Film tearing machine for HDI circuit board, control method and device of film tearing machine and medium

Abstract

The invention provides a film tearing machine for an HDI circuit board and a control method, device and medium thereof.The film tearing machine comprises an adsorption platform which is provided with an easy-to-tear-and-paste material taking position and used for containing the circuit board, and an adhesive tape is attached to the surface of a film covering the surface of the circuit board; a first X-axis linear motor, a second X-axis linear motor, a Y-axis linear motor and two Z-axis linear motors are arranged on the outer side; the two film tearing assemblies are installed on the Z-axis linear motor, each film tearing assembly comprises a clamping jaw assembly and a first driving assembly, and each clamping jaw assembly comprises a large clamping jaw, a small clamping jaw located in the large clamping jaw, an adsorption pressure head close to or away from the small clamping jaw and a photographing camera with the photographing direction aligned to the adsorption platform; and the controller is in communication connection with the adsorption platform, the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor and the film tearing assembly. According to the technical scheme of the embodiment of the invention, the bonding part of the easy-to-tear tape and the high-viscosity adhesive tape is clamped by the large clamping jaw, and the thin film of the HDI circuit board is torn off.

Description

Technical Field

[0001] The present invention relates to the technical field of film tearing equipment, and in particular to a film tearing machine for an HDI circuit board and a control method, device and medium thereof. Background Art

[0002] The production environment of high-density interconnect (HDI) circuit boards is complex, so a layer of film is covered on the surface of the HDI circuit boards. There is tape on the surface of the film. The film can protect the HDI circuit boards from external environmental interference. Before the HDI circuit boards enter subsequent production, the film on the HDI circuit boards is torn off.

[0003] The existing film-tearing equipment uses the clamping claws to clamp the easy-tear sticker, stick the easy-tear sticker to the tape of the HDI circuit board, and then the clamping claws tear off the film on the HDI circuit board through the easy-tear sticker and the tape. The existing film-tearing equipment can only be used to remove films with low-viscosity tape and standard-viscosity tape. When the clamping claws of the existing film-tearing equipment tear off the film with high-viscosity tape, due to the high viscosity of the high-viscosity tape, the film-tearing force required is greater than the film-tearing force required for low-viscosity tape and standard-viscosity tape. During the film-tearing process, the adhesion between the high-viscosity tape and the easy-tear sticker is greater than the friction between the clamping claws and the easy-tear sticker, causing the easy-tear sticker to fall off from the clamping claws and the film-tearing failure. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a film tearing machine for HDI circuit boards and a control method, device, and medium thereof, wherein a small clamping jaw clamps an easy-to-tear sticker, and a large clamping jaw clamps the bonding portion of the easy-to-tear sticker and a high-viscosity tape, so that the clamping jaw clamps the easy-to-tear sticker more firmly, and the film with a high-viscosity tape on the HDI circuit board is torn off by a double clamping jaw structure.

[0005] In a first aspect, an embodiment of the present invention provides a film peeling machine for an HDI circuit board, comprising: An adsorption platform, wherein the adsorption platform is provided with an easy-tear sticker taking position, the adsorption platform is used to place a circuit board, the surface of the circuit board is covered with a film, the surface of the film is attached with a tape, the outer side of the adsorption platform is provided with a first X-axis linear motor, a second X-axis linear motor and a Y-axis linear motor, the Y-axis linear motor can slide on the first X-axis linear motor and the second X-axis linear motor, and one side of the Y-axis linear motor is provided with two Z-axis linear motors; Two film tearing assemblies, the film tearing assembly is installed on the front side of the Z-axis linear motor, the Z-axis linear motor drives the film tearing assembly to slide in the vertical direction, the film tearing assembly includes a clamping jaw assembly and a first driving assembly, the first driving assembly is connected to the clamping jaw assembly, the first driving assembly is used to drive the clamping jaw assembly to rotate, the clamping jaw assembly includes a small clamping jaw, a large clamping jaw, an adsorption pressure head and a camera, the small clamping jaw is located inside the large clamping jaw, the small clamping jaw is connected to a finger cylinder, the large clamping jaw is connected to a second driving assembly, the adsorption pressure head is connected to a third driving assembly, the third driving assembly is used to drive the adsorption pressure head to approach or move away from the small clamping jaw, the camera is fixed to one side of the film tearing assembly, and the shooting direction of the camera is aligned with the adsorption platform; A controller is communicatively connected to the adsorption platform, the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor and the film tearing assembly.

[0006] According to some embodiments of the present invention, the upper clamping portion of the small jaw is provided with a first through hole, the lower clamping portion of the small jaw is provided with a second through hole, the first through hole and the second through hole are interconnected, an optical fiber sensor is provided above the first through hole, and the optical fiber sensor is communicatively connected to the controller.

[0007] According to some embodiments of the present invention, the first drive assembly includes a first servo motor, a first harmonic reducer, a second servo motor and a second harmonic reducer, the first servo motor is installed on the front side of the Z-axis linear motor, the first harmonic reducer is connected to the bottom of the first servo motor, the first harmonic reducer is connected to the second harmonic reducer through a mounting plate, the second servo motor is connected to the side of the second harmonic reducer away from the adsorption platform, the clamping assembly is connected to the side of the second harmonic reducer close to the adsorption platform, a pressure sensor is arranged between the second harmonic reducer and the clamping assembly, and the first servo motor, the second servo motor and the pressure sensor are respectively communicatively connected to the controller.

[0008] According to some embodiments of the present invention, a pressure plate assembly is provided on opposite sides of the adsorption platform, and the pressure plate assembly includes a pressure plate, a cylinder, a third servo motor and a transmission assembly. The third servo motor is connected to the pressure plate through the transmission assembly, and the third servo motor drives the pressure plate to approach or move away from the adsorption platform through the transmission assembly. The cylinder is connected to the pressure plate, and the cylinder is used to drive the pressure plate to move in a vertical direction. An ion wind rod is provided above the pressure plate assembly, and the air outlet of the ion wind rod is aligned with the adsorption platform, wherein the cylinder, the third servo motor and the ion wind rod are respectively communicatively connected to the controller.

