Backlight module and display device

Abstract

The invention provides a backlight module and a display device. The backlight module comprises a back plate, a lamp panel assembly and a back shell. Wherein the back plate is provided with a first side and a second side which are opposite in the thickness direction; the lamp panel assembly is arranged on the first side; the back shell is arranged on the second side, and the back plate and the back shell are sealed to form a containing cavity; the backlight module further comprises a heat conduction part, and at least part of the heat conduction part is arranged in the containing cavity and makes contact with the back plate. The back shell is provided with a heat dissipation part which is in contact with the heat conduction part; the heat conduction part is used for conducting heat generated by the lamp panel assembly to the heat dissipation part, and the heat is dissipated out of the back shell through the heat dissipation part. The backlight module has the advantages of being high in heat dissipation efficiency and light in weight while meeting the overall closed design.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a backlight module and a display device. Background Art

[0002] LCDs with Mini LED backlight technology are widely used in wearable display devices, TVs, and car displays, etc., because they have better performance in dynamic contrast and brightness, and have advantages such as lightness, high image quality, low power consumption, and energy saving. However, compared with ordinary light boards, MiniLED light boards have higher temperatures during normal operation due to the difference in the number of lamp beads and driving methods, so heat dissipation design is required, otherwise it may affect the luminous effect of the lamp beads. Continuous high temperature may also affect the normal operation of components in the display and damage components, shortening their service life.

[0003] Among them, considering waterproof and dustproof, the display often needs to be designed as an overall closed type, which puts higher requirements on the heat dissipation design of the display. At present, the heat dissipation path of the MiniLED backlight lamp beads mainly relies on the LED light board-backboard-external air; or the addition of thermal conductive glue between the light board and the backboard; or the entire display shell is made of metal materials with high thermal conductivity. However, the above generally have poor heat dissipation effects and are not conducive to the lightweight design requirements of the display. Summary of the invention

[0004] The present application provides a backlight module and a display panel, aiming to solve the problems of poor heat dissipation efficiency and heavy weight while satisfying overall sealing.

[0005] In order to solve the above technical problems, the first technical solution provided by the present application is to provide a backlight module. The backlight module includes:

[0006] a back plate having a first side and a second side opposite to each other in a thickness direction;

[0007] A light panel assembly is disposed on the first side;

[0008] A back shell is arranged on the second side, and the back plate and the back shell are sealed to form a receiving cavity;

[0009] The backlight module also includes:

[0010] The heat conducting portion is at least partially disposed in the accommodating cavity and is in contact with the back plate;

[0011] The back shell has a heat dissipation part, which is in contact with the heat conduction part; the heat conduction part is used to conduct the heat generated by the light board assembly to the heat dissipation part, and dissipate it to the outside of the back shell through the heat dissipation part.

[0012] In some embodiments, the heat conducting portion includes a first portion and a second portion connected to each other, the first portion is in contact with the heat dissipating portion, and is used to dissipate heat to the outside of the back shell and / or transfer heat to the heat dissipating portion;

[0013] The second part is located in the accommodating cavity and is used for conducting the heat generated by the light panel assembly to the first part.

[0014] In some embodiments, the back shell has a heat dissipation opening, and the heat dissipation portion is sealed and connected to the heat dissipation opening so that the back plate and the back shell remain sealed;

[0015] The first part is fixedly installed on the heat dissipation part, and the first part is exposed from the back shell.

[0016] In some embodiments, the heat dissipation portion includes a heat dissipation base plate and a mounting structure. The heat dissipation base plate is made of a heat conductive material. The heat dissipation base plate is disposed on a side of the back shell facing the back plate. The orthographic projection of the heat dissipation base plate on the back shell covers the heat dissipation opening, so as to block the heat dissipation opening.

[0017] The heat dissipation base plate is closely and firmly connected with the back shell through the mounting structure, and the first part is mounted on a side of the heat dissipation base plate facing the back shell.

[0018] In some embodiments, the heat dissipation portion further includes an elastic sealing ring, which is disposed between the heat dissipation base plate and the back shell;

[0019] The elastic sealing ring is used to maintain the sealed connection between the heat dissipation base plate and the back shell through deformation force.

[0020] In some embodiments, a heat dissipation groove is provided on a side of the heat dissipation base plate facing away from the back plate, and the orthographic projection of the heat dissipation groove on the back shell is located in the heat dissipation opening area.

[0021] In some embodiments, the area where the back shell is located is continuous, and the entire heat conducting portion is accommodated in the accommodation cavity;

[0022] The back shell includes a first plate body and a second plate body that are continuously spliced ​​together, and the first plate body forms a heat dissipation portion;

[0023] The material of the first plate body is different from the material of the second plate body, and the thermal conductivity of the first plate body is greater than the thermal conductivity of the second plate body.

[0024] In some embodiments, a mounting base is connected to the back plate, the mounting base is located on the second side, and the mounting base is made of a heat-conducting material;

[0025] The heat conducting part comprises a first section and a second section connected to each other, and the second section is fixedly connected to the back plate via a fastener;

[0026] In the thickness direction of the back plate, the height of the first section relative to the back plate is greater than the height of the second section relative to the back plate. The mounting seat is used to lift the first section, and the first section contacts the mounting seat to conduct heat to the mounting seat. A side wall of the mounting seat facing the back shell abuts against the first plate body.

[0027] In some embodiments, the mounting seat has a mounting groove on one side facing the back shell;

[0028] In the thickness direction of the back plate, the height of the first section relative to the back plate is adapted to the height of the mounting groove relative to the back plate, so that a portion of the first section can be embedded in the mounting groove;

[0029] When the back plate is sealed and connected to the back shell, a portion of the side wall of the first section and a side wall of the mounting seat facing the back shell are both in contact with the back shell.

[0030] In order to solve the above technical problems, the second technical solution provided by the present application is: to provide a display device. The display device includes a backlight module and a display panel as provided in the above technical solution. The display panel is used to display images, and the backlight module is arranged opposite to the display panel to provide backlight to the display panel.

