Pick-and-place device and chip automatic test system

Abstract

According to the pick-and-place equipment and the chip automatic test system provided by the invention, the single bare chip is tested after the wafer is cut, so that defects or unqualified products which may not be found in a wafer-level test can be identified more accurately. The defects may be introduced in the wafer cutting process, such as cutting damage, pollution and the like. Therefore, the test method can effectively improve the yield of final products, and reduces resource waste and cost increase caused by the fact that unqualified bare chips flow into subsequent production links. Moreover, through the pick-and-place device, the test device and the take-out device, the automatic processing flow of placing the bare chips in the chip carrier, then placing the chip carrier on the tray, carrying out batch test through the tray and taking the bare chips out of the chip carrier after test can be realized, the processing speed is improved, and the labor cost and human errors are reduced.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a pick-and-place device and a chip automatic testing system. Background Art

[0002] The wafer-level testing of advanced process chips (such as HBM chips) is relatively mature, but there is no good solution for chip-level testing.

[0003] Take HBM chip as an example. HBM chip is a high-performance DRAM based on 3D stacking process, which is designed to meet the high demand for memory bandwidth and capacity in high-performance computing, artificial intelligence and graphics processing. HBM is a new type of memory chip technology that achieves high-speed and high-bandwidth memory access by vertically stacking multiple DRAM chips and using advanced packaging technologies such as through silicon vias (TSV) and micro bumps.

[0004] The manufacturing process of HBM chips mainly includes: thinning and bumping the memory core wafer, and then cutting it to obtain multiple bare dies; thinning and bumping the logic wafer; stacking multiple bare dies on the logic wafer to obtain a stacked wafer; cutting and wafer debonding or peeling the stacked wafer to obtain multiple stacked bare chips, which are then packaged in tape and reel and enter the subsequent process of batch shipment.

[0005] The existing technology for testing HBM chips mainly includes: testing of memory core wafers, testing of logic wafers, and testing of stacked wafers. However, in the manufacturing process of HBM chips, after obtaining the stacked wafers, wafer cutting and wafer debonding or peeling are also performed. This process may produce unqualified HBM units. These unqualified HBM units are assembled into 2.5D packages, resulting in a decrease in product yield. Summary of the invention

[0006] The purpose of the embodiments of the present application is to provide a pick-and-place device and a chip automatic testing system to solve the technical problem that the prior art only performs wafer-level testing and cannot detect unqualified bare chips after wafer cutting, resulting in a decrease in product yield.

[0007] A pick-and-place device provided in an embodiment of the present application includes: a carrier transfer device, a chip transfer device and a pick-and-place mechanical arm group;

[0008] The carrier transfer device is used to transfer the chip carrier to the pick-and-place station;

[0009] The chip transfer device is used to transfer the tape or frame containing bare chips to the pick-and-place station;

[0010] The pick-and-place robot arm group is used to place the bare chip at the pick-and-place station into the chip carrier at the pick-and-place station, and move the chip carrier with the bare chip to the tray at the entrance of the test equipment.

[0011] In some optional embodiments, the pick-and-place robot arm group includes: a first robot arm, a second robot arm, and a move-in robot arm;

[0012] The first robot arm is used to absorb the cover plate of the chip carrier to expose the cavity inside the chip carrier;

[0013] The second robot arm is used to pick up the bare chip on the tape and place the bare chip into the chip carrier through the opening of the chip carrier;

[0014] The first robot arm is also used to cover the opening of the chip carrier with a cover plate after the bare chip is placed in the chip carrier;

[0015] The robot arm is moved in to clamp the carrier body of the chip carrier; and after the cover plate covers the opening of the chip carrier, the chip carrier with the bare chip is moved to the empty position of the tray at the entrance of the test equipment.

[0016] In some optional embodiments, the pick-and-place robot arm assembly further includes: a flipping device;

[0017] The second robot arm is used to pick up the bare chip on the frame, place the bare chip on the flipping device to flip it over, pick up the flipped bare chip and put the bare chip into the chip carrier through the opening of the chip carrier.

[0018] In some optional embodiments, a CCD camera is provided on the second robotic arm; the CCD camera is used to perform necessary appearance inspection on the front, back and sides of the bare chip during the process of sucking up the bare chip and placing the bare chip into the chip carrier to ensure that the picked bare chip has no abnormalities.

[0019] In some optional embodiments, the second robotic arm includes a pressure feedback monitoring module; in the process of placing the bare chip into the chip carrier, the pressure of pressing the bare chip is detected in real time according to the pressure feedback monitoring module and the force is adjusted to control the pressure to be less than or equal to the set value.

[0020] In some optional embodiments, the bottom plate surface of the chip carrier has a positioning mark; the second robot arm places the bare chip into the chip carrier according to the positioning mark, wherein the positioning accuracy of the bare chip in the process of placing the bare chip into the chip carrier is less than 30um.

[0021] In some optional embodiments, the carrier introduction device includes: a first clamping assembly;

[0022] The first clamping assembly is used to clamp the chip carrier; after the bare chip is placed in the chip carrier, the first clamping assembly is released.

[0023] In some optional embodiments, the pick-and-place robotic arm group includes: a first robotic arm and a second robotic arm;

[0024] The first robot arm is used to absorb the cover plate of the chip carrier to expose the cavity inside the chip carrier;

[0025] The second robot arm is used for picking up the bare chip and placing the bare chip into the chip carrier through the opening of the chip carrier;

[0026] The first robot arm is also used to cover the opening of the chip carrier with a cover plate after the bare chip is placed in the chip carrier;

[0027] The first mechanical arm or the second mechanical arm is used to clamp the carrier body of the chip carrier after the first clamping assembly is released, and move the chip carrier with the bare chip to an empty position of the tray at the entrance of the test equipment.

