Wafer cleaning device capable of easily removing crystal accumulation

Abstract

The invention relates to a wafer cleaning device capable of easily removing crystal accumulation, and belongs to the technical field of wafer cleaning equipment.The wafer cleaning device comprises a cleaning box with a cleaning tank formed in one end, a cleaning assembly, a crystal removing assembly and a drying assembly; an air cylinder is fixedly installed at one end of the L-shaped installation frame, a square block is fixedly installed at the output end of the air cylinder, a liquid conveying cavity is formed in the cleaning box, a square groove is formed in one end of the cleaning box, and a collecting box is installed in the square groove. The first fan is started to dry the wafer, the centrifugal fan is started at the same time, air suction is conducted through the air suction holes, air blowing and air suction circulation is formed, the drying effect is improved, the surface of the wafer can be cleaned through the first round pipe, then the wafer is comprehensively and evenly cleaned through the second round pipe, and the cleaning effect is good.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer cleaning equipment, and in particular to a wafer cleaning device which is easy to remove crystal accumulation. Background Art

[0002] During the processing and manufacturing process, the wafer needs to undergo several processing processes such as doping implantation, deposition, etching and chemical mechanical grinding. These operations will leave residues and grinding fluid on the surface of the wafer. As the requirements for the cleanliness of the wafer surface become higher and higher, if they are not removed in time, it will affect the effect of subsequent processes and the quality of the chip. Therefore, a wafer cleaning device is needed to clean the polished wafer to provide a smooth and clean wafer surface. When cleaning the wafer, chemical cleaning is generally used. Chemical cleaning is the use of various chemical reagents or organic solvents to remove impurities attached to the surface of the object. During cleaning, a combination of rotary cleaning and spray cleaning is used. The wafer is rotated while cleaning fluid is supplied from a linear nozzle for cleaning to remove contaminants attached to the wafer surface for subsequent processing.

[0003] As shown in the announcement number: CN107086188B, a wafer cleaning device includes a cleaning tank, a wafer rack for carrying wafers, a circulation device, an online detection device for detecting the concentration of effective ingredients in the cleaning liquid, and an automatic liquid adding device. The cleaning tank is an ultrasonic cleaning tank. During cleaning, the cleaning liquid is discharged from the cleaning tank, filtered and heated in turn, and then enters the cleaning tank for circulation. The online detection device detects the concentration of effective ingredients in the cleaning liquid in real time and feeds back to the liquid adding device. The liquid adding device automatically controls the dripping of the cleaning liquid through a peristaltic pump. The present invention has a simple structure, a long contact time between the cleaning liquid and the wafer, a good cleaning effect, a fast cleaning rate, and the cleaning liquid can be reused, which reduces the waste of the cleaning liquid and reduces the cost. The automatic liquid adding process reduces the operating procedures and improves production efficiency.

[0004] When a common wafer cleaning device is used, although it can clean the wafer and the cleaning liquid can be reused, which reduces the cost, the component used to clamp the wafer limits the wafer along the outer contour of the wafer. However, a large amount of cleaning liquid crystals will accumulate at the contact position, reducing the cleaning quality of the wafer. In addition, when cleaning the wafer, the cleaning effect of the wafer at the outer end is poor. Summary of the invention

[0005] In order to overcome the technical defects of the prior art, the present invention provides a wafer cleaning device that is easy to remove crystal accumulation, which can achieve the purpose of improving the cleaning quality and cleaning effect of the wafer.

