ADB module and manufacturing method thereof

Abstract

The invention discloses an ADB module and a manufacturing method thereof. The ADB module comprises an integrated LED chip, a circuit board and a radiator. The integrated LED chip and the circuit board are both connected with the radiator; the circuit board is provided with a window, and the integrated LED chip is arranged in the window and connected with the circuit board. According to the ADB module, the integrated LED chip is directly connected with the radiator, the heat dissipation effect can be greatly enhanced, the circuit board does not need to have the heat dissipation function, other low-heat-conduction materials can be selected to replace a metal substrate circuit board, and the overall cost of the whole ADB module can be reduced.

Description

Technical Field

[0001] The present invention belongs to the technical field of ADB vehicle lamps, and in particular relates to an ADB module and a manufacturing method thereof. Background Art

[0002] The ADB module of the prior art includes: an LED module, a heat sink and a high thermal conductivity circuit board. The LED module is a single chip mounted on a ceramic substrate with a circuit, and then a fluorescent sheet is mounted on the surface of the chip, and a light blocking layer is filled between the chips; the LED module is mounted on the circuit board through a high thermal conductivity adhesive layer, and connected to the circuit board through pad leads and bottom pads; the circuit board controls the LED module; the circuit board is mounted on the heat sink through a thermal conductive adhesive layer. Metal, as the substrate of the circuit board, is conductive and generally only single-sided wiring can be designed. For ADB headlights with a higher pixel level, single-sided PCB wiring is difficult to meet the design requirements. At the same time, high thermal conductivity metal substrates with strong heat dissipation are often expensive. If a multi-layer metal substrate with double-sided wiring is used, the cost will be even more expensive. Summary of the invention

[0003] In order to overcome the above technical defects, the present invention provides an ADB module and a manufacturing method thereof, which can reduce costs.

[0004] In order to solve the above problems, the present invention is implemented according to the following technical solutions:

[0005] An ADB module, comprising: an integrated LED chip, a circuit board and a heat sink

[0006] The integrated LED chip and the circuit board are both connected to the heat sink;

[0007] The circuit board is provided with a window, and the integrated LED chip is arranged in the window and connected to the circuit board.

[0008] As a further improvement of the present invention, the integrated LED chip is connected to the heat sink via a first heat-conducting connection layer.

[0009] As a further improvement of the present invention, the circuit board is connected to the heat sink via a second heat-conducting connection layer.

[0010] As a further improvement of the present invention, the integrated LED chip includes a plurality of light-emitting units arranged in an array;

[0011] A fluorescent sheet is fixed on the surface of the light-emitting unit via an adhesive layer.

[0012] As a further improvement of the present invention, the size of the fluorescent sheet is smaller than the light-emitting unit, so that the positive electrode pad of the light-emitting unit is exposed on the fluorescent sheet;

[0013] Negative electrode pads are arranged on two sides of the integrated LED chip.

[0014] As a further improvement of the present invention, the circuit board is provided with a positive electrode pad and a negative electrode pad;

[0015] The positive electrode pad of the circuit board is connected to the positive electrode pad of the integrated LED chip through a lead wire;

[0016] The cathode pad of the circuit board is connected to the cathode pad of the integrated LED chip via a lead wire.

[0017] As a further improvement of the present invention, the lead is covered with a lead protection layer.

[0018] As a further improvement of the present invention, a light blocking layer is filled at a connection between the window and the integrated LED chip, and a light blocking layer is filled between adjacent light-emitting units.

[0019] As a further improvement of the present invention, the height of the light blocking layer is smaller than the height of the upper surface of the fluorescent sheet, and the height of the upper surface of the circuit board is larger than the height of the upper surface of the fluorescent sheet.

[0020] Compared with the prior art, the present invention has the following beneficial effects: the integrated LED chip is directly connected to the heat sink, which can greatly enhance the heat dissipation effect. The circuit board does not need to bear the heat dissipation function. Other materials with low thermal conductivity can be used to replace the metal substrate circuit board, which can reduce the overall cost of the entire ADB module.