[0028] In some optional embodiments, the chip transfer device is used to transfer the bare chip to the pick-and-place station when the bare chip needs to be tested; when the bare chip does not need to be tested, the bare chip is transferred to the tape pick-and-place station.

[0029] An automatic chip testing system provided in an embodiment of the present application includes: a pick-and-place device, a testing device, and a take-out device;

[0030] The pick-and-place device is used to place the bare chips obtained by cutting the wafer into the corresponding chip carrier, and place the chip carrier with the bare chips on the empty space of the tray at the entrance of the test equipment;

[0031] The testing device is used to move the tray at the entrance of the testing device to the testing station, and perform a test on the chip carriers on at least two placement areas of the tray; after the test, the tray is moved to the exit of the testing device;

[0032] The take-out device is used to obtain the chip carrier on the tray at the exit of the test equipment; take the bare chip out of the chip carrier, wherein the qualified bare chip enters the tape packaging link or is put back on the Frame.

[0033] In the above technical solution, by testing a single bare chip after wafer cutting, defects or defective products that may not be discovered in wafer-level testing can be more accurately identified. These defects may be introduced during the wafer cutting process, such as cutting damage, contamination, etc. Therefore, this testing method can effectively improve the yield of the final product and reduce the waste of resources and increased costs caused by the flow of unqualified bare chips into subsequent production links. In addition, through the placement equipment, testing equipment and removal equipment, it is possible to realize the automated processing flow of "placing the bare chip in the chip carrier, then placing the chip carrier on the tray, performing batch testing through the tray, and removing the bare chip from the chip carrier after testing", thereby improving the processing speed and reducing labor costs and human errors.

[0034] In some optional embodiments, the pick-and-place device includes: a carrier introduction device, a chip introduction device, and a pick-and-place mechanical arm group;

[0035] The carrier transfer device is used to transfer the chip carrier to the pick-and-place station;

[0036] The chip transfer device is used to transfer the bare chip to the pick-and-place station;

[0037] The pick-and-place robot arm group is used to place the bare chip at the pick-and-place station into the chip carrier at the pick-and-place station, and move the chip carrier with the bare chip to the tray at the entrance of the test equipment.

[0038] In the above technical solution, the carrier transfer device and the chip transfer device are, for example, conveyor belts, etc. The carrier transfer device stops when transferring the chip carrier to the pick-and-place station, and the chip transfer device also stops when transferring the corresponding bare chip to the pick-and-place station. Then, the bare chip is placed in the chip carrier by the pick-and-place robot arm, and then the chip carrier with the bare chip is placed on the empty position of the tray at the entrance of the test equipment. After that, the carrier transfer device and the chip transfer device are started, and the above process is repeated until a set number of chip carriers are placed on the tray at the entrance of the test equipment, and the tray is sent to the test equipment for chip testing, and then the empty tray is placed at the entrance of the test equipment to fill the next tray.

[0039] In some optional embodiments, the chip transfer device is used to transfer the bare chip to the pick-and-place station when the bare chip needs to be tested; when the bare chip does not need to be tested, the bare chip is transferred to the tape pick-and-place station.

[0040] In some optional embodiments, the pick-and-place robot arm group includes: a first robot arm, a second robot arm, and a move-in robot arm;

[0041] The first robot arm is used to absorb the cover plate of the chip carrier to expose the cavity inside the chip carrier;

[0042] The second robot arm is used for picking up the bare chip and placing the bare chip into the chip carrier through the opening of the chip carrier;

[0043] The first robot arm is also used to cover the opening of the chip carrier with a cover plate after the bare chip is placed in the chip carrier;

[0044] The robot arm is moved in to clamp the carrier body of the chip carrier; and after the cover plate covers the opening of the chip carrier, the chip carrier with the bare chip is moved to the empty position of the tray at the entrance of the test equipment.

[0045] There are positioning marks on the cover of the chip carrier, and the first robot arm accurately picks up the cover of the chip carrier through the positioning marks. There are also positioning marks on the bare chip, and the second robot arm accurately picks up the bare chip through the positioning marks. There are positioning marks on the cavity inside the chip carrier, and the second robot arm can accurately place the bare chip into the chip carrier through the positioning marks.

[0046] The second robot arm has a pressure feedback monitoring module. When placing the bare chip into the chip carrier, the pressure feedback monitoring module detects the feedback pressure in real time and adjusts the force to avoid crushing the bare chip.

[0047] In the above technical solution, the carrier body of the chip carrier on the pick-and-place station is clamped by the moving-in robot arm, the cover plate of the chip carrier is sucked by the first robot arm, the bare chip is sucked and placed in the chip carrier by the second robot arm, and the opening of the chip carrier is covered with the cover plate by the first robot arm. Finally, the moving-in robot arm moves the chip carrier to the empty space on the tray at the entrance of the test equipment and releases the chip carrier.

[0048] In some optional embodiments, the testing device includes: a tray transfer device and a testing machine;

[0049] The tray transfer device is used to transfer the tray at the entrance of the test equipment to the test station;

[0050] The test machine is used to perform chip testing on each chip carrier on the tray of the test station;

[0051] The tray transfer device is also used to transfer the tray of the test station to the exit of the test equipment.

