Refrigerating system

Abstract

The invention provides a refrigerating system, which belongs to the technical field of household appliances and comprises a shell, a semiconductor chip and a first heat exchange assembly. Wherein a cold storage agent is arranged in the shell. The semiconductor chip is connected with the shell and comprises a cold end and a hot end, the cold end is suitable for refrigerating the coolant, and the hot end is arranged away from the shell. The first heat exchange assembly extends into the shell and exchanges heat with the cold storage agent. The semiconductor chip is used for refrigeration, the refrigeration process is carried out when the refrigeration equipment needs to be in the standby state, the cold energy generated by the semiconductor chip is stored in the cold storage agent, and when the refrigeration equipment needs to be used, the cold energy in the cold storage agent is provided for a user through the first heat exchange assembly; and enough time is provided for cold storage work, so that the low-power semiconductor chip can adapt to household appliances needing a refrigeration system, and meanwhile, the basic cost of the household appliances cannot be greatly influenced.

Description

Technical Field

[0001] The present invention relates to the technical field of household electrical appliances, and in particular to a refrigeration system. Background Art

[0002] Air conditioning systems are commonly used household appliances. Air conditioning generally covers indoor living rooms and bedrooms, but cannot cover kitchen and bathroom spaces. However, kitchen and bathroom spaces also have the need to use air conditioning. If air conditioning is introduced into the kitchen and bathroom, holes need to be reserved on the walls of the kitchen and bathroom for the refrigerant pipes of the air conditioner to pass through, and the corresponding indoor units need to be adapted for installation and use. If the air conditioner is connected to the kitchen and bathroom space, it must be reserved in advance by a professional construction team before decoration, preferably during the developer's construction period. However, some customers do not have this demand, and it is difficult to unify the standards. In addition, the cost of adding indoor units is relatively high. If air conditioning equipment is adapted to more indoor units, a larger power and higher performance compressor is required, which will also increase the cost of air conditioning.

[0003] What is needed is a low-power device that can be adapted to household appliances that require a refrigeration system, such as kitchen air conditioners, range hoods, cold fans, tower fans, refrigerators, etc., and will not have a significant impact on the basic cost of the household appliances. Summary of the invention

[0004] Therefore, the technical problem to be solved by the present invention is to overcome the defect that there is no low-power refrigeration household appliance in the prior art, thereby providing a refrigeration system.

[0005] The present invention provides a refrigeration system, comprising:

[0006] A shell having a refrigerant disposed therein;

[0007] A semiconductor chip is connected to the shell, the semiconductor chip includes a cold end and a hot end, the cold end is suitable for cooling the refrigerant, and the hot end is arranged away from the shell

[0008] The first heat exchange component extends into the shell, and the first heat exchange component exchanges heat with the refrigerant.

[0009] As a preferred solution, the first heat exchange component comprises:

[0010] A first heat exchange pipeline extends into the interior of the shell;

[0011] A first heat exchanger is disposed on the first heat exchange pipeline, wherein the first heat exchange pipeline is suitable for transferring the cold energy of the coolant to the first heat exchanger;

[0012] A fan is arranged at one side of the first heat exchanger, and the fan is suitable for blowing air toward the first heat exchanger.

[0013] As a preferred solution, the refrigeration system further comprises:

[0014] The second heat exchange component is connected to the hot end of the semiconductor chip; the second heat exchange component exchanges heat with the hot end.

[0015] As a preferred solution, the second heat exchange component comprises:

[0016] A heat sink, disposed at a hot end of the semiconductor chip;

[0017] The second heat exchange structure is connected to the heat sink, and the second heat exchange structure exchanges heat with the heat sink.

[0018] As a preferred solution, the second heat exchange structure comprises:

[0019] A second heat exchange pipeline is arranged corresponding to the heat sink;

[0020] A second heat exchanger is arranged on the second heat exchange pipeline; the second heat exchange pipeline is suitable for transferring the heat of the heat sink to the second heat exchanger;

[0021] A cooling structure is provided corresponding to the second heat exchanger; the cooling structure cools the second heat exchanger.

[0022] As a preferred solution, the refrigeration system further comprises:

[0023] A heat conducting sheet is arranged inside the shell, and the cold end of the semiconductor is suitable for transferring cold energy to the coolant through the heat conducting sheet.

[0024] As a preferred embodiment, the heat conductive sheet includes a connecting portion and an extending portion, wherein a first side of the connecting portion is in contact with an inner wall of the shell, a first end of the extending portion is connected to a second side of the connecting portion, and a second end of the extending portion extends toward the interior of the shell.

