Single-chip type cleaning machine liquid spraying device and etching device

Abstract

The invention discloses a single-chip type cleaning machine liquid spraying device and an etching device, and belongs to the technical field of microelectronic packaging, and the single-chip type cleaning machine liquid spraying device comprises a spraying head body and a nozzle body; the sprayer body and the nozzle body are each internally provided with a liquid medicine channel, the sprayer body and the nozzle body are coaxially arranged and detachably connected, the liquid medicine channels of the sprayer body and the nozzle body are coaxially communicated, and the upper end of the sprayer body is used for being connected with the liquid medicine channels. The flow area of the liquid medicine channel of the nozzle body is smaller than that of the liquid medicine channel of the sprayer body, and the spraying pressure of liquid medicine is regulated and controlled by reducing the flow area of the nozzle body; according to the device, by reducing the flow area of the liquid medicine channel of the nozzle body, the flow speed of liquid medicine passing through the nozzle is increased under the same flow, so that the spraying pressure is improved, the formation of lateral erosion and black edges is reduced, the etching precision and the production efficiency are improved, and meanwhile, the device is convenient to maintain and adjust, and has remarkable advantages and practical value.

Description

Technical Field

[0001] The invention relates to the technical field of microelectronic packaging, in particular to a liquid spraying device and an etching device of a single-chip cleaning machine. Background Art

[0002] Metal wet etching is an important process for preparing RDL in advanced packaging technology. This process generally involves depositing a metal layer by electroplating or PVD, then patterning it with photoresist, and then using a single-wafer wet etcher to prepare the required lines.

[0003] The spray device for metal wet etching uses a nozzle to spray liquid medicine onto the wafer. In theory, the metal layer in the area not covered by the photoresist should be etched cleanly, and the metal in the area protected by the photoresist should be completely retained. However, in actual production, wet etching is isotropic etching, and the liquid medicine is infiltrated. Due to the long contact time between the surface metal and the liquid medicine, especially in the wet etching of thick metal, the side etching problem will cause the product to have black edges, which will cause the top of the original line to narrow, resulting in restrictions on subsequent processes.

[0004] In addition, the spray pressure of the nozzle of the existing spray device is regulated by controlling the flow rate adjusted by the flow valve, but the pressure regulation of the flow valve is limited; in addition, the life and maintenance of the existing nozzles are very difficult. For example, patent publication number CN221208507U is a three-nozzle integrated nozzle. During maintenance, the nozzle needs to be disassembled while the fixture and the liquid supply pipe need to be removed, and the replacement process is cumbersome. Summary of the invention

[0005] In view of the problems existing in the prior art, the present invention provides a single-wafer cleaning machine spray device and etching device, which increases the spray pressure by adjusting the flow area of ​​the liquid medicine channel, thereby controlling the diffusion and infiltration of the liquid medicine, reducing the generation of side etching and black edges, and improving the accuracy and efficiency of wet etching.

[0006] The present invention is achieved through the following technical solutions: In a first aspect, the present application provides a single-chip cleaning machine liquid spraying device, including a spray head body and a nozzle body; A liquid medicine channel is provided in the spray head body and the nozzle body. The spray head body and the nozzle body are coaxially arranged and detachably connected. The liquid medicine channels of the spray head body and the nozzle body are coaxially connected. The upper end of the spray head body is used to connect the liquid medicine channel. The flow area of ​​the liquid medicine channel of the nozzle body is smaller than the flow area of ​​the liquid medicine channel of the spray head body. The spray pressure of the liquid medicine is regulated by reducing the flow area of ​​the nozzle body.

[0007] Preferably, the nozzle body comprises a nozzle, a hollow liquid medicine pipeline is formed inside the nozzle, a connecting part is provided at one end of the nozzle, the liquid medicine pipeline passes through the connecting part, and the connecting part is used to install and fix the nozzle body on the etching device.

[0008] Preferably, the inner wall of the connecting portion is provided with a thread for connecting to a medicine liquid delivery pipeline; and the other end of the spray head is provided with an internal thread for connecting to a nozzle body.

