Semiconductor process equipment and sealing door mechanism thereof

Abstract

The invention discloses semiconductor process equipment and a sealing door mechanism thereof, and belongs to the technical field of semiconductors. The sealing door mechanism is used for sealing a first opening of a process chamber of the semiconductor process equipment, the sealing door mechanism comprises a sealing disc, a sealing piece and an isolation pad, the sealing disc is used for sealing the first opening of the process chamber, the heat insulation plate is arranged on the upper surface of the sealing disc, a purging gap is formed between the sealing disc and the heat insulation plate, and the heat insulation plate is provided with a second opening. And the second opening is communicated with the purging gap. The semiconductor process equipment comprises the sealing door mechanism and a process chamber, the process chamber is provided with a first opening, and the sealing door mechanism is used for sealing the first opening. According to the arrangement, the sealing door mechanism is used for sealing the first opening of the process chamber, no wafer boat exists in the process chamber in the purging state, the wafer boat does not influence the flow speed of purging gas and the purging uniformity, the dead-corner-free purging process is achieved, and the purging effect and the purging efficiency are improved.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor technology, and specifically relates to a semiconductor process equipment and a sealing door mechanism thereof. Background Art

[0002] In the field of semiconductor technology, many semiconductor process equipments have process chambers. The process chambers need to be heated during the process, and the first opening of the process chambers is closed by a process door to prevent the process chambers from dissipating heat outward. Specifically, a first opening is provided at the bottom of the process chamber, and the process door carries a wafer boat, which is used to carry wafers. The process door can drive the wafer boat carrying the wafers to rise, so that the wafer boat extends into the process chamber through the first opening. At the same time, the process door closes the first opening, and the process chamber can carry out the process. After the process is completed, the process door drives the wafer boat to descend, the first opening is opened, and the wafer boat extends out of the process chamber from the first opening, and then the external wafer transfer device is used to transfer the wafers between the wafer box and the wafer boat.

[0003] However, since by-products such as particles are generated during the process, these by-products remain on the wall of the process chamber and are easily detached and fall onto the surface of the wafer during the process, affecting the process effect of the wafer. Therefore, it is necessary to purge the process chamber after the process is completed to blow the particles and other by-products out of the process chamber.

[0004] In the related art, in the purge state, the process door is directly used to seal the first opening. That is to say, after the process is completed, the process door drives the wafer boat to descend, and then the wafer transfer device takes away the wafer carried by the wafer boat, and the process door continues to rise to seal the first opening, so that the process chamber is in a closed state. At this time, purge gas is introduced into the process chamber to purge particles and other by-products. However, due to the presence of the wafer boat in the process chamber, the purge gas flow is affected by the wafer boat, there are purge dead corners, and the purge uniformity is poor, resulting in poor purge effect. Moreover, both the purge process and the process require the process door to participate in closing the first opening, so the purge process and the process of loading and unloading wafers from the wafer boat cannot be carried out at the same time, resulting in a long process cycle and low process efficiency of semiconductor process equipment. Summary of the invention The purpose of the embodiments of the present application is to provide a semiconductor process equipment and a sealing door mechanism thereof, which can solve the problem in the related art that the first opening is sealed by the process door in the purge state, resulting in poor purge effect.

[0005] In a first aspect, an embodiment of the present application provides a sealing door mechanism of a semiconductor process equipment, which is used to seal a first opening of a process chamber of the semiconductor process equipment. The sealing door mechanism includes a sealing disk and a thermal insulation plate. The sealing disk is used to close the first opening of the process chamber. The thermal insulation plate is arranged on the upper surface of the sealing disk. A purge gap is provided between the sealing disk and the thermal insulation plate. The thermal insulation plate is provided with a second opening, and the second opening is connected to the purge gap.

[0006] In a second aspect, an embodiment of the present application further provides a semiconductor process equipment, including a process chamber and the above-mentioned sealing door mechanism, wherein the process chamber is provided with a first opening, and the sealing door mechanism is used to seal the first opening.

