Cooling liquid flow regulation and control device for semiconductor temperature control equipment

Abstract

The invention discloses a cooling liquid flow regulation and control device for semiconductor temperature control equipment, and belongs to the technical field of semiconductor manufacturing, the cooling liquid flow regulation and control device comprises a fixed seat, one end of the fixed seat is provided with precise liquid regulation equipment, and the other end of the fixed seat is provided with semiconductor manufacturing equipment; a flow regulation and control mechanism used in cooperation with semiconductor manufacturing equipment is installed at a liquid outlet in the precise liquid regulation equipment, cooling liquid can be cooled by arranging the precise liquid regulation equipment, it is ensured that the precise liquid regulation equipment works within a proper temperature range, and the refrigeration technology is efficient, saves energy and improves the refrigeration efficiency. The precise liquid adjusting device can accurately adjust the temperature of the cooling liquid, can accurately control the temperature of the cooling liquid, and can form a closed-loop reciprocating circulation system between the precise liquid adjusting device and the semiconductor manufacturing device in cooperation with the designed flow adjusting and controlling mechanism, so that heat generated by the semiconductor manufacturing device in the production process is effectively taken away through the circulation, and the production efficiency is improved. And the normal operation temperature of the equipment is maintained.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor manufacturing, and in particular to a cooling liquid flow control device for semiconductor temperature control equipment. Background Art

[0002] Semiconductor manufacturing begins with silica sand, which is heated to separate carbon monoxide and silicon to obtain high-purity silicon materials. These materials are made into wafers as the basis for manufacturing. The semiconductor manufacturing process goes through multiple steps such as wafer oxidation, photolithography, etching, thin film deposition, interconnection, testing and packaging. Each step requires precise control to ensure the quality and performance of the final product. Therefore, semiconductors are processed by semiconductor manufacturing equipment during the manufacturing process, and temperature changes will occur during the processing. Existing semiconductor manufacturing equipment will add temperature control devices when in use, and cool down the equipment by circulating coolant in the pipes of the temperature control device. However, due to the lack of precise temperature control and flow regulation control functions during the flow of the coolant, the temperature and flow of the coolant cannot be controlled. This not only increases the production cost, but also reduces the work efficiency of semiconductor material production, and affects the quality of semiconductor production.

[0003] According to the announcement number: CN110993539A, a temperature control device and semiconductor processing equipment are proposed, the temperature control device includes a cooling component, a temperature measuring element and a regulating component; the liquid inlet of the cooling component is connected to the liquid outlet of the process tank, and the liquid outlet is connected to the first inlet of the regulating component, which is used to cool part of the process liquid output from the liquid outlet of the process tank, and output the cooled process liquid to the first inlet of the regulating component; the temperature measuring element is arranged in the process tank, which is used to measure the real-time temperature of the process liquid in the process tank; the second inlet of the regulating component is connected to the liquid outlet of the process tank, and the outlet is connected to the liquid return port of the process tank, which is used to adjust the flow rate of the process liquid returning to the process tank through the first inlet and the second inlet according to the real-time temperature measured by the temperature measuring element. The temperature control device and semiconductor processing equipment provided by the invention can control the temperature of the process liquid in the process tank in real time and quickly, thereby improving the efficiency of temperature control of the process liquid in the process tank and improving the process effect.

[0004] According to the above introduction, in order to increase the temperature control device when the existing semiconductor manufacturing equipment is in use, the coolant circulates through the pipe in the temperature control device to perform cooling treatment. However, due to the lack of precise temperature control and flow regulation control functions during the flow of the coolant, the temperature and flow of the coolant cannot be controlled. Therefore, it not only increases the production cost, but also reduces the work efficiency of semiconductor material production, and affects the quality of semiconductor production. In order to solve the above problems, a coolant flow control device for semiconductor temperature control equipment is proposed. Summary of the invention

[0005] The purpose of the present invention is to provide a cooling liquid flow control device for semiconductor temperature control equipment. By setting up a precise liquid control device, the cooling liquid can be cooled to ensure that it works within an appropriate temperature range. This refrigeration technology is not only efficient and energy-saving, but also can achieve precise control of the cooling liquid temperature to meet the strict cooling requirements of semiconductor equipment. At the same time, in conjunction with the designed flow control mechanism, a closed-loop reciprocating circulation system can be formed between the precise liquid control equipment and the semiconductor manufacturing equipment. This circulation not only effectively takes away the heat generated by the semiconductor manufacturing equipment during the production process and maintains the normal operating temperature of the equipment, but also ensures the strict requirements on temperature and fluid dynamics in the semiconductor process by precisely controlling the flow rate, so as to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solution: a cooling liquid flow control device for semiconductor temperature control equipment, comprising a fixed seat, one end of which is equipped with a precision liquid control device, and the other end of which is equipped with a semiconductor manufacturing equipment. The liquid outlet on the precision liquid control device is equipped with a flow control mechanism used in conjunction with the semiconductor manufacturing equipment, and the flow control mechanism is used to connect the precision liquid control device and the semiconductor manufacturing equipment for the circulation of cooling liquid, and one end of the flow control mechanism passes through the semiconductor manufacturing equipment and is connected to the liquid inlet position of the precision liquid control device.