[0009] In a second aspect, an embodiment of the present invention provides a control method for a film peeling machine for an HDI circuit board, which is applied to the film peeling machine for an HDI circuit board described in the first aspect, and the method includes: After the circuit board is placed on the adsorption platform, the adsorption platform is controlled to work. When the adsorption platform adsorbs the circuit board, the camera is controlled to locate the circuit board to generate a positioning result, and the positioning result is sent to the controller, and then the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor and the first driving assembly are controlled to move the clamping claw assembly to the easy-tear sticker taking position; Control the second driving assembly and the finger cylinder to make the small clamping claws clamp the easy-tear sticker, control the third driving assembly to make the adsorption pressure head move in a direction close to the small clamping claws, and when the adsorption pressure head abuts against the easy-tear sticker, control the adsorption pressure head to adsorb the easy-tear sticker; Based on the positioning result, the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor and the first driving assembly are controlled so that the adsorption pressure head presses the easily-tearable tape attached to the circuit board; Control the third driving assembly and the adsorption pressure head so that the adsorption pressure head releases the easy-tear label and moves in a direction away from the small clamping claw, and then control the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor and the first driving assembly to increase the angle between the small clamping claw and the adsorption platform; When the small jaw is perpendicular to the adsorption platform, the first drive assembly and the second drive assembly are controlled to make the large jaw rotate after closing; when the large jaw rotates to the film tearing angle, the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor and the first drive assembly are controlled to make the large jaw move along a preset trajectory; when the large jaw is located at the end point of the preset trajectory, the camera is controlled to acquire the image of the circuit board, and the comparison result of the image of the circuit board and the preset image is sent to the controller; when the comparison result is inconsistent, the controller alarms.

[0010] According to some embodiments of the present invention, the upper clamping portion of the small clamping jaw is provided with a first through hole, the lower clamping portion of the small clamping jaw is provided with a second through hole, the first through hole and the second through hole are interconnected, an optical fiber sensor is provided above the first through hole, and the optical fiber sensor is communicatively connected to the controller; Control the second driving assembly and the finger cylinder to enable the small gripper to grip the easy-tear sticker, including: controlling the second drive assembly to open the large jaw; Controlling the finger cylinder to open and then close the small gripper; When the easy-tear label is located between the first through hole and the second through hole, the optical fiber sensor sends a material removal completion signal to the controller.

[0011] According to some embodiments of the present invention, a pressure plate assembly is provided on opposite sides of the adsorption platform, and the pressure plate assembly includes a pressure plate, a cylinder, a third servo motor and a transmission assembly, the third servo motor is connected to the pressure plate through the transmission assembly, and the third servo motor drives the pressure plate to approach or move away from the adsorption platform through the transmission assembly, the cylinder is connected to the pressure plate, and the cylinder is used to drive the pressure plate to move in a vertical direction, and an ion wind rod is provided above the pressure plate assembly, and the air outlet of the ion wind rod is aligned with the adsorption platform, wherein the cylinder, the third servo motor and the ion wind rod are respectively communicatively connected to the controller; Before controlling the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor and the first driving assembly based on the positioning result so that the adsorption pressure head presses the easy-to-tear tape attached to the circuit board, the method further includes: Controlling the third servo motor to move the pressing plate to above the edge pressing position of the adsorption platform; Controlling the cylinder to move the pressing plate downward until the pressing plate abuts against the circuit board; The ion wind rod is controlled to start, and the ion wind rod outputs ion wind in the direction of the adsorption platform.

[0012] According to some embodiments of the present invention, the first driving assembly includes a first servo motor, a first harmonic reducer, a second servo motor and a second harmonic reducer, the first servo motor is installed on the front side of the Z-axis linear motor, the first harmonic reducer is connected to the bottom of the first servo motor, the first harmonic reducer is connected to the second harmonic reducer through a mounting plate, the second servo motor is connected to a side of the second harmonic reducer away from the adsorption platform, the clamping jaw assembly is connected to a side of the second harmonic reducer close to the adsorption platform, a pressure sensor is arranged between the second harmonic reducer and the clamping jaw assembly, and the first servo motor, the second servo motor and the pressure sensor are respectively communicatively connected to the controller; After controlling the third driving assembly and the suction pressure head so that the suction pressure head releases the easy-tear label and moves in a direction away from the small clamping claw, the method further includes: Controlling the pressure sensor to start and send the real-time pressure value to the controller; Control the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor, the first servo motor and the second servo motor to move the large jaw along the preset trajectory. When the large jaw is located at the preset trajectory and the real-time pressure value is zero, control the pressure sensor to send an alarm signal to the controller.

[0013] In a third aspect, an embodiment of the present invention provides a control device for a film tearing machine for an HDI circuit board, comprising at least one control processor and a memory for communicating with the at least one control processor; the memory stores instructions executable by the at least one control processor, and the instructions are executed by the at least one control processor so that the at least one control processor can execute the control method for the film tearing machine for an HDI circuit board as described in the second aspect above.

[0014] In a fourth aspect, an embodiment of the present invention provides a computer-readable storage medium storing computer-executable instructions, wherein the computer-executable instructions are used to execute the control method of the film peeling machine for HDI circuit boards as described in the second aspect above.