[0007] In an embodiment of the present application, in the purge state, the first opening of the process chamber is sealed by a sealing door mechanism, and there is no need to seal the first opening by a process door. In this way, in the purge state, there is no crystal boat in the process chamber, and the crystal boat will not affect the flow rate and purge uniformity of the purge gas, thereby achieving a purge process without dead ends, which is beneficial to improving the purge effect and purge efficiency. Moreover, the process door and the sealing door mechanism seal the first opening in the process state and the purge state respectively, so the process of loading and unloading wafers by the crystal boat and the purge process can be carried out simultaneously, saving the time for separate purge, which is beneficial to improving the utilization rate and process efficiency of semiconductor process equipment.

[0008] In addition, when the sealing door mechanism seals the first opening, the gas in the process chamber enters the purge gap through the second opening, the air pressure above the insulation board tends to be equal to the air pressure in the purge gap, and the insulation board is in a force balance state, which prevents the insulation board from being subjected to unbalanced force and impacting the sealing disk, thereby preventing the insulation board from breaking. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 is a front view of the sealing door mechanism disclosed in the embodiment of the present application; Figure 2 Figure 1 The enlarged view of point A in the middle; Figure 3 is a structural schematic diagram of a sealing door mechanism disclosed in an embodiment of the present application; Figure 4 is a top view of the sealing door mechanism disclosed in the embodiment of the present application; Figure 5 It is a schematic diagram of the structure of the heat insulation board disclosed in the embodiment of the present application; Figure 6 is a schematic structural diagram of a semiconductor process device in a process state disclosed in an embodiment of the present application; Figure 7is a structural schematic diagram of a semiconductor process equipment in the process of opening a first opening of a process door after a process is completed, as disclosed in an embodiment of the present application; Figure 8 is a schematic structural diagram of a semiconductor process device disclosed in an embodiment of the present application when a sealing door mechanism seals a first opening; Fig. 9 is a schematic structural diagram of a semiconductor process equipment in a purging state disclosed in an embodiment of the present application; Fig.10 is a schematic diagram of the structure of the semiconductor process equipment after the purging is completed according to the embodiment of the present application; Fig.11 It is a structural schematic diagram of the semiconductor process equipment disclosed in an embodiment of the present application when the sealing door mechanism opens the first opening after the purge is completed.

[0010] Description of reference numerals: 10-Sealing door mechanism, 100-sealing disc, 110-groove, 111-support structure, 120-sealing groove, 200-Seals, 300-isolation pad, 310-connection part, 311-fastener, 320-isolation part, 400-insulation board, 400a-second opening, 400b-purge gap, 500-Support arm, 600-slewing mechanism, 700-Linear drive mechanism, 20-process chamber, 21-first opening, 22-air inlet, 23-exhaust port, 30-Craft door, 40-crystal boat, 41-wafer. DETAILED DESCRIPTION

[0011] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

[0012] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0013] The semiconductor process equipment and the sealing door mechanism thereof provided by the embodiments of the present application are described in detail below through specific embodiments and their application scenarios in combination with the accompanying drawings.

[0014] Please refer to Figure 1-Figure 11 The embodiment of the present application discloses a sealing door mechanism 10 of a semiconductor process equipment, which is used to seal a first opening 21 of a process chamber 20 of the semiconductor process equipment. Optionally, the sealing door mechanism 10 is used to seal the first opening 21 of the process chamber 20 of the semiconductor process equipment in a purge state to prevent the heat in the process chamber 20 from being dissipated to the loading area. Of course, the sealing door mechanism 10 can also seal the first opening 21 in other states except purge. Specifically, when the semiconductor process equipment is in a purge state, the sealing door mechanism 10 seals the first opening 21 of the process chamber 20.

[0015] It should be noted that the sealing door mechanism 10 is different from the process door 30 of the semiconductor process equipment. The process door 30 is used to seal the first opening 21 of the process chamber 20 under the process state.