[0007] Preferably, the precision liquid regulating equipment includes a variable frequency refrigeration compressor and a variable frequency water pump, a circulation pipe is connected between the variable frequency refrigeration compressor and the variable frequency water pump, the liquid outlet of the variable frequency refrigeration compressor and the liquid inlet of the variable frequency water pump are both installed with branch pipes, and the branch pipes are connected to the flow control mechanism.

[0008] Preferably, the flow control mechanism includes a liquid supply pipe, one end of which is connected to a branch pipe on the variable frequency refrigeration compressor, one end of which passes through the semiconductor manufacturing equipment and is connected to a branch pipe on the variable frequency water pump, a flow meter and a needle valve are installed at one end of the liquid supply pipe close to the variable frequency refrigeration compressor, and interlocking control components for regulating the coolant are installed at both ends of the liquid supply pipe.

[0009] Preferably, the interlock control component includes a throttle tube, one end of the throttle tube is installed on the liquid supply pipe near the needle valve, the other end of the throttle tube is installed at the other end of the liquid supply pipe near the variable frequency water pump, and a first solenoid valve is installed on the liquid supply pipe near one end of the needle valve, and a second solenoid valve used in conjunction with the first solenoid valve is installed on the throttle tube.

[0010] Preferably, the liquid supply pipeline is arranged in a U shape, and the bent position of the liquid supply pipeline is installed on the semiconductor manufacturing equipment and connected to a liquid leakage sensor, and an alarm is installed on the liquid leakage sensor.

[0011] Preferably, a host controller is installed on the fixing seat near the variable frequency water pump, a user controller electrically connected to the host controller is installed on the semiconductor manufacturing equipment, and the leakage sensor and alarm are both electrically connected to the user controller.

[0012] Preferably, both ends of the fixing seat are fixedly connected with a support frame, and a limiting groove is provided on the surface of the support frame at a position corresponding to the liquid supply pipe, and the surface of the liquid supply pipe is clamped in the limiting groove.

[0013] Preferably, a positioning frame is clamped on the surface of the circulation pipe, and the bottom of the positioning frame is fixed to the surface of the fixing seat.

[0014] Preferably, a plurality of the liquid supply pipelines are provided, and each of the liquid supply pipelines is installed with a flow meter, a needle valve and an interlocking control component.

[0015] Preferably, the variable frequency water pump is installed on one end of the fixing seat through a base, and the variable frequency refrigeration compressor is installed at the same end of the fixing seat as the variable frequency water pump.

[0016] Compared with the prior art, the present invention has the following beneficial effects: The present invention provides a cooling liquid flow control device for semiconductor temperature control equipment. By setting up a precise liquid control device, the cooling liquid can be cooled to ensure that it works within an appropriate temperature range. This refrigeration technology is not only efficient and energy-saving, but also can achieve precise control of the cooling liquid temperature to meet the strict cooling requirements of semiconductor equipment. At the same time, in conjunction with the designed flow control mechanism, a closed-loop reciprocating circulation system can be formed between the precise liquid control device and the semiconductor manufacturing equipment. This circulation not only effectively takes away the heat generated by the semiconductor manufacturing equipment during the production process and maintains the normal operating temperature of the equipment, but also ensures the strict requirements on temperature and fluid dynamics in the semiconductor process by precisely controlling the flow.

[0017] The present invention provides a coolant flow control device for semiconductor temperature control equipment. Through the cooperation of a leakage sensor and an alarm, the coolant flowing in a liquid supply pipeline can be detected. If leakage is found, an alarm signal can be issued in time, and the flow control mechanism can quickly control the flow of the coolant to reduce the risk of pollution to a minimum. The continuity and stability of production are guaranteed, and the economic losses caused by accidental leakage are reduced, thereby ensuring that the normal operation of the coolant in the liquid supply pipeline will not be affected. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a left-side schematic diagram of the structure of the precision liquid adjustment equipment and semiconductor manufacturing equipment of the present invention; Figure 3 It is a right side schematic diagram of the structure of the precision liquid adjustment equipment and semiconductor manufacturing equipment of the present invention; Figure 4 It is a schematic diagram of the structure of the flow control mechanism and the precision liquid control equipment of the present invention; Figure 5 It is a schematic diagram of the structure of the flow control mechanism of the present invention.

