FEM including switch and electronic device including the fem

Abstract

An electronic device according to various embodiments includes a first power supply circuit, a second power supply circuit, a switch, a first radio frequency front end (FEM), a second FEM, a third FEM, a fourth FEM, and a processor in which a signal is transmitted using a third PA in the third FEM or a fourth PA in the fourth FEM operated based on a second voltage supplied from the second power supply circuit. On the basis of transmitting a signal using a first PA in a first FEM operating based on a first voltage supplied from a first power supply circuit, a processor may electrically connect a third PA and a fourth PA through a second power supply circuit and a switch. Various other embodiments are also possible.

Description

Technical Field

[0001] The following description relates to a front end module (FEM) including a switch and an electronic device including the FEM. Background Art

[0002] Electronic devices are generally required to support various frequency ranges. Electronic devices supporting 5G network communications may support EN-DC (Evolved Universal Mobile Telecommunications System Terrestrial Radio Access (EN-UTRA) New Radio (NR) Dual Connectivity). Electronic devices may include multiple power supply circuits for supplying voltage to a power amplifier (PA) in a front-end module (FEM) to support dual connectivity. Summary of the invention

[0003] The electronic device according to the example may provide a structure of a power supply circuit capable of various connections in an operating frequency band so as to increase the degree of freedom of an antenna and reduce the number of power supply circuits with a simplified structure of the power supply circuit.

[0004] The technical problems to be achieved in the present disclosure are not limited to the above-mentioned technical problems, and any other technical problems not mentioned herein will be clearly understood by those skilled in the art from the following description.

[0005] “Technology solutions”

[0006] According to an example, an electronic device is provided. The electronic device may include a plurality of power supply circuits and a plurality of front-end modules (FEMs), the plurality of power supply circuits including a first power supply circuit and a second power supply circuit, and the plurality of front-end modules are electrically connected to a processor. The FEM may include a first FEM connected to the first power supply circuit and including a first power amplifier (PA), a second FEM connected to the second power supply circuit and including a second PA, a third FEM including a third PA, and a switch configured to connect a power supply circuit selected from the first power supply circuit and the second power supply circuit to the third PA, and a fourth FEM including a fourth PA. The switch may include a first path configured to connect the first power supply circuit to the third PA and the fourth PA and a second path configured to connect the second power supply circuit to the third PA and the fourth PA. The switch may be controlled to connect the second power supply circuit to the third PA and the fourth PA so that while using the first PA operated based on the first voltage provided from the first power supply circuit to send a signal, a third PA or a fourth PA operated based on the second voltage provided from the second power supply circuit is used to send a signal. The switch can be controlled to connect the first power supply circuit to the third PA and the fourth PA so that a signal is transmitted using the third PA or the fourth PA operated based on the first voltage supplied from the first power supply circuit while a signal is transmitted using the second PA operated based on the second voltage supplied from the second power supply circuit.

[0007] According to another embodiment, a front end module (FEM) is provided. The FEM may include a substrate, a power amplifier (PA) configured to set the transmission power of a signal, a first terminal connected to a first power supply circuit outside the FEM, a second terminal connected to a second power supply circuit outside the FEM, a third terminal connected to another PA outside the FEM, and a switch configured to provide a first connection between the first terminal in the FEM and the PA or a second connection between the second terminal in the FEM and the PA. In an example, the third terminal may be configured to provide a first voltage to another PA in another FEM while providing a first voltage from the first power supply circuit to the PA in the FEM through a first electrical connection. In an example, the third terminal may be connected to a node between the switch and the PA, so that the first voltage is provided to the other PA while the first voltage is provided from the first power supply circuit to the PA in the FEM through a first connection formed by using the switch, and the second voltage is provided to the other PA while the second voltage is provided from the second power supply circuit to the PA in the FEM through a second connection formed by using the switch.

[0008] “Beneficial effects”

[0009] The electronic device according to the example makes it possible to improve the connection structure of a power supply circuit that supplies a voltage to a power amplifier, thereby achieving further miniaturization of components in the electronic device and reducing the number of parts in the components in the electronic device.

[0010] Effects that can be obtained from the present disclosure are not limited to the above-mentioned effects, and any other effects not mentioned herein will be clearly understood by a person of ordinary skill in the art to which the present disclosure pertains from the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is a block diagram of an electronic device in a network environment according to an example;

[0012] Figure 2 is a block diagram of an electronic device for supporting traditional network communications and 5G network communications according to an example;

[0013] Figure 3 is a schematic diagram illustrating a wireless communication system of a network for providing traditional communications and / or 5G communications according to an example;

[0014] Figure 4a is a simplified block diagram of an exemplary electronic device according to an example;

[0015] Figure 4b is a simplified block diagram of an exemplary electronic device including a FEM including a switch.

[0016] Figure 5An example of a structure of a front end module (FEM) in an electronic device according to an example is shown;

[0017] Figure 6 An example of a structure of another FEM in an electronic device according to an example is shown;

[0018] Figure 7 and Figure 8 An example of a connection relationship between a power amplifier (PA) of one FEM and a terminal of one FEM in an electronic device according to an example is shown; and

[0019] Fig. 9 An example of an arrangement of an antenna module electrically connected to a FEM in an electronic device according to an example is shown.

[0020] Fig.10 is a simplified block diagram of an exemplary electronic device including a PA disposed external to a FEM according to an example.

[0021] Fig.11 is a simplified block diagram of an exemplary electronic device including an additional FEM.

[0022] Fig.12 An example of operation of a switch in a FEM inside an electronic device according to an example is shown. DETAILED DESCRIPTION

[0023] The terms used in the present disclosure are only used to better describe a certain embodiment, and may not be intended to limit the scope of other embodiments. Unless the context clearly stipulates otherwise, singular expressions may include plural expressions. The terms used herein (including technical and scientific terms) may have the same meaning as the meanings generally understood by those skilled in the art to which the present disclosure belongs. The terms defined in the general dictionary in the terms used in the present disclosure may be interpreted as having the same or similar meanings as the meanings in the context of the relevant field, and unless clearly defined in the present disclosure, they should not be interpreted in an ideal or overly formal sense. In some cases, even the terms defined in the present disclosure may not be interpreted as excluding embodiments of the present disclosure.

[0024] In the examples of the present invention described below, a hardware method will be described as an example. However, since the examples of the present disclosure include techniques utilizing both hardware-based methods and software-based methods, such examples of the present disclosure are not intended to exclude software-based methods.

[0025] Through the following disclosure, terms related to multi-connectivity (e.g., dual connectivity (DC), MR (multi-RAT (radio technology)-DC, cell group, primary cell group (MCG), secondary cell group (SCG)), terms referring to signals (e.g., reference signal, system information, control signal, message, data), terms referring to network entities (e.g., communication node, radio node, radio unit, network node, primary node (MN), secondary node (SN), transmit / receive point (TRP), digital unit (DU), radio unit (RU), massive MIMO unit (MMU), etc.) are exemplified only for the convenience of description. Therefore, the present disclosure is not limited to the terms to be described below, and any other terms with equivalent technical meanings may be used.

[0026] In addition, throughout the disclosure, expressions such as, for example, "exceeds" or "lower than" may be used to determine whether a specific condition is satisfied or met, but it is merely a description for expressing an example, and does not exclude the meaning of "greater than or equal to" or "less than or equal to." A condition described as "greater than or equal to" may be replaced with "exceeds" or "higher than," a condition described as "less than or equal to" may be replaced with "lower than," and conditions described as "greater than or equal to" and "lower than" may be replaced with "exceeds" and "less than or equal to," respectively.

[0027] The terms used in the present disclosure are only used to better describe a certain embodiment, and may not be intended to limit the scope of other embodiments. Unless the context clearly stipulates otherwise, singular expressions may include plural expressions. The terms used herein (including technical and scientific terms) may have the same meaning as the meanings generally understood by those skilled in the art to which the present disclosure belongs. The terms defined in the general dictionary in the terms used in the present disclosure may be interpreted as having the same or similar meanings as the meanings in the context of the relevant field, and unless clearly defined in the present disclosure, they should not be interpreted in an ideal or overly formal sense. In some cases, even the terms defined in the present disclosure may not be interpreted as excluding embodiments of the present disclosure.

[0028] In the examples of the present invention described below, a hardware method will be described as an example. However, since the examples of the present disclosure include techniques utilizing both hardware-based methods and software-based methods, such examples of the present disclosure are not intended to exclude software-based methods.

[0029] Through the following disclosure, terms related to multi-connectivity (e.g., dual connectivity (DC), MR (multi-RAT (radio technology)-DC, cell group, primary cell group (MCG), secondary cell group (SCG)), terms referring to signals (e.g., reference signal, system information, control signal, message, data), terms referring to network entities (e.g., communication node, radio node, radio unit, network node, primary node (MN), secondary node (SN), transmit / receive point (TRP), digital unit (DU), radio unit (RU), massive MIMO unit (MMU), etc.) are exemplified only for the convenience of description. Therefore, the present disclosure is not limited to the terms to be described below, and any other terms with equivalent technical meanings may be used.

[0030] In addition, throughout the disclosure, expressions such as, for example, "exceeds" or "lower than" may be used to determine whether a specific condition is satisfied or met, but it is merely a description for expressing an example, and does not exclude the meaning of "greater than or equal to" or "less than or equal to." A condition described as "greater than or equal to" may be replaced with "exceeds" or "higher than," a condition described as "less than or equal to" may be replaced with "lower than," and conditions described as "greater than or equal to" and "lower than" may be replaced with "exceeds" and "less than or equal to," respectively.

[0031] Figure 1 is a block diagram of an electronic device in a network environment according to an example of the present disclosure.

[0032] refer to Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an example, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an example, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one component (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added in the electronic device 101. In some embodiments, some components (eg, sensor module 176, camera module 180, or antenna module 197) may be implemented as a single component (eg, display module 160).

[0033] The processor 120 may execute, for example, software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of the electronic device 101 coupled to the processor 120, and may perform various data processing or calculations. According to an example, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resulting data in the non-volatile memory 134. According to an example, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)), and the auxiliary processor 123 may operate independently of the main processor 121 or in conjunction with the main processor 121. For example, when the electronic device 101 includes a main processor 121 and a secondary processor 123, the secondary processor 123 may be adapted to consume less power than the main processor 121 or be dedicated to a designated function. The secondary processor 123 may be implemented separately from the main processor 121 or as part of the main processor 121.

[0034] The auxiliary processor 123 may replace the main processor 121 when the main processor 121 is in an inactive (e.g., sleep) state, or control at least some of the functions or states related to at least one of the components of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190) together with the main processor 121 when the main processor 121 is in an active state (e.g., executing an application). According to an example, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as a part of another component (e.g., camera module 180 or communication module 190) that is functionally related to the auxiliary processor 123. According to an example, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure specified for artificial intelligence model processing. The artificial intelligence model may be generated by machine learning. Such learning may be performed, for example, by the electronic device 101 that performs artificial intelligence or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or alternatively, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0035] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0036] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0037] The input module 150 may receive a command or data to be used by another component (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0038] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as playing multimedia or playing recordings. The receiver may be used to receive incoming calls. According to an example, the receiver may be implemented as a part of the speaker or as a part of the speaker.

[0039] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling a corresponding one of the display, the hologram device, and the projector. According to an example, the display module 160 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0040] The audio module 170 can convert sound into an electrical signal, and vice versa. According to an example, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly coupled to the electronic device 101.

[0041] The sensor module 176 can detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a user's state) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an example, the sensor module 176 may include, for example, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0042] The interface 177 may support one or more designated protocols for the electronic device 101 to be directly (e.g., wired) or wirelessly coupled to an external electronic device (e.g., the electronic device 102). According to an example, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0043] The connection terminal 178 may include a connector, via which the electronic device 101 may be physically connected to an external electronic device (e.g., the electronic device 102). According to an example, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0044] The haptic module 179 may convert the electric signal into mechanical stimulation (eg, vibration or movement) or electric stimulation that can be recognized by the user via his tactile or kinesthetic sense. According to an example, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electric stimulator.

[0045] The camera module 180 may capture still images or moving images. According to an example, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0046] The power management module 188 may manage power supplied to the electronic device 101. According to an example, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0047] The battery 189 may supply power to at least one component of the electronic device 101. According to an example, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0048] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors that may operate independently of the processor 120 (e.g., an application processor (AP)) and support direct (e.g., wired) communication or wireless communication. According to an example, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth™, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN)). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components (e.g., multiple chips) separated from each other. The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using subscriber information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the subscriber identification module 196.

[0049] The wireless communication module 192 can support 5G networks and next-generation communication technologies (e.g., new radio (NR) access technology) after the 4G network. NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable and low-latency communication (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., mm-wave bands) to address, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to an example, the wireless communication module 192 can support peak data rates for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0050] The antenna module 197 may send a signal or power to or receive a signal or power from the outside of the electronic device 101 (e.g., an external electronic device). According to an example, the antenna module 197 may include an antenna including a radiating element including a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an example, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network such as the first network 198 or the second network 199 may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). Then, a signal or power may be sent or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an example, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as a part of the antenna module 197.

[0051] According to various embodiments, the antenna module 197 may form a millimeter wave antenna module. According to an example, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave frequency band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0052] At least some of the above components may be coupled to each other and transmit signals (e.g., commands or data) therebetween via an inter-peripheral communication scheme (e.g., a bus, general purpose input and output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)).

[0053] According to an example, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via a server 108 coupled to the second network 199. Each of the electronic devices 102 or 104 may be a device of the same type or a different type as the electronic device 101. According to an example, all or some of the operations to be performed at the electronic device 101 may be performed at one or more of the external electronic devices 102, 104, or 108. For example, if the electronic device 101 should automatically or in response to a request from a user or another device to perform a function or service, the electronic device 101 may request one or more external electronic devices to perform at least a part of the function or service, instead of performing the function or service, or in addition to performing the function or service, the electronic device 101 may also request one or more external electronic devices to perform at least a part of the function or service. The one or more external electronic devices receiving the request may perform at least a part of the requested function or service, or an additional function or additional service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least part of the reply to the request with or without further processing the result. To this end, for example, cloud computing, distributed computing, mobile edge computing (MEC) or client-server computing technology can be used. The electronic device 101 can use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another example of the present disclosure, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to the example, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 can be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or health care) based on 5G communication technology or IoT-related technologies.

[0054] Figure 2 An electronic device 101 for supporting both traditional network communications and 5G network communications according to an example is shown.

[0055] Reference Figure 2 , the electronic device 101 may further include a first communication processor 212, a second communication processor 214, a first RFIC 222, a second RFIC 224, a third RFIC 226, a fourth RFIC 228, a first radio frequency front end (RFFE) 232, a second RFFE 234, a first antenna module 242, a second antenna module 244, and an antenna 248. The electronic device 101 may further include a processor 120 and a memory 130. The second network 199 may include a first network 292 and a second network 294. According to another example, the electronic device 101 may further include Figure 1 , and the network 199 may also include at least one of the components shown in , and the network 199 may also include at least another network. According to an example, the first communication processor 212, the second communication processor 214, the first RFIC 222, the second RFIC 224, the fourth RFIC 228, the first RFFE 232, and the second RFFE 234 may constitute at least a part of the wireless communication module 192. According to another example, the fourth RFIC 228 may be omitted, or may be included as part of the third RFIC 226.