[0031] Beneficial effects of the present application: Different from the prior art, the present application provides a backlight module and a display device. The backlight module includes a back plate and a back shell, and the back plate and the back shell are sealed to form a receiving cavity to meet the overall closed requirements of the display. Furthermore, by arranging a heat-conducting part in the receiving cavity, and the heat-conducting part is in contact with the back plate, the heat transferred from the lamp board assembly to the back plate can be transferred to the heat-conducting part, and the heat-conducting part is in contact with the heat dissipation part on the back shell, so that the heat transferred from the back plate to the heat-conducting part can be transferred from the heat-conducting part to the heat-dissipating part, and the heat-dissipating part is exposed to the outside air, so that the heat generated by the lamp board assembly can be finally dissipated to the outside of the back shell through heat convection between the heat-dissipating part and the outside air. Compared with the prior art in which heat is transferred sequentially through the lamp board assembly, the back plate and the back shell, the above design can make the heat generated by the lamp board assembly pass through the back plate, the heat conducting part and then the heat dissipation part and finally dissipate to the outside of the back shell. That is, it is equivalent to adding a heat dissipation channel from the heat conducting part to the heat dissipation part between the back plate and the back shell. In this way, while improving the heat dissipation effect, it can also provide the possibility for lightweight design of the back shell. For example, the heat dissipation part of the back shell can be made of a metal material with high thermal conductivity, and the area on the back shell where the heat dissipation part is removed can be made of a lightweight plastic material. Since the heat generated by the lamp board assembly can be discharged by the back plate, the heat conducting part and the heat dissipation part of the back shell, this can reduce the weight of the display device while also improving the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0033] Figure 1 is a schematic structural diagram of a backlight module at a first viewing angle provided by an embodiment of the present application;

[0034] Figure 2 yes Figure 1 A schematic cross-sectional view of a partial structure in FIG.

[0035] Figure 3 yes Figure 1 Schematic diagram of the backplane structure in FIG.

[0036] Figure 4 yes Figure 1 A schematic diagram of the structure of the back plate, the heat conducting part and the fasteners used to fix the heat conducting part;

[0037] Figure 5 yes Figure 1 The schematic diagram of the structure with the back shell and heat dissipation part removed is hidden in the middle;

[0038] Figure 6 yes Figure 5 A schematic diagram of the enlarged structure at A in the middle;

[0039] Figure 7 yes Figure 1 Schematic diagram of heat transfer of the light board assembly of the backlight module;

[0040] Figure 8 This is a schematic structural diagram of another backlight module provided by an embodiment of the present application when the back shell is hidden at a first viewing angle;

[0041] Fig. 9 This is a schematic structural diagram of another backlight module provided by an embodiment of the present application at a second viewing angle when the back shell is hidden;

[0042] Fig.10 It is a partial structural diagram of another backlight module in the embodiment of the present application;

[0043] Fig.11 is a rear view of another backlight module in the embodiment of the present application;

[0044] Fig.12 yes Fig.11 Schematic diagram of heat transfer of the light panel assembly of the backlight module.

[0045] Reference numerals:

[0046] 100, backlight module; 10, back plate; 13, heat pipe mounting groove; 14, back plate threaded hole; 20, lamp board assembly; 30, back shell; 31, heat dissipation part; 311, heat dissipation bottom plate; 312, mounting structure; 313, elastic sealing ring; 3111, heat dissipation groove; 3112, limit groove; 32, heat dissipation opening; 3a, first plate body; 3b, second plate body; 40, heat conduction part; 41, first part; 42, second part; 41a, first section; 41b, second section; 5, mounting seat; 51, mounting groove; 52, mounting seat threaded hole; 61, bolt; 62, fixing buckle; 621, clamping part; 622, buckle threaded hole. DETAILED DESCRIPTION

[0047] The scheme of the embodiment of the present application is described in detail below in conjunction with the drawings of the specification.

[0048] In the following description, for the purpose of explanation rather than limitation, specific details such as specific system structures, interfaces, and technologies are provided to facilitate a thorough understanding of the present application.

[0049] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0050] The terms "first", "second", "third" in this application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", "third" can expressly or implicitly include at least one of the features. In the description of this application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the embodiments of this application, all directional indications (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the steps or units listed, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0051] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0052] The present application is described in detail below with reference to the accompanying drawings and embodiments.

[0053] See also Figure 1 to Figure 6 In this embodiment, a backlight module 100 is provided, and the backlight module 100 includes a back plate 10, a light plate assembly 20 and a back shell 30. The back plate 10 has a first side and a second side opposite to each other in the thickness direction; the light plate assembly 20 is arranged on the first side of the back plate 10; the back shell 30 is arranged on the second side, and the back plate 10 and the back shell 30 are sealed to form a receiving cavity; here, when the light plate assembly 20 is applied to the backlight module 100, it can be a direct-type light source or an edge-type light source, which can be set according to actual needs. The light board assembly 20 may include a light board and a light guide plate arranged on the light emitting side of the light board, the light board including a circuit substrate and a light emitting element arranged on the circuit substrate; wherein the light emitting element may specifically be a current-driven light emitting device, such as a light emitting diode (Light Emitting Diode, LED), a sub-millimeter light emitting diode (Mini Light Emitting Diode, Mini-LED), a micro light emitting diode (Micro Light Emitting Diode, Micro-LED), an organic light emitting diode (Organic Light Emitting Diode, OLED) and other light emitting devices.

[0054] In the embodiment of the present application, the connection method between the light panel assembly 20 and the back panel 10 can be fixed by screws, or fixed by an adhesive layer, or a combination of screws and an adhesive layer. The back shell 30 is arranged on the second side of the back panel 10, that is, the back shell 30 is located on the side of the back panel 10 away from the light panel assembly 20.

[0055] In the embodiment of the present application, the back shell 30 and the back plate 10 are sealed to form a receiving cavity. The back shell 30 may be concave toward the side away from the back plate 10 to form a groove, or the back plate 10 may be concave toward the side away from the back shell 30 to form a groove. The edges of the back shell 30 and the back plate 10 are connected by screws or adhesives, and a sealing ring may be provided between the two to seal the back shell 30 and the back plate 10 to form a receiving cavity. Alternatively, one of the back shell 30 and the back plate 10 may be provided with a snap-fitting protrusion on the edge side wall surface, and the other may be provided with a corresponding snap-fitting groove on the edge side wall surface, and the two may be interference fit to form a seal. For example, referring to Figure 3 and Figure 4 The back shell 30 is concave toward the side away from the back plate 10 to form a concave portion, and the side wall of the concave portion is the side wall of the back shell 30. The side wall of the back shell 30 is tightly connected to the side wall of the back plate 10 to seal and form a accommodating cavity.

[0056] In the related art, in order to make the display device meet the requirements of dustproof and waterproof, the back shell 30 is often continuous as a whole (that is, without heat dissipation holes), and the material of the back shell 30 is usually a metal material with high thermal conductivity, such as the back shell 30 is made of aluminum alloy, titanium alloy, etc. That is, while meeting the overall closed design of the display device to be dustproof and waterproof, currently, the back shell 30 is often designed as a metal material as a whole to simultaneously meet the heat transfer and heat dissipation requirements from the back plate 10 to the metal back shell 30, but this will make the display device heavier and inconvenient to transfer.