[0006] The technical solution adopted by the present invention is: it includes a cleaning box with a cleaning groove at one end, a cleaning component, a crystal removal component and a drying component, the cleaning groove is fixedly installed with an annular block on the upper end, and a placement rack for placing wafers is rotatably installed on the upper end of the annular block, an L-shaped mounting frame is fixedly installed at one end of the cleaning box, a cylinder is fixedly installed at one end of the L-shaped mounting frame, a square block is fixedly installed at the output end of the cylinder, the cleaning component is installed at one end of the square block, the drying component is installed at the other end of the square block, the crystal removal component is installed at one end of the annular block, an infusion cavity is opened inside the cleaning box, circular holes are opened in a circular array at one end of the cleaning groove, one end of the circular hole is connected with the infusion cavity, and the cleaning box is fixedly installed at one end of the cleaning groove. A square groove is provided at the end, and a collecting box is installed in the square groove. One end of the collecting box is connected to the infusion cavity through an infusion tube. An integrated control panel is fixedly installed at one end of the cleaning box. When in use, a controller is provided inside the integrated control panel for controlling various components. The collecting box is used to collect waste liquid generated by cleaning. One end of the infusion tube is a telescopic tube, and one end of the infusion tube is plugged into the collecting box. The circular hole is used to transport the waste liquid generated by cleaning. The crystal removing component is used to remove accumulated cleaning liquid crystals. The drying component is used to dry the cleaned wafers. The cleaning component is used to clean the wafers. The cylinder is used to move the square block up and down, and the placement rack is used to limit the position of the wafer.

[0007] Preferably, in order to enable the placement rack to rotate, a mounting groove is opened at the bottom of the cleaning tank, and a first motor is fixedly installed in the mounting groove, the output end of the first motor is fixedly connected to the placement rack, the first motor is electrically connected to the integrated control panel, the integrated control panel is used to control the first motor switch, the first motor is used to drive the placement rack, and a heat dissipation hole is opened at one end of the cleaning box for heat dissipation of the first motor.

[0008] Preferably, in order to clean the surface of the wafer, the cleaning component includes a first circular tube, a second circular tube and a liquid storage tank, one end of the first circular tube and the second circular tube are fixedly installed with an atomizing nozzle, the first circular tube is fixedly installed in the middle position of the lower end of the square block, a sliding groove is provided on one side of the upper end of the square block, a movable T-shaped block is installed in the sliding groove through a driving member, the second circular tube is fixedly installed at the lower end of the T-shaped block, the driving member is used to move the T-shaped block, and the T-shaped block can move in the sliding groove, the liquid storage tank is used to store cleaning liquid, one end of the liquid storage tank is provided with a liquid inlet with a hole plug inserted inside, and the atomizing nozzle is an existing structure for reducing the impact force of water flow.

[0009] Preferably, in order to enable the T-shaped block to move back and forth, the driving member includes a second motor and a lead screw, the lead screw is rotatably installed in the sliding groove, the second motor is fixedly installed on one side of the square block, the output end of the second motor is fixedly connected to the lead screw, the T-shaped block is threadedly connected to the lead screw, the second motor is electrically connected to the integrated control panel, the second motor is a servo motor that can rotate forward and reverse and is used to drive the lead screw, a control panel is provided at one end of the second motor, the integrated control panel is used to control the start and stop of the second motor, and the lead screw is used to change the position of the T-shaped block.

[0010] Preferably, in order to transport cleaning liquid into the first circular tube and the second circular tube, the liquid storage tank is fixedly installed on one side of the cleaning tank, a water pump is installed on the upper end of the liquid storage tank through a pipeline, an L-shaped hard pipe is fixedly installed on the output end of the water pump, one end of the L-shaped hard pipe is respectively connected with the first circular tube and the second circular tube through a telescopic tube, the water pump is fixedly installed on the upper end of the liquid storage tank, one end of the water pump is electrically connected to the integrated control panel, the L-shaped hard pipe is used to transport cleaning liquid, and the telescopic tube can be telescopic.

[0011] Preferably, in order to dry the cleaned wafers, the drying component includes a first fan, which is fixedly mounted on one side of the cleaning box, and is electrically connected to the integrated control panel. An air storage chamber is provided inside one end of the square block, and air outlet pipes are installed in a linear array on one side of the lower end of the square block, and one end of the air outlet pipes is connected to the air storage chamber, and one end of the first fan is connected to the air storage chamber through an air supply pipe. Several air outlet pipes are provided, and one end of each is a funnel-shaped structure. The integrated control panel can control the switch of the first fan, and the first fan is used to generate wind.