[0025] As a preferred solution, there are a plurality of extension parts, and the plurality of extension parts are arranged at intervals along the extension direction of the connecting part.

[0026] As a preferred solution, the refrigeration system further comprises:

[0027] The heat-insulating layer is wrapped outside the shell.

[0028] As a preferred solution, the coolant is water.

[0029] The technical solution of the present invention has the following advantages:

[0030] 1. The present invention provides a refrigeration system, in which a semiconductor chip cools the interior of a shell, so that a refrigerant in the shell stores cold energy, a first heat exchange component extends into the interior of the shell to exchange heat with the refrigerant, and the first heat exchange component brings the cold energy stored in the refrigerant to household appliances that require refrigeration, thereby meeting the refrigeration needs of the household appliances; and the present invention uses semiconductor chips for refrigeration, wherein the refrigeration process is performed when the household appliances are required to be in a standby state, generally at night or in idle time, the cold energy generated by the semiconductor chip is stored in the refrigerant, and when it is needed, the cold energy in the refrigerant is provided to the household appliances through the first heat exchange component, thereby meeting the user's use needs, because the cold energy is stored in the idle time, there is enough time for the cold energy storage work, so the use of low-power semiconductor chips can adapt to kitchen air conditioners, range hoods, cold fans, tower fans, refrigerators and other household appliances that require refrigeration systems, while not having a significant impact on the basic cost of the household appliances.

[0031] 2. The present invention provides a refrigeration system, wherein the first heat exchange component includes a first heat exchange pipeline, a first heat exchanger and a fan. The first heat exchange pipeline is used in conjunction with the first heat exchanger to transfer the cold stored in the refrigerant to the first heat exchanger, and then the cold stored in the first heat exchanger is delivered to the household appliances that need refrigeration through the airflow blown out by the fan. The first heat exchange component has the advantages of simple structure and low cost.

[0032] 3. The present invention provides a refrigeration system, wherein the refrigeration system also includes a second heat exchange component, which cools the hot end of the semiconductor chip. The second heat exchange component has the advantage of preventing the hot end of the semiconductor chip from being overheated, which causes the overall refrigeration effect to deteriorate.

[0033] 4. The present invention provides a refrigeration system, wherein the second heat exchange component includes a heat sink and a second heat exchange structure; wherein the heat sink is arranged at the hot end of the semiconductor chip, and the material of the heat sink is a metal with a small specific heat, and the heat sink is contacted with the hot end, and the heat sink absorbs heat very quickly, and at the same time, the speed of heat loss is also relatively fast, so that the heat transfer has the effect of rapid heat dissipation. The second heat exchange component further dissipates heat from the heat sink to improve the heat dissipation effect of the heat sink.

[0034] 5. The present invention provides a refrigeration system, wherein a heat conductive sheet is arranged inside a shell, the heat conductive sheet contacts the cold end of the semiconductor sheet, and transfers the cold energy of the cold end of the semiconductor sheet to the refrigerant. The heat conductive sheet increases the contact area between the cold end and the refrigerant in disguised form, thereby increasing the efficiency of cold energy transfer.

[0035] 6. The present invention provides a refrigeration system, which is also wrapped with a thermal insulation layer outside the shell. The thermal insulation layer can isolate the heat exchange inside and outside the shell, and has the advantage of reducing the loss of cold in the shell. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0037] Figure 1 The present invention provides an overall structural schematic diagram of a refrigeration system.

[0038] Description of reference numerals:

[0039] 1. Shell; 2. Semiconductor chip; 3. First heat exchange component; 31. First heat exchange pipeline; 32. First heat exchanger; 33. Fan; 4. Second heat exchange component; 41. Heat sink; 42. Second heat exchange structure; 421. Second heat exchange pipeline; 422. Second heat exchanger; 423. Cooling structure; 5. Heat conducting sheet; 51. Connecting part; 52. Extension part; 6. Insulation layer. DETAILED DESCRIPTION

[0040] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.

[0042] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0043] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0044] In the related art, when the user starts refrigeration, the refrigeration system starts working immediately, and its working mode is start-up as needed. The refrigeration structure is a high-power compressor or a high-power semiconductor chip 2, etc., which has high power and high cost.

[0045] like Figure 1 As shown, this embodiment provides a refrigeration system, including a shell 1, a semiconductor chip 2 and a first heat exchange component 3. A refrigerant is arranged inside the shell 1. The semiconductor chip 2 is connected to the shell 1, wherein the semiconductor chip 2 includes a cold end and a hot end, the cold end is suitable for cooling the refrigerant, and the hot end is arranged away from the shell 1. The first heat exchange component 3 extends into the shell 1 and exchanges heat with the refrigerant.

