Automatic heat dissipation device and system for computer

Abstract

The invention discloses an automatic cooling device and system for a computer. The automatic cooling device comprises a shell, and cooling fins are arranged on the inner side of the top of the shell; the device further comprises a functional mechanism. The functional mechanism is arranged at the top position of the shell and is composed of a monitoring assembly and a purging assembly, and the monitoring assembly is arranged at one end position of the shell and is connected with the water cooling pipe; the purging assembly is arranged on the cooling fins, and the purging assembly is not in contact with the monitoring assembly; in the using process, dust on the cooling fins is blown through the blowing assembly; through the designed monitoring assembly, the temperature of the cooling liquid in the water cooling pipe can be detected in real time, so that the heat dissipation power needed by current operation of the computer is accurately reflected, data collected by the monitoring assembly is subsequently used for intelligently adjusting the power of the heat dissipation system, and it is ensured that the heat dissipation effect is perfectly matched with the actual requirement of the computer. According to the dynamic adjusting mechanism, energy waste caused by excessive heat dissipation is effectively avoided, and the overall energy consumption is remarkably reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of computer heat dissipation, and in particular relates to an automatic computer heat dissipation device and system. Background Art

[0002] A computer automatic cooling device refers to a device or system used to dissipate heat inside a computer. It can automatically sense the temperature inside the computer and take appropriate cooling measures to ensure the stable operation of the computer.

[0003] Existing computer automatic cooling devices are usually designed to start synchronously with the computer host, which means that as long as the computer is turned on, the cooling system will immediately start working, regardless of the current computing load or actual cooling demand. Although this working mode ensures that the computer can be cooled in time when it is running at high load, it also brings a significant problem: the cooling service life remains unchanged.

[0004] Specifically, whether the computer is performing light tasks or high-intensity computing, the heat dissipation device will operate at the same power and efficiency, and cannot dynamically adjust its heat dissipation effect according to the actual working environment and temperature fluctuations. This inflexible design may not only lead to excessive heat dissipation when there is low heat demand, causing unnecessary energy waste and increased power consumption, but may also accelerate the wear of components such as cooling fans and shorten their service life.

[0005] Therefore, although the existing computer automatic heat dissipation device ensures the stable operation of the computer to a certain extent, its fixed working mode also causes problems of high power consumption and low energy efficiency. Summary of the invention

[0006] The object of the present invention is to provide an automatic heat dissipation device and system for a computer, so as to solve the problem that the heat dissipation power of the automatic heat dissipation device proposed in the above background technology is constant and has a high power.

[0007] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an automatic heat dissipation device for a computer, comprising a shell, a heat sink being arranged on the inner side of the top; and a functional mechanism being arranged at the top of the shell, the functional mechanism being composed of a monitoring component and a purge component, wherein the monitoring component is arranged at one end of the shell and is connected to a water cooling pipe; the purge component is arranged on the heat sink, and the purge component and the monitoring component do not contact each other; in use, the dust on the heat sink is purged by the purge component to ensure that the heat dissipation efficiency is not affected.

[0008] As a preferred technical solution in the present invention, a cold water pipe is installed on the top of one end of the shell, and the cold water pipe is connected to the water cooling pipe. The monitoring component includes a temperature sensor installed at one end of the shell, and the temperature sensor is located between the two cold water pipes. A ring is also connected to the temperature sensor, and the ring is mounted on the water cooling pipe. A detection probe is also provided inside the ring. The temperature of the cooling liquid inside the water cooling pipe is detected by the detection probe. When the water temperature is low, it indicates that the computer's heat dissipation demand is not high. At this time, the heat dissipation efficiency, that is, the water cooling operation efficiency, can be reduced. Otherwise, the water cooling operation efficiency can be improved.

[0009] As a preferred technical solution in the present invention, a connecting harness is further connected between the collar and the temperature sensor, and the temperature sensor is connected to a CPU inside the computer.

[0010] As a preferred technical solution in the present invention, the purge assembly includes main air ducts equidistantly distributed on the heat sink, the main air duct located in the middle of the heat sink and at the other end of the shell is fixed to the inner wall of the top opening of the shell, and the main air duct located at one end of the shell is arranged adjacent to the cold water connecting pipe, and the bottom position of the main air duct facing the heat sink is connected to a plurality of inclined purge heads, and dust on the surface of the heat sink is cleaned by the purge heads.

[0011] As a preferred technical solution in the present invention, multiple main air ducts are connected with a connecting pipe, and gas transmission to all the main air ducts is achieved through the connecting pipe. One end of the main air duct at one end of the outer shell is connected with an air intake pipe, and the air intake pipe is connected to the internal air duct of the outer shell. The gas generated by the fan is transmitted to the air intake pipe to clean the heat sink.