[0016] refer to Figure 2-Figure 5 As shown, the sealing door mechanism 10 includes a sealing disk 100 and a heat insulating plate 400. The sealing disk 100 is used to close the first opening 21 of the process chamber 20. The sealing disk 100 can be a circular plate structure made of metal material, but the embodiment of the present application is not limited to this. The sealing disk 100 can also be a square plate or other structure. The heat insulating plate 400 is arranged on the upper surface of the sealing disk 100. Optionally, the heat insulating plate 400 can be directly placed on the upper surface of the sealing disk 100, or the sealing disk 100 is also provided with a supporting structure 111, and the heat insulating plate 400 is supported by the supporting structure 111, so that the heat insulating plate 400 is stably located on the upper surface of the sealing disk 100. Further optionally, the supporting structure 111 can be a column, and the column directly supports the lower surface of the heat insulating plate 400; or, the supporting structure 111 can be a step structure, and the step structure supports the lower surface and side wall of the heat insulating plate 400. The embodiment of the present application does not limit the specific structure of the supporting structure 111.

[0017] In this way, when the sealing disk 100 seals the first opening 21 of the process chamber 20 , the heat insulation board 400 is used to insulate the process chamber 20 to prevent the heat in the process chamber 20 from being lost.

[0018] The heat insulating plate 400 may be made of quartz, and the material of the heat insulating plate 400 is the same as that of the process chamber 20. Of course, the material of the heat insulating plate 400 may also be different from that of the process chamber 20, and the heat insulating plate 400 may be made of other structures besides quartz.

[0019] In the embodiment of the present application, in the purge state, the sealing door mechanism 10 is used to seal the first opening 21 of the process chamber 20, and there is no need to use the process door 30 to seal the first opening 21 in the purge state. In this way, in the purge state, there is no crystal boat 40 in the process chamber 20, and the crystal boat 40 will not affect the flow rate and purge uniformity of the purge gas, thereby realizing a purge process without dead ends, which is beneficial to improving the purge effect and purge efficiency; moreover, the process door 30 and the sealing door mechanism 10 seal the first opening 21 in the process state and the purge state respectively, so the process of loading and unloading the wafers 41 by the crystal boat 40 and the purge process can be carried out simultaneously, saving the time for separate purge, which is beneficial to improving the utilization rate and process efficiency of semiconductor process equipment.

[0020] In this embodiment, a purge gap 400b is provided between the sealing disk 100 and the heat insulation board 400, and the heat insulation board 400 is provided with a second opening 400a, and the second opening 400a is connected to the purge gap 400b. Optionally, the lower surface of the heat insulation board 400 and the upper surface of the sealing disk 100 can directly form the purge gap 400b, or the upper surface of the sealing disk 100 is provided with other structures, and the other structures and the lower surface of the heat insulation board 400 form the purge gap 400b. The embodiment of the present application does not limit the specific structure of the purge gap 400b; the second opening 400a can be a square opening, a circular opening, etc., and the embodiment of the present application does not limit the specific structure of the second opening 400a; the second opening 400a and the purge gap 400b can be directly connected or indirectly connected.

[0021] With such arrangement, when the sealing door mechanism 10 seals the first opening 21, the gas in the process chamber 20 enters the purge gap 400b through the second opening 400a, the air pressure above the insulation board 400 tends to be equal to the air pressure in the purge gap 400b, and the insulation board 400 is in a state of force balance, thereby preventing the insulation board 400 from being subjected to unbalanced force and impacting the sealing disk 100, thereby preventing the insulation board 400 from being broken.

[0022] In an alternative embodiment, reference Figure 2As shown, the upper surface of the sealing disk 100 is provided with a groove 110, and the heat insulation board 400 is located in the groove 110. A purge gap 400b is formed between the groove wall surface of the groove 110 and the heat insulation board 400. Optionally, the groove wall surface of the groove 110 may include a groove side wall and a groove bottom wall. The groove bottom wall may be a planar structure, and the groove side wall may be perpendicular to the groove bottom wall, or the groove side wall may be inclined relative to the groove bottom wall. Of course, the groove 110 may also adopt other structures, and the embodiment of the present application does not limit the structure of the groove 110.

[0023] Optionally, refer to Figure 3 and Figure 4 As shown, the groove 110 can be a circular groove, the insulation board 400 is a circular structure, and the insulation board 400 cooperates with the groove 110; the support structure 111 can be arranged on the groove side wall of the groove 110 to make the insulation board 400 stably located in the groove 110.

