GIS equipment mechanical connection structure defect detection method and device, electronic equipment and storage medium

By obtaining the stress distribution maps under different tightening degrees of mechanical connection structure of GIS equipment, combining steady-state and transient stress data, the problem of single data acquisition of existing detection methods is solved, which improves the comprehensiveness and accuracy of the detection and enhances the reliability of the results.

CN119555355APending Publication Date: 2025-03-04GUANGDONG POWER GRID CO LTD +1
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Patent Information

Application Number
CN202411704584.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-26
Publication Date
2025-03-04

AI Technical Summary

Technical Problem

The existing GIS equipment mechanical connection structure defect detection methods cannot fully reflect the actual stress of the equipment due to the single data acquisition, resulting in low credibility of the detection results, limiting the effectiveness of fault detection and maintenance.

Method used

By obtaining the first and second stress distribution diagrams of the mechanical connection structure of the GIS equipment under different tightening degrees, combining the steady-state and transient stress data, we judge whether it meets the standard stress distribution diagram to determine whether there are defects in the mechanical connection structure.

Benefits of technology

It improves the comprehensiveness and accuracy of defect detection of mechanical connection structures, enhances the reliability and adaptability of the detection results, and can more accurately reflect the stress characteristics of the equipment under various operating conditions.

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Abstract

The invention discloses a GIS equipment mechanical connection structure defect detection method and device, electronic equipment and a storage medium. The method comprises the following steps: acquiring a first stress distribution diagram and a second stress distribution diagram of a GIS equipment mechanical connection structure under different fastening degrees; judging whether each first stress distribution diagram and each second stress distribution diagram meet a standard or not according to a standard stress distribution diagram; if all the first stress distribution diagrams and all the second stress distribution diagrams meet the standard, it is judged that the mechanical connection structure does not have defects; otherwise, judging that the mechanical connection structure has defects; wherein the first stress distribution diagram is generated according to stress data of each strain gauge after the electromagnetic induction coil applies induction current to the GIS equipment; the second stress distribution diagram is generated according to stress data of the strain gauges after the gravity ball falls from the preset height to knock the GIS shell; according to the invention, the reliability of the defect detection result of the mechanical connection structure can be improved.
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Description

Technical Field

[0001] The present invention relates to the technical field of electrical detection equipment, and in particular to a method, device, electronic equipment and storage medium for detecting defects in the mechanical connection structure of GIS equipment. Background Art

[0002] Gas Insulated Switchgear (GIS) is an indispensable and important equipment in the power system. It uses gas insulation to replace traditional air-insulated equipment. It has the advantages of small footprint, reliable operation, and simple maintenance. It is widely used in high voltage, ultra-high voltage and even ultra-high voltage fields. SF6 gas is used as the insulating medium inside the GIS, and all functional components are enclosed in a metal casing. Although this fully enclosed design improves the safety and reliability of the equipment, it also increases the complexity of fault detection. Especially in actual operation, GIS equipment is often subjected to large currents and mechanical vibrations, which may cause tiny defects in its internal mechanical connection structure. If these defects are not discovered and handled in time, they may not only cause the degradation of the internal electrical performance of the GIS equipment, but may also cause equipment operation failures, thereby endangering the stability and safety of the power grid.

[0003] At present, in the detection methods for mechanical connection defects inside GIS equipment, due to the single data collection, the status of the mechanical connection can usually only be evaluated from one aspect, resulting in the inability to fully reflect the actual stress conditions of the equipment. This inaccuracy directly affects the credibility of the analysis results, thereby limiting the effectiveness of GIS equipment fault detection and maintenance. Summary of the invention

[0004] The embodiment of the present invention provides a method, device, electronic device and storage medium for detecting defects in the mechanical connection structure of GIS equipment. By implementing the present invention, it is possible to detect whether there are defects in the mechanical connection structure of GIS equipment and improve the reliability of the detection results of mechanical connection structure defects.

[0005] An embodiment of the present invention provides a method for detecting defects in a mechanical connection structure of a GIS device, comprising:

[0006] Obtaining a first stress distribution diagram and a second stress distribution diagram of a mechanical connection structure of a GIS device at different tightening degrees; wherein a plurality of strain gauges are arranged on the surface of the mechanical connection structure of the GIS device;

[0007] According to the preset standard stress distribution diagram, it is determined whether each first stress distribution diagram and each second stress distribution diagram meet the standard; if all the first stress distribution diagrams and all the second stress distribution diagrams meet the standard, it is determined that the mechanical connection structure has no defects; otherwise, it is determined that the mechanical connection structure has defects.