[0019] Numbers in the figure: 1. Fixed seat; 2. Precision liquid adjustment equipment; 21. Variable frequency refrigeration compressor; 22. Variable frequency water pump; 23. Circulation pipe; 24. Branch pipe; 3. Semiconductor manufacturing equipment; 4. Flow control mechanism; 41. Liquid supply pipeline; 42. Flow meter; 43. Needle valve; 44. Interlock control component; 441. Throttle tube; 442. First solenoid valve; 443. Second solenoid valve; 5. Liquid leakage sensor; 6. Alarm; 7. Host controller; 8. User controller; 9. Support frame; 10. Limit groove; 11. Positioning frame. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] The present invention provides Figures 1 to 5A cooling liquid flow control device for semiconductor temperature control equipment is shown, including a fixed seat 1, one end of which is equipped with a precision liquid regulating device 2, and the other end of which is equipped with a semiconductor manufacturing equipment 3. The liquid outlet of the precision liquid regulating device 2 is equipped with a flow control mechanism 4 used in conjunction with the semiconductor manufacturing equipment 3, and the flow control mechanism 4 is used to connect the circulation of cooling liquid between the precision liquid regulating device 2 and the semiconductor manufacturing equipment 3. One end of the flow control mechanism 4 passes through the semiconductor manufacturing equipment 3 and is connected to the liquid inlet position of the precision liquid regulating device 2. By setting the precision liquid regulating device 2, the cooling liquid can be cooled to ensure that it works within an appropriate temperature range. This refrigeration technology is not only efficient and energy-saving, but also can achieve precise control of the cooling liquid temperature to meet the strict cooling requirements of semiconductor equipment. At the same time, in conjunction with the designed flow control mechanism 4, a closed-loop reciprocating circulation system can be formed between the precision liquid regulating device 2 and the semiconductor manufacturing equipment 3. This circulation not only effectively takes away the heat generated by the semiconductor manufacturing equipment 3 during the production process and maintains the normal operating temperature of the equipment, but also ensures the strict requirements on temperature and fluid dynamics in the semiconductor process by precisely controlling the flow.

[0022] The precision liquid regulating equipment 2 includes a variable frequency refrigeration compressor 21 and a variable frequency water pump 22. A circulation pipe 23 is connected between the variable frequency refrigeration compressor 21 and the variable frequency water pump 22. A branch pipe 24 is installed at the liquid outlet of the variable frequency refrigeration compressor 21 and the liquid inlet of the variable frequency water pump 22. The branch pipe 24 is connected to the flow control mechanism 4. The variable frequency refrigeration compressor 21 can refrigerate the coolant, and then the refrigerated coolant flows into the flow control mechanism 4. The flow control mechanism 4 can pass through the semiconductor manufacturing equipment 3 to take out the heat. Then, the variable frequency water pump 22 provides driving force again, and the coolant is transported to the variable frequency refrigeration compressor 21 through the circulation pipe 23 for refrigeration processing. A closed-loop reciprocating circulation system is formed between the variable frequency refrigeration compressor 21, the variable frequency water pump 22 and the semiconductor manufacturing equipment 3. This circulation not only effectively takes away the heat generated by the semiconductor manufacturing equipment 3 during the production process and maintains the normal operating temperature of the equipment, but also ensures the strict requirements on temperature and fluid dynamics in the semiconductor process by accurately controlling the flow.

