Fan device and computing equipment

Abstract

The embodiment of the invention provides a fan device and computing device.The fan device comprises a shell and a fan module, the shell comprises a bottom shell and a housing arranged on the bottom shell, the housing and the bottom shell define an air duct, the housing is provided with a support, the support defines a clamping groove, and the fan module is contained in the clamping groove; the fan module generates airflow flowing along the air channel in the operation process. The fan module is accommodated in the clamping groove, so that the assembly of the fan module can be simplified, and the assembly difficulty is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation of electronic equipment, and in particular to a fan device and a computing device. Background Art

[0002] Electronic devices generate a lot of heat during operation. An effective heat dissipation structure can ensure that electronic devices operate within a safe temperature range and prevent performance degradation and hardware damage due to overheating.

[0003] In the related art, fans are used to dissipate heat from electronic equipment, but the installation structure of the fans is relatively complex and difficult to operate. Summary of the invention

[0004] Embodiments of the present application provide a fan device and a computing device to solve or alleviate one or more technical problems in the prior art.

[0005] As one aspect of an embodiment of the present application, an embodiment of the present application provides a fan device, including:

[0006] The housing comprises a bottom shell and a cover shell disposed on the bottom shell, wherein the bottom shell and the cover shell define an air outlet duct, the cover shell has a bracket, and the bracket defines a card slot;

[0007] The fan module is accommodated in the card slot, and generates airflow flowing along the air duct during operation of the fan module.

[0008] In one embodiment, the bracket includes at least two partitions, the at least two partitions are spaced apart in the first direction, and two adjacent partitions define a slot.

[0009] In one embodiment, the cover shell has a shell plate opposite to the bottom shell, the partition extends from the inner side of the shell plate toward the bottom shell, two adjacent partitions define two first walls of the slot, and the area of ​​the shell plate between the two adjacent partitions defines the second wall of the slot.

[0010] In one embodiment, the edges of two adjacent partitions in a direction toward the bottom shell define a card entrance of the card slot, and the card entrance is used for the fan module to be carded into the card slot.

[0011] In one embodiment, the bracket further includes a baffle, which is disposed on a side portion of the card slot in the second direction and connected between side portions of two adjacent partitions in the second direction;

[0012] The baffle plate has a ventilation gap which is away from the shell plate of the cover shell, and the ventilation gap is used for allowing air flow to pass through.

[0013] In one embodiment, baffles are respectively disposed on two opposite sides of the card slot in the second direction.

[0014] In one embodiment, the number of fan modules is at least two, the number of partitions is at least three, the at least three partitions define at least two slots, and the at least two fan modules correspond one-to-one to the at least two slots.

[0015] In one embodiment, the fan device also includes a flexible protective member, which is arranged on the outer peripheral wall of the fan module where no air flows through, and the portion of the flexible protective member located between the fan module and the slot abuts against the inner wall of the slot so that the fan module is snapped into the slot.

[0016] In one embodiment, the shell plate of the cover shell has a guide member extending toward the bottom shell, and the bottom shell has a guide matching member matched with the guide member.

[0017] In one embodiment, the guide member is disposed on a first side of a partition of the bracket in the second direction, and the guide member is connected to the corresponding partition and the baffle of the bracket through a connecting plate.

[0018] In one embodiment, the end of the fan module away from the shell plate of the casing is defined with a wire clamping notch on a first side in the second direction, and the connecting line of the fan module is clamped in the wire clamping notch and extends to the side of the fan module away from the shell plate of the casing.

[0019] In one embodiment, the air duct has an air inlet and an air outlet, and the cover shell defines the air inlet and the air outlet.

[0020] In one embodiment, the air inlet and the air outlet are distributed in the second direction, the air outlet is adjacent to a first side of the bracket in the second direction, and the air inlet is adjacent to a second side of the bracket in the second direction.

[0021] In one embodiment, the fan device further includes a guide plate, which is connected to the inner side of the shell plate of the cover shell and extends from the outer side of the bracket in the first direction along the airflow direction.

[0022] In one embodiment, along the airflow direction, the guide plate includes a first guide section adjacent to the fan module, a second guide section extending outward from the first guide section, and a third guide section extending from the second guide section away from the fan module.

[0023] As one aspect of an embodiment of the present application, an embodiment of the present application provides a computing device, including:

[0024] A fan device as in any of the above;

[0025] The computing module is arranged in the air duct of the fan device.

[0026] In one embodiment, the computing module is located downstream of the fan module of the fan device along the air flow direction.

[0027] In one embodiment, the computing module is disposed on the inner side of the bottom shell of the fan device.

[0028] In one embodiment, the computing device further includes a filter assembly disposed at an air inlet, the filter assembly including a filter frame and a filter element disposed in the filter frame, the filter element being used to filter the airflow passing therethrough.

[0029] In one embodiment, the housing of the fan device has an air inlet plate, and the air inlet plate is formed with an air inlet;

[0030] An accommodating space is defined between the bracket of the fan device and the air inlet plate, and an insertion port communicating with the accommodating space is defined between the cover shell and the bottom shell of the shell of the fan device, and the filter assembly is inserted into the accommodating space through the insertion port.

[0031] In one embodiment, the filter frame has an insertion end and a closed end, the insertion end is inserted into the accommodating space through the insertion opening, and the closed end covers the insertion opening.

[0032] In one embodiment, the closed end is snap-fitted to the bottom shell.

[0033] In one embodiment, the computing device further includes an air outlet guide assembly, the air outlet guide assembly includes an air outlet grille plate, the air outlet grille plate is arranged outside the air outlet, and is used to guide the air outlet, and a magnetic member is arranged in a non-air outlet area of ​​the air outlet grille plate;

[0034] The cover shell has an air outlet plate, which defines an air outlet. A magnetic matching part corresponding to the magnetic part is arranged in the non-air outlet area of ​​the air outlet plate. A magnetic force of mutual attraction is generated between the magnetic part and the magnetic matching part to keep the air outlet grille plate on the air outlet plate.

[0035] In one embodiment, the air outlet guide assembly further includes a decorative strip, which is disposed in a non-air outlet area of ​​the air outlet grille plate and is used to cover the magnetic member.

[0036] In one embodiment, the computing device further includes a control module, and the control module is disposed in the air duct.

[0037] In one embodiment, the control module is located downstream of the fan module along the air flow direction.

[0038] In one embodiment, the control module is disposed on the inner side of a shell plate of a housing of the fan device.

[0039] In one embodiment, the computing device further comprises a data plug connected to the control module, the cover of the fan device comprises a plug mounting portion, the plug mounting portion defines a plug mounting slot, and the data plug is snapped into the plug mounting slot.

[0040] In one embodiment, the plug mounting portion is disposed on an outer side of a bracket of the fan device in the first direction.

[0041] In one embodiment, the air inlet plate of the housing has an insertion hole communicated with the plug installation slot, and the insertion hole is used for inserting the data cable to connect with the data plug.

[0042] In one embodiment, the computing device further includes a light emitting member and a light guide member, which are arranged inside the housing and adjacent to the air outlet. The light emitting member is arranged on the light guide member, and the light guide member is snap-connected to the housing.

[0043] In one embodiment, the cover shell defines an installation space located inside the air outlet plate, the light guide is clamped in the installation space, and the inner side of the air outlet plate has a first limiting portion, and the end surface of the light guide facing the bottom shell abuts against the first limiting portion.

[0044] In one embodiment, the computing device also includes a temperature sensor, the inner side of the air outlet plate also has a second limiting portion, the end surface of the light guide facing the bottom shell has a third limiting portion, the third limiting portion and the second limiting portion define a limiting space, and the temperature sensor is clamped in the limiting space.

[0045] In one embodiment, the computing device also includes a transparent cover plate and a display screen, the shell plate is formed with a display hole, and the shell plate is formed with an inwardly protruding protective portion on the inner periphery of the display hole, the transparent cover plate and the display screen are accommodated in the space defined by the protective portion and the display hole, and the transparent cover plate covers the outer side of the display screen.

[0046] In one embodiment, the computing device further includes a display protection member, wherein the display protection member covers an inner side of the display screen.

[0047] In one embodiment, the computing module includes a circuit board and at least one heat sink, and the heat sink is disposed on at least one surface of the circuit board.

[0048] In one embodiment, the heat sink includes a heat conducting plate and a plurality of heat sinks, at least one surface of the circuit board is covered with the heat conducting plate, and the plurality of heat sinks are arranged at intervals on a side of the heat conducting plate facing away from the circuit board.

[0049] In one embodiment, a heat dissipation channel is formed between adjacent heat dissipation fins, and the heat dissipation channel extends along the air flow direction.

[0050] In one embodiment, the bottom shell of the fan device has a plurality of guide fittings spaced apart in a first direction, and the heat conducting plate and the circuit board are respectively formed with avoidance gaps for avoiding the plurality of guide fittings.

[0051] In one embodiment, a reinforcing plate is provided on one side of the guide fitting adjacent to the avoidance notch in the second direction, and the reinforcing plate abuts against the avoidance notch.

[0052] In one embodiment, a surface of the circuit board facing away from the bottom shell of the fan device has a first functional area and a second functional area distributed in a first direction, the first functional area is provided with a plurality of computing chips, and the second functional area is provided with an electrical connector for connecting to a control module;

[0053] The first functional area is covered with a heat sink, and the second functional area is exposed outside the heat sink.

[0054] In one embodiment, the heat sink covering the first functional area has a first heat dissipation area away from the second functional area and a second heat dissipation area adjacent to the second functional area, and the height dimension of the heat dissipation fins of the second heat dissipation area extending away from the bottom shell is smaller than the height dimension of the heat dissipation fins of the first heat dissipation area extending away from the bottom shell.

[0055] In one embodiment, the control module is located on a side of the second heat dissipation area and the second functional area away from the bottom shell.

[0056] In one embodiment, the control module is provided with a connecting mating portion corresponding to and matingly connected with the electrical connector of the second functional area.

[0057] In one embodiment, one of the electrical connector and the connecting and mating part is a pin, and the other is a socket.

[0058] In one embodiment, there are two heat sinks, one of which covers the first functional area, and the other covers the surface of the circuit board facing the bottom shell.

[0059] In one embodiment, one of the heat conducting plate of the heat sink and the circuit board has a positioning portion, and the other has a positioning matching portion, and the positioning portion is matched and connected with the positioning matching portion.

[0060] In one embodiment, the heat conducting plate adjacent to the bottom shell has fixed areas at both ends in the first direction, and no heat sink is provided in the fixed areas; a positioning column is provided on the side of the fixed area adjacent to the first functional area facing the first functional area, and the circuit board and the heat conducting plate away from the bottom shell have positioning holes corresponding to the positioning columns, and the positioning columns are adapted to be plugged into the positioning holes.

[0061] In one embodiment, the positioning column is formed with a first connection hole penetrating the heat conducting plate in the thickness direction of the heat conducting plate;

[0062] The inner surface of the bottom shell has a plurality of fixing columns, some of which correspond to the positioning columns and have a first fixing channel corresponding to the first connecting hole. The circuit board and the heat conducting plate are fixed to the bottom shell by fasteners that pass through the positioning hole and the first connecting hole in sequence and are fastened to the first fixing channel.

[0063] In one embodiment, a second connection hole penetrating the heat conducting plate in the thickness direction of the heat conducting plate is formed in the fixing area adjacent to the second functional area, and a third connection hole corresponding to the second connection hole is formed in the second functional area;

[0064] Some of the fixing columns have second fixing holes corresponding to the second connecting holes, and the circuit board and the heat conducting plate are fixed to the bottom shell by fasteners which pass through the third connecting hole and the second connecting hole in sequence and are fastened to the second fixing holes.

[0065] In one embodiment, a reinforcing member extending toward the heat sink is disposed on the inner side of the bottom shell, and the reinforcing member is connected to a plurality of fixing columns.

[0066] In one embodiment, the reinforcement member includes a reinforcement connecting plate and a reinforcement side plate connected to the outer side of the reinforcement connecting plate in the first direction, the reinforcement connecting plate includes a connecting section and a reinforcement section, the connecting section is connected between two adjacent fixed columns in the second direction, and the reinforcement section is connected to the outer side of the fixed columns distributed in the second direction.

[0067] In one embodiment, the circuit board of the computing module includes a board body, a chip array arranged on the board body, and a voltage converter. The electrical connector of the circuit board is arranged on the board body for supplying power to the voltage converter. The voltage converter is arranged on the board body for supplying power to the chip array according to a preset voltage range.

[0068] In one embodiment, the chip array includes at least two rows of chipsets, the at least two rows of chipsets are arranged at intervals in the second direction, and each row of chipsets includes a plurality of computing chips arranged at intervals in the first direction.

[0069] In one embodiment, a row of chipsets adjacent to the electrical connector is a first chipset, a row of chipsets away from the electrical connector is a second chipset, and the electrical connector is disposed on a first side of the first chipset in a first direction and on a side of the first chipset facing away from the second chipset.

[0070] In one embodiment, the electrical connector has a power input terminal and a power ground terminal, the power input terminal is connected to the second chipset through a voltage converter, the power ground terminal is connected to the first chipset, and multiple computing chips in the chip array are connected in series.

[0071] In one embodiment, the first chipset is electrically connected between the second side in the first direction and the second side in the first direction of the second chipset, the first side in the first direction of the first chipset is connected to the power ground terminal, and the first side in the first direction of the second chipset is connected to the voltage converter.

[0072] In one embodiment, the electrical connector has a signal connection end, and the signal connection end is connected to the chip array.

[0073] In one embodiment, the signal connection end is connected to a side of the first chipset of the chip array away from the second chipset through a signal line, and is connected to a computing chip in the first chipset that is closest to the signal connection end.

[0074] In one embodiment, the signal line connects the computing chip from one side of the computing chip in the second direction, and connects the adjacent computing chip from the other side of the computing chip in the second direction.

[0075] In one implementation, the computing chip farthest from the signal connection end in the first chipset is signal-connected to the computing chip closest to the computing chip in the second chipset.

[0076] In one embodiment, the number of computing chips in the first chip group of the chip array is an odd number.

[0077] In one embodiment, the voltage converter includes a voltage regulating module, which includes a voltage control chip, an input voltage switching element and an output voltage switching element. The voltage control chip is used to control the on and off of the input voltage switching element and the on and off of the output voltage switching element according to a preset voltage range.

[0078] In one implementation, the input voltage switch element and the output voltage switch element are metal oxide semiconductor field effect transistors respectively.

[0079] In one embodiment, the voltage converter includes a voltage stabilizing module, the voltage stabilizing module includes an input capacitor element, an output capacitor element and an inductor element, the input capacitor element is connected between a power input terminal of the electrical connector and an input terminal of the input voltage switch element;

[0080] The input end of the inductor element is respectively connected to the output end of the input voltage switch element and the input end of the output voltage switch element, and the output end of the inductor element is respectively connected to the input end of the output capacitor element and the power supply input end of the chip array.

[0081] According to the fan device and computing device of the embodiments of the present application, a bracket is designed on the cover and a slot for accommodating the fan module is defined by the bracket, thereby simplifying the assembly of the fan module and reducing the difficulty of assembly.

[0082] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present application will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0083] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments disclosed in the present application and should not be regarded as limiting the scope of the present application.