[0008] The generation of the first stress distribution map includes: collecting stress data of each strain gauge after the electromagnetic induction coil applies an induced current to the GIS equipment to obtain steady-state stress data; and generating the first stress distribution map according to the steady-state stress data.

[0009] The generation of the second stress distribution diagram includes: collecting stress data of each strain gauge after a gravity ball falls from a preset height and hits the GIS shell to obtain transient stress data; and generating the second stress distribution diagram according to the transient stress data.

[0010] Furthermore, the different tightening degrees include standard tightening, overtight tightening and loose tightening;

[0011] When the thread tightening torque of the mechanical connection structure is within a preset torque range, the tightening degree is standard tightening;

[0012] In the case where the thread tightening torque of the mechanical connection structure is greater than the upper limit of the preset torque range, the tightening degree is overtightening;

[0013] When the thread tightening torque of the mechanical connection structure is less than the lower limit of the preset torque range, the tightening degree is loose tightening.

[0014] Furthermore, when the electromagnetic induction coil applies an induced current to the GIS device, the corresponding applied frequency is 50 Hz, and the applied amplitude is equal to the current value of the rated current of the GIS device.

[0015] Further, generating a first stress distribution diagram according to the steady-state stress data includes:

[0016] According to the geometric characteristic parameters and material characteristic parameters of the mechanical connection structure, a model for displaying stress distribution is constructed;

[0017] According to the steady-state stress data, a first stress distribution diagram is generated by drawing on the model.

[0018] Further, generating a second stress distribution diagram according to the transient stress data includes:

[0019] According to the transient stress data, a second stress distribution diagram is generated by drawing on the model.

[0020] Based on the above method embodiment, the present invention provides a corresponding device embodiment.

[0021] An embodiment of the present invention provides a device for detecting defects in mechanical connection structures of GIS equipment, including: a stress distribution map acquisition module, a defect detection module, a first stress distribution map generation module, and a second stress distribution map generation module.

[0022] The stress distribution map acquisition module is used to obtain a first stress distribution map and a second stress distribution map of the mechanical connection structure of the GIS equipment at different tightening degrees; wherein a plurality of strain gauges are arranged on the surface of the mechanical connection structure of the GIS equipment;

[0023] The defect detection module is used to determine whether each first stress distribution map and each second stress distribution map meet the standard according to a preset standard stress distribution map; if all the first stress distribution maps and all the second stress distribution maps meet the standard, it is determined that there is no defect in the mechanical connection structure; otherwise, it is determined that there is a defect in the mechanical connection structure.

[0024] The first stress distribution diagram generating module is used to collect stress data of each strain gauge after the electromagnetic induction coil applies an induced current to the GIS equipment to obtain steady-state stress data; and generate a first stress distribution diagram according to the steady-state stress data.

[0025] The second stress distribution diagram generating module is used to collect stress data of each strain gauge after the gravity ball falls from a preset height and hits the GIS shell to obtain transient stress data; and generate a second stress distribution diagram based on the transient stress data.

[0026] Furthermore, in the device for detecting defects in the mechanical connection structure of the GIS equipment, the first stress distribution diagram generating module, the application frequency corresponding to the electromagnetic induction coil applying the induced current to the GIS equipment is 50 Hz, and the applied amplitude is equal to the current value of the rated current of the GIS equipment.

[0027] Furthermore, the detection device for mechanical connection structure defects of GIS equipment, the first stress distribution map generating module, the first stress distribution map generated according to the steady-state stress data, comprises:

[0028] According to the geometric characteristic parameters and material characteristic parameters of the mechanical connection structure, a model for displaying stress distribution is constructed;

[0029] According to the steady-state stress data, a first stress distribution diagram is generated by drawing on the model.

[0030] Based on the above method embodiment, the present invention provides a corresponding electronic device embodiment.

[0031] An embodiment of the present invention provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the method for detecting defects in the mechanical connection structure of GIS equipment as described in any one of the above-mentioned method embodiments can be implemented.

[0032] Based on the above method item embodiments, the present invention provides a corresponding storage medium item embodiment.