[0023] The flow control mechanism 4 includes a liquid supply pipeline 41, one end of which is connected to the branch pipe 24 on the variable frequency refrigeration compressor 21, one end of which passes through the semiconductor manufacturing equipment 3 and is connected to the branch pipe 24 on the variable frequency water pump 22, a flow meter 42 and a needle valve 43 are installed at one end of the liquid supply pipeline 41 close to the variable frequency refrigeration compressor 21, and interlocking control components 44 for regulating the coolant are installed at both ends of the liquid supply pipeline 41. The coolant can be conveyed through the set liquid supply pipeline 41, and the flow meter 42 and the needle valve 43 for manually adjusting the flow are installed on the liquid supply pipeline 41. The flow meter 42 is used to monitor the flow of the liquid in real time, and the needle valve 43 allows the operator to manually adjust the flow on site as needed. This design makes the flow control more accurate and flexible. The interlocking control component 44 includes a throttle tube 441, one end of which is installed on the liquid supply pipeline 41 close to the needle valve 43, and the other end of the throttle tube 441 is installed on the liquid supply pipeline 41 close to the variable frequency water pump 22. A first solenoid valve 442 is installed at the other end of the pipeline 41 and near one end of the needle valve 43 on the liquid supply pipeline 41, and a second solenoid valve 443 used in conjunction with the first solenoid valve 442 is installed on the throttling tube 441. At the same time, the interlocking control component 44 can send a signal to the semiconductor manufacturing equipment 3 to request the corresponding liquid supply pipeline 41 to be closed. The precision liquid adjustment equipment 2 will close the first solenoid valve 442 on the channel and open the second solenoid valve 443 at the same time. This control is actually an interlocking operation of the first solenoid valve 442 and the second solenoid valve 443, which can maintain the overall stable operation while closing the liquid supply channel, and minimize the impact on the overall flow rate. There are several liquid supply pipelines 41, and each liquid supply pipeline 41 is equipped with a flow meter 42, a needle valve 43 and an interlocking control component 44. These liquid supply pipelines 41 are specifically used to supply the required liquid to the semiconductor manufacturing equipment 3. This multi-channel design ensures the flexibility and reliability of liquid supply and can meet the needs of different manufacturing processes.

[0024] The liquid supply pipeline 41 is set in a U shape, and the bent position of the liquid supply pipeline 41 is installed on the semiconductor manufacturing equipment 3 and is connected to the liquid leakage sensor 5. The liquid leakage sensor 5 is equipped with an alarm 6, which can monitor the fluid state in the liquid supply pipeline 41 in real time, detect abnormal conditions in time and take measures. Through these intelligent designs, the precision liquid adjustment equipment 2 not only improves the safety and reliability of the semiconductor manufacturing process, but also provides a strong guarantee for the efficient production of the semiconductor industry.

[0025] A host controller 7 is installed on the fixed base 1 near the variable frequency water pump 22. Through the set main controller, in order to facilitate the control of the precision liquid adjustment equipment 2, a user controller 8 electrically connected to the host controller 7 is installed on the semiconductor manufacturing equipment 3. Through the set user controller 8, in order to be able to control the first solenoid valve 442, the second solenoid valve 443, the leakage sensor 5 and the alarm 6 in the flow control mechanism 4, so as to control the flow of the coolant, the stability and reliability of the liquid supply in the semiconductor manufacturing process can be ensured, thereby improving the manufacturing efficiency and product quality. The leakage sensor 5 and the alarm 6 are both electrically connected to the user controller 8.

[0026] Support frames 9 are fixedly connected at both ends of the fixing seat 1. Limiting grooves 10 are provided on the surface of the support frame 9 at positions corresponding to the liquid supply pipe 41. The surface of the liquid supply pipe 41 is snapped into the limiting grooves 10. Through the cooperation of the support frame 9 and the limiting grooves 10, the liquid supply pipe 41 can be supported, thereby enhancing the stability of the connection of the liquid supply pipe 41.

[0027] A positioning frame 11 is clamped on the surface of the circulation pipe 23, and the bottom of the positioning frame 11 is fixed on the surface of the fixing seat 1. The positioning frame 11 can provide support for the circulation pipe 23, thereby enhancing the stability of the connection between the circulation pipe 23 and the variable frequency refrigeration compressor 21 and the variable frequency water pump 22.

[0028] The variable frequency water pump 22 is installed at one end of the fixed base 1 through a base, and the variable frequency refrigeration compressor 21 is installed at the same end of the fixed base 1 as the variable frequency water pump 22, which can facilitate cooling of the coolant, thereby cooling the semiconductor manufacturing equipment 3.