[0057] To this end, in an embodiment of the present application, the backlight module 100 also includes a heat-conducting portion 40, which is at least partially disposed in the accommodating cavity and in contact with the back panel 10; at the same time, the back shell 30 also has a heat dissipation portion 31, which is in contact with the heat-conducting portion 40; the heat-conducting portion 40 is used to conduct the heat generated by the lamp board assembly 20 to the heat dissipation portion 31, and dissipate it to the outside of the back shell 30 through the heat dissipation portion 31.

[0058] For details, please refer to Figure 4 and Figure 8 In some embodiments, the heat conducting part 40 may be a liquid cooling tube having a cooling liquid medium with high thermal conductivity. Accordingly, the heat dissipation part 31 may be a heat dissipation metal sheet with high thermal conductivity on the back shell 30, or the heat dissipation part 31 may include a heat dissipation metal base plate in contact with the heat conducting part 40 and a liquid cooling tube embedded in the heat dissipation metal base plate.

[0059] The heat conducting part 40 may also be a heat pipe, where the heat pipe may include a tube shell, an end cap and a liquid wick (not shown in the figure). The tube shell may be a hollow tubular structure, and its material may be any one or more materials of metal materials such as aluminum, copper, platinum, gold, etc. In the embodiment of the present application, the material of the tube shell is illustrated by copper as an example; the end caps are arranged at the opposite ends of the tube shell; the liquid wick is located in the hollow tubular structure space, and either end of the tube shell may be an evaporation section or a condensation section. It can be understood that the evaporation section can be used to absorb the heat on the back plate 10, and the heat is transferred to the liquid medium in and around the liquid wick through the tube shell. The liquid medium evaporates into steam after being heated. The steam flows to the condensation section through the channel in the liquid wick under the action of heat diffusion. The steam releases heat in the condensation section and liquefies into a liquid medium. The liquid medium flows back to the evaporation section by the capillary force provided by the liquid wick. In this cycle, the heat on the back plate 10 is transferred to the heat dissipation part 31 through the heat pipe, thereby achieving the heat dissipation requirements. At the same time, the heat pipe is a closed heat dissipation system, and the internal working liquid will not circulate between different periods, so there is no risk of liquid leakage; in addition, compared with the thermal conductivity of copper of 400w / mk, the thermal conductivity of the heat pipe can reach several thousand or even tens of thousands of w / mk, and the temperature cycle of the condensation section and the evaporation section of the heat pipe is less affected by weight. Therefore, the heat conduction part 40 uses a heat pipe for heat conduction, which can have a better heat dissipation efficiency.

[0060] In the present application, unless otherwise specified, refer to Figure 6 and Fig. 9 The heat conducting part 40 is taken as an example of a heat pipe. The heat conducting part 40 is in contact with the back plate 10. It can be understood that the evaporation section of the heat pipe is in contact with the back plate 10, and the condensation section of the heat pipe is in contact with the heat dissipation part 31. In this way, the heat on the back plate 10 can be conducted to the heat dissipation part 31 through the heat pipe, and then the heat is dissipated to the outside of the back shell 30 through the heat dissipation part 31, thereby realizing the heat dissipation of the lamp board assembly 20 by using the heat pipe and the heat dissipation part 31.

[0061] In the embodiment of the present application, the back shell 30 has a heat dissipation portion 31, wherein the heat dissipation portion 31 can be understood as a partial area on the back shell 30 being a heat sink with high thermal conductivity. Accordingly, the heat conducting portion 40 can be entirely located in the accommodating cavity, and the heat sink is in contact with the heat conducting portion 40, and the heat conducting portion 40 dissipates heat to the outside of the back shell 30 through the heat sink. For example, a partial area of ​​the back shell 30 is a copper sheet, an aluminum sheet, or an aluminum alloy sheet with high thermal conductivity, and heat dissipation fins can also be added to the copper sheet, the aluminum sheet, or the aluminum alloy sheet to further increase the heat dissipation effect. In this way, only the area where the heat dissipation portion 31 of the back shell 30 is located can be made of metal material, and the other parts can be made of lightweight plastic material, which can be conducive to achieving a lightweight design of the display device by reducing the weight of the back shell 30.

[0062] In other embodiments, the heat dissipation portion 31 can also be understood as an attached structure on the back shell 30. For example, the back shell 30 has a heat dissipation opening 32 (see Figure 2 ), the heat dissipation opening 32 is sealed and filled with a heat-conducting heat dissipation bottom plate 311, the heat dissipation bottom plate 311 is used to seal the opening, the heat dissipation part 31 is the heat dissipation bottom plate 311 at the heat dissipation opening 32, and the heat-conducting part 40 takes a heat pipe as an example, the condensation section of the heat pipe is in contact with the heat dissipation bottom plate 311, and is used to transfer heat to the heat dissipation part 31 through the heat pipe, and then dissipate the heat from the heat dissipation part 31 to the outside of the back shell 30. At this time, correspondingly, the heat-conducting part 40 can be completely located in the accommodating cavity, and the part of the heat-conducting part 40 close to the heat dissipation part 31 is in contact with the heat dissipation part 31, for example, the part of the heat-conducting part 40 located below the heat dissipation bottom plate 311 facing the back plate 10 is in contact with the heat dissipation bottom plate 311; or a part of the heat-conducting part 40 can be located in the accommodating cavity and in contact with the back plate 10, and another part of the heat-conducting part 40 is in contact with the side of the heat dissipation bottom plate 311 away from the back plate 10, and exposed to the back shell 30. In this way, heat dissipation is achieved by setting the heat dissipation part 31 in contact with the heat conduction part 40 , and the part of the back shell 30 excluding the heat dissipation part 31 can be designed to be a lightweight plastic material, which is also beneficial to weight reduction of the display.