[0056] The first communication processor 212 can establish a communication channel in a frequency band to be used for wireless communication with the first network 292, and can support traditional network communication through the established communication channel. According to an example, the first network can be a traditional network, including a second generation (2G), a third generation (3G), a fourth generation (4G) or a long term evolution (LTE) network. The second communication processor 214 can establish a communication channel corresponding to a specified frequency band (e.g., from about 6 GHz to about 60 GHz) in a frequency band to be used for wireless communication with the second network 294, and can support 5G network communication through the established communication channel. According to an example, the second network 294 can be a 5G network defined in the third generation partnership project (3GPP). In addition, according to an example, the first communication processor 212 or the second communication processor 214 can establish a communication channel corresponding to another specified frequency band (e.g., about 6 GHz or less) in a frequency band to be used for wireless communication with the second network 294, and can support 5G network communication through the established communication channel. According to an example, the first communication processor 212 and the second communication processor 214 may be implemented in a single chip or a single package. According to an example, the first communication processor 212 and the second communication processor 214 may be formed in a single chip or a single package with the processor 120, the auxiliary processor 123 or the communication module 190.

[0057] During signal transmission, the first RFIC 222 may convert a baseband signal generated by the first communication processor 212 into a radio frequency (RF) signal of about 700 megahertz (MHz) to about 3 GHz for the first network 292 (e.g., a legacy network). During signal reception, the RF signal may be obtained from the first network 292 (e.g., a legacy network) through an antenna (e.g., the first antenna module 242) and may be pre-processed by an RFFE (e.g., the first RFFE 232). The first RFIC 222 may convert the pre-processed RF signal into a baseband signal that may be processed by the first communication processor 212.

[0058] During signal transmission, the second RFIC 224 may convert a baseband signal generated by the first communication processor 212 or the second communication processor 214 into an RF signal (hereinafter, a 5G sub6 RF signal) of a Sub6 frequency band (e.g., about 6 GHz or less) for a second network 294 (e.g., a 5G network). During signal reception, a 5G SUB6 RF signal may be obtained from a second network 294 (e.g., a 5G network) through an antenna (e.g., a second antenna module 244), and the 5G SUB6 RF signal may be pre-processed through an RFFE (e.g., a second RFFE 234). The second RFIC 224 may convert the pre-processed 5G Sub6 RF signal into a baseband signal, which may be processed by a corresponding communication processor in the first communication processor 212 and the second communication processor 214.

[0059] The third RFIC 226 may convert the baseband signal generated by the second communication processor 214 into an RF signal (hereinafter, 5G or above 6 RF signal) of a 5G or above frequency band (e.g., from about 6 GHz to about 60 GHz) to be used in the second network 294 (e.g., 5G network). When receiving the signal, the 5G or above RF signal may be obtained from the second network 294 (e.g., 5G network) through an antenna (e.g., antenna 248) and may be pre-processed by the third RFFE 236. The third RFIC 226 may convert the pre-processed 5G or above RF signal into a baseband signal that may be processed by the second communication processor 214. According to an example, the third RFFE 236 may be configured as part of the third RFIC 226.

[0060] According to an example, the electronic device 101 may include a fourth RFIC 228 that is separate from or at least part of the third RFIC 226. In this case, the fourth RFIC 228 may convert a baseband signal generated by the second communication processor 214 into an RF signal (hereinafter, an intermediate frequency (IF) signal) of an intermediate frequency band (e.g., from about 9 GHz to about 11 GHz), and then the IF signal may be sent to the third RFIC 226. The third RFIC 226 may convert the IF signal into a 5G or higher RF signal. At the time of signal reception, the 5G or higher RF signal may be received from the second network 294 (e.g., a 5G network) through an antenna (e.g., antenna 248), and may be converted into an IF signal by the third RFIC 226. The fourth RFIC 228 may convert the IF signal into a baseband signal that may be processed by the second communication processor 214.

[0061] According to an example, the first RFIC 222 and the second RFIC 224 may be implemented as at least a portion of a single package or a single chip. According to an example, the first RFFE 232 and the second RFFE 234 may be implemented as at least a portion of a single package or a single chip. According to an example, at least one of the first antenna module 242 or the second antenna module 244 may be omitted, or may be combined with another antenna module to process RF signals of multiple frequency bands corresponding thereto.

[0062] According to an example, the third RFIC 226 and the antenna 248 may be arranged on the same substrate to constitute the third antenna module 246. For example, the wireless communication module 192 or the processor 120 may be arranged on a first substrate (e.g., a main PCB). In this case, the third antenna module 246 may be configured by arranging the third RFIC 226 in a partial area (e.g., a lower surface) of a second substrate (e.g., a sub-PCB) independent of the first substrate and arranging the antenna 248 in another partial area (e.g., an upper surface) thereof. According to an example, the antenna 248 may include, for example, an antenna array that can be used for beamforming. Arranging the third RFIC 226 and the antenna 248 on the same substrate may reduce the length of the transmission line between them, and may reduce the loss (e.g., attenuation) of the transmission line to the signal in the high frequency band (e.g., about 6 GHz to about 60 GHz) for 5G network communication. Therefore, the electronic device 101 may exhibit enhanced communication quality or speed with the second network 294 (e.g., a 5G network).

[0063] The second network 294 (e.g., a 5G network) may operate independently of the first network 292 (e.g., a traditional network) (e.g., standalone (SA)), or may operate while connected to the first network (e.g., non-standalone (NSA)). For example, the 5G network may include only an access network (e.g., a 5G radio access network (RAN) or a next generation RAN (NG RAN)) and may not include a core network (e.g., a next generation core (NGC)). In this case, the electronic device 101 may access the access network of the 5G network and may then access an external network (e.g., the Internet) under the control of the core network of the traditional network (e.g., an evolved encapsulated core (EPC) network). Protocol information for communicating with a traditional network (e.g., LTE protocol information) or protocol information for communicating with a 5G network (e.g., new radio (NR) protocol information) may be stored in the memory 230 and may be accessed by another component (e.g., the processor 120, the first communication processor 212, or the second communication processor 214).

[0064] Figure 3 is a diagram illustrating a wireless communication system of a network for providing traditional communications and / or 5G communications according to an example. Figure 3 A first base station 310, a second base station 330, and an electronic device 101 are shown as some nodes using a wireless channel in a wireless communication system.

[0065] refer to Figure 3 , each of the first base station 310 and the second base station 330 may be a network infrastructure that provides radio access to the electronic device 101. Each of the first base station 310 and the second base station 330 may have a certain coverage, which corresponds to a geographical area defined based on the distance at which a radio signal can be transmitted. As used in the following description, the term "coverage" may refer to a service coverage area in which the service of a base station is available. Each base station may cover a single cell or multiple cells, wherein the multiple cells may be distinguished by the frequency supported by the corresponding base station or the area of ​​the sector covered by the base station.

[0066] In addition to a base station, the first base station 310 may be referred to as an "access point (AP)", "eNode B (eNB)", "radio point", "transmit / receive point (TRP)", "distributed unit (DU)", "radio unit (RU)", "remote radio head (RRH)" or other terms having technical meanings equivalent thereto. According to an example, the first base station 310 may provide a first communication scheme (e.g., LTE) for a radio access technology (RAT). According to an example, the first base station 310 may operate as an eNB for supporting an Evolved Universal Terrestrial Radio Access (E-UTRA) carrier in EN-DC. In an example, the electronic device 101 may send and receive radio signals to and from the first base station 310 in a frequency band of approximately 800 MHz (megahertz) to approximately 2.6 GHz.

[0067] In addition to a base station, the second base station 330 may be referred to as a "fifth generation (5G) node", "5G Node B (NB)", "next generation Node B (gNB)", "radio point", "transmit / receive point (TRP)", "central unit (CU)", "distributed unit (DU)", "radio unit (RU)", remote radio head equipment (RRH) or other terms having equivalent technical meanings. According to an example, the second base station 330 may be connected to one or more "transmit / receive points (TRP)". The second base station 330 may send a downlink signal to the electronic device 101 via one or more TRPs, or may receive an uplink signal from the electronic device 101 via one or more TRPs. According to an example, the second base station 330 may provide a second communication scheme (e.g., NR) for a radio access technology (RAT). According to an example, the second base station 330 may operate as a gNB for supporting NR carriers in EN-DC. In an example, the electronic device 101 may send and receive radio signals in a frequency band of a first frequency range (e.g., NR FR1 of approximately 410 MHz to approximately 7125 MHz) or a second frequency range (e.g., NR FR2 of approximately 24,250 MHz to approximately 52,600 MHz or approximately 24,250 MHz to approximately 100,000 MHz).

[0068] although Figure 3Not shown, but in order to support network function virtualization or more efficient resource management and scheduling in 5G systems, base stations can be implemented in distributed deployments. For example, in a 5G system, a base station (gNB) can be further divided into a central unit (CU) and a distributed unit (DU). For example, a CU may have at least a protocol layer of a radio resource control (RRC) and a packet data convergence protocol (PDCP). According to an example, a CU may also include a service data adaptation protocol (SDAP). For example, a DU may have a radio link control (RLC), a media access control (MAC), and a physical layer. For example, an F1 interface as a standardized common interface may exist between a CU and a DU. The F1 interface may be divided into a control plane F1-C and a user plane F1-U. The transport network layer of F1-C may be based on IP transmission. For more stable signaling, a stream control transmission protocol (SCTP) may be added to an Internet protocol (IP). The application layer protocol may be F1AP. SCTP may provide stable application layer messaging. The transport layer of F1-U may be a user datagram protocol (UDP) / IP. User plane protocol data units (PDUs) may be performed using GTP (General Packet Radio Service (GPRS) Tunneling Protocol)-U over UDP / IP.

[0069] The electronic device 101, which is a device used by a user, can communicate with the first base station 310 and / or the second base station 330 through a wireless channel. In some cases, the electronic device 101 can be operated without any user participation. That is, at least one of the electronic devices 101 is a device that performs machine type communication (MTC) and may not be carried by a user. In addition to the terminal, the electronic device 101 may be referred to as "user equipment (UE)", "mobile station", "subscriber station", "customer premises equipment (CPE)", "remote terminal", "wireless terminal", "electronic device" or "vehicle terminal", "user equipment" or other terms with the same or equivalent technical meanings.

[0070] According to an example, the electronic device 101 may be connected to the first base station 310 and the second base station 330 through a dual connection (DC) 350. One of the first base station 310 and the second base station 330 may operate as a master node (MN), and the other of the first base station 310 and the second base station 330 may operate as a secondary node (SN). The MN and the SN may be connected to each other through a network interface (e.g., an X2 interface or an XN interface).

[0071] although Figure 3Not shown, but the first base station 310 or the second base station 330 can be connected to the evolved packet core (EPC) network, which is the core of the 4G network. In the case where the first base station 310 provides a primary cell group and the second base station 330 provides a secondary cell group, the connection between the two base stations can be referred to as Evolved Universal Terrestrial Radio Access-New Radio Dual Connection (EN-DC). Through this EN-DC, the terminal can access the LTE cell using LTE technology, and can access the NR cell using NR technology. In the following, the cell using LTE technology may be referred to as an LTE cell, an E-UTRA cell, or a 4G cell, and the frequency of the cell using LTE technology may be referred to as an E-UTRA carrier, an LTE carrier, or a 4G carrier. In addition, the cell using NR technology may be referred to as an NR cell or a 5G cell, and the frequency of the cell using NR technology may be referred to as an NR carrier or a 5G carrier.

[0072] Hereinafter, in various embodiments of the present disclosure, EN-DC is described as an example of a technology for providing both an LTE carrier and an NR carrier, but the embodiments of the present disclosure are not limited thereto. The same principles of the embodiments described below can also be applied to other types of DC (e.g., NE-DC (New Radio-Evolved Universal Terrestrial Radio Access-Dual Connectivity), NGEN-DC (NG-RAN (Next Generation Radio Access Network) Evolved Universal Terrestrial Radio Access-New Radio Dual Connectivity)).

[0073] The definition of possible types of DC can be provided as follows

[0074]

[0075]

[0076] The electronic device 101 may support multi-radio (MR)-DC. The electronic device 101 may be connected to a first base station 310 and a second base station 330. The first base station 310 may be a MN and the second base station 330 may be a SN so that they can be connected to a terminal. Together with carrier aggregation (CA) provided by each base station, dual connectivity may provide a higher data rate. The first base station 310 and the second base station 330 may send downlink traffic to the electronic device 101 or receive uplink traffic from the electronic device 101 as a MN and a SN, respectively. Figure 4a is a simplified block diagram of an exemplary electronic device according to an example. Figure 4b is a simplified block diagram of an exemplary electronic device including a FEM including a switch. Figure 5 An example of a structure of a front end module (FEM) in an electronic device according to an example is shown. Figure 6 An example of a structure of another FEM in an electronic device according to an example is shown. Figure 7 and Figure 8 Each shows an example of a connection relationship between a power amplifier (PA) of one FEM and a terminal of one FEM in an electronic device according to an example.

[0077] Reference Figure 4a , Figure 4b , Figure 5 , Figure 6 , Figure 7 and Figure 8 The electronic device 101 may include a processor 400 , a first power supply circuit 401 , a second power supply circuit 402 , a first FEM 410 , a second FEM 420 , a third FEM 430 , a fourth FEM 440 , a fifth FEM 450 , and / or a sixth FEM 460 .

[0078] In an example, processor 400 may include Figure 1 In an example, the processor 400 may include at least one of the processor 120, the first communication processor 212, the second communication processor 214, the first RFIC 222, the second RFIC 224, the third RFIC 226, and the fourth RFIC 228, as shown. Figure 2 or transceiver as shown.

[0079] The FEMs 410, 420, 430, 440, 450, and 460 in the electronic device 101 may include a component for processing a signal transmitted through at least one of the antennas A1, A2, A3, A4, A5, and A6 respectively connected to the FEMs 410, 420, 430, 440, 450, and 460. Each of the FEMs 410, 420, 430, 440, 450, and 460 may be connected to one of the antennas A1, A2, A3, A4, A5, and A6. According to an example, some of the antennas A1, A2, A3, A4, A5, and A6 may be connected to one or more FEMs. For example, each of the FEMs 410, 420, 430, 440, 450, and 460 may include at least one filter (e.g., the first filter 521, the second filter 531, or the third filter 541) for processing a signal transmitted through one of the antennas A1, A2, A3, A4, A5, and A6, at least one power amplifier (PA) (e.g., the first PA 411, the second PA 421, the third PA 431, the fourth PA 441, the fifth PA 451, and / or the sixth PA 461), a switch (e.g., the switch 550 and / or the switch 580), or a duplexer (e.g., the first duplexer 520, the second duplexer 530, or the third duplexer 540). Each of the FEMs 410, 420, 430, 440, 450, and 460 may be configured to process signals having different frequencies. For example, a first frequency band of a first signal processed by a first FEM 410 and transmitted through an antenna A (e.g., at least one of antennas A1, A2, A3, A4, A5, and A6) may be spaced apart from a second frequency band of a second signal processed by a second FEM 420 and transmitted through an antenna. A first frequency band of a first signal processed by a first FEM 410 and transmitted through an antenna may partially overlap a third frequency band of a third signal processed by a third FEM 430 and transmitted through an antenna. However, the present disclosure is not limited thereto. A voltage for an operating range of PAs 411, 421, 431, 441, 451, and 461 may be set by a processor 400. According to an example, a voltage may be set by at least one radio frequency integrated circuit (RFIC) (not shown) connected to the processor 400 and each FEM. Meanwhile, the FEM may be referred to as a radio frequency chain or an RF path.

