Baking device for wafer aging test
By designing a baking device including rotating components, adjustment components and adsorption components, the problem of uneven baking in wafer aging test is solved, more uniform heating and higher testing efficiency are achieved, and the stability and reliability of the wafer are improved.
Patent Information
- Application Number
- CN202411451446.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-17
- Publication Date
- 2025-03-07
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
Figure CN119575124A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of wafer aging test, in particular to a baking device for wafer aging test. Background Art
[0002] Wafer is one of the key components in integrated circuit manufacturing. It is a thin sheet of silicon base material used in the manufacture of integrated circuit chips. Wafer is made of single crystal silicon material with a flat surface and highly pure structure. During the chip manufacturing process, wafers are cut into hundreds or even thousands of small cubes, and each small cube becomes an independent chip. Wafers and chips made from them may have various defects during the manufacturing and use process, including obvious defects and potential defects. Obvious defects such as short circuit and open circuit will directly cause the product to fail to work properly, while potential defects may not affect the use of the product temporarily, but will gradually be exposed during use, causing product failure or malfunction. In order to eliminate these potential defects and improve the reliability and stability of the product, aging testing is required.
[0003] When performing wafer aging tests, since the wafers are generally placed directly in a baking oven for baking, the bottom of the wafer contacts the support plate. During subsequent hot air baking, the bottom of the wafer has poor ventilation, which can easily result in uneven heating of the wafers during baking, making it impossible to effectively bake, reducing the efficiency of the aging test. Improvements need to be made to this problem. Summary of the invention
[0004] The object of the present invention is to provide a baking device for wafer aging test to solve the problems raised in the above background technology.
[0005] In order to solve the above technical problems, the present invention provides the following technical solutions: a baking device for wafer aging test, comprising a baking oven, a rotating component, an adjusting component and an adsorption component, a protective door is provided on the front of the baking oven, and a working box is fixedly connected to the middle of the baking oven.
[0006] Wherein, the rotating assembly comprises: The driving motor is fixedly connected to the bottom of the baking oven, the driving motor has an output shaft, the output shaft of the driving motor is fixedly connected to a pulley 1, the outer side of the pulley 1 is connected to a belt, the pulley 1 is connected to a pulley 2 through a belt transmission, the middle of the pulley 2 is fixedly connected to a rotating rod, and the bottom of the rotating rod is fixedly connected to a rotating seat.
[0007] According to the above technical scheme, the adjusting assembly includes a rotating cylinder, an adjusting cylinder, a guide slide groove, an electric telescopic rod, a lifting plate, an adjusting frame, a connecting block, a telescopic rod, a guide sliding block and an extension rod, the rotating cylinder is fixedly connected to the top of the rotating rod, the adjusting cylinder is fixedly connected to the top of the rotating cylinder, the guide slide groove is fixedly connected to the top of the outer side of the adjusting cylinder, the electric telescopic rod is fixedly connected to the inner bottom of the adjusting cylinder, the electric telescopic rod has a telescopic end, the lifting plate is fixedly connected to the telescopic end of the electric telescopic rod, the adjusting frame is fixedly connected to the outer side of the lifting plate, the connecting block is rotatably connected to the inside of the adjusting frame, the telescopic rod is fixedly connected to the side of the connecting block away from the adjusting frame, the guide sliding block is rotatably connected to one end of the telescopic rod away from the connecting block, and the extension rod is fixedly connected to the side of the guide sliding block away from the adjusting cylinder.
[0008] According to the above technical solution, the adsorption assembly includes a miniature vacuum pump, a shunt pipe rack, a connecting pipe, a spring hose and a vacuum adsorption suction cup. The miniature vacuum pump is fixedly connected to the outside of the rotating cylinder. The miniature vacuum pump has an output pipe. The shunt pipe rack is fixedly connected to the output pipe of the miniature vacuum pump. The connecting pipe is fixedly connected to the top of the shunt pipe rack. The spring hose is fixedly connected to one end of the connecting pipe away from the shunt pipe rack. The vacuum adsorption suction cup is arranged inside the extension rod.
[0009] According to the above technical solution, the bottom of the rotating seat is rotatably connected to the inner wall of the bottom of the working box, and the bottom of the left and right sides of the working box and the bottom of the left and right sides of the baking box are provided with connected ventilation grooves at the same horizontal position, and the top of the rotating rod passes through the bottom of the working box and extends into the working box and is fixedly connected to the bottom of the rotating cylinder.