[0084] Figure 1A A schematic diagram of a three-dimensional structure of a computing device according to an embodiment of the present application is provided as an example;

[0085] Figure 1B A schematic diagram of the structure of a computing device in an embodiment of the present application is provided as an example at one viewing angle;

[0086] Figure 1C A schematic diagram of the structure of a computing device according to an embodiment of the present application from another perspective is exemplarily provided;

[0087] Figure 2 A schematic diagram of the decomposition structure of a computing device according to an embodiment of the present application is provided as an example;

[0088] Figure 3A A schematic diagram of the structure of a computing device in an embodiment of the present application is provided as an example at one viewing angle;

[0089] Figure 3B A schematic diagram of the structure of the computing device of an embodiment of the present application from another perspective is exemplarily provided;

[0090] Figure 3C A schematic diagram of the structure of a cover of a fan device of a computing device according to an embodiment of the present application is exemplarily provided;

[0091] Figure 4 A schematic diagram of the decomposition structure of a computing device according to an embodiment of the present application is provided as an example;

[0092] Figure 5A A schematic diagram of the structure of a filtering component of a computing device according to an embodiment of the present application is provided as an example;

[0093] Figure 5B An exploded structural diagram of a filter assembly and a housing of a computing device according to an embodiment of the present application is provided as an example;

[0094] Figure 5C A schematic diagram of the assembly structure of the filter assembly and the housing of the computing device of the embodiment of the present application is provided as an example;

[0095] Figure 6 A schematic diagram of the exploded structure of an air outlet and guide assembly of a computing device according to an embodiment of the present application is provided as an example;

[0096] Fig. 7A A schematic diagram of the combined structure of a bottom case, a computing module and a heat sink of a computing device according to an embodiment of the present application is provided as an example;

[0097] Figure 7B An exploded structural diagram of a bottom case, a computing module, and a heat sink of a computing device according to an embodiment of the present application is exemplarily provided;

[0098] Fig. 8A A schematic diagram of the main structure of a circuit board of a computing device according to an embodiment of the present application is exemplarily provided;

[0099] Figure 8B A schematic diagram of the three-dimensional structure of a circuit board of a computing device according to an embodiment of the present application is exemplarily provided;

[0100] Figure 8C A schematic diagram of the main structure of a circuit board of a computing device according to an embodiment of the present application is provided as an example.

[0101] Description of reference numerals:

[0102] 100-computing device, 10-control module, 11-connection matching part, 20-computing module, 21-circuit board, 211-electric connector, 212-positioning hole, 213-computing chip, 214-first functional area, 215-second functional area, 216-third connection hole, 217-matching hole, 22-heat dissipation element, 221-heat conducting plate, 2211-positioning column, 22111-first connection hole, 2212-second fixing hole, 2213-second connection hole, 222-heat dissipation fin, 2221-first fixing hole, 2222-heat dissipation channel, 223-first heat dissipation area, 224-second heat dissipation area, 2201-avoidance gap;

[0103] 30-fan module, 31-cable notch, 32-flexible protective member, 40-data plug, 50-display screen, 51-transparent cover, 52-display protective member, 60-wifi plug, 70-light-emitting member, 71-light-guiding member, 711-third limiting portion, 712-bayonet, 80-temperature sensor, 90-connecting line;

[0104] 1000-shell, 1101-air duct, 110-cover, 111-shell plate, 1111-display hole, 1112-protection part, 15-guide plate, 151-first guide section, 152-second guide section, 153-third guide section;

[0105] 112-air inlet plate, 1121-air inlet, 1122-insertion hole, 113-air outlet plate, 1131-air outlet, 1132-matching groove, 1133-first limiting portion, 1134-second limiting portion, 1135-connecting plate, 11351-protrusion, 1136-magnetic matching piece, 114-side plate, 1141-through hole;

[0106] 115-bracket, 1151-card slot, 1152-card entrance, 1153-partition plate, 1154-blocking plate, 1155-ventilation gap, 1156-connecting plate, 116-accommodating space, 117-plug installation portion, 118-guide member, 119-first screw column;

[0107] 120- bottom shell, 121- guide fitting, 1211- reinforcing plate, 122- second screw column, 123- fixing column, 1231- first fixing hole, 1232- second fixing hole, 124- insertion port, 125- reinforcing member, 1251- reinforcing connecting plate, 12511- connecting section, 12512- reinforcing section, 1252- reinforcing side plate;

[0108] 130 - filter assembly, 131 - filter frame, 1311 - airflow opening, 1312 - clamping protrusion, 1313 - insertion end, 1314 - closed end, 132 - filter element;

[0109] 140-air outlet guide assembly, 141-air outlet grille plate, 1411-mounting hole, 1412-guide plate, 142-decorative strip, 143-magnetic member;

[0110] 2111-power input terminal, 2112-power ground terminal, 2113-signal connection terminal, 210-board, 22-chip set, 23-first chipset, 24-second chipset, 25-conductive row, 251-first conductive row, 252-second conductive row, 253-power input terminal, 254-power output terminal, 26-middle conductive member;

[0111] 27-voltage converter, 271-input voltage switch element, 272-output voltage switch element, 273-voltage control main chip, 274-voltage control auxiliary chip, 275-diode, 276-resistance element, 277-input capacitance element, 278-inductance element, 279-output capacitance element;

[0112] L1-first direction, L2-second direction, L3-power supply line, L4-signal line. DETAILED DESCRIPTION

[0113] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present application. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0114] The following combination Figures 1A to 8C The fan device and the computing device 100 according to the embodiment of the present application are described in detail.

[0115] Figure 1A A schematic diagram of the three-dimensional structure of a computing device 100 according to an embodiment of the present application is provided as an example. Figure 1B The following is a schematic diagram of the structure of the computing device 100 according to an embodiment of the present application at a viewing angle. Figure 1C The following is a schematic diagram of the structure of the computing device 100 according to an embodiment of the present application from another perspective. Figure 2 The following is a schematic diagram of the decomposition structure of the computing device 100 according to an embodiment of the present application. Figure 3A The following is a schematic diagram of the structure of the computing device 100 according to an embodiment of the present application at a viewing angle. Figure 3B The following is a schematic diagram of the structure of the computing device 100 according to an embodiment of the present application from another perspective. Figure 3C The structural schematic diagram of the housing 110 of the fan device of the computing device 100 according to the embodiment of the present application is exemplarily provided. Figure 4 A schematic diagram of the decomposition structure of the computing device 100 according to an embodiment of the present application is provided as an example.

[0116] like Figure 1A , Figure 2 and Figure 3A As shown, the computing device 100 of the embodiment of the present application may include a fan device and a computing module 20 arranged in an air duct 1101 of the fan device. During operation, the fan device can generate an airflow flowing along the air duct 1101 to improve the heat dissipation efficiency of the computing module 20.

[0117] like Figure 1A , Figure 3A and Figure 4 As shown, the fan device of this embodiment includes a housing 1000 and a fan module 30. The housing 1000 includes a bottom housing 120 and a cover housing 110 disposed on the bottom housing 120. The bottom housing 120 and the cover housing 110 define an air duct 1101. The cover housing 110 has a bracket 115. The bracket 115 defines a slot 1151. The fan module 30 is accommodated in the slot 1151. The fan module 30 generates an airflow flowing along the air duct 1101 during operation. In this embodiment, by designing the bracket 115 on the cover housing 110 and using the bracket 115 to define the slot 1151 for accommodating the fan module 30, the assembly of the fan module 30 can be simplified and the assembly difficulty can be reduced.

[0118] It should be noted that there are multiple ways to realize the combination of the bracket 115 and the cover 110 .

[0119] In some examples, the bracket 115 can be integrally formed with the housing 110 to improve structural strength and assembly efficiency. In other examples, the bracket 115 can be designed separately from the housing 110, for example, fixed to the housing 110 by welding or fasteners. Of course, the examples of the combination of the bracket 115 and the housing 110 are not limited to this.

[0120] For example, see Figure 3C The bracket 115 includes at least two partitions 1153, and the at least two partitions 1153 are spaced apart in the first direction L1. Two adjacent partitions 1153 define a slot 1151, so that the fan module 30 is limited in the first direction L1 by the two partitions 1153, so as to facilitate the assembly of the fan module 30. Of course, the structure of the bracket 115 is not limited to this example, and can also be other structural examples that can accommodate the fan module 30.

[0121] For some examples, see Figure 3C The cover 110 has a shell plate 111 opposite to the bottom shell 120, a partition 1153 extends from the inner side of the shell plate 111 toward the bottom shell 120, two adjacent partitions 1153 define two first walls of the slot 1151, and the area of ​​the shell plate 111 between the two adjacent partitions 1153 defines the second wall of the slot 1151. That is, the shell plate 111 of the bottom shell 120 and the partition 1153 of the bracket 115 cooperate to define the slot 1151, so as to reduce the number of components of the bracket 115, simplify the design of the bracket 115, and increase the compactness between the cover 110 and the bottom shell 120.

[0122] In other examples, the bracket 115 may further include a wall panel, which is disposed on the shell plate 111 of the bottom shell 120 , and the wall panel constitutes a second wall of the slot 1151 , that is, the wall panel and two adjacent partitions 1153 define the slot 1151 .

[0123] It should be noted that the above is only an example and does not constitute a limitation to the present application. Those skilled in the art can understand that the structure of the bracket 115 defining the slot 1151 may also include a slide rail structure, a spring clamping structure, etc., and is not limited thereto.

[0124] For some examples, see Figure 3C The edges of two adjacent partitions 1153 toward the bottom shell 120 define a card entrance 1152 of the card slot 1151, and the card entrance 1152 is used for the fan module 30 to be carded into the card slot 1151, that is, the edges between the two adjacent partitions 1153 toward the bottom shell 120 are open without obstruction, and the fan module 30 can be quickly carded into the card slot 1151 through the open opening, i.e., the card entrance 1152, which is simple to assemble and easy to operate.

[0125] In other examples, a cover plate may be connected between the edges of two adjacent partitions 1153 in the direction toward the bottom shell 120, and a card entrance 1152 may be provided on the cover plate. The fan module 30 may be inserted into the card slot 1151 through the card entrance 1152, and the cover plate may provide local limiting for the fan module 30 inserted into the card slot 1151.

[0126] It should be noted that the above is only for illustration and does not constitute a limitation to the present application. Those skilled in the art can understand that the card entrance 1152 can also have other limiting forms, for example, a closing plate is connected between two adjacent partitions 1153 on one side facing the bottom shell 120, and the closing plate can be connected to the partition 1153 by a hinge or a buckle, etc. The closing plate is opened to expose the card entrance 1152 so that the fan module 30 can be inserted into the card slot 1151, and the closing plate is closed to close the card entrance 1152 to limit the wind direction module 30. This is also only an example, and the limiting form of the card entrance 1152 is not limited to this.

[0127] For example, see Figure 3C The bracket 115 further includes a baffle 1154, which is disposed on the side of the slot 1151 in the second direction L2 and connected between the sides of two adjacent partitions 1153 in the second direction L2. The baffle 1154 has a ventilation gap 1155 away from the shell plate 111 of the housing 110, and the ventilation gap 1155 is used for airflow to pass through. The baffle 1154 provides a limit for the fan module 30 without blocking the airflow, thereby ensuring smooth flow of the airflow.

[0128] In some examples, the edge of the baffle 1154 may define a ventilation gap 1155, and the shape of the ventilation gap 1155 may be an arc convex toward the shell plate 111, so as to form an area for airflow to pass in the direction of the baffle 1154 away from the shell plate 111, thereby increasing the airflow passing area. In addition, the shape of the ventilation gap 1155 may also be a regular shape such as a rectangle, square, circle, oval, or other irregular shapes, but is not limited thereto.

[0129] In other examples, the ventilation gap 1155 may be an opening formed in a non-edge area of ​​the baffle 1154 , and the shape of the ventilation gap 1155 may be, for example, a rectangle, a square, a circle, an ellipse or other irregular shapes, but is not limited thereto.

[0130] Exemplarily, baffles 1154 may be respectively provided on two opposite sides of the slot 1151 in the second direction L2 to limit the fan module 30 on the two opposite sides in the second direction L2 and improve the assembly stability of the fan module 30 .

[0131] For example, see Figure 4 The outer peripheral wall of the fan module 30 through which no air flows may be provided with a flexible protective member 32. When the fan module 30 is inserted into the slot 1151, the portion of the flexible protective member 32 between the fan module 30 and the slot 1151 abuts against the inner wall of the slot 1151, so that the fan module 30 is clamped in the slot 1151.

[0132] It is understandable that the periphery of the airflow passing area of ​​the fan module 30 cannot be blocked by objects to ensure smooth flow of airflow. In this example, the flexible protective member 32 provided on the peripheral wall of the fan module 30 where the airflow does not pass can fill the gap between the fan module 30 and the card slot 1151, so that the fan module 30 and the card slot 1151 are clamped tightly, and the stability of the fan module 30 can be ensured without screw fixation, thereby simplifying the assembly of the fan module 30 and reducing the difficulty of assembly. In addition, the flexible protective member 32 protects and dampens the fan module 30, reducing the noise during the operation of the fan module 30.

[0133] In some examples, the flexible protective member 32 may be an EVA anti-collision pad, and the flexible protective member 32 is bonded to the peripheral wall of the fan module 30 through which the airflow does not pass, simplifying the connection between the flexible protective member 32 and the fan module 30. In other examples, the flexible protective member 32 may also be foam rubber, polyurethane foam, etc. It should be noted that this is only an example and does not constitute a limitation of the present application. Those skilled in the art will appreciate that the flexible protective member 32 may also be silicone, polypropylene foam, memory foam, etc., and is not limited thereto.

[0134] For some examples, see Figure 3B and Figure 4 The end of the fan module 30 away from the shell plate 111 of the housing 110 is defined with a line-locking notch 31 on the first side in the second direction L2, and the connection line 90 of the fan module 30 is locked in the line-locking notch 31 and extends to the side of the shell plate 111 of the fan module 30 away from the housing 110. By designing the line-locking notch 31 at the end of the fan module 30, the connection line 90 can be arranged to avoid cluttering the line. In addition, by designing the arrangement position of the line-locking notch 31 and the connection line 90 on the side of the fan module 30 away from the shell plate 111, the free space between the fan module 30 and the bottom shell 120 can be used to avoid obstructing the airflow direction and also avoid affecting the arrangement of other components inside the fan device.

[0135] In some examples, the connection line 90 may extend along the first direction L1 on a side of the casing plate 111 of the housing 110 facing away from the fan module 30 .

[0136] In some other examples, the connection line 90 may extend from one side of the line-locking notch 31 in the second direction L2 of the fan module 30 .

[0137] It should be noted that this is only an example and does not constitute a limitation to the present application. Those skilled in the art will appreciate that the connection line 90 may also have other arrangement positions, such as on the side of the fan module 30 facing the shell plate 111, extending in the first direction L1 or in the second direction L2, and is not limited thereto.

[0138] Exemplarily, in order to increase the airflow in the air duct 1101, the number of the fan modules 30 may be at least two. In addition, exemplary, in order to enhance the compactness of the fan module 30 and the bracket 115 and reduce the space occupied, the number of the partitions 1153 may be at least three, at least three partitions 1153 define at least two slots 1151, and at least two fan modules 30 correspond to the at least two slots 1151 one by one.