[0080] Antenna A (eg, at least one of antennas A1, A2, A3, A4, A5, and A6) may include Figure 1At least a portion of the antenna module shown. For example, antenna A may include at least one array antenna including a plurality of antennas. According to an example, antenna A may include an antenna using a conductive portion arranged along at least a portion of the side surface of the housing of the electronic device 101. According to an example, antenna A may include a plurality of antennas, and the plurality of antennas may correspond to each FEM. However, the present disclosure is not limited thereto, and the number of the plurality of antennas may be different from the number of FEMs. For example, the third FEM 430 and the fourth FEM 440 may be connected to one antenna, and one antenna connected to the third FEM 430 and the fourth FEM 440 may be an antenna shared by the third FEM 430 and the fourth FEM 440. The fifth FEM 450 and the sixth FEM 460 may be connected to another antenna, and another antenna connected to the fifth FEM 450 and the sixth FEM 460 may be an antenna shared by the fifth FEM 450 and the sixth FEM 460. According to an example, although it has been described that six FEMs are provided, the present disclosure is not limited thereto, and the FEM may include less than six FEMs or more than six FEMs. For example, the plurality of FEMs may include a first FEM 410, a second FEM 420, a third FEM 430, and / or a fourth FEM 440. The FEMs may be configured to send different RF signals to the outside. For example, the first FEM 410 may include a first PA 411 configured to send a first RF signal of a first frequency. The first PA 411 may be configured to amplify the first RF signal based on the voltage Vcc1 of the first power supply circuit 401. The second FEM 420 may include a second PA 421 configured to send a second RF signal of a second frequency different from the first RF signal. The second PA 421 may be configured to amplify the second RF signal based on the voltage Vcc2 of the second power supply circuit 402. The third FEM 430 may include a third PA 431, which is configured to send a third RF signal of a third frequency different from the first RF signal and the second RF signal. The third PA 431 may be configured to amplify the third RF signal based on the voltage Vcc1 of the first power supply circuit 401 or the voltage Vcc2 of the second power supply circuit 402. The fourth FEM 440 may include a fourth PA 441 configured to transmit a fourth RF signal of a fourth frequency different from the first RF signal, the second RF signal, and the third RF signal. The fourth PA 441 may be configured to amplify the fourth RF signal based on the voltage Vcc1 of the first power supply circuit 401 or the voltage Vcc2 of the second power supply circuit 402. The fifth FEM 450 may include a fifth PA 451 configured to transmit a fifth RF signal of a fifth frequency different from the first RF signal, the second RF signal, the third RF signal, and the fourth RF signal.The fifth PA 451 may be configured to amplify the fifth RF signal based on the voltage Vcc1 of the first power supply circuit 401 or the voltage Vcc2 of the second power supply circuit 402. The sixth FEM 460 may include a sixth PA 461 configured to transmit a sixth RF signal of a sixth frequency different from the first RF signal, the second RF signal, the third RF signal, the fourth RF signal, and the fifth RF signal. The sixth PA 461 may be configured to amplify the sixth RF signal based on the voltage Vcc1 of the first power supply circuit 401 or the voltage Vcc2 of the second power supply circuit 402. The third PA 431, the fourth PA 441, the fifth PA 451, and / or the sixth PA 461 may be connected to the switch 490.

[0081] Figure 4a The switch 490 may be located outside the FEM 460. The switch 490 may provide the voltage Vcc1 of the first power supply circuit 401 and / or the voltage Vcc2 of the second power supply circuit 402 to the third PA 431, the fourth PA 441, the fifth PA 451, and / or the sixth PA 461 through connection with the third PA 431, the fourth PA 441, the fifth PA 451, and / or the sixth PA 461. Figure 4bThe switch 490 may be provided inside one of the third FEM 430, the fourth FEM 440, the fifth FEM 450, and / or the sixth FEM 460. For example, the third FEM 430 may include the switch 490. At least one power supply circuit (e.g., the first power supply circuit 401 or the second power supply circuit 402) may variably supply voltage to the PA based on the control of the processor 400 and / or a radio frequency integrated circuit (RFIC) (not shown). According to an example, the voltage of the dynamic operating range of the PAs 411, 421, 431, 441, 451, and 461 may be set by the processor 400. The voltage may also be set by a radio frequency integrated circuit (RFIC) (not shown) connected to the processor 400 and each of the FEMs 410, 420, 430, 440, 450, and 460. For example, the RFIC may set the voltage through one or more power supply circuits 401 and 402 based on envelope tracking (ET). However, the present disclosure is not limited thereto. At least one power supply circuit 401 or 402 can variably provide the voltage to PA 411, 421, 431, 441, 451, and 461 based on the control of the processor 400 and / or the RFIC. For example, at least one power supply circuit 401 or 402 can be used to set the voltage based on ET. According to an example, at least one power supply circuit 401 or 402 can be used to set the voltage based on average power tracking (APT). At least one of the power supply circuits 401 and 402 is described as a supply voltage, but can supply power to PA 411, 421, 431, 441, 451, and 461. At least one power supply circuit 401 or 402 can be referred to as a modulator, an ET modulator, a power modulator, a power supply, a power supply, or a voltage supply circuit.

[0082] According to an example, at least one power supply circuit may include a first power supply circuit 401 and / or a second power supply circuit 402. For example, each of the PAs 431, 441, 451, and 461 included in each of some FEMs 430, 440, 450, and 460 among the FEMs may receive a voltage or power from the first power supply circuit 401 or the second power supply circuit 402. For example, a first PA 411 included in a first FEM 410 among the FEMs may receive a first voltage Vcc1 or power from the first power supply circuit 401. For example, a second PA 421 included in a second FEM 420 among the FEMs may receive a second voltage Vcc2 or power from the second power supply circuit 402. For example, the first power supply circuit 401 may be configured to provide a first voltage Vcc1 to the PAs 411, 431, 441, 451, and 461 included in each of the first FEM 410, the third FEM 430, the fourth FEM 440, the fifth FEM 450, and the sixth FEM 460. According to an example, the first voltage Vcc1 transmitted from the first power supply circuit 401 to the PAs 411, 431, 441, 451, and 461 may be different. For example, by a voltage drop, a voltage applied from the first power supply circuit 401 to the third PA 431, the fourth PA 441, the fifth PA 451, or the sixth PA 461 through the switch or the third FEM 430 may be lower than a voltage applied from the first power supply circuit 401 to the third PA 431. For example, the second power supply circuit 402 may be configured to provide a second voltage Vcc2 to the PAs 421, 431, 441, 451, and 461 included in each of the second FEM 420, the third FEM 430, the fourth FEM 440, the fifth FEM 450, and the sixth FEM 460. According to an example, the second voltage Vcc2 transmitted from the second power supply circuit 402 to the PAs 411, 431, 441, 451, and 461 may be different. For example, through a voltage drop, a voltage applied to the third PA 431, the fourth PA 441, the fifth PA 451, or the sixth PA 461 from the second power supply circuit 402 through a switch or the third FEM 430 may be lower than a voltage applied to the third PA 431 from the second power supply circuit 402. The first PA 411 of the first FEM 410 may receive a first voltage Vcc1 through the first power supply circuit 401. The first PA 411 may receive power from the first power supply circuit 401. The second PA 421 of the second FEM 420 may receive a second voltage Vcc2 through the second power supply circuit 402. The second PA 412 may receive power from the second power supply circuit 402.Each of the PAs 431, 441, 451, and 461 of each of the third FEM 430, the fourth FEM 440, the fifth FEM 450, and the sixth FEM 460 may receive the first voltage Vcc1 or the second voltage Vcc2 through the first power supply circuit 401 or the second power supply circuit 402. Each of the PAs 431, 441, 451, and 461 may receive power from the first power supply circuit 401 or from the second power supply circuit 402.

[0083] The processor 400 according to the example may be configured to operate one PA (e.g., the first PA 411) among the PAs 411, 431, 441, 451, and 461 among the FEMs 410, 430, 440, 450, and 460 that is supplied with the first voltage Vcc1 from the first power supply circuit 401, and operate a PA in one of the FEMs 420, 430, 440, 450, and 460 that is supplied with the second voltage Vcc2 from the second power supply circuit 402, which is different from a PA (e.g., the first PA 411) in one of the FEMs 410, 430, 440, 450, and 460 (e.g., the first FEM 410) that is supplied with the first voltage Vcc1.

[0084] According to an example, in order to provide the first voltage Vcc1 provided from the first power supply circuit 401 and the second voltage Vcc2 provided from the second power supply circuit 402 to the designated FEM, the switch 490 may be operably connected to the processor 400. The processor 400 may include at least one of the processor 120, the first communication processor 212, the second communication processor 214, the first RFIC 222, the second RFIC 224, the third RFIC 226, and the fourth RFIC 228, as shown in FIG. Figure 2The switch 490 may be controlled by the processor 400. The switch 490 may selectively connect the third FEM 430, the fourth FEM 440, the fifth FEM 450, and the sixth FEM 460 to the first power supply circuit 401 or the second power supply circuit 402. For example, the switch 490 may be configured to route one voltage selected from the first voltage Vcc1 (or the control signal) output from the first power supply circuit 401 and the second voltage Vcc2 output from the second power supply circuit to a signal path for providing to the third FEM 430 under the control of the processor. The first power supply circuit 401 may be always electrically connected to the first FEM 410, and may be selectively connected to the third FEM 430, the fourth FEM 440, the fifth FEM 450, and the sixth FEM 460 through the switch 490 and the path 491 connected to the switch 490. The second power supply circuit 402 may be always electrically connected to the second FEM 420 , and may be selectively connected to the third FEM 430 , the fourth FEM 440 , the fifth FEM 450 , and the sixth FEM 460 through a switch 490 and a path 492 connected to the switch 490 .

[0085] The switch 490 may include a first terminal 490a connected to each of the third PA 431 and the fourth PA 441, a second terminal 490b connected to the first power supply circuit 401, and a third terminal 490c connected to the second power supply circuit 402. While transmitting a signal using the second PA 421, the switch 490 may connect the first terminal 490a to the second terminal 490b to transmit a signal using the third PA 431, the fourth PA 441, the fifth PA 451, and / or the sixth PA 461 that operate based on a voltage from the first power supply circuit 401. The second PA 421 may operate based on a voltage from the second power supply circuit 402. While transmitting a signal using the first PA 411, the switch 490 may connect the first terminal 490a to the third terminal 490c to transmit a signal using the third PA 431, the fourth PA 441, the fifth PA 451, and / or the sixth PA 461 that operate based on a voltage from the second power supply circuit 402. Switch 490 may be referred to as a routing component in terms of setting up one of several paths.

[0086] According to an example, the processor 400 may be configured to provide a first connection state and a second connection state between the power supply circuits 401 and 402 and the PAs 411, 421, 431, 441, 451, and 461 through a switch 490. The first connection state may be a state in which the second power supply circuit 402 is electrically connected to the third PA 431, the fourth PA 441, the fifth PA 451, and the sixth PA 461 through the switch 490 on the basis of transmitting a signal using the first PA 411 operated based on the first voltage Vcc1 provided from the first power supply circuit 401, so as to transmit a signal using the third PA 431, the fourth PA 441, the fifth PA 451, or the sixth PA 461 operated based on the second voltage Vcc2 provided from the second power supply circuit 402.

[0087] In the first connection state, the processor 120 may be configured to control the switch 490 to connect the second power supply circuit 402 to the third PA 431 to transmit a signal using the third PA 431, the fourth PA 441, the fifth PA 451, and / or the sixth PA 461. The processor 120 may be configured to provide a control signal to the third FEM 430, which causes the switch 490 to connect the second power supply circuit 402 to the third PA 431 to transmit a signal using the third PA 431, the fourth PA 441, the fifth PA 451, and / or the sixth PA 461. The third PA 431 may be connected to the fourth PA 441, the fifth PA 451, and / or the sixth PA 461 through an electrical path. While transmitting a signal using the first PA 411, the third PA 431, the fourth PA 441, the fifth PA 451, and / or the sixth PA 461 operate based on the second voltage Vcc2 provided from the second power supply circuit 402. The third PA 431 , the fourth PA 441 , the fifth PA 451 and / or the sixth PA 461 may operate based on the second voltage Vcc2 provided from the second power supply circuit 402 , while the first PA obtains the first voltage Vcc1 provided from the first power supply circuit 401 to transmit a signal using the first PA 411 .

[0088] The second connection state may be a state in which the first power supply circuit 401 is electrically connected to the third PA 431, the fourth PA 441, the fifth PA 451 and the sixth PA 461 through the switch 490 on the basis of sending a signal using the second PA 421 operated based on the second voltage Vcc2 provided from the second power supply circuit 402, so as to send a signal using the third PA 431, the fourth PA 441, the fifth PA 451 or the sixth PA 461 operated based on the first voltage Vcc1 provided from the first power supply circuit 401.

[0089] In the second connection state, the processor 120 may be configured to control the switch 490 to connect the first power supply circuit 401 to the third PA 431 to transmit a signal using the third PA 431, the fourth PA 441, the fifth PA 451, and / or the sixth PA 461. The processor 120 may be configured to provide a control signal to the third FEM 430, the control signal causing the switch 490 to connect the first power supply circuit 401 to the third PA 431 to transmit a signal using the third PA 431, the fourth PA 441, the fifth PA 451, and / or the sixth PA 461. While transmitting a signal using the second PA 441, the third PA 431, the fourth PA 441, the fifth PA 451, and / or the sixth PA 461 may operate based on the first voltage Vcc1 provided from the first power supply circuit 401. The third PA 431 , the fourth PA 441 , the fifth PA 451 and / or the sixth PA 461 may operate based on the first voltage Vcc1 provided from the first power supply circuit 401 , while the second PA 421 may obtain the second voltage Vcc2 provided from the second power supply circuit 402 to transmit a signal using the second PA 421 .

[0090] The processor 400 may be configured to simultaneously transmit the first RF signal and one RF signal selected from the third to sixth RF signals in the first connection state. The processor 400 may be configured to simultaneously transmit the second RF signal and one RF signal selected from the third to sixth RF signals in the second connection state.

[0091] According to an example, while supplying a voltage to one PA through the first power supply circuit 401 , the processor 400 may supply a voltage to another PA other than the PA through the second power supply circuit 402 .

[0092] According to an example, the processor 400 may transmit a signal to an external electronic device using the first PA 411, and transmit a signal to another external electronic device different from the external electronic device using one of the second PA 421, the third PA 431, the fourth PA 441, the fifth PA 451, or the sixth PA 461. However, the present disclosure is not limited thereto, and the processor 400 may transmit a signal to an external electronic device using the first PA 411, and transmit a signal to another external electronic device different from the external electronic device using multiple PAs of the second PA 421, the third PA 431, the fourth PA 441, the fifth PA 451, or the sixth PA 461. For example, while transmitting a signal through an antenna, using the first PA 411 operated based on the first voltage Vcc1 provided from the first power supply circuit 401, the processor 400 may provide the second voltage Vcc2 provided from the second power supply circuit 402 to the third PA 431, the fourth PA 441, the fifth PA 451, and / or the sixth PA 461 through the switch 490. For example, while transmitting a signal to the outside through the antenna A1 using the first PA 411, the processor 400 may be configured to avoid causing the switch 490 to electrically connect the first power supply circuit 401 with the third PA 431, the fourth PA 441, the fifth PA 451, and the sixth PA 461, and to cause the switch 490 to electrically connect the second power supply circuit 402 with the third PA 431, the fourth PA 441, the fifth PA 451, and the sixth PA 461. For example, the processor 400 may communicate with an external electronic device through the antenna A3, A4, A5, or A6 connected to one of the third PA 431, the fourth PA 441, the fifth PA 451, and the sixth PA 461, which are provided with the second voltage Vcc2 from the second power supply circuit 402.

