Antenna and electronic equipment

Abstract

The invention relates to an antenna and electronic equipment, which are applied to the technical field of antennae, and the antenna comprises a radiation layer and a feed layer, and the radiation layer is arranged above the feed layer; the radiation layer comprises a first metal layer, a first dielectric layer and a second metal layer; the first dielectric layer is arranged between the first metal layer and the second metal layer; at least one through hole is formed in the first metal layer, and one radiation patch is arranged in each through hole; a plurality of first metal through holes penetrating through the first medium are formed in the first medium layer, the first metal through holes can define first resonant cavities with the same number as the radiation patches, and the first resonant cavities are arranged below the radiation patches in a one-to-one correspondence mode; the second metal layer is provided with first coupling slots with the same number as the radiation patches, and the first coupling slots are arranged below the first resonant cavities in a one-to-one correspondence mode. The problem that a traditional surface slotted antenna unit is narrow in bandwidth is solved.

Description

Technical Field

[0001] The present application relates to the field of antenna technology, and in particular to an antenna and an electronic device. Background Art

[0002] High-gain antennas are mainly divided into two forms: feed type and array type. For example, traditional parabolic antennas have high gain and wide bandwidth, and are widely used in satellite communications and radar systems. However, the disadvantages of large size, heavy weight and high profile also limit their application in modern communication systems. Although the flat reflective array can relatively reduce the weight and volume of the antenna, the feed source needs to be placed at a focal position several wavelengths away from the reflective surface, which still makes the antenna have a relatively high profile as a whole. In contrast, the flat-panel array antenna using a fully parallel feed network has many advantages such as low profile, compact structure, and small size, and has therefore attracted widespread attention from researchers at home and abroad.

[0003] In the related art, an antenna unit with a slotted surface is usually used. However, the antenna obtained in this way has a narrow bandwidth, which restricts the application of the antenna to a certain extent. Summary of the invention

[0004] The present application provides an antenna and an electronic device to solve the problem of narrow bandwidth of a traditional surface slotted antenna unit in the prior art.

[0005] In a first aspect, an embodiment of the present application provides an antenna, comprising: a radiation layer and a feeding layer, wherein the radiation layer is arranged above the feeding layer;

[0006] The radiation layer comprises: a first metal layer, a first dielectric layer and a second metal layer; the first dielectric layer is arranged between the first metal layer and the second metal layer;

[0007] At least one through hole is provided on the first metal layer, and a radiation patch is provided in each through hole;

[0008] A plurality of first metal through holes penetrating the first medium are arranged in the first dielectric layer, the first metal through holes can enclose the same number of first resonant cavities as the number of the radiation patches, and the first resonant cavities are arranged below the radiation patches in a one-to-one correspondence;

[0009] The second metal layer is provided with first coupling slots having the same number as the radiation patches, and the first coupling slots are arranged below the first resonant cavity in a one-to-one correspondence.

[0010] Optionally, the size of the first resonant cavity is larger than the through hole, and two adjacent first resonant cavities share a first metal through hole on the same frame.

[0011] Optionally, the feed layer comprises: a third metal layer and a second dielectric layer;

[0012] A plurality of second metal through holes penetrating the second medium are arranged in the second dielectric layer, and the second metal through holes can form a power divider.

[0013] Optionally, the number of the through holes is 4X, where X is a positive integer; the feed layer further includes: a third dielectric layer and a fourth metal layer;

[0014] A plurality of third metal through holes penetrating the third medium are arranged in the third dielectric layer, and the third metal through holes can enclose a second resonant cavity having a quarter of the number of the radiation patches;

[0015] The second resonant cavities are arranged one by one below the first coupling slot group, and the first coupling slot group includes four adjacent first coupling slots;

[0016] The fourth metal layer is provided with second coupling slots having the same number as the second resonant cavities, and the second coupling slots are provided below the second resonant cavities in a one-to-one correspondence.

[0017] Optionally, the third metal through hole in the third dielectric layer can be aligned with the first metal through hole at the same position in the first dielectric layer.

[0018] Optionally, the four first coupling slots in the first coupling slot group are in a 2*2 array form.

[0019] Optionally, the radiation patch has an axisymmetric structure, and each side of the radiation patch has a groove.

[0020] Optionally, the radiation patch is a rectangular structure, the radiation patch has a first slot at the center of the first side, and has a second slot at the center of the second side of the radiation patch, the length of the first slot is greater than the length of the second slot, and the second side is adjacent to the first side.