[0021] In addition, the present invention provides a method for manufacturing an ADB module, which is used to manufacture the above-mentioned ADB module, comprising the steps of:

[0022] Mounting the circuit board on the heat sink through a first heat-conducting connection layer, and mounting the integrated LED chip on the heat sink through a second heat-conducting connection layer;

[0023] Connecting the positive electrode pad of the circuit board to the positive electrode pad of the integrated LED chip and connecting the negative electrode pad of the circuit board to the negative electrode pad of the integrated LED chip by using leads;

[0024] Filling a light blocking layer between the connection between the window and the integrated LED chip and between adjacent light-emitting units;

[0025] A lead protection layer is covered over the leads.

[0026] Compared with the prior art, the present invention has the following beneficial effects: the integrated LED chip is directly mounted on the heat sink, which can greatly enhance the heat dissipation effect. The circuit board does not need to bear the heat dissipation function. Other materials with low thermal conductivity can be used to replace the metal substrate circuit board, which can reduce the overall cost of the entire ADB module. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The specific embodiments of the present invention are further described in detail below in conjunction with the accompanying drawings, wherein:

[0028] Figure 1 This is a schematic diagram of the overall structure of the ADB module described in Example 1;

[0029] Figure 2 Another schematic diagram of the overall structure of the ADB module described in Example 1;

[0030] Figure 3 This is a schematic diagram of the structure of the integrated LED chip described in Example 1;

[0031] Figure 4 is an equivalent circuit diagram of the integrated LED chip described in Example 1;

[0032] Figure 5 This is a schematic diagram of the structure of the circuit board described in Example 1;

[0033] Figure 6 is a flow chart of the production method described in Example 2;

[0034] Figure 7 This is a diagram of the manufacturing process of the integrated LED chip described in Example 2;

[0035] Figure 8 This is a schematic diagram of the structure of the integrated LED chip described in Example 2;

[0036] Fig. 9 This is a schematic diagram of the structure of the circuit board described in Example 2;

[0037] Fig.10 The ADB module manufacturing method process described in Example 2 Figure 1 ;

[0038] Fig.11 The ADB module manufacturing method process described in Example 2 Figure 2 ;

[0039] Fig.12 The ADB module is obtained by the manufacturing method described in Example 2.

[0040] Explanation of the reference numerals: 1. integrated LED chip; 11. light-emitting unit; 111. passivation layer; 112. transparent conductive layer; 113. positive electrode emission layer; 114. multi-quantum well layer; 12. adhesive layer; 13. phosphor sheet; 14. positive electrode pad; 15. negative electrode pad; 16. substrate; 17. negative electrode emission layer; 2. circuit board; 21. window; 22. positive electrode pad; 23. negative electrode pad; 3. heat sink; 4. first thermal conductive connection layer; 5. second thermal conductive connection layer; 6. lead; 7. lead protection layer; 8. light blocking layer. DETAILED DESCRIPTION

[0041] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0042] Example 1

[0043] This embodiment provides an ADB module, such as Figure 1 and Figure 2 As shown, it includes: an integrated LED chip 1, a circuit board 2 and a heat sink 3; the integrated LED chip 1 and the circuit board 2 are both connected to the heat sink 3; the circuit board 2 is provided with a window 21, and the integrated LED chip 1 is arranged in the window 21 and connected to the circuit board 2.

[0044] The substrate of the circuit board 2 is FR4, and the heat sink 3 has heat dissipation fins, which are made of aluminum, copper or other high thermal conductivity metals.

[0045] Furthermore, the integrated LED chip 1 is connected to the heat sink 3 via the first thermal conductive connection layer 4, and the first adhesive layer 12 is a high thermal conductive silicone.