[0033] An embodiment of the present invention provides a storage medium having a computer program stored thereon. When the computer program is executed by a processor, the method for detecting defects in the mechanical connection structure of GIS equipment as described in any one of the above method embodiments can be implemented.

[0034] Compared with the prior art, the present invention has the following beneficial effects:

[0035] The embodiment of the present invention provides a method, device, electronic device and storage medium for detecting defects in the mechanical connection structure of GIS equipment. The method obtains the first and second stress distribution diagrams of the mechanical connection structure of the GIS equipment at different tightening degrees; judges whether each first and second stress distribution diagram meets the standard according to the standard stress distribution diagram; if all the first and second stress distribution diagrams meet the standard, it is determined that there is no defect; otherwise, it is determined that there is a defect. Among them, the first stress distribution diagram is generated by collecting the steady-state stress data of each strain gauge after the electromagnetic induction coil applies current; the second stress distribution diagram is generated by collecting the transient stress data of each strain gauge after the gravity ball hits the GIS shell.

[0036] The present invention comprehensively analyzes the three aspects of steady-state vibration, transient vibration and the tightness of the mechanical connection structure, comprehensively reflects the stress characteristics of the mechanical connection structure of GIS equipment under various working conditions, and overcomes the problem of insufficient accuracy caused by the single data collection of traditional detection methods. By combining steady-state and transient stress data, the stress distribution characteristics of the mechanical connection under static and dynamic loads are fully reflected, thereby improving the comprehensiveness and accuracy of defect detection. In addition, stress calculations under different tightness levels simulate various stress states of the mechanical connection structure, enhancing the reliability and adaptability of the detection results. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a flow chart of a method for detecting defects in mechanical connection structures of GIS equipment provided in one embodiment of the present invention.

[0038] Figure 2 It is a structural schematic diagram of a device for detecting structural defects of mechanical connections of GIS equipment provided by one embodiment of the present invention. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] like Figure 1As shown, an embodiment of the present invention provides a method for detecting defects in mechanical connection structures of GIS equipment, which at least includes the following steps:

[0041] Step S1, obtaining a first stress distribution diagram and a second stress distribution diagram of a mechanical connection structure of a GIS device at different tightening degrees; wherein a plurality of strain gauges are arranged on the surface of the mechanical connection structure of the GIS device;

[0042] It should be explained here that the purpose of obtaining the first stress distribution diagram and the second stress distribution diagram of the mechanical connection structure of the GIS equipment at different tightening degrees is to gain a deeper understanding of the stress conditions at the equipment connection. The tightening degrees here include standard tightening, overtightening, and loose tightening;

[0043] When the thread tightening torque of the mechanical connection structure is within a preset torque range, the tightening degree is standard tightening;

[0044] In the case where the thread tightening torque of the mechanical connection structure is greater than the upper limit of the preset torque range, the tightening degree is overtightening;

[0045] When the thread tightening torque of the mechanical connection structure is less than the lower limit of the preset torque range, the tightening degree is loose tightening.

[0046] Among them, the preset torque range is the torque range recommended by the manufacturer of the mechanical connection structure. Assuming that the torque range recommended by the manufacturer is 50-70Nm, when the thread tightening torque of the mechanical connection structure is within 50-70Nm, the tightening degree is standard tightening; when the thread tightening torque of the mechanical connection structure is greater than 70Nm, the tightening degree is overtightening; when the thread tightening torque of the mechanical connection structure is less than 50Nm, the tightening degree is loose tightening.

[0047] In a preferred embodiment, the generation of the first stress distribution map includes: collecting stress data of each strain gauge after the electromagnetic induction coil applies an induced current to the GIS device to obtain steady-state stress data; generating the first stress distribution map according to the steady-state stress data;

