Spherical phased-array antenna efficient heat dissipation assembly and spherical phased-array antenna thereof

By designing the spherical phased array antenna efficient heat dissipation components and using integrated thermal conductivity structure and heat dissipation teeth design, the existing spherical phased array antenna has been solved, and efficient heat dissipation and reduced production costs are achieved.

CN119560759APending Publication Date: 2025-03-04XIAN AEROSPACE TIANHUI DATA TECH CO LTD
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Patent Information

Application Number
CN202411688218.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-25
Publication Date
2025-03-04

AI Technical Summary

Technical Problem

The existing spherical phased array antenna has low heat dissipation efficiency and cannot meet the needs of efficient heat dissipation. At the same time, the structure is complex and the maintenance is cumbersome, which increases production costs and low competitiveness of products.

Method used

An efficient heat dissipation component of spherical phased array antenna is designed, including the upper thermal control panel, the right support arm, the bottom thermal control panel, the left thermal control support arm and the thermal control fan. Through the integrated thermal conductivity structure and heat dissipation teeth design, an efficient heat dissipation air duct is formed, and sealing measures are designed at the splicing.

Benefits of technology

It realizes efficient heat dissipation of spherical phased array antennas, shortens production cycles, reduces production costs, and increases the adaptability and competitiveness of the products.

✦ Generated by Eureka AI based on patent content.

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Abstract

The spherical phased-array antenna efficient heat dissipation assembly comprises an upper-layer thermal control board, a bottom-layer thermal control board, a thermal control fan and the like, and the upper-layer thermal control board, a right side supporting arm, the bottom-layer thermal control board and a left side thermal control supporting arm are jointly spliced to form a heat dissipation air channel cavity; heat dissipation teeth in the air duct direction are designed on an upper-layer thermal control plate, a bottom-layer thermal control plate and a left-side thermal control supporting arm on the inner wall of an air duct cavity, and thermal control fans and fan dust covers are installed in front of and behind the cavity, so that the heat dissipation requirements of all modules installed on the upper-layer thermal control plate, the bottom-layer thermal control plate and the left-side thermal control supporting arm are efficiently met; the production cycle of the whole machine is greatly shortened, meanwhile, the production cost is reduced, sealing measures are designed at the mounting positions of the efficient heat dissipation assembly and the antenna housing and the base and at the splicing positions of the upper-layer thermal control board and the right side supporting arm, an air duct cavity is only communicated with the outside and completely isolated from internal devices of the product, and the adaptability of the product is improved.
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Description

Technical Field

[0001] The present invention relates to the technical field of phased array antennas, and in particular to a spherical phased array antenna high-efficiency heat dissipation component and a spherical phased array antenna. Background Art

[0002] Spherical phased array antennas can achieve full-range scanning coverage of the airspace, which has an incomparable advantage over the 120° airspace scanning coverage of planar phased array antennas in phased array antenna systems. They can be used in fixed, vehicle-mounted, airborne, and ship-mounted communication systems, and have strong platform adaptability. However, they are all used in unobstructed outdoor environments, so the products are also exposed to wind and sun all year round, with high ambient temperatures. At the same time, there are also heat-generating power devices inside, which can easily cause component damage due to the inability to dissipate heat in time.

[0003] The currently disclosed heat dissipation forms are heat dissipation through heat dissipation holes, or heat dissipation through water pipes and heat conduction pipes combined with heat box-type air cooling. The heat dissipation efficiency of the heat dissipation hole form is low, and it cannot meet the heat dissipation requirements of the spherical array antenna. In addition, since the spherical array antenna is exposed to the outside all year round in an unshaded outdoor environment, in some severe weather such as wind and rain, the spherical array antenna lacks a protective structure, so it is very easy to cause damage to the antenna array, and then cause the device to be damaged and unusable. The heat dissipation form of the water pipe, heat conduction pipe and heat box-type air cooling is complex in structure and requires manual maintenance according to weather and usage requirements. The operation is cumbersome, and it greatly increases the production cost, and the product competitiveness is low. Therefore, high efficiency, low cost, easy operation, and easy maintenance have become key technologies that need to be urgently solved in the heat dissipation design of spherical phased array antenna products. Summary of the invention

[0004] The object of the present invention is to provide a beam control system for solving the frequency hopping problem of a phased array antenna system, so as to solve the above technical problems.

