Semiconductor device docking method and system, and control module

Abstract

The invention provides a semiconductor device docking method and system and a control module, the method is applied to the control module, and the method comprises the following steps: receiving device state information of a first semiconductor device from an EAP device automation module, and receiving a sensor signal from the first semiconductor device; determining a docking state of the first semiconductor device according to the device state information and the sensor signal; the docking state is a correct state or an incorrect state; and under the condition that the butt joint state is correct, controlling second semiconductor equipment to realize feeding butt joint and / or discharging butt joint between the second semiconductor equipment and the first semiconductor equipment. According to the invention, the butt joint is carried out when the butt joint state of the first semiconductor equipment is correct, so that the interference between the equipment and the collision risk are reduced, and the production efficiency and the equipment safety are improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor intelligent manufacturing technology, and in particular to a semiconductor equipment docking method and system, and a control module. Background Art

[0002] In the semiconductor manufacturing process, with the advancement of production technology, manual loading and unloading methods are difficult to meet the needs of efficient and flexible production, which not only restricts production efficiency, but also makes it difficult to ensure equipment safety. For example, in the wafer transfer and processing stage, in the processing processes such as silicon wafer cleaning, etching, lithography and ion implantation, the wafer needs to be transferred from one device to another. After each process is completed, the wafer needs to be transferred to the next processing equipment through loading and unloading operations. At different stages of the process, the wafer needs to be transferred to the inspection equipment for quality inspection and defect analysis to ensure that the production standards are met. This process requires the wafer to be unloaded from the processing equipment to the inspection equipment. In the subsequent packaging and testing processes, the chip needs to be frequently moved between various test equipment for multiple tests such as electrical characteristics and mechanical characteristics. The loading and unloading frequency at this stage is high, the efficiency of manual operation is limited, and there is a risk of damage caused by improper equipment docking. In these links, multiple loading and unloading operations put forward high requirements for accurate docking and information feedback between equipment, and manual operation can no longer fully meet the needs of fast, safe and accurate docking.

[0003] Based on this, the present application provides a semiconductor device docking method and system, and a control module to improve related technologies. Summary of the invention

[0004] The purpose of this application is to provide a semiconductor equipment docking method and system, and a control module to improve production efficiency and equipment safety.

[0005] The purpose of this application is achieved by the following technical solutions:

[0006] In a first aspect, the present application provides a semiconductor device docking method, which is applied to a control module, and the method includes: receiving device status information of a first semiconductor device from an EAP device automation module, and receiving a sensor signal from the first semiconductor device; the device status information is used to characterize one or more of the device online status, device port status and device processing status; the sensor signal is used to determine whether there is material on the port of the first semiconductor device; according to the device status information and the sensor signal, determining the docking status of the first semiconductor device; the docking status is a correct status or an incorrect status; when the docking status is a correct status, controlling the second semiconductor device to achieve loading docking and / or unloading docking with the first semiconductor device.

[0007] In some embodiments, the second semiconductor device is a mobile device, and the second semiconductor device is used to send a docking signal to the control module after receiving a transport command from the MES manufacturing execution module; the control of the second semiconductor device to achieve loading docking and / or unloading docking with the first semiconductor device includes: receiving the docking signal to allow the second semiconductor device to perform a loading docking action and / or an unloading docking action with the first semiconductor device.

[0008] In some embodiments, the second semiconductor device is a fixed-position device, and controlling the second semiconductor device to achieve loading and / or unloading docking with the first semiconductor device includes: generating an action command for the second semiconductor device, so that the second semiconductor device performs a loading and / or unloading docking action with the first semiconductor device after receiving the action command.

[0009] In the second aspect, the present application provides a control module, which is used to: receive device status information of a first semiconductor device from an EAP device automation module, and receive a sensor signal from the first semiconductor device; the device status information is used to characterize one or more of the device online status, device port status and device processing status; the sensor signal is used to determine whether there is material on the port of the first semiconductor device; determine the docking status of the first semiconductor device based on the device status information and the sensor signal; the docking status is a correct status or an incorrect status; when the docking status is a correct status, control the second semiconductor device to achieve loading docking and / or unloading docking with the first semiconductor device.

[0010] In some embodiments, the control module includes a PC control unit and a PLC control unit; the PC control unit is used to receive device status information of the first semiconductor device from the EAP device automation module;

[0011] The PLC control unit is used to receive device status information of the first semiconductor device from the PC control unit and a sensor signal from the first semiconductor device; determine the docking state of the first semiconductor device according to the device status information and the sensor signal; and control the second semiconductor device to achieve loading docking and / or unloading docking with the first semiconductor device when the docking state is correct.

[0012] In the third aspect, the present application provides a semiconductor device docking system, the system comprising a first semiconductor device, a second semiconductor device, an EAP device automation module and a control module; the EAP device automation module is used to receive device status information of the first semiconductor device; the device status information is used to characterize one or more of the device online status, device port status and device processing status; the control module is used to receive the device status information of the first semiconductor device from the EAP device automation module, and to receive a sensor signal from the first semiconductor device; the sensor signal is used to determine whether there is material on the port of the first semiconductor device; based on the device status information and the sensor signal, determine the docking status of the first semiconductor device; the docking status is a correct status or an incorrect status; when the docking status is a correct status, control the second semiconductor device to achieve loading docking and / or unloading docking with the first semiconductor device.