[0063] With the above design, the back plate 10 and the back shell 30 are sealed to form a receiving cavity, which can meet the requirement of the overall closed type of the display. In addition, by arranging the heat conducting part 40 in the receiving cavity, and the heat conducting part 40 is in contact with the back plate 10, the heat transferred from the light board assembly 20 to the back plate 10 can be transferred to the heat conducting part 40, and the heat conducting part 40 is in contact with the heat dissipation part 31 on the back shell 30, so that the heat transferred from the back plate 10 to the heat conducting part 40 can be transferred from the heat conducting part 40 to the heat dissipation part 31, and the heat dissipation part 31 can be exposed to the outside air, so that the heat transferred to the heat dissipation part 31 can undergo heat convection with the outside air through the heat dissipation part 31 and finally dissipated to the outside of the back shell 30. In this way, compared with the prior art in which the heat generated by the lamp panel assembly 20 is transferred through the back plate 10 and then through the back shell 30, the heat generated by the lamp panel assembly 20 can be dissipated to the outside of the back shell 30 through the back plate 10 and the heat conducting part 40 through the heat dissipation part 31, which is equivalent to adding a heat dissipation channel from the heat conducting part 40 to the heat dissipation part 31 between the back plate 10 and the back shell 30. In this way, while improving the heat dissipation effect, it can also provide the possibility for the lightweight design of the back shell 30, such as making the heat dissipation part 31 of the back shell 30 into a metal material with high thermal conductivity, and making the area on the back shell 30 where the heat dissipation part 31 is removed into a lightweight plastic material. Since the heat generated by the lamp panel assembly 20 can be discharged by the back plate 10, the heat conducting part 40, and the heat dissipation part 31 of the back shell 30, this can reduce the weight of the display device while meeting the heat dissipation requirements.

[0064] In some embodiments, Figure 4 , Figure 5and Figure 6 As shown, the heat conducting part 40 includes a first part 41 and a second part 42 connected to each other. The first part 41 contacts the heat dissipating part 31, and is used to dissipate heat to the outside of the back shell 30 and / or transfer heat to the heat dissipating part 31; the second part 42 is located in the accommodating cavity, and is used to conduct the heat generated by the light board assembly 20 to the first part 41. Among them, the second part 42 of the heat conducting part 40 is located in the accommodating cavity, and the second part 42 abuts against the back plate 10, and is used to conduct the heat transferred from the light board assembly 20 to the back plate 10 to the first part 41. For the first part 41 to contact with the heat dissipating part 31, it can be understood that the first part 41 is in contact with the heat dissipating part 31, and the first part 41 is exposed to the back shell 30; in this way, the first part 41 can directly dissipate heat to the outside of the back shell 30, and at the same time, because the first part 41 contacts with the heat dissipating part 31, the first part 41 also transfers heat to the heat dissipating part 31, and then the heat dissipating part 31 transfers heat to the outside of the back shell 30. Alternatively, the first portion 41 is embedded in the heat dissipation portion 31, and the first portion 41 cannot directly dissipate heat to the outside of the back shell 30, but transfers the heat to the heat dissipation portion 31, and then the heat dissipation portion 31 dissipates the heat to the outside of the back shell 30. The above arrangement can make the portion of the back shell 30 with the heat dissipation portion 31 made of metal heat conductive material, and the portion of the back shell 30 without the heat dissipation portion 31 made of plastic material, which can help reduce the weight of the back shell 30, and at the same time, achieve a better heat dissipation effect through the arrangement of the heat conductive portion 40 and the heat dissipation portion 31.

[0065] For example, refer to Figure 1 and Figure 2 The back shell 30 has a heat dissipation opening 32, and the heat dissipation portion 31 is sealed and connected to the heat dissipation opening 32, so that the back plate 10 and the back shell 30 remain sealed; the first part 41 is fixedly installed on the heat dissipation portion 31, and the first part 41 is exposed from the back shell 30. The shape and size of the heat dissipation opening 32 are not limited. For example, the heat dissipation opening 32 can be circular, square, etc. Correspondingly, the outer cross-sectional shape of the heat dissipation portion 31 is adapted to the heat dissipation opening 32, so as to make the heat dissipation portion 31 and the heat dissipation opening 32 sealed and connected. Both the heat dissipation portion 31 and the heat dissipation opening 32 can be multiple, and the number of the heat dissipation portion 31 and the heat dissipation opening 32 is the same, and they are arranged one by one. In addition, the heat dissipation part 31 and the heat dissipation opening 32 can be connected by interference fit, or the heat dissipation part 31 includes a substrate and a columnar protrusion protruding from the substrate and the heat dissipation opening 32 to form an adaptation, the columnar protrusion is filled in the heat dissipation opening 32, and the substrate and the heat dissipation opening 32 on the back shell 30 are attached along the side wall and then screwed or bonded to the back shell 30. The first part 41 can be welded to the heat dissipation part 31, or it can be snapped to the heat dissipation part 31, and there is no specific limitation.

[0066] For example, refer to Figure 2 , Figure 5 and Figure 6The heat dissipation part 31 includes a heat dissipation base plate 311 and a mounting structure 312. The heat dissipation base plate 311 is made of heat-conducting material. The heat dissipation base plate 311 is arranged on the side of the back shell 30 facing the back plate 10. The orthographic projection of the heat dissipation base plate 311 on the back shell 30 covers the heat dissipation opening 32, which is used to block the heat dissipation opening 32. The heat dissipation base plate 311 is fastened and connected to the back shell 30 through the mounting structure 312, and the first part 41 is installed on the side of the heat dissipation base plate 311 facing the back shell 30. Among them, the material of the heat dissipation base plate 311 can be copper, aluminum, platinum or their alloys, such as, the heat dissipation base plate 311 can be aluminum or aluminum alloy with lower cost. The shape of the heat dissipation base plate 311 is not limited. The size of the heat dissipation base plate 311 is larger than the size of the heat dissipation opening 32, and can meet the requirement of sealing the heat dissipation opening 32. The size of the heat dissipation opening 32 can be set according to the heat dissipation requirements, and there are no excessive restrictions on this.

[0067] For the mounting structure 312, the mounting structure 312 can be an adhesive, through which the heat dissipation base plate 311 is bonded to the back shell 30; the mounting structure 312 can also include screws with external threads, through holes opened on the heat dissipation base plate 311, and threaded holes opened on the back shell 30 and corresponding to the through holes one by one and adapted to the external threads of the screws, and the screws are passed through the through holes in turn and then tightened into the threaded holes to fasten the heat dissipation base plate 311 and the back shell 30 to the side wall of the back shell 30 facing the back plate 10.

[0068] See also Figure 2 and Figure 6 The heat dissipation part 31 also includes an elastic sealing ring 313, which is arranged between the heat dissipation base plate 311 and the back shell 30; the elastic sealing ring 313 is used to maintain the sealed connection between the heat dissipation base plate 311 and the back shell 30 through deformation force. In this case, the opposite sides of the elastic sealing ring 313 can be respectively abutted between the heat dissipation base plate 311 and the back shell 30 in the thickness direction of the back shell 30; the elastic sealing ring 313 can also be bonded to at least one of the heat dissipation base plate 311 and the back shell 30 by adhesive; or at least one of the heat dissipation base plate 311 and the back shell 30 is provided with a limiting groove that is sleeved and matched with the elastic sealing ring 313, so that part of the elastic sealing ring 313 is clamped and limited in the limiting groove 3112.