[0052] In the above technical solution, the entire testing process is automated from the tray transfer device transferring the tray from the entrance to the testing station, the testing machine performing chip testing on the chip carrier on the tray, to the tray transfer device transferring the tested tray to the exit. This process-based design greatly reduces manual intervention and improves testing efficiency and accuracy.

[0053] Specifically, there are multiple placement areas evenly distributed on the tray, each placement area is used to place a chip carrier, and these placement areas are numbered. The test machine tests the chip carrier in each numbered placement area, and after the test, the chip carriers corresponding to the placement areas with different numbers are labeled as qualified or unqualified.

[0054] In some optional embodiments, the testing device further comprises: a tray recovery device;

[0055] The tray recovery device is used to move the empty tray to the entrance of the test equipment after all chip carriers on the tray at the exit of the test equipment are removed.

[0056] In the above technical solution, the tray transfer device can continuously transfer the tray from the entrance of the test equipment to the test station, and the test machine can efficiently test the chip carrier on the tray that arrives at the test station. After the test is completed, the tray transfer device quickly transfers the tray to the exit to prepare for the next test cycle. This continuous operation method significantly improves the test efficiency.

[0057] Specifically, the tray recovery device may be a mechanical arm, which grabs the edge of the empty tray and moves it to the entrance of the test equipment for placement. The tray recovery device may also be a conveyor belt.

[0058] In some optional embodiments, the take-out device includes: a carrier outgoing device, a qualified chip outgoing device, and a take-out robot arm group;

[0059] The take-out robot arm group is used to move the chip carrier on the tray at the exit of the test equipment to the take-out station; and, take out the bare chip from the chip carrier, place the qualified bare chip on the qualified chip transfer device, and place the empty chip carrier on the carrier transfer device;

[0060] The qualified chip delivery device is used to deliver the qualified bare chips to the tape pick-and-place station;

[0061] The carrier outgoing device is connected to the carrier incoming device, and the empty chip carrier is transmitted to the pick-and-place station through the carrier outgoing device and the carrier incoming device.

[0062] In some optional embodiments, the removal device further includes: an NG chip discharging device; the NG chip discharging device is used to send unqualified bare chips to a recycling station.

[0063] In some optional embodiments, the removal robot arm group includes: a third robot arm, a fourth robot arm and a removal robot arm;

[0064] The third robot arm is used to pick up the cover plate of the chip carrier to expose the bare chip inside the chip carrier;

[0065] The fourth robot arm is used to pick up the bare chips; place the qualified bare chips on the qualified chip delivery device, or place the unqualified bare chips on the NG chip carrier of the NG chip delivery device; wherein the NG chip carrier includes a tray, a tape or a frame;

[0066] The third robot arm is also used to cover the opening of the chip carrier with a cover plate after the bare chip is taken out from the chip carrier;

[0067] The robot arm is used to move the chip carrier on the tray at the exit of the test equipment to the removal station and clamp the carrier body of the chip carrier; after the cover plate covers the opening of the chip carrier, the chip carrier is released to the carrier transfer device.

[0068] There are positioning marks on the cover of the chip carrier, and the third robot arm can accurately absorb the cover of the chip carrier through the positioning marks. There are positioning marks on the cavity inside the chip carrier, and the fourth robot arm can accurately take out the bare chip from the chip carrier through the positioning marks.

[0069] In some optional embodiments, a CCD camera is provided on the fourth robotic arm; the CCD camera is used to perform necessary appearance inspection on the front, back and sides of the bare chip during the process of sucking the bare chip from the chip carrier and placing the bare chip into the qualified chip output device to ensure that the picked bare chip has no abnormalities.

[0070] In some optional embodiments, the carrier introduction device includes: a first clamping assembly;

[0071] The first clamping assembly is used to clamp the chip carrier; after the bare chip is placed in the chip carrier, the first clamping assembly is released.

[0072] In some optional embodiments, the pick-and-place robotic arm group includes: a first robotic arm and a second robotic arm;

[0073] The first robot arm is used to absorb the cover plate of the chip carrier to expose the cavity inside the chip carrier;

[0074] The second robot arm is used for picking up the bare chip and placing the bare chip into the chip carrier through the opening of the chip carrier;

[0075] The first robot arm is also used to cover the opening of the chip carrier with a cover plate after the bare chip is placed in the chip carrier;

[0076] The first mechanical arm or the second mechanical arm is used to clamp the carrier body of the chip carrier after the first clamping assembly is released, and move the chip carrier with the bare chip to an empty position of the tray at the entrance of the test equipment.

[0077] In the above technical solution, since the carrier transfer device has a first clamping component for clamping the carrier body of the chip carrier, the first robot arm and the second robot arm can cooperate to realize the process of taking the bare chip out of the chip carrier. After the bare chip is taken out from the chip carrier, the first robot arm and the second robot arm are in an idle state, and the chip carrier can be moved to an empty space on the tray at the entrance of the test equipment by using the first robot arm or the second robot arm.

[0078] In some optional embodiments, the take-out device includes: a carrier outgoing device, a qualified chip outgoing device, and a take-out robot arm group;

[0079] The take-out robot arm group is used to move the chip carrier on the tray at the exit of the test equipment to the take-out station; take out the bare chip from the chip carrier, place the qualified bare chip on the qualified chip outgoing device, and place the empty chip carrier on the carrier outgoing device;

[0080] The qualified chip delivery device is used to deliver the bare chips to the tape pick-and-place station;

[0081] The carrier delivery device comprises: a second clamping assembly; the second clamping assembly is used to clamp the carrier body of the chip carrier when the chip carrier moves to the removal station;

[0082] The carrier outgoing device is connected to the carrier incoming device, and the empty chip carrier is transmitted to the pick-and-place station through the carrier outgoing device and the carrier incoming device.