[0139] For example, Figures 2 to 4 As shown, there are three fan modules 30, the bracket 115 includes four partitions 1153, the four partitions 1153 define three slots 1151, there are three flexible protective members 32, and a flexible protective member 32 is wrapped around the peripheral wall of each fan module 30 where the airflow does not pass. It should be noted that this is only an example and does not constitute a limitation to the present application. The number of fan modules 30 can also be two, four, or five, etc., and is not limited thereto.

[0140] For some examples, see Figure 1A , Figure 3C and Figure 4 The shell plate 111 of the cover shell 110 has a guide piece 118 extending squarely toward the bottom shell 120, and the bottom shell 120 has a guide fitting piece 121 connected with the guide piece 118, that is, the guide piece 118 and the corresponding guide fitting piece 121 provide positioning and guiding functions for the assembly of the bottom shell 120 and the cover shell 110. The guide fitting piece 121 on the bottom shell 120 and the guide piece 118 of the cover shell 110 are plugged into each other to guide the installation of the bottom shell 120 and the cover shell 110, thereby simplifying the assembly process of the cover shell 110 and the bottom shell 120, preventing wrong installation and misoperation, improving the reliability of assembly, and ensuring assembly accuracy. On the other hand, it can enhance the structural strength of the connection between the cover shell 110 and the bottom shell 120, improve the firmness and stability of the connection, and enhance the durability and impact resistance of the shell 1000.

[0141] For example, Figure 3C As shown, the guide member 118 can be arranged on the first side of the partition 1153 of the bracket 115 in the second direction L2, and the guide member 118 is connected to the corresponding partition 1153 and the baffle 1154 of the bracket 115 through the connecting plate 1156, that is, the partition 1153 and the baffle 1154 of the bracket 115 are connected to the guide member 118 through the connecting plate 1156, so as to simultaneously enhance the stability of the guide member 118 and the bracket 115 and improve the compactness of the overall structure.

[0142] In some examples, the guide member 118 may also be disposed relatively independently from two adjacent baffles 1154 in the first direction L1.

[0143] In other examples, the guide member 118 may be connected between two adjacent baffles 1154 in the first direction L1 via a connecting plate 1156 .

[0144] It should be noted that the connection between the partition 1153, the connecting plate 1156 and the two adjacent baffles 1154 connected thereto can form a cross shape to enhance the overall strength thereof. In addition, the connection between the connecting plate 1156 and the two adjacent baffles 1154 connected thereto can also form an X shape, a tic-tac-toe shape, etc., but is not limited thereto.

[0145] For example, the number of the guide members 118 may be one or more, and the plurality of guide members 118 are distributed at intervals in the first direction L1. Figure 3C There are two guide members 118, and the guide members 118 are connected to the corresponding two adjacent partitions 1153 and the corresponding two adjacent baffles 1154 through the corresponding connecting plates 1156. This is only an example and does not constitute a limitation to the present application. The number of guide members 118 can also be three, four, etc., and is not limited thereto.

[0146] In some examples, Figure 4 The guide member 118 shown can be integrally formed with the shell plate 111 of the housing 110, and the guide fitting 121 (by Fig. 7A ) can be integrally formed with the bottom case 120 to improve structural strength and assembly efficiency.

[0147] In other examples, Figure 4 The guide member 118 shown can be connected to the shell plate 111 separately, and the guide matching member 121 (by Fig. 7A ) can be separately connected to the bottom shell 120, for example, by welding or fasteners, etc., but is not limited thereto.

[0148] For some examples, see Figure 4 and Fig. 7A One of the guide member 118 and the guide matching member 121 can be a guide column, and the other can be a guide sleeve. The guide column and the guide sleeve are plugged into each other to provide positioning and guidance for the assembly of the cover shell 110 and the bottom shell 120.

[0149] In some other examples, one of the guide member 118 and the guide matching member 121 is a protrusion, and the other is a groove, and the protrusion and the groove are plug-fitted.

[0150] It should be noted that the above is only an example and does not constitute a limitation of the present application. Those skilled in the art will understand that the assembly and positioning of the cover shell 110 and the bottom shell 120 can also be achieved by the cooperation of buckles and locks, the cooperation of pins and sockets, or magnetic guidance, etc., but are not limited thereto.

[0151] In some examples, the cover 110 and the bottom shell 120 can be connected by fasteners. For example, the interior of the cover 110 has a first screw column 119 (see Figure 3B ), the inner side of the bottom shell 120 has a second screw column 122 opposite to the first screw column 119 (see Fig. 7A ), the cover shell 110 and the bottom shell 120 are assembled by screws passing through the first screw column 119 and the second screw column 122.

[0152] The number of the first screw column 119 and the second screw column 122 can be multiple, for example, the four corner regions inside the cover 110 each have a first screw column 119, and the four corner regions inside the bottom shell 120 each have a second screw column 122, so as to increase the stability of the assembly of the cover 110 and the bottom shell 120. The first screw column 119 can be integrally formed with the cover 110 or connected in a separate body, and the second screw column 122 can be integrally formed with the bottom shell 120 or connected in a separate body.

[0153] In some other examples, the cover shell 110 and the bottom shell 120 may be connected by snaps (not shown in the drawings).

[0154] It should be noted that the above is only an example and does not constitute a limitation of the present application. Those skilled in the art will understand that the cover 110 and the bottom shell 120 can also be connected by rivets, latches and lock structures, hinges or magnetism, etc., but are not limited thereto.

[0155] For some examples, see Figure 3A and Figure 4 , the cover 110 defines an air inlet 1121 and an air outlet 1131 of the air outlet 1101. In other examples, one of the cover 110 and the bottom case 120 defines an air inlet 1121, and the other defines an air outlet 1131, which is only an example and does not constitute a limitation of the present application. The air inlet 1121 and the air outlet 1131 can also be set in other positions, such as on the bottom case 120, but is not limited thereto.

[0156] For some examples, see Figure 4 , the air inlet 1121 and the air outlet 1131 are distributed in the second direction L2, the air outlet 1131 is adjacent to the first side of the bracket 115 in the second direction L2, and the air inlet 1121 is adjacent to the second side of the bracket 115 in the second direction L2. That is, the airflow flows from the second side of the bracket 115 in the second direction L2 to the first side opposite to the second side, forming an axial flow airflow. Accordingly, with reference to the axial relationship between the airflow direction and the fan module 30, the fan module 30 can be an axial flow fan.

[0157] In other examples, the air inlet 1121 and the air outlet 1131 may be distributed in different directions, and accordingly, the fan module 30 may be a centrifugal fan, a diagonal flow fan, a cross flow fan, etc., but is not limited thereto.

[0158] For example, Figure 3B and Figure 3C As shown, the inner side of the shell plate 111 of the housing 110 may be connected to a guide plate 15, which extends from the outer side of the bracket 115 in the first direction L1 along the airflow direction to guide the airflow in the air duct 1101. The outer side of the bracket 115 in the first direction L1 can be understood as a side of the bracket 115 away from the center of the bracket 115 in the first direction L1.

[0159] For some examples, see Figure 3B Along the airflow direction, the guide plate 15 includes a first guide section 151 adjacent to the fan module 30, a second guide section 152 extending outward from the first guide section 151, and a third guide section 153 extending from the second guide section 152 in a direction away from the fan module 30, that is, along the airflow direction, the guide plate 15 first expands outward to diffuse the airflow, reduce the speed and pressure of the airflow, make the airflow fully contact with the computing module 20, and improve the heat dissipation effect of the computing module 20. When the guide plate 15 changes from expanding outward to contracting inward, the airflow can be re-accelerated to make the airflow flow out quickly. The above design of the guide plate 15 can help the airflow to gradually transition, reduce the formation of turbulence and eddies, and thus make the airflow smooth and uniform.

[0160] In other examples, along the airflow direction, the guide plate 15 may first gradually expand and then gradually contract. It should be noted that the above is only an example and does not constitute a limitation of the present application. Those skilled in the art will appreciate that the shape of the guide plate 15 may also have other forms, such as a curved shape, an airfoil, etc., and is not limited thereto.

[0161] As will be appreciated by those skilled in the art, the above examples of fan devices may be arbitrarily combined to achieve specific design requirements and functions without departing from the spirit or scope of the present application.

[0162] In the computing device 100 of this embodiment, in some examples, along the air flow direction, the computing module 20 can be located downstream of the fan module 30, that is, external cold air enters the air duct 1101 from the air inlet 1121, first passes through the fan module 30, then passes through the computing module 20, absorbs the heat of the computing module 20, and then flows out from the air outlet 1131.

[0163] For other examples, see Figure 3A , Figure 4 and Fig. 7AThe computing module 20 may be located upstream of the fan module 30 , that is, external cold air enters the air duct 1101 from the air inlet 1121 , first passes through the computing module 20 , and then passes through the fan module 30 and flows out to the air outlet 1131 .

[0164] The air outlet 1131 can be connected to an external heat recovery system or directed toward a heat-using area. In this way, the computing device 100 can be used as a heater while realizing computing functions, thereby recycling the hot air output from the air outlet 1131 and saving energy.

[0165] For some examples, see Fig. 7A , the computing module 20 can be arranged on the inner side of the bottom shell 120, so that the fan module 30 and the computing module 20 are reasonably allocated to reduce their interference in the assembly process of the cover shell 110 and the bottom shell 120, reduce the difficulty of assembly, and improve the overall compactness of the computing device 100. In other examples, the computing module 20 can be arranged inside the cover shell 110. It should be noted that this is only an example and does not constitute a limitation of the present application. The computing module 20 can also be arranged on the outside of the cover shell 110, but is not limited to this.

[0166] For example, see Figure 3A and Figure 3B The air duct 1101 may be provided with a control module 10 to dissipate heat for the control module 10 .

[0167] In some examples, along the air flow direction, the control module 10 is located downstream of the fan module 30 , that is, external cold air enters the air duct 1101 from the air inlet 1121 , first passes through the fan module 30 , then passes through the control module 10 , and then flows out from the air outlet 1131 .

[0168] In other examples, the control module 10 may be located upstream of the fan module 30 , that is, external cold air enters the air duct 1101 from the air inlet 1121 , passes through the control module 10 , and then passes through the fan module 30 and flows out to the air outlet 1131 .

[0169] In the example where the computing module 20 and the control module 10 are arranged in the air duct 1101, the positional relationship between the control module 10 and the computing module 20 relative to the airflow direction can be flexibly set. For example, the control module 10 is located downstream or upstream of the computing module 20. For another example, the airflow flows through the control module 10 and the computing module 20 at the same time, etc., but it is not limited to this.

[0170] For example, see Figure 3A and Figure 3B The control module 10 can be arranged on the inner side of the shell plate 111 of the cover shell 110 to fully utilize the space inside the cover shell 110 and facilitate the electrical connection between the control module 10 and the computing module 20.

[0171] It can be understood that the control module 10 is electrically connected to the computing module 20 and the fan module 30 respectively, so as to realize signal transmission and power transmission between the control module 10 and the computing module 20 and the fan module 30 .

[0172] In some examples, the control module 10 and the fan module 30 and / or the computing module 20 can be connected by wires. In other examples, the control module 10 and the fan module 30 and / or the computing module 20 can be electrically connected by the cooperation of a socket and a plug. This is only an example and does not constitute a limitation of the present application. It can be understood by those skilled in the art that the connection method between the control module 10 and the fan module 30 can also be a pin connection, a wireless connection, a terminal connection, etc., and is not limited to this.

[0173] For example, see Figure 4 The housing 110 has an air inlet plate 112 and an air outlet plate 113. The air inlet plate 112 is formed with an air inlet 1121, and the air outlet plate 113 is formed with an air outlet 1131. There are many designs for the air inlet 1121 and the air outlet 1131. For example, the air inlet plate 112 and the air outlet plate 113 are respectively formed with a plurality of small circular holes distributed in an array, and the plurality of small circular holes of the air inlet plate 112 constitute the air inlet 1121 to evenly disperse the incoming air, increase the flow area of ​​the incoming air inside the housing 1000, and improve the heat dissipation effect. The plurality of small circular holes of the air outlet plate 113 constitute the air outlet 1131 to evenly disperse the outgoing air and increase the diffusion area of ​​the outgoing air. For another example, the air inlet plate 112 and the air outlet plate 113 are respectively formed with a plurality of long strip openings, and the plurality of long strip openings on the air inlet plate 112 and the air outlet plate 113 respectively constitute the air inlet 1121 and the air outlet 1131. The foregoing is merely an example and does not constitute a limitation of the present application. Those skilled in the art will understand that the design of the air inlet 1121 and the air outlet 1131 can also be a square hole, a polygonal hole, an irregular hole or a multi-type mixed hole, etc., and is not limited thereto.

[0174] It is understandable that the relative positions of the air inlet 1121 and the air outlet 1131 are related to the structural type of the fan module 30 .

[0175] In some examples, such as Figure 3A , Figure 3B and Figure 4 As shown, the fan module 30 is an axial flow structure, that is, the air flow direction in the air duct 1101 is parallel to the axis of the fan module 30. Accordingly, the air inlet 1121 and the air outlet 1131 can be relatively distributed in the air flow direction, that is, the air inlet plate 112 and the air outlet plate 113 can be relatively distributed in the air flow direction.

[0176] In other examples, the fan module 30 can be a centrifugal structure, and the air flow direction is perpendicular to the axis of the fan module 30. Accordingly, the air inlet 1121 and the air outlet 1131 can be distributed vertically, that is, the extension direction of the air inlet plate 112 is perpendicular to the extension direction of the air outlet plate 113.

[0177] It should be noted that the above is only an example and does not constitute a limitation of the present application. Those skilled in the art can understand that according to the structural type of the fan module 30, the positions of the air inlet plate 112, the air outlet plate 113 and the air inlet 1121 and the air outlet 1131 can be changed accordingly and are not limited to the above examples.

[0178] Figure 5A The following is a schematic diagram of the structure of the filtering component 130 of the computing device 100 according to an embodiment of the present application. Figure 5B The following is a schematic diagram of the exploded structure of the filter assembly 130 and the housing 110 of the computing device 100 according to an embodiment of the present application. Figure 5C A schematic diagram of the assembly structure of the filter assembly 130 and the housing 110 of the computing device 100 according to an embodiment of the present application is provided as an example.

[0179] See also Figures 5A to 5C As shown, a filter assembly 130 can be set at the air inlet 1121. The filter assembly 130 includes a filter frame 131 and a filter element 132 arranged on the filter frame 131. The filter element 132 is used to filter the airflow passing through it. This can prevent external impurities such as dust and particles from entering the fan module 30 and affecting the normal operation of the fan module 30, thereby improving the operating reliability and service life of the fan module 30; on the other hand, it can prevent impurities from affecting the normal operation of the control module 10 and the computing module 20 in the air duct 1101. In addition, the cleanliness of the airflow output from the air outlet 1131 can be improved.