[0048] First, the electromagnetic induction coil applies an induced current to the GIS equipment. During this process, the electromagnetic induction coil generates a changing magnetic field through an alternating current, thereby inducing a current on the conductor of the GIS equipment. Specifically, the frequency of the induced current is 50Hz, which is a standard AC frequency commonly used in power systems. The amplitude of the applied current is equal to the rated current value of the GIS equipment, ensuring that the induced current has the same magnitude and characteristics as the working current of the equipment, thereby simulating the current condition of the equipment under normal operating conditions. In this process, the applied current not only simulates the electrical load that the equipment may experience in actual operation, but also causes steady-state vibration of the mechanical system through electromagnetic induction. Steady-state vibration means that under external excitation, the system enters a stable vibration state, and the vibration amplitude no longer increases with time. This steady-state vibration usually occurs near the resonant frequency of the structure, so studying these vibrations can reveal the resonance phenomenon that may occur in the equipment and help analyze the safety of the equipment under normal and extreme working conditions. By measuring and analyzing the characteristics of steady-state vibration, such as vibration frequency, amplitude and distribution, key data can be provided for the design optimization of GIS equipment to avoid equipment damage or failure caused by resonance or other vibration effects during operation. This experiment helps to evaluate the mechanical response of the device under the action of electric current and further improve the stability and reliability of the device.

[0049] Secondly, after the electromagnetic induction coil applies induced current to the GIS equipment, the stress changes of the equipment at different positions are measured in real time through each strain gauge to obtain steady-state stress data. This process usually requires the installation of multiple strain gauges at key parts of the equipment to ensure that the stress distribution of the equipment under the action of the induced current can be fully and accurately captured. The action of the induced current will cause electromagnetic force inside the equipment, which will cause a certain deformation of the structure of the equipment, and then generate measurable strain signals on different strain gauges. By converting these strain signals into stress data, the stress condition of the equipment under specific current conditions can be reflected. Among them, the strain gauges arranged on the mechanical connection structure include at least three positions: upper, middle and lower. The selection of the strain gauge position is based on the geometric characteristics of the mechanical connection structure, such as the starting point of the thread, holes, cuts, cross-sectional transition areas and corners and other structural discontinuities, to ensure that they are arranged at key stress points on the load path.

[0050] The first stress distribution diagram needs to be generated according to the steady-state stress data based on a finite element calculation model that can be used to display stress distribution, wherein the finite element calculation model is constructed according to geometric characteristic parameters and material characteristic parameters of the mechanical connection structure.

[0051] Specifically, according to the geometric characteristic parameters (such as size, shape, connection part, etc.) and material characteristic parameters (such as elastic modulus, Poisson's ratio, density, etc.) of the mechanical connection structure, the geometric model of the mechanical connection structure is first constructed. The geometric model is the basis of finite element calculation. It truly reproduces the shape and size of the mechanical connection structure and provides information on spatial distribution and geometric constraints for subsequent analysis.

[0052] After the geometric model is constructed, the finite element method is used to discretize it, that is, the continuous geometric model is divided into multiple small finite units. After discretization, each unit is assigned corresponding physical properties (such as mechanical properties of materials, thermal conductivity properties, etc.), and the boundary conditions and loading methods of the model are set according to the actual working environment, such as the location of the constraint point, the magnitude and direction of the force, the distribution of the heat source, etc. Through the above operations, a finite element calculation model containing geometry, physical properties and working conditions is generated, providing a complete data basis for subsequent analysis.

[0053] Next, based on the steady-state stress data obtained from the experiment or simulation, these data are combined with the finite element calculation model and plotted on the model. Through data mapping, the steady-state stress data is matched to each node or unit of the finite element model, and then a stress distribution map is generated on the model surface.

[0054] The stress distribution map is intuitively presented in the form of a color gradient, from high stress (usually represented by red) to low stress (usually represented by blue), clearly revealing the stress intensity in different parts.

[0055] In a preferred embodiment, the generation of the second stress distribution map includes: collecting stress data of each strain gauge after a gravity ball falls from a preset height and hits the GIS shell to obtain transient stress data; and generating the second stress distribution map according to the transient stress data.

[0056] Preferably, a gravity ball is freely dropped from a preset height to hit the housing of the GIS device with a certain impact force, thereby applying transient vibration to the GIS device. The free fall of the gravity ball simulates the transient vibration response of the device to sudden loads or mechanical shocks, and can effectively reproduce the shock and vibration environment that the device may encounter under actual working conditions, such as earthquakes, mechanical shocks or other high-frequency transient excitations.

[0057] When the gravity ball hits the GIS shell, the surface and interior of the GIS equipment will vibrate violently for a short time due to the impact force. This vibration triggers complex stress wave propagation in the equipment structure, showing transient stress distribution characteristics. The strain gauge records the stress change data at the moment of impact in real time, and through high-sensitivity measurement, it fully reflects the dynamic stress distribution of the equipment under transient vibration state.