[0083] In some optional embodiments, the removal robot arm group includes: a third robot arm and a fourth robot arm;

[0084] The third robot arm is used to pick up the cover plate of the chip carrier to expose the bare chip inside the chip carrier;

[0085] The fourth robot arm is used to pick up the bare chips; place the qualified bare chips on the qualified chip delivery device, or place the unqualified bare chips on the NG chip carrier of the NG chip delivery device; wherein the NG chip carrier includes a tray, a tape or a frame;

[0086] The third robot arm is also used to cover the opening of the chip carrier with a cover plate after the bare chip is taken out from the chip carrier;

[0087] The third robot arm or the fourth robot arm is also used to move the chip carrier on the tray at the exit of the testing equipment to the taking-out station.

[0088] In some optional embodiments, the bare chip includes an HBM chip, a 3D stacked chip, or an advanced process packaging chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0089] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0090] Figure 1 A schematic diagram of a chip automatic testing system provided in an embodiment of the present application;

[0091] Figure 2 A schematic diagram of a test device provided in an embodiment of the present application;

[0092] Figure 3 A schematic diagram of a pick-and-place device provided in the first embodiment of the present application;

[0093] Figure 4 A schematic diagram of a removal device provided in the first embodiment of the present application;

[0094] Figure 5 A schematic diagram of a pick-and-place device provided in a second embodiment of the present application;

[0095] Figure 6 Schematic diagram of the removal device provided for the second embodiment of the present application.

[0096] Icons: 1-pick and place equipment, 11-carrier transfer device, 12-chip transfer device, 13-pick and place robot arm group, 131-first robot arm, 132-second robot arm, 133-moving-in robot arm, 2-testing equipment, 21-tray transmission device, 22-testing machine, 23-tray recovery device, 3-removal equipment, 31-carrier transfer device, 32-qualified chip transfer device, 33-NG chip transfer device, 34-removal robot arm group, 341-third robot arm, 342-fourth robot arm, 343-moving-out robot arm. DETAILED DESCRIPTION

[0097] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application.

[0098] Please refer to Figure 1 , Figure 1 A schematic diagram of a chip automatic testing system provided in an embodiment of the present application, the system comprising: a pick-and-place device 1, a testing device 2 and a take-out device 3.

[0099] Among them, the pick-and-place device 1 is used to place the bare chips obtained by cutting the wafer into the corresponding chip carrier, and place the chip carrier with the bare chips on the empty position of the tray at the entrance of the test device 2. The test device 2 is used to move the tray at the entrance of the test device 2 to the test station, and perform parallel testing on the chip carriers on at least two placement areas of the tray; after the test, the tray is moved to the exit of the test device 2. The take-out device 3 is used to obtain the chip carrier on the tray at the exit of the test device 2; take the bare chip out of the chip carrier, wherein the qualified bare chip enters the tape packaging link or is placed back on the Frame. Among them, the Frame is a structure obtained by cutting the wafer.

[0100] In the embodiment of the present application, by testing a single bare chip after wafer cutting, defects or defective products that may not be discovered in wafer-level testing can be more accurately identified. These defects may be introduced during the wafer cutting process, such as cutting damage, contamination, etc. Therefore, this testing method can effectively improve the yield of the final product and reduce the waste of resources and increased costs caused by the flow of unqualified bare chips into subsequent production links. In addition, through the placement device 1, the testing device 2 and the removal device 3, the automated processing flow of "placing the bare chip in the chip carrier, then placing the chip carrier on the tray, performing batch testing through the tray, and removing the bare chip from the chip carrier after testing" can be realized, thereby improving the processing speed and reducing labor costs and human errors.

[0101] A pick-and-place device provided in an embodiment of the present application includes: a carrier transfer device, a chip transfer device and a pick-and-place robot arm group; the carrier transfer device is used to transfer the chip carrier to the pick-and-place station; the chip transfer device is used to transfer the tape or frame containing the bare chip to the pick-and-place station; the pick-and-place robot arm group is used to place the bare chip of the pick-and-place station into the chip carrier of the pick-and-place station, and move the chip carrier with the bare chip to the tray at the entrance of the test equipment.

[0102] In some optional embodiments, the pick-and-place robot arm group includes: a first robot arm, a second robot arm and a moving-in robot arm; the first robot arm is used to suck the cover plate of the chip carrier to expose the cavity inside the chip carrier; the second robot arm is used to suck the bare chip on the tape and place the bare chip into the chip carrier from the opening of the chip carrier; the first robot arm is also used to cover the opening of the chip carrier with the cover plate after the bare chip is placed in the chip carrier; the moving-in robot arm is used to clamp the carrier body of the chip carrier; and, after the cover plate covers the opening of the chip carrier, the chip carrier with the bare chip is moved to the empty position of the tray at the entrance of the testing equipment.

[0103] In some optional embodiments, a CCD camera is provided on the second robotic arm; the CCD camera is used to perform necessary appearance inspection on the front, back and sides of the bare chip during the process of sucking up the bare chip and placing the bare chip into the chip carrier to ensure that the picked bare chip has no abnormalities.