[0180] In some examples, the filter element 132 may be filter cotton, the interior of which can hold dust and improve the filtering effect. The filter cotton may be made of cotton fiber, polyurethane foam, polyester fiber, polypropylene fiber, etc., but is not limited thereto. In other examples, the filter element 132 may be a filter screen, filter paper, or membrane filter, etc., which are merely examples and do not constitute a limitation to the present application.

[0181] In some examples, such as Figure 5B As shown, the filter element 132 can be connected to the filter frame 131 by adhesive bonding, and is easy to disassemble, so as to facilitate the replacement of the filter element 132. In other examples, the filter element 132 can be snap-connected to the filter frame 131. This is only an example and does not constitute a limitation of the present application. It can be understood by those skilled in the art that the filter element 132 can also be connected by plugging, pressing, etc., and is not limited thereto.

[0182] For example, see Figure 5A The filter frame 131 should have an airflow opening 1311, and there may be multiple airflow openings 1311. The filter element 132 may cover the inside or outside of the airflow opening 1311. The airflow opening 1311 may be covered with a filter screen, and the filter screen may be located on the inside of the filter element 132 to perform secondary filtration on the airflow filtered by the filter element 132 to improve the filtering effect.

[0183] The number and arrangement direction of the airflow openings 1311 may be consistent with the number and arrangement direction of the fan modules 30. For example, in an example in which a plurality of fan modules 30 are arranged in the first direction L1, see Figure 4 , FIG. 5A to FIG. 5C The multiple air flow openings 1311 of the filter frame 131 are arranged in sequence in the first direction L1.

[0184] In some examples, the filter assembly 130 can be inserted into the housing 1000. Figure 4 and Figure 5B , a receiving space 116 is defined between the bracket 115 of the computing device 100 and the air inlet plate 112, the housing 110 and the bottom housing 120 define an insertion port 124 communicating with the receiving space 116, and the filter assembly 130 is inserted into the receiving space 116 through the insertion port 124. In this example, the receiving space 116 for receiving the filter assembly 130 is defined by the bracket 115 for receiving the fan module 30 and the air inlet plate 112 of the housing 110, so that the plug-in installation and removal of the filter assembly 130 is realized, the convenience of replacing the filter element 132 is improved, the compactness of the structure is increased, and the utilization rate of the internal space of the housing 1000 is improved.

[0185] For example, see Figure 5B The filter frame 131 has an insertion end 1313 and a closed end 1314. The insertion end 1313 is inserted into the accommodating space 116 through the insertion port 124, and the closed end 1314 covers the insertion port 124, that is, the closed end 1314 cooperates with the bottom shell 120 and the cover shell 110 to close the insertion port 124 to maintain the sealing at the insertion port 124 and avoid air leakage.

[0186] For example, see Figure 5B The insertion port 124 is defined by the notch formed on the bottom shell 120 and the cover shell 110, that is, a notch is formed on the bottom shell 120. After the bottom shell 120 and the cover shell 110 are assembled, the notch of the bottom shell 120 and the cover shell 110 form the insertion port 124. After the filter assembly 130 is inserted into the accommodating space 116 through the insertion port 124, the closed end 1314 of the filter frame 131 closes the insertion port 124.

[0187] To increase the stability of the connection between the filter assembly 130 and the housing 1000, the filter frame 131 of the filter assembly 130 can be snap-fitted to the housing 1000. Figure 5B The closed end 1314 of the filter frame 131 is engaged with the bottom shell 120. For example, the two sides of the closed end 1314 of the filter frame 131 in the extending direction are respectively provided with a clamping protrusion 1312 (see Figure 5A ), the bottom shell 120 has a limiting protrusion that cooperates with the locking protrusion 1312, and the locking protrusion 1312 abuts against the limiting protrusion to limit the filter assembly 130 and improve the stability of the filter assembly 130.

[0188] In other examples, the filter assembly 130 can be installed in the housing 1000 by fastener connection or the like. It should be noted that this is only an example and does not constitute a limitation of the present application. Those skilled in the art can understand that the filter assembly 130 and the housing 1000 can also be connected by magnetic attraction, snap connection, etc., and are not limited thereto.

[0189] Figure 6 The schematic diagram of the exploded structure of the air outlet and guide assembly 140 of the computing device 100 of the embodiment of the present application is provided as an example

[0190] like Figure 6 , combined with Figures 1A to 4 As shown, an air outlet guide assembly 140 may be provided at the air outlet 1131 , and the air outlet guide assembly 140 includes an air outlet grille plate 141 , and the air outlet grille plate 141 is provided on the outside of the air outlet 1131 to guide the outlet air flow so that the outlet air is evenly diffused to the outside.

[0191] In some examples, the air outlet grille plate 141 can be magnetically connected to the housing 110. Figure 6 The non-air outlet area of ​​the air outlet grille plate 141 is provided with a magnetic member 143, and the non-air outlet area of ​​the air outlet plate 113 of the housing 110 is provided with a magnetic matching member 1136 corresponding to the magnetic member 143 (see Figure 3B ), the magnetic member 143 and the magnetic matching member 1136 generate a magnetic force of mutual attraction to keep the air outlet grille plate 141 on the air outlet plate 113 of the housing 110. This simplifies the assembly of the air outlet grille plate 141 and the housing 110, and facilitates the disassembly of the air outlet grille plate 141. The air outlet plate 113 of the housing 110 may be formed with a matching groove 1132 (see Figure 4 ), the air outlet grille plate 141 is accommodated in the matching groove 1132 to prevent the air outlet grille plate 141 from protruding outward and affecting the appearance, while reducing the volume of the shell 1000.

[0192] For example, see Figure 3B and Figure 6The non-air outlet area of ​​the air outlet grille plate 141 may be formed with a mounting hole 1411, and the magnetic component 143 is embedded in the mounting hole 1411. The non-air outlet area of ​​the air outlet plate 113 of the cover 110 and the area corresponding to the mounting hole 1411 may be formed with a mounting opening, and the magnetic matching component 1136 is embedded in the mounting opening.

[0193] It can be understood that the magnetic member 143 and the magnetic matching member 1136 are two components that can generate magnetic attraction. For example, one of the magnetic member 143 and the magnetic matching member 1136 is a magnet and the other is an iron sheet, but it is not limited thereto.

[0194] The number of the magnetic member 143 and the magnetic matching member 1136 can be multiple. Figure 3B and Figure 6 In the example shown, a magnetic part 143 is respectively provided at the four corner areas of the air outlet grille 141, and a magnetic matching part 1136 is respectively provided at the four angle areas of the air outlet plate 113 to enhance the adsorption force between the air outlet grille 141 and the air outlet plate 113 and improve the stability of the air outlet grille 141 on the air outlet plate 113.

[0195] It should be noted that the above is only for illustration and does not constitute a limitation to the present application. Those skilled in the art can understand that the position, quantity and shape of the magnetic member 143 and the magnetic matching member 1136 can also have other forms, for example, the magnetic member 143 and the magnetic matching member 1136 can be in the shape of a long strip to enhance the adsorption force; for example, the magnetic member 143 can be arranged on any one or more sides of the air outlet grille plate 141, and correspondingly, the magnetic matching member 1136 can be arranged on any one or more sides of the air outlet plate 113, and is not limited thereto.

[0196] For example, see Figure 6 The air outlet guide assembly 140 further includes a decorative strip 142 , which is disposed in a non-air outlet area of ​​the air outlet grille plate 141 and is used to cover the magnetic member 143 to maintain the aesthetic appearance of the air outlet guide assembly 140 .

[0197] In other examples, the air outlet grille plate 141 and the housing 110 may also be connected by fasteners. It should be noted that this is only an example and does not constitute a display of the present application. Those skilled in the art can understand that the air outlet grille plate 141 and the housing 110 may also be connected by riveting, latching, snap-fitting or welding, and are not limited thereto.

[0198] For some examples, see Figure 6 The air outlet grille plate 141 may include a frame and a guide plate 1412 disposed in the frame.

[0199] Exemplarily, there may be one guide plate 1412, and the guide plate 1412 may be arranged vertically or horizontally. For example, the guide plate 1412 is arranged vertically, and the guide plate 1412 extends obliquely relative to the direction of the airflow flowing out of the air outlet 1131, so that the airflow is diffused into a larger space. It should be noted that this is only an example and does not constitute a limitation to the present application. When the guide plate 1412 is arranged horizontally, it may extend horizontally or obliquely relative to the direction of the airflow flowing out of the air outlet 1131, and is not limited thereto.

[0200] Exemplarily, there may be a plurality of guide plates 1412 , and the plurality of guide plates 1412 are arranged in sequence to form a grid structure. The guide plates 1412 and the frame may be integrally formed or separately connected.

[0201] In some examples, the guide plates 1412 extend in the same direction, directing the outlet airflow in the same direction to increase the temperature of the local concentrated area.

[0202] In other examples, multiple guide vanes 1412 can be divided into a first guide group and a second guide group, where each guide vane 1412 in the first guide group extends in a direction parallel to one direction, and each guide vane 1412 in the second guide group extends in a direction parallel to another direction, so as to guide the outlet air flow in different directions, making the blown air flow more dispersed and uniform.

[0203] The user can manually flip the air outlet grille plate 141, for example, flip it upside down, flip it left to right, or flip it inside out to change the air outlet direction, achieve different air outlet effects, and meet different air outlet requirements.

[0204] For example, Figure 3B and Figure 4 As shown, a light-emitting component 70 and a light-guiding component 71 adjacent to the air outlet 1131 may also be provided inside the cover shell 110. The light-emitting component 70 is provided on the light-guiding component 71, and the light-guiding component 71 is snap-connected to the cover shell 110 to guide the light emitted by the light-emitting component 70 toward the air outlet 1131, so as to facilitate user observation and enhance the display effect.

[0205] The light emitting element 70 can be connected to the control module 10 and display different colors according to different air outlet temperatures to provide a more intuitive temperature indication for the user.

[0206] In some examples, the light emitting element 70 may be a light strip, and the light guide element 71 may be a light guide bar. In other examples, the light emitting element 70 may be an LED bulb, and the light guide element 71 may be a light guide plate. It should be noted that this is only an example and does not constitute a limitation of the present application. Those skilled in the art will understand that the light emitting element 70 may also be an OLED panel, an electroluminescent (EL) panel, a fluorescent lamp, etc., but is not limited thereto. The light guide element 71 may also be a light guide prism, a light guide film, a reflective sheet, an optical lens, etc., but is not limited thereto.

[0207] In some examples, the light emitting member 70 and the light guiding member 71 may be connected by bonding or binding, or may be fixed by snap fastening, but is not limited thereto.

[0208] For some examples, see Figure 3B The housing 110 defines an installation space located inside the air outlet plate 113, the light guide 71 is clamped in the installation space, the inner side of the air outlet plate 113 has a first limit portion 1133, and the light guide 71 faces the bottom housing 120 (see Fig. 7A ) is in contact with the first limiting portion 1133, that is, when the light guide 71 is clamped in the installation space, the first limiting portion 1133 of the air outlet plate 113 limits the end surface of the light guide 71 toward the bottom shell 120, thereby limiting different positions of the light guide 71 to ensure the stability of the installation of the light guide 71.

[0209] exist Figure 3B In the example shown, connecting plates 1135 are respectively provided between the air outlet plate 113 of the housing 110 and the two first screw columns 119 adjacent to the two ends thereof, and the air outlet plate 113 and the two connecting plates 1135, the two first screw columns 119 and the shell plate of the housing 110 define a mounting groove. The light guide 71 is in the shape of an elongated strip and extends along the length direction of the housing 1000. The two ends of the light guide 71 in the extending direction are respectively engaged with the two connecting plates 1135 to achieve the engagement of the light guide 71 with the housing 110. For example, the two ends of the light guide 71 are respectively provided with bayonet ports 712, and the two connecting plates 1135 are respectively provided with protrusions 11351 corresponding to the two bayonet ports 712, and the bayonet ports 712 cooperate with the corresponding protrusions 11351 to engage the light guide 71 with the connecting plates 1135.

[0210] In other examples, the light guide 71 may be fixed in the installation space of the housing 110 by fasteners, bonding, rivets, etc., but is not limited thereto.

[0211] Exemplarily, the computing device 100 further includes a temperature sensor 80, such as Figure 3B and Figure 4 As shown, a temperature sensor 80 may be provided inside the air outlet 1131 to detect the outlet air temperature. It is understandable that the temperature sensor 80 is connected to the control module 10, and the control module 10 obtains the outlet air temperature information detected by the temperature sensor 80, and controls the light emitting element 70 to change the color and / or light brightness accordingly based on different outlet air temperatures, so as to help the user understand the current outlet air temperature more intuitively.

[0212] In some examples, the temperature sensor 80 may also be disposed at the air inlet 1121 to monitor the air inlet temperature. This is only an example and does not constitute a limitation of the present application. Those skilled in the art will appreciate that the temperature sensor 80 is not limited to the above positions. For example, the temperature sensor 80 may be disposed at a heat source (such as a computing module 20) of the computing device 100, or at any of the above different positions, etc., and is not limited thereto.

[0213] like Figure 3B In the example shown, the inner side of the air outlet plate 113 also has a second limiting portion 1134, and the end surface of the light guide 71 facing the bottom shell 120 has a third limiting portion 711. The third limiting portion 711 and the second limiting portion 1134 define a limiting space, and the temperature sensor 80 is clamped in the limiting space. The temperature sensor 80 can be installed without using fasteners or tools, and is easy to operate and stable to install.

[0214] For example, see Figure 4 The computing device 100 further includes a transparent cover plate 51 and a display screen 50. The shell plate of the cover 110 is formed with a display hole 1111. The shell plate is formed with an inwardly protruding protective portion 1112 on the inner periphery of the display hole 1111. The transparent cover plate 51 and the display screen 50 are accommodated in a space defined by the protective portion 1112 and the display hole 1111. The transparent cover plate 51 covers the outer side of the display screen 50. The protective portion 1112 not only provides protection for the display screen 50 and the transparent cover plate 51, but also provides an installation area for the display screen 50 and the transparent cover plate 51. The transparent cover plate 51 and the display screen 50 are located on the inner side of the display hole 1111, which can prevent the transparent cover plate 51 and the display screen 50 from being hit by foreign objects, thereby ensuring the safety of the transparent cover plate 51 and the display screen 50.

[0215] Continue to see Figure 4 A mounting surface is defined between the protective portion 1112 and the inner periphery of the display hole 1111. In some examples, the transparent cover plate 51 may be bonded to the mounting surface. In other examples, the transparent cover plate 51 may be fixed to the mounting surface by screws or buckles, etc., but is not limited thereto.

[0216] For example, see Figure 1A and Figure 4 The inner side of the display screen 50 may be covered with a display protection member 52 to provide cushioning and protection for the display screen 50 and prevent components inside the cover housing 110 from damaging the display screen 50 .

[0217] In some examples, the display protection member 52 may be an EVA cotton sheet, and the display protection member 52 may be bonded to the inner surface of the display screen 50. In other examples, the display protection member 52 may be a glass protective film, a silicone protective cover, a silicone rubber pad, etc., but is not limited thereto.