[0093] According to an example, the processor 400 may control to deactivate the remaining PAs except for one PA that communicates with the external electronic device among the third PA 431, the fourth PA 441, the fifth PA 451, and the sixth PA 461 supplied with the second voltage Vcc2. For example, among the PAs 431, 441, 451, and 461 supplied with voltage through the switch 490, the PA that does not transmit a signal may be disabled. The processor 400 may identify one PA that communicates with the external electronic device among the third PA 431, the fourth PA 441, the fifth PA 451, and the sixth PA 461. Based on identifying that the one PA is the third PA 431, the processor 400 may transmit a signal for requesting deactivation to the fourth PA 441, the fifth PA 451, and the sixth PA 461.

[0094] According to an example, based on the above operations, the processor 400 can be configured to: based on sending a signal using the first PA 411 operated based on the first voltage Vcc1 provided from the first power supply circuit 401, electrically connect the second power supply circuit 402 with the third PA 431, the fourth PA 441, the fifth PA 451 or the sixth PA 461 through the switch 490, so as to send a signal using one of the third PA 431, the fourth PA 441, the fifth PA 451 or the sixth PA 461 operated based on the second voltage Vcc2 provided from the second power supply circuit 402. As another example, based on sending a signal using the second PA 421 operated based on a voltage provided from the second power supply circuit 402, the processor 400 can be configured to electrically connect the first power supply circuit 401 to the third PA 431, the fourth PA 441, the fifth PA 451 or the sixth PA 461 through the switch 490 so as to send a signal using one of the third PA 431, the fourth PA 441, the fifth PA 451 or the sixth PA 461 operated based on the first voltage provided from the first power supply circuit 401.

[0095] According to an example, the processor 400 may be configured to transmit a signal to a first external electronic device (eg, Figure 3 The control message may be an RRC message. The control message may include a second external electronic device (e.g., Figure 3 The second base station 330) and / or information related to the frequency band used to connect thereto.

[0096] According to an example, the processor 400 may be configured to identify, based on the control message, a PA of a signal to be transmitted when a signal is transmitted using the first PA 411 from among the second PA 421, the third PA 431, the fourth PA 441, the fifth PA 451, and the sixth PA 461. The processor 400 may identify, based on the information within the control message, a frequency band of a signal to be transmitted when a signal is transmitted using the first PA 411, and identify a FEM, a PA, and / or an antenna for the signal to be transmitted based on the frequency band.

[0097] According to an example, the processor 400 may be configured to electrically connect the second power supply circuit 402 to the third PA 431, the fourth PA 441, the fifth PA 451, and the sixth PA 461 through the switch 490, in a case where the identified PA is determined to be the third PA 431, the fourth PA 441, the fifth PA 451, and the sixth PA 461. For example, when the identified PA is the third PA 431, the processor 400 may be configured to electrically connect the second power supply circuit 402 to the third PA 431, the fourth PA 441, the fifth PA 451, and the sixth PA 461 through the switch 490. The switch 490 may be configured to electrically connect the third PA 431, the fourth PA 441, the fifth PA 451, and the sixth PA 461 to the first power supply circuit 401 or the second power supply circuit 402. When the first power supply circuit 401 is electrically connected to the third PA 431 , the fourth PA 441 , the fifth PA 451 , and the sixth PA 461 , the second power supply circuit 402 may be electrically disconnected from the third PA 431 , the fourth PA 441 , the fifth PA 451 , and the sixth PA 461 .

[0098] According to an example, a signal transmitted using the first PA 411 may be transmitted to a first external electronic device (eg, Figure 3 The signal transmitted using the PA identified in the second PA 421, the third PA 431, the fourth PA 441, the fifth PA 451, and the sixth PA 461 may be transmitted to the first external electronic device (e.g., Figure 3 The first base station 310) is different from the second external electronic device (for example, Figure 3For example, based on the control message, the processor 400 may be configured to electrically connect the third PA 431, the fourth PA 441, the fifth PA 451, and / or the sixth PA 461 to the second power supply circuit 402 through the switch 490 based on identifying that the PA for the signal to be transmitted to the second external electronic device according to the second communication scheme is the third PA 431. Based on the control message, the processor 400 may be configured to electrically connect the third PA 431, the fourth PA 441, the fifth PA 451, and / or the sixth PA 461 to the second power supply circuit 402 through the switch 490 based on identifying that the PA for the signal to be transmitted to the second external electronic device according to the second communication scheme is the fourth PA 441. As another example, based on the control message, the processor 400 can be configured to avoid electrically connecting the third PA 431, the fourth PA 441, the fifth PA 451 and the sixth PA 461 to the second power supply circuit 402 through the switch 490 based on identifying that the PA used for the signal to be sent to the external electronic device according to the second communication scheme is the second PA 421.

[0099] According to an example, the processor 400 may be configured to receive a control message from the first external electronic device when transmitting a signal to the first external electronic device using the second PA 421, identify a PA for a signal to be transmitted when transmitting a signal using the second PA 421 among the first PA 411, the third PA 431, the fourth PA 441, the fifth PA 451, and the sixth PA 461 based on the control message, and electrically connect the first power supply circuit 401 to the third PA 431, the fourth PA 441, the fifth PA 451, and the sixth PA 461 through a switch under the condition that the identified PA is identified as the third PA 431. The fourth PA 441, the fifth PA 451, or the sixth PA 461. The signal transmitted using the second PA 421 may be transmitted to the first external electronic device according to the first communication scheme. A signal transmitted using the identified PA among the first PA 411 , the third PA 431 , the fourth PA 441 , the fifth PA 451 , and the sixth PA 461 may be transmitted to a second external electronic device different from the first external electronic device according to a second communication scheme different from the first communication scheme.

[0100] According to an example, based on the control message, the processor 400 may electrically connect the third PA 431, the fourth PA 441, the fifth PA 451, and the sixth PA 461 to the first power supply circuit 401 through the switch 490 based on recognizing that the PA for the signal to be transmitted to the second external electronic device according to the second communication scheme is the third PA 431. Based on the control message, the processor 400 may electrically connect the first power supply circuit 401 to the third PA 431, the fourth PA 441, the fifth PA 451, and the sixth PA 461 through the switch 490 based on recognizing that the PA for the signal to be transmitted to the external electronic device according to the second communication scheme is the fourth PA 441. Based on the control message, the processor 400 may electrically connect the first power supply circuit 401 to the third PA 431, the fourth PA 441, the fifth PA 451, and the sixth PA 461 through the switch 490 based on recognizing that the PA for the signal to be transmitted to the first external electronic device according to the second communication scheme is the fifth PA 451. Based on the control message, the processor 400 may electrically connect the first power supply circuit 401 with the third PA 431, the fourth PA 441, the fifth PA 451, and the sixth PA 461 through the switch 490 based on recognizing that the PA for the signal to be transmitted to the second external electronic device according to the second communication scheme is the sixth PA 461. Based on the control message, the processor 400 may be configured to avoid electrically connecting the first power supply circuit 401 with the third PA 431, the fourth PA 441, the fifth PA 451, and the sixth PA 461 through the switch 490 based on recognizing that the PA for the signal to be transmitted to the second external electronic device according to the second communication scheme is the first PA 411.

[0101] According to an example, while a voltage is supplied to the first PA 411 through the first power supply circuit 401 and a signal is transmitted to an external electronic device through the first PA 411, the processor 400 may control to avoid operating the second PA 421, the fourth PA 441, the fifth PA 451, and the sixth PA 461 based on recognizing that the PA identified based on the control message is the third PA 431. According to an example, while a second voltage is supplied to the second PA 421 through the second power supply circuit 401 and a signal is transmitted to an external electronic device through the second PA 421, the processor 400 may control to avoid operating the first PA 411, the fourth PA 441, the fifth PA 451, and the sixth PA 461 based on recognizing that the PA identified based on the control message is the third PA 431.

[0102] Instead of arranging a power switch in each component (e.g., the third FEM 430, the fourth FEM 440, the fifth FEM 450, and / or the sixth FEM 460) that must receive power from the first power supply circuit 401 and the second power supply circuit 402 according to the above-described embodiment, the switch 490 may be provided outside the third FEM 430, the fourth FEM 440, the fifth FEM 450, and / or the sixth FEM 460. The switch 490 provided outside the third FEM 430, the fourth FEM 440, the fifth FEM 450, and / or the sixth FEM 460 may electrically connect the first power supply circuit 401 to the third FEM 430, the fourth FEM 440, the fifth FEM 450, and / or the sixth FEM 460, or may electrically connect the second power supply circuit 402 to the third FEM 430, the fourth FEM 440, the fifth FEM 450, and / or the sixth FEM 460. As described above, the switch 490 may ensure the antenna freedom capable of supporting various frequency bands through the electrical connection between the third FEM 430 , the fourth FEM 440 , the fifth FEM 450 , and / or the sixth FEM 460 and the first power supply circuit 401 or the second power supply circuit 402 .

[0103] refer to Figure 5 and Figure 6 , Figure 5 The FEM 500 may be a FEM for an antenna capable of supporting multiple frequency bands. Figure 6 The FEM 600 may be a FEM for an antenna capable of supporting a single frequency band. The FEM 500 may be configured to support multiple frequency bands, including multiple filters or multiple duplexers. According to an example, the FEM 500 may be a FEM capable of supporting LTE frequency domain or EN-DC. For example, the FEM 500 may be Figure 4a or Figure 4b 4. The first FEM 410, the second FEM 420, the fifth FEM 450, or the sixth FEM 460 shown in FIG. According to an example, the FEM 600 may be connected to an antenna supporting an ultra-high frequency band (UHB) of the NR frequency domain. For example, the FEM 600 may be Figure 4a or Figure 4b 4. However, the present disclosure is not limited thereto, and Figure 5 FEM 500 and Figure 6 The FEM 600 may be implemented in the electronic device 101 in various combinations.

[0104] refer to Figure 5 , FEM 500 may be operably and / or electrically connected to antenna 590 (e.g., Figure 4a or Figure 4bIn an example, the FEM 500 may include a first duplexer 520 operably and / or electrically connectable to the antenna 590, a second duplexer 530 operably and / or electrically connectable to the antenna 590, and / or a third duplexer 540 operably and / or electrically connectable to the antenna 590.

[0105] The first duplexer 520 may include a first filter 521 for passing a first signal in an uplink frequency range of the first frequency band. In terms of a frequency range of a signal transmitted from the electronic device 101, the uplink frequency range of the first frequency band may be referred to as a transmission frequency range of the first frequency band.

[0106] Similar to the first duplexer 520, the second duplexer 530 may include a second filter 531 for passing a signal within an uplink frequency range of a second frequency band different from the first frequency band. The third duplexer 540 may include a third filter 541 for passing a signal within an uplink frequency range of a third frequency band different from the first frequency band and the second frequency band.

[0107] According to an example, the FEM 500 may further include a switch 550. For example, the switch 550 may be controlled by the processor 400. For example, the processor 400 may operably connect the PA 510 and the first filter 521 in the first duplexer 520, operably connect the PA 510 and the second filter 531 in the second duplexer 530, operably connect the PA 510 and the third filter 541 in the third duplexer 540, or operably disconnect the PA 510 from the first filter 521, the second filter 531, and the third filter 541 through the switch 550. For example, based on the control of the processor 400, the switch 550 may have a first state of forming (or providing) a first electrical path 551 between the PA 510 and the first filter 521 in the first duplexer 520, a second state of forming a second electrical path 552 connecting the PA 510 and the second filter 531 in the second duplexer 530, and a third state of forming a third electrical path 553 connecting the PA 510 and the third filter 541 in the third duplexer 540. Or a fourth state of disconnecting all of the first electrical paths 551, the second electrical paths 552, and the third electrical paths 553.

[0108] According to an example, the FEM 500 may further include a switch 580. For example, the switch 580 may be controlled by the processor 400. For example, the processor 400 may operably connect the first duplexer 520 and the antenna 590, operably connect the second duplexer 530 and the antenna 590, operably connect the third duplexer 540 and the antenna 590, operably connect two duplexers of the first duplexer 520, the second duplexer 530, and the third duplexer 540 to the antenna 590, operably connect all of the first duplexer 520, the second duplexer 530, and the third duplexer 540 to the antenna 590, or operably disconnect all of the first duplexer 520, the second duplexer 530, and the third duplexer 540 from the antenna 590 through the switch 580.

[0109] refer to Figure 6 , the FEM 600 may be operably coupled to an antenna 690. In an example, the FEM 600 may include a duplexer 620 that may be connected to the antenna 690.

[0110] The duplexer 620 may include a filter that passes a signal within a frequency range of the NR standard of the third frequency band.

[0111] refer to Figure 7 , the FEM 700 may include a PA 710 , a first switch 750 , a first connector 720 , a second connector 730 , and a third connector 740 .

[0112] According to an example, FEM 700 may perform Figure 4b The operation of the third FEM 430 and Figure 4b For example, the FEM 700 may include Figure 4b Switch 490 Figure 4b For example, the FEM 700 may include a substrate 701, a PA 710 disposed on the substrate 701, a first connector 720 disposed on an edge of the substrate 701, a second terminal disposed on an edge of the substrate 701, a third connector 740 disposed on an edge of the substrate 701, and / or a switch 750 on the substrate 701, the switch 750 being configured to selectively provide the first voltage Vcc1 or the second voltage Vcc2 to the PA 710. The first power supply circuit 401 may provide the first voltage Vcc1 to the PA 710. The first voltage Vcc1 may be different from the second voltage Vcc2.

[0113] The first switch 750 may include a first terminal 750a, a second terminal 750b, and a third terminal 750c. The first switch 750 includes a first terminal 750a connected to the PA 710 and the third connector 740, a second terminal 750b connected to the first power supply circuit 402, and a third terminal 750c connected to the second power supply circuit 402. The first switch 750 may be configured to connect the first terminal 750a and the second terminal 750b so that the third PA 431, the fourth PA 441, the fifth PA 451, and / or the sixth PA 461 operating based on the voltage of the first power supply circuit 401 are used to transmit signals while the second PA 421 is used to transmit signals. The first switch 750 may be configured to connect the first terminal 750a and the third terminal 750c so that the third PA 431, the fourth PA 441, the fifth PA 451, and / or the sixth PA 461 operating based on the voltage of the second power supply circuit 402 are used to transmit signals while the first PA 411 is used to transmit signals. Switch 490 may be referred to as a routing component in terms of setting up one of several paths.

[0114] According to an example, the first connector 720 may be configured to provide the first voltage Vcc1 provided from the first power supply circuit 401 to the PA (710) (eg, Figure 4b The first switch 750 may provide a first electrical connection 751 from the first connector 720 to the PA 710. The first connector 720 may be electrically connected to a first power supply circuit 401 external to the FEM 700, the first power supply circuit 401 being configured to provide a first voltage Vcc1 for operating the PA 710 within an operating range. A connector may be referred to as a node because it is disposed between two or more circuit elements (e.g., a switch, a PA, or a FEM). For example, the first connector 720 may be referred to as a first node because it is disposed between the first PA 411 and the PA 710 (e.g., Figure 4b The second connector 730 may be referred to as a second node because it is disposed between the second PA 421 and the third PA 710. The third connector 740 may be referred to as a third node because it is disposed between the switch 750 (or the PA 710) and the fourth PA 441.