[0046] In this embodiment, the interior of the shell 1 is cooled by the semiconductor chip 2, so that the refrigerant in the shell 1 stores cold energy, and the first heat exchange component 3 extends into the shell 1 to exchange heat with the refrigerant. The first heat exchange component 3 brings the cold energy stored in the refrigerant to the household appliance that needs to be cooled, using a working mode of first storing cold energy and then using cold energy, thereby realizing the refrigeration demand of the household appliance. In this embodiment, the semiconductor chip 2 is used for refrigeration, wherein the refrigeration process is carried out when the refrigeration equipment is in a standby state. Generally, at night or in idle time, the cold energy generated by the semiconductor chip 2 is stored in the refrigerant. When it is needed, the cold energy in the refrigerant is provided to the user through the first heat exchange component 3. Because the cold energy is stored in idle time, there is enough time for the cold energy storage work, so the low-power semiconductor chip 2 can be used for refrigeration. While the refrigeration system is adapted to household appliances that require refrigeration systems, such as kitchen air conditioners, range hoods, cold fans 33, tower fans, refrigerators, etc., it will not have a significant impact on the basic cost of household appliances.

[0047] It should be noted that in this embodiment, the cold end of the semiconductor chip 2 is the end close to the housing 1, and the hot end is the other end opposite to the cold end. In this embodiment, the volume of the semiconductor chip 2 is only the size of a palm, the volume of the semiconductor chip 2 is small and its cost is significantly lower than that of compressor refrigeration, thereby ensuring that the cost of the home appliance will not be greatly affected.

[0048] like Figure 1 As shown, in this embodiment, three semiconductor chips 2 are arranged side by side.

[0049] It should be noted that the refrigerant is a material with a large specific heat capacity. In this embodiment, water is selected as the refrigerant in consideration of factors such as cost. However, if cost factors are not considered, a chemically synthesized coolant with a larger specific heat capacity than water can also be selected as the refrigerant.

[0050] It should be noted that the cold capacity stored in the shell 1 in which the coolant is water can be used continuously for 1.5 hours to 3 hours, which can fully meet the general needs of users.

[0051] It should be noted that the shape of the housing 1 is not limited to a rectangular parallelepiped. When the housing 1 is adapted to different electrical devices, its shape can be changed according to the installation space of the electrical device.

[0052] Further, such as Figure 1 As shown, the first heat exchange assembly 3 includes a first heat exchange pipeline 31, a second heat exchanger 422 and a fan 33. The first heat exchange pipeline 31 extends into the interior of the housing 1 and exchanges heat with the refrigerant. The first heat exchanger 32 is arranged on the first heat exchange pipeline 31, and the first heat exchange pipeline 31 is suitable for transferring the cold of the refrigerant to the first heat exchanger 32. The fan 33 is arranged on one side of the first heat exchanger 32 and is suitable for blowing air toward the first heat exchanger 32.

[0053] The first heat exchange pipeline 31 cooperates with the first heat exchanger 32 to transfer the cold stored in the refrigerant to the first heat exchanger 32, and then the cold is taken away by the airflow blown by the fan 33, so that the cold stored in the first heat exchanger 32 is sent to the household appliance that needs to be refrigerated. The first heat exchange component 3 arranged in this way has the advantages of simple structure and low cost.

[0054] It should be noted that a heat exchange medium flows in the first heat exchange pipeline 31 , and the heat exchange medium plays a role in heat transfer.

[0055] It should be noted that if Figure 1 As shown, in this embodiment, a first on-off valve is also provided on the first heat exchange pipeline 31, and the first heat exchange component 3 can be started and closed by controlling the switch of the first on-off valve. A first power pump is also provided on the first heat exchange pipeline 31, and the first power pump can provide power for the heat exchange medium in the first heat exchange pipeline 31. Other common structures in the pipeline, such as an alarm structure, can also be provided on the first heat exchange pipeline 31.

[0056] Further, such as Figure 1 As shown, the refrigeration system also includes a second heat exchange component 4. The second heat exchange component 4 is connected to the hot end of the semiconductor chip 2 and exchanges heat with the hot end. The hot end of the semiconductor chip 2 is heat exchanged by the second heat exchange component 4, so that the temperature of the hot end is reduced. The second heat exchange component 4 has the advantage of preventing the hot end of the semiconductor chip 2 from being overheated, which leads to a poor overall refrigeration effect.