[0015] The film peeling machine for HDI circuit boards according to the embodiment of the present invention has at least the following beneficial effects: an adsorption platform, the adsorption platform is provided with an easy-to-tear sticker taking position, the adsorption platform is used to place the circuit board, the surface of the circuit board is covered with a film, the surface of the film is attached with tape, the outer side of the adsorption platform is provided with a first X-axis linear motor, a second X-axis linear motor and a Y-axis linear motor, the Y-axis linear motor can slide on the first X-axis linear motor and the second X-axis linear motor, and one side of the Y-axis linear motor is provided with two Z-axis linear motors; two film peeling assemblies, the film peeling assembly is installed on the front side of the Z-axis linear motor, the Z-axis linear motor drives the film peeling assembly to slide in the vertical direction, the film peeling assembly includes a clamping claw assembly and a first driving assembly, The first driving assembly is connected to the clamping jaw assembly, and the first driving assembly is used to drive the clamping jaw assembly to rotate. The clamping jaw assembly includes a small clamping jaw, a large clamping jaw, an adsorption pressure head and a camera. The small clamping jaw is located inside the large clamping jaw, and the small clamping jaw is connected to the finger cylinder. The large clamping jaw is connected to the second driving assembly, and the adsorption pressure head is connected to the third driving assembly. The third driving assembly is used to drive the adsorption pressure head to approach or move away from the small clamping jaw. The camera is fixed to one side of the film tearing assembly, and the shooting direction of the camera is aligned with the adsorption platform; the controller is communicatively connected to the adsorption platform, the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor and the film tearing assembly. According to the technical solution of the embodiment of the present invention, the easy-to-tear sticker is clamped by the small clamping jaw, and the bonding part of the easy-to-tear sticker and the high-viscosity tape is clamped by the large clamping jaw, so that the effect of the clamping jaw clamping the easy-to-tear sticker is more stable, and the film with high-viscosity tape on the HDI circuit board can be torn off by the double clamping jaw structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of a first X-axis linear motor, a second X-axis linear motor, a Y-axis linear motor, a Z-axis linear motor and a film tearing assembly provided by an embodiment of the present invention; Figure 2 is a schematic structural diagram of an adsorption platform provided by another embodiment of the present invention; Figure 3 is a structural schematic diagram of a film tearing assembly provided by another embodiment of the present invention; Figure 4 is a side view of a film tearing assembly provided by another embodiment of the present invention; Figure 5 is a rear view of a film tearing assembly provided by another embodiment of the present invention; Figure 6 This is a working flow chart of a film peeling machine for HDI circuit boards provided by another embodiment of the present invention; Figure 7It is a structural diagram of a control device of a film peeling machine for HDI circuit boards provided in another embodiment of the present invention. DETAILED DESCRIPTION

[0017] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0018] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0019] In the description of the present invention, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0020] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0021] The film peeling machine for HDI circuit boards according to the embodiment of the present invention has at least the following beneficial effects: an adsorption platform, the adsorption platform is provided with an easy-to-tear sticker taking position, the adsorption platform is used to place the circuit board, the surface of the circuit board is covered with a film, the surface of the film is attached with tape, the outer side of the adsorption platform is provided with a first X-axis linear motor, a second X-axis linear motor and a Y-axis linear motor, the Y-axis linear motor can slide on the first X-axis linear motor and the second X-axis linear motor, and one side of the Y-axis linear motor is provided with two Z-axis linear motors; two film peeling assemblies, the film peeling assembly is installed on the front side of the Z-axis linear motor, the Z-axis linear motor drives the film peeling assembly to slide in the vertical direction, the film peeling assembly includes a clamping claw assembly and a first driving assembly, The first driving assembly is connected to the clamping jaw assembly, and the first driving assembly is used to drive the clamping jaw assembly to rotate. The clamping jaw assembly includes a small clamping jaw, a large clamping jaw, an adsorption pressure head and a camera. The small clamping jaw is located inside the large clamping jaw, and the small clamping jaw is connected to the finger cylinder. The large clamping jaw is connected to the second driving assembly, and the adsorption pressure head is connected to the third driving assembly. The third driving assembly is used to drive the adsorption pressure head to approach or move away from the small clamping jaw. The camera is fixed to one side of the film tearing assembly, and the shooting direction of the camera is aligned with the adsorption platform; the controller is communicatively connected to the adsorption platform, the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor and the film tearing assembly. According to the technical solution of the embodiment of the present invention, the easy-to-tear sticker is clamped by the small clamping jaw, and the bonding part of the easy-to-tear sticker and the high-viscosity tape is clamped by the large clamping jaw, so that the effect of the clamping jaw clamping the easy-to-tear sticker is more stable, and the film with high-viscosity tape on the HDI circuit board can be torn off by the double clamping jaw structure.

[0022] First, refer to Figures 1 to 5 The film peeling machine for HDI circuit board provided in the embodiment of the present application comprises: The adsorption platform 10 is provided with an easy-tear sticker material taking position. The adsorption platform 10 is used to place the circuit board. The surface of the circuit board is covered with a film. The surface of the film is attached with a tape. The outer side of the adsorption platform 10 is provided with a first X-axis linear motor 20, a second X-axis linear motor 30 and a Y-axis linear motor 40. The Y-axis linear motor 40 can slide on the first X-axis linear motor 20 and the second X-axis linear motor 30. Two Z-axis linear motors 50 are provided on one side of the Y-axis linear motor 40. Two film-tearing assemblies 60, the film-tearing assembly 60 is installed on the front side of the Z-axis linear motor 50, the Z-axis linear motor 50 drives the film-tearing assembly 60 to slide in the vertical direction, the film-tearing assembly 60 includes a clamping jaw assembly 62 and a first driving assembly 61, the first driving assembly 61 is connected to the clamping jaw assembly 62, the first driving assembly 61 is used to drive the clamping jaw assembly 62 to rotate, the clamping jaw assembly 62 includes a small clamping jaw 622, a large clamping jaw 621, an adsorption pressure head 623 and a camera 63, the small clamping jaw 622 is located inside the large clamping jaw 621, the small clamping jaw 622 is connected to a finger cylinder 624, the large clamping jaw 621 is connected to a second driving assembly, the adsorption pressure head 623 is connected to a third driving assembly, the third driving assembly is used to drive the adsorption pressure head 623 to move closer to or away from the small clamping jaw 622, the camera 63 is fixed to one side of the film-tearing assembly 60, and the shooting direction of the camera 63 is aligned with the adsorption platform 10; The controller is communicatively connected to the adsorption platform 10, the first X-axis linear motor 20, the second X-axis linear motor 30, the Y-axis linear motor 40, the Z-axis linear motor 50 and the film tearing assembly 60.