[0115] According to an example, the second connector 730 may be configured to provide a second voltage Vcc2 provided from the second power supply circuit 402. The first switch 750 may provide a second electrical connection 752 from the second connector 730 to the PA 710. The second connector 730 may be electrically connected to a second power supply circuit 402 external to the FEM 700, the second power supply circuit 402 being configured to provide a second voltage Vcc2 for operating the PA 710 within an operating range.

[0116] According to an example, the third connector 740 may be electrically connected to the PA 710 inside the FEM 700. According to an example, the third connector 740 may be electrically connected to a PA (e.g., the fourth PA 441, the fifth PA 451, or the sixth PA 461 of FIG. 4) in another FEM (e.g., the fourth FEM 440, the fifth FEM 450, or the sixth FEM 460 of FIG. 4) outside the FEM 700 (e.g., the third FEM 430 of FIG. 4). The third connector 740 may provide an electrical connection 753 connected from a node N between the first connector 720 and the second connector 730 and the PA 710 or the switch 750 to the outside. The electrical connection 753 may be a path for providing the voltage Vcc1 or Vcc2 provided to the node N to a PA in another FEM. The third connector 740 may provide the first voltage Vcc1 to a PA (e.g., a fourth PA 441, a fifth PA 451, or a sixth PA 461) in another FEM (e.g., a fourth FEM 440, a fifth FEM 450, or a sixth FEM 460) while the first voltage Vcc1 is provided from the first power supply circuit 401 to the PA 710 in the FEM 700 through the first electrical connection 751. While the first voltage from the first power supply circuit 401 is supplied to the PA 710, the voltage of the first connector 720 may be different from the voltage of the third connector 740. For example, due to the voltage drop caused by the switch 750, the voltage of the first connector 720 as an input terminal may be different from the voltage of the third connector 740 as an output terminal. The voltage of the third connector 740 may also be lower than the voltage of the first connector 720.

[0117] According to an example, the third connector 740 may be configured to provide a second voltage to a PA (e.g., a fourth PA 441, a fifth PA 451, or a sixth PA 461) in another FEM (e.g., a fourth FEM 440, a fifth FEM 450, or a sixth FEM 460), while the second voltage Vcc2 is provided from the second power supply circuit 402 to the PA 710 in the FEM 700 through the second electrical connection 752. While the second voltage from the second power supply circuit 402 is supplied to the PA 710, the voltage of the second connector 730 may be different from the voltage of the third connector 740. For example, due to a voltage drop caused by the switch 750, the voltage of the second connector 730 as an input terminal may be different from the voltage of the third connector 740 as an output terminal. The voltage of the third connector 740 may be lower than the voltage of the second connector 730.

[0118] According to an example, when power from the first power supply circuit 401 is supplied to the PA 710 through a first connection formed by using the switch 750, the third connector 740 may supply power from the first power supply circuit 401 to another PA (e.g., the fourth PA 441, the fifth PA 451, or the sixth PA 461). While power from the second power supply circuit 402 is supplied to the PA 710 through a second connection formed by using the switch 750, the third connector 740 may supply power from the second power supply circuit 402 to another PA (e.g., the fourth PA 441, the fifth PA 451, or the sixth PA 461).

[0119] According to an example, the first switch 750 may be provided in the FEM 700, and may be configured to provide a first electrical connection 751 between the first connector 720 and the PA 710 or a second electrical connection 752 between the second connector 730 and the PA 710. The first switch 750 may have a first state in which the first electrical connection 751 is established between the first connector 720 and the PA 710, a second state in which the second electrical connection 752 is established between the second connector 730 and the PA 710, and a third state in which both the first electrical connection 751 and the second electrical connection 752 are disconnected from the PA 710. According to an example, the first switch 750 may connect a path from the fourth PA 441 to the first connector 720 (or the first pad) to provide a voltage Vcc1 obtained from the first power supply circuit 401 to the first connector 720 to a pad of a fourth FEM (e.g., the fourth FEM 440 of FIG. 4 ), while transmitting a signal using the second PA 421 operated based on the voltage Vcc2 from the second power supply circuit 402. The first switch 750 may connect the path of the fourth PA 441 and the second connector 730 (or the second pad) to provide the voltage Vcc2 obtained from the second power supply circuit 402 to the second connector 730 to the pad of the fourth FEM 440 while sending a signal using the first PA 411 operated based on the voltage Vcc1 from the first power supply circuit 401. The first switch 750 has been described as having a first state, a second state, and a third state, but is not limited thereto. The first switch 750 may have a fourth state in which the first electrical connection 751 and the second electrical connection 752 are simultaneously formed.

[0120] According to an example, instead of arranging a power switch in each component (e.g., the third FEM 430, the fourth FEM 440, the fifth FEM 450, and / or the sixth FEM 460) that must receive power from the first power supply circuit 401 and the second power supply circuit 402, the first switch 750 may be provided in one FEM 700 (e.g., the third FEM 430). The first switch 750 provided in one FEM 700 may electrically connect the first power supply circuit 401 to the third FEM 430, the fourth FEM 440, the fifth FEM 450, or the sixth FEM 460, electrically connect the second power supply circuit 402 to the third FEM 430, the fourth FEM 440, the fifth FEM 450, and / or the sixth FEM 460, or electrically disconnect the third FEM 430, the fourth FEM 440, the fifth FEM 450, and / or the sixth FEM 460 from the first power supply circuit 401 and the second power supply circuit 402. As described above, the first switch 750 may ensure antenna freedom for supporting various frequency bands through electrical connections between the third FEM 430 , the fourth FEM 440 , the fifth FEM 450 , and / or the sixth FEM 460 and the first power supply circuit 401 or the second power supply circuit 402 .

[0121] According to an example, the PA 710 may be configured to set the transmit power of the signal. The PA 710 may set the transmit power of the signal based on the first voltage Vcc1 or the second voltage Vcc2. For example, the PA 710 may receive a voltage (e.g., the first voltage Vcc1 or the second voltage Vcc2) from a power supply circuit (e.g., the first power supply circuit 401 or the second power supply circuit 402) outside the FEM 700. In response to receiving the voltage, the PA 710 may send the transmit power of the signal to the antenna A.

[0122] refer to Figure 8 , FEM 800 can also include Figure 7The second switch 760 in the FEM 700 of the embodiment of the present invention. The second switch 760 may be arranged in the FEM 800 and may be configured to provide a third electrical connection 753 between the first switch 750 and the third connector 740 and a fourth electrical connection 754 between the first switch 750 and the PA 710. The second switch 760 may have a first state of establishing the third electrical connection 753 between the third connector 740 and the first switch 750, a second state of establishing the fourth electrical connection 754 between the first switch 750 and the PA, and a third state of disconnecting both the third electrical connection 753 and the fourth electrical connection 754. According to an example, the second switch 760 includes an input terminal connected to a signal path extending from the first switch 750, a first output terminal connected to the third FEM 430, and a second output terminal connected to the fourth FEM 440. The second switch 760 may be configured to be selectively set to a first routing state or a second routing state, in which a signal received at the input terminal is routed to the first output terminal, and in which a signal received at the input terminal is routed to the second output terminal. The processor 400 may be configured to control a routing state of the second switch 760 to route a voltage transmitted through the input terminal to one of the third FEM 430 and the fourth FEM 440 .

[0123] According to an example, when the second switch 760 is configured to provide power to a PA (eg, the fourth FEM 440, the fifth FEM 450, or the sixth FEM 460) included in another FEM (eg, the fourth FEM 440, the fifth FEM 450, or the sixth FEM 460) outside the FEM 700, Figure 4b When the fourth PA 441, the fifth PA 451 or the sixth PA 461 of the FEM 700 is used to provide a voltage, the second switch 760 can be configured not to provide a voltage to the PA 710, thereby increasing its stability. The second switch 760 can be configured not to provide a voltage to the PA outside the FEM 700, but to provide a voltage to the PA 710 inside the FEM 700, resulting in less influence from the line extending from the PA 710.

[0124] Fig. 9 An example of an arrangement of an antenna module electrically connected to a FEM in an electronic device according to an example is shown.

[0125] Reference Fig. 9, the electronic device 101 may include a first side surface 901, a second side surface 902 substantially parallel to the first side surface 901, a third side surface 903 substantially perpendicular to the first side surface 901 and extending from one end of the first side surface 901 to one end of the second side surface 902, and a fourth side surface 904 substantially perpendicular to the first side surface 901 and extending from the other end of the first side surface 901 to the other end of the second side surface 902. The lengths of the first side surface 901 and the second side surface 902 may be smaller than the lengths of the third side surface 903 and the fourth side surface 904. The first antenna A1 and / or the second antenna A2 may be disposed on the first side surface 901 of the first side surface 901 and the second side surface 902, both of which have a short length. For example, the first antenna A1 and / or the second antenna A2 may be disposed at a position less affected by the user's hand when the user of the electronic device 101 grasps the electronic device 101. The first antenna A1 and / or the second antenna A2 may be disposed in the first area 900A. The first area 900A may be an area located near the jaw (or mouth) of the user when the user holds the electronic device 101 for a phone call. The third antenna A3 and / or the fourth antenna A4 may be disposed in the second area 900B. The second area 900B may be an area located near the ear of the user when the user holds the electronic device 101 for a phone call. The electronic device 101 may further include a housing including a side wall forming a side surface. The conductive portion of the side wall disposed in the second area 900B may be configured to operate as at least a portion of the third antenna A3 and the fourth antenna A4.

[0126] According to an example, one of the first antenna A1 and the second antenna A2 can be operated to communicate with an external electronic device, and one of the remaining antennas other than the above antennas can also be operated. For example, when the first antenna A1 is operated, one of the second antenna A2, the third antenna A3, and the fourth antenna A4 can be operated together with the first antenna A1. As another example, when the second antenna A2 is operated, one of the first antenna A1, the third antenna A3, and the fourth antenna A4 can be operated together with the second antenna A2.

[0127] According to an example, the electronic device 101 may include multiple antennas A1, A2, A3, and A4. The frequency ranges supported by each of the multiple antennas A1, A2, A3, and A4 may be different from each other. For example, the first antenna A1 may be electrically connected to a first FEM (e.g., Figure 4a or Figure 4b The second antenna A2 may be electrically connected to a second FEM (eg, Figure 4a or Figure 4bThe third antenna A3 and / or the fourth antenna A4 may be selectively connected to one of the plurality of FEMs (eg, Figure 4a or Figure 4b The third antenna A3 may be connected to the third FEM (eg, Figure 4a or Figure 4b 430) or a fourth FEM (e.g., Figure 4a or Figure 4b The third antenna A3 may transmit a signal within the third frequency range based on the connection with the third FEM 430, and the third antenna A4 may transmit a signal within the fourth frequency range based on the connection with the fourth FEM 440. For example, the fourth antenna A4 may be connected to the fifth FEM (e.g., Figure 4a or Figure 4b 450) or a sixth FEM (e.g., Figure 4a or Figure 4b The fourth antenna A4 may transmit a signal in a fifth frequency range (e.g., n77 or n79 of the NR standard) based on a connection with the fifth FEM 450, and the fourth antenna A4 may transmit a signal in a sixth frequency range (e.g., n77 or n79 of the NR standard) based on a connection with the sixth FEM 460.

[0128] According to an example, when a user is connected to a first PA (e.g., Figure 4a or Figure 4b The first antenna of the first PA 411) sends the signal to the first external electronic device and uses the first antenna connected to the third PA (eg, Figure 4a or Figure 4b When the third antenna A3 of the third PA 431) sends a signal to the second external electronic device, the processor (eg, Figure 4a or Figure 4b The processor 400 of the electronic device 101 may be configured to send a signal to the second external electronic device through the second PA using the second antenna A2 based on the state change recognized in the electronic device 101. The state change in the electronic device 101 may mean a state change that affects the antenna radiation performance by the user's grip. In the case where the electronic device 101 is a foldable electronic device, the state change of the electronic device 101 may mean a change in the folded or unfolded state of the foldable electronic device.

[0129] For example, the following table shows Figure 4a or Figure 4b The structure of the FEM and Fig. 9 An example of dual connection of an antenna arrangement structure.

[0130]

[0131]

[0132] Refer to the table above and Figure 4a , Figure 4b and Fig. 9 , by switching (e.g., Figure 4a or Figure 4b Switch 490, or Figure 7 The electronic device 101 may provide an electrical connection between the third PA 431 of the third FEM 430, the fourth PA 441 of the fourth FEM 440, the fifth PA 451 of the fifth FEM 450, or the sixth PA 461 of the sixth FEM 460 and the first power supply circuit 401, or provide an electrical connection between the third PA 431 of the third FEM 430, the fourth PA 441 of the fourth FEM 440, the fifth PA 451 of the fifth FEM 450, or the sixth PA 461 of the sixth FEM 460 and the second power supply circuit 402. When the first voltage is provided to the first PA 411 connected to the first antenna A1 located in the first area 900A through the first power supply circuit 401, the processor (e.g., Figure 4a or Figure 4bThe processor 400 of the embodiment of the present invention may be configured to supply the second voltage to the third PA 431 of the third FEM 430, the fourth PA 441 of the fourth FEM 440, the fifth PA 451 of the fifth FEM 450, or the sixth PA 461 of the sixth FEM 460 connected to the third antenna A3 or the fourth antenna A4 located in the second area 900B through the second power supply circuit 402. When the second voltage is supplied to the second PA 412 connected to the second antenna A2 located at the lower end through the second power supply circuit 402, the processor 400 may be configured to supply the first voltage to the third PA 431 of the third FEM 430, the fourth PA 441 of the fourth FEM 440, the fifth PA 451 of the fifth FEM 450, or the sixth PA 461 of the sixth FEM 460 connected to the third antenna A3 or the fourth antenna A4 located at the upper end through the first power supply circuit 401. According to an example, a first antenna A1 and a second antenna A2 capable of supporting LTE may be disposed at the lower end of the electronic device 101 where the first side surface 901 is located. If the LTE connection is unstable when the electronic device 101 is operated in EN-DC, it will also affect the communication using NR, so the antennas A1 and A2 supporting LTE may be disposed at the lower end. In the example, each of the antennas A1 and A2 disposed at the lower end may be connected to a power supply circuit (e.g., a first power supply circuit 401 or a second power supply circuit 402), respectively. For example, the first power supply circuit 401 connected to the first antenna A1 may be connected to a third antenna A3 and a fourth antenna A4. The second power supply circuit 402 connected to the second antenna A2 may be connected to the third antenna A3 and the fourth antenna A4. Depending on the operation of the first antenna A1 or the second antenna A2, the third antenna A3 and the fourth antenna A4 may be electrically connected to the first power supply circuit 401 or the second power supply circuit 402. For example, when the first power supply circuit 401 is connected to the first antenna A1, the second power supply circuit 402 may be connected to the first antenna A1 by a switch (e.g., Figure 4a or Figure 4b The first power supply circuit 401 can be connected to the third antenna A3 and the fourth antenna A4 through the switch 490 while the second power supply circuit 402 is connected to the second antenna A2.