[0012] Preferably, in order to clean the crystals of the cleaning liquid at the contact point of the wafer, the crystal removal component includes a centrifugal fan, which is fixedly installed on one side of the cleaning box, a first annular groove is provided at one end of the annular block, a second annular groove is provided at the lower end of the placement rack, and L-shaped liquid suction holes are provided in a circular array at one end of the placement rack, one end of the placement rack is connected with the second annular groove at one end, and one end of the centrifugal fan is connected with the first annular groove through a first ventilation pipe. The centrifugal fan is electrically connected to the integrated control panel, and the integrated control panel is used to control the switch of the centrifugal fan. The first ventilation pipe is used to convey air, and the L-shaped liquid suction holes are used to convey accumulated cleaning liquid crystals. The sizes of the first annular groove and the second annular groove match, and the centrifugal fan is an existing structure.

[0013] Preferably, in order to improve the drying efficiency, suction plates with square cavities opened inside are fixedly installed at both ends of the cleaning tank, suction holes are opened in a linear array at one end of the suction plate, waterproof air-permeable valves are installed at one end of the first ventilation pipe and inside the suction holes, a Y-shaped ventilation pipe is fixedly installed at one end of the first ventilation pipe, one end of the Y-shaped ventilation pipe is connected to the suction plate, the Y-shaped ventilation pipe is used for conveying air, the waterproof air-permeable valve is an existing equipment, and two suction plates are symmetrically arranged.

[0014] Preferably, in order to control the circulation of the first ventilation duct and the Y-shaped ventilation duct, electric valves are fixedly installed at one end of the first ventilation duct and the Y-shaped ventilation duct, and the electric valves are electrically connected to the integrated control panel, and the integrated control panel is used to control the switching of the electric valves.

[0015] Preferably, in order to collect the accumulated cleaning fluid crystals, an annular hole is opened inside the first annular groove, one end of the annular hole is connected to the infusion cavity, a baffle is inserted into one end of the square block, one end of the baffle extends into the annular hole, and the annular hole is used to transport the cleaning fluid crystals.

[0016] The beneficial effects of the present invention are: 1. The present invention uses a centrifugal fan to transport the cleaning liquid crystals accumulated at the contact position between the placement rack and the wafer through the L-shaped suction hole to the first annular groove for storage, thereby preventing a large amount of cleaning liquid crystals from accumulating at the contact position and reducing the cleaning quality of the wafer.

[0017] 2. The present invention starts the first fan, and the wind generated is blown to the surface of the wafer through the air outlet pipe to dry it. At the same time, the centrifugal fan is started to suck air through the air suction holes, forming a blowing and exhausting cycle to improve the drying effect.

[0018] 3. The present invention first sprays cleaning liquid onto the surface of the wafer through the first circular tube for cleaning, and then reciprocates the second circular tube to clean the wafer comprehensively and evenly, with good cleaning effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall front view structure of the present invention.

[0020] Figure 2 It is a schematic diagram of the overall rear view structure of the present invention.

[0021] Figure 3 It is a schematic diagram of the overall cross-sectional structure of the present invention.

[0022] Figure 4 It is a schematic diagram of the connection structure of the placement rack of the present invention.

[0023] Figure 5It is a schematic diagram of the explosion structure of the annular block and the placement rack of the present invention.

[0024] Figure 6 It is a schematic diagram of the ring block connection structure of the present invention.

[0025] Figure 7 It is a schematic diagram of the cross-sectional structure of the placement rack of the present invention.

[0026] Figure 8 It is a schematic diagram of the connection structure of the cleaning component of the present invention.

[0027] Fig. 9 It is a schematic diagram of the square block connection structure of the present invention.

[0028] Fig.10 It is a schematic diagram of the air storage chamber connection structure of the present invention.