[0104] In some optional embodiments, the pick-and-place robot arm group further includes: a flipping device; a second robot arm is used to suck the bare chip on the frame, place the bare chip on the flipping device for flipping, suck the flipped bare chip and place the bare chip into the chip carrier from the opening of the chip carrier.

[0105] In some optional embodiments, the second robotic arm includes a pressure feedback monitoring module; in the process of placing the bare chip into the chip carrier, the pressure of pressing the bare chip is detected in real time according to the pressure feedback monitoring module and the force is adjusted to control the pressure to be less than or equal to the set value.

[0106] In some optional embodiments, the bottom plate surface of the chip carrier has a positioning mark; the second robot arm places the bare chip into the chip carrier according to the positioning mark, wherein the positioning accuracy of the bare chip in the process of placing the bare chip into the chip carrier is less than 30um.

[0107] Please refer to Figure 2 , Figure 2 Schematic diagram of the test device 2 provided in an embodiment of the present application.

[0108] In some optional embodiments, the testing device 2 includes: a tray transmission device 21 and a testing machine 22 .

[0109] Among them, the tray transmission device 21 is used to transmit the tray at the entrance of the test equipment 2 to the test station; the test machine 22 is used to perform chip testing on each chip carrier on the tray of the test station; the tray transmission device 21 is also used to transmit the tray of the test station to the exit of the test equipment 2.

[0110] In the embodiment of the present application, the entire testing process is automated from the tray transfer device 21 transferring the tray from the entrance to the testing station, the testing machine 22 performing chip testing on the chip carrier on the tray, to the tray transfer device 21 transferring the tested tray to the exit. This streamlined design greatly reduces manual intervention and improves testing efficiency and accuracy.

[0111] Specifically, there are multiple placement areas evenly distributed on the tray, each placement area is used to place a chip carrier, and these placement areas are numbered. The tester 22 tests the chip carrier in each numbered placement area. After the test, the chip carriers corresponding to the placement areas with different numbers are labeled as qualified or unqualified. For example, there are eight placement areas in total, numbered 1-8, where area 1 and area 2 are unqualified, and areas 3, 4, 5, 6, 7 and 8 are qualified. After the chip carriers in area 1 and area 2 are subsequently grabbed and the bare chips are taken out, the bare chips are unqualified chips. After the chip carriers in areas 3, 4, 5, 6, 7 and 8 are subsequently grabbed and the bare chips are taken out, the bare chips are qualified chips.

[0112] In some optional embodiments, the test device 2 further includes: a tray recovery device 23; the tray recovery device 23 is used to move an empty tray to an entrance of the test device 2 after all chip carriers on the tray at the exit of the test device 2 are removed.

[0113] In the embodiment of the present application, the tray transmission device 21 can continuously transmit the tray from the entrance of the test equipment 2 to the test station, and the test machine 22 efficiently tests the chip carrier on the tray that arrives at the test station. After the test is completed, the tray transmission device 21 quickly transmits the tray to the exit to prepare for the next test cycle. This continuous operation method significantly improves the test efficiency.

[0114] Specifically, the tray recovery device 23 may be a robotic arm, which grabs the edge of the empty tray and then moves it to the entrance of the testing device 2 for placement.

[0115] Please refer to Figure 3 , Figure 3 Schematic diagram of the pick-and-place device 1 provided in the first embodiment of the present application.

[0116] In some optional embodiments, the pick-and-place device 1 includes: a carrier transfer device 11 , a chip transfer device 12 , and a pick-and-place robot arm group 13 .

[0117] Among them, the carrier transfer device 11 is used to transfer the chip carrier to the pick-and-place station; the chip transfer device 12 is used to transfer the bare chip to the pick-and-place station when the bare chip needs to be tested; when the bare chip does not need to be tested, the bare chip is transferred to the tape pick-and-place station; the pick-and-place robot arm group 13 is used to place the bare chip from the pick-and-place station into the chip carrier of the pick-and-place station, and move the chip carrier with the bare chip to the tray at the entrance of the testing equipment 2.

[0118] In the embodiment of the present application, the carrier introduction device 11 and the chip introduction device 12 are, for example, conveyor belts, and the carrier introduction device 11 stops when it conveys the chip carrier to the pick-and-place station, and the chip introduction device 12 stops when it conveys the corresponding bare chip to the pick-and-place station, and then the bare chip is placed in the chip carrier by the pick-and-place robot arm, and then the chip carrier with the bare chip is placed on the empty position of the tray at the entrance of the test equipment 2. Then, the carrier introduction device 11 and the chip introduction device 12 are started, and the above process is repeated until a set number of chip carriers are placed on the tray at the entrance of the test equipment 2, and the tray is sent to the test equipment 2 for chip testing, and then the empty tray is placed at the entrance of the test equipment 2 to fill the next tray.

[0119] In some optional embodiments, the pick-and-place robot arm group 13 includes: a first robot arm 131, a second robot arm 132 and a moving-in robot arm 133. The first robot arm 131 is used to suck the cover plate of the chip carrier to expose the cavity inside the chip carrier. The second robot arm 132 is used to suck the bare chip and place the bare chip into the chip carrier from the opening of the chip carrier. The first robot arm 131 is also used to cover the opening of the chip carrier with the cover plate after the bare chip is placed in the chip carrier. The moving-in robot arm 133 is used to clamp the carrier body of the chip carrier; and, after the cover plate covers the opening of the chip carrier, move the chip carrier with the bare chip to the empty position of the tray at the entrance of the testing device 2.