[0012] As a preferred technical solution in the present invention, an ash discharge groove is provided at the other end surface of the shell, and the ash discharge groove is located at the bottom position of the purge head, so that the dust blown off the heat sink by the purge head can be discharged from the ash discharge groove.

[0013] As a preferred technical solution in the present invention, a fan is also installed at the bottom end of the shell, and the fan is fixed to the bottom of the shell by bolts.

[0014] The present invention also discloses a computer automatic heat dissipation system, including an automatic heat dissipation device, the system includes a main control terminal, and a

[0015] The temperature sensing module is used to detect the temperature inside the water cooling pipe and feed back the detected data to the main control terminal;

[0016] The heat dissipation module receives instructions from the main control terminal and adjusts the heat dissipation power according to the instructions;

[0017] The backup module backs up all operation logs of the main control terminal;

[0018] The autonomous operation module is used to automatically adjust the corresponding heat dissipation power according to the computer temperature. A setting module is connected to the autonomous operation module, and the setting module is used to set the data of the autonomous operation module. The setting module is connected to the main control terminal, and the value of the setting module is modified through the main control terminal. The autonomous operation module is also connected to the backup module to obtain the past heat dissipation operation log of the main control terminal.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] The monitoring component designed in the present invention can detect the temperature of the cooling liquid inside the water cooling tube in real time, thereby accurately reflecting the heat dissipation power required for the current operation of the computer. The data collected by the monitoring component is then used to intelligently adjust the power of the heat dissipation system to ensure that the heat dissipation effect perfectly matches the actual needs of the computer. This dynamic adjustment mechanism not only effectively avoids the energy waste caused by excessive heat dissipation, but also significantly reduces overall energy consumption and improves energy utilization efficiency.

[0021] In addition, a purge component has been added, which can automatically start at regular intervals to forcefully purge the dust on the heat sink to prevent dust accumulation and reduce heat dissipation efficiency, ensuring that the cooling system always maintains the best working condition. By continuously clearing obstacles on the heat sink, the purge component effectively extends the service life of the cooling system, while improving the computer's heat dissipation performance and overall stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural schematic diagram of the present invention;

[0023] Figure 2 It is a rear view of the present invention;

[0024] Figure 3 For the present invention Figure 2 A magnified schematic diagram of the middle A area;

[0025] Figure 4 It is a system diagram of the present invention.

[0026] In the figure:

[0027] 100, housing; 101, heat sink; 102, fan; 103, dust discharge chute; 104, cold water connection pipe;

[0028] 200, temperature sensor; 201, collar; 202, connecting harness; 203, detection probe;

[0029] 300, main air duct; 301, air inlet pipe; 302, connecting pipe; 303, purge head. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] See also Figures 1 to 4 The present invention provides a technical solution: a computer automatic heat dissipation device, comprising

[0032] The housing 100 has a heat sink 101 disposed on the inner side of the top;

[0033] Also includes

[0034] Functional mechanism; arranged at the top position of the housing 100, the functional mechanism consists of a monitoring component, a purge component, wherein

[0035] The monitoring component is placed at one end of the housing 100 and connected to the water cooling pipe;

[0036] The purge component is arranged on the heat sink 101, and the purge component and the monitoring component do not contact each other; in use, the dust on the heat sink 101 is purged by the purge component to ensure that the heat dissipation efficiency is not affected.

[0037] In this embodiment, a cold water pipe 104 is installed on the top of one end of the shell 100, and the cold water pipe 104 is connected to the water cooling pipe. The monitoring component includes a temperature sensor 200 installed at one end of the shell 100, and the temperature sensor 200 is located between the two cold water pipes 104. A ring 201 is also connected to the temperature sensor 200, and the ring 201 is sleeved on the water cooling pipe. A detection probe 203 is also provided inside the ring 201. The temperature of the cooling liquid inside the water cooling pipe is detected by the detection probe 203. When the water temperature is low, it indicates that the heat dissipation demand of the computer is not high. At this time, the heat dissipation efficiency, that is, the water cooling operation efficiency, can be reduced. Otherwise, the water cooling operation efficiency can be improved.

[0038] In this embodiment, a connecting harness 202 is further connected between the collar 201 and the temperature sensor 200 , and the temperature sensor 200 is connected to the CPU inside the computer.

[0039] In this embodiment, the purge assembly includes main air ducts 300 equidistantly distributed on the heat sink 101. The main air duct 300 located in the middle of the heat sink 101 and at the other end of the outer shell 100 is fixed to the inner wall of the top opening of the outer shell 100, and the main air duct 300 located at one end of the outer shell 100 is arranged near the cold water pipe 104. The bottom position of the main air duct 300 facing the heat sink 101 is connected to a plurality of inclined purge heads 303, and the dust on the surface of the heat sink 101 is cleaned by the purge heads 303.