[0046] Furthermore, the circuit board 2 is connected to the heat sink 3 through the second thermal conductive connection layer 5, the second adhesive layer 12 is a high thermal conductive silicone, the circuit board 2 is provided with a positioning hole, and the heat sink 3 is provided with a positioning column, and the positions of the positioning holes and the positioning columns are arranged correspondingly to facilitate positioning and installation.

[0047] like Figure 3 As shown, the integrated LED chip 1 includes a plurality of light-emitting units 11 arranged in an array; a fluorescent sheet 13 is fixed to the surface of the light-emitting unit 11 through an adhesive layer 12, and the adhesive layer 12 is transparent silicone. The fluorescent sheet 13 is one or more of white, red, green, and transparent fluorescent sheets 13. The substrate of the fluorescent sheet 13 is glass or ceramic, and the height of the upper surface of the circuit board 2 is greater than the height of the upper surface of the fluorescent sheet 13.

[0048] Specifically, an adhesive layer 12 is coated on the surface of each light-emitting unit 11, and then the fluorescent sheet 13 is aligned and mounted on the surface of the light-emitting unit 11. The integrated LED chip 1 comprises, from bottom to top, a bonded substrate 16 and a negative electrode emission layer 17, the negative electrode pad 15 and the light-emitting unit 11 are both located on the negative electrode emission layer 17, and the light-emitting unit 11 comprises, from top to bottom, a fluorescent sheet 13, an adhesive layer 12, a passivation layer 111, a transparent conductive layer 112, a positive electrode emission layer 113, and a multi-quantum well layer 114.

[0049] Preferably, the integrated LED chip 1 of this embodiment includes 12 light-emitting units 11, which are arranged in two rows, each row having 6 light-emitting units 11, and each IC controls 6 light-emitting units 11 in one row. Each output pin of the IC is connected to the positive electrode of a light-emitting unit 11. The integrated LED chip 1 has a common cathode. Each light-emitting unit 11 of the integrated LED chip 1 can be independently controlled, such as Figure 4 shown.

[0050] like Figure 5 As shown, the size of the fluorescent sheet 13 is smaller than the light-emitting unit 11, so that the positive electrode pad 14 of the light-emitting unit 11 is exposed on the fluorescent sheet 13, which is convenient for the subsequent bonding of the lead 6; negative electrode pads 2315 are arranged on both sides of the integrated LED chip 1.

[0051] The circuit board 2 is provided with a corresponding circuit, and the circuit is provided with a positive electrode pad 22 and a negative electrode pad 23; the positive electrode pad 22 of the circuit board 2 is connected to the positive electrode pad 14 of the integrated LED chip 1 through a lead 6; the negative electrode pad 23 of the circuit board 2 is connected to the negative electrode pad 15 of the integrated LED chip 1 through a lead 6, and the lead 6 is made of gold wire or aluminum wire, and the wire diameter is 0.9 to 5 mil.

[0052] The lead 6 is covered with a lead protection layer 6 , and the material of the lead protection layer 6 is white or black silicone.

[0053] The size of the window 21 is larger than that of the integrated LED chip 1, so that the integrated LED chip 1 is located in the window 21, and the connection between the window 21 and the integrated LED chip 1 (i.e., the gap between the window 21 and the integrated LED chip 1) is filled with a light blocking layer 8, and the light blocking layer 8 is filled between adjacent light-emitting units 11.

[0054] The height of the light blocking layer 8 is smaller than the height of the upper surface of the fluorescent sheet 13 , and the material of the light blocking layer 8 is white or black silica gel.

[0055] Example 2

[0056] This embodiment provides a method for manufacturing an ADB module, which is used to manufacture the ADB module in Embodiment 1. Figure 6 As shown, the steps include:

[0057] S1 . Mount the circuit board 2 on the heat sink 3 through the first heat-conducting connection layer 4 , and mount the integrated LED chip 1 on the heat sink 3 through the second heat-conducting connection layer 5 .