[0120] Among them, there are positioning marks on the cover plate of the chip carrier, and the first robot arm 131 accurately absorbs the cover plate of the chip carrier through the positioning marks. There are also positioning marks on the bare chip, and the second robot arm 132 accurately absorbs the bare chip through the positioning marks. There are positioning marks on the cavity inside the chip carrier, and the second robot arm 132 can accurately place the bare chip into the chip carrier through the positioning marks. The second robot arm 132 has a pressure feedback monitoring module. When placing the bare chip into the chip carrier, the pressure feedback monitoring module detects the feedback pressure in real time and adjusts the force to avoid crushing the bare chip.

[0121] In the embodiment of the present application, the carrier body of the chip carrier on the pick-and-place station is clamped by moving in the robot arm 133, the cover plate of the chip carrier is sucked by the first robot arm 131, the bare chip is sucked and placed in the chip carrier by the second robot arm 132, and the cover plate is covered with the opening of the chip carrier by the first robot arm 131. Finally, the chip carrier is moved to the empty space of the tray at the entrance of the test equipment 2 by the moving in robot arm 133 and the chip carrier is released.

[0122] Specifically, the robot arm is usually composed of a controller, a driver, an arm and an end effector. In the process of sucking the chip (or cover plate), the robot arm mainly relies on its end effector, which usually includes a suction cup or other precision fixtures to accurately pick up, transport and place the chip from the production line to the designated location. The robot arm works by negative pressure suction, that is, the chip (or cover plate) is adsorbed on it by the suction cup principle, and the chip (or cover plate) is transported by the arm's extension, rotation and lifting movements.

[0123] Please refer to Figure 4 , Figure 4 This is a schematic diagram of the removal device 3 provided in the first embodiment of the present application.

[0124] In some optional embodiments, the taking-out device 3 includes: a carrier outgoing device 31 , a qualified chip outgoing device 32 , an NG chip outgoing device 33 and a taking-out robot arm group 34 .

[0125] Among them, the removal robot arm group 34 is used to move the chip carrier on the tray at the exit of the test equipment 2 to the removal station; and, take out the bare chip from the chip carrier, place the qualified bare chip on the qualified chip output device 32, place the unqualified bare chip on the NG chip output device 33, and place the empty chip carrier on the carrier output device 31.

[0126] The qualified chip outgoing device 32 is used to send the bare chip to the tape pick-up and placement station. The NG chip outgoing device 33 is used to send the bare chip to the recycling station. The carrier outgoing device 31 is connected to the carrier incoming device 11, and the empty chip carrier is transferred to the pick-up and placement station through the carrier outgoing device 31 and the carrier incoming device 11.

[0127] In some optional embodiments, the removal robot arm group 34 includes: a third robot arm 341 , a fourth robot arm 342 and a removal robot arm 343 .

[0128] Among them, the third robot arm 341 is used to absorb the cover plate of the chip carrier to expose the bare chip inside the chip carrier. The fourth robot arm 342 is used to absorb the bare chip; place the qualified bare chip on the qualified chip transmission device 32, or place the unqualified bare chip on the NG chip transmission device 33. The third robot arm 341 is also used to cover the opening of the chip carrier with the cover plate after the bare chip is taken out from the chip carrier. The removal robot arm 343 is used to move the chip carrier on the tray at the exit of the test equipment 2 to the removal station and clamp the carrier body of the chip carrier; after the cover plate covers the opening of the chip carrier, release the chip carrier to the carrier transmission device 31.

[0129] There are positioning marks on the cover of the chip carrier, and the third robot arm 341 can accurately absorb the cover of the chip carrier through the positioning marks. There are positioning marks on the cavity inside the chip carrier, and the fourth robot arm 342 can accurately take the bare chip out of the chip carrier through the positioning marks.

[0130] In some optional embodiments, a CCD camera is provided on the fourth robotic arm; the CCD camera is used to perform necessary appearance inspection on the front, back and sides of the bare chip during the process of sucking the bare chip from the chip carrier and placing the bare chip into the qualified chip output device to ensure that the picked bare chip has no abnormalities.

[0131] Please refer to Figure 5 , Figure 5 This is a schematic diagram of a pick-and-place device 1 provided in a second embodiment of the present application. The difference from the first embodiment is that the carrier transfer device 11 of this embodiment includes a first clamping assembly.

[0132] The first clamping assembly is used to clamp the chip carrier; after the bare chip is placed in the chip carrier, the first clamping assembly is released.

[0133] In some optional embodiments, the pick-and-place robot arm group 13 includes: a first robot arm 131 and a second robot arm 132 .

[0134] The first robot arm 131 is used to suck the cover plate of the chip carrier to expose the cavity inside the chip carrier. The second robot arm 132 is used to suck the bare chip and put the bare chip into the chip carrier from the opening of the chip carrier. The first robot arm 131 is also used to cover the opening of the chip carrier with the cover plate after the bare chip is put into the chip carrier. The first robot arm 131 or the second robot arm 132 is used to clamp the carrier body of the chip carrier; after the cover plate covers the opening of the chip carrier, the chip carrier with the bare chip is moved to the empty position of the tray at the entrance of the test device 2.

[0135] In the embodiment of the present application, since the carrier introduction device 11 has a first clamping component for clamping the carrier body of the chip carrier, the first robotic arm 131 and the second robotic arm 132 can cooperate to realize the process of taking out the bare chip from the chip carrier. After the bare chip is taken out from the chip carrier, the first robotic arm 131 and the second robotic arm 132 are in an idle state, and the first robotic arm 131 or the second robotic arm 132 can be used to move the chip carrier to an empty space on the tray at the entrance of the testing equipment 2.