[0010] According to the above technical solution, a sliding groove is provided in the lifting plate, and the lifting plate is slidably connected to the outer wall of the adjusting cylinder through the sliding groove. The guide sliding block is arranged inside the guide sliding groove, and the guide sliding block is slidably connected to the guide sliding groove. An adjustment groove for accommodating the movement of the extension rod is provided on the side of the guide sliding groove away from the adjusting cylinder.
[0011] According to the above technical solution, one end of the spring hose away from the connecting pipe is fixedly connected to the vacuum adsorption cup, and the vacuum adsorption cup is connected to the spring hose, the connecting pipe and the diversion pipe rack.
[0012] According to the above technical solution, the number of the adjusting frame, connecting block, telescopic rod, guide sliding block, extension rod, connecting tube, spring hose and vacuum adsorption suction cup is four, and the four adjusting frames, connecting block, telescopic rod, guide sliding block, extension rod, connecting tube, spring hose and vacuum adsorption suction cup are distributed in a ring on the outside of the adjusting cylinder.
[0013] Compared with the prior art, the beneficial effects achieved by the present invention are as follows: when it is necessary to bake the wafer, the protective door is opened, and then the electric telescopic rod is controlled to work. When the electric telescopic rod is working, the lifting plate is pushed to move outside the adjustment cylinder, so that the lifting plate pushes the connecting block through the adjustment frame, so that the connecting block pushes the telescopic rod, so that the guide sliding block on the other side of the telescopic rod slides in the guide slide groove, and at the same time, the extension rod on the guide slide block drives the vacuum adsorption cup to move. When the wafer is large, the lifting plate is raised to the top outside the guide slide groove. When the wafer is small, the lifting plate is moved to the lower side outside the guide slide groove, and the wafer is placed on the top of the vacuum adsorption cup. Then, the micro vacuum pump is controlled to work, so that when the micro vacuum pump is working, the air in the vacuum adsorption cup is extracted through the spring hose, the connecting pipe and the shunt pipe rack, so that the vacuum adsorption cup generates negative pressure and adsorbs the wafer, so that the device can carry out bottom support according to the overall size of the wafer; When supporting the wafer, the bottom of the wafer is fixed by four vacuum suction cups, and there is space between the bottom of the wafer and the top of the adjustment cylinder, so that the wafer is supported by the four vacuum suction cup contacts, so that the hot air can bake the upper and lower sides of the wafer at the same time when the subsequent baking box is working, and the bottom is not blocked during baking, so that the air can enter under the wafer, which makes the baking more uniform and makes the experimental data more accurate; When baking in the baking oven, if the position of the wafer and the air outlet in the baking oven is fixed, one side of the wafer will be heated more strongly, while the wafer on the side away from the air outlet will be heated less, which will cause uneven baking. At this time, the drive motor is controlled to work, and the drive motor is driven to rotate when the drive motor is working. At the same time, pulley one drives pulley two to rotate through the belt, and further drives the wafer above the rotating cylinder to rotate. Through rotation, different parts of the wafer can be alternately exposed to the air outlet in the baking oven, thereby reducing the temperature difference caused by different positions and improving the uniformity of baking. During the wafer manufacturing process, residual stress will be generated due to the different thermal expansion coefficients of each layer of material. These stresses may affect the electrical properties and reliability of the wafer. The rotary baking method can help alleviate the residual stress in the wafer through uniform heating and slow cooling, thereby improving the stability and reliability of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings: Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the interior of the working box of the present invention; Figure 3It is a schematic diagram of the pulley of the present invention at two locations; Figure 4 It is a schematic diagram of the rotating cylinder of the present invention; Figure 5 is a schematic diagram of the interior of the rotating drum of the present invention; Figure 6 It is a schematic diagram of the guide chute of the present invention; Figure 7 yes Figure 5 The enlarged schematic diagram at A in the middle; Figure 8 It is a schematic diagram of the vacuum adsorption cup of the present invention.