[0029] During specific use, when the semiconductor manufacturing equipment 3 processes the semiconductor, heat is generated. Then, in order to ensure the stability of the semiconductor processing, the variable frequency refrigeration compressor 21 is set to cool the coolant. Then, the cooled coolant flows into the flow control mechanism 4, and can pass through the semiconductor manufacturing equipment 3 through the flow control mechanism 4, thereby taking out the heat. Then, the variable frequency water pump 22 provides driving force again, and the coolant is transported to the variable frequency refrigeration compressor 21 through the circulation pipe 23 for refrigeration processing. A closed-loop reciprocating circulation system is formed between the variable frequency refrigeration compressor 21, the variable frequency water pump 22 and the semiconductor manufacturing equipment 3. This circulation not only effectively takes away the heat generated by the semiconductor manufacturing equipment 3 during the production process and maintains the normal operating temperature of the equipment, but also ensures the strict requirements on temperature and fluid dynamics in the semiconductor process by precisely controlling the flow.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A cooling liquid flow control device for semiconductor temperature control equipment, comprising a fixing seat (1), characterized in that: A precision liquid regulating device (2) is installed on one end of the fixing seat (1), and a semiconductor manufacturing device (3) is installed on the other end of the fixing seat (1). A flow control mechanism (4) used in conjunction with the semiconductor manufacturing device (3) is installed at the liquid outlet of the precision liquid regulating device (2), and the flow control mechanism (4) is used to connect the precision liquid regulating device (2) and the semiconductor manufacturing device (3) to circulate cooling liquid. One end of the flow control mechanism (4) passes through the semiconductor manufacturing device (3) and is connected to the liquid inlet of the precision liquid regulating device (2).

2. The cooling liquid flow control device for semiconductor temperature control equipment according to claim 1, characterized in that: The precision liquid regulating device (2) comprises a variable frequency refrigeration compressor (21) and a variable frequency water pump (22), wherein a circulation pipe (23) is connected between the variable frequency refrigeration compressor (21) and the variable frequency water pump (22), and a branch pipe (24) is installed at the liquid outlet of the variable frequency refrigeration compressor (21) and the liquid inlet of the variable frequency water pump (22), and the branch pipe (24) is connected to the flow control mechanism (4).

3. The cooling liquid flow control device for semiconductor temperature control equipment according to claim 2, characterized in that: The flow control mechanism (4) comprises a liquid supply pipeline (41), one end of which is in communication with a branch pipe (24) on a variable frequency refrigeration compressor (21), one end of which passes through the semiconductor manufacturing equipment (3) and is in communication with a branch pipe (24) on a variable frequency water pump (22), a flow meter (42) and a needle valve (43) are installed at one end of the liquid supply pipeline (41) close to the variable frequency refrigeration compressor (21), and interlocking control components (44) for regulating the coolant are installed at both ends of the liquid supply pipeline (41).

4. The cooling liquid flow control device for semiconductor temperature control equipment according to claim 3, characterized in that: The interlock control component (44) comprises a throttle tube (441), one end of which is mounted on a liquid supply pipe (41) close to a needle valve (43), and the other end of which is mounted on the other end of the liquid supply pipe (41) close to a variable frequency water pump (22). A first solenoid valve (442) is mounted on the liquid supply pipe (41) close to one end of the needle valve (43), and a second solenoid valve (443) used in conjunction with the first solenoid valve (442) is mounted on the throttle tube (441).

5. The cooling liquid flow control device for semiconductor temperature control equipment according to claim 4, characterized in that: The liquid supply pipeline (41) is arranged in a U shape, and the bent position of the liquid supply pipeline (41) is installed on the semiconductor manufacturing equipment (3) and is connected to a liquid leakage sensor (5), and an alarm (6) is installed on the liquid leakage sensor (5).

6. The cooling liquid flow control device for semiconductor temperature control equipment according to claim 5, characterized in that: A host controller (7) is installed on the fixing seat (1) at a position close to the variable frequency water pump (22), a user controller (8) electrically connected to the host controller (7) is installed on the semiconductor manufacturing equipment (3), and the liquid leakage sensor (5) and the alarm (6) are both electrically connected to the user controller (8).

7. The cooling liquid flow control device for semiconductor temperature control equipment according to claim 4, characterized in that: The two ends of the fixing seat (1) are fixedly connected to a support frame (9), and a limiting groove (10) is provided on the surface of the support frame (9) at a position corresponding to the liquid supply pipe (41), and the surface of the liquid supply pipe (41) is clamped in the limiting groove (10).

8. The cooling liquid flow control device for semiconductor temperature control equipment according to claim 2, characterized in that: A positioning frame (11) is clamped on the surface of the circulation pipe (23), and the bottom of the positioning frame (11) is fixed to the surface of the fixing seat (1).

9. The cooling liquid flow control device for semiconductor temperature control equipment according to claim 4, characterized in that: A plurality of liquid supply pipelines (41) are provided, and each of the liquid supply pipelines (41) is installed with a flow meter (42), a needle valve (43) and an interlock control component (44).

10. The cooling liquid flow control device for semiconductor temperature control equipment according to claim 2, characterized in that: The variable frequency water pump (22) is mounted on one end of the fixing seat (1) via a base, and the variable frequency refrigeration compressor (21) is mounted at the same end of the fixing seat (1) as the variable frequency water pump (22).

Images