[0009] Preferably, the nozzle body comprises a nozzle, one end of which is provided with a fixing portion for connecting to a nozzle body, a hollow nozzle pipe is formed in the nozzle, and when the nozzle body is connected to the nozzle body, the liquid medicine channel of the nozzle body is coaxially connected to the nozzle pipe.

[0010] Preferably, the cross section of the nozzle is smaller than the cross section of the liquid medicine channel of the nozzle body.

[0011] Preferably, a positioning ring is provided on the outer wall of the nozzle for positioning the installation length of the nozzle body.

[0012] Preferably, the cross section of the liquid medicine channel of the nozzle body is circular or elliptical.

[0013] Preferably, when the nozzle is circular in shape, its diameter is 0.8-3.2 mm.

[0014] Preferably, the cross section of the nozzle is elliptical, and the major axis of the ellipse is 1.6 mm.

[0015] In a second aspect, the present application proposes an etching device, including the single-wafer cleaning machine liquid spraying device.

[0016] Compared with the prior art, the present invention has the following beneficial technical effects: The present application proposes a single-chip cleaning machine spray device, which increases the flow rate of the liquid when passing through the nozzle at the same flow rate by reducing the flow area of ​​the liquid channel of the nozzle body, thereby increasing the spray pressure. Due to the increase in the spray pressure, the impact of the liquid on the surface of the wafer is more concentrated and powerful, reducing the infiltration time of the liquid at the edge of the photoresist, thereby reducing the possibility of excessive etching of the metal layer. This helps to significantly reduce or eliminate the formation of black edges, maintain the integrity and width of the original lines, and improve the quality of the wafer. Secondly, by optimizing the liquid spraying method, the distribution of the liquid and the etching depth can be more accurately controlled, thereby improving the etching accuracy. In addition, the nozzle body and the nozzle body are designed to be coaxial and detachably connected, making the device more convenient when cleaning, replacing or repairing. This design helps to extend the service life of the equipment and reduce maintenance costs. The single-chip cleaning machine spray device optimizes the liquid spraying method, increases the spray pressure, reduces the formation of side etching and black edges, improves etching accuracy and production efficiency, and is easy to maintain and adjust, and has significant advantages and practical value. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 This is the schematic diagram of metal wet etching; Figure 2 It is a structural schematic diagram of the nozzle body of the present invention; Figure 3 It is an end view of the nozzle body of the present invention; Figure 4 It is a schematic structural diagram of the nozzle of the present invention; Figure 5 is an end view of the nozzle of the present invention; Figure 6 A cross-sectional view of a nozzle according to another embodiment of the present invention; Figure 7 It is a schematic diagram of the structure of the etching device of the present invention; Figure 8 This is a comparison diagram of the black edges formed by etching with the etching device of the present invention and the existing etching device under an RDL optical microscope.

[0019] In the figure: 1. chemical solution; 2. photoresist; 3. matrix; 4. base; 5. black edge; 6. pipeline; 7. swing arm; 8. motor; 10. CUP; 11. wafer; 12. base; 13. nozzle; 20. connecting part; 21. nozzle body; 22. chemical solution pipeline; 23. positioning edge; 30. fixing part; 31. positioning ring; 32. nozzle; 33. nozzle. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0022] Figure 1The schematic diagram of metal wet etching is shown in FIG. 1 . A wafer 12 is etched with a photoresist 1. Before the metal wet etching, a metal layer 3 is formed on the substrate 4 of the wafer by electroplating or PVD deposition method, which is used as a mask for subsequent etching process or for forming circuit connection. The photoresist 2 is evenly coated on the surface of the wafer to form a photosensitive film. The coating method may include spin coating, spray coating, etc. The solvent in the photoresist is removed, and the photoresist is solidified and adhered to the surface of the wafer. A photolithography machine is used to transfer the pattern on the mask to the photoresist. During the exposure process, ultraviolet light is irradiated onto the photoresist through the mask, causing chemical changes in the photoresist in the exposure area. A developer is used to remove the photoresist in the exposure area to form a pattern corresponding to the mask pattern. Then use a single-chip wet etcher to etch the required lines, the liquid medicine is sprayed on the wafer, and the area not covered by the photoresist is etched. In theory, the metal layer 2 in the area not covered by the photoresist should be etched clean, and the metal in the area protected by the photoresist should be completely retained. In the wet etching process, the liquid medicine can be sprayed on the wafer and contact the metal layer on the wafer surface. Due to the fluidity of the liquid medicine, the liquid medicine can diffuse along the wafer surface and infiltrate the edge area of ​​the photoresist. The liquid medicine infiltrating the edge area of ​​the photoresist will react with the metal layer, especially at the junction of the photoresist and the metal layer, because the coverage of the photoresist is incomplete or there are small defects, the liquid medicine is more likely to contact the metal layer. Side etching refers to that in the wet etching process, the liquid medicine not only etches the metal layer along the vertical direction, but also etches the metal layer to a certain degree in the horizontal direction. Due to the long contact time between the surface metal and the liquid, side etching will cause the metal layer below the edge of the photoresist to be over-etched, thereby forming a black border 5 on the surface of the wafer. The black border 5 will cause the top of the original line to become narrower, resulting in restrictions on subsequent processes.