[0069] For example, referring to Figure 2 and Figure 6A limiting groove 3112 is provided on the heat dissipation base plate 311, and the limiting groove 3112 is adapted to the outer contour of the elastic sealing ring 313 so that part of the elastic sealing ring 313 is clamped and limited in the limiting groove 3112, and another part of the elastic sealing ring 313 protrudes out of the limiting groove 3112 to abut against the back shell 30 for deformation and maintain a sealed state. In addition, a first threaded hole is provided on the heat dissipation base plate 311, and a second threaded hole is provided on the back shell 30 corresponding to the first threaded hole. The mounting structure 312 also includes a bolt (not shown), and the bolt has an external thread. The internal thread of the first threaded hole and the internal thread of the second threaded hole are threadedly adapted to the external thread of the bolt. When the heat dissipation base plate 311 is fastened to the back shell 30 by the bolt 61, for example, the bolt 61 passes through the first threaded hole and the second threaded hole in sequence and is continuously tightened. The elastic sealing ring 313 is squeezed and deformed to form an elastic deformation to fill the gap space between the heat dissipation base plate 311 and the back shell 30, so that the heat dissipation base plate 311 seals and blocks the heat dissipation opening 32 on the back shell 30, so as to have a better dustproof and waterproof effect to the outside world, thereby making the display device have good overall sealing properties.

[0070] A heat dissipation groove 3111 is provided on the side of the heat dissipation bottom plate 311 away from the back plate 10, and the orthographic projection of the heat dissipation groove 3111 on the back shell 30 is located in the heat dissipation opening 32 area. Here, the design of the heat dissipation groove 3111 can improve the heat dissipation efficiency of the heat dissipation part 31 by increasing the heat dissipation area.

[0071] In some embodiments, reference Figure 3 and Figure 4 The back shell 30 is concavely formed with a concave portion on the side facing away from the back plate 10, and the space in the concave portion is used as a receiving space formed by the sealed connection between the back plate 10 and the back shell 30. The heat conducting portion 40 takes a heat pipe as an example, and the edge areas on the opposite sides of the back plate 10 correspond to the heat dissipation portion 31, and the opposite ends of the heat pipe are arranged corresponding to the heat dissipation portion 31 as the first part 41, and the second part 42 of the heat pipe, that is, the part where the heat pipe contacts the back plate 10, or the second part of the heat pipe can also be understood as the part of the area between the opposite sides of the back plate 10. Among them, a heat pipe mounting groove 13 is designed on the back plate 10, and the number of heat pipes can be multiple and arranged at intervals.

[0072] like Figure 4As shown, the heat pipes can be arranged to be 5, and the second part 42 of the heat pipe is fixed by the heat pipe fixing buckle 62. Specifically, the heat pipe fixing buckle 62 may be provided with a buckle threaded hole 622, and the back plate 10 may have a back plate threaded hole 14 at a position opposite to the thread. The second part 42 of the heat pipe is fixed to the back plate 10 by passing a bolt through the buckle threaded hole 622 and the back plate threaded hole 14 in sequence. In addition, the junction between the first part 41 and the second part 42 of the heat pipe may be bent so that the first part 41 of the heat pipe is lifted to be attached to the heat dissipation base plate 311. Specifically, the first part 41 may pass through the heat dissipation base plate 311 and be attached to the surface of the side of the heat dissipation base plate 311 away from the back plate 10. For the first part 41 of the heat pipe, that is, the part of the heat pipe extending from the bending point of the second part 42 and the first part 41 to the heat dissipation base plate 311, the first part 41 can be connected to the heat dissipation base plate 311 of the heat dissipation part 31 by welding. By adopting the welding process, the first part 41 of the heat pipe can be seamlessly connected to the heat dissipation part 31, so as to play an effective dust-proof and waterproof role.

[0073] Through the above-mentioned arrangement, the second part 42 of the heat conducting part 40 can be firmly contacted and connected to the back panel 10, so that the heat conducted from the lamp board assembly 20 to the back panel 10 can be conducted to the second part 42 of the heat conducting part 40 more quickly, and the first part 41 of the heat conducting part 40 is seamlessly welded to the heat dissipation bottom plate 311 of the heat dissipation part 31, that is, the heat conducting part 40 is in contact with the heat dissipation part 31, so that the heat conducting part 40 can conduct the heat generated by the lamp board assembly 20 to the heat dissipation part 31 through the back panel 10 and the heat conducting part 40, and dissipate it to the outside of the back shell 30 through the heat dissipation part 31.

[0074] For example, refer to Figure 1 , Figure 2 and Figure 6 , the first part 41 of the heat-conducting part 40 is seamlessly welded on the heat-dissipating bottom plate 311 of the heat-dissipating part 31, and is exposed on the back shell 30. That is, the heat conducted from the heat-conducting part 40 to the heat-dissipating part 31 can be dissipated to the outside of the back shell 30 through the heat-dissipating part 31, and directly conducts heat convection with the outside air through the heat-dissipating part 31. Among them, the heat-dissipating bottom plate 311 of the corresponding heat-dissipating part 31 on the back shell 30 is made of a metal material with high thermal conductivity, so that the heat of the heat-conducting part 40 received by the heat-dissipating part 31 can be dissipated to the outside air outside the back shell 30 more quickly; and the material of the other parts of the back shell 30 except the heat-dissipating part 31 can be made of plastic material, so as to reduce the weight of the back shell 30. Here, although the part of the back shell 30 except the heat-dissipating part 31 is made of plastic material, it can also conduct part of the heat of the heat-conducting part 40, so that part of the heat can also be dissipated through this part of the back shell 30. Therefore, referring to Figure 7 In the embodiment, the heat conducting part 40 conducts the heat to the heat dissipating part 31 and the back shell 30 , and then conducts heat convection with the air, thereby dissipating the heat to the outside of the back shell 30 .