[0013] In some embodiments, the second semiconductor device is a mobile device, and the system further includes an MES manufacturing execution module; the MES manufacturing execution module is used to generate a transport command for the second semiconductor device after receiving the device status information of the first semiconductor device from the EAP device automation module; the second semiconductor device is used to send a docking signal to the control module after receiving the transport command; the control module is used to control the second semiconductor device to achieve loading docking and / or unloading docking with the first semiconductor device in the following manner: receiving the docking signal to allow the second semiconductor device to perform a loading docking action and / or an unloading docking action with the first semiconductor device.

[0014] In some embodiments, the mobile device is an AMHS automatic transport device.

[0015] In some embodiments, the second semiconductor device is a fixed-position device; the control module is used to control the second semiconductor device to achieve loading and / or unloading docking with the first semiconductor device in the following manner: generate an action command for the second semiconductor device so that the second semiconductor device performs a loading and / or unloading docking action with the first semiconductor device after receiving the action command.

[0016] In some embodiments, the first semiconductor device is provided with a port sensor, and the port sensor is used to detect whether there is material on the port of the first semiconductor device to generate the sensor signal.

[0017] The present application provides a semiconductor device docking method and system, and a control module, which realizes information exchange and judgment between devices through a newly added control module. Specifically, the control module first receives the device status information of the first semiconductor device from the EAP device automation module, as well as the sensor signal of the first semiconductor device. Based on the received device status information and sensor signal, the control module can judge the docking state of the first semiconductor device and determine whether it is "correct state" or "incorrect state". When the docking state is judged to be "correct state", the control module controls the second semiconductor device to perform loading and unloading docking actions with the first semiconductor device. The present application ensures that docking is performed when the docking state of the first semiconductor device is correct, thereby reducing the risk of interference and collision between devices, and significantly improving the safety of automated docking. Secondly, it reduces dependence on manual operation, reduces the risk of human error, effectively improves the efficiency of automated docking between devices, helps optimize production processes, and improves overall production efficiency and equipment utilization. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present application is further described below in conjunction with the accompanying drawings and specific implementation methods.

[0019] Figure 1 It is a flow chart of a semiconductor device docking method provided in an embodiment of the present application.

[0020] Figure 2 It is a structural schematic diagram of a semiconductor device docking system provided in an embodiment of the present application (the second semiconductor device is a mobile device).

[0021] Figure 3 It is a structural schematic diagram of a semiconductor device docking system provided in an embodiment of the present application (the second semiconductor device is a fixed position device). DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in this application to clearly and completely describe the technical solutions in the implementation mode of this application. Obviously, the described implementation mode is only a part of the implementation mode of this application, not all the implementation modes. Based on the implementation mode in this application, all other implementation modes obtained by those skilled in the art without creative work are within the scope of protection of this application.

[0023] In the description of the embodiments of the present application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0024] Most of the relevant semiconductor equipment uses manual loading and unloading when it has the function of intercommunication with the MES manufacturing execution module (hereinafter referred to as MES). It is difficult to directly connect to other loading and unloading equipment or to the AMHS automatic handling equipment (hereinafter referred to as AMHS) to realize the fully automated handling of the factory. In addition, direct docking without obtaining equipment status information will cause equipment collision, causing great losses to the factory. On the one hand, untimely manual loading and unloading will cause the equipment to be IDEL (idle) and affect the factory's production capacity; on the other hand, if the new equipment is directly docked without obtaining the equipment status information, it will cause equipment interference and collision.

[0025] See also Figure 1 , Figure 1 It is a flow chart of a semiconductor device docking method provided in an embodiment of the present application.

[0026] An embodiment of the present application provides a semiconductor device docking method, which is applied to a control module. The method includes steps S101 to S103.

[0027] Step S101: receiving device status information of a first semiconductor device from an EAP device automation module, and receiving a sensor signal from the first semiconductor device. The device status information is used to characterize one or more of a device online status, a device port status, and a device processing status; and the sensor signal is used to determine whether there is material on the port of the first semiconductor device.

[0028] Step S102: determining a docking state of the first semiconductor device according to the device state information and the sensor signal; the docking state is a correct state or an incorrect state.

[0029] Step S103: when the docking state is correct, controlling the second semiconductor device to achieve loading docking and / or unloading docking with the first semiconductor device.

[0030] In some embodiments, the method may further include: when the docking state is incorrect, restricting the second semiconductor device from achieving loading docking and / or unloading docking with the first semiconductor device.

[0031] In the above embodiments, the "first semiconductor device" and the "second semiconductor device" are both semiconductor devices, and the prefixes "first" and "second" serve to distinguish them. As an example, the first semiconductor device is a main device waiting for docking, and the second semiconductor device is a docking device that actively performs a docking operation.

[0032] Semiconductor equipment can report equipment status information to MES through the EAP