[0058] It should be noted that, in a preferred embodiment, when measuring transient impact stress by free-impacting of a gravity ball, three measurements are required, and then the average value of the multiple measurements is calculated as the final transient stress data. In each measurement, the gravity ball should be dropped from the same height, and the mechanical connection structure state between each measurement should be kept unchanged to reduce experimental errors.

[0059] According to the transient stress data, it is drawn on the finite element calculation model to generate a second stress distribution diagram.

[0060] Step S2: judging whether each first stress distribution map and each second stress distribution map meet the standard according to the preset standard stress distribution map; if all the first stress distribution maps and all the second stress distribution maps meet the standard, it is judged that the mechanical connection structure has no defects; otherwise, it is judged that the mechanical connection structure has defects;

[0061] It should be noted that, according to the preset standard stress distribution diagram, each first stress distribution diagram and each second stress distribution diagram obtained in the experiment are compared and analyzed to determine whether they meet the standard. The standard stress distribution diagram is a reference diagram generated based on design specifications, material properties and structural optimization design, which represents the stress distribution characteristics of the mechanical connection structure under ideal conditions, including the range of stress magnitude, the location of the stress concentration area and the distribution law.

[0062] Specifically, the first stress distribution diagram generated by the experiment is compared point by point or area by area with the standard diagram to check whether the stress of the equipment under steady-state conditions is within the allowable safety range, and observe whether the stress distribution law is consistent with the standard. For example, if a stress concentration area that deviates significantly from the standard appears in the first stress distribution diagram, it may indicate that the mechanical connection structure has potential design defects or material problems under static load.

[0063] Subsequently, the same comparison is performed on each second stress distribution diagram to check whether the stress distribution of the equipment under transient vibration conditions meets the standard. The analysis of the transient stress distribution diagram focuses on whether the high stress peak exceeds the design limit and whether the propagation path and concentration point of the stress wave caused by the impact load are consistent with the standard. Figure 1 If transient stresses exceed the allowable range or abnormal stress concentration areas appear, it may indicate that the structure is at risk of failure or has weak links under dynamic loads.

[0064] Through comparative analysis, if all the first stress distribution diagrams and the second stress distribution diagrams meet the standards, it means that the performance of the mechanical connection structure under static and dynamic load conditions meets the design requirements, and it can be determined that there are no defects and it meets the use specifications and safety requirements. On the contrary, if any of the first stress distribution diagrams or the second stress distribution diagrams deviate from the standards, such as excessive stress concentration or abnormal distribution patterns, it is determined that the mechanical connection structure has defects. This defect may be caused by insufficient uniformity of the material, processing errors in the connection parts, or the structural design does not fully consider the stress response under complex working conditions.

[0065] In addition, by further analyzing the distribution map that deviates from the standard, the specific defect area can be located, and the potential cause of the failure can be inferred by combining the nature of the stress anomaly. For example, stress concentration may indicate that the stress concentration point in the design has not been optimized, while the abnormal stress distribution may reflect the existence of material defects or local wear in the structure. Such diagnostic information provides an important basis for subsequent structural optimization, material improvement and maintenance decisions.

[0066] like Figure 2 As shown, an embodiment of the present invention provides a device for detecting defects in mechanical connection structures of GIS equipment, including: a stress distribution map acquisition module, a defect detection module, a first stress distribution map generation module and a second stress distribution map generation module.

[0067] The stress distribution map acquisition module is used to obtain a first stress distribution map and a second stress distribution map of the mechanical connection structure of the GIS equipment at different tightening degrees; wherein, a plurality of strain gauges are arranged on the surface of the mechanical connection structure of the GIS equipment.

[0068] The defect detection module is used to determine whether each first stress distribution map and each second stress distribution map meet the standard according to a preset standard stress distribution map; if all the first stress distribution maps and all the second stress distribution maps meet the standard, it is determined that there is no defect in the mechanical connection structure; otherwise, it is determined that there is a defect in the mechanical connection structure.

[0069] The first stress distribution diagram generating module is used to collect stress data of each strain gauge after the electromagnetic induction coil applies an induced current to the GIS equipment to obtain steady-state stress data; and generate a first stress distribution diagram according to the steady-state stress data.

[0070] The second stress distribution diagram generating module is used to collect stress data of each strain gauge after the gravity ball falls from a preset height and hits the GIS shell to obtain transient stress data; and generate a second stress distribution diagram based on the transient stress data.