[0023] It should be noted that the adsorption platform 10 includes a plurality of vacuum logic valves. A circuit board is placed on the adsorption platform 10, and a closed space is formed between the circuit board and the vacuum logic valve. The controller controls the operation of the adsorption platform 10, and the vacuum logic valve opens, so that the vacuum pump connected to the vacuum logic valve extracts the air in the closed space. When the vacuum logic valve detects that the internal pressure of the closed space is less than the preset threshold, it indicates that the adsorption platform 10 has successfully adsorbed the circuit board, and the vacuum logic valve sends a signal to the controller. The circuit board is fixed by the adsorption platform 10, so that the film tearing machine can be applicable to the film tearing steps of circuit boards of various sizes. After the film is torn off the circuit board, the controller controls the vacuum logic valve to close, thereby destroying the vacuum state, causing the adsorption platform 10 to release the circuit board, so that the circuit board can be removed from the adsorption platform 10.

[0024] It should be noted that one end of the Y-axis linear motor 40 is located at the first X-axis linear motor 20, and the other end is located at the second X-axis linear motor 30. The first X-axis linear motor 20 and the second X-axis linear motor 30 work together to drive the Y-axis linear motor 40 to move in the X-axis direction, thereby realizing the movement of the clamping jaw assembly 62 in the X-axis direction; the Y-axis linear motor 40 drives the clamping jaw assembly 62 through the Z-axis linear motor 50 to realize the movement of the clamping jaw assembly 62 in the Y-axis direction; the first driving assembly 61 is installed on the front side of the Z-axis linear motor 50, and the Z-axis linear motor 50 drives the clamping jaw assembly 62 to move in the Z-axis direction through the first driving assembly 61.

[0025] It should be noted that the first driving assembly 61 includes a servo motor and a harmonic reducer. The servo motor drives the clamping jaw assembly 62 to rotate through the harmonic reducer, thereby achieving high-precision rotation angle control of the clamping jaw assembly 62.

[0026] It should be noted that the second drive assembly is connected to the rear side of the large clamping jaw 621, and the second drive assembly includes a cylinder 72. Two rack plates are connected to both sides of the cylinder 72. Racks are provided on the upper and lower sides of the rack plates. The large clamping jaw 621 is hinged to the fixed plate connected to the first drive assembly 61. Two integrally formed gears are provided on both sides of the large clamping jaw 621. The gears of the large clamping jaw 621 are meshed with the rack plate. The rack plate is driven to move forward and backward by the cylinder 72, and the gears are driven to rotate, thereby driving the large clamping jaw 621 to open and close.

[0027] It should be noted that the finger cylinder 624 is connected to the rear side of the small clamp 622, and the small clamp 622 is driven by the finger cylinder 624 to realize the opening and closing of the small clamp 622; the upper surface and the lower surface of the clamping part of the small clamp 622 are inclined surfaces, and when the small clamp 622 sticks the easy-tear sticker to the tape of the circuit board, the inclined surface of the lower surface of the small clamp 622 is parallel to the adsorption platform 10 and abuts against the circuit board.

[0028] It should be noted that the third driving assembly includes a telescopic cylinder and a transverse cylinder, the telescopic cylinder is connected to the transverse cylinder, the transverse cylinder is connected to the adsorption pressure head 623, the telescopic cylinder is used to drive the transverse cylinder and the adsorption pressure head 623 to move along the X-axis direction, and the transverse cylinder is used to drive the adsorption pressure head 623 to move along the Y-axis direction. The side of the adsorption pressure head 623 close to the large clamping jaw 621 is set to be parallel to the inclined surface of the lower surface of the small clamping jaw 622. When the small clamping jaw 622 sticks the easy-to-tear sticker to the tape, the inclined surface of the adsorption pressure head 623 is parallel to the adsorption platform 10 and abuts against the circuit board, so that the adsorption pressure head 623 presses the easy-to-tear sticker to the tape.

[0029] It should be noted that, after the small clamping jaws 622 clamp the easy-tear label, the suction pressure head 623 is controlled to be close to the small clamping jaws 622, the suction pressure head 623 abuts against the easy-tear label, and the suction pressure head 623 is controlled to suction the easy-tear label.

[0030] It should be noted that the camera 63 is used to locate the tape of the circuit board on the adsorption platform 10, and send the positioning result to the controller. The controller controls the first X-axis linear motor 20, the second X-axis linear motor 30 and the Y-axis linear motor 40 based on the positioning result, and drives the clamping jaw assembly 62 to move from the easy-tear tape material position to the positioning result, that is, the tape of the circuit board after clamping the easy-tear tape; after the circuit board film is torn off, the camera 63 is controlled to obtain the image of the circuit board, and the image of the circuit board obtained is compared with the preset image, and the comparison result is sent to the controller. When the image of the circuit board obtained is inconsistent with the preset image, the comparison result is image inconsistency, indicating that there is film residue on the circuit board, and the controller sends an alarm to remind the staff that there is film residue on the surface of the circuit board located on the adsorption platform 10.