[0029] Explanation of the accompanying drawings: In the figure: 1, cleaning box; 2, cleaning tank; 3, cleaning assembly; 301, first round tube; 302, second round tube; 303, liquid storage tank; 304, atomizing nozzle; 305, sliding groove; 306, T-shaped block; 307, second motor; 308, lead screw; 309, water pump; 310, L-shaped hard tube; 311, telescopic tube; 4, crystal removal assembly; 401, centrifugal fan; 402, first annular groove; 403, second annular groove; 404, L-shaped liquid suction hole; 405, first ventilation pipe; 5, dry Drying component; 501, first fan; 502, air storage chamber; 503, air outlet pipe; 504, air supply pipe; 6, annular block; 7, placement rack; 8, L-shaped mounting rack; 9, cylinder; 10, square block; 11, infusion chamber; 12, round hole; 13, square slot; 14, collection box; 15, infusion tube; 16, integrated control panel; 17, first motor; 18, square cavity; 19, air suction plate; 20, air suction hole; 21, waterproof breathable valve; 22, Y-shaped ventilation pipe; 23, electric valve; 24, annular hole; 25, baffle. DETAILED DESCRIPTION

[0030] The present invention is further described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] like Figure 1-Figure 10As shown, this embodiment provides a wafer cleaning device that is easy to remove crystal accumulation, including a cleaning box 1 with a cleaning tank 2 at one end, a cleaning component 3, a crystal removing component 4 and a drying component 5, a ring block 6 is fixedly installed on the upper end of the cleaning tank 2, and a placement rack 7 for placing wafers is rotatably installed on the upper end of the ring block 6, an L-shaped mounting frame 8 is fixedly installed at one end of the cleaning box 1, a cylinder 9 is fixedly installed at one end of the L-shaped mounting frame 8, a square block 10 is fixedly installed at the output end of the cylinder 9, the cleaning component 3 is installed at one end of the square block 10, and the drying component 5 is installed at the other end of the square block 10. The cleaning component 4 is installed at one end of the annular block 6, an infusion cavity 11 is opened inside the cleaning box 1, and a circular hole 12 is opened in a circumferential array at one end of the cleaning tank 2, and one end of the circular hole 12 is connected to the infusion cavity 11. A square groove 13 is opened at one end of the cleaning box 1, and a collection box 14 is installed in the square groove 13. One end of the collection box 14 is connected to the infusion cavity 11 through an infusion tube 15. An integrated control panel 16 is fixedly installed at one end of the cleaning box 1, and an installation groove is opened at the bottom of the cleaning tank 2. A first motor 17 is fixedly installed in the installation groove. The output end of the first motor 17 is fixedly connected to the placement rack 7. The first The motor 17 is electrically connected to the integrated control panel 16. When in use, the wafer is first manually placed on the placement rack 7, and then the first motor 17 is controlled to start through the integrated control panel 16 to drive the placement rack 7 to rotate in a circle, and the wafer rotates in a circle accordingly. Then, the cylinder 9 at one end of the L-shaped mounting rack 8 is manually started to move the square block 10 downward, and then the cleaning component 3 is controlled through the integrated control panel 16 to clean the surface of the wafer, and the cleaning effect is good. Then, the crystal removal component 4 is controlled through the integrated control panel 16 to remove the cleaning liquid crystals accumulated at the contact position between the placement rack 7 and the wafer. The cleaning liquid is removed to prevent the accumulation of a large amount of cleaning liquid crystals at the contact position, which reduces the cleaning quality of the wafer. The waste liquid generated by cleaning is transported to the infusion cavity 11 through the circular hole 12 inside the cleaning tank 2, and then transported to the collection box 14 for recovery through the infusion tube 15. The collection box 14 and the infusion tube 15 can be manually separated, and then the collection box 14 is removed to reuse the waste liquid, saving resources. After cleaning, the drying component 5 is controlled by the integrated control panel 16 to quickly dry the surface of the wafer, and the drying effect is good. After drying, the square block 10 is reset, and finally the wafer is taken out.