[0024] In this embodiment, the position of the heat insulation board 400 is limited by the groove 110 to prevent the heat insulation board 400 from being displaced relative to the sealing disk 100 due to the influence of the purge airflow. In addition, by providing the groove 110 to form the purge gap 400b, the contact area between the heat insulation board 400 and the sealing disk 100 is reduced, further reducing the risk of the heat insulation board 400 impacting the sealing disk 100 and breaking.

[0025] Of course, in other embodiments, the heat insulation plate 400 may not be provided with the groove 110 , and the lower surface of the heat insulation plate 400 and the upper surface of the sealing disk 100 directly form the purge gap 400 b .

[0026] In an optional embodiment, the second opening 400 a is opened inside the heat insulation board 400 , and the second opening 400 a is adjacent to an edge of the heat insulation board 400 .

[0027] In another embodiment, reference Figure 5 As shown, the second opening 400a is opened at the edge of the heat insulation board 400. In this way, it is more convenient to set the second opening 400a at the edge of the heat insulation board 400, and it is convenient to take and place the heat insulation board 400 through the second opening 400a located at the edge.

[0028] In a further embodiment, the edge of the second opening 400a is an arc-shaped structure, and the second opening 400a is smoothly connected to the edge of the insulation board 400. Optionally, the edge of the second opening 400a is an arc-shaped structure, and the second opening 400a is smoothly connected to the edge of the insulation board 400 through an arc.

[0029] In this embodiment, the edge of the second opening 400a and the connection between the second opening 400a and the edge of the insulation board 400 all adopt a smooth connection structure, which is beneficial to reducing stress and avoiding stress concentration caused by the existence of a bending structure.

[0030] Of course, in other embodiments, the edge of the second opening 400a may adopt a non-arc structure. Optionally, the second opening 400a may be a square structure; the second opening 400a and the edge of the heat insulation board 400 may be directly bent and connected.

[0031] In an optional embodiment, the number of the second opening 400a is one.

[0032] In another embodiment, reference Figure 5 As shown, at least two second openings 400a are arranged at intervals along the direction in which the edge of the heat insulation board 400 extends. Optionally, each second opening 400a is arranged at the edge of the heat insulation board 400, wherein two second openings 400a are arranged opposite to each other, and the shapes and sizes of each second opening 400a can be the same or different.

[0033] With this embodiment, the number of second openings 400a increases. When purging residues in the process chamber 20, the purge gas can quickly enter the purge gap 400b through the multiple second openings 400a, so that the air pressure above the insulation plate 400 and the air pressure in the purge gap 400b quickly approach the same, ensuring that the insulation plate 400 is quickly in a balanced state and more effectively preventing the sealing disk 100 from being impacted.

[0034] In the scheme of this application, reference is made to Figure 1 and Figure 2 As shown, the sealing door mechanism 10 further includes a sealing member 200, which is disposed on the upper surface of the sealing disk 100, the sealing member 200 is located at the periphery of the heat insulation board 400, and the sealing member 200 protrudes from the upper surface of the sealing disk 100 to seal the gap between the sealing disk 100 and the process chamber 20. Optionally, the sealing member 200 may be a sealing ring made of a flexible material, and the sealing ring is concentrically disposed with the sealing disk 100, but the embodiment of the present application is not limited thereto, as long as the sealing member 200 can seal the first opening 21 of the process chamber 20.

[0035] Optionally, refer to Figure 2 As shown, a sealing groove 120 is provided on the upper surface of the sealing disk 100, and a sealing member 200 is disposed in the sealing groove 120. Further optionally, the sealing groove 120 and the sealing member 200 are both annular structures.

[0036] With such arrangement, when the sealing door mechanism 10 seals the first opening 21 of the process chamber 20, the seal 200 seals the gap between the process chamber 20 and the sealing disk 100, and a static sealing structure is formed between the seal 200 and the process chamber 20. Particles and other by-products are not easy to enter the process chamber 20, thereby preventing particles and other by-products from diffusing to the surface of the wafer 41 under the process state and thereby affecting the process effect of the wafer 41, which is beneficial to improving the sealing performance.

[0037] Of course, in other embodiments, the seal 200 may not be provided on the upper surface of the sealing disk 100 , and the gap between the sealing disk 100 and the process chamber 20 may be sealed by other structures outside the sealing disk 100 or outside the process chamber 20 .