[0021] Optionally, according to a target number of coupling gaps in the metal layer above the second dielectric layer, the second metal through holes are grouped into a power divider of the target number.

[0022] Optionally, the number of the through holes is M, M is N*N, and N is an even number;

[0023] The through holes are arranged in the first metal layer in an N*N array form.

[0024] In a second aspect, an embodiment of the present application provides an electronic device, including: an electronic device body and the antenna described in the first aspect.

[0025] The antenna provided in an embodiment of the present application includes a radiation layer and a feeding layer, wherein the radiation layer is arranged above the feeding layer; the radiation layer includes: a first metal layer, a first dielectric layer and a second metal layer; the first dielectric layer is arranged between the first metal layer and the second metal layer; at least one through hole is arranged on the first metal layer, and a radiation patch is arranged in each through hole; a plurality of first metal through holes penetrating the first dielectric are arranged in the first dielectric layer, and the first metal through holes can enclose a first resonant cavity having the same number as the radiation patches, and the first resonant cavity is arranged one-to-one below the radiation patch; the second metal layer is provided with first coupling slots having the same number as the radiation patches, and the first coupling slots are arranged one-to-one below the first resonant cavity. In this way, the radiation layer is fed through the feeding layer. Since the first dielectric layer is arranged between the first metal layer and the second metal layer, and the first metal through hole of the first dielectric layer is arranged, the above three layers form a SIC. Therefore, the SIC of the first dielectric layer can be fed and resonated through the total coupling gap of the second metal layer, and then electromagnetic waves are radiated through the radiation patch in the first metal layer. Compared with the slot radiation method in the related art, the patch radiation method can make the antenna radiate a higher bandwidth. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0027] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0028] Figure 1 A structural diagram of a SIW in an antenna provided in an embodiment of the present application;

[0029] Figure 2 A schematic diagram of a metal through hole of an antenna provided in an embodiment of the present application;

[0030] Figure 3 A structural diagram of a SIC in an antenna provided in an embodiment of the present application;

[0031] Figure 4 A structural diagram of an antenna provided in one embodiment of the present application;

[0032] Figure 5 A structural diagram of a power divider in an antenna provided in an embodiment of the present application;

[0033] Figure 6 A structural diagram of an antenna provided in another embodiment of the present application;

[0034] Figure 7 A structural diagram of a radiation unit in an antenna provided in an embodiment of the present application;

[0035] Figure 8 A structural diagram of a PCB in an antenna provided in an embodiment of the present application;

[0036] Fig. 9 A structural diagram of a PCB in an antenna provided in another embodiment of the present application;

[0037] Fig.10 This is a diagram of S11 simulation results of an antenna provided in one embodiment of the present application;

[0038] Fig.11 A graph showing the gain simulation results of an antenna provided in one embodiment of the present application;

[0039] Fig.12 This is a diagram of S11 simulation results of an antenna provided in another embodiment of the present application;

[0040] Fig.13 A graph showing the gain simulation results of an antenna provided in another embodiment of the present application.

[0041] Reference numerals:

[0042] Low-loss dielectric substrate 101, upper surface 102, lower surface 103, metal through hole 104, radiation layer 1, first metal layer 11, through hole 111, radiation patch 112, first dielectric layer 12, first metal through hole 121, second metal layer 13, first coupling slot 131, feeding layer 2, third metal layer 21, second dielectric layer 22, second metal through hole 221, third dielectric layer 23, third metal through hole 231, fourth metal layer 24, second coupling slot 241, radiation patch 701 resonant cavity 702, coupling slot 703. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0044] It should be noted that, in the description of the present application, the terms "lateral", "longitudinal", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0045] Before further describing the embodiments of the present application in detail, the nouns and terms involved in the embodiments of the present application are explained. The nouns and terms involved in the embodiments of the present application are subject to the following interpretations.

[0046] The antenna of the present application adopts a substrate integrated waveguide (SIW) and substrate integrated cavity (SIC) structure, which is a new structure that can planarize the traditional metal waveguide. Figure 1 The upper surface 102 and the lower surface 103 of the low-loss dielectric substrate 101 are both metal surfaces, and the metal through holes 104 are densely arranged. The upper and lower metal layers are equivalent to the upper and lower walls of the rectangular waveguide. When the spacing between the holes is small enough, such a structure can firmly bind the electromagnetic energy in the channel between the two rows of holes, achieving a transmission effect similar to that of a rectangular waveguide. At this time, the two rows of through holes are equivalent to the side walls of the rectangular waveguide. To achieve such an effect, refer to Figure 2 The specific parameter indicators that need to be met are as follows: s<2d, d<2w.