[0133] According to the above embodiment, the electronic device 101 can increase the degree of freedom of the antenna by connecting the FEM to be connected to the multiple power supply circuits 401 and 402 through the switch 490 disposed outside the FEM or the first switch 750 disposed inside one of the multiple FEMs. The electronic device 101 does not have a switch in each of the multiple FEMs, and can arrange a switch only in a selected FEM or arrange a switch outside the FEM, thereby reducing the size of the FEM and reducing the number of switches. Therefore, the relevant manufacturing cost can be greatly reduced.

[0134] Fig.10 is a simplified block diagram of an exemplary electronic device including a PA disposed external to a FEM according to an example.

[0135] refer to Fig.10 , the electronic device 101 (eg, electronic device 101) may include a processor 1000, a first power supply circuit 1001, a second power supply circuit 1002, a first FEM 1010, a second FEM 1020, a third FEM 1030, a fourth FEM 1040, a fifth FEM 1050, and / or a sixth FEM 1060. In an example, the processor 1000 may include Figure 1 In an example, the processor 1000 may include a processor 120 as shown. Figure 2 At least one of the processor 120, the first communication processor 212, the second communication processor 214, the first RFIC 222, the second RFIC 224, the third RFIC 226, the fourth RFIC 228, or a transceiver is shown.

[0136] The FEMs 1010, 1020, 1030, 1040, 1050, and 1060 may include at least one filter (e.g., Figure 5 The first filter 521, the second filter 531 or the third filter 541), the duplexer (for example, Figure 5 The first duplexer 520, the second duplexer 530, or the third duplexer 540) and / or a switch (eg, Figure 5 switch 550 and / or switch 580).

[0137] The PAs (eg, the first PA 411 , the second PA 421 , the third PA 431 , the fourth PA 441 , the fifth PA 451 , and / or the sixth PA 461 ) and / or the switch 1090 may be disposed outside the FEM.

[0138] Based on the control of the processor 1000 and / or a radio frequency integrated circuit (RFIC) (not shown), at least one power supply circuit (e.g., the first power supply circuit 1001 or the second power supply circuit 1002) can variably supply voltage to the PA. According to an example, the voltage of the dynamic operating range of the PAs 1011, 1021, 1031, 1041, 1051, and 1061 can be set by the processor 1000. The voltage can also be set by a radio frequency integrated circuit (RFIC) (not shown) connected to the processor 1000 and each of the FEMs 1010, 1020, 1030, 1040, 1050, and 1060.

[0139] According to an example, at least one power supply circuit may include a first power supply circuit 1001 and / or a second power supply circuit 1002. For example, each of the PAs 1031, 1041, 1051, and 1061 connected to each of some of the FEMs 1030, 1040, 1050, and 1060 in the FEMs may receive a voltage or power from the first power supply circuit 1001 or the second power supply circuit 1002. For example, a first PA 1011 connected to a first FEM 1010 in the FEMs may receive a first voltage Vcc1 or power from the first power supply circuit 1001. For example, a second PA 1021 connected to a second FEM 1020 in the FEMs may receive a second voltage Vcc2 or power from the second power supply circuit 1002. For example, the first power supply circuit 1001 may be configured to provide a first voltage Vcc1 to PAs 1011, 1031, 1041, 1051, and 1061 connected to each of the first FEM 1010, the third FEM 1030, the fourth FEM 1040, the fifth FEM 1050, and the sixth FEM 1060. For example, the second power supply circuit 1002 may be configured to provide a second voltage Vcc2 to PAs 1021, 1031, 1041, 1051, and 1061 connected to each of the first FEM 1020, the third FEM 1030, the fourth FEM 1040, the fifth FEM 1050, and the sixth FEM 1060. The first PA 1011 may receive power from the first power supply circuit 1001. The second PA 1012 may receive power from the second power supply circuit 1002. Each of the PAs 1031 , 1041 , 1051 , and 1061 may receive power from the first power supply circuit 1001 or the power supply circuit 1002 .

[0140] According to an example, the processor 1000 is configured to operate one PA (e.g., the third PA 1031 ) of the PAs 1011 , 1031 , 1041 , 1051 , 1061 supplied with the first voltage Vcc1 from the first power supply circuit 1001 , and to operate the second PA 1021 supplied with the second voltage Vcc2 from the second power supply circuit 1002 .

[0141] According to an example, in order to provide the first voltage Vcc1 provided from the first power supply circuit 1001 and the second voltage Vcc2 provided from the second power supply circuit 1002 to a designated FEM, the switch 1090 may be operably connected to the processor 1000. The switch 1090 may be controlled by the processor 1000. The processor 1000 may include a Figure 2The processor 120, the first communication processor 212, the second communication processor 214, the first RFIC 222, the second RFIC 224, the third RFIC 226, the fourth RFIC 228, or at least one of the transceiver. The switch 1090 may be controlled by the processor 1000. The switch 1090 may selectively connect the third PA 1031, the fourth PA 1041, the fifth PA 1051, and the sixth PA 1061 to the first power supply circuit 1001 or the second power supply circuit 1002. The first power supply circuit 1001 may always be electrically connected to the first PA 1011, and the first power supply circuit 1001 may be selectively connected to the third PA 1031, the fourth PA 1041, the fifth PA 1051, and the sixth PA 1061 through the switch 1090 and the path 1091 connected to the switch 1090. The second power supply circuit 1002 may be always electrically connected to the second PA 1012, and the second power supply circuit 1002 may be selectively connected to the third PA 1031, the fourth PA 1041, the fifth PA 1051, and the sixth PA 1061 through the switch 1090 and the path 1092 connected to the switch 1090. The third PA 1031 and the switch 1090 may be configured as one component. The switch 1090 may be provided on a substrate on which the third PA 1031 is provided. A first terminal 1090a or a first pad of the switch 1090 may be connected to the third PA 1031. A second terminal 1090b or a second pad of the switch 1090 may be connected to the path 1091, and a third terminal 1090c or a third pad of the switch 1090 may be connected to the path 1092. The switch 1090 is not limited thereto, and may be formed as a component separate from the third PA 1031.

[0142] According to an example, while supplying the voltage Vcc1 from the first power supply circuit 1001 to the first PA 1011, the processor 1000 may be configured to supply the voltage from the second power supply circuit 1002 to the remaining PAs 1021, 1031, 1041, 1051, and 1061 except the first PA 1011 by using the switch 1090. While supplying the voltage Vcc2 from the second power supply circuit 1002 to the second PA 1021, the processor 1000 may be configured to supply the voltage from the first power supply circuit 1001 to the remaining PAs 1011, 1031, 1041, 1051, and 1061 except the second PA 1012 by using the switch 1090.

[0143] According to an example, the electronic device 101 may include FEMs 1010, 1020, 1030, 1040, 1050, 1060 disposed outside PAs 1011, 1021, 1031, 1041, 1051, 1061. The present disclosure describes that all PAs are disposed outside the FEMs 1010, 1020, 1030, 1040, 1050, and 1060, but is not limited thereto. Some of the FEMs 1010, 1020, 1030, 1040, 1050, and 1060 may include PAs in some of the FEMs. For example, the first FEM 1010 and the second FEM 1020 may be disposed like Figure 4a or Figure 4b The electronic device 101 may include a PA like the first FEM 410 and the second FEM 420. In addition to the PA being disposed outside the FEM, the electronic device 101 may be configured to Figure 4b The operation of the processor 1000 may be the same as or similar to the electronic device 101 of FIG. Figure 4a or Figure 4b The operations of processor 400 are the same or similar.

[0144] Fig.11 is a simplified block diagram of an exemplary electronic device including an additional FEM. Fig.12 An example of the operation of a switch in a FEM inside an electronic device according to an example is shown.

[0145] Reference Fig.11 and Fig.12 , electronic device 101 (eg, Figure 1 The electronic device 101 may include a processor 1100, a first power supply circuit 1101, a second power supply circuit 1102, a first FEM 1110, a second FEM 1120, a third FEM 1130, a fourth FEM 1140, a fifth FEM 1150, a sixth FEM 1160, a seventh FEM 1170, a first PA 1111, a second PA 1121, a third PA 1131, a fourth PA 1141, a fifth PA 1151, a sixth PA 1161, or a seventh PA 1171. In an example, the processor 1100 may include Figure 1 In an example, the processor 1100 may include a processor 120 as shown in FIG. Figure 2The processor 120, the first communication processor 212, the second communication processor 214, the first RFIC 222, the second RFIC 224, the third RFIC 226, the fourth RFIC 228, or a transceiver are shown. The FEMs 1010, 1020, 1030, 1040, 1050, and 1060 may include components for processing signals transmitted through at least one of the antennas A1, A2, A3, A4, A5, A6, and A7. Each of the FEMs 1110, 1120, 1130, 1140, 1150, 1160, 1170 may be connected to one of the antennas A1, A2, A3, A4, A5, A6, and A7.

[0146] According to an example, in the electronic device 101 of Figure 4B, a seventh FEM 1170 and a seventh antenna A7 may be added. Description of the first power supply circuit 1101, the second power supply circuit 1102, the first FEM 1110, the second FEM 1120, the third FEM 1130, the fourth FEM 1140, the fifth FEM 1150, the sixth FEM 1160, the first PA 1011, the second PA 1021, the third PA 1031, the fourth PA 1041, the fifth PA 1051, or the sixth PA 1061 described in Figure 4B is omitted.

[0147] According to an example, the seventh FEM 1170 and the seventh antenna may be a FEM for satellite communication and an antenna requiring high power for satellite communication. For example, the signal transmitted through the seventh antenna A7 may be used for a Save Our Ship (SOS) service (or emergency service). For wide signal coverage, the range of transmission power obtained using the seventh PA 1171 may be higher than the range of transmission power obtained using other PAs (e.g., the first PA 1111, the second PA 1121, the third PA 1131, the fourth PA 1141, the fifth PA 1151, or the sixth PA 1161). The intensity of the current used to obtain the transmission power of the signal transmitted through the antenna A7 using the seventh PA 1171 is higher than the maximum amplitude of the current that can be obtained from one of the first power supply circuit 1101 and the second power supply circuit 1102. For the transmission power of the signal transmitted through the antenna A7, the first power supply circuit 1101 and the second power supply circuit 1102 may be connected in parallel to the third FEM 1130 connected to the seventh PA 1171. For example, a voltage from the first power supply circuit 1101 and a voltage from the second power supply circuit 1102 may be provided to the seventh PA 1171 to obtain a transmission power of a signal transmitted through the antenna A7. The seventh PA 1171 within the seventh FEM 1170 may require higher power than the first PA 1111, the second PA 1121, the third PA 1131, the fourth PA 1141, the fifth PA 1151, and the sixth PA 1161. In order to supply the required power to the seventh PA 1171, the switch 1190 may be controlled to supply power from the first power supply circuit 1101 to the seventh PA 1171 and to supply power from the second power supply circuit 1102 to the seventh PA 1171. While the switch 1190 is connected to the first power supply circuit 1101 to provide the required power to the seventh PA 1171, the switch 1190 may be connected to the second power supply circuit 1102. The switch 1190 may connect a path 1191 extending from the first power supply circuit 1101 and a path 1192 extending from the second power supply circuit 1102 to a path connected to the third PA 1131 and the fourth PAs 1141 , the fifth PA 1151 , the sixth PA 1161 , and / or the seventh PA 1171 .

[0148] According to an example, the seventh PA 1171 within the seventh FEM 1170 may require a higher current capacity than the first PA 1111, the second PA 1121, the third PA 1131, the fourth PA 1141, the fifth PA 1151, and the sixth PA 1161. The switch 1190 may be controlled to provide one of a current provided from the first power supply circuit 1101, a current provided from the second power supply circuit 1102, and a sum of a current provided from the first power supply circuit 1101 and a current provided from the second power supply circuit 1102 to the third FEM 1130. The current provided to the third FEM 1130 may be transferred to the seventh PA 1171 in the seventh FEM 1170.

[0149] According to an example, the switch 1190 may be the same component as the third FEM 1130. The switch 1190 may be a separate component provided outside the third FEM 1130. The switch 1190 may be controlled to supply the current supplied from the first power supply circuit 1101 and the second power supply circuit 1102 to the seventh PA 1171 so as to supply the required current capacity to the seventh PA 1171.

[0150] refer to Fig.12 , FEM 1200 can be Fig.11 The third FEM 1130 of the embodiment of the present invention. The FEM 1200 may include a substrate 1201, a PA 1210 disposed on the substrate 1201, a first connector (or pad, terminal) 1220, a second connector 1230, a third connector 1240, and / or a switch disposed on the substrate. The switch 1250 may be configured to supply the first voltage Vcc1 and / or the second voltage Vcc2 to the PA 1210.

[0151] According to an example, a first voltage Vcc1 from the first power supply circuit 1101 may be provided to the first connector 1220, and a second voltage Vcc2 from the second power supply circuit 1102 may be provided to the second connector 1230. The switch 1250 may include a first terminal 1250a connected to the PA 1210 and the third connector 1240, a second terminal 1250b connected to the first connector 1220, and a third terminal 1250c connected to the second connector 1220. The switch 1250 may provide an electrical connection 1251 from the first connector to the PA 1210. For example, the switch 1250 may provide a first electrical connection 1251 connecting the first power supply circuit 1101 and the PA 1210 outside the FEM 1200 by connecting the first terminal 1250a and the second terminal 1250b. The switch 1250 may provide an electrical connection 1252 from the second connector 1230 to the PA 1210. For example, the switch 1250 may provide a second electrical connection 1252 connecting the second power supply circuit 1102 external to the FEM 1200 and the PA 1210 by connecting the first terminal 1250a and the third terminal 1250c.

[0152] According to an example, the third connector 1240 may be electrically connected to the PA 1210 inside the FEM 1200 and another PA (e.g., the fourth PA 1141, the fifth PA 1151, the sixth PA 1161, and / or the seventh PA 1171) in another FEM (e.g., the fourth FEM 1140, the fifth FEM 1150, the sixth FEM 1160, and / or the seventh FEM 1170) outside the FEM 1200. The third connector 1240 may provide a node N between the switch 1250 and the PA 1210 or a third electrical connection 1253 connected from the switch 1250 to the outside. The third electrical connection 1253 may be a path for providing the voltage Vcc1 and / or Vcc2 provided to the node N to another PA.

[0153] According to an example, while the first voltage Vcc1 is provided from the first power supply circuit 1101 to the PA 1210 in the FEM 1200 through the first connection 1251, the third connector 1240 may be configured to provide the first voltage Vcc1 to a PA (e.g., the fourth PA 1141, the fifth PA 1151, the sixth PA 1161, or the seventh PA 1171) in another FEM (e.g., the fourth FEM 1140, the fifth FEM 1150, the sixth FEM 1160, or the seventh FEM 1170) (or connected to another FEM (e.g., the fourth FEM 1140, the fifth FEM 1151, the sixth PA 1161, or the seventh PA 1171). While the second voltage Vcc2 is provided from the second power supply circuit 1102 to the PA 1210 in the FEM 1200 through the second connection 1252, the third connector 1240 may be configured to provide the second voltage Vcc2 to another FEM (e.g., the fourth FEM 1140, the fifth FEM 1150, the sixth FEM 1160, or the seventh FEM 1170). 1140, fifth FEM 1150, sixth FEM 1160, or seventh FEM 1170) (or connected to another FEM (e.g., fourth FEM 1140, fifth FEM 1150, sixth FEM 1160, or seventh FEM 1170)).