[0071] In a preferred embodiment, the device for detecting defects in the mechanical connection structure of the GIS equipment, the first stress distribution diagram generating module, the application frequency corresponding to the electromagnetic induction coil applying the induced current to the GIS equipment is 50 Hz, and the applied amplitude is equal to the current value of the rated current of the GIS equipment.

[0072] In an optional embodiment, the detection device for mechanical connection structure defects of GIS equipment, the first stress distribution map generating module, the generating of the first stress distribution map according to the steady-state stress data, comprises:

[0073] According to the geometric characteristic parameters and material characteristic parameters of the mechanical connection structure, a model for displaying stress distribution is constructed;

[0074] According to the steady-state stress data, a first stress distribution diagram is generated by drawing on the model.

[0075] It should be noted that the embodiments of the device described above correspond to the above embodiments of the present invention, and can implement any of the methods described above in the present invention. In addition, the embodiments of the above-mentioned device are merely schematic, wherein the modules described as separate components may or may not be physically separated, and the components displayed as modules may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. In addition, in the drawings of the device embodiments provided by the present invention, the connection relationship between the modules indicates that there is a communication connection between them, which can be specifically implemented as one or more communication buses or signal lines. A person of ordinary skill in the art can understand and implement it without paying any creative work.

[0076] Based on the above method embodiment of the present invention, a corresponding electronic device embodiment is provided.

[0077] An embodiment of the present invention provides an electronic device, comprising a processor, a memory, and a computer program stored in the memory and configured to be executed by the processor. When the processor executes the computer program, the method for detecting defects in the mechanical connection structure of GIS equipment described in any one of the present invention is implemented, or, when the processor executes the computer program, the functions of the modules in the above-mentioned device embodiments are implemented.

[0078] Exemplarily, the computer program may be divided into one or more modules, which are stored in the memory and executed by the processor to implement the present invention. The one or more modules may be a series of computer program instruction segments capable of implementing specific functions, which are used to describe the execution process of the computer program in the terminal device.

[0079] The terminal device may be a computing device such as a desktop computer, a notebook, a PDA, a cloud server, etc. The terminal device may include, but is not limited to, a processor and a memory.

[0080] The processor may be a central processing unit (CPU), other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or any conventional processor, etc. The processor is the control center of the terminal device, and uses various interfaces and lines to connect various parts of the entire terminal device.

[0081] The memory can be used to store the computer program and / or module, and the processor realizes various functions of the terminal device by running or executing the computer program and / or module stored in the memory, and calling the data stored in the memory. The memory can mainly include a program storage area and a data storage area, wherein the program storage area can store an operating system, at least one application required for a function, etc.; the data storage area can store data created according to the use of the mobile phone, etc. In addition, the memory can include a high-speed random access memory, and can also include a non-volatile memory, such as a hard disk, a memory, a plug-in hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (SecureDigital, SD) card, a flash card (Flash Card), at least one disk storage device, a flash memory device, or other volatile solid-state storage devices.

[0082] Based on the above method embodiment, the present invention provides a storage medium embodiment;

[0083] Another embodiment of the present invention provides a storage medium, which includes a stored computer program, wherein when the computer program is running, the device where the storage medium is located is controlled to execute the method for detecting mechanical connection structure defects of any one of the above-mentioned GIS devices of the present invention.

[0084] The storage medium is a computer-readable storage medium, and the computer program includes computer program code, which may be in source code form, object code form, executable file or some intermediate form, etc. The computer-readable medium may include: any entity or device capable of carrying the computer program code, recording medium, USB flash drive, mobile hard disk, magnetic disk, optical disk, computer memory, read-only memory (ROM), random access memory (RAM), electric carrier signal, telecommunication signal and software distribution medium, etc. It should be noted that the content contained in the computer-readable medium may be appropriately increased or decreased according to the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, computer-readable media do not include electric carrier signals and telecommunication signals.

[0085] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples, unless they are contradictory.