[0047] Among them, s refers to the distance between holes, d refers to the diameter of the cylindrical hole, and w refers to the distance between two rows of through holes.

[0048] SIC is based on the SIW transmission structure, such as Figure 3 As shown in the figure, a closed cavity is formed by adding the same metal pillars at both ends. SIW and rectangular waveguide have similar characteristics. Similarly, SIC and rectangular waveguide resonant cavities also have similar characteristics. Therefore, the equivalent length and width of the resonant cavity can be obtained by the conversion formula, and then the resonant frequency of each mode inside the substrate integrated waveguide resonator can be obtained according to the calculation formula of the resonant frequency of the rectangular waveguide resonant cavity.

[0049] SIW and SIC structures can greatly enrich the form of antennas and make great contributions to the planarization, miniaturization and integration of antennas.

[0050] An embodiment of the present application provides an antenna, which can be applied to any electronic device using an antenna. Figure 4 As shown, the antenna comprises: a radiation layer 1 and a feeding layer 2, wherein the radiation layer is arranged above the feeding layer;

[0051] The radiation layer includes: a first metal layer 11, a first dielectric layer 12 and a second metal layer 13; the first dielectric layer is arranged between the first metal layer and the second metal layer;

[0052] At least one through hole is provided on the first metal layer, and a radiation patch is provided in each through hole;

[0053] A plurality of first metal through holes 121 penetrating the first medium are arranged in the first dielectric layer, and the first metal through holes can enclose the same number of first resonant cavities as the number of the radiation patches, and the first resonant cavities are arranged below the radiation patches in a one-to-one correspondence;

[0054] The second metal layer is provided with first coupling slots 131 having the same number as the radiation patches, and the first coupling slots are arranged below the first resonant cavity in a one-to-one correspondence.

[0055] In some embodiments, the radiation layer is fed through the feeding layer. Since the first dielectric layer is arranged between the first metal layer and the second metal layer, and the first metal through hole of the first dielectric layer is arranged, the above three layers form a SIC. Therefore, the SIC of the first dielectric layer can be fed and resonated through the total coupling gap of the second metal layer, and then electromagnetic waves are radiated through the radiation patch in the first metal layer. Compared with the slot radiation method in the related art, the patch radiation method can make the antenna radiate a higher bandwidth.

[0056] The shape of the through hole can be any geometric shape, such as a rectangle, a circle, a polygon, etc. The shape of the radiation patch can also be any geometric shape, such as a rectangle, a circle, a polygon, etc. The shape of the through hole and the shape of the radiation patch can be the same or different. Exemplarily, the shape of the through hole and the shape of the radiation patch are both square.

[0057] In an optional embodiment, the number of the through holes is M, M is N*N, and N is an even number;

[0058] The through holes are arranged in the first metal layer in an N*N array form.

[0059] In some embodiments, by arranging the through holes in an N*N array form, the size of the antenna can be reduced and the antenna can be prevented from being too long.

[0060] Exemplarily, the number of through holes may be 16, in a 4*4 array, uniformly arranged in the first metal layer.

[0061] In an optional embodiment, the first resonant cavity can surround the through hole, and two adjacent first resonant cavities share a first metal through hole on the same frame.

[0062] By setting the first resonant cavity larger than the through hole, the through hole is surrounded, so that the electromagnetic wave fed from the coupling slot resonates in the resonant cavity and can be radiated by the radiation patch in the through hole as much as possible, thereby improving the radiation effect of the electromagnetic wave. In addition, by having two adjacent first resonant cavities share the first metal through hole on the same frame, the cost of manufacturing the first metal through hole is saved.

[0063] In an optional embodiment, the feed layer includes: a third metal layer 21 and a second dielectric layer 22;

[0064] A plurality of second metal through holes 221 penetrating the second medium are disposed in the second dielectric layer, and the second metal through holes can form a power divider.

[0065] In some embodiments, see Figure 5 By setting a second metal through hole, its function is similar to that of a metal wall, which has a binding effect on electromagnetic waves and prevents electromagnetic wave leakage. Since the function of the SIW structure is equivalent to that of a waveguide, a SIW power divider can be formed by the third metal layer, the second dielectric layer and the metal layer above the second dielectric layer, which is equivalent to a metal waveguide power divider.