[0136] Please refer to Figure 6 , Figure 6 Schematic diagram of the removal device provided for the second embodiment of the present application.

[0137] In some optional embodiments, the taking-out device 3 includes: a carrier outgoing device 31 , a qualified chip outgoing device 32 , an NG chip outgoing device 33 and a taking-out robot arm group 34 .

[0138] The take-out robot arm group 34 is used to move the chip carrier on the tray at the exit of the test equipment 2 to the take-out station; take out the bare chip from the chip carrier, place the qualified bare chip on the qualified chip output device 32, place the unqualified bare chip on the NG chip output device 33, and place the empty chip carrier on the carrier output device 31; the take-out robot arm group 34 of this embodiment includes a third robot arm 341 and a fourth robot arm 342.

[0139] The qualified chip delivery device 32 is used to deliver the bare chips to the tape pick-and-place station; the NG chip delivery device 33 is used to deliver the bare chips to the recycling station.

[0140] The carrier outgoing device 31 includes: a second clamping component; the second clamping component is used to clamp the carrier body of the chip carrier when the chip carrier moves to the removal station; the carrier outgoing device 31 is connected to the carrier incoming device 11, and the empty chip carrier is transferred to the pick-up and placement station through the carrier outgoing device 31 and the carrier incoming device 11.

[0141] In some optional embodiments, the removal robot arm group includes: a third robot arm and a fourth robot arm; the third robot arm is used to absorb the cover plate of the chip carrier to expose the bare chip inside the chip carrier. The fourth robot arm is used to absorb the bare chip; place the qualified bare chip on the qualified chip transmission device, or place the unqualified bare chip on the NG chip carrier of the NG chip transmission device; wherein the NG chip carrier includes a tray, a tape or a frame; the third robot arm is also used to cover the opening of the chip carrier with the cover plate after the bare chip is taken out from the chip carrier. The third robot arm or the fourth robot arm is also used to move the chip carrier on the tray at the exit of the test equipment to the removal station.

[0142] In some optional embodiments, the bare chip includes an HBM chip, a 3D stacked chip, or an advanced process packaging chip.

[0143] In the embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some communication interfaces, and the indirect coupling or communication connection of the devices or units can be electrical, mechanical or other forms.

[0144] In addition, the units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0145] Furthermore, the functional modules in the various embodiments of the present application may be integrated together to form an independent part, or each module may exist separately, or two or more modules may be integrated to form an independent part.

[0146] In this document, relational terms such as first and second, etc. are used merely to distinguish one entity or operation from another entity or operation, but do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0147] The above description is only an embodiment of the present application and is not intended to limit the protection scope of the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A pick-and-place device, characterized in that: include: Carrier transfer device, chip transfer device and pick-and-place robotic arm group; The carrier transfer device is used to transfer the chip carrier to the pick-and-place station; The chip transfer device is used to transfer the tape or frame containing the bare chip to the pick-and-place station; The pick-and-place robot arm group is used to place the bare chip at the pick-and-place station into the chip carrier at the pick-and-place station, and move the chip carrier with the bare chip to the tray at the entrance of the test equipment.

2. The pick-and-place device according to claim 1, characterized in that The pick-and-place robot arm group includes: a first robot arm, a second robot arm and a moving-in robot arm; The first robot arm is used to absorb the cover plate of the chip carrier to expose the cavity inside the chip carrier; The second robot arm is used to pick up the bare chip on the tape and place the bare chip into the chip carrier through the opening of the chip carrier; The first mechanical arm is also used to cover the opening of the chip carrier with a cover plate after the bare chip is placed in the chip carrier; The moving-in robot arm is used to clamp the carrier body of the chip carrier; and, after the cover plate covers the opening of the chip carrier, the chip carrier with the bare chip placed thereon is moved to the empty position of the tray at the entrance of the test equipment.

3. The pick-and-place device according to claim 2, characterized in that The second mechanical arm is provided with a CCD camera; the CCD camera is used to perform appearance inspection on the bare chip during the process of sucking the bare chip and placing the bare chip into the chip carrier.

4. The pick-and-place device according to claim 2, characterized in that: The pick-and-place robotic arm assembly also includes: a turning device; The second robot arm is used to absorb the bare chip on the frame, place the bare chip on the flipping device to flip it over, absorb the flipped bare chip and place the bare chip into the chip carrier through the opening of the chip carrier.

5. The pick-and-place device according to claim 2, characterized in that: The second robot arm includes a pressure feedback monitoring module; in the process of placing the bare chip into the chip carrier, the pressure of pressing the bare chip is detected in real time according to the pressure feedback monitoring module and the force is adjusted to control the pressure to be less than or equal to the set value.

6. The pick-and-place device according to claim 2, characterized in that: The bottom plate surface of the chip carrier has positioning marks; the second robot arm places the bare chip into the chip carrier according to the positioning marks, wherein the positioning accuracy of the bare chip in the process of placing the bare chip into the chip carrier is less than 30um.

7. The pick-and-place device according to claim 1, characterized in that: The carrier introduction device comprises: a first clamping assembly; The first clamping assembly is used to clamp the chip carrier; after the bare chip is placed in the chip carrier, the first clamping assembly is released.