[0005] To achieve the above purpose, the present invention adopts the following technical solutions: A spherical phased array antenna high-efficiency heat dissipation component comprises an upper thermal control plate, a right support arm, a bottom thermal control plate, a left thermal control support arm, and a thermal control fan, wherein a digital analog conversion module is installed on the upper surface of the upper thermal control plate, a heat dissipation surface of a heating device of the digital analog conversion module is located on the bottom surface thereof, the bottom surface of the digital analog conversion module is in close contact with the upper surface of the upper thermal control plate, and a heat dissipation tooth is provided on the lower surface of the upper thermal control plate; The lower surface of the bottom thermal control plate is equipped with a power board and a baseband. The heat generating components of the power board and the baseband conduct heat to the upper surface of the power board and the baseband through an integrated heat conducting structure design. The upper surface of the power board and the baseband is in close contact with the lower surface of the bottom thermal control plate. The upper surface of the bottom thermal control plate is provided with heat dissipation teeth. The left thermal control support arm is an arc-shaped cavity structure, and a channel unit module is installed on the arc-shaped inner cavity side wall of the left thermal control support arm. The heat generating device of the channel unit module conducts heat to the bottom shell through an integrated heat conduction structure design, and the bottom surface of the shell of the channel unit module is closely installed on the arc-shaped inner cavity side wall of the left thermal control support arm, and heat dissipation teeth are arranged on the outer side of the arc-shaped inner cavity side wall of the left thermal control support arm; The thermal control fan is installed at the inlet and outlet of the heat dissipation duct formed by splicing the upper thermal control plate, the right support arm, the bottom thermal control plate, and the left thermal control support arm.

[0006] It also includes a fan dust cover, which covers the thermal control fan at the inlet and outlet of the heat dissipation duct and is installed in the outer ring of the structure formed by splicing the upper thermal control plate, the right support arm, the bottom thermal control plate, and the left thermal control support arm.

[0007] The heat dissipation teeth of the upper thermal control plate, the bottom thermal control plate, and the left thermal control support arm are in the same direction. The upper thermal control plate, the right support arm, the bottom thermal control plate, and the left thermal control support arm are spliced ​​and installed in the upper, right, lower, and left directions to form a heat dissipation duct inner cavity. The upper thermal control plate, the right support arm, the bottom thermal control plate, and the left thermal control support arm are provided with sealing grooves for installing sealing strips at the splicing. The right support arm is an arc-shaped cavity structure.

[0008] Utilizing the above-mentioned high-efficiency heat dissipation component, an antenna cover and a spherical antenna array are respectively installed on the inner and outer circular flanges on the upper surface of the heat dissipation component. The antenna cover covers the spherical antenna array inside. The inner ring flange at the bottom of the heat dissipation component is connected to the base through an inner ring lug, and a sealing groove for installing a sealing strip is provided between the high-efficiency heat dissipation component and the antenna cover and the base.

[0009] Compared with the prior art, the present invention has the following advantages: the present invention efficiently solves the heat dissipation requirements of each module installed on the upper thermal control plate, the bottom thermal control plate, and the left thermal control support arm, greatly shortens the production cycle of the whole machine and reduces the production cost. At the same time, the high-efficiency heat dissipation component is designed with sealing measures at the installation points with the antenna cover and the base, as well as at the joints of the upper thermal control plate, the right support arm, the bottom thermal control plate, and the left thermal control support arm, so that the air duct cavity is only connected to the outside world and is completely isolated from the internal devices of the product, thereby increasing the adaptability of the product.

[0010] The present invention can meet the heat dissipation requirements of the spherical phased array antenna as a whole, and has the advantages of strong feasibility, low complexity, short production cycle, low production cost, and strong platform adaptability. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 Schematic diagram of the spherical phased array antenna structure.

[0012] Figure 2 Schematic diagram of the heat dissipation component structure.

[0013] Figure 3 This is a schematic diagram of the assembly of high-efficiency heat dissipation components and heating modules.