[0038] In an optional embodiment, the sealing door mechanism 10 further includes an isolation pad 300, which is disposed on the upper surface of the sealing disk 100. The isolation pad 300 is located at the periphery of the sealing member 200, and the isolation pad 300 protrudes from the upper surface of the sealing disk 100 to isolate the sealing disk 100 from the process chamber 20. The isolation pad 300 may be made of engineering plastics, specifically PEEK (polyetheretherketone), and of course, may also be made of other engineering plastics, or may be made of other materials other than engineering plastics.

[0039] Optionally, the isolation pad 300 is located at the periphery of the sealing ring, and the isolation pad 300 may be a block structure, a strip structure, or even a ring structure. The specific structure of the isolation pad 300 is not limited in the embodiment of the present application, and it is sufficient that the sealing disk 100 and the process chamber 20 can be isolated. Further optionally, the sealing member 200 and the isolation pad 300 are both ring structures, and the sealing disk 100, the heat insulation plate 400, the groove 110, the sealing member 200, and the isolation pad 300 are all concentrically arranged, and the sealing member 200 and the isolation pad 300 are both located outside the groove 110.

[0040] In this embodiment, the sealing door mechanism 10 is additionally provided with an isolation pad 300. When the sealing disk 100 closes the first opening 21 of the process chamber 20, the sealing member 200 seals the gap between the process chamber 20 and the sealing disk 100. At the same time, the isolation pad 300 isolates the sealing disk 100 from the process chamber 20, thereby preventing the sealing disk 100 from directly contacting the process chamber 20 when the clamping force between the sealing disk 100 and the process chamber 20 is large, thereby preventing the process chamber 20 from being partially collided and broken, and effectively ensuring the safety of the process chamber 20.

[0041] Of course, in other embodiments, the sealing door mechanism 10 may not be provided with the isolation pad 300 , and the sealing disk 100 is prevented from directly contacting the process chamber 20 by increasing the thickness of the sealing member 200 .

[0042] In an alternative embodiment, reference Figure 1 , Figure 3 as well as Figure 4As shown, the sealing door mechanism 10 also includes a linear drive mechanism 700, a rotating mechanism 600 and a support arm 500. The first end of the support arm 500 is connected to the sealing disk 100, and the support arm 500 can drive the sealing disk 100 to move so that the sealing disk 100 closes the first opening 21 or opens the first opening 21; the rotating mechanism 600 is connected to the second end of the support arm 500, and the rotating mechanism 600 drives the support arm 500 to drive the sealing disk 100 to rotate. The linear drive mechanism 700 is connected to the rotating mechanism 600, and the linear drive mechanism 700 can drive the rotating mechanism 600 to drive the support arm 500 and the sealing disk 100 to rise and fall synchronously. The rotating mechanism 600 and the linear drive mechanism 700 work together to enable the sealing disk 100 to switch between the first position and the second position.

[0043] Specifically, when the sealing disk 100 is in the first position, Figure 3 When the sealing disk 100 is in the middle position, the sealing disk 100 closes the first opening 21, and the sealing member 200 seals the first opening 21, and the process chamber 20 can start the purge process; when the sealing disk 100 is in the second position, it is Figure 3 At the position shown by the middle dotted line, the sealing disk 100 opens the first opening 21 , and the process door 30 can seal the first opening 21 . At this time, the process chamber 20 can start the process.

[0044] The rotary mechanism 600 may be a driving member including a driving motor, a pneumatic motor, etc. to provide a rotational driving force, and the linear driving mechanism 700 may include a driving member including a cylinder, an electric cylinder, a linear module, etc. to provide a linear driving force. Optionally, the first end of the support arm 500 and the sealing disk 100, the second end of the support arm 500 and the driving shaft of the rotary mechanism 600, and the housing of the rotary mechanism 600 and the linear driving mechanism 700 may be connected by welding, bonding, etc.

[0045] In an optional embodiment, the sealing member 200 is a sealing ring, and the shape of the sealing ring can be the same as the shape of the first opening 21 of the process chamber 20. Optionally, the first opening 21 is a square opening, and the sealing ring is a square ring structure; or, the first opening 21 is a circular opening, and the sealing ring is a circular ring structure. The isolation pad 300 is an arc-shaped structure, and the arc-shaped structure extends along the circumference of the sealing ring.