[0057] Specifically, Figure 1As shown, the second heat exchange component 4 includes a heat sink 41 and a second heat exchange structure 42. The heat sink 41 is arranged at the hot end of the semiconductor chip 2 and contacts the hot end. In this embodiment, in order to increase the heat dissipation effect of the heat sink 41, the heat sink 41 is covered on three semiconductor chips 2, and a heat conductive medium is applied between the heat sink 41 and the semiconductor chip 2. The second heat exchange structure 42 is connected to the heat sink 41, and the second heat exchange structure 42 exchanges heat with the heat sink 41, thereby cooling the heat sink 41. The second heat exchange structure 42 can further increase the heat dissipation effect of the heat sink 41.

[0058] It should be noted that the material of the heat sink 41 is a metal with a small specific heat, and in this embodiment, the material of the heat sink 41 is aluminum. When the heat sink 41 is in contact with the hot end, the heat sink 41 absorbs heat very quickly, and at the same time, the speed of heat loss is also relatively fast. In this way, by transferring the heat from the hot end to the heat sink 41, part of the heat is quickly dissipated into the air through the heat sink 41, and part of the heat is dissipated through the second heat exchange structure 42, thereby achieving a rapid heat dissipation effect.

[0059] Specifically, Figure 1 As shown, the second heat exchange structure 42 includes a second heat exchange pipeline 421, a second heat exchanger 422 and a cooling structure 423. The second heat exchange pipeline 421 extends into the interior of the heat sink 41 and exchanges heat with the heat sink 41. The second heat exchanger 422 is arranged on the second heat exchange pipeline 421, and the second heat exchange pipeline 421 is suitable for transferring the heat of the heat sink 41 to the second heat exchanger 422. The cooling structure 423 is arranged corresponding to the second heat exchanger 422, and the cooling structure 423 can cool the second heat exchanger 422. The second heat exchange pipeline 421 transfers the heat in the heat sink 41 to the second heat exchanger 422, and then takes away the heat from the second heat exchanger 422 through the cooling structure 423.

[0060] It should be noted that, in this embodiment, the cooling structure 423 is disposed on one side of the second heat exchanger 422, and air cooling is used to cool the second heat exchanger 422; the cooling structure 423 can also be water cooling or other cooling methods.

[0061] It should be noted that a heat exchange medium flows in the second heat exchange pipeline 421 , and the heat exchange medium plays a role in heat transfer.

[0062] It should be noted that, in this embodiment, a second on-off valve is also provided on the second heat exchange pipeline 421, and the second heat exchange component 4 can be started and closed by controlling the switch of the second on-off valve. A second power pump is also provided on the second heat exchange pipeline 421, and the second power pump can provide power for the heat exchange medium in the second heat exchange pipeline 421. Other common structures in the pipeline, such as an alarm structure, can also be provided on the second heat exchange pipeline 421.

[0063] It should be noted that the cooling structure 423 in this embodiment is a blowing structure, which cools the second heat exchanger 422 by airflow. The cooling structure 423 can also be water-cooled or other cooling structures.

[0064] It should be noted that in order to increase the heat exchange effect between the second heat exchange pipeline 421 and the heat sink 41 , the second heat exchange pipeline 421 is bent inside the heat sink 41 , and the bending setting can increase the contact area between the second heat exchange pipeline 421 and the heat sink 41 .

[0065] Further, such as Figure 1 As shown, the refrigeration system also includes a heat conductive sheet 5; the heat conductive sheet 5 is arranged inside the shell 1, and the cold end of the semiconductor is suitable for transferring the cold to the cold storage agent through the heat conductive sheet 5. If the heat conductive sheet 5 is not provided, the cold of the semiconductor sheet 2 is directly transferred to the cold storage agent, the contact area between the semiconductor sheet 2 and the cold storage agent is small, and the cold in the local cold storage agent accumulates rapidly, and the cold storage agent near the cold end will freeze. The frozen cold storage agent will hinder the transfer of the cold on the cold end to the cold storage agent, resulting in poor cold storage effect of the cold storage agent. By providing the heat conductive sheet 5, the contact area between the cold end and the cold storage agent is increased, so that the cold at the cold end is evenly transferred to the cold storage agent, preventing the occurrence of local freezing, and ensuring the cold storage effect of the cold storage agent.

[0066] Specifically, Figure 1 As shown, the heat conducting sheet 5 includes a connecting portion 51 and an extending portion 52, wherein a first side of the connecting portion 51 is in contact with the inner wall of the housing 1. A first end of the extending portion 52 is connected to a second side of the connecting portion 51, and a second end of the extending portion 52 extends toward the interior of the housing 1.