[0014] In the figure: 1-radome; 2-spherical antenna array; 3-high-efficiency heat dissipation component; 4-base; 5-digital-to-analog conversion module; 6-upper thermal control board; 7-right support arm; 8-bottom thermal control board; 9-power board; 10-baseband; 11-channel unit module; 12-left thermal control support arm; 13-thermal control fan; 14-fan dust cover. DETAILED DESCRIPTION

[0015] The present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0016] A spherical phased array antenna high-efficiency heat dissipation component comprises an upper thermal control plate 6, a right support arm 7, a bottom thermal control plate 8, a left thermal control support arm 12, and a thermal control fan 13. The upper surface of the upper thermal control plate 6 is provided with a digital analog conversion module 5, the heat dissipation surface of the main heat generating device of the digital analog conversion module 5 is located on its bottom surface, the bottom surface of the digital analog conversion module 5 is in close contact with the upper surface of the upper thermal control plate 6, and the lower surface of the upper thermal control plate 6 is provided with heat dissipation teeth; The lower surface of the bottom thermal control plate 8 is installed with a power board 9 and a baseband 10. The heat generating components of the power board 9 and the baseband 10 conduct heat to the upper surface of the power board 9 and the baseband 10 through an integrated heat conducting structure design. The upper surface of the power board 9 and the baseband 10 is in close contact with the lower surface of the bottom thermal control plate 8. The upper surface of the bottom thermal control plate 8 is provided with heat dissipation teeth. The left thermal control support arm 12 is an arc-shaped cavity structure, and a channel unit module 11 is installed on the arc-shaped inner cavity side wall of the left thermal control support arm 12. The heating device of the channel unit module 11 conducts heat to the bottom shell through an integrated heat conduction structure design. The bottom surface of the shell of the channel unit module 11 is closely installed on the arc-shaped inner cavity side wall of the left thermal control support arm 12, and heat dissipation teeth are arranged on the outer side of the arc-shaped inner cavity side wall of the left thermal control support arm 12; The thermal control fan 13 is installed at the inlet and outlet of the heat dissipation duct formed by splicing the upper thermal control plate 6, the right support arm 7, the bottom thermal control plate 8, and the left thermal control support arm 12.

[0017] 2. A spherical phased array antenna high-efficiency heat dissipation component as described in claim 1, characterized in that it also includes a fan dust cover 14, which covers the thermal control fan 13 at the inlet and outlet of the heat dissipation air duct and is installed in the outer ring of the structure formed by splicing the upper thermal control plate 6, the right support arm 7, the bottom thermal control plate 8, and the left thermal control support arm 12.

[0018] The heat dissipation teeth of the upper thermal control plate 6, the bottom thermal control plate 8, and the left thermal control support arm 12 are in the same direction. The upper thermal control plate 6, the right support arm 7, the bottom thermal control plate 8, and the left thermal control support arm 12 are spliced ​​and installed in the upper, right, lower, and left directions to form a heat dissipation duct inner cavity. The upper thermal control plate 6, the right support arm 7, the bottom thermal control plate 8, and the left thermal control support arm 12 are provided with a sealing groove for installing a sealing strip at the splicing. The right support arm 7 is an arc-shaped cavity structure.

[0019] Utilizing the efficient heat dissipation component 3, the antenna cover 1 and the spherical antenna array 2 are respectively installed on the inner and outer circular flanges on the upper surface of the heat dissipation component 3, the antenna cover 1 covers the spherical antenna array 2 inside, and the inner ring flange at the bottom of the heat dissipation component 3 is connected to the base 4 through the inner ring lug, and a sealing groove for installing a sealing strip is provided between the efficient heat dissipation component 3 and the antenna cover 1 and the base 4.