[0023] Based on the above problems, the present application provides a single-chip cleaning machine liquid spraying device, including a spray head body and a nozzle body; A liquid medicine channel is provided in the nozzle body and the nozzle body. The nozzle body and the nozzle body are coaxially arranged and detachably connected. The liquid medicine channels of the nozzle body and the nozzle body are coaxially connected. The upper end of the nozzle body is used to connect the liquid medicine channel. The flow area of ​​the liquid medicine channel of the nozzle body is smaller than the flow area of ​​the liquid medicine channel of the nozzle body. By reducing the flow area of ​​the nozzle body, the spraying pressure of the liquid medicine is increased to overcome the problem of black edges formed by side erosion of the liquid medicine.

[0024] The principle of the above-mentioned single-chip cleaning machine nozzle is mainly based on changing the spray pressure and distribution of the liquid medicine by adjusting the design of the liquid medicine channel, thereby solving the side etching and black edge problems that occur during wet etching. First, the nozzle body and the nozzle body are coaxially arranged and detachably connected, and liquid medicine channels are arranged inside them. The liquid medicine channel is coaxially connected when the nozzle body and the nozzle body are connected, ensuring that the liquid medicine can flow smoothly from the upper end of the nozzle body and spray out through the nozzle body. The key design is that the flow area of ​​the liquid medicine channel of the nozzle body is designed to be smaller than the flow area of ​​the liquid medicine channel of the nozzle body. When the liquid medicine flows from a larger flow area (nozzle body) to a smaller flow area (nozzle body), the flow rate of the liquid medicine will increase, thereby generating a higher spray pressure. Increasing the spray pressure can more effectively spray the liquid medicine onto the wafer surface in a more direct and concentrated manner. In this way, the diffusion and infiltration of the liquid medicine on the wafer surface will be controlled, reducing the chance of the liquid medicine diffusing along the wafer surface to the edge area of ​​the photoresist. Since side etching is mainly caused by the infiltration of the liquid into the edge area of ​​the photoresist and the reaction with the metal layer, by increasing the spray pressure, this infiltration phenomenon can be significantly reduced, thereby reducing the occurrence of side etching. The metal layer below the edge of the photoresist will not be over-etched, thus avoiding the formation of black edges.

[0025] As the best embodiment of this application, see Figure 2 and 3 The nozzle body includes a nozzle 21, a hollow liquid medicine pipeline 22 is formed inside the nozzle 21, a connecting part 20 is provided at one end of the nozzle, the liquid medicine pipeline 22 passes through the connecting part 20, and the connecting part is used to install and fix the nozzle body on the etching device. The inner wall of the connecting part 20 is provided with a thread for connecting the liquid medicine delivery pipeline. The other end of the nozzle 21 is provided with an internal thread for connecting the nozzle body.

[0026] In some embodiments, in order to facilitate the installation of the nozzle body, two parallel positioning edges 23 are provided on the side walls of the connecting portion 20, and the nozzle body is installed on the etching device through the positioning edges 23. At the same time, during the disassembly and assembly of the nozzle body and the nozzle body, the nozzle body is positioned through the positioning edges, which facilitates the disassembly and assembly of the nozzle body and the nozzle body.