[0067] Specifically, Figure 1 As shown, there are a plurality of extending portions 52 , and the plurality of extending portions 52 are arranged at intervals along the extending direction of the connecting portion 51 .

[0068] It should be noted that the connecting portion 51 and the extension portion 52 can be connected by welding, bonding or integral molding, wherein the function of the extension portion 52 is to increase the contact area with the refrigerant. In the present embodiment, the extension portion 52 is in the shape of a long strip. In order to further increase the contact area between the extension portion 52 and the refrigerant, the extension portion 52 can also be in a wavy shape, etc.

[0069] Furthermore, the refrigeration system further comprises a heat-insulating layer 6 . The heat-insulating layer 6 is wrapped outside the shell 1 , and the heat-insulating layer 6 can isolate the heat exchange inside and outside the shell 1 , and has the advantage of reducing the loss of cold in the shell 1 .

[0070] When the refrigeration system of this embodiment is applied, when the household appliance is on standby, the semiconductor chip 2 starts to work, and the cold end of the semiconductor chip 2 stores cold energy in the refrigerant; at the same time, the second heat exchange component 4 works to cool the hot end of the semiconductor chip 2; when the household appliance is started, the first heat exchange component 3 works, and through coordinated use, the cold energy stored in the refrigerant is transferred to the first heat exchanger 32, and then the cold energy is taken away by the airflow blown out by the fan 33, thereby delivering the cold energy stored in the first heat exchanger 32 to the household appliance that needs refrigeration.

[0071] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention.

Claims

1. A refrigeration system, characterized in that: include: A shell (1) having a refrigerant disposed therein; A semiconductor chip (2) is connected to the shell (1), and the semiconductor chip (2) includes a cold end and a hot end, the cold end is suitable for cooling the refrigerant, and the hot end is provided with a first heat exchange component (3) away from the shell (1) and extends into the shell (1), and the first heat exchange component (3) exchanges heat with the refrigerant.

2. The refrigeration system according to claim 1, characterized in that: The first heat exchange component (3) comprises: A first heat exchange pipeline (31) extends into the interior of the shell (1); A first heat exchanger (32) is arranged on the first heat exchange pipeline (31), wherein the first heat exchange pipeline (31) is suitable for transferring the cold energy of the refrigerant to the first heat exchanger (32); A fan (33) is arranged on one side of the first heat exchanger (32), and the fan (33) is suitable for blowing air toward the first heat exchanger (32).

3. The refrigeration system according to claim 1 or 2, characterized in that: The refrigeration system further comprises: The second heat exchange component (4) is connected to the hot end of the semiconductor chip (2); the second heat exchange component (4) exchanges heat with the hot end.

4. The refrigeration system according to claim 3, characterized in that: The second heat exchange component (4) comprises: A heat sink (41) is arranged at the hot end of the semiconductor chip (2); The second heat exchange structure (42) is connected to the heat sink (41), and the second heat exchange structure (42) exchanges heat with the heat sink (41).

5. The refrigeration system according to claim 4, characterized in that: The second heat exchange structure (42) comprises: A second heat exchange pipeline (421) is arranged corresponding to the heat sink (41); A second heat exchanger (422) is arranged on the second heat exchange pipeline (421); the second heat exchange pipeline (421) is suitable for transferring the heat of the heat sink (41) to the second heat exchanger (422); A cooling structure (423) is arranged corresponding to the second heat exchanger (422); the cooling structure (423) cools the second heat exchanger (422).

6. The refrigeration system according to claim 1 or 2, characterized in that: The refrigeration system further comprises: A heat conducting sheet (5) is arranged inside the shell (1), and the cold end of the semiconductor is suitable for transferring cold energy to the cold storage agent through the heat conducting sheet (5).

7. The refrigeration system according to claim 6, characterized in that: The heat conducting sheet (5) comprises a connecting portion (51) and an extending portion (52), wherein a first side of the connecting portion (51) is in contact with an inner wall of the shell (1), a first end of the extending portion (52) is connected to a second side of the connecting portion (51), and a second end of the extending portion (52) extends toward the interior of the shell (1).

8. The refrigeration system according to claim 7, characterized in that: There are a plurality of extension parts (52), and the plurality of extension parts (52) are arranged at intervals along the extension direction of the connecting part (51).

9. The refrigeration system according to claim 1 or 2, characterized in that: The refrigeration system further comprises: A heat-insulating layer (6) is wrapped around the shell (1).

10. The refrigeration system according to claim 1 or 2, characterized in that: The coolant is water.

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