[0032] like Figure 6 and Figure 7As shown, the crystal removal component 4 includes a centrifugal fan 401, which is fixedly installed on one side of the cleaning box 1, a first annular groove 402 is opened at one end of the annular block 6, a second annular groove 403 is opened at the lower end of the placement rack 7, and L-shaped liquid suction holes 404 are opened in a circular array at one end of the placement rack 7, and one end of the L-shaped liquid suction hole 404 is connected to the second annular groove 403, and one end of the centrifugal fan 401 is connected to the first annular groove 402 through a first ventilation pipe 405. The centrifugal fan 401 is electrically connected to the integrated control panel 16, and both ends of the cleaning tank 2 are fixed inside. An air suction plate 19 with a square cavity 18 is installed, and one end of the air suction plate 19 is provided with air suction holes 20 in a linear array. A waterproof breathable valve 21 is installed at one end of the first ventilation pipe 405 and inside the air suction holes 20. A Y-shaped ventilation pipe 22 is fixedly installed at one end of the first ventilation pipe 405, and one end of the Y-shaped ventilation pipe 22 is connected to the air suction plate 19. An electric valve 23 is fixedly installed at one end of the first ventilation pipe 405 and the Y-shaped ventilation pipe 22, and the electric valve 23 is electrically connected to the integrated control panel 16. The first annular groove 402 is provided with an annular hole 24, and the annular hole 2 4 is connected to the infusion cavity 11, and a baffle 25 is inserted at one end of the square block 10. When in use, the centrifugal fan 401 and the electric valve 23 at one end of the first ventilation pipe 405 are first started through the integrated control panel 16, and the electric valve 23 at one end of the Y-shaped ventilation pipe 22 is in a closed state. The suction force generated by the centrifugal fan 401 transports the cleaning liquid crystals and part of the cleaning liquid accumulated at the contact position between the placement rack 7 and the wafer to the L-shaped suction hole 404, and then transports them along the L-shaped suction hole 404 to the second annular groove 403, and flows into the first annular groove 403 under the action of gravity. 02, the wind absorbed by the centrifugal fan 401 is discharged through the exhaust port at one end. At this time, the waterproof breathable valve 21 at one end of the first ventilation pipe 405 is used to prevent impurities and cleaning liquid from flowing into the first ventilation pipe 405. After cleaning, the centrifugal fan 401 and the electric valve 23 at one end of the first ventilation pipe 405 are closed through the integrated control panel 16, and then the baffle 25 is manually moved outward to keep one end away from the annular hole 24, and the cleaning liquid crystals and part of the cleaning liquid flow into the infusion cavity 11 along the annular hole 24, and then are transported to the collection box 14 through the infusion tube 15 for recovery.

[0033] like Figure 8 and Fig. 9As shown, the cleaning assembly 3 includes a first circular tube 301, a second circular tube 302 and a liquid storage tank 303. Atomizing nozzles 304 are fixedly installed at one end of the first circular tube 301 and the second circular tube 302. The first circular tube 301 is fixedly installed at the middle position of the lower end of the square block 10. A sliding groove 305 is opened on one side of the upper end of the square block 10. A movable T-shaped block 306 is installed in the sliding groove 305 through a driving member. The second circular tube 302 is fixedly installed at the lower end of the T-shaped block 306. The driving member includes a second electric The second motor 307 and the lead screw 308 are rotatably mounted in the sliding groove 305, the second motor 307 is fixedly mounted on one side of the square block 10, the output end of the second motor 307 is fixedly connected to the lead screw 308, the T-shaped block 306 is threadedly connected to the lead screw 308, the second motor 307 is electrically connected to the integrated control panel 16, the liquid storage tank 303 is fixedly mounted on one side of the cleaning tank 1, a water pump 309 is installed on the upper end of the liquid storage tank 303 through a pipeline, and a water pump 309 is fixedly installed on the output end of the water pump 309 The L-shaped hard tube 310 has one end connected to the first round tube 301 and the second round tube 302 through the telescopic tube 311. When in use, the wafer is rotated first, and then the cleaning liquid is transported to the liquid storage tank 303. The water pump 309 is started through the integrated control panel 16 to transport the cleaning liquid in the liquid storage tank 303 to the L-shaped hard tube 310, and then transported to the first round tube 301 and the second round tube 302 through the telescopic tube 311. Then, the cleaning liquid is sprayed by the atomizer at one end of the first round tube 301. The head 304 sprays the cleaning liquid onto the surface of the wafer for cleaning. At the same time, the second motor 307 is started through the integrated control panel 16, driving the screw 308 to reciprocate in the sliding groove 305, so that the T-shaped block 306 moves back and forth in the sliding groove 305, and the second circular tube 302 moves back and forth accordingly, thereby spraying the cleaning liquid on the surface of the wafer for comprehensive and uniform cleaning with good cleaning effect. After cleaning, the water pump 309 is turned off through the integrated control panel 16, and then the second circular tube 302 is reset.