[0040] In the present embodiment, a plurality of main air ducts 300 are connected with a connecting pipe 302, and gas transmission to all the main air ducts 300 is achieved through the connecting pipe 302. One end of the main air duct 300 located at one end of the outer shell 100 is connected with an air intake pipe 301, and the air intake pipe 301 is connected to the internal air passage of the outer shell 100. The gas generated by the fan 102 is transmitted to the air intake pipe 301 to clean the heat sink 101.

[0041] In this embodiment, a dust discharge groove 103 is opened at the other end surface of the shell 100. The dust discharge groove 103 is located at the bottom position of the purge head 303, so that the dust blown off the heat sink 101 can be discharged from the dust discharge groove 103 through the purge head 303.

[0042] In this embodiment, a fan 102 is further installed at the bottom end of the housing 100 , and the fan 102 is fixed to the bottom of the housing 100 by bolts.

[0043] The present invention also discloses a computer automatic heat dissipation system, including an automatic heat dissipation device, the system includes a main control terminal, and a

[0044] The temperature sensing module is used to detect the temperature inside the water cooling pipe and feed back the detected data to the main control terminal;

[0045] The heat dissipation module receives instructions from the main control terminal and adjusts the heat dissipation power according to the instructions;

[0046] The backup module backs up all operation logs of the main control terminal;

[0047] The autonomous operation module is used to automatically adjust the corresponding heat dissipation power according to the computer temperature. A setting module is connected to the autonomous operation module, and the setting module is used to set the data of the autonomous operation module. The setting module is connected to the main control terminal, and the value of the setting module is modified through the main control terminal. The autonomous operation module is also connected to the backup module to obtain the past heat dissipation operation log of the main control terminal.

[0048] Although embodiments of the present invention have been shown and described (see the above detailed description for details), it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A computer automatic heat dissipation device, comprising: The housing (100) has a heat sink (101) disposed on the inner side of the top; Features: Also includes Functional mechanism; arranged at the top position of the housing (100), the functional mechanism is composed of a monitoring component and a purge component, wherein The monitoring component is placed at one end of the housing (100) and is connected to a water cooling pipe; The purge component is arranged on the heat sink (101), and the purge component and the monitoring component are not in contact with each other.

2. The computer automatic heat dissipation device according to claim 1, characterized in that: A cold water pipe (104) is installed at the top of one end of the shell (100), and the cold water pipe (104) is connected to a water cooling pipe. The monitoring component comprises a temperature sensor (200) installed at one end of the shell (100), and the temperature sensor (200) is located between the two cold water pipes (104). A collar (201) is also connected to the temperature sensor (200), and the collar (201) is sleeved on the water cooling pipe. A detection probe (203) is also provided inside the collar (201).

3. The automatic heat dissipation device for a computer according to claim 2, characterized in that: A connecting harness (202) is also connected between the collar (201) and the temperature sensor (200), and the temperature sensor (200) is connected to a CPU inside a computer.

4. The automatic heat dissipation device for a computer according to claim 1, characterized in that: The purge assembly comprises main air ducts (300) equidistantly distributed on the heat sink (101); the main air duct (300) located in the middle of the heat sink (101) and at the other end of the housing (100) is fixedly arranged on the inner wall of the top opening of the housing (100); the main air duct (300) located at one end of the housing (100) is arranged adjacent to the cold water pipe (104); and a plurality of inclined purge heads (303) are connected to the bottom of the main air duct (300) in the direction of the heat sink (101).

5. The automatic heat dissipation device for a computer according to claim 4, characterized in that: The plurality of main air ducts (300) are connected to a connecting pipe (302), and one end of the main air duct (300) located at one end of the outer shell (100) is connected to an air inlet pipe (301), and the air inlet pipe (301) is connected to an internal air passage of the outer shell (100).

6. The automatic heat dissipation device for a computer according to claim 4, characterized in that: An ash discharge groove (103) is provided at the other end surface of the housing (100), and the ash discharge groove (103) is located at the bottom of the purge head (303).

7. The automatic heat dissipation device for a computer according to claim 1, characterized in that: A fan (102) is also installed at the bottom end of the housing (100), and the fan (102) is fixed to the bottom of the housing (100) by bolts.

8. A computer automatic heat dissipation system, comprising the automatic heat dissipation device according to any one of claims 1 to 7, characterized in that: The system includes a main control terminal and a The temperature sensing module is used to detect the temperature inside the water cooling pipe and feed back the detected data to the main control terminal; The heat dissipation module receives instructions from the main control terminal and adjusts the heat dissipation power according to the instructions; The backup module backs up all operation logs of the main control terminal; The autonomous operation module is used to automatically adjust the corresponding heat dissipation power according to the computer temperature. A setting module is connected to the autonomous operation module, and the setting module is used to set the data of the autonomous operation module. The setting module is connected to the main control terminal, and the value of the setting module is modified through the main control terminal. The autonomous operation module is also connected to the backup module to obtain the past heat dissipation operation log of the main control terminal.

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