[0027] As the best embodiment of this application, see Figure 4 and 5 The nozzle body includes a nozzle 32, one end of which is provided with a fixing portion 30, which is used to connect to the nozzle body. A hollow nozzle pipe 33 is formed in the nozzle 32. When the nozzle body and the nozzle body are in a connected state, the liquid medicine enters the nozzle pipe 33 through the liquid medicine pipeline of the nozzle body and is sprayed onto the wafer.

[0028] The cross section of the nozzle 33 is smaller than the cross section of the liquid medicine pipeline 22, that is, the liquid medicine flow area of ​​the liquid medicine pipeline 22 is larger than the liquid medicine flow area of ​​the nozzle 33. When the liquid medicine enters the nozzle 33 from the liquid medicine pipeline, the pressure of the liquid medicine can be increased due to the reduction of the flow area under the condition of unchanged flow rate, thereby increasing the spraying pressure of the liquid medicine. Therefore, by increasing the spraying pressure, this infiltration phenomenon can be significantly reduced, thereby reducing the occurrence of side etching. The metal layer below the edge of the photoresist will not be over-etched, thereby avoiding the formation of black edges.

[0029] The fixing portion is provided with an internal thread matched with the spray head body on the outside, so that the spray head body and the nozzle body form a detachable connection, thereby facilitating the replacement of nozzles of different models and realizing the adjustment of the spray pressure.

[0030] In another embodiment, a positioning ring 31 is provided on the outer wall of the connection between the nozzle 32 and the fixing portion 30 for positioning the installation length of the nozzle body. When the nozzle body is connected to the nozzle body, the lower end surface of the nozzle body abuts against the positioning ring 31 to form axial positioning.

[0031] In some embodiments, in order to facilitate the disassembly and assembly of the nozzle body, a positioning edge is provided on the positioning ring 31 for positioning with a disassembly tool to achieve rapid replacement and maintenance of the nozzle body.

[0032] The nozzle body includes multiple models, and the difference between the models lies in the diameter and shape of the nozzle. The shape of the nozzle is circular, elliptical or polygonal.

[0033] See again Figure 5 , when the shape of the nozzle is circular, its diameters are 3.2 mm, 1.6 mm and 0.8 mm respectively to suit different working environments.

[0034] See again Figure 6 In another embodiment, the shape of the nozzle is elliptical, and the major axis of the ellipse is 1.6 mm.

[0035] Example 1 A single-chip cleaning machine spray device, with a total length of 40mm, the upper end of the nozzle body has an inner diameter of 12mm thread, which is connected to the liquid supply pipe, and the lower end of the nozzle body is designed with an 8mm internal thread for connecting the nozzle. Figure 4 Schematic diagram of the nozzle, the upper end of the nozzle body is designed with an 8mm external thread, wherein the nozzle body is connected to the swing arm 7 and the liquid supply pipeline 6, and there is no need to disassemble when replacing the nozzle head, such as Figure 5 , only the lower nozzle 13 needs to be replaced, thus achieving easy replacement of the nozzle 13 .

[0036] The nozzle outlet is designed to be in shapes A and B. Shape A is a circular nozzle with different inner diameters, including but not limited to 3.2 mm, 1.6 mm and 0.8 mm. Shape B is a fan-shaped nozzle, etc. The shape of the nozzle can be designed according to the actual product and can be adapted to process adjustments for different products, including but not limited to the above two types of nozzles, to achieve the production of diversified products.

[0037] The test sample is a 12-inch wafer. A 3.5-micron thick metal layer is deposited on the bare silicon. Then, an RDL photoresist protective layer with a line width of 90 microns is prepared for testing. The two nozzles are tested using the same process conditions. Figure 8 The left is an optical microscope image of the RDL after the improved front nozzle etching. The black edge of the sample is about 19 microns. Figure 8 On the right is an optical microscope image of the RDL after improved nozzle etching. The black edge of the sample is about 7 microns, which is a significant improvement for this type of product.

[0038] Based on the above-mentioned single-wafer cleaning machine nozzle, the present application also proposes an etching device, including a motor 8, a swing arm 7, a liquid recovery device CUP10 and a single-wafer cleaning machine spray device.