[0075] In addition, it should be noted that when the first portion 41 of the heat conducting portion 40 contacts the heat dissipating portion 31, the first portion 41 of the heat conducting portion 40 may be exposed to the heat dissipating portion 31, such as Figure 6 As shown, the first part 41 of the heat conducting part 40 is exposed after being welded to the heat dissipation bottom plate 311 of the heat dissipation part 31, that is, the first part 41 of the heat conducting part 40 is located outside the accommodating cavity and is directly in contact with the outside air; accordingly, it can be understood that the first part 41 of the heat conducting part 40 is in contact with the heat dissipation part 31, and the heat of the first part 41 of the heat conducting part 40 can be conducted to the heat dissipation part 31 and then dissipated to the outside of the back shell 30; at the same time, since the first part 41 of the heat conducting part 40 is exposed, a part of the heat conducted to the first part 41 of the heat conducting part 40 can be directly dissipated to the outside of the back shell 30.

[0076] Among them, there can be multiple heat pipes, such as Figure 1 and Figure 5 As shown in , five heat pipes are arranged in parallel and spaced apart, and each heat pipe is connected to a heat dissipation portion 31 at two opposite ends along its own extension direction, that is, the five heat pipes are provided with a total of ten heat dissipation portions 31. Alternatively, one heat dissipation portion 31 may be provided at each of the two opposite ends along its own extension direction, that is, the same end of the five heat pipes shares a heat dissipation portion 31 of a larger size, that is, the five heat pipes are provided with a total of two heat dissipation portions 31, so as to improve the manufacturing cost and efficiency of the heat dissipation structure.

[0077] For example, in some embodiments, the heat conducting portion 40 may also use only one heat pipe, and the two opposite ends of the heat pipe along its own extension direction are respectively connected to a heat dissipation portion 31. For example, the second portion 42 of the heat pipe is arranged in the middle area of ​​the back plate 10, and the second portion 42 is not linear, and can be in the shape of a U-shaped or a continuous plurality of "X" shapes. The first portion 41 of the heat pipe is bent relative to the second portion 42 and then lifted so as to be seamlessly welded to the heat dissipation portion 31. In this way, the use of a single heat conducting portion 40 can make the heat dissipation structure design simple and easy.

[0078] In other embodiments, reference Figure 8 , Fig. 9 and Fig.11 , the area where the back shell 30 is located is continuous, and the entire heat-conducting part 40 is contained in the containing cavity; the back shell 30 includes a first plate body 3a and a second plate body 3b that are continuously spliced ​​together, and the first plate body 3a forms a heat dissipation part 31; wherein the material of the first plate body 3a is different from the material of the second plate body 3b, and the thermal conductivity of the first plate body 3a is greater than the thermal conductivity of the second plate body 3b. Among them, the entire heat-conducting part 40 is contained in the containing cavity formed by the sealing of the back plate 10 and the back shell 30, that is, the heat-conducting part 40 is not exposed, but is built into the containing cavity between the back plate 10 and the back shell 30, which makes it easy to realize the overall closed structure of the display.

[0079] In the related art, there is no additional heat dissipation channel between the back plate 10 and the back shell 30, but the back shell 30 is simply made of a metal material with high thermal conductivity to conduct the heat generated by the light board assembly 20 directly to the back shell 30 through the back plate 10, which undoubtedly sacrifices the requirement for lightweight design of the back shell 30. If the back shell 30 is designed as a lightweight plastic material without a new heat dissipation design structure, it cannot meet the heat dissipation requirements of the light board assembly 20 in the display.

[0080] In the embodiment of the present application, a heat conducting part 40 is added between the back plate 10 and the back shell 30. Here, the heat conducting part 40 can be a heat conducting structure with high thermal conductivity such as a liquid cooling tube, a heat conducting medium, a heat pipe, etc. arranged in the accommodating cavity. In this embodiment, the heat conducting part 40 is still described by taking a heat pipe as an example. For example, all the heat pipes are arranged in the accommodating cavity, and the heat pipes are in contact with the back plate 10, so that the heat generated by the light board assembly 20 is conducted to the back plate 10, and then conducted to the heat pipe through the back plate. Specifically, in this embodiment, thermally conductive silicone is coated between the light board assembly 20 and the back plate 10, and between the back plate 10 and the heat conducting part 40, so that the thermally conductive silicone fills the gap between the light board assembly 20 and the back plate 10, and the gap between the back plate 10 and the heat conducting part 40, so as to improve the thermal conductivity efficiency. The heat dissipation part 31 of the back shell 30 is formed on the first plate body 3a of the back shell 30 with high thermal conductivity, that is, the first plate body 3a of the back shell 30 is the heat dissipation part 31. For example, the first plate 3a may be made of copper, aluminum, platinum, silver or alloys thereof, and the second plate 3b may be made of a lightweight plastic material. Specifically, the area where the back shell 30 is located is continuous, which can be understood as having no openings on the back shell 30, and being a complete, continuous and closed whole, so that the back shell 30 is connected to the back plate 10 to form a sealed whole, thereby meeting the overall closed structure requirements of the display device.

[0081] The above arrangement of this embodiment, by adding a heat pipe as a heat conducting part 40 between the back shell 30 and the back plate 10, and forming a heat dissipation part 31 with high thermal conductivity on the back shell 30 in contact with the heat conducting part 40, the heat conducting part 40 conducts the heat generated by the lamp board to the heat dissipation part 31 and then dissipates it to the outside of the back shell 30, which is equivalent to adding a new heat dissipation channel to improve the heat dissipation effect. At the same time, only part of the back shell 30 can be made of a metal material with high thermal conductivity, and the other parts of the back shell 30 can be made of a light plastic material. Finally, under the premise of satisfying the overall closed structure, it also has the advantages of good heat dissipation effect and light weight.

[0082] Further, refer to Fig. 9 and Fig.10, a mounting seat 5 is also connected to the back plate 10, and the mounting seat 5 is located on the second side of the back plate 10, and the mounting seat 5 is made of heat-conducting material; the heat-conducting part 40 includes a first section 41a and a second section 41b connected to each other, and the second section 41b is fixedly connected to the back plate 10 by a fastener 6; in the thickness direction of the back plate 10, the height of the first section 41a relative to the back plate 10 is greater than the height of the second section 41b relative to the back plate 10, the mounting seat 5 is used to lift the first section 41a, and the first section 41a is in contact with the mounting seat 5 to conduct heat to the mounting seat 5, and the mounting seat 5 is in contact with the first plate body 3a on one side wall facing the back shell 30.