[0034] like Fig.10As shown, the drying component 5 includes a first fan 501, which is fixedly installed on one side of the cleaning box 1, and is electrically connected to the integrated control panel 16. An air storage chamber 502 is provided inside one end of the square block 10, and an air outlet pipe 503 is installed on one side of the lower end of the square block 10 in a linear array, and one end of the air outlet pipe 503 is connected to the air storage chamber 502. One end of the first fan 501 is connected to the air storage chamber 502 through an air supply pipe 504. When in use, the crystal element is rotated first, and then the first fan 501 is controlled to start through the integrated control panel 16. The wind generated by the first fan 501 is transported to the air storage chamber 502 inside one end of the square block 10 through the air supply pipe 504, and then evenly blown to the crystal element through the air outlet pipe 503. The surface of the element is dried, and at the same time, the centrifugal fan 401 and the electric valve 23 at one end of the Y-shaped ventilation pipe 22 are manually started through the integrated control panel 16. The electric valve 23 at one end of the first ventilation pipe 405 is in a closed state, and the air at the lower end of the wafer is sucked into the square cavity 18 through the suction hole 20 at one end of the suction plate 19, and then sucked into the centrifugal fan 401 through the Y-shaped ventilation pipe 22, and finally discharged through the exhaust port at one end thereof, thereby forming a blowing and exhausting cycle to improve the drying effect of the wafer. At this time, the waterproof breathable valve 21 prevents the cleaning liquid from flowing into the interior of the square cavity 18. After drying, the centrifugal fan 401, the electric valve 23 and the first fan 501 can be turned off through the integrated control panel 16.

[0035] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for illustrating the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which shall fall within the scope of the present invention to be protected. The scope of protection of the present invention shall be defined by the attached claims and their equivalents.

Claims

1. A wafer cleaning device for easily removing crystal accumulation, comprising a cleaning box (1) with a cleaning tank (2) at one end, a cleaning component (3), a crystal removal component (4) and a drying component (5), wherein an annular block (6) is fixedly mounted on the upper end of the cleaning tank (2), and a placement rack (7) for placing wafers is rotatably mounted on the upper end of the annular block (6), characterized in that: An L-shaped mounting frame (8) is fixedly mounted on one end of the cleaning box (1), a cylinder (9) is fixedly mounted on one end of the L-shaped mounting frame (8), a square block (10) is fixedly mounted on the output end of the cylinder (9), the cleaning component (3) is mounted on one end of the square block (10), the drying component (5) is mounted on the other end of the square block (10), the crystal removal component (4) is mounted on one end of the annular block (6), an infusion cavity (11) is provided inside the cleaning box (1), circular holes (12) are provided in a circumferential array at one end of the cleaning tank (2), one end of the circular holes (12) is connected to the infusion cavity (11), a square groove (13) is provided at one end of the cleaning box (1), a collection box (14) is mounted in the square groove (13), one end of the collection box (14) is connected to the infusion cavity (11) through an infusion tube (15), and an integrated control panel (16) is fixedly mounted on one end of the cleaning box (1).

2. The wafer cleaning device for easily removing crystal accumulation according to claim 1, characterized in that: The cleaning tank (2) has an installation slot at the bottom, a first motor (17) is fixedly installed in the installation slot, an output end of the first motor (17) is fixedly connected to the placement rack (7), and the first motor (17) is electrically connected to the integrated control panel (16).