[0031] It should be noted that, in the prior art, the easy-tear sticker is clamped by only one clamping jaw, and after the easy-tear sticker is attached to the tape, the clamping jaw moves to tear off the film, that is, the clamping jaw only clamps the easy-tear sticker during the whole process, resulting in the easy-tear sticker falling off from the clamping jaw when the film with high-viscosity tape is torn off; in the present application, the easy-tear sticker is clamped by the small clamping jaw 622, and the large clamping jaw 621 clamps the bonding point between the easy-tear sticker and the tape, and the tape is attached to the film, so the clamping part of the large clamping jaw 621 clamps the easy-tear sticker, the tape and the film, so that the effect of the clamping jaw clamping the easy-tear sticker is more stable, and the film with high-viscosity tape on the HDI circuit board can be torn off by the double clamping jaw structure.

[0032] It should be noted that after the circuit board is placed on the adsorption platform 10, the adsorption platform 10 is started, the vacuum logic valve is opened, and the vacuum pump extracts the air in the enclosed space between the circuit board and the vacuum logic valve. When the vacuum logic valve detects that the air pressure in the enclosed space between the circuit board and the vacuum logic valve is less than a preset threshold, the vacuum logic valve sends a signal to the controller, and the controller controls the camera 63 to obtain an image of the circuit board, obtains the positioning result of the tape of the circuit board and sends it to the controller; the controller controls the first X-axis linear motor 20, the second X-axis linear motor 30, and the Y-axis linear motor 31. The motor 40 and the Z-axis linear motor 50 move the clamping jaw assembly 62 to the easy-tear sticker taking position, control the film tearing assembly 60 to make the small clamping jaw 622 clamp the easy-tear sticker, and control the third driving assembly to make the adsorption pressure head 623 close to the small clamping jaw 622. When the adsorption pressure head 623 abuts against the easy-tear sticker, the adsorption pressure head 623 is controlled to adsorb the easy-tear sticker; based on the positioning result, the controller controls the first X-axis linear motor 20, the second X-axis linear motor 30, the Y-axis linear motor 40, the Z-axis linear motor 50 and the film tearing assembly 60, and controls the small clamping jaw 622 to stick the easy-tear sticker to the line At the tape of the road plate, the adsorption pressure head 623 presses the easy-to-tear sticker on the tape, controls the third driving component to move the adsorption pressure head 623 to the initial position, controls the first X-axis linear motor 20, the second X-axis linear motor 30, the Y-axis linear motor 40, the Z-axis linear motor 50 and the first driving component 61 to increase the angle between the small clamp 622 and the adsorption platform 10, and prevents the large clamp 621 from colliding with the adsorption platform 10 when clamping the easy-to-tear sticker and the tape. When the small clamp 622 is perpendicular to the adsorption platform 10, the large clamp 621 is controlled to close, and the large clamp 621 Clamp easy-to-tear stickers, tapes and films; control the first X-axis linear motor 20, the second X-axis linear motor 30, the Y-axis linear motor 40, the Z-axis linear motor 50 and the first driving assembly 61 to move the clamping jaw assembly 62 along a preset trajectory. When the clamping jaw assembly 62 moves to the end point of the preset trajectory, control the camera 63 to obtain an image of the circuit board, and compare the image with the preset image, and send the comparison result to the controller. When the comparison result is inconsistent, the controller issues an alarm to remind the staff that there is film residue on the surface of the circuit board on the adsorption platform 10.

[0033] In addition, in one embodiment, referring to Figure 4 A first through hole is provided at the upper clamping portion of the small clamping jaw 622, a second through hole is provided at the lower clamping portion of the small clamping jaw 622, the first through hole and the second through hole are interconnected, an optical fiber sensor 6222 is provided above the first through hole, and the optical fiber sensor 6222 is communicatively connected to the controller.

[0034] It should be noted that before the small clamping jaw 622 clamps the easy-to-tear sticker, the first through hole is connected to the second through hole, and the optical fiber sensor 6222 can receive the light signal; after the small clamping jaw 622 clamps the easy-to-tear sticker, the easy-to-tear sticker is located between the first through hole and the second through hole, and the optical fiber sensor 6222 cannot receive the light signal. The optical fiber sensor 6222 sends a material removal completion signal to the controller, and the controller drives the small clamping jaw 622 to move.

[0035] In addition, in one embodiment, referring to Figures 2 to 5 The first driving assembly 61 includes a first servo motor 611, a first harmonic reducer 612, a second servo motor 613 and a second harmonic reducer 614. The first servo motor 611 is installed on the front side of the Z-axis linear motor 50, the first harmonic reducer 612 is connected to the bottom of the first servo motor 611, the first harmonic reducer 612 is connected to the second harmonic reducer 614 through a mounting plate, the second servo motor 613 is connected to the side of the second harmonic reducer 614 away from the adsorption platform 10, the clamping jaw assembly 62 is connected to the side of the second harmonic reducer 614 close to the adsorption platform 10, a pressure sensor 615 is arranged between the second harmonic reducer 614 and the clamping jaw assembly 62, and the first servo motor 611, the second servo motor 613 and the pressure sensor 615 are respectively communicated and connected to the controller.

[0036] It should be noted that the first servo motor 611 and the first harmonic reducer 612 work together to realize the rotation of the clamping jaw assembly 62 on the horizontal plane; the second servo motor 613 and the second harmonic reducer 614 work together to realize the rotation of the clamping jaw assembly 62 on the vertical plane, wherein the vertical plane is parallel to the first X-axis linear motor 20.

[0037] It should be noted that the pressure sensor 615 is located between the second harmonic reducer 614 and the clamping jaw assembly 62. During the film tearing process, the rotation of the clamping jaw assembly 62 is realized by the first driving assembly 61, and the pressure sensor 615 is subjected to the pressure between the second harmonic reducer 614 and the clamping jaw assembly 62, and the real-time pressure value is fed back to the controller. The real-time pressure value is the magnitude of the film tearing force exerted on the clamping jaw assembly 62; when the clamping jaw assembly 62 is located in the preset trajectory and the real-time pressure value is zero, it means that during the film tearing process, the film breaks and the film cannot be successfully torn off. At this time, the controller controls the first X-axis linear motor 20, the second X-axis linear motor 30, the Y-axis linear motor 40, the Z-axis linear motor 50 and the film tearing assembly 60 to stop running, and issues an alarm to alert the staff.