[0046] In another embodiment, the isolation pad 300 is an annular structure, and the isolation pad 300 is disposed around the sealing ring. Optionally, the isolation pad 300 can be located at the periphery of the sealing ring, and the isolation pad 300 and the sealing ring are disposed concentrically.

[0047] By adopting this embodiment, the extension length of the isolation pad 300 is increased in the circumferential direction of the sealing ring, so that the isolation area between the process chamber 20 and the sealing disk 100 is increased, which effectively avoids direct contact between the sealing disk 100 and the process chamber 20, further avoids local collision and breakage of the process chamber 20, and further improves the safety performance of the process chamber 20.

[0048] In an optional embodiment, the isolation gasket 300 is disposed at the edge of the sealing disk 100 , and the isolation gasket 300 is located on the upper surface of the sealing disk 100 , and the isolation gasket 300 only includes an isolation portion 320 , and the isolation portion 320 contacts the upper surface of the sealing disk 100 . In another embodiment, the isolation pad 300 further includes a connecting portion 310, which is bent and connected to the isolation portion 320, and the connecting portion 310 is connected to the side surface of the sealing disk 100. Optionally, the connecting portion 310 and the side surface of the sealing disk 100 can be fixedly connected by welding, bonding, etc.; the connecting portion 310 and the isolation portion 320 can be a split structure, and the connecting portion 310 and the isolation portion 320 are fixedly connected by welding, bonding, etc. Of course, the connecting portion 310 and the isolation portion 320 can also be formed into an integrated structure by injection molding.

[0049] In this embodiment, the isolation gasket 300 is connected to the sealing disk 100 via the connecting portion 310, so that the position of the isolation portion 320 is fixed relative to the sealing disk 100, thereby preventing the position of the isolation portion 320 from shifting. Moreover, the connecting portion 310 extends to the side surface of the sealing disk 100 and is connected to the sealing disk 100. The connection operation will not affect the isolation portion 320, thereby effectively ensuring that the isolation portion 320 isolates the sealing disk 100 and the process chamber 20.

[0050] In a further embodiment, the connection part 310 is detachably connected to the side surface of the sealing disk 100. Optionally, the connection part 310 can be connected to the side surface of the sealing disk 100 by means of clamping, bolting, etc., and further optionally, the connection part 310 can be provided with an opening, the side surface of the sealing disk 100 is provided with a threaded hole, and a fastener 311 such as a screw or bolt is used to penetrate the opening and extend into the threaded hole to connect the sealing disk 100 and the connection part 310; or, one of the connection part 310 and the side surface of the sealing disk 100 is provided with a clamping block, and the other is provided with a clamping groove, and the clamping block can extend into the clamping groove to achieve clamping of the sealing disk 100 and the connection part 310.

[0051] With this embodiment, a detachable connection method is adopted to facilitate installation and removal of the isolation pad 300. The isolation pad 300 can be replaced as needed to continuously ensure that the sealing disk 100 is effectively isolated from the process chamber 20, thereby extending the service life of the process chamber 20.

[0052] Of course, in other embodiments, the connection portion 310 may also be fixedly connected to the side surface of the sealing disk 100 by welding, bonding or other non-detachable means.

[0053] In an optional embodiment, the height of the isolation pad 300 protruding from the sealing disk 100 is greater than or equal to the height of the sealing member 200 protruding from the sealing disk 100. Optionally, the height of the isolation portion 320 protruding from the sealing disk 100 is greater than or equal to the height of the sealing ring protruding from the sealing disk 100.

[0054] In another embodiment, reference Figure 2 As shown, the height of the isolation pad 300 protruding from the sealing disk 100 is less than the height of the sealing member 200 protruding from the sealing disk 100. Optionally, the height of the isolation portion 320 protruding from the sealing disk 100 is less than the height of the sealing ring protruding from the sealing disk 100.

[0055] In this embodiment, the protruding height of the seal 200 is relatively large, and the protruding height of the isolation pad 300 is relatively small, so as to ensure that the process chamber 20 first squeezes the seal 200 so that the seal 200 seals the gap between the process chamber 20 and the sealing disk 100, thereby avoiding the protruding height of the isolation pad 300 being relatively large and affecting the sealing between the process chamber 20 and the sealing disk 100.