[0218] For example, see Figure 4 The control module 10 is covered on the display protection member 52 on the side of the display protection member 52 facing the bottom shell 120, and the control module 10 is electrically connected to the display screen 50 to achieve signal transmission between the control module 10 and the display screen 50. The display screen 50 can display the wind temperature, the computing power, power consumption, IP information, etc. of the computing module 20. A plurality of screw columns can be provided on the inner side of the shell plate of the cover 110 around the protective portion 1112, and the control module 10 is fixed to the shell plate of the cover 110 by screws fastened to the screw columns.

[0219] For example, see Figure 3A and Figure 4 , the data plug 40 of the computing device 100 is connected to the control module 10. For example, the housing 110 has a plug mounting portion 117, and the plug mounting portion 117 defines a plug mounting slot, and the data plug 40 is snapped into the plug mounting slot to achieve a plug-in connection between the data plug 40 and the computing device 100, without the need for fasteners such as screws for fixing, and is convenient for disassembly and assembly.

[0220] For example, see Figure 3A and Figure 4 The plug mounting portion 117 may be disposed outside the bracket 115 in the first direction L1 to utilize the space between the bracket 115 and the housing 110 to improve space utilization.

[0221] For example, see Figure 1B The air inlet plate 112 of the housing 110 has an insertion hole 1122 connected to the plug installation groove. The insertion hole 1122 is used for inserting a data cable to connect with the data plug 40, thereby realizing power connection and data transmission between the control module 10 and the outside.

[0222] Exemplarily, the control module 10 of the computing device 100 can communicate with external devices via a wireless network, such as WiFi, Bluetooth, etc., or communicate with external devices via a wired network, such as Ethernet, power line, etc., but is not limited thereto.

[0223] In a specific example, the control module 10 communicates with the external device via wifi. Figure 1A and Figure 4 The computing device 100 may include a wifi plug 60 connected to the control module 10. The side panel 114 of the cover 110 is formed with a through hole 1141 for inserting the wifi plug 60. The wifi plug 60 is inserted into the interior of the cover 110 through the through hole 1141 to connect with the control module 10, thereby realizing the transmission and wiring of wireless signals between the control module 10 and the external device.

[0224] Figure 1AThe computing device 100 shown is in a state where a wifi plug 60 is installed, that is, the computing device 100 communicates with an external device through the external wifi plug 60. This is only an example and does not constitute a limitation of the present application. Those skilled in the art can understand that the structure for implementing wifi communication between the computing device 100 and the external device can be the external wifi plug in the above example, or can be a wifi module set inside the computing device 100, and is not limited thereto.

[0225] Fig. 7A The following is a schematic diagram of the combined structure of the bottom case 120, the computing module 20 and the heat sink 22 of the computing device 100 according to the embodiment of the present application. Figure 7B A schematic diagram of the exploded structure of the bottom case 120, the computing module 20 and the heat sink 22 of the computing device 100 according to an embodiment of the present application is provided as an example.

[0226] like Fig. 7A and 7B As shown, the computing module 20 includes a circuit board 21 and at least one heat sink 22 , and the heat sink 22 is disposed on at least one surface of the circuit board 21 .

[0227] In some examples, a heat sink 22 is disposed on one surface of the circuit board 21. For example, the heat sink 22 is disposed on a circuit board having a computing chip 213 (see Fig. 8A ) surface. In other examples, heat sinks are provided on both surfaces of the circuit board 21 to improve the heat dissipation effect. It should be noted that the above is only an example and does not constitute a limitation of the present application. Those skilled in the art will understand that the heat sink 22 can also be provided at the end of the circuit board 21, and is not limited thereto.

[0228] For example, see Figure 7B The heat sink 22 includes a heat conducting plate 221 and a plurality of heat sinks 222. At least one surface of the circuit board 21 is covered with the heat conducting plate 221. The plurality of heat sinks 222 are spaced apart on a side of the heat conducting plate 221 away from the circuit board 21 to increase the heat dissipation area and improve the heat dissipation efficiency.

[0229] For example, see Figure 7B A heat dissipation channel 2222 is formed between adjacent heat dissipation fins 222 to allow air flow to pass through, thereby improving heat dissipation efficiency.

[0230] In some examples, the heat dissipation channel 2222 extends along the airflow direction, that is, the heat dissipation channel 2222 is parallel to the airflow direction to ensure that the heat dissipation airflow can evenly cover all the heat sinks 222. For example, the extension direction of the heat sink 222 is parallel to the wind direction, and multiple heat sinks 222 are arranged in sequence in a direction perpendicular to the wind direction to form a heat dissipation channel extending along the airflow direction between adjacent heat sinks 222, thereby improving heat dissipation efficiency.

[0231] In other examples, the heat dissipation channel 2222 may intersect with the air flow direction to increase the complexity of the flow path, thereby improving the heat exchange efficiency.

[0232] It should be noted that the above is only an example and does not constitute a limitation to the present application. Those skilled in the art can understand that the heat dissipation channel 2222 and the airflow direction can also be partially parallel or partially intersecting, and are not limited thereto.

[0233] like Figure 7B As shown, in the example where the bottom shell 120 has a plurality of guide fittings 121 spaced apart in a first direction, the heat conducting plate 221 and the circuit board 21 are respectively formed with avoidance gaps 2201 for avoiding the plurality of guide fittings 121, so as to increase the compactness of each component while avoiding interference between the heat conducting plate 221 and the circuit board 21 and the guide fittings 121.

[0234] In some examples, such as Figure 7B and Fig. 8A As shown, the avoidance gap 2201 is L-shaped, that is, the heat conducting plate 221 and the circuit board 21 form a gap in the area where the guide fitting 121 passes, and remain intact in the area that does not interfere with the guide fitting 121 to ensure the size of the heat conducting plate 221 and the circuit board 21.

[0235] In other examples, the shape of the avoidance gap 2201 can be matched with the shape of the guide fitting 121. For example, the guide fitting 121 is cylindrical and the avoidance gap 2201 is a semicircular gap, so as to minimize the size of the avoidance gap and leave more space for the heat conducting plate 221 and the circuit board 21.

[0236] It should be noted that the above is only an example and does not constitute a limitation of the present application. Those skilled in the art can understand that the avoidance gap 2201 can also be a gap of a regular shape such as a square gap, a U-shaped gap, or a gap of an irregular shape, and is not limited thereto.

[0237] For example, see Figure 7B A reinforcing plate 1211 is provided on one side of the guide fitting 121 adjacent to the avoidance notch 2201 in the second direction L2. The reinforcing plate 1211 abuts against the avoidance notch 2201, which not only enhances the stability of the guide fitting 121 but also makes the arrangement of various components more compact.

[0238] In some examples, the reinforcing plate 1211 can be integrally formed with the guide fitting 121 to improve structural strength and assembly efficiency. In other examples, the reinforcing plate 1211 can be designed separately from the guide fitting 121, for example, the reinforcing plate 1211 is fixed to the guide fitting 121 by welding or fasteners, etc., but is not limited thereto.

[0239] For example, see Figure 7B The surface of the circuit board 21 facing away from the bottom case 120 has a first functional area 214 and a second functional area 215 distributed in the first direction L1. The first functional area 214 is provided with a plurality of computing chips 213, and the second functional area 215 is provided with an electrical connector 211 for connecting with the control module 10. The first functional area 214 is covered with a heat sink 22, and the second functional area 215 is exposed outside the heat sink 22. In this way, the heat sink 22 is used to dissipate the heat of the computing chip 213 on the first functional area 214, thereby ensuring the stable operation of the computing chip 213, and facilitating the connection between the electrical connector 211 on the second functional area 215 and the control module 10, thereby avoiding the interference of the heat sink 22 on the connection between the circuit board 21 and the control module 10.

[0240] Among them, the computing chip 213 can be any one or more combinations of a central processing unit (CPU), a graphics processing unit (GPU), a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), a neural network processor (NPU), etc., but is not limited thereto.

[0241] The circuit board 21 may also be provided with components such as a power management unit, a clock and timer circuit, capacitors, inductors, resistors, etc., but not limited thereto, to form a complete computing unit together with the chip, and these components may be arranged in the second functional area 215 or partially arranged in the first functional area 214 and partially arranged in the second functional area 215. Compared with the heat dissipation of the chip, the heat dissipation of these components is relatively small, and even if they are arranged in the second functional area 215 not covered by the heat sink 22, their heat dissipation requirements can be met by natural convection.

[0242] In the example where there are two heat sinks 22, see Figure 7B One heat sink 22 may cover the first functional area 214, and the other heat sink 22 may cover the surface of the circuit board 21 facing the bottom shell 120, that is, a partial area of ​​the surface of the circuit board 21 facing away from the bottom shell 120, that is, the first functional area 214 is covered with the heat sink 22, and the surface of the circuit board 21 facing the bottom shell 120 may be partially or completely covered with the heat sink 22 to enhance the heat dissipation effect.

[0243] For example, see Figure 7BThe heat sink 22 covering the first functional area 214 has a first heat sink 223 away from the second functional area 215 and a second heat sink 224 adjacent to the second functional area 215, and the height dimension of the heat sink 222 of the second heat sink 224 extending in the direction away from the bottom case 120 is smaller than the height dimension of the heat sink 222 of the first heat sink 223 extending in the direction away from the bottom case 120. That is, the heat sink 222 of the second heat sink 224 is closer to the shell plate 111 of the cover 110 than the heat sink 222 of the first heat sink 223, so as to reserve a space for arranging the control module 10 between the second heat sink 224 and the shell plate 111, avoid interference between the heat sink 222 and the control module 10, and improve the compactness of the computing device 100 to save space.

[0244] Exemplarily, the control module 10 can be located on the side of the second heat dissipation zone 224 and the second functional zone 215 away from the bottom shell 120, that is, part of the control module 10 is located on the side of the second heat dissipation zone 224 away from the bottom shell 120, and the other part extends to the side of the second functional zone 215 away from the bottom shell 120, so as to meet the size requirements of the control module 10 and facilitate the connection between the control module 10 and the circuit board 21.

[0245] For some examples, see Figure 4 and Fig. 7A The control module 10 is provided with a connecting mating portion 11 corresponding to and matingly connected with the electrical connector 211 of the second functional area 215 , and the electrical connector 211 is matingly connected with the connecting mating portion 11 to connect the control module 10 with the circuit board 21 .

[0246] The electrical connector 211 and the connection mating part 11 can be a socket and a pin connection to improve the convenience of electrical connection between the control module 10 and the circuit board 21. The electrical connector 211 and the connection mating part 11 can also be a board-to-board connection or an interface connection, etc., but are not limited thereto.

[0247] In other examples, the control module 10 and the computing module 20 may be connected via wires.

[0248] It should be noted that the above is only an example and does not constitute a limitation of the present application. Those skilled in the art can understand that the connection between the control module 10 and the computing module 20 can also be wireless connection, USB connection, magnetic connection, etc., but is not limited thereto.

[0249] Exemplarily, one of the heat sink 22 and the circuit board 21 is provided with a positioning portion, and the other is provided with a positioning matching portion, and the positioning hole portion is matched and connected with the positioning matching portion to provide positioning for the installation of the circuit board 21 and the heat sink 22, thereby facilitating the assembly of the circuit board 21 and the heat sink 22.

[0250] In some examples, such as Figure 7B and Fig. 8A As shown, one of the positioning portion and the positioning matching portion may be a positioning column 2211 , and the other may be a positioning hole 212 . The positioning column 2211 is plug-fitted with the positioning hole 212 to achieve installation and positioning of the circuit board 21 and the heat sink 22 .

[0251] In other examples, the positioning portion and the positioning matching portion may be a matching combination of a protrusion and a groove.

[0252] It should be noted that the above is only an example and does not constitute a limitation of the present application. Those skilled in the art can understand that the positioning portion and the positioning matching portion can also be the matching of a pin and a socket, the matching of a buckle and a lock, or magnetic positioning, etc., and are not limited thereto.

[0253] For example, see Figure 7B The heat conducting plate 221 adjacent to the bottom shell 120 has fixed areas at both ends in the first direction L1, and no heat sink 222 is provided in the fixed areas. A positioning column 2211 is provided on the side of the fixed area adjacent to the first functional area 214 facing the first functional area 214. The circuit board 21 and the heat conducting plate 221 away from the bottom shell 120 have positioning holes 212 corresponding to the positioning columns 2211, and the positioning columns 2211 are adapted and plugged with the positioning holes 212. That is, the positioning columns 2211 on the ends of the heat conducting plate 221 adjacent to the bottom shell 120 cooperate with the positioning holes 212 corresponding to the circuit board 21 and another heat conducting plate 221, so as to provide positioning for the installation of the circuit board 21 and the heat sink 22.

[0254] For some examples, see Figure 7B The circuit board 21 and the heat sink 22 are fixed by fasteners. For example, a first fixing hole 2221 is defined between the plurality of heat sinks 222 of the heat sink 22, the heat conducting plate 221 of the heat sink 22 has a second fixing hole 2212 corresponding to the first fixing hole 2221, and the circuit board 21 has a corresponding matching hole 217 (such as Fig. 8A As shown in FIG. 2 , the circuit board 21 and the heat sink 22 are fixed by fasteners that pass through the first fixing hole 2221, the matching hole 217, and the second fixing hole 2212 in sequence. The number of the first fixing hole 2221, the matching hole 217, and the second fixing hole 2212 can be one or more to enhance the stability of the fixing between the circuit board 21 and the heat sink 22.

[0255] In other examples, the circuit board 21 and the heat sink 22 are fixed by an adhesive, such as thermally conductive adhesive.

[0256] It should be noted that the above is only an example and does not constitute a limitation of the present application. Those skilled in the art can understand that the circuit board 21 and the heat sink 22 can also be fixed by riveting, snap connection or welding, etc., but are not limited thereto.

[0257] There may be many ways to fix the circuit board 21 and the heat sink 22 to the bottom case 120 .

[0258] For some examples, see Figure 7B The circuit board 21 and the heat sink 22 are fixed to the bottom case 120 by fasteners. Specifically, the positioning column 2211 is formed with a first connection hole 22111 that penetrates the heat conducting plate 221 in the thickness direction of the heat conducting plate 221. The inner surface of the bottom case 120 has a plurality of fixing columns 123. Some of the fixing columns 123 correspond to the positioning columns 2211 and have first fixing channels 1231 corresponding to the first connection holes 22111. The circuit board 21 and the heat conducting plate 221 are fixed to the bottom case 120 by fasteners that sequentially pass through the positioning holes 212 and the first connection holes 22111 and are fastened to the first fixing channels 1231. That is, while positioning, the positioning column 2211 can also cooperate with some of the fixing columns 123 corresponding to the bottom case 120 to achieve the fixing of the circuit board 21 and the heat sink 22 to the bottom case 120.

[0259] For other examples, see Figure 7B The fixing area adjacent to the second functional area 215 is formed with a second connection hole 2213 penetrating the heat conducting plate 221 in the thickness direction of the heat conducting plate 221, and the second functional area 215 is formed with a third connection hole 216 corresponding to the second connection hole 2213 (see also Fig. 8A ), part of the fixing column 123 has a second fixing channel 1232 corresponding to the second connection hole 2213, and the circuit board 21 and the heat conducting plate 221 are fixed to the bottom case 120 by a fastener that passes through the third connection hole 216 and the second connection hole 2213 in sequence and is fastened to the second fixing channel 1232. In this way, the circuit board 21 and the heat sink 22 can be fixed to the bottom case 120 through the cooperation of the second connection hole 2213 of the heat conducting plate 221, the third connection hole 216 of the second functional area 215 of the circuit board 21 and the part of the fixing column 123 corresponding to the bottom case 120.