[0086] The above is a preferred embodiment of the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A method for detecting defects in mechanical connection structures of GIS equipment, characterized in that: A plurality of strain gauges are arranged on the surface of the mechanical connection structure of the GIS equipment; The detection method comprises: Obtain a first stress distribution diagram and a second stress distribution diagram of the mechanical connection structure of the GIS equipment at different tightening degrees; According to a preset standard stress distribution diagram, judging whether each first stress distribution diagram and each second stress distribution diagram meet the standard; if all the first stress distribution diagrams and all the second stress distribution diagrams meet the standard, judging that the mechanical connection structure has no defects; otherwise, judging that the mechanical connection structure has defects; The generation of the first stress distribution map includes: collecting stress data of each strain gauge after the electromagnetic induction coil applies an induced current to the GIS equipment to obtain steady-state stress data; generating the first stress distribution map according to the steady-state stress data; The generation of the second stress distribution diagram includes: collecting stress data of each strain gauge after a gravity ball falls from a preset height and hits the GIS shell to obtain transient stress data; and generating the second stress distribution diagram according to the transient stress data.

2. The method for detecting defects in mechanical connection structures of GIS equipment according to claim 1, characterized in that: The different tightening degrees include standard tightening, overtightening and loose tightening; When the thread tightening torque of the mechanical connection structure is within a preset torque range, the tightening degree is standard tightening; In the case where the thread tightening torque of the mechanical connection structure is greater than the upper limit of the preset torque range, the tightening degree is overtightening; When the thread tightening torque of the mechanical connection structure is less than the lower limit of the preset torque range, the tightening degree is loose tightening.

3. The method for detecting defects in mechanical connection structures of GIS equipment according to claim 1, characterized in that: When the electromagnetic induction coil applies induced current to the GIS equipment, the corresponding applied frequency is 50 Hz, and the applied amplitude is equal to the current value of the rated current of the GIS equipment.

4. The method for detecting defects in mechanical connection structures of GIS equipment according to claim 1, characterized in that: The step of generating a first stress distribution diagram according to the steady-state stress data comprises: According to the geometric characteristic parameters and material characteristic parameters of the mechanical connection structure, a model for displaying stress distribution is constructed; According to the steady-state stress data, a first stress distribution diagram is generated by drawing on the model.

5. The method for detecting defects in mechanical connection structures of GIS equipment according to claim 4, characterized in that: The step of generating a second stress distribution diagram according to the transient stress data comprises: According to the transient stress data, a second stress distribution diagram is generated by drawing on the model.

6. A device for detecting defects in mechanical connection structures of GIS equipment, characterized in that: include: A stress distribution map acquisition module, a defect detection module, a first stress distribution map generation module and a second stress distribution map generation module; The stress distribution map acquisition module is used to obtain a first stress distribution map and a second stress distribution map of the mechanical connection structure of the GIS equipment at different tightening degrees; wherein a plurality of strain gauges are arranged on the surface of the mechanical connection structure of the GIS equipment; The defect detection module is used to determine whether each first stress distribution map and each second stress distribution map meet the standard according to a preset standard stress distribution map; if all the first stress distribution maps and all the second stress distribution maps meet the standard, it is determined that the mechanical connection structure has no defects; otherwise, it is determined that the mechanical connection structure has defects; The first stress distribution diagram generating module is used to collect stress data of each strain gauge after the electromagnetic induction coil applies an induced current to the GIS equipment to obtain steady-state stress data; and generate a first stress distribution diagram according to the steady-state stress data; The second stress distribution diagram generating module is used to collect stress data of each strain gauge after the gravity ball falls from a preset height and hits the GIS shell to obtain transient stress data; and generate a second stress distribution diagram based on the transient stress data.

7. The device for detecting defects in mechanical connection structures of GIS equipment according to claim 6, characterized in that: In the first stress distribution diagram generating module, when the electromagnetic induction coil applies an induced current to the GIS device, the applied frequency corresponding to the induced current is 50 Hz, and the applied amplitude is equal to the current value of the rated current of the GIS device.

8. The device for detecting mechanical connection structure defects of GIS equipment according to claim 6, characterized in that: A first stress distribution map generating module, wherein the first stress distribution map is generated according to the steady-state stress data, comprises: According to the geometric characteristic parameters and material characteristic parameters of the mechanical connection structure, a model for displaying stress distribution is constructed; According to the steady-state stress data, a first stress distribution diagram is generated by drawing on the model.

9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein: When the processor executes the computer program, it can implement the method for detecting defects in the mechanical connection structure of GIS equipment as described in any one of claims 1 to 5.

10. A storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, it can implement the method for detecting defects in the mechanical connection structure of GIS equipment as described in any one of claims 1 to 5.