[0056] Based on the sealing door mechanism 10 disclosed in the present application, the present application embodiment also discloses a semiconductor process equipment, referring to Figure 7-Figure 11 As shown, the semiconductor process equipment includes the above-mentioned sealing door mechanism 10 and a process chamber 20 . The process chamber 20 is provided with a first opening 21 . The sealing door mechanism 10 is used to seal the first opening 21 .

[0057] Optionally, the process chamber 20 can be a vertical process tube, the top of the process tube is a closed structure, and the bottom of the process tube is an open structure to form a first opening 21. The process chamber 20 is provided with an air inlet 22 and an exhaust port 23. The air inlet 22 can introduce a purge gas into the interior of the process chamber 20, and the exhaust port 23 can supply the purge gas to be discharged outside the process chamber 20, wherein the purge gas can be but is not limited to nitrogen.

[0058] According to the present embodiment, the sealing door mechanism 10 of the semiconductor process equipment is additionally provided with an isolation pad 300. When the sealing disk 100 closes the first opening 21 of the process chamber 20, the sealing member 200 seals the gap between the process chamber 20 and the sealing disk 100. At the same time, the isolation pad 300 isolates the sealing disk 100 from the process chamber 20, thereby preventing the sealing disk 100 from directly contacting the process chamber 20 when the clamping force between the sealing disk 100 and the process chamber 20 is large, thereby preventing the process chamber 20 from being partially broken by collision, and effectively improving the safety of the process chamber 20.

[0059] In an optional embodiment, the heat insulation board 400 is provided with at least two second openings 400a at intervals, and when the sealing door mechanism 10 seals the first opening 21, the two second openings 400a are respectively opposite to the air inlet 22 and the air outlet 23. In this arrangement, the purge gas entering through the air inlet 22 can conveniently enter the purge gap 400b through the second opening 400a, and be discharged through the other second opening 400a through the air outlet 23, which is more conducive to the rapid circulation of the purge gas in the purge gap 400b.

[0060] In an optional embodiment, the semiconductor process equipment further includes a process door 30 and a wafer boat 40. The process door 30 is used to seal the first opening 21 in the process state. The wafer boat 40 is used to carry the wafer 41. The wafer boat 40 is disposed on the process door 30. The process door 30 can drive the wafer boat 40 carrying the wafer 41 to move. When the semiconductor process equipment is in the process state, the process door 30 seals the first opening 21, and the wafer boat 40 extends into the process chamber 20. When the semiconductor process equipment is in the purge state, the sealing door mechanism 10 seals the first opening 21.

[0061] Specifically, refer to Figure 6 As shown, the process door 30 seals the first opening 21, the semiconductor process equipment is in the process state, and particles and other residues gradually remain on the inner wall surface of the process chamber 20. At this time, the sealing plate 100 is in the second position; when the process is completed, refer to Figure 7 As shown, the process door 30 drives the wafer boat 40 and the wafer 41 to descend, and the process door 30 opens the first opening 21; when the wafer boat 40 and the wafer 41 leave the process chamber 20, and then other transmission equipment transmits the wafer 41 that has completed the process carried by the wafer boat 40, refer to Figure 8 As shown, the sealing disk 100 is switched from the second position to the first position, and the sealing disk 100 seals the first opening 21 of the process chamber 20. Fig. 9 As shown, the semiconductor process equipment starts the purge process, and a purge gas such as nitrogen is introduced into the process chamber 20 from the gas inlet 22. The purge gas purges the residues in the process chamber 20 and is discharged from the exhaust port 23 with the residues. When the purge process is completed, refer to Fig.10 As shown, the sealing plate 100 is switched from the first position to the second position, the sealing plate 100 opens the first opening 21, and at the same time, other transmission equipment transmits the unprocessed wafer 41 to the wafer boat 40. For further reference, Fig.11 As shown, the process door 30 drives the wafer boat 40 and the wafer 41 to rise to seal the first opening 21 , and the semiconductor process equipment starts the process again.