[0260] When the above two examples are combined, multiple fixing positions can be formed on the circuit board 21 and the heat sink 22 to enhance the stability of the connection between the circuit board 21 and the heat sink 22 and the bottom case 120 .

[0261] In some other examples, the heat sink 22 and the bottom case 120 may be fixed by an adhesive.

[0262] It should be noted that the above is only an example and does not constitute a limitation to the present application. Those skilled in the art can understand that the heat sink 22 and the bottom shell 120 can also be fixed by riveting, snap connection or welding, etc., but are not limited thereto.

[0263] For example, see Figure 7BA reinforcing member 125 extending toward the heat sink 22 is disposed on the inner side of the bottom shell 120 . The reinforcing member 125 is connected to a plurality of fixing columns 123 to enhance the strength and stability of the fixing columns 123 .

[0264] For some examples, see Figure 7B The reinforcement member 125 of the bottom case 120 includes a reinforcement connecting plate 1251 and a reinforcement side plate 1252 connected to the outer side of the reinforcement connecting plate 1251 in the first direction L1, so that the plurality of fixing columns 123 distributed on the second square L2 are connected by the reinforcement connecting plate 1251 to enhance the stability of the fixing columns 123. The outer side of the reinforcement connecting plate 1251 in the first direction L1 refers to the side of the reinforcement connecting plate 1251 away from the center thereof in the first direction L1.

[0265] For example, see Figure 7B The reinforcing connecting plate 1251 may include a connecting section 12511 and a reinforcing section 12512. The connecting section 12511 is connected between two adjacent fixing columns 123 in the second direction L2, and the reinforcing section 12512 is connected to the outer sides of the fixing columns 123 distributed in the second direction L2. In this way, the reinforcing connecting plate 1251 is reinforced by the reinforcing side plate 1252 to improve the strength and stability of the reinforcing member 125. The reinforcing connecting plate 1251 and the reinforcing side plate 1252 provide support for the heat conducting plate 221 of the heat sink 22, thereby ensuring the overall stability of the bottom case 120, the heat sink 22 and the circuit board 21.

[0266] In some examples, the reinforcement member 125 and the fixing column 123 may be integrally formed with the bottom shell 120 to improve structural strength and assembly efficiency.

[0267] In some other examples, the reinforcement member 125 and the fixing column 123 may be designed separately from the bottom shell 120 , and may be fixed to the bottom shell 120 by welding or fasteners, for example, but is not limited thereto.

[0268] In the related art, an independent power module is provided to power the circuit board of the computing device. The power module provides a voltage within a preset voltage range to the circuit board through voltage regulation to meet the working requirements of the circuit board. However, the provision of the power module will increase space occupation and weight, and increase circuit complexity and cost.

[0269] The circuit board 21 of the embodiment of the present application can omit an independent power supply module while meeting the power demand of the circuit board 21. FIG. 8A to FIG. 8C The circuit board 21 of this embodiment is described in detail.

[0270] Fig. 8A The main structural diagram of the circuit board 21 of the embodiment of the present application is provided as an example. Figure 8BA schematic diagram of the three-dimensional structure of the circuit board 21 of the embodiment of the present application is provided as an example. Figure 8C A schematic diagram of the main structure of the circuit board 21 of an embodiment of the present application is provided as an example.

[0271] like Fig. 8A As shown, the circuit board 21 of the embodiment of the present application includes a board body 210, a chip array disposed on the board body 210, an electrical connector 211 and a voltage converter 27, wherein the electrical connector 211 is disposed on the board body 210 and is used to supply power to the voltage converter 27, and the voltage converter 27 is disposed on the board body 210 and is used to supply power to the chip array according to a preset voltage range. The circuit board 21 electrically connects the voltage converter 27 with the control module 10 through the electrical connector 211, and adjusts the voltage input by the control module 10 to the voltage required by the circuit board 21 through the voltage converter 27, thereby omitting the power module and meeting the power demand of the circuit board 21.

[0272] like Fig. 8A , and combined with Figure 7B As shown, the chip array is arranged in the first functional area 214 of the surface of the board body 210 of the circuit board 21 away from the bottom shell 120, and the electrical connector 211 and the voltage converter 27 can be arranged in the second functional area 215 of the surface of the board body 210 away from the bottom shell 120.

[0273] The voltage converter 27 may be a DC-DC converter, such as a switching buck converter that converts a higher DC voltage into a lower DC voltage, an adjustable output voltage converter, or an AC-DC converter, but is not limited thereto. The electrical connector 211 may be a pin header type, a pin header type, a USB type, etc., but is not limited thereto.

[0274] Exemplarily, the chip array includes at least two rows of chipsets 22, which are arranged at intervals in the second direction L2, and each row of chipsets 22 includes a plurality of computing chips 213 arranged at intervals in the first direction L1, so as to improve computing performance. Fig. 8A In the example shown, the chip array includes two rows of chipsets 22. In other examples, the chip array may include three or more rows of chipsets 22.

[0275] exist Fig. 8A In the example shown, a row of chipsets 22 adjacent to the electrical connector 211 is the first chipset 23, and a row of chipsets 22 away from the electrical connector 211 is the second chipset 24. The electrical connector 211 is disposed on the first side of the first chipset 23 in the first direction L1, and is located on the side of the first chipset 23 away from the second chipset 24, that is, the electrical connector 211 is closer to the first side of the first chipset 23 in the first direction L1, which facilitates the connection between the electrical connector 211 and the chip array.

[0276] In the example where the chip array includes two rows of chipsets 22, one of the rows of chipsets 22 adjacent to the electrical connector 211 is the first chipset 23, and the other row of chipsets 22 is the second chipset 24. In the example where the chip array includes more than two rows of chipsets 22, the row of chipsets 22 closest to the electrical connector 211 is the first chipset 23, and the row of chipsets 22 farthest from the electrical connector 211 is the second chipset 24.

[0277] Understandable, such as Fig. 8A and Figure 8C As shown, the electrical connector 211 has a power input terminal 2111 and a power ground terminal 2112. The power input terminal 2111 is connected to the second chipset 24 through the voltage converter 27, and the power ground terminal 2112 is connected to the first chipset 23, that is, the power ground terminal 2112 is connected to the first chipset 23 closer to it through the power supply line L3, shortening the length of the power supply line L3 connecting the first chipset 23 and the power ground terminal 2112, and reducing the intersection of the power supply line L3 at the ground terminal with other lines.

[0278] In some examples, multiple computing chips 213 in the chip array are connected in series, that is, the chip array is powered in series as a whole. In other examples, multiple computing chips 213 in the chip array can be connected in parallel or in a mixed series-parallel form.

[0279] In some examples, each computing chip 213 in the chip array may have the same model. In other examples, each computing chip 213 in the chip array may have the same size. This is only an example and does not constitute a limitation of the present application. Each computing chip 213 in the chip array may also have the same specifications or functions, etc., and is not limited thereto.

[0280] Exemplarily, the second side of the first chipset 23 in the first direction L1 is electrically connected to the second side of the second chipset 24 in the first direction L1 (see Fig. 8A That is, when the chip array includes two rows of chipsets 22, the second side of the first chipset 23 in the first direction L1 is directly electrically connected to the second side of the second chipset 24 in the first direction L1. When the chip array includes more than two rows of chipsets 22, the second side of the first chipset 23 in the first direction L1 is electrically connected to the second side of the second chipset 24 in the first direction L1 through the chipset 22 between the first chipset 23 and the second chipset 24, thereby realizing the series connection of the computing chips 213 of the chip array.

[0281] For example, see FIG. 8A to FIG. 8CThe first chipset 23 is connected to the power ground terminal 2112 on the first side in the first direction L1, and the second chipset 24 is connected to the voltage converter 27 on the first side in the first direction L1, that is, the ends of the first side, i.e., the first side, of the first chipset 23 and the second chipset 24 in the first direction L1 serve as the ground terminal and the power supply terminal, respectively, which facilitates the arrangement of the power supply line L3 between the electrical connector 211, the voltage converter 27 and the chip array, increases the compactness of the components on the circuit board 21, and reduces the overall size of the circuit board 21.

[0282] In some examples, the electrical connections of the computing chips 213 in the chip array can be connected by conductive members (such as conductive copper bars) to improve the current carrying capacity and reduce the resistance. In addition, based on the good thermal conductivity of the conductive members, it can help the chip to dissipate heat.

[0283] In other examples, the electrical connections of the computing chips 213 in the chip array can be connected through power supply lines arranged on the board 210. This connection method occupies little space and can achieve miniaturization and high integration of the circuit board 21.

[0284] It should be noted that this is only an example and does not constitute a limitation to the present application. Those skilled in the art will understand that the electrical connection of each computing chip 213 can also be connected by combining a conductive member and a power supply line, and is not limited to this.

[0285] In a specific example, Fig. 8A As shown, the electrical connection of each computing chip 213 in the chip array is connected through a conductive member. The board body 210 is provided with at least two conductive bars 25 and an intermediate conductive member 26. The at least two conductive bars 25 correspond to at least two rows of chipsets 22 one by one. One conductive bar 25 is connected to a plurality of computing chips 213 in a corresponding row of chipsets 22, and the intermediate conductive member 26 is connected between at least two rows of chipsets 22. That is, each computing chip 213 in the chipset 22 is connected in series through the conductive bar 25, and the computing chips 213 between the chipsets 22 are connected in series through the intermediate conductive member 26.

[0286] In some examples, the conductive bar 25 and the intermediate conductive member 26 may be integrally provided. In other examples, the conductive bar 25 and the intermediate conductive member 26 are separately provided. In the example where the conductive bar 25 and the intermediate conductive member 26 are separately provided, the conductive bar 25 and the intermediate conductive member 26 may respectively include an integrally provided conductive sheet or include a plurality of conductive sheets. In the example where the conductive bar 25 includes a plurality of conductive sheets, and / or the intermediate conductive member 26 includes a plurality of conductive sheets, a power supply line may be provided in the gap area between the plurality of conductive sheets on the plate body 210, and the plurality of conductive sheets may be connected through the power supply line.

[0287] The conductive bar 25 , the intermediate conductive member 26 and the plate body 210 may be fixed by welding, fasteners, etc., but are not limited thereto.

[0288] In some examples, such as Figure 8C As shown, the voltage converter 27 is connected to the conductive bar 25 through the power supply line, and the power ground terminal 2112 of the electrical connector 211 is connected to the conductive bar 25 through the power supply line L3, so as to realize the electrical connection between the chip array and the voltage converter 27 and the electrical connector 211. In other examples, the voltage converter 27 and the power ground terminal 2112 of the electrical connector 211 are directly connected to each computing chip 213 of the chip array through the power supply line L3.

[0289] In a specific example, Fig. 8A and Figure 8C As shown, a conductive row 25 of a plurality of computing chips 213 connected to a first chipset 23 of a chip array is a first conductive row 251, and a conductive row 25 of a plurality of computing chips 213 connected to a second chipset 24 of a chip array is a second conductive row 252. The second conductive row 252 has a power supply input terminal 253 located on a first side of the second chipset 24 in a first direction L1, and the first conductive row 251 has a power supply output terminal 254 located on a first side of the first chipset 23 in the first direction L1. The power supply input terminal 253 of the second conductive row 252 is connected to a voltage converter 27, and the power supply output terminal 254 of the second conductive row 252 is connected to a power ground terminal 2112 of an electrical connector 211.

[0290] For example, see Fig. 8A The intermediate conductive member 26 is disposed on the second side of at least two rows of chipsets 22 in the first direction L1, and is connected between at least two rows of chipsets 22, so that the chipsets 22 are connected in series on the second side of the first direction L1. At the same time, the intermediate conductive member 26 is arranged separately from the electrical connector 211 and the voltage converter 27 on the first side in the first direction L1, making the layout more reasonable and making full use of the space of the board 210.

[0291] For example, Figure 8C As shown, the electrical connector 211 has a signal connection end 2113, and the signal connection end 2113 is connected to the chip array. Through the electrical connector 211, data is transmitted between the control module and the computing chip 213 of the chip array, so that the computing chip 213 can calculate, analyze and process the data and feedback the data processing results.

[0292] For example, see Figure 8CThe power ground terminal 2112 , the power input terminal 2111 and the signal connection terminal 2113 of the electrical connector 211 are arranged in the first direction L1 , so as to facilitate the electrical connection between the electrical connector 211 and the voltage converter 27 and the chip array.

[0293] exist Figure 8C In the example shown, the electrical connector 211 can be in the shape of a long strip extending along the first direction L1. The electrical connector 211 is formed with two rows of sockets arranged at intervals along the second direction L2. The two rows of sockets extend along the first direction L1 respectively. The two rows of pinholes respectively define a power ground terminal 2112, a power input terminal 2111 and a signal connection terminal 2113 arranged in sequence in the first direction L1.

[0294] In some other examples, the electrical connector 211 may be in the shape of an elongated strip extending along the second direction L2, and the electrical connector 211 may be in the shape of a pinhole or pin row.

[0295] It should be noted that the above is only an example and does not constitute a limitation of the present application. Those skilled in the art will understand that the electrical connector 211 can also be a regular shape such as a circle or a rectangle, or an irregular shape, etc., and is not limited to this. The connection form of the electrical connector 211 can also be a USB form, etc., and is not limited to this.

[0296] For example, Figure 8C As shown, the signal connection terminal 2113 is connected to the side of the first chipset 23 of the chip array away from the second chipset 24 through the signal line L4, and is connected to the computing chip 213 in the first chipset 23 that is closest to the signal connection terminal 2113. On the one hand, the signal line L4 avoids the power supply line L3 connecting the first chipset 23 and the power ground terminal 2112, avoiding the interference of ground noise on the signal and ensuring the reliability and stability of the signal; on the other hand, it can shorten the length of the signal line L4, reduce signal delay, and simplify the wiring design.

[0297] Exemplarily, the signal line L4 connects the computing chip 213 from the first side of the computing chip 213 in the second direction L2, and further connects the adjacent computing chip 213 from the second side of the computing chip 213 in the second direction L2, so as to connect the computing chips 213 in the first chipset 23 and the second chipset 24 in series. Fig. 8A and Figure 8CIn the first chipset 23, the signal line L4 is connected from the upper side of the computing chip 213 (i.e. the side away from the second chipset 24 in the second direction L2) to the rightmost computing chip 213 (i.e. the computing chip 213 closest to the signal connection end 2113), from the lower side of the rightmost computing chip 213 (i.e. the other side in the second direction L2) to the adjacent computing chip 213 on the left, and then from the upper side of the computing chip 213 on the left to the next computing chip 213 on the left, and so on, the signal line L4 connects the computing chips 213 in the first chipset 23 in series. The computing chip 213 at the end of the first chipset 23 (i.e. the leftmost computing chip 213) is then connected to the computing chip 213 in the second chipset 24, and the computing chips 213 in the second chipset 24 are then connected in sequence, connecting the second chipset 24 and the first chipset 23 in series.