[0058] Prior to this, the integrated LED chip 1 and the circuit board 2 need to be processed first. Figure 7 , coating the adhesive layer 12 on the surface of each light-emitting unit 11, and then aligning and mounting the fluorescent sheet 13 on the surface of the light-emitting unit 11, to obtain Figure 8 ;like Fig. 9 As shown, a window 21 is opened on the circuit board 2, and at the same time, a positive electrode pad 22 and a negative electrode pad 23 are made.

[0059] S2, using the lead wire 6 to connect the positive electrode pad 22 of the circuit board 2 with the positive electrode pad 14 of the integrated LED chip 1, and the negative electrode pad 23 of the circuit board 2 with the negative electrode pad 15 of the integrated LED chip 1, as shown in FIG. Fig.10 shown.

[0060] S3, filling a light blocking layer between the connection between the window 21 and the integrated LED chip 1 and between adjacent light-emitting units 11, such as Fig.11 shown.

[0061] S4, covering the lead 6 with a lead protection layer 6, such as Fig.12 shown.

[0062] For other specific implementations of this embodiment, please refer to Embodiment 1, which will not be described in detail here.

[0063] It can be seen from Example 1 and Example 2 that the present invention has the following beneficial effects:

[0064] 1. Each light-emitting unit can realize controlled light emission with ultra-small pixel pitch;

[0065] 2. The LED chip is directly mounted on the radiator, which greatly enhances the heat dissipation effect;

[0066] 3. The circuit does not need to bear the heat dissipation, and low thermal conductivity FR4 can be used to replace the metal substrate circuit board to reduce the overall cost of the module.

[0067] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Therefore, any modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the technical solution of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. An ADB module, characterized in that: include: Integrated LED chips, circuit boards and heat sinks; The integrated LED chip and the circuit board are both connected to the heat sink; The circuit board is provided with a window, and the integrated LED chip is arranged in the window and connected to the circuit board.

2. The ADB module according to claim 1, characterized in that: The integrated LED chip is connected to the heat sink via a first heat-conducting connection layer.

3. The ADS module according to claim 1, characterized in that: The circuit board is connected to the heat sink via a second heat-conducting connection layer.

4. The ADS module according to any one of claims 1 to 3, characterized in that: The integrated LED chip includes a plurality of light-emitting units arranged in an array; A fluorescent sheet is fixed on the surface of the light-emitting unit via an adhesive layer.

5. The ADS module according to claim 4, characterized in that: The size of the fluorescent sheet is smaller than that of the light-emitting unit, so that the positive electrode pad of the light-emitting unit is exposed on the fluorescent sheet; Negative electrode pads are arranged on two sides of the integrated LED chip.

6. The ADB module according to claim 5, characterized in that: The circuit board is provided with a positive electrode pad and a negative electrode pad; The positive electrode pad of the circuit board is connected to the positive electrode pad of the integrated LED chip through a lead wire; The cathode pad of the circuit board is connected to the cathode pad of the integrated LED chip via a lead wire.

7. The ADB module according to claim 6, characterized in that: The leads are covered with a lead protection layer.

8. The ADB module according to claim 4, characterized in that: The connection between the window and the integrated LED chip is filled with a light blocking layer, and the light blocking layer is filled between adjacent light-emitting units.

9. The ADB module according to claim 8, characterized in that: The height of the light blocking layer is smaller than the height of the upper surface of the fluorescent sheet, and the height of the upper surface of the circuit board is larger than the height of the upper surface of the fluorescent sheet.

10. A method for manufacturing an ADB module, characterized in that: Used to manufacture the ADB module according to any one of claims 1 to 9, comprising the steps of: Mounting the circuit board on the heat sink through a first heat-conducting connection layer, and mounting the integrated LED chip on the heat sink through a second heat-conducting connection layer; Connecting the positive electrode pad of the circuit board to the positive electrode pad of the integrated LED chip and connecting the negative electrode pad of the circuit board to the negative electrode pad of the integrated LED chip by using leads; A light blocking layer is filled at the connection between the window and the integrated LED chip and between adjacent light-emitting units; and a lead protection layer is covered above the lead.

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