[0015] In the figure: 1. baking oven; 2. protective door; 3. working box; 4. rotating assembly; 401. driving motor; 402. pulley 1; 403. belt; 404. pulley 2; 405. rotating rod; 406. rotating seat; 5. adjusting assembly; 501. rotating cylinder; 502. adjusting cylinder; 503. guide slide; 504. electric telescopic rod; 505. lifting plate; 506. adjusting frame; 507. connecting block; 508. telescopic rod; 509. guide slide block; 510. extension rod; 6. adsorption assembly; 601. micro vacuum pump; 602. shunt pipe rack; 603. connecting pipe; 604. spring hose; 605. vacuum adsorption suction cup. DETAILED DESCRIPTION
[0016] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0017] See also Figure 1-4 The present invention provides a technical solution: a baking device for wafer aging test, including a baking box 1, a rotating component 4, an adjusting component 5 and an adsorption component 6. A protective door 2 is provided on the front of the baking box 1, and a working box 3 is fixedly connected to the middle of the baking box 1.
[0018] Wherein, the rotating assembly 4 comprises: The driving motor 401 is fixedly connected to the bottom of the baking oven 1. The driving motor 401 has an output shaft. The output shaft of the driving motor 401 is fixedly connected to a pulley 1 402. The outer side of the pulley 1 402 is connected to a belt 403. The pulley 1 402 is connected to a pulley 2 404 through the belt 403. The middle of the pulley 2 404 is fixedly connected to a rotating rod 405. The bottom of the rotating rod 405 is fixedly connected to a rotating seat 406.
[0019] The bottom of the rotating seat 406 is rotatably connected to the inner wall of the bottom of the working box 3. The bottom of the left and right sides of the working box 3 and the bottom of the left and right sides of the baking box 1 are provided with connected ventilation grooves at the same horizontal position. The top of the rotating rod 405 passes through the bottom of the working box 3 and extends into the working box 3 and is fixedly connected to the bottom of the rotating cylinder 501.
[0020] When baking in the baking oven 1, if the position of the wafer and the air outlet in the baking oven 1 is fixed, one side of the wafer will be heated more strongly, while the wafer on the side away from the air outlet will be heated less, which will result in uneven baking. At this time, the drive motor 401 is controlled to work, so that the drive motor 401 works. When the drive motor 401 works, it drives pulley 1 402 to rotate. At the same time, pulley 1 402 drives pulley 2 404 to rotate through belt 403, and further drives the wafer above the rotating cylinder 501 to rotate. Through rotation, different parts of the wafer can be alternately exposed to the air outlet in the baking oven 1, thereby reducing the temperature difference caused by different positions and improving the uniformity of baking. In the wafer manufacturing process, residual stress will be generated due to the different thermal expansion coefficients of each layer of material. These stresses may affect the electrical properties and reliability of the wafer. The rotary baking method can help alleviate the residual stress in the wafer through uniform heating and slow cooling, thereby improving the stability and reliability of the wafer.
[0021] See also Figure 1-8 The present invention provides a technical solution: the adjustment component 5 includes a rotating cylinder 501, an adjusting cylinder 502, a guide slide 503, an electric telescopic rod 504, a lifting plate 505, an adjustment frame 506, a connecting block 507, a telescopic rod 508, a guide sliding block 509 and an extension rod 510. The rotating cylinder 501 is fixedly connected to the top of the rotating rod 405, the adjusting cylinder 502 is fixedly connected to the top of the rotating cylinder 501, the guide slide 503 is fixedly connected to the outer top of the adjusting cylinder 502, and the electric telescopic rod 504 is fixedly connected to the adjusting At the bottom of the cylinder 502, the electric telescopic rod 504 has a telescopic end, the lifting plate 505 is fixedly connected to the telescopic end of the electric telescopic rod 504, the adjusting frame 506 is fixedly connected to the outside of the lifting plate 505, the connecting block 507 is rotatably connected to the inside of the adjusting frame 506, the telescopic rod 508 is fixedly connected to the side of the connecting block 507 away from the adjusting frame 506, the guide sliding block 509 is rotatably connected to the end of the telescopic rod 508 away from the connecting block 507, and the extension rod 510 is fixedly connected to the side of the guide sliding block 509 away from the adjusting cylinder 502.