[0066] According to the target number of coupling slots in the metal layer above the second dielectric layer, the second metal through holes are formed into a power divider of the target number.

[0067] In some embodiments, through the constructed power divider, after the signal is input through the input end of the power divider, power distribution can be achieved by utilizing the second metal through hole constituting the power divider.

[0068] The second metal through hole in the second dielectric layer can surround the coupling gap in the metal layer above the second dielectric layer.

[0069] The metal layer above the second dielectric layer may be the second metal layer or the fourth metal layer.

[0070] In an optional embodiment, the number of the through holes is 4X, where X is a positive integer; in order to enable the antenna to have a higher gain, see Figure 6 , the feed layer further includes: a third dielectric layer 23 and a fourth metal layer 24;

[0071] A plurality of third metal through holes 231 penetrating the third medium are arranged in the third dielectric layer, and the third metal through holes can enclose a second resonant cavity having a quarter of the number of the radiation patches;

[0072] The second resonant cavities are arranged one by one below the first coupling slot group, and the first coupling slot group includes four adjacent first coupling slots;

[0073] The fourth metal layer is provided with second coupling slots 241 having the same number as the second resonant cavities, and the second coupling slots are provided below the second resonant cavities in a one-to-one correspondence.

[0074] In some embodiments, by providing a third dielectric layer and a fourth metal layer, the coupling gap of the fourth metal layer can be used to feed the SIC composed of the second metal layer, the third dielectric layer and the fourth metal layer to form a high-order mode. Then, the high-order mode feeds the SIC composed of the first metal layer, the first dielectric layer and the first metal layer through the coupling gap of the second metal layer for resonance, and then radiates electromagnetic waves through the radiation patch of the first metal layer.

[0075] Among them, the four first coupling slots in the first coupling slot group are in a 2*2 array form.

[0076] In an optional embodiment, the radiation patch has an axisymmetric structure, and each side of the radiation patch has a groove.

[0077] The antenna bandwidth is increased by slotting each side of the radiating patch.

[0078] Furthermore, the radiation patch is a rectangular structure, having a first slot at the center of a first side of the radiation patch and a second slot at the center of a second side of the radiation patch, the length of the first slot is greater than the length of the second slot, and the second side is adjacent to the first side.

[0079] By setting slots of different lengths on different sides, the bandwidth can be expanded, the antenna can obtain higher gain, and the antenna performance can be improved.

[0080] In some embodiments, the bandwidth can be further extended by forming corresponding grooves on the four sides of the radiation patch.

[0081] In a specific embodiment, see Figure 6 The antenna in this application has a total of seven layers, among which the first, second and third layers are the radiation layers of the antenna, which are respectively a metal layer, a low-loss dielectric layer and a metal layer; the fourth, fifth, sixth and seventh layers are all feeding layers, which are respectively an adhesive dielectric layer, a metal layer, a low-loss dielectric layer and a metal layer.

[0082] The first layer is composed of 4*4 metal patches evenly arranged. The second layer is composed of 4*4 rectangular resonant cavities formed by metal through holes. The third layer is provided with rectangular coupling gaps. Figure 7, a metal radiation patch 701 in the first layer, a resonant cavity 702 in the second layer below the radiation patch, and a coupling slot 703 under the resonant cavity can constitute a radiation unit. Therefore, the first, second, and third layers can form 4*4 radiation units. Among them, in each radiation unit, the metal radiation patch and the coupling slot can be set in the center of a square, and the through hole outside the radiation patch formed by etching can also be a centered square frame line. Among them, the radius of the metal through hole is 0.2mm, the center of the circle is 0.6mm apart, and the side length of the radiation unit is 3mm, which can just accommodate 6 metal through holes.

[0083] The fourth layer is a high-order mode SIC centralized feeding layer, made of an adhesive dielectric layer, surrounded by metal through holes to form a 2*2 SIC. By exciting the high-order mode in the SIC, the 4*4 radiation units can be fed. There is a rectangular coupling slot on the fifth layer, which is centered with respect to the square surrounded by metal through holes. The sixth and seventh layers are power splitter feeding layers, which form a 1-to-4 SIW power splitter with metal through holes. The fourth layer SIC is fed through the coupling slot of the fifth layer to form a high-order mode. The high-order mode feeds the second layer SIC through the coupling slot of the third layer, and resonates and radiates electromagnetic waves through the first layer of metal patches.