[0038] In addition, in one embodiment, referring to Figure 2 , pressure plate assemblies are provided on opposite sides of the adsorption platform 10, and the pressure plate assembly includes a pressure plate 71, a cylinder 72, a third servo motor 73 and a transmission assembly 74, the third servo motor 73 is connected to the pressure plate 71 through the transmission assembly 74, and the third servo motor 73 drives the pressure plate 71 to move closer to or away from the adsorption platform 10 through the transmission assembly 74, the cylinder 72 is connected to the pressure plate 71, and the cylinder 72 is used to drive the pressure plate 71 to move in a vertical direction, and an ion wind rod 80 is provided above the pressure plate assembly, and the air outlet of the ion wind rod 80 is aligned with the adsorption platform 10, wherein the cylinder 72, the third servo motor 73 and the ion wind rod 80 are respectively communicatively connected to the controller.

[0039] It should be noted that the transmission assembly 74 includes a coupling and a screw, the third servo motor 73 is connected to the coupling, the coupling is connected to the screw, and the screw is connected to the pressure plate 71; through the coupling and the screw, the rotation of the shaft of the third servo motor 73 is converted into linear movement of the pressure plate 71 in the horizontal direction.

[0040] It should be noted that the third servo motor 73 works, and after the third servo motor 73 drives the pressing plate 71 to move above the edge pressing position of the adsorption platform 10 through the coupling and the screw, it controls the cylinder 72 to realize the horizontal movement of the pressing plate 71, so that the pressing plate 71 abuts against the circuit board to prevent the suction force of the adsorption platform 10 from being insufficient, causing the circuit board to leave the adsorption platform 10 during the film tearing process. When the circuit board completes the film tearing step, the cylinder 72 drives the pressing plate 71 to rise and leave the circuit board, and the third servo motor 73 controls the pressing plate 71 to move in the direction away from the adsorption platform 10.

[0041] It should be noted that before the clamping jaw assembly 62 sticks the easily-tearable tape on the circuit board, the ion wind rod 80 is started to blow ion wind toward the adsorption platform 10, thereby removing the static electricity generated during the film tearing process.

[0042] In addition, an embodiment of the present invention provides a control method for a film peeling machine for an HDI circuit board, which is applied to Figures 1 to 5 The film peeling machine for HDI circuit board of the embodiment shown in FIG. Figure 6 The method includes but is not limited to the following steps: S10, after the circuit board is placed on the adsorption platform, the adsorption platform is controlled to work, when the adsorption platform adsorbs the circuit board, the camera is controlled to locate the circuit board to generate a positioning result, the positioning result is sent to the controller, and then the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor and the first driving assembly are controlled to move the clamping claw assembly to the easy-tear label taking position; S20, controlling the second driving assembly and the finger cylinder to enable the small clamping claw to clamp the easy-tear label, controlling the third driving assembly to enable the adsorption pressure head to move toward the direction close to the small clamping claw, and when the adsorption pressure head abuts against the easy-tear label, controlling the adsorption pressure head to adsorb the easy-tear label; S30, based on the positioning result, controlling the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor and the first driving assembly so that the adsorption pressure head presses the tape that is easy to tear and adhere to the circuit board; S40, controlling the third driving assembly and the adsorption pressure head so that the adsorption pressure head releases the easy-tear label and moves in a direction away from the small clamping claw, and then controlling the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor and the first driving assembly so that the angle between the small clamping claw and the adsorption platform increases; S50, when the small jaw is perpendicular to the adsorption platform, control the first drive assembly and the second drive assembly to make the large jaw rotate after closing; when the large jaw rotates to the film tearing angle, control the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor and the first drive assembly to make the large jaw move along a preset trajectory; when the large jaw is at the end point of the preset trajectory, control the camera to obtain an image of the circuit board, and send the comparison result of the image of the circuit board and the preset image to the controller; when the comparison result is inconsistent, the controller alarms.

[0043] It should be noted that the technical principle of the film peeling machine for HDI circuit boards to achieve the film peeling of HDI circuit boards with high-viscosity tapes can be referred to Figures 1 to 5 , which will not be repeated here.

[0044] In addition, in one embodiment, step S20 specifically includes but is not limited to the following steps: S21, controlling the second driving assembly to open the large clamping jaw; S22, controlling the finger cylinder to open and then close the small gripper; S23, when the easy-tear label is located between the first through hole and the second through hole, the optical fiber sensor sends a material removal completion signal to the controller.

[0045] It should be noted that the principle of judging whether the small gripper has successfully gripped the easy-tear sticker based on the optical fiber sensor can refer to the above Figure 2 The description of the illustrated embodiment will not be repeated here.

[0046] In addition, in one embodiment, step S30 specifically includes but is not limited to the following steps: S31, controlling the third servo motor to move the pressing plate to above the edge pressing position of the adsorption platform; S32, controlling the cylinder to move the pressing plate downward until the pressing plate abuts against the circuit board; S33, controlling the ion wind rod to start, and the ion wind rod outputs ion wind in the direction of the adsorption platform.

[0047] It should be noted that the principle of fixing the circuit board based on the pressure plate assembly and the principle of eliminating static electricity generated during film tearing by the ion wind rod can refer to the above Figure 2 The description of the illustrated embodiment will not be repeated here.

[0048] In addition, in one embodiment, the external clock rising edge collector is connected to the internal clock counter, and after executing step S40, the following steps are also included but not limited to: S41, control the pressure sensor to start and send the real-time pressure value to the controller; S42, controls the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor, the first servo motor and the second servo motor to move the large jaw along a preset trajectory. When the large jaw is located at the preset trajectory and the real-time pressure value is zero, controls the pressure sensor to send an alarm signal to the controller.