[0083] Among them, the heat conducting part 40 is explained by taking a heat pipe as an example, and the second section 41b is fixedly connected to the back plate 10 by a fastener 6. Here, the fastener 6 may include a bolt (not shown) and a heat pipe fixing buckle 62. Specifically, the heat pipe fixing buckle 62 includes a clamping part 621 with an arc and a buckle threaded hole 622. The arc of the clamping part 621 is adapted to the arc of the outer wall of the heat pipe, so as to be used to sleeve the part of the outer wall that abuts the heat pipe to prevent the heat pipe from moving away from the back plate 10; a threaded hole is provided on the back plate 10 corresponding to the buckle threaded hole 622. For example, after the second section 41b of the heat pipe is limited by a plurality of clamping parts 621, the bolts pass through the buckle threaded holes 622 in sequence and are tightened in the threaded holes on the back plate 10, so as to realize that the second section 41b of the heat pipe is in contact with the back plate 10, and then used to conduct the heat of the back plate 10 to the heat pipe. The junction between the first section 41a and the second section 41b of the heat pipe has a bending portion. In the thickness direction of the back plate 10, the height of the first section 41a relative to the back plate 10 is greater than the height of the second section 41b relative to the back plate 10. After being bent relative to the second section 41b, the first section 41a is raised to a certain height so that the first section 41a can contact the mounting seat 5.

[0084] Continue, refer to Fig. 9 , the side of the mounting seat 5 facing the back shell 30 has a mounting groove 51; in the thickness direction of the back plate 10, the height of the first section 41a relative to the back plate 10 is adapted to the height of the mounting groove 51 relative to the back plate 10, so that part of the first section 41a can be embedded in the mounting groove 51; in the state where the back plate 10 and the back shell 30 are sealed and connected, part of the side wall of the first section 41a and the side wall of the mounting seat 5 facing the back shell 30 are both in contact with the back shell 30. That is, the side wall of the first end 41a facing the back shell 30 and the side wall of the mounting seat 5 facing the back shell 30 are both in contact with the back shell 30.

[0085] The specific shape of the mounting base 5 is not limited, and it can be a plate-like structure with a cross-sectional shape of square, oval, etc. The specific material of the mounting base 5 only needs to have a high thermal conductivity, such as aluminum, copper, platinum or its alloy. In the embodiment of the present application, the material of the mounting base 5 is a lightweight aluminum alloy to reduce the weight of the backlight module 100. The mounting base 5 is roughly a long strip of plate-like structure. The number of mounting bases 5 is not limited, and it can be one or more. For example, refer to Fig. 9 There is one mounting seat 5, and the mounting seat 5 is connected to one end area of ​​the back plate 10 along the length direction or the width direction.

[0086] The first section 41a of the heat conducting part 40 may be completely embedded in the mounting seat 5; or the mounting seat 5 may have a mounting groove 51 on the side facing the back shell 30, and a portion of the first section 41a of the heat conducting part 40 is located in the mounting groove 51, so as to limit the heat conducting part 40 in the mounting groove 51, and a portion of the first section 41a of the heat conducting part 40 facing the back shell 30 may slightly protrude from the mounting groove 51, or a side wall of the first section 41a of the heat conducting part 40 facing the back shell 30 is just flush with the plane of the notch of the mounting groove 51. For example, refer to Fig. 9 and Fig.10 The portion of the heat conducting part 40 facing the back shell 30 protrudes out of the mounting groove 51, and the portion of the heat conducting part 40 installed on the mounting seat 5, that is, the first portion 41 of the heat conducting part 40 can be flattened. In this way, when the back plate 10 and the back shell 30 are sealed and pressed tightly, the portion of the heat conducting part 40 facing the back shell 30 can be completely fitted with the back shell 30 after being flattened, and the side wall of the mounting seat 5 facing the back shell 30 is also fitted with the back shell 30. In this way, it is equivalent to that the first portion 41 of the heat conducting part 40 and the side wall of the mounting seat 5 facing the back shell 30 are both fitted with the back shell 30, which increases the contact area between the heat conducting part 40 and the back shell 30, and can effectively improve the thermal conductivity efficiency, thereby further improving the heat dissipation effect.

[0087] There is no limitation on the connection method between the mounting seat 5 and the back plate 10 and the back shell 30. For example, the side wall of the mounting seat 5 facing the back plate 10 may be bonded to the back plate 10 with a heat-conducting adhesive, the other side wall of the mounting seat 5 may be provided with a mounting seat threaded hole 52, and the back shell 30 may have a threaded hole at a position corresponding to the mounting seat threaded hole 52, and the bolt 61 may pass through the threaded hole on the back shell 30 and then be tightened to the mounting seat threaded hole 52 on the mounting seat 5. Alternatively, the side of the mounting seat 5 facing the back shell 30 may be bonded to the back shell 30, and the side of the mounting seat 5 facing the back plate 10 may be bonded to the back plate 10. Alternatively, threaded holes may be provided at corresponding positions of the mounting seat 5 and the back shell 30, and the mounting seat 5 may be fastened to the back plate 10 by the bolt 61.

[0088] Here, it is considered that if the mounting seat 5 is not designed, if the first section 41a and the second section 41b of the heat pipe are both fixed to the heat pipe by the fixing buckle 62, since the heat pipe fixing buckle 62 has a curved clamping portion 621 that is sleeved on the periphery of the heat pipe, that is, the clamping portion 621 is facing one side of the back shell 30, that is, it is the clamping portion 621 that contacts the back shell 30 rather than the heat pipe. On the one hand, the back shell 30 is not in direct contact with the heat pipe, that is, the heat on the heat pipe is transferred to the back shell 30 through the heat pipe fixing buckle 62, the contact area between the two is extremely small, and the heat dissipation effect is poor; on the other hand, if the mounting seat 5 is not set, the heat pipe will inevitably be squeezed when the back shell 30 is sealed and connected, resulting in damage to the heat pipe. Furthermore, even if the heat pipe is flattened first and then fitted into contact with the back shell 30, firstly, the contact area is very limited and the heat dissipation effect is poor; secondly, if the heat pipe is all attached to the back shell 30, during long-term use, considering the thermal expansion and contraction of the heat pipe, the back shell 30 will repeatedly apply force to the heat pipe, which will also affect the service life of the heat pipe. The design of the mounting seat 5 makes it possible for the second section 41b of the heat conducting part 40 not to contact the back shell 30, thus providing a good protection for the second section 41b of the heat conducting part 40; at the same time, the first section 41a of the heat conducting part 40 conducts heat to the mounting seat 5, and the mounting seat 5 fits with the back shell 30. Compared with the fit of the heat pipe and the back shell 30, the heat dissipation contact area is greatly increased, and the heat dissipation effect is good; in addition, since the first section 41a of the heat conducting part 40 located on the mounting seat 5 is accommodated in the mounting groove 51 on the mounting seat 5, even if the first section 41a of the heat conducting part 40 is flattened, the mounting groove 51 of the mounting seat 5 will protect the first section 41a of the heat conducting part 40. In summary, the design of the mounting seat 5 can not only improve the heat dissipation effect, but also protect the heat conducting part 40 to improve the service life of the entire display.