[0020] The upper thermal control plate, the right support arm, the bottom thermal control plate, and the left thermal control support arm of the present invention are spliced ​​together to form a heat dissipation duct cavity. The upper thermal control plate, the bottom thermal control plate, and the left thermal control support arm structures on the inner wall of the duct cavity are designed with heat dissipation teeth along the duct direction, and thermal control fans and fan dust covers are installed in front and behind the cavity, which effectively solves the heat dissipation requirements of various modules installed on the upper thermal control plate, the bottom thermal control plate, and the left thermal control support arm, greatly shortening the production cycle of the whole machine while reducing the production cost. At the same time, the high-efficiency heat dissipation component is designed with sealing measures at the installation place with the antenna cover and the base, as well as at each splicing place of the upper thermal control plate, the right support arm, the bottom thermal control plate, and the left thermal control support arm, so that the duct cavity is only connected to the outside world and is completely isolated from the internal components of the product, which increases the adaptability of the product.

[0021] The present invention can meet the heat dissipation requirements of the spherical phased array antenna as a whole, and has the advantages of strong feasibility, low complexity, short production cycle, low production cost, and strong platform adaptability.

[0022] The above is a preferred embodiment of the present invention. For ordinary technicians in this field, according to the teachings of the present invention, without departing from the principles and spirit of the present invention, changes, modifications, substitutions and variations made to the implementation methods are still within the scope of protection of the present invention.

Claims

1. A spherical phased array antenna high-efficiency heat dissipation component, characterized in that: It includes an upper thermal control plate, a right support arm, a bottom thermal control plate, a left thermal control support arm, and a thermal control fan. A digital analog conversion module is installed on the upper surface of the upper thermal control plate. The heat dissipation surface of the heating device of the digital analog conversion module is located on its bottom surface. The bottom surface of the digital analog conversion module is in close contact with the upper surface of the upper thermal control plate. The lower surface of the upper thermal control plate is provided with heat dissipation teeth. The lower surface of the bottom thermal control plate is equipped with a power board and a baseband. The heat generating components of the power board and the baseband conduct heat to the upper surface of the power board and the baseband through an integrated heat conducting structure design. The upper surface of the power board and the baseband is in close contact with the lower surface of the bottom thermal control plate. The upper surface of the bottom thermal control plate is provided with heat dissipation teeth. The left thermal control support arm is an arc-shaped cavity structure, and a channel unit module is installed on the arc-shaped inner cavity side wall of the left thermal control support arm. The heat generating device of the channel unit module conducts heat to the bottom shell through an integrated heat conduction structure design, and the bottom surface of the shell of the channel unit module is closely installed on the arc-shaped inner cavity side wall of the left thermal control support arm, and heat dissipation teeth are arranged on the outer side of the arc-shaped inner cavity side wall of the left thermal control support arm; The thermal control fan is installed at the inlet and outlet of the heat dissipation duct formed by splicing the upper thermal control plate, the right support arm, the bottom thermal control plate, and the left thermal control support arm.

2. The spherical phased array antenna high-efficiency heat dissipation component according to claim 1, characterized in that: It also includes a fan dust cover, which covers the thermal control fan at the inlet and outlet of the heat dissipation duct and is installed in the outer ring of the structure formed by splicing the upper thermal control plate, the right support arm, the bottom thermal control plate, and the left thermal control support arm.

3. The spherical phased array antenna high-efficiency heat dissipation component according to claim 1, characterized in that: The heat dissipation teeth of the upper thermal control plate, the bottom thermal control plate and the left thermal control support arm are in the same direction. The upper thermal control plate, the right support arm, the bottom thermal control plate and the left thermal control support arm are spliced ​​and installed in the upper, right, lower and left directions to form an inner cavity of the heat dissipation duct. The upper thermal control plate, the right support arm, the bottom thermal control plate and the left thermal control support arm are provided with sealing grooves for installing sealing strips at the splicing positions.

4. The spherical phased array antenna high-efficiency heat dissipation component according to claim 1, characterized in that: The right support arm is an arc-shaped cavity structure.

5. A spherical phased array antenna, characterized in that: Utilizing the high-efficiency heat dissipation component described in any one of claims 1 to 4, a radome and a spherical antenna array are respectively installed on the inner and outer circular flanges on the upper surface of the heat dissipation component, the radome covers the spherical antenna array inside, the inner flange at the bottom of the heat dissipation component is connected to the base via an inner protrusion, and a sealing groove for installing a sealing strip is provided between the high-efficiency heat dissipation component and the radome and the base.

Citation Information

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