[0049] It should be noted that the principle of monitoring the film tearing process of the clamping jaws through the pressure sensor can refer to the above Figures 2 to 5 The description of the illustrated embodiment will not be repeated here.

[0050] like Figure 7 As shown, Figure 7 : is a structural diagram of a control device of a film peeling machine for HDI circuit boards provided by an embodiment of the present invention. The present invention also provides a control device of a film peeling machine for HDI circuit boards, comprising: The processor 501 may be implemented by a general-purpose central processing unit (CPU), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of the present application; The memory 502 can be implemented in the form of a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM). The memory 502 can store an operating system and other application programs. When the technical solution provided in the embodiment of this specification is implemented by software or firmware, the relevant program code is stored in the memory 502, and the processor 501 calls and executes the control method of the film peeling machine for HDI circuit boards in the embodiment of this application; Input / output interface 503, used to implement information input and output; Communication interface 504, used to realize communication interaction between the device and other devices, which can be realized through wired mode (such as USB, network cable, etc.) or wireless mode (such as mobile network, WIFI, Bluetooth, etc.); A bus 505 that transmits information between various components of the device (e.g., the processor 501, the memory 502, the input / output interface 503, and the communication interface 504); The processor 501 , the memory 502 , the input / output interface 503 and the communication interface 504 are connected to each other in communication within the device via the bus 505 .

[0051] An embodiment of the present application further provides a storage medium, which is a computer-readable storage medium. The storage medium stores a computer program, and when the computer program is executed by a processor, the control method of the film tearing machine for HDI circuit boards is implemented.

[0052] As a non-transient computer-readable storage medium, the memory can be used to store non-transient software programs and non-transient computer executable programs. In addition, the memory may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage devices. In some embodiments, the memory may optionally include a memory remotely arranged relative to the processor, and these remote memories may be connected to the processor via a network. Examples of the above-mentioned networks include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and a combination thereof. The device embodiments described above are merely schematic, wherein the units described as separate components may or may not be physically separated, and are implemented to be located in one place, or may also be distributed to multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the present embodiment.

[0053] It will be appreciated by those skilled in the art that all or some of the steps and systems in the methods disclosed above may be implemented as software, firmware, hardware, and appropriate combinations thereof. Some or all physical components may be implemented as software executed by a processor, such as a central processing unit, a digital signal processor, or a microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit. Such software may be distributed on a computer-readable medium, which may include a computer storage medium (or non-transitory medium) and a communication medium (or transient medium). As known to those skilled in the art, the term computer storage medium includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disk (DVD) or other optical disk storage, magnetic cassettes, magnetic tapes, disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and can be accessed by a computer. Furthermore, it is well known to those skilled in the art that communication media typically include computer readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media.

[0054] The above is a specific description of the preferred implementation of the present invention, but the present invention is not limited to the above-mentioned implementation mode. Technical personnel familiar with the field can also make various equivalent deformations or substitutions under the shared conditions without violating the spirit of the present invention. These equivalent deformations or substitutions are all included in the scope defined by the claims of the present invention.

Claims

1. A film peeling machine for HDI circuit boards, characterized in that: include: An adsorption platform, wherein the adsorption platform is provided with an easy-tear sticker taking position, the adsorption platform is used to place a circuit board, the surface of the circuit board is covered with a film, the surface of the film is attached with a tape, the outer side of the adsorption platform is provided with a first X-axis linear motor, a second X-axis linear motor and a Y-axis linear motor, the Y-axis linear motor can slide on the first X-axis linear motor and the second X-axis linear motor, and one side of the Y-axis linear motor is provided with two Z-axis linear motors; Two film tearing assemblies, the film tearing assembly is installed on the front side of the Z-axis linear motor, the Z-axis linear motor drives the film tearing assembly to slide in the vertical direction, the film tearing assembly includes a clamping jaw assembly and a first driving assembly, the first driving assembly is connected to the clamping jaw assembly, the first driving assembly is used to drive the clamping jaw assembly to rotate, the clamping jaw assembly includes a small clamping jaw, a large clamping jaw, an adsorption pressure head and a camera, the small clamping jaw is located inside the large clamping jaw, the small clamping jaw is connected to a finger cylinder, the large clamping jaw is connected to a second driving assembly, the adsorption pressure head is connected to a third driving assembly, the third driving assembly is used to drive the adsorption pressure head to approach or move away from the small clamping jaw, the camera is fixed to one side of the film tearing assembly, and the shooting direction of the camera is aligned with the adsorption platform; A controller is communicatively connected to the adsorption platform, the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor and the film tearing assembly.

2. The film peeling machine for HDI circuit board according to claim 1, characterized in that: The upper clamping part of the small clamping jaw is provided with a first through hole, the lower clamping part of the small clamping jaw is provided with a second through hole, the first through hole and the second through hole are interconnected, an optical fiber sensor is provided above the first through hole, and the optical fiber sensor is communicatively connected to the controller.

3. The film peeling machine for HDI circuit board according to claim 1, characterized in that: The first driving assembly includes a first servo motor, a first harmonic reducer, a second servo motor and a second harmonic reducer, the first servo motor is installed on the front side of the Z-axis linear motor, the first harmonic reducer is connected to the bottom of the first servo motor, the first harmonic reducer is connected to the second harmonic reducer through a mounting plate, the second servo motor is connected to the side of the second harmonic reducer away from the adsorption platform, the clamping jaw assembly is connected to the side of the second harmonic reducer close to the adsorption platform, a pressure sensor is arranged between the second harmonic reducer and the clamping jaw assembly, and the first servo motor, the second servo motor and the pressure sensor are respectively communicatively connected to the controller.