[0089] Reference Fig.11 , the first plate 3a on the back shell 30 can be made of aluminum alloy, the second plate 3b can be made of plastic, and the orthographic projection of the first plate 3a on the mounting seat 5 completely covers the mounting seat 5, so that the first plate 3a can be completely attached to the mounting seat 5, even if the first plate 3a made of aluminum alloy thermal conductive material is in full contact with the mounting seat 5 with higher thermal conductivity, so that the heat transferred to the mounting seat 5 by the heat conducting part 40 is dissipated to the outside of the back shell 30 through the heat dissipation part 31 formed by the first plate 3a on the back shell 30. Furthermore, a plurality of heat dissipation grooves 3111 can also be provided on the first plate 3a to further improve the heat dissipation efficiency by increasing the heat dissipation area; or a plurality of heat dissipation fins can be added on the side of the first plate 3a away from the back plate 10 to further improve the heat dissipation efficiency. The above design can reduce the weight of the back shell 30 while ensuring sufficient heat dissipation area.

[0090] For example, refer to Fig.12Specifically, the heat generated by the lamp panel assembly 20 is transferred to the back panel 10 by heat conduction, and the back panel 10 then conducts the heat to the heat conducting part 40, and then the heat conducting part 40 transfers the heat to the mounting seat 5, and then the mounting seat 5 transfers the heat to the first plate 3a (i.e., the heat dissipation part 31) of the back shell 30, and then forms heat convection with the air outside the back shell 30; this also includes that after the back panel 10 conducts the heat to the heat conducting part 40, the heat conducting part 40 on the mounting seat 5 contacts the back shell 30, and then the back shell 30 and the outside air conduct heat. That is, the heat of the lamp panel assembly 20 is transferred to the back panel 10 by heat conduction, and then the back panel 10 transfers the heat to the first plate 3a (which can be the aluminum alloy part of the back shell 30) and the second plate 3b (which can be the plastic part of the back shell 30) of the back shell 30 through the heat conducting part 40 and the heat pipe mounting seat 5, and finally transfers the heat to the air by heat convection to achieve heat dissipation.

[0091] The embodiment of the present application also provides a display device, which includes a backlight module 100 and a display panel as provided in the above technical solution. The display panel is used to display images, and the backlight module 100 is arranged opposite to the display panel to provide backlight to the display panel. Since the display device includes the backlight module 100 described in the above embodiment, the display device not only meets the overall closed design, but also has the advantages of good heat dissipation effect and is conducive to the lightweight design of the display device.

[0092] The above are only implementation methods of the present application, and are not intended to limit the patent protection scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A backlight module, comprising: a back plate having a first side and a second side opposite to each other in a thickness direction; A light panel assembly, disposed on the first side; A back shell, disposed on the second side, wherein the back plate and the back shell are sealed to form a receiving cavity; Characterized in that the backlight module also includes: a heat conducting portion, at least partially disposed in the accommodating cavity and in contact with the back plate; The back shell has a heat dissipation portion, which is in contact with the heat conduction portion; the heat conduction portion is used to conduct the heat generated by the light board assembly to the heat dissipation portion, and dissipate the heat to the outside of the back shell through the heat dissipation portion.

2. The backlight module according to claim 1, characterized in that: The heat conducting portion comprises a first portion and a second portion connected to each other, wherein the first portion is in contact with the heat dissipating portion and is used to dissipate heat to the outside of the back shell and / or transfer heat to the heat dissipating portion; The second part is located in the accommodating cavity and is used for conducting heat generated by the light board assembly to the first part.

3. The backlight module according to claim 2, characterized in that: The back shell has a heat dissipation opening, and the heat dissipation portion is sealed and connected to the heat dissipation opening, so that the back plate and the back shell are kept sealed; The first portion is fixedly mounted on the heat dissipation portion, and the first portion is exposed from the back shell.

4. The backlight module according to claim 3, characterized in that: The heat dissipation part includes a heat dissipation base plate and a mounting structure, the base plate is made of heat-conducting material, the heat dissipation base plate is arranged on the side of the back shell facing the back plate, and the orthographic projection of the heat dissipation base plate on the back shell covers the heat dissipation opening, so as to block the heat dissipation opening; The heat dissipation base plate is closely and firmly connected to the back shell through the mounting structure, and the first part is mounted on a side of the heat dissipation base plate facing the back shell.

5. The backlight module according to claim 4, characterized in that: The heat dissipation part further includes an elastic sealing ring, and the elastic sealing ring is arranged between the bottom plate and the back shell; The elastic sealing ring is used to maintain the sealed connection between the bottom plate and the back shell through deformation force.

6. The backlight module according to claim 4, characterized in that: A heat dissipation groove is provided on a side of the heat dissipation bottom plate away from the back plate, and the orthographic projection of the heat dissipation groove on the back shell is located in the heat dissipation opening area.

7. The backlight module according to claim 1, characterized in that: The area where the back shell is located is continuous, and the entire heat conduction part is accommodated in the accommodation cavity; The back shell includes a first plate body and a second plate body that are continuously spliced ​​together, and the first plate body forms the heat dissipation part; The material of the first plate body is different from the material of the second plate body, and the thermal conductivity of the first plate body is greater than the thermal conductivity of the second plate body.

8. The backlight module according to claim 7, characterized in that: The back plate is connected with a mounting seat, the mounting seat is located on the second side, and the mounting seat is made of a heat-conducting material; The heat conducting part comprises a first section and a second section connected to each other, and the second section is fixedly connected to the back plate via a fastener; In the thickness direction of the back plate, the height of the first section relative to the back plate is greater than the height of the second section relative to the back plate, the mounting base is used to lift the first section, and the first section is in contact with the mounting base to conduct heat to the mounting base, and the side wall of the mounting base facing the back shell abuts against the first plate body.

9. The backlight module according to claim 8, characterized in that: The mounting seat has a mounting groove on one side facing the back shell; In the thickness direction of the back plate, the height of the first section relative to the back plate is adapted to the height of the mounting groove relative to the back plate, so that a portion of the first section can be embedded in the mounting groove; When the back plate is sealed and connected to the back shell, a portion of the side wall of the first section and a side wall of the mounting seat facing the back shell are both in contact with the back shell.

10. A display device, characterized in that: include: A display panel, used for displaying images; The backlight module is the backlight module according to any one of claims 1 to 9, arranged opposite to the display panel, and used for providing backlight to the display panel.

Images