[0039] The output shaft of the electrode 8 is vertically arranged at the top, one end of the swing arm is connected to the output shaft of the motor, and the other end of the swing arm is a free end. The liquid spraying device of the single-chip cleaning machine is installed at the bottom of the free end of the swing arm. The nozzle is connected to the liquid medicine tank through the pipeline 6, and the pipeline 6 is fixedly laid on the top of the swing arm. The swing arm drives the nozzle to move along a fan-shaped trajectory. The liquid medicine recovery device CUP10 is arranged below the swing arm. A base is arranged in the liquid medicine recovery device. The wafer 11 is fixed on the base and can rotate. A rotating device is arranged in the base to drive the wafer to rotate.

[0040] Driven by the motor, the swing arm swings horizontally in a fan-shaped manner, and the wafer rotates under the drive of the base. The liquid passes through the pipe on the swing arm and is sprayed from the nozzle to the wafer surface in the form of a liquid column, and is finally recovered by the recovery CUP. The nozzle is fixed by a fixture on the swing arm.

[0041] An etching device of the present application places a single-wafer cleaning machine spray device on a swing arm. The single-wafer cleaning machine spray device includes a detachable nozzle body and a nozzle body, which reduces the complexity of replacing the nozzle body. The shape of the bottom of the nozzle is changed to adjust the flow field control of the liquid sprayed onto the wafer surface, thereby realizing process adjustment for different products.

[0042] The above contents are only for explaining the technical idea of ​​the present invention and cannot be used to limit the protection scope of the present invention. Any changes made on the basis of the technical solution in accordance with the technical idea proposed by the present invention shall fall within the protection scope of the claims of the present invention.

Claims

1. A liquid spraying device for a single-chip cleaning machine, characterized in that: It includes a nozzle body and a nozzle body; A liquid medicine channel is provided in the spray head body and the nozzle body. The spray head body and the nozzle body are coaxially arranged and detachably connected. The liquid medicine channels of the spray head body and the nozzle body are coaxially connected. The upper end of the spray head body is used to connect the liquid medicine channel. The flow area of ​​the liquid medicine channel of the nozzle body is smaller than the flow area of ​​the liquid medicine channel of the spray head body. The spray pressure of the liquid medicine is regulated by reducing the flow area of ​​the nozzle body.

2. A liquid spraying device for a single-chip cleaning machine according to claim 1, characterized in that: The nozzle body comprises a nozzle, a hollow liquid medicine pipeline is formed inside the nozzle, a connecting part is arranged at one end of the nozzle, the liquid medicine pipeline runs through the connecting part, and the connecting part is used to install and fix the nozzle body on the etching device.

3. A liquid spraying device for a single-chip cleaning machine according to claim 2, characterized in that: The inner wall of the connecting part is provided with a thread for connecting to a medicine liquid delivery pipeline; the other end of the spray head is provided with an internal thread for connecting to a nozzle body.

4. A liquid spraying device for a single-chip cleaning machine according to claim 1 or 3, characterized in that: The nozzle body comprises a nozzle, one end of which is provided with a fixing portion for connecting to a nozzle body, a hollow nozzle pipe is formed in the nozzle, and when the nozzle body is connected to the nozzle body, the liquid medicine channel of the nozzle body is coaxially connected to the nozzle pipe.

5. A liquid spraying device for a single-chip cleaning machine according to claim 4, characterized in that: The cross section of the nozzle is smaller than the cross section of the liquid medicine channel of the nozzle body.

6. A liquid spraying device for a single-chip cleaning machine according to claim 4, characterized in that: A positioning ring is arranged on the outer wall of the nozzle for positioning the installation length of the nozzle body.

7. A liquid spraying device for a single-chip cleaning machine according to claim 1 or 5, characterized in that: The cross section of the liquid medicine channel of the nozzle body is circular or elliptical.

8. The liquid spraying device of a single-chip cleaning machine according to claim 7, characterized in that: When the shape of the nozzle is circular, its diameter is 0.8-3.2 mm.

9. A liquid spraying device for a single-chip cleaning machine according to claim 7, characterized in that: The cross section of the nozzle is elliptical, and the major axis of the ellipse is 1.6 mm.

10. An etching device, characterized in that: It comprises the liquid spraying device of a single-chip cleaning machine as described in any one of claims 1-9.

Images