[0084] The first to seventh layers can be realized by three PCB boards, with the first, second and third layers arranged on the first PCB board, the fourth layer arranged on the second PCB board, and the fourth to seventh layers arranged on the third PCB board. Each PCB layer is processed separately, and the metal through holes of the first and second PCB layers, such as Figure 8 As shown by the solid line in , the two are aligned with each other, and the metal through hole in the middle of the second layer PCB is aligned with the metal through hole of the first layer PCB, such as Fig. 9 As shown by the solid line in , the two are aligned with each other.

[0085] Exemplarily, the size of each radiation unit can be but not limited to 3mm*3mm, so the length and width of the 4*4 antenna array are 12mm*12mm. For ease of operation, a size margin of 13m is set around the antenna array, so the size of the antenna is 13mm*13mm. The thickness of the metal layer is 0.017mm, the second and sixth dielectric layers use Rogers 5880 low-loss dielectric with a thickness of 0.508mm, and the fourth dielectric layer uses Rogers 4450T with a thickness of 0.5mm as an adhesive layer. The total thickness of the array antenna is 1.584mm.

[0086] By simulating the above antenna, see Fig.10 The impedance bandwidth of the antenna is 73.1GHz~90.3GHz, and the relative impedance bandwidth is 22.3%. Within the frequency band, see Fig.11The antenna has an 8dBi gain bandwidth of 73.5GHz to 93GHz, a relative gain bandwidth of 25.32%, and a maximum gain of 10.05dBi within the bandwidth, which is nearly 44% higher than the 6-7dBi gain of existing millimeter wave antennas.

[0087] With the feeding network composed of high-order mode SIC and SIW power dividers, the performance of the 4*4 antenna array is as follows: Fig.12 As shown, the impedance bandwidth is 73.2GHz-87.1GHz, and the relative impedance bandwidth is 18.05%. Fig.12 As shown in the figure, the 20dBi gain bandwidth in the frequency band is 73.6GHz~91GHz, the relative gain bandwidth is 22.6%, and the maximum gain of the antenna array in the bandwidth can reach 21.8dBi. Compared with other array antennas of the same frequency band and scale, the bandwidth and gain performance are significantly improved.

[0088] The antenna of the present application includes a radiation layer and a feeding layer, both of which are based on a SIW structure and adopt a PCB process, and have the characteristics of low processing difficulty and low cost. The antenna bonded by the multi-layer PCB has a low profile, a simple structure, and is easy to integrate with other microwave devices. The radiation unit adopts the form of combining SIC and a specially designed metal radiation patch. Compared with most existing solutions of slotting the surface of SIC, the form used in the present invention can effectively expand the bandwidth and improve the gain.

[0089] In order to further improve the gain of the antenna, an array configuration is often used. However, the realization of a large array often means that a more complex feeding network is required. Generally speaking, a complex feeding network will bring higher losses, especially in the millimeter wave frequency band, which is not worth the loss. In order to solve this problem, the present invention uses a SIC structure to form a high-order mode feeding method, centrally feeds 2*2 radiation units, simplifies the complexity of the feeding network of the 4*4 array, reduces the transmission loss of the entire antenna in the millimeter wave frequency band, and can achieve high gain without a complex feeding network, significantly improving the radiation efficiency and radiation gain of array applications.

[0090] The radiation unit adopts the form of a combination of SIC and metal patches. Compared with most existing solutions with slots on the SIC surface, this application can effectively expand the bandwidth and improve the gain. The radiation patch in this application has corresponding slots on all sides, which can further expand the bandwidth. As a result, the relative impedance bandwidth of the radiation unit of this application can reach 22.3%, which is doubled compared to the 10% impedance bandwidth of the ordinary SIC surface slot solution. The 8dBi gain bandwidth of the antenna is 73.5GHz~93GHz, the relative gain bandwidth is 25.32%, and the maximum gain of the antenna within the bandwidth can reach 10.05dBi. Compared with the 6-7dBi gain of the existing millimeter wave antenna, it has increased by nearly 44%. The maximum gain of the antenna array within the bandwidth can reach 21.8dBi, which is significantly improved compared to the performance of other array antennas of the same frequency band and scale.

[0091] Therefore, the antenna of the present application has the advantages of low profile, wide bandwidth, high gain and low processing difficulty.

[0092] The antenna of the present application can be an antenna used in a vehicle-mounted millimeter wave high-gain array, which can help realize information exchange and collaboration between vehicles, between vehicles and road facilities, and between vehicles and traffic management departments, thereby improving the safety, efficiency and intelligence level of road traffic. It is applicable to the following specific scenarios:

[0093] High-speed mobile communications: The millimeter wave frequency band can provide higher bandwidth and faster data transmission speed, making vehicle-to-vehicle communications more stable and faster. It supports communication between vehicles, thereby achieving collaboration and information sharing between vehicles, and improving the safety and efficiency of road traffic.