[0154] According to an example, the switch 1250 may be provided in the FEM 1200 and configured to provide a first electrical connection 1251 between the first connector 1220 and the PA 1210, or a second electrical connection 1252 between the second connector 1230 and the PA 1210. The switch 1250 may be controlled by the processor 1100. The first switch 1250 may provide a first state in which the first electrical connection 1251 between the first terminal 1220 and the PA 1210 is formed, a second state in which the second electrical connection 1252 between the second connector 1230 and the PA 1210 is formed, a third state in which both the first electrical connection 1251 and the second electrical connection 1252 are disconnected, and a fourth state in which both the first electrical connection 1251 and the second electrical connection 1252 are formed. The switch 1250 has been described as being provided within the FEM 1200, but is not limited thereto, and the switch 1250 may be provided outside the FEM 1200. According to an example, while transmitting a signal using the second PA 1121 operated based on the voltage Vcc2 from the second power supply circuit 1102, in order to transmit the voltage Vcc1 obtained at the first connector 1220 to the fourth FEM (eg, Fig.11 The switch 1250 connects the path from the fourth PA 1141 to the second connector 1230 (eg, the path from the third connector 1240 to the node N).

[0155] In the fourth state where both the first electrical connection 1251 and the second electrical connection 1252 are formed, in order to transmit the power or current of the first power supply circuit 1101 to the fourth FEM (eg, Fig.11 In the fourth state, the first switch 1250 may connect the path from the fourth PA 1141 to the first connector 1220 (or the first pad) (e.g., the path from the third connector 1240 to the node N), and connect the path from the fourth PA 1141 to the second connector 1230. For example, the first terminal 1250a of the switch 1250 may be connected to the second terminal 1250b and to the third terminal 1250c at the same time. In the fourth state, the switch 1250 may be controlled to transmit the power from the first power supply circuit 1101 and the power from the second power supply to the third PA (e.g., Fig.12 For example, in the fourth state, the switch 1250 may be controlled to transmit a current greater than the current from the first power supply circuit 1101 or the current from the second power supply circuit 1102.

[0156] Reference Fig.11 , the switch 1190 may support a multi-on mode, while providing a connection between the first terminal 1250a and the second terminal 1250b and a connection between the first terminal 1250a and the third terminal 1250c. The processor 1100 may be configured to control the switch 1190 to supply the power from the first power supply circuit 1101 and the power from the second power supply circuit 1102 to the seventh PA 1171, so as to use the antenna A7 requiring high power. For example, the processor 1100 may use the switch 1250 to supply the power from the first power supply circuit 1101 and the power from the second power supply circuit 1102 to the seventh PA 1171, so as to establish a satellite communication channel through the seventh antenna A7. For example, the processor 1100 may be configured to connect the first terminal 1250a and the second terminal 1250b of the switch 1190 or 1250, and simultaneously connect the first terminal 1250a and the third terminal 1250c. Although the seventh antenna A7 has been described as an antenna for satellite communication, it is not limited thereto and may be an antenna supporting other frequency bands requiring high power. For example, when a signal is being sent to at least one external electronic device (e.g., Figure 3When the first base station 310 or the second base station 330 is connected to the first power supply circuit 1101 or the second power supply circuit 1102, the processor 1100 may be configured to receive a control message from at least one external electronic device. The processor 1100 may identify the PA of the signal to be transmitted based on the control message. The processor 1100 may be configured to connect the seventh PA 1171 to the first power supply circuit 1101 and the second power supply circuit 1102 by controlling the switch 1190 based on the identified PA being the seventh PA 1171.

[0157] According to the example, Figure 4a or Figure 4b Switch 490, Figure 7 or Figure 8 The first switch 750 and / or Fig.10 The switch 1090 can be like Fig.11 Switch 1190 or Fig.12 The switch 1250 also supports multiple connections.

[0158] According to the above-described embodiment, the electronic device 101 can support a frequency band requiring high output power by simultaneously supplying power from the first power supply circuit 1101 and power from the second power supply circuit 1102 to the third PA 1131, the fourth PA 1141, the fifth PA 1151, the sixth PA 1161, or the seventh PA 1171 via the switch 1190 or 1250. In a shadow area where it is difficult to establish a communication channel between a base station and the electronic device 101, the electronic device 1100 can establish a communication channel for communicating with a satellite by simultaneously supplying a plurality of power supply voltages to the PAs.

[0159] According to the above-mentioned embodiments, the electronic device (eg, Figure 1 The electronic device 101 may include at least one processor (eg, Figure 1 processor 120), including a first power supply circuit (eg, Figure 4a or Figure 4b The first power supply circuit 401) and the second power supply circuit (for example, Figure 4a or Figure 4b The first FEM (e.g., Figure 4a or Figure 4b The first FEM 410 is electrically connected to the first power supply circuit and includes a first power amplifier (PA) configured to transmit a first RF signal (eg, Figure 4a or Figure 4b a first PA 411); a second FEM (e.g., Figure 4a or Figure 4bThe second FEM 420 is electrically connected to the second power supply circuit and includes a second PA (eg, Figure 4a or Figure 4b a second PA 421); a third FEM (e.g., Figure 4a or Figure 4b a third FEM 430 of the present invention), comprising a third PA and a switch, the third PA being configured to transmit a third RF signal different from the first RF signal and the second RF signal, the switch being configured to electrically connect one power supply circuit selected from the first power supply circuit and the second power supply circuit to the third PA, the third FEM being configured to electrically connect the selected one power supply circuit to another FEM via an electrical path extending from a node between the third PA and the switch; and a fourth FEM (e.g., Figure 4a or Figure 4b The fourth FEM 440 includes a fourth PA, the fourth PA is configured to transmit a fourth RF signal different from the first RF signal, the second RF signal and the third RF signal, and the fourth FEM is electrically connected to the electrical path.

[0160] According to an example, at least one processor may be configured to: based on using the first PA operating based on the first voltage provided from the first power supply circuit through the switch to transmit a signal, provide a first connection state in which the second power supply circuit is electrically connected to the third PA and the fourth PA through the switch to transmit a signal using the third PA or the fourth PA operating based on the second voltage provided from the second power supply circuit, and based on using the second PA operating based on the second voltage provided from the second power supply circuit to transmit a signal, provide a second connection state in which the first power supply circuit is electrically connected to the third PA and the fourth PA through the switch to transmit a signal using the third PA or the fourth PA operating based on the first voltage provided from the first power supply circuit. According to an embodiment, the processor may be configured to transmit one selected from the third RF signal or the fourth RF signal together with the first RF signal in the first connection state, or transmit one selected from the third RF signal or the fourth RF signal together with the second RF signal in the second connection state.

[0161] According to an example, the electronic device may further include a plurality of antennas (eg, Figure 4a or Figure 4b The multiple antennas include a first antenna electrically connected to the first PA, a second antenna electrically connected to the second PA, a third antenna electrically connected to the third PA, and a fourth antenna connected to the fourth PA.

[0162] According to an example, the third antenna or the fourth antenna may be provided on one side of the electronic device.

[0163] According to an example, the electronic device may further include a side wall forming a side surface of the electronic device.

[0164] According to an example, the conductive portion of the sidewall disposed on one side may be configured to operate as at least a part of one of the third antenna or the fourth antenna.

[0165] According to an example, the first antenna or the second antenna may be disposed on another side opposite to one side of the electronic device.

[0166] According to an example, at least one processor may also be configured to support dual connectivity or carrier aggregation by simultaneously sending a selected one of a third RF signal or a fourth RF signal and the first RF signal in a first connection state, or simultaneously sending a selected one of a third RF signal or a fourth RF signal and a second RF signal in a second connection state.

[0167] According to the example, at least one processor may also be configured to: send a signal based on using a first PA operated based on a first voltage provided from a first power supply circuit, electrically connect the third PA and the fourth PA to the second power supply circuit through a switch, so as to send a signal to the outside using the third PA or the fourth PA operated based on a second voltage provided from the second power supply circuit.

[0168] According to the example, at least one processor may also be configured to: send a signal based on using a second PA operated based on a second voltage provided from a second power supply circuit, electrically connect the third PA and the fourth PA to the first power supply circuit through a switch, so as to send a signal to the outside using the third PA or the fourth PA operated based on the first voltage provided from the first power supply circuit.

[0169] According to an example, the at least one processor may be further configured to receive a control message from the first external electronic device while transmitting a signal to the first external electronic device using the first PA.

[0170] According to an example, the at least one processor may be further configured to, based on the control message, identify a PA of another signal different from the signal from among the second PA, the third PA, and the fourth PA while transmitting the signal using the first PA.

[0171] According to an example, the at least one processor may be further configured to electrically connect the second power supply circuit to the third PA and the fourth PA through a switch when the identified PA is determined to be the third PA or the fourth PA.

[0172] According to the example, a signal sent using the first PA can be sent to a first external electronic device that supports the first communication scheme according to a first communication scheme, and a signal sent using an identified PA among the second PA, the third PA, or the fourth PA can be sent to a second external electronic device that supports the second communication scheme according to a second communication scheme different from the first communication scheme, the second external electronic device being different from the first external electronic device.

[0173] According to an example, at least one processor may be configured to electrically connect the second power supply circuit with the third PA and the fourth PA through a switch based on a control message, and deactivate the fourth PA based on identifying that the PA for a signal to be sent to a second external electronic device according to a second communication scheme is the third PA.

[0174] According to an example, at least one processor may be configured to: based on a control message, electrically connect the second power supply circuit with the third PA and the fourth PA through a switch, and deactivate the third PA based on identifying that the PA for the signal to be sent to the second external electronic device according to the second communication scheme is the fourth PA.

[0175] According to an example, at least one processor may be configured to: based on the control message, based on identifying that the PA used for the signal to be sent to the second external electronic device according to the second communication scheme is the second PA, avoid electrically connecting the second power supply circuit with the third PA and the fourth PA through the switch.

[0176] According to an example, at least one processor may be configured to receive a control message related to a signal to be sent from a first external electronic device while sending the signal to the first external electronic device using a second PA, and based on the control message, identify a PA for the signal to be sent while sending the signal using the second PA from among the first PA, the third PA, and the fourth PA.

[0177] According to an example, the at least one processor may be configured to electrically connect the first power supply circuit with the third PA and the fourth PA through the switch under the condition that the identified PA is determined to be the third PA or the fourth PA.

[0178] According to an example, the at least one processor may be configured to cause a signal transmitted using the second PA to be transmitted to the first external electronic device according to the first communication scheme.

[0179] According to an example, at least one processor may be configured to cause a signal transmitted using a PA identified among the first, third, or fourth PAs to be transmitted to a second external electronic device different from the first external electronic device according to a second communication scheme different from the first communication scheme.

[0180] According to an example, at least one processor may be configured to: based on the control message, based on identifying that the PA used for the signal to be transmitted to the second external electronic device according to the second communication scheme is the third PA, provide a voltage from the second power supply circuit to the third PA and the fourth PA through a switch.

[0181] According to an example, at least one processor may be configured to: based on the control message, based on identifying that the PA used for the signal to be transmitted to the second external electronic device according to the second communication scheme is the fourth PA, provide a voltage from the second power supply circuit to the third PA and the fourth PA through the switch.

[0182] According to an example, the at least one processor may be configured to: based on the control message, based on identifying that the PA used for the signal to be sent to the second external electronic device according to the second communication scheme is the second PA, avoid providing the voltage from the second power supply circuit to the third PA and the fourth PA through the switch.

[0183] According to an example, the third FEM may include a first terminal (eg, Figure 7 A first connector 720 configured to provide a second voltage provided from a second power supply circuit (eg, Figure 7 ), and a third terminal (eg, a second connector 730) connected to a third PA. Figure 7 A third connector 740).

[0184] According to an example, the switch in the third FEM may be configured to provide a first electrical connection between the first terminal and the third PA or a second electrical connection between the second terminal and the third PA.

[0185] According to an example, the third terminal may be configured to supply the first voltage provided from the first power supply circuit to the fourth PA while supplying the first voltage provided from the first power supply circuit to the third PA through the first electrical connection.

[0186] According to an example, the third terminal may be configured to supply the second voltage provided from the second power supply circuit to the fourth PA while supplying the second voltage provided from the second power supply circuit to the third PA through the second electrical connection.

[0187] According to an example, the third FEM may further include another switch different from the switch and configured to connect the third terminal to a node of the third PA to which the first voltage provided from the first power supply circuit or the second voltage provided from the second power supply circuit is applied.

[0188] According to an example, at least one processor may be configured to: receive a control message from a first external electronic device while using a second PA to send a signal to a first external electronic device, identify a PA for a signal to be sent while using the first PA to send a signal in a third PA and a fourth PA based on the control message, and based on identifying that the identified PA is the third PA, electrically connect the third PA and the first terminal through another switch while electrically connecting the other switch and the first terminal through the switch, and avoid electrically connecting a node of the third PA and the third terminal.

[0189] According to an example, at least one processor may be configured to electrically connect a node of a third PA and a third terminal through another switch while electrically connecting another switch and the first terminal through the switch based on the identified PA being a fourth PA, and avoid electrically connecting the third PA and the first terminal.

[0190] According to an example, the first PA may be configured to set a first transmit power having a first frequency band, the second PA may be configured to set a second transmit power having a second frequency band, the third PA may be configured to set a third transmit power having a third frequency band, and the fourth PA may be configured to set a fourth transmit power having a fourth frequency band.

[0191] According to an example, the first frequency band may be spaced apart from the second frequency band, and the third frequency band may be spaced apart from the fourth frequency band.

[0192] According to an example, the first frequency band or the second frequency band may be lower than the third frequency band or the fourth frequency band.

[0193] According to an example, the first frequency band may include at least a portion of the third frequency band.

[0194] According to an example, the second frequency band may include at least a portion of the fourth frequency band.

[0195] According to an example, the electronic device may further include a housing forming an internal space thereof, the housing having a first side surface (eg, Fig. 9 a first side surface 901 of the embodiment of the present invention and a second side surface parallel to the first side surface (eg, Fig. 9 a second side surface 902 of the first side surface, a third side surface extending from one end of the first side surface to one end of the second side surface in a direction perpendicular to the first side surface (eg, Fig. 9 A third side surface 903), and a fourth side surface extending from the other end of the first side surface to the other end of the second side surface in a direction perpendicular to the first side surface (eg, Fig. 9 a fourth side surface 904).

[0196] According to an example, the electronic device may further include at least one first antenna (eg, Fig. 9 The first antenna A1 and / or the second antenna A2), and at least one second antenna (eg, Fig. 9 third antenna A3 and / or fourth antenna A4).

[0197] According to an example, the at least one first antenna may be configured to transmit a signal received from the first FEM or the second FEM to an external electronic device.

[0198] According to an example, the at least one second antenna may be configured to transmit a signal received from the third FEM or the fourth FEM to an external electronic device.

[0199] According to an example, at least one processor may be configured to, while using a first PA and at least one first antenna to send a signal to a first external electronic device and using at least one second antenna to send a signal to a second external electronic device through a third PA, send a signal to a second external electronic device through a second PA based on identifying a state of the electronic device.

[0200] According to an example, the FEM may further include a fifth FEM including a fifth PA connected to the first path and the second path of the switch. The switch may be controlled to connect the first power supply circuit to the third PA, the fourth PA, and the fifth PA, and controlled to connect the second power supply circuit to the third PA, the fourth PA, and the fifth PA to transmit a signal using the fifth PA operated based on a first voltage provided from the first power supply circuit and a second voltage provided from the second power supply circuit.