[0062] According to the present embodiment, the semiconductor process equipment seals the first opening 21 of the process chamber 20 in the purge state through the sealing door mechanism 10, and there is no need to use the process door 30 to seal the first opening 21 in the purge state. In this way, in the purge state, there is no crystal boat 40 in the process chamber 20, and the crystal boat 40 will not affect the flow rate and purge uniformity of the purge gas, thereby realizing a purge process without dead angles, which is beneficial to improving the purge effect and purge efficiency. Moreover, the process door 30 and the sealing door mechanism 10 seal the first opening 21 in the process state and the purge state respectively, so the process of loading and unloading the wafers 41 by the crystal boat 40 and the purge process can be carried out simultaneously, saving the time for separate purge, which is beneficial to improving the utilization rate and process efficiency of the semiconductor process equipment.

[0063] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A sealing door mechanism of a semiconductor process equipment, used for sealing a first opening (21) of a process chamber (20) of the semiconductor process equipment, characterized in that: The sealing door mechanism (10) comprises a sealing disk (100) and a heat insulation plate (400), wherein the sealing disk (100) is used to seal a first opening (21) of the process chamber (20), the heat insulation plate (400) is arranged on the upper surface of the sealing disk (100), a purge gap (400b) is provided between the sealing disk (100) and the heat insulation plate (400), and the heat insulation plate (400) is provided with a second opening (400a), and the second opening (400a) is connected to the purge gap (400b).

2. The sealing door mechanism according to claim 1, characterized in that: The upper surface of the sealing disk (100) is provided with a groove (110), the heat insulation plate (400) is located in the groove (110), and the purge gap (400b) is formed between the groove wall surface of the groove (110) and the heat insulation plate (400).

3. The sealing door mechanism according to claim 1, characterized in that: The second opening (400a) is opened at the edge of the heat insulation board (400).

4. The sealing door mechanism according to claim 3, characterized in that: The edge of the second opening (400a) is an arc-shaped structure, and the second opening (400a) is connected to the edge of the heat insulation board (400) in a smooth transition.

5. The sealing door mechanism according to claim 3, characterized in that: Along the direction in which the edge of the heat insulation board (400) extends, at least two of the second openings (400a) are arranged at intervals.

6. The sealing door mechanism according to claim 1, characterized in that: The sealing door mechanism further comprises a sealing member (200), wherein the sealing member (200) is arranged on the upper surface of the sealing disk (100), the sealing member (200) is located at the periphery of the heat insulation plate (400), and the sealing member (200) protrudes from the upper surface of the sealing disk (100) to seal the gap between the sealing disk (100) and the process chamber (20).

7. The sealing door mechanism according to claim 6, characterized in that: The sealing door mechanism further comprises an isolation pad (300), wherein the isolation pad (300) is arranged on the upper surface of the sealing disk (100), the isolation pad (300) is located at the periphery of the sealing member (200), and the isolation pad (300) protrudes from the upper surface of the sealing disk (100) to isolate the sealing disk (100) and the process chamber (20).

8. The sealing door mechanism according to claim 7, characterized in that: The isolation pad (300) is arranged at the edge of the sealing disk (100), and the isolation pad (300) comprises a connecting portion (310) and an isolation portion (320) which are connected to each other, the isolation portion (320) is in contact with the upper surface of the sealing disk (100), and the connecting portion (310) is connected to the side surface of the sealing disk (100).

9. The sealing door mechanism according to claim 8, characterized in that: The connecting portion (310) is detachably connected to a side surface of the sealing disk (100).

10. The sealing door mechanism according to claim 7, characterized in that: The height of the isolation pad (300) protruding from the sealing disk (100) is smaller than the height of the sealing member (200) protruding from the sealing disk (100).

11. A semiconductor process equipment, characterized in that: It comprises a sealing door mechanism (10) as claimed in any one of claims 1 to 10 and a process chamber (20), wherein the process chamber (20) is provided with a first opening (21), and the sealing door mechanism (10) is used for sealing the first opening (21).

12. The semiconductor process equipment according to claim 11, characterized in that: The semiconductor process equipment further comprises a process gate (30) and a wafer boat (40); the wafer boat (40) is used to carry a wafer (41); and the wafer boat (40) is arranged on the process gate (30).

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