[0094] Autonomous driving: High-gain array antennas can provide higher signal strength and more accurate directionality, thereby improving the accuracy and reliability of autonomous driving systems.

[0095] Intelligent Transportation System: Millimeter wave radar can help monitor traffic flow and improve the safety and efficiency of road traffic by detecting the position and speed of vehicles. By communicating with the intelligent transportation system, it can help traffic management departments monitor and manage vehicles and roads, and improve the safety and efficiency of the transportation system.

[0096] Entertainment systems: Broadband antennas can provide higher network bandwidth and faster data transmission speeds to support high-definition video, audio and interactive experiences in in-car entertainment systems.

[0097] Collision avoidance system: can sense objects and obstacles around the vehicle to help the driver or autonomous driving system avoid collisions.

[0098] Vehicle positioning and navigation: Millimeter wave positioning technology can provide higher precision and more accurate vehicle positioning information, thereby helping vehicle navigation and driving.

[0099] Based on the same concept, an electronic device is also provided in the embodiment of the present application, such as Figure 4 As shown, the electronic device mainly includes: an electronic device body and the antenna described in the above embodiment.

[0100] The electronic device may be any type of device that can use an antenna, for example, a mobile terminal, a vehicle-mounted terminal, a PC terminal, etc.

[0101] It should be noted that, in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0102] The above description is only a specific implementation of the present application, so that those skilled in the art can understand or implement the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest range consistent with the principles and novel features applied for herein.

Claims

1. An antenna, characterized in that: include: A radiation layer and a feed layer, wherein the radiation layer is arranged above the feed layer; The radiation layer comprises: a first metal layer, a first dielectric layer and a second metal layer; the first dielectric layer is arranged between the first metal layer and the second metal layer; At least one through hole is provided on the first metal layer, and a radiation patch is provided in each through hole; A plurality of first metal through holes penetrating the first medium are arranged in the first dielectric layer, the first metal through holes can enclose the same number of first resonant cavities as the number of the radiation patches, and the first resonant cavities are arranged below the radiation patches in a one-to-one correspondence; The second metal layer is provided with first coupling slots having the same number as the radiation patches, and the first coupling slots are arranged below the first resonant cavity in a one-to-one correspondence.

2. The antenna according to claim 1, characterized in that The size of the first resonant cavity is larger than the through hole, and two adjacent first resonant cavities share a first metal through hole on the same frame.

3. The antenna according to claim 1, characterized in that The feed layer comprises: a third metal layer and a second dielectric layer; A plurality of second metal through holes penetrating the second medium are arranged in the second dielectric layer, and the second metal through holes can form a power divider.

4. The antenna according to claim 1, characterized in that: The number of the through holes is 4X, where X is a positive integer; the feed layer further includes: a third dielectric layer and a fourth metal layer; A plurality of third metal through holes penetrating the third medium are arranged in the third dielectric layer, and the third metal through holes can enclose a second resonant cavity having a quarter of the number of the radiation patches; The second resonant cavities are arranged one by one below the first coupling slot group, and the first coupling slot group includes four adjacent first coupling slots; The fourth metal layer is provided with second coupling slots having the same number as the second resonant cavities, and the second coupling slots are provided below the second resonant cavities in a one-to-one correspondence.

5. The antenna according to claim 4, characterized in that: The four first coupling slots in the first coupling slot group are in a 2*2 array form.

6. The antenna according to claim 1, characterized in that The radiation patch has an axisymmetric structure, and each side of the radiation patch has a slot.

7. The antenna according to claim 6, characterized in that The radiation patch is a rectangular structure, having a first slot at the center of a first side of the radiation patch and a second slot at the center of a second side of the radiation patch, the length of the first slot is greater than the length of the second slot, and the second side is adjacent to the first side.

8. The antenna according to claim 3, characterized in that: According to a target number of coupling slots in the metal layer above the second dielectric layer, the second metal vias are formed into a power divider having the target number.

9. The antenna according to claim 1, characterized in that: The number of the through holes is M, M is N*N, and N is an even number; The through holes are arranged in the first metal layer in an N*N array form.

10. An electronic device, characterized in that: include: An electronic device body and an antenna as claimed in any one of claims 1 to 9.

Images