[0201] According to an example, the FEM may include: a power amplifier (PA) configured to set a transmission power of a signal; a first terminal (eg, Figure 7 A first connector 720 of the FEM is configured to provide a first voltage for operating the PA within an operating range; a second terminal (eg, Figure 7 A second connector 730 of the FEM), the second terminal of which is configured to provide a second voltage for operating the PA within the operating range; a third terminal (eg, Figure 7 a third connector 740); and a switch (eg, Figure 7 A first switch 750) is configured to provide a first electrical connection between a first terminal in the FEM and the PA or a second electrical connection between a second terminal in the FEM and the PA.

[0202] According to an example, the third terminal may be configured to provide the first voltage to another PA in another FEM while providing the first voltage from the first power supply circuit to the PA in the FEM through the first electrical connection.

[0203] According to an example, the third terminal may be configured to provide the second voltage to another PA in another FEM while providing the second voltage from the second power supply circuit to the PA in the FEM through the second electrical connection.

[0204] According to an example, the third terminal may be electrically connected to a node of the PA in the FEM to which the first voltage or the second voltage is applied.

[0205] According to an example, the FEM may further include another switch that is different from the switch and is configured to provide a third electrical connection between the PA in the FEM and the switch or a fourth electrical connection between the switch and a third terminal.

[0206] According to an example, the further switch may be configured to inhibit supply of the first voltage to another PA in another FEM through the fourth electrical connection while supplying the first voltage from the first power supply circuit to the PA in the FEM through the third electrical connection.

[0207] According to an example, the further switch may be configured to inhibit supply of the first voltage to the PA in the FEM through the third electrical connection while supplying the first voltage from the first power supply circuit to another PA in another FEM through the fourth electrical connection.

[0208] According to an example, the further switch may be configured to inhibit supply of the second voltage to another PA in another FEM through the fourth electrical connection while supplying the second voltage from the second power supply circuit to the PA in the FEM through the third electrical connection.

[0209] According to an example, the further switch may be configured to inhibit supply of the second voltage to the PA in the FEM through the third electrical connection while supplying the second voltage from the second power supply circuit to another PA in another FEM through the fourth electrical connection.

[0210] Various examples of the present disclosure include one or more electronic devices according to one or more of the following numbered examples. The skilled person will understand that the following examples and their features can be combined with any other suitable examples, aspects, embodiments and / or claims disclosed in this specification and its features.

[0211] According to an example, an electronic device (101) may include a processor (400), a first power supply PS (401) and a second power supply PS (402), a third front-end module FEM (430), the third front-end module FEM (430) including a third power amplifier PA (431) for amplifying a third RF signal based on a control signal, and a first routing component (490, 750) configured to route a selected one of a first control signal output by the first PS (401) and a second control signal output by the second PS (402) to a signal path for providing a control signal to the third FEM (430) according to control of the processor (400).

[0212] According to an example, the electronic device may further include a first FEM (410) including a first PA (411) for amplifying a first RF signal based on a control signal output by the first PS (401), and a second FEM (420) including a second PA (421) for amplifying a second RF signal based on a control signal output by the second PS (402).

[0213] According to an example, wherein the third FEM (430) is directly connected to the routing component (490) via the signal path.

[0214] According to an example, the electronic device may further include a fourth FEM (440), the fourth FEM (440) including a fourth PA (441), the fourth PA (441) for amplifying a fourth RF signal based on a control signal transmitted via the signal path.

[0215] According to an example, wherein the fourth FEM (440) is directly connected to the routing component (490) via a signal path.

[0216] According to an example, the electronic device may further include a second routing component (760) configured to route a signal received via the signal path to a selected one of the third FEM (430) and the fourth FEM (440) according to control of the processor (400).

[0217] According to an example, wherein the second routing component (760) is configured to selectively disconnect signals received from the third FEM (430) and the fourth FEM (440) via the signal path according to control of the processor.

[0218] According to an example, wherein the second routing component (760) comprises a switch.

[0219] According to an example, the second routing component (760) includes an input node connected to a signal path, a first output node connected to a third FEM (430), and a second output node connected to a fourth FEM (440), wherein the second routing component (760) is configured to be selectively set to a first routing state or a second routing state, wherein in the first routing state, a signal received at the input node is routed to the first output node, and in the second routing state, a signal received at the input node is routed to the second output node, and wherein the processor (400) is configured to control the routing state of the second routing component (760) to route a control signal sent via the signal path to one of the third FEM (430) and the fourth FEM (440).

[0220] According to an example, the second routing component (760) is disposed within one of the FEMs (eg, the third FEM (430)).

[0221] According to an example, wherein the first routing component (490, 750) comprises a switch.

[0222] According to an example, the first routing component (490, 750) includes a first input node connected to the first PS (401), a second input node connected to the second PS (402), and an output node connected to the signal path, wherein the first routing component (490, 750) is configured to be selectively set to a first routing state or a second routing state, in which the signal received at the first input node is routed to the output node, and in which the signal received at the second input node is routed to the output node, and wherein the processor (400) is configured to control the routing state of the first routing component (490, 750) to route a control signal output by one of the first PS (401) and the second PS (402) as a control signal to the output signal path.

[0223] According to an example, wherein the first routing component (490, 750) is disposed within one of the FEMs (eg, the third FEM (430)).

[0224] According to an example, the electronic device may include one or more antennas (A1-A4), wherein each antenna (A1-A4) is configured to be connected or selectively connectable to an output of at least one PA (411, 421, 431, 441).

[0225] According to an example, the one or more antennas (A1-A4) include: first to fourth antennas (A1-A4), which are respectively connected to the outputs of first to fourth PAs (411, 421, 431, 441) and are configured to transmit first to fourth RF signals, respectively.

[0226] According to an example, at least one of the antennas (A1-A4) is disposed on a side surface (901-904) of a shell or casing of an electronic device (101), or is formed by a conductive portion of a side surface (901-904) of a shell or casing of an electronic device (101).

[0227] According to an example, at least some of the antennas (A1-A4) are disposed on different (eg, opposite or adjacent) side surfaces (901-904) of a housing or casing of the electronic device (101).

[0228] According to an example, wherein at least some of the RF signals differ in their signal characteristics.

[0229] According to an example, wherein the signal characteristic comprises a frequency characteristic (eg, a frequency band).

[0230] According to an example, the processor (400) is configured to control the first and / or second routing components (490, 750, 760) to route a first control signal output by the first PS (401) to the first FEM (410) to transmit a first RF signal, and to route a second control signal output by the second PS (402) to at least one of a third FEM (430) and a fourth FEM (440) to transmit at least one of a third RF signal and a fourth RF signal while transmitting the first RF signal.

[0231] According to an example, the processor (400) is configured to control the first and / or second routing components (490, 750, 760) to route the second control signal output by the second PS (402) to the second FEM (420) to transmit the second RF signal, and to route the first control signal output by the first PS (401) to at least one of the third FEM (430) and the fourth FEM (440) to transmit at least one of the third RF signal and the fourth RF signal while transmitting the second RF signal.

[0232] The electronic device according to various embodiments disclosed herein may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to the example, the electronic device is not limited to those described above.

[0233] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, and include various changes, equivalents or replacements of the corresponding embodiments. With respect to the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It should be understood that, unless otherwise clearly stated in the relevant context, the singular form of the noun corresponding to the project may include one or more things. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together in a corresponding phrase. As used herein, terms such as "first" and "second" or "first" and "second" may be used to simply distinguish a corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It should be understood that if an element (e.g., a first element) is referred to as being "coupled with another element (e.g., a second element)", "coupled to another element", "connected to another element" or "connected to another element" with or without the term "operably" or "communicatively", it means that the element can be coupled to the other element directly (e.g., wired), wirelessly or via a third element.

[0234] As used in conjunction with various embodiments of the present disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "component," or "circuit"). A module may be a single integrated component or its smallest unit or portion adapted to perform one or more functions. For example, according to an example, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0235] The various embodiments described herein may be implemented as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) readable by a machine (e.g., electronic device 101). For example, a processor of a machine (e.g., processor 120 of electronic device 101) may call at least one of the one or more instructions stored in the storage medium and execute it with or without one or more other components under the control of the processor. This allows the machine to be operated to perform at least one function according to at least one instruction called. One or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between where data is semi-permanently stored in the storage medium and where data is temporarily stored in the storage medium.

[0236] According to an example, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disc read-only memory (CD-ROM)), or via an application store (e.g., PlayStore). TM ) online distribution (e.g., download or upload), or directly between two user devices (e.g., smartphones) (e.g., download or upload). If distributed online, at least a portion of the computer program product may be temporarily generated or at least temporarily stored in a machine-readable storage medium, such as a memory of a manufacturer's server, a server of an application store, or a relay server.

[0237] According to various embodiments of the present disclosure, each of the above-mentioned components (e.g., a module or a program) may include a single entity or multiple entities, and some of the multiple entities may be separately set in different components. According to various embodiments of the present disclosure, one or more of the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments of the present disclosure, the integrated component may still perform one or more functions of each of the multiple components in the same or similar manner as performed by the corresponding components in the multiple components before integration. According to various embodiments of the present disclosure, the operations performed by a module, a program or another component may be performed sequentially, in parallel, repeatedly or heuristically, or one or more of the operations may be performed or omitted in a different order, or one or more other operations may be added.

Claims

1. An electronic device, comprising: A plurality of power supply circuits, including a first power supply circuit and a second power supply circuit; Front End Module (FEM), including: a first FEM connected to the first power supply circuit and comprising a first power amplifier (PA), a second FEM connected to the second power supply circuit and comprising a second PA, a third FEM, including a third PA and a switch, and a fourth FEM including a fourth PA; and wherein the switch includes a first path configured to connect the first power supply circuit to the third PA and the fourth PA and a second path configured to connect the second power supply circuit to the third PA and the fourth PA, wherein the switch is controlled to connect the second power supply circuit to the third PA and the fourth PA while transmitting a signal using the first PA operated based on the first voltage supplied from the first power supply circuit so as to transmit a signal using the third PA or the fourth PA operated based on the second voltage supplied from the second power supply circuit, and The switch is controlled to connect the first power supply circuit to the third PA and the fourth PA while sending a signal using the second PA operated based on the second voltage provided from the second power supply circuit, so as to send a signal using the third PA or the fourth PA operated based on the first voltage provided from the first power supply circuit.

2. The electronic device according to claim 1 further includes multiple antennas, the multiple antennas including a first antenna connected to the first PA, a second antenna connected to the second PA, a third antenna electrically connected to the third PA, and a fourth antenna electrically connected to the fourth PA.

3. The electronic device according to claim 1 or 2, wherein: The third antenna or the fourth antenna is disposed on one side of the electronic device.

4. The electronic device according to any one of the preceding claims, further comprising a side wall forming one side surface of the electronic device, and in, The conductive portion of the sidewall disposed on the one side is configured to operate as at least a part of one of the third antenna or the fourth antenna.

5. The electronic device according to any one of the preceding claims, further comprising at least one processor, and in, The at least one processor is configured to support dual connectivity or carrier aggregation by sending a first RF signal from the first PA and a signal from the third PA or the fourth PA in a first connection state and / or by sending the second RF signal, a signal from the third PA or the fourth PA in a second connection.

6. The electronic device according to any one of the preceding claims, further comprising at least one processor, and in, The at least one processor is configured to: while using the first PA to send a signal to a first external electronic device, receiving a control message from the first external electronic device, based on the control message, while transmitting the signal using the first PA, identifying a PA for the signal to be transmitted among the second PA, the third PA, and the fourth PA, and Under the condition that the PA is the third PA or the fourth PA, the second power supply circuit is connected to the third PA and the fourth PA through the switch.

7. An electronic device according to any one of the preceding claims, wherein: The signal transmitted using the first PA is transmitted to the first external electronic device according to a first communication scheme; as well as The signal transmitted using the PA is transmitted to a second external electronic device according to a second communication scheme.

8. An electronic device according to any one of the preceding claims, wherein: The at least one processor is configured to: Based on the control message, based on identifying that the PA used for the signal to be transmitted to the second external electronic device according to the second communication scheme is the third PA, electrically connecting the second power supply circuit with the third PA and the fourth PA through the switch, and deactivating the fourth PA; as well as Based on the control message, based on identifying that the PA for the signal to be sent to the second external electronic device according to the second communication scheme is the fourth PA, the second power supply circuit is electrically connected to the third PA and the fourth PA through the switch, and the third PA is deactivated.

9. An electronic device according to any one of the preceding claims, wherein: The at least one processor is configured to: Based on the control message, based on identifying that the PA used for the signal to be transmitted to the second external electronic device according to the second communication scheme is the second PA, electrically connecting the third PA and the fourth PA to the second power supply circuit through the switch is avoided.

10. An electronic device according to any one of the preceding claims, wherein: The at least one processor is configured to: receiving a control message from the first external electronic device while sending a signal to the first external electronic device using the second PA, based on the control message, when transmitting a signal using the second PA, identifying a PA for a signal to be transmitted among the first PA, the third PA, and the fourth PA, and Under the condition that the PA is the third PA or the fourth PA, the first power supply circuit is electrically connected to the third PA and the fourth PA through the switch.

11. An electronic device according to any one of the preceding claims, in, The signal transmitted using the second PA is transmitted to the first external electronic device according to the first communication scheme; as well as The signal transmitted using the PA among the first PA, the third PA or the fourth PA is transmitted to a second external electronic device different from the first external electronic device according to a second communication scheme different from the first communication scheme.

12. An electronic device according to any one of the preceding claims, wherein: The at least one processor is configured to: Based on the control message, based on identifying that the PA used for the signal to be transmitted to the second external electronic device according to the second communication scheme is the third PA, electrically connecting the third PA and the fourth PA to the power supply circuit through the switch; Based on the control message, based on identifying that the PA used for the signal to be transmitted to the second external electronic device according to the second communication scheme is the fourth PA, electrically connecting the third PA and the fourth PA to the second power supply circuit through the switch; as well as Based on the control message, based on identifying that the PA used for the signal to be transmitted to the second external electronic device according to the second communication scheme is the second PA, electrically connecting the third PA and the fourth PA to the second power supply circuit through the switch is avoided.

13. An electronic device according to any one of the preceding claims, in, The FEM further includes a fifth FEM including a fifth PA connected to the first path and the second path through the switch, and The switch is controlled to connect both the first power supply circuit and the second power supply circuit to the fifth PA so as to transmit a signal using the fifth PA operating based on the first voltage and the second voltage.

14. A front end module (FEM), comprising: substrate; a power amplifier (PA), disposed on the substrate and configured to set a transmission power of a signal; a first terminal configured to be connected to a first power supply circuit outside the FEM; a second terminal configured to be connected to a second power supply circuit outside the FEM; a third terminal configured to be connected to another PA outside the FEM; a switch disposed on the substrate and configured to provide a first connection between the first terminal and the PA in the FEM or to provide a second connection between the second terminal and the PA in the FEM; and wherein a third pad is connected to a node between the switch and the PA, so that while electric power from the first power supply circuit is supplied to the PA in the FEM through the first connection formed by using the switch, electric power from the first power supply circuit is supplied to the other PA, and while electric power from the second power supply circuit is supplied to the PA in the FEM through the second connection formed by using the switch, electric power from the second power supply circuit is supplied to the other PA.

15. The FEM of claim 14, wherein: The switch is further configured to provide a third connection to connect both the first terminal and the second terminal to the third terminal.

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