4. The film peeling machine for HDI circuit board according to claim 1, characterized in that: A pressure plate assembly is provided on both opposite sides of the adsorption platform, and the pressure plate assembly includes a pressure plate, a cylinder, a third servo motor and a transmission assembly. The third servo motor is connected to the pressure plate through the transmission assembly, and the third servo motor drives the pressure plate to approach or move away from the adsorption platform through the transmission assembly. The cylinder is connected to the pressure plate, and the cylinder is used to drive the pressure plate to move in a vertical direction. An ion wind rod is provided above the pressure plate assembly, and the air outlet of the ion wind rod is aligned with the adsorption platform, wherein the cylinder, the third servo motor and the ion wind rod are respectively communicatively connected to the controller.

5. A control method for a film peeling machine for HDI circuit boards, characterized in that: A controller for a film peeling machine for an HDI circuit board according to any one of claims 1 to 4, the method comprising: After the circuit board is placed on the adsorption platform, the adsorption platform is controlled to work. When the adsorption platform adsorbs the circuit board, the camera is controlled to locate the circuit board to generate a positioning result, and the positioning result is sent to the controller, and then the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor and the first driving assembly are controlled to move the clamping claw assembly to the easy-tear sticker taking position; Control the second driving assembly and the finger cylinder to make the small clamping claws clamp the easy-tear sticker, control the third driving assembly to make the adsorption pressure head move in a direction close to the small clamping claws, and when the adsorption pressure head abuts against the easy-tear sticker, control the adsorption pressure head to adsorb the easy-tear sticker; Based on the positioning result, the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor and the first driving assembly are controlled so that the adsorption pressure head presses the easily-tearable tape attached to the circuit board; Control the third driving assembly and the adsorption pressure head so that the adsorption pressure head releases the easy-tear label and moves in a direction away from the small clamping claw, and then control the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor and the first driving assembly to increase the angle between the small clamping claw and the adsorption platform; When the small jaw is perpendicular to the adsorption platform, the first drive assembly and the second drive assembly are controlled to make the large jaw rotate after closing; when the large jaw rotates to the film tearing angle, the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor and the first drive assembly are controlled to make the large jaw move along a preset trajectory; when the large jaw is located at the end point of the preset trajectory, the camera is controlled to acquire the image of the circuit board, and the comparison result of the image of the circuit board and the preset image is sent to the controller; when the comparison result is inconsistent, the controller alarms.

6. The control method of the film peeling machine for HDI circuit board according to claim 5, characterized in that: The upper clamping part of the small clamping jaw is provided with a first through hole, the lower clamping part of the small clamping jaw is provided with a second through hole, the first through hole and the second through hole are connected to each other, an optical fiber sensor is provided above the first through hole, and the optical fiber sensor is communicatively connected to the controller; Control the second driving assembly and the finger cylinder to enable the small gripper to grip the easy-tear sticker, including: controlling the second drive assembly to open the large jaw; Controlling the finger cylinder to open and then close the small gripper; When the easy-tear label is located between the first through hole and the second through hole, the optical fiber sensor sends a material removal completion signal to the controller.

7. The control method of the film peeling machine for HDI circuit board according to claim 5, characterized in that: A pressure plate assembly is provided on both sides of the adsorption platform, and the pressure plate assembly includes a pressure plate, a cylinder, a third servo motor and a transmission assembly. The third servo motor is connected to the pressure plate through the transmission assembly, and the third servo motor drives the pressure plate to approach or move away from the adsorption platform through the transmission assembly. The cylinder is connected to the pressure plate, and the cylinder is used to drive the pressure plate to move in a vertical direction. An ion wind rod is provided above the pressure plate assembly, and the air outlet of the ion wind rod is aligned with the adsorption platform, wherein the cylinder, the third servo motor and the ion wind rod are respectively communicatively connected to the controller; Before controlling the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor and the first driving assembly based on the positioning result so that the adsorption pressure head presses the easy-to-tear tape attached to the circuit board, the method further includes: Controlling the third servo motor to move the pressing plate to above the edge pressing position of the adsorption platform; Controlling the cylinder to move the pressing plate downward until the pressing plate abuts against the circuit board; The ion wind rod is controlled to start, and the ion wind rod outputs ion wind in the direction of the adsorption platform.

8. The control method of the film peeling machine for HDI circuit board according to claim 5, characterized in that: The first driving assembly includes a first servo motor, a first harmonic reducer, a second servo motor and a second harmonic reducer, the first servo motor is installed on the front side of the Z-axis linear motor, the first harmonic reducer is connected to the bottom of the first servo motor, the first harmonic reducer is connected to the second harmonic reducer through a mounting plate, the second servo motor is connected to the side of the second harmonic reducer away from the adsorption platform, the clamping jaw assembly is connected to the side of the second harmonic reducer close to the adsorption platform, a pressure sensor is arranged between the second harmonic reducer and the clamping jaw assembly, and the first servo motor, the second servo motor and the pressure sensor are respectively communicatively connected to the controller; After controlling the third driving assembly and the suction pressure head so that the suction pressure head releases the easy-tear label and moves in a direction away from the small clamping claw, the method further includes: Controlling the pressure sensor to start and send the real-time pressure value to the controller; Control the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor, the first servo motor and the second servo motor to move the large jaw along the preset trajectory. When the large jaw is located at the preset trajectory and the real-time pressure value is zero, control the pressure sensor to send an alarm signal to the controller.

9. A control device for a film peeling machine for HDI circuit boards, characterized in that: It includes at least one control processor and a memory for communicating with the at least one control processor; the memory stores instructions that can be executed by the at least one control processor, and the instructions are executed by the at least one control processor so that the at least one control processor can execute the control method of the film tearing machine for HDI circuit boards as described in any one of claims 5 to 8.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer-executable instructions, and the computer-executable instructions are used to enable a computer to execute the control method of the film peeling machine for HDI circuit boards according to any one of claims 5 to 8.

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