[0298] In some examples, the computing chip 213 farthest from the signal connection terminal 2113 in the first chipset 23 is signal-connected to the computing chip 213 farthest from the signal connection terminal 2113 in the second chipset 24, that is, the signal line L4 is transmitted from the computing chip 213 closest to it to the computing chip 213 farthest from it in the first chipset 23, and then transmitted from the farthest computing chip 213 to the computing chip 213 closest to the farthest computing chip 213 in the second chipset 24, so as to shorten the signal line L4. Fig. 8A and Figure 8C The signal line L4 starts from the rightmost computing chip 213 in the first chipset 23, and is transmitted to each computing chip 213 on the left in sequence, and then is transmitted from the leftmost computing chip 213 to the leftmost computing chip 213 in the second chipset 24, and then is transmitted to each computing chip 213 on the right in sequence, completing the signal transmission between the first chipset 23 and the second chipset 24.

[0299] In other examples, the signal line L4 may be transmitted by a computing chip 213 at a certain middle position in the first chipset 23 , and then sequentially transmitted to adjacent computing chips 213 and each computing chip 213 in the second chipset 24 .

[0300] It should be noted that the above is only an example and does not constitute a limitation to the present application. Those skilled in the art can understand that the transmission path of the signal line L4 is not limited to the above example. For example, the signal line L4 can also pass through the second chipset 24 and then be transmitted to the first chipset 23, and then be transmitted from the computing chip 213 of the second chipset 24 closest to the signal connection terminal 2113 to other computing chips 213 in sequence, and is not limited to this.

[0301] In some examples, the number of computing chips 213 in the first chipset 23 may be an odd number. When the number of computing chips 213 in the first chipset 23 is an odd number, when the signal line L4 is transmitted to the leftmost computing chip 213 of the first chipset 23, it can be led out from the lower side of the computing chip 213 (i.e., the side of the computing chip 213 close to the second chipset 24 in the second direction L2), so that the signal line L4 can continue to be transmitted from the lower side of the computing chip 213 to the leftmost computing chip 213 of the second chipset 24, thereby shortening the signal line L4 and ensuring the stability of signal transmission.

[0302] In some other examples, the number of computing chips 213 in the first chipset 23 may be an even number.

[0303] The total number of computing chips 213 of the chip array can be determined according to the computing power required by the circuit board 21. In addition, the number of computing chips 213 in the first chipset 23 and the number of computing chips 213 in the second chipset 24 can be determined according to the component layout design requirements of the circuit board 21. The number of computing chips 213 in the second chipset 24 can be an odd number or an even number, which is not limited in the embodiment of the present application.

[0304] In some examples, the number of computing chips 213 in the first chipset 23 is greater than the number of computing chips 213 in the second chipset 24, that is, the number of computing chips 213 in the first chipset 23 that is closer to the signal connection end 2113 is greater, and the number of computing chips 213 in the second chipset 24 that is relatively far from the signal connection end 2113 is less, so as to ensure that the signal can be transmitted to more computing chips 213 in the same time, thereby improving the signal transmission efficiency.

[0305] In other examples, the number of computing chips 213 in the first chipset 23 may be the same as the number of computing chips 213 in the second chipset 24 .

[0306] It should be noted that the above is only an example and does not constitute a limitation to the present application. Those skilled in the art can understand that the number of computing chips 213 in the first chipset 23 can also be less than the number of computing chips 213 in the second chipset 24.

[0307] In some examples, the distance between two adjacent computing chips 213 in the second chipset 24 is greater than the distance between other two adjacent computing chips 213. Fig. 8A , the spacing between adjacent computing chips 213 on the first side adjacent to the first direction L1 in the second chipset 24 is greater than the spacing between adjacent computing chips 213 on the second side adjacent to the first direction L1, that is, the spacing between adjacent computing chips 213 on the right side of the second chipset 24 is greater than the spacing between adjacent computing chips 213 on the left side.

[0308] It can be understood that when the board 210 reserves the same layout space for the first chipset 23 and the second chipset 24, if the number of computing chips 213 in the first chipset 23 is greater than the number of computing chips 213 in the second chipset 24, it is equivalent to reducing the chips in the second chipset 24, that is, removing some of the computing chips 213 in the second chipset 24 and increasing the spacing between some adjacent computing chips 213.

[0309] exist Fig. 8A In the example shown, the spacing between adjacent computing chips 213 in the middle area of ​​the second chipset 24 is greater than the spacing between adjacent computing chips 213 on both sides. It can be understood that after removing two computing chips 213 from the middle area of ​​the second chipset 24, the spacing between adjacent computing chips 213 in the middle area that remain is equivalent to twice the spacing between other adjacent computing chips 213 and the sum of the sizes of the two computing chips 213 themselves.

[0310] It should be noted that the above is only an example and does not constitute a limitation to the present application. Those skilled in the art can understand that the spacing between two adjacent computing chips 213 in the second chipset 24 can be uniform or partially uniform, and is not limited thereto.

[0311] For example, Fig. 8A As shown, the avoidance gap 2201 of the board 210 is formed on one side of the board 210 adjacent to the first chipset 23 in the second direction L2 , and the avoidance gap 2201 extends from the second side of the board 210 in the first direction L1 to the side adjacent to the electrical connector 211 .

[0312] It should be noted that the ratio of the extension dimension of the board 210 in the first direction L1 to the extension dimension of the board 210 in the second direction L2 can be set according to the actual design requirements of the computing device. Exemplarily, the ratio of the extension dimension of the board 210 in the first direction L1 to the extension dimension of the board 210 in the second direction L2 can fall within a ratio range of 1.5:1 to 3.5:1, that is, the length dimension and the width dimension of the board 210 meet the aforementioned ratio range, providing a suitable space for the arrangement of the chip array and other electronic components to match the performance requirements and size requirements of the computing device.

[0313] It is understandable that electronic components with different functions require different operating voltages. When the computing device uses other electronic components, such as a control module to power the circuit board 21, it is necessary to convert the output voltage of the control module into the voltage required by the circuit board 21 through the voltage converter 27.

[0314] For example, Fig. 8AAs shown, the voltage converter 27 includes a voltage regulating module, which includes a voltage control chip, an input voltage switch element 271 and an output voltage switch element 272. The voltage control chip is used to control the on-off of the input voltage switch element 271 and the on-off of the output voltage switch element 272 according to a preset voltage range. The voltage control chip can monitor the output voltage of the voltage converter 27 in real time to determine whether the actual output voltage is within the preset voltage range. If the output voltage of the voltage converter 27 does not fall within the preset voltage range, the voltage control chip will adjust the on-off time of the input voltage switch element 271 and the output voltage switch element 272, thereby stabilizing the output voltage of the voltage converter 27 so that it falls within the preset voltage range and meets the working requirements of the chip array.

[0315] In some examples, the input voltage switch element 271 and the output voltage switch element 272 can be metal oxide semiconductor field effect transistors respectively, that is, the input voltage switch element 271 is a high-side MOS (Metal Oxide Semiconductor) field effect transistor, and the output voltage switch element 272 is a low-side MOS field effect transistor, so as to reduce the on-resistance and improve the efficiency of the voltage converter 27.

[0316] In other examples, the input voltage switch element 271 may be an insulated gate bipolar transistor (IGBT) or a bipolar junction transistor (BJT), and the output voltage switch element 272 may be a freewheeling diode, but is not limited thereto.

[0317] It can be understood that the signal connection terminal 2113 of the electrical connector 211 can output two signals, one signal is transmitted to the chip array, so that the computing chip 213 performs calculations and analysis, and the other signal is transmitted to the voltage control chip, so that the voltage control chip controls the input voltage switch element 271 and the output voltage switch element 272.

[0318] Exemplarily, the voltage control chip may include a voltage control main chip 273 and a voltage control auxiliary chip 274. The voltage control main chip 273 is responsible for generating a pulse width modulation (PWM) signal to control the on and off of the input voltage switch element 271 and the output voltage switch element 272. The voltage control auxiliary chip 274 may include a startup circuit, a bias power supply, a protection circuit, etc. to provide auxiliary power management and provide a stable power supply for the voltage control main chip 273 and other auxiliary circuits.

[0319] The voltage regulating module also includes a resistor element 276 and a diode 275. The resistor element 276 may include a voltage-dividing resistor, a current monitoring resistor, a starting resistor, etc. The voltage regulating module obtains a feedback signal of the output voltage of the voltage converter 27 through the voltage-dividing resistor by voltage division. The feedback signal is input to the error amplifier in the voltage control main chip 273, and compared with the preset voltage range to generate an error signal. The error signal is input to the PWM control circuit of the voltage control main chip 273. The PWM control circuit adjusts the duty cycle of the PWM according to the error signal. The duty cycle determines the on-time and off-time of the input voltage switch element 271 and the output voltage switch element 272 to adjust the output voltage of the voltage converter 27 to within the preset voltage range. The current detection resistor monitors the current size through the voltage drop across it and provides a current detection signal for overcurrent protection and current mode control. The starting resistor is used to provide an initial startup current for the voltage control main chip 273. The diode 275 is used to protect the components in the circuit from damage by overvoltage or reverse voltage.

[0320] Exemplarily, the voltage converter 27 includes a voltage stabilizing module, which includes an input capacitor element 277, an output capacitor element 279 and an inductor element 278, wherein the input capacitor element 277 is connected between the power input terminal 2111 of the electrical connector 211 and the input terminal of the input voltage switch element 271, the input terminal of the inductor element 278 is respectively connected to the output terminal of the input voltage switch element 271 and the input terminal of the output voltage switch element 272, and the output terminal of the inductor element 278 is respectively connected to the input terminal of the output capacitor element 279 and the power supply input terminal 253 of the chip array.

[0321] The input capacitor element 277 filters the input voltage of the electrical connector 211 to reduce the ripple of the input voltage. When the input voltage switch element 271 is turned on, the input voltage provides energy to the chip array and the output capacitor element 279 through the inductor element 278. The output capacitor element 279 filters the output voltage to reduce the ripple of the output voltage and provide a stable DC output for the chip array. When the input voltage switch element 271 is turned off and the output voltage switch element 272 is turned on, the energy stored in the inductor element 278 is released through the input voltage switch element 271 to maintain the output voltage. The inductor element 278 is responsible for storing energy and smoothing the current, reducing the transient changes of the current, and maintaining a continuous current supply.

[0322] For ease of understanding, the voltage regulation and stabilization process of the voltage converter 27 is described below using a specific example.

[0323] See also FIG. 8A to FIG. 8COne end of the input capacitor element 277 is connected to the power input terminal 2111 of the electrical connector 211, and the other end is connected to the drain of the input voltage switch element 271, the source of the input voltage switch element 271 is connected to the drain of the inductor element 278 and the output voltage switch element 272, and the gate of the input voltage switch element 271 is connected to the PWM signal output of the voltage control chip; the source of the output voltage switch element 272 is grounded, the drain is connected to the drain of the output voltage switch element 272 and the inductor element 278, and the gate is connected to the PWM output of the voltage control chip; one end of the output capacitor element 279 is connected to the output voltage of the inductor element 278, and the other end is connected to the ground; the power supply input terminal of the chip array is connected to the output voltage of the inductor element 278, and the power supply output terminal is connected to the ground.

[0324] In the initial state, the input voltage switch element 271 is turned on, the output voltage switch element 272 is turned off, and the input voltage of the electrical connector 211 provides current to the output end through the input capacitor element 277, the input voltage switch element 271 and the inductor element 278, charging the output capacitor element 279 and powering the chip array, while the current in the inductor element 278 increases step by step to store energy. In this process, the voltage control chip monitors the output voltage of the voltage converter 27, obtains the output voltage signal through the feedback circuit, and compares it with the preset voltage range. When the output voltage is lower than the preset voltage range, the voltage control chip increases the duty cycle and prolongs the conduction time of the input voltage switch element 271; when the output voltage is higher than the preset voltage range, the voltage control chip reduces the duty cycle and shortens the conduction time of the input voltage switch element 271.

[0325] When the PWM signal becomes a low level, the input voltage switch element 271 is turned off, the output voltage switch element 272 is turned on, the energy of the inductor element 278 is released through the output voltage switch element 272, and the current continues to be provided to the output end, and the current in the inductor element 278 gradually decreases. When the PWM signal becomes a high level, the input voltage switch element 271 is turned on, the output voltage switch element 272 is turned off, and the input voltage is transmitted to the output end through the input voltage switch element 271 and the inductor. The input voltage switch element 271 and the output voltage switch element 272 are periodically turned on and off in this way, continuously providing a stable output voltage for the chip array to meet the power supply requirements of the chip array.

[0326] For some examples, see Fig. 8A The inductor element 278 is adjacent to the first side of the second chipset 24 of the chip array in the first direction L1, which facilitates the connection between the inductor element 278 and the power supply input terminal 253 of the second chipset 24, thereby shortening the power supply line.

[0327] For some examples, see Fig. 8AThe number of input capacitor elements 277 is at least two, and at least two input capacitor elements 277 are connected in parallel to reduce power supply noise and ripple and improve filtering effect. At the same time, multiple input capacitor elements 277 can share current, reduce the current load of each input capacitor element 277, and extend the life of the input capacitor element 277.

[0328] It can be understood that at least two input capacitor elements 277 are arranged on the first side of the inductor element 278 in the first direction L1, and at least two input capacitor elements 277 are spaced apart in the second direction L2 to facilitate the connection between the input capacitor element 277 and the inductor element 278.

[0329] For some examples, see Fig. 8A The number of output capacitor elements 279 is at least two, and at least two output capacitor elements 279 are connected in parallel to reduce power supply noise and ripple and improve filtering effect. Multiple output capacitor elements 279 can share current, reduce the current load of each output capacitor element 279, and extend the life of the output capacitor element 279.

[0330] Continue to see Fig. 8A Part of the output capacitor element 279 is arranged on the side of the second chipset 24 of the chip array away from the first chipset 23 and is located on the second side of the inductor element 278 in the first direction L1, and another part of the output capacitor element 279 is arranged on the side of the inductor element 278 adjacent to the first chipset 23 in the second direction L2 to better utilize the space of the circuit board 21.

[0331] In some examples, the number of output voltage switch elements 272 is at least two, and at least two output voltage switch elements 272 are connected in parallel to reduce conduction loss and reduce the current load of each output voltage switch element 272, thereby reducing power consumption and heat generation of each output voltage switch element 272, providing certain redundant protection, and improving the efficiency and reliability of the voltage converter 27.

[0332] For some examples, see Fig. 8A The input voltage switch element 271 and the output voltage switch element 272 are arranged in the area defined between the input capacitor element 277, the inductor element 278, the output capacitor element 279 and the voltage control chip. The distribution of each component is more concentrated, which facilitates the connection of each component and improves the space utilization of the circuit board 21.

[0333] In other examples, the input capacitor element 277 , the output capacitor element 279 , the input voltage switch element 271 , and the output voltage switch element 272 may be freely distributed within the right side region (the first side region in the first direction L1 ) of the board body 210 .

[0334] It should be noted that the above is only an example and does not constitute a limitation to the present application. Those skilled in the art can understand that the distribution positions of the above components can also be in the upper area or the lower area of ​​the plate 210, and are not limited thereto.