[0022] The adsorption assembly 6 includes a micro vacuum pump 601, a shunt tube rack 602, a connecting tube 603, a spring hose 604 and a vacuum adsorption suction cup 605. The micro vacuum pump 601 is fixedly connected to the outside of the rotating cylinder 501. The micro vacuum pump 601 has an output pipe. The shunt tube rack 602 is fixedly connected to the output pipe of the micro vacuum pump 601. The connecting tube 603 is fixedly connected to the top of the shunt tube rack 602. The spring hose 604 is fixedly connected to one end of the connecting tube 603 away from the shunt tube rack 602. The vacuum adsorption suction cup 605 is arranged inside the extension rod 510.
[0023] A sliding groove is provided in the lifting plate 505, and the lifting plate 505 is slidably connected to the outer wall of the adjusting cylinder 502 through the sliding groove. The guide sliding block 509 is arranged inside the guide sliding groove 503, and the guide sliding block 509 is slidably connected to the guide sliding groove 503. An adjustment groove for accommodating the movement of the extension rod 510 is provided on the side of the guide sliding groove 503 away from the adjusting cylinder 502.
[0024] One end of the spring hose 604 away from the connecting pipe 603 is fixedly connected to the vacuum suction cup 605 , and the vacuum suction cup 605 is connected to the spring hose 604 , the connecting pipe 603 and the diversion pipe rack 602 .
[0025] There are four adjusting frames 506, connecting blocks 507, telescopic rods 508, guide sliding blocks 509, extension rods 510, connecting tubes 603, spring hoses 604 and vacuum suction cups 605. The four adjusting frames 506, connecting blocks 507, telescopic rods 508, guide sliding blocks 509, extension rods 510, connecting tubes 603, spring hoses 604 and vacuum suction cups 605 are distributed in a ring on the outside of the adjusting cylinder 502.
[0026] When it is necessary to bake the wafer, the protective door 2 is opened, and then the electric telescopic rod 504 is controlled to work. When the electric telescopic rod 504 works, the lifting plate 505 is pushed to move outside the adjustment cylinder 502, so that the lifting plate 505 pushes the connecting block 507 through the adjustment frame 506, so that the connecting block 507 pushes the telescopic rod 508, so that the guide sliding block 509 on the other side of the telescopic rod 508 slides in the guide slide groove 503, and at the same time, the extension rod 510 on the guide sliding block 509 drives the vacuum adsorption cup 605 to move. When the wafer is large, the lifting plate 505 is pushed to move outside the adjustment cylinder 502, so that the lifting plate 505 pushes the connecting block 507 through the adjustment frame 506, so that the connecting block 507 pushes the telescopic rod 508, so that the guide sliding block 509 on the other side of the telescopic rod 508 slides in the guide slide groove 503, and at the same time, the extension rod 510 on the guide sliding block 509 drives the vacuum adsorption cup 605 to move. The lowering plate 505 rises to the top outside the guide slot 503. When the wafer is small, the lifting plate 505 moves to the lower side outside the guide slot 503 to place the wafer on the top of the vacuum suction cup 605. Then the micro vacuum pump 601 is controlled to work so that the air in the vacuum suction cup 605 is extracted through the spring hose 604, the connecting pipe 603 and the diversion pipe rack 602 when the micro vacuum pump 601 is working, so that the vacuum suction cup 605 generates negative pressure and adsorbs the wafer, so that the device can carry out bottom support according to the overall size of the wafer.
[0027] When the wafer is supported, the bottom of the wafer is fixed by four vacuum suction cups 605, and there is space below the wafer and the top of the adjustment cylinder 502, so that the wafer is supported by the contacts of the four vacuum suction cups 605, so that the hot air can bake the upper and lower sides of the wafer at the same time when the baking oven 1 is working. During baking, the bottom is not blocked, so the air can enter under the wafer, which makes the baking more uniform and makes the experimental data more accurate.
[0028] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.
[0029] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.
Claims
1. A baking device for wafer aging test, comprising a baking oven (1), characterized in that: It also comprises a rotating assembly (4), an adjusting assembly (5) and an adsorption assembly (6); a protective door (2) is arranged on the front of the baking oven (1); and a working box (3) is fixedly connected to the middle of the baking oven (1); Wherein, the rotating assembly (4) comprises: A driving motor (401) is fixedly connected to the bottom of the baking oven (1). The driving motor (401) has an output shaft. The output shaft of the driving motor (401) is fixedly connected to a pulley 1 (402). The outer side of the pulley 1 (402) is connected to a belt (403). The pulley 1 (402) is connected to a pulley 2 (404) via the belt (403). The middle of the pulley 2 (404) is fixedly connected to a rotating rod (405). The bottom of the rotating rod (405) is fixedly connected to a rotating seat (406).