3. The wafer cleaning device for easily removing crystal accumulation according to claim 1, characterized in that: The cleaning assembly (3) comprises a first circular tube (301), a second circular tube (302) and a liquid storage tank (303); an atomizing nozzle (304) is fixedly mounted on one end of each of the first circular tube (301) and the second circular tube (302); the first circular tube (301) is fixedly mounted at a middle position of the lower end of the square block (10); a sliding groove (305) is provided on one side of the upper end of the square block (10); a movable T-shaped block (306) is mounted in the sliding groove (305) via a driving member; and the second circular tube (302) is fixedly mounted at the lower end of the T-shaped block (306).

4. The wafer cleaning device for easily removing crystal accumulation according to claim 3 is characterized in that: The driving member comprises a second motor (307) and a lead screw (308); the lead screw (308) is rotatably mounted in the sliding groove (305); the second motor (307) is fixedly mounted on one side of the square block (10); an output end of the second motor (307) is fixedly connected to the lead screw (308); the T-shaped block (306) is threadedly connected to the lead screw (308); and the second motor (307) is electrically connected to the integrated control panel (16).

5. The wafer cleaning device for easily removing crystal accumulation according to claim 4 is characterized in that: The liquid storage tank (303) is fixedly mounted on one side of the cleaning tank (1); a water pump (309) is mounted on the upper end of the liquid storage tank (303) via a pipeline; an L-shaped hard pipe (310) is fixedly mounted on the output end of the water pump (309); one end of the L-shaped hard pipe (310) is respectively connected to the first circular pipe (301) and the second circular pipe (302) via a telescopic pipe (311).

6. The wafer cleaning device for easily removing crystal accumulation according to claim 1, characterized in that: The drying component (5) comprises a first fan (501), the first fan (501) being fixedly mounted on one side of the cleaning box (1), the first fan (501) being electrically connected to the integrated control panel (16), an air storage chamber (502) being provided inside one end of the square block (10), an air outlet pipe (503) being installed in a linear array on one side of the lower end of the square block (10), one end of the air outlet pipe (503) being connected to the air storage chamber (502), and one end of the first fan (501) being connected to the air storage chamber (502) via an air supply pipe (504).

7. The wafer cleaning device for easily removing crystal accumulation according to claim 1, characterized in that: The crystal removal component (4) comprises a centrifugal fan (401), wherein the centrifugal fan (401) is fixedly mounted on one side of the cleaning box (1); a first annular groove (402) is formed at one end of the annular block (6); a second annular groove (403) is formed at the lower end of the placement rack (7); L-shaped liquid suction holes (404) are formed in a circular array at one end of the placement rack (7); one end of the L-shaped liquid suction holes (404) is connected to the second annular groove (403); one end of the centrifugal fan (401) is connected to the first annular groove (402) via a first ventilation pipe (405); and the centrifugal fan (401) is electrically connected to the integrated control panel (16).

8. The wafer cleaning device for easily removing crystal accumulation according to claim 7, characterized in that: An air suction plate (19) with a square cavity (18) formed therein is fixedly mounted at both ends of the cleaning tank (2); air suction holes (20) are formed in a linear array at one end of the air suction plate (19); a waterproof air permeable valve (21) is mounted at one end of the first ventilation pipe (405) and inside the air suction holes (20); a Y-shaped ventilation pipe (22) is fixedly mounted at one end of the first ventilation pipe (405); and one end of the Y-shaped ventilation pipe (22) is connected to the air suction plate (19).

9. The wafer cleaning device for easily removing crystal accumulation according to claim 8, characterized in that: An electric valve (23) is fixedly mounted on one end of each of the first ventilation pipe (405) and the Y-shaped ventilation pipe (22); the electric valve (23) is electrically connected to the integrated control panel (16).

10. The wafer cleaning device for easily removing crystal accumulation according to claim 9, characterized in that: An annular hole (24) is provided inside the first annular groove (402), one end of the annular hole (24) is connected to the infusion cavity (11), and a baffle (25) is inserted into one end of the square block (10).

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