8. The pick-and-place device according to claim 1, wherein: The pick-and-place robotic arm group comprises: a first robotic arm and a second robotic arm; The first robot arm is used to absorb the cover plate of the chip carrier to expose the cavity inside the chip carrier; The second robot arm is used to pick up the bare chip and place the bare chip into the chip carrier through the opening of the chip carrier; The first mechanical arm is also used to cover the opening of the chip carrier with a cover plate after the bare chip is placed in the chip carrier; The first robot arm or the second robot arm is used to clamp the carrier body of the chip carrier after the first clamping assembly is released, and move the chip carrier with the bare chip placed on it to an empty position of the tray at the entrance of the test equipment.

9. The pick-and-place device according to claim 1, wherein: The chip transfer device is used to transfer the bare chip to the pick-and-place station when the bare chip needs to be tested; and to transfer the bare chip to the tape pick-and-place station when the bare chip does not need to be tested.

10. A chip automatic testing system, characterized in that: include: A pick-and-place device as claimed in any one of claims 1 to 9, as well as a testing device and a taking-out device; The testing device is used to move the tray at the entrance of the testing device to the testing station, and perform a parallel test on the chip carriers on at least two placement areas of the tray; after the test, the tray is moved to the exit of the testing device; The taking-out device is used to obtain the chip carrier on the tray at the exit of the test device; take the bare chip out of the chip carrier, wherein the qualified bare chip enters the tape packaging link, or is put back into the frame or tray.

11. The system according to claim 10, characterized in that The testing equipment includes: a tray transmission device and a testing machine; The pallet conveying device is used to convey the pallet at the entrance of the testing equipment to the testing station; The testing machine is used to perform chip testing on each chip carrier on the tray of the testing station; The tray transmission device is also used to transmit the tray of the test station to the exit of the test equipment.

12. The system according to claim 10, characterized in that The testing equipment also includes: a tray recovery device; The tray recovery device is used to move the empty tray to the entrance of the test equipment after all chip carriers on the tray at the exit of the test equipment are removed.

13. The system of claim 12, wherein: The pallet recovery device includes a conveyor belt or a mechanical arm.

14. The system according to claim 10, characterized in that The take-out device comprises: a carrier outgoing device, a qualified chip outgoing device and a take-out mechanical arm group; The take-out robot arm group is used to move the chip carrier on the tray at the exit of the test equipment to the take-out station; and, take out the bare chip from the chip carrier, place the qualified bare chip on the qualified chip transfer device, and place the empty chip carrier on the carrier transfer device; The qualified chip delivery device is used to deliver the qualified bare chips to the tape pick-and-place station; The carrier outgoing device is connected to the carrier incoming device, and the empty chip carrier is transferred to the pick-and-place station through the carrier outgoing device and the carrier incoming device.

15. The system of claim 14, wherein: The removal device further comprises: an NG chip discharging device; the NG chip discharging device is used to send unqualified bare chips to a recycling station.

16. The system of claim 14, wherein: The removal robot arm group includes: a third robot arm, a fourth robot arm and a removal robot arm; The third mechanical arm is used to absorb the cover plate of the chip carrier to expose the bare chip inside the chip carrier; The fourth robot arm is used to pick up the bare chip; place the qualified bare chip on the qualified chip transmission device, or place the unqualified bare chip on the NG chip carrier of the NG chip transmission device; wherein the NG chip carrier includes a tray, a tape or a frame; The third robot arm is also used to cover the opening of the chip carrier with a cover plate after the bare chip is taken out from the chip carrier; The removal robot arm is used to move the chip carrier on the tray at the exit of the test equipment to the removal station and clamp the carrier body of the chip carrier; after the cover plate covers the opening of the chip carrier, the chip carrier is released to the carrier transfer device.

17. The system of claim 16, wherein: The fourth mechanical arm is provided with a CCD camera; the CCD camera is used to perform appearance inspection on the bare chip during the process of sucking the bare chip inside the chip carrier and placing the bare chip into the qualified chip transmission device.

18. The system of claim 10, wherein: The take-out device comprises: a carrier outgoing device, a qualified chip outgoing device and a take-out mechanical arm group; The removal robot arm group is used to move the chip carrier on the tray at the exit of the test equipment to the removal station; remove the bare chip from the chip carrier, place the qualified bare chip on the qualified chip transfer device, and place the empty chip carrier on the carrier transfer device; The qualified chip delivery device is used to deliver the bare chip to the tape pick-and-place station; The carrier delivery device comprises: a second clamping assembly; the second clamping assembly is used to clamp the carrier body of the chip carrier when the chip carrier moves to the removal station; The carrier outgoing device is connected to the carrier incoming device, and the empty chip carrier is transferred to the pick-and-place station through the carrier outgoing device and the carrier incoming device.

19. The system of claim 18, wherein: The removal robot arm group includes: a third robot arm and a fourth robot arm; The third mechanical arm is used to absorb the cover plate of the chip carrier to expose the bare chip inside the chip carrier; The fourth robot arm is used to pick up the bare chip; place the qualified bare chip on the qualified chip transmission device, or place the unqualified bare chip on the NG chip carrier of the NG chip transmission device; wherein the NG chip carrier includes a tray, a tape or a frame; The third robot arm is also used to cover the opening of the chip carrier with a cover plate after the bare chip is taken out from the chip carrier; The third robot arm or the fourth robot arm is also used to move the chip carrier on the tray at the exit of the testing equipment to the removal station.

20. The system of claim 10, wherein: The bare chip includes an HBM chip, a 3D stacked chip or an advanced process packaging chip.

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