2. The baking device for wafer aging test according to claim 1, characterized in that: The adjusting assembly (5) comprises a rotating cylinder (501), an adjusting cylinder (502), a guide slide groove (503), an electric telescopic rod (504), a lifting plate (505), an adjusting frame (506), a connecting block (507), a telescopic rod (508), a guide sliding block (509) and an extension rod (510), wherein the rotating cylinder (501) is fixedly connected to the top of the rotating rod (405), the adjusting cylinder (502) is fixedly connected to the top of the rotating cylinder (501), the guide slide groove (503) is fixedly connected to the top of the outer side of the adjusting cylinder (502), and the electric telescopic rod (504) is fixedly connected to the inner side of the adjusting cylinder (502). At the bottom, the electric telescopic rod (504) has a telescopic end, the lifting plate (505) is fixedly connected to the telescopic end of the electric telescopic rod (504), the adjustment frame (506) is fixedly connected to the outside of the lifting plate (505), the connecting block (507) is rotatably connected to the inside of the adjustment frame (506), the telescopic rod (508) is fixedly connected to a side of the connecting block (507) away from the adjustment frame (506), the guide sliding block (509) is rotatably connected to an end of the telescopic rod (508) away from the connecting block (507), and the extension rod (510) is fixedly connected to a side of the guide sliding block (509) away from the adjustment cylinder (502).
3. The baking device for wafer aging test according to claim 2, characterized in that: The adsorption assembly (6) comprises a micro vacuum pump (601), a flow distribution pipe rack (602), a connecting pipe (603), a spring hose (604) and a vacuum adsorption cup (605); the micro vacuum pump (601) is fixedly connected to the outside of the rotating cylinder (501); the micro vacuum pump (601) has an output pipe; the flow distribution pipe rack (602) is fixedly connected to the output pipe of the micro vacuum pump (601); the connecting pipe (603) is fixedly connected to the top of the flow distribution pipe rack (602); the spring hose (604) is fixedly connected to one end of the connecting pipe (603) away from the flow distribution pipe rack (602); and the vacuum adsorption cup (605) is arranged inside the extension rod (510).
4. The baking device for wafer aging test according to claim 3, characterized in that: The bottom of the rotating seat (406) is rotatably connected to the inner wall of the bottom of the working box (3); the bottoms of the left and right sides of the working box (3) and the bottoms of the left and right sides of the baking box (1) are provided with communicating ventilation slots at the same horizontal position; the top of the rotating rod (405) passes through the bottom of the working box (3) and extends into the working box (3) to be fixedly connected to the bottom of the rotating cylinder (501).
5. The baking device for wafer aging test according to claim 4, characterized in that: A sliding groove is provided in the lifting plate (505), and the lifting plate (505) is slidably connected to the outer wall of the adjustment tube (502) via the sliding groove. The guide sliding block (509) is arranged inside the guide sliding groove (503), and the guide sliding block (509) is slidably connected to the guide sliding groove (503). An adjustment groove for accommodating the movement of the extension rod (510) is provided on a side of the guide sliding groove (503) away from the adjustment tube (502).
6. The baking device for wafer aging test according to claim 5, characterized in that: One end of the spring hose (604) away from the connecting pipe (603) is fixedly connected to the vacuum adsorption cup (605), and the vacuum adsorption cup (605) is connected to the spring hose (604), the connecting pipe (603) and the flow distribution pipe rack (602).
7. The baking device for wafer aging test according to claim 6, characterized in that: The number of the adjusting frame (506), the connecting block (507), the telescopic rod (508), the guide sliding block (509), the extension rod (510), the connecting pipe (603), the spring hose (604) and the vacuum adsorption sucker (605) is four, and the four adjusting frames (506), the connecting block (507), the telescopic rod (508), the guide sliding block (509), the extension rod (510), the connecting pipe (603), the spring hose (604) and the vacuum adsorption sucker (605) are distributed in an annular manner on the outside of the adjusting cylinder (502).