[0335] Other components of the computing device 100 of the exemplary embodiment described above may adopt various technical solutions known to ordinary technicians in the field now and in the future, and will not be described in detail here.

[0336] As will be appreciated by those skilled in the art, the above examples may be arbitrarily combined to achieve specific design requirements and functions without departing from the spirit or scope of the present application.

[0337] In the description of this specification, it should be understood that the terms "length", "up", "down", "front", "back", "left", "right", "vertical", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0338] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0339] In this application, unless otherwise clearly specified and limited, the terms "connected" and "connection" can refer to electrical connection or communication; can refer to direct connection or indirect connection through an intermediate medium; can refer to the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0340] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0341] The disclosure above provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numerals and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0342] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A fan device, characterized in that: include: The housing comprises a bottom shell and a cover shell disposed on the bottom shell, wherein the bottom shell and the cover shell define an air outlet duct, the cover shell has a bracket, and the bracket defines a card slot; The fan module is accommodated in the card slot, and the fan module generates an airflow flowing along the air duct during operation.

2. The fan device according to claim 1, characterized in that The bracket includes at least two partitions, the at least two partitions are spaced apart and distributed in a first direction, and two adjacent partitions define the card slot.

3. The fan device according to claim 2, characterized in that The cover shell has a shell plate opposite to the bottom shell, the partition extends from the inner side of the shell plate toward the bottom shell, two adjacent partitions define two first walls of the slot, and the area of ​​the shell plate between the two adjacent partitions defines the second wall of the slot.

4. The fan device according to claim 2, characterized in that The edges of two adjacent partitions in a direction toward the bottom shell define a card entrance of the card slot, and the card entrance is used for the fan module to be carded into the card slot.

5. The fan device according to claim 2, characterized in that: The bracket further includes a baffle, which is arranged on the side of the card slot in the second direction and connected between the side of two adjacent partitions in the second direction; The baffle has a ventilation gap facing away from the shell plate of the housing, and the ventilation gap is used for air flow to pass through.

6. The fan device according to claim 5, characterized in that The baffles are respectively disposed on two opposite sides of the card slot in the second direction.

7. The fan device according to claim 2, characterized in that The number of the fan modules is at least two, the number of the partitions is at least three, at least three partitions define at least two slots, and at least two fan modules correspond to at least two slots in a one-to-one manner.

8. The fan device according to claim 1, characterized in that It also includes a flexible protective member, which is arranged on the outer peripheral wall of the fan module where no air flows through, and the part of the flexible protective member located between the fan module and the slot abuts against the inner wall of the slot so that the fan module is snapped into the slot.

9. The fan device according to claim 1, characterized in that The shell plate of the cover shell has a guide piece extending toward the bottom shell, and the bottom shell has a guide matching piece matched with the guide piece.

10. The fan device according to claim 9, characterized in that The guide member is disposed on a first side of a partition of the bracket in a second direction, and the guide member is connected to the corresponding partition and the baffle of the bracket through a connecting plate.

11. The fan device according to claim 1, characterized in that The end of the fan module away from the shell plate of the housing is defined with a wire clamping notch on a first side in the second direction, and the connecting line of the fan module is clamped in the wire clamping notch and extends to the side of the fan module away from the shell plate of the housing.

12. The fan device according to claim 1, characterized in that The air duct has an air inlet and an air outlet, and the cover shell defines the air inlet and the air outlet.

13. The fan device according to claim 12, characterized in that The air inlet and the air outlet are distributed in the second direction, the air outlet is adjacent to a first side of the bracket in the second direction, and the air inlet is adjacent to a second side of the bracket in the second direction.

14. The fan device according to claim 1, characterized in that It also includes a guide plate, which is connected to the inner side of the shell plate of the cover shell and extends from the outer side of the bracket in the first direction along the airflow direction.

15. The fan device according to claim 14, characterized in that Along the airflow direction, the guide plate includes a first guide section adjacent to the fan module, a second guide section extending outward from the first guide section, and a third guide section extending from the second guide section away from the fan module.

16. A computing device, characterized in that: include: The fan device according to any one of claims 1 to 15; The computing module is arranged in the air duct of the fan device.

17. The computing device according to claim 16, characterized in that Along the air flow direction, the computing module is located downstream of the fan module of the fan device.

18. The computing device according to claim 16, wherein: The computing module is arranged on the inner side of the bottom shell of the fan device.

19. The computing device of claim 16, wherein: It also includes a filter assembly, which is arranged at the air inlet of the air duct. The filter assembly includes a filter frame and a filter element arranged on the filter frame, and the filter element is used to filter the airflow passing through it.

20. The computing device of claim 19, wherein: The housing of the fan device has an air inlet plate, and the air inlet is formed on the air inlet plate; An accommodating space is defined between the bracket of the fan device and the air inlet plate, an insertion port communicating with the accommodating space is defined between the cover shell and the bottom shell of the fan device, and the filter assembly is inserted into the accommodating space through the insertion port.

21. The computing device of claim 20, wherein: The filter frame has an insertion end and a closed end. The insertion end is inserted into the accommodating space through the insertion opening, and the closed end covers the insertion opening.

22. The computing device of claim 21, wherein: The closed end is snap-connected with the bottom shell.

23. The computing device of claim 16, wherein: It also includes an air outlet guide component, which includes an air outlet grille plate. The air outlet grille plate is arranged on the outside of the air outlet of the air duct and is used to guide the outlet air.

24. The computing device of claim 23, wherein: The non-air outlet area of ​​the air outlet grille plate is provided with a magnetic member; The cover of the fan device has an air outlet plate, the air outlet plate defines the air outlet, and a magnetic matching part corresponding to the magnetic part is provided in the non-air outlet area of ​​the air outlet plate. The magnetic part is adsorbed and fitted with the magnetic matching part to keep the air outlet grille plate on the air outlet plate.

25. The computing device of claim 24, wherein: The air outlet guide assembly further includes a decorative strip, which is disposed in a non-air outlet area of ​​the air outlet grille plate and is used to cover the magnetic member.

26. The computing device of claim 16, wherein: It also includes a control module, which is arranged in the air duct.

27. The computing device of claim 26, wherein: Along the airflow direction, the control module is located downstream of the fan module.

28. The computing device of claim 26, wherein: The control module is arranged on the inner side of the shell plate of the cover of the fan device.

29. The computing device of claim 26, wherein: It also includes a data plug connected to the control module. The cover of the fan device has a plug installation portion, the plug installation portion defines a plug installation slot, and the data plug is snapped into the plug installation slot.

30. The computing device of claim 29, wherein: The plug mounting portion is disposed outside the bracket of the fan device in a first direction.

31. The computing device of claim 29, wherein: The air inlet plate of the housing has an insertion hole communicated with the plug installation slot, and the insertion hole is used for inserting a data line to connect with the data plug.

32. The computing device of claim 16, wherein: It also includes a light emitting member and a light guide member, which are arranged inside the housing of the fan device and adjacent to the air outlet of the air duct. The light emitting member is arranged on the light guide member, and the light guide member is snap-connected with the housing.

33. The computing device of claim 32, wherein: The cover shell defines an installation space located inside the air outlet plate of the cover shell, the light guide is clamped in the installation space, the inner side of the air outlet plate has a first limiting portion, and the end surface of the light guide facing the bottom shell of the fan device abuts against the first limiting portion.

34. The computing device of claim 33, wherein: It also includes a temperature sensor. The inner side of the air outlet plate also has a second limiting portion. The end surface of the light guide member facing the bottom shell has a third limiting portion. The third limiting portion and the second limiting portion define a limiting space. The temperature sensor is clamped in the limiting space.

35. The computing device of claim 16, wherein: It also includes a transparent cover plate and a display screen. The shell plate of the cover of the fan device is formed with a display hole. The shell plate is formed with an inwardly protruding protective portion on the inner periphery of the display hole. The transparent cover plate and the display screen are accommodated in a space defined by the protective portion and the display hole, and the transparent cover plate covers the outer side of the display screen.

36. The computing device of claim 35, wherein: A display protection member is also included, and the display protection member covers the inner side of the display screen.

37. The computing device of claim 16, wherein: The computing module includes a circuit board and at least one heat sink, and the heat sink is disposed on at least one surface of the circuit board.

38. The computing device of claim 37, wherein: The heat sink comprises a heat conducting plate and a plurality of heat sinks. At least one surface of the circuit board is covered with the heat conducting plate. The plurality of heat sinks are arranged at intervals on a side of the heat conducting plate away from the circuit board.

39. The computing device of claim 38, wherein: A heat dissipation channel is formed between adjacent heat dissipation fins, and the heat dissipation channel extends along the air flow direction.

40. The computing device of claim 38, wherein: The bottom shell of the fan device has a plurality of guide fittings spaced apart in a first direction, and the heat conducting plate and the circuit board are respectively formed with avoidance gaps for avoiding the plurality of guide fittings.

41. The computing device of claim 40, wherein: A reinforcing plate is provided on one side of the guide fitting adjacent to the avoidance notch in the second direction, and the reinforcing plate abuts against the avoidance notch.

42. The computing device of claim 38, wherein: The surface of the circuit board facing away from the bottom shell of the fan device has a first functional area and a second functional area distributed in a first direction, the first functional area is provided with a plurality of computing chips, and the second functional area is provided with an electrical connector for connecting with a control module; The first functional area is covered by the heat dissipation element, and the second functional area is exposed outside the heat dissipation element.

43. The computing device of claim 42, wherein: The heat sink covering the first functional area has a first heat dissipation area away from the second functional area and a second heat dissipation area adjacent to the second functional area, and the height dimension of the heat sink in the second heat dissipation area extending away from the bottom shell is smaller than the height dimension of the heat sink in the first heat dissipation area extending away from the bottom shell.

44. The computing device of claim 43, wherein: The control module is located on a side of the second heat dissipation area and the second functional area away from the bottom shell.

45. The computing device of claim 44, wherein: The control module is provided with a connecting mating portion corresponding to and matingly connected with the electrical connector of the second functional area.

46. ​​The computing device of claim 45, wherein: One of the electrical connector and the connection mating part is a pin, and the other is a socket.

47. The computing device of claim 42, wherein: There are two heat sinks, one of which covers the first functional area, and the other covers the surface of the circuit board facing the bottom shell.

48. The computing device of claim 47, wherein: One of the heat conducting plate of the heat sink and the circuit board has a positioning portion, and the other has a positioning matching portion, and the positioning portion is matched and connected with the positioning matching portion.

49. The computing device of claim 47, wherein: The heat conducting plate adjacent to the bottom shell has fixed areas at both ends in the first direction, and the heat sink is not provided in the fixed areas; the fixed area adjacent to the first functional area is provided with a positioning column on the side facing the first functional area, and the circuit board and the heat conducting plate away from the bottom shell have positioning holes corresponding to the positioning columns, and the positioning columns are adapted to be plugged into the positioning holes.

50. The computing device of claim 49, wherein: The positioning column is formed with a first connection hole penetrating the heat conducting plate in the thickness direction of the heat conducting plate; The inner surface of the bottom shell has a plurality of fixing columns, some of which correspond to the positioning columns and have a first fixing channel corresponding to the first connecting hole. The circuit board and the heat conducting plate are fixed to the bottom shell by fasteners that pass through the positioning hole and the first connecting hole in sequence and are fastened to the first fixing channel.

51. The computing device of claim 50, wherein: The fixing area adjacent to the second functional area is formed with a second connection hole penetrating the heat conducting plate in the thickness direction of the heat conducting plate, and the second functional area is formed with a third connection hole corresponding to the second connection hole; Some of the fixing columns have second fixing holes corresponding to the second connecting holes, and the circuit board and the heat conducting plate are fixed to the bottom shell by fasteners that pass through the third connecting hole and the second connecting hole in sequence and are fastened to the second fixing holes.

52. The computing device of claim 51, wherein: A reinforcing member extending toward the heat sink is disposed on the inner side of the bottom shell, and the reinforcing member is connected to the plurality of fixing columns.

53. The computing device of claim 52, wherein: The reinforcement member includes a reinforcement connecting plate and a reinforcement side plate connected to the outer side of the reinforcement connecting plate in the first direction, the reinforcement connecting plate includes a connection section and a reinforcement section, the connection section is connected between two adjacent fixed columns in the second direction, and the reinforcement section is connected to the outer side of the fixed columns distributed in the second direction.

54. The computing device of claim 16, wherein: The circuit board of the computing module includes a board body, a chip array arranged on the board body, and a voltage converter. The electrical connector of the circuit board is arranged on the board body for supplying power to the voltage converter. The voltage converter is arranged on the board body for supplying power to the chip array according to a preset voltage range.

55. The computing device of claim 54, wherein: The chip array includes at least two rows of chipsets, the chipsets are arranged at intervals in the second direction, and each row of chipsets includes a plurality of computing chips arranged at intervals in the first direction.

56. The computing device of claim 55, wherein: A row of chipsets adjacent to the electrical connector is a first chipset, a row of chipsets away from the electrical connector is a second chipset, and the electrical connector is disposed on a first side of the first chipset in a first direction and located on a side of the first chipset away from the second chipset.

57. The computing device of claim 56, wherein: The electrical connector has a power input terminal and a power ground terminal. The power input terminal is connected to the second chipset through the voltage converter, and the power ground terminal is connected to the first chipset. The multiple computing chips in the chip array are connected in series.

58. The computing device of claim 57, wherein: The first chipset is electrically connected between a second side in the first direction and a second side in the first direction of the second chipset, the first chipset is connected to the power ground terminal on a first side in the first direction, and the second chipset is connected to the voltage converter on a first side in the first direction.

59. The computing device of claim 54, wherein: The electrical connector has a signal connection end, and the signal connection end is connected to the chip array.

60. The computing device of claim 59, wherein: The signal connection end is connected to a side of the first chipset of the chip array away from the second chipset through a signal line, and is connected to a computing chip in the first chipset that is closest to the signal connection end.

61. The computing device of claim 60, wherein: The signal line is connected to the computing chip from one side of the computing chip in the second direction, and is connected to the adjacent computing chip from the other side of the computing chip in the second direction.

62. The computing device of claim 61, wherein: The computing chip farthest from the signal connection end in the first chipset is signal-connected to the computing chip closest to the computing chip in the second chipset.

63. The computing device of claim 62, wherein: The number of computing chips in the first chip group of the chip array is an odd number.

64. The computing device of claim 54, wherein: The voltage converter includes a voltage regulating module, which includes a voltage control chip, an input voltage switch element and an output voltage switch element. The voltage control chip is used to control the on and off of the input voltage switch element and the on and off of the output voltage switch element according to a preset voltage range.

65. The computing device of claim 64, wherein: The input voltage switch element and the output voltage switch element are metal oxide semiconductor field effect transistors respectively.

66. The computing device of claim 64, wherein: The voltage converter comprises a voltage stabilizing module, the voltage stabilizing module comprises an input capacitor element, an output capacitor element and an inductor element, the input capacitor element is connected between the power input terminal of the electrical connector and the input terminal of the input voltage switch element; The input end of the inductor element is respectively connected to the output end of the input voltage switch element and the input end of the output voltage switch element, and the output end of the inductor element is respectively connected to the input end of the output capacitor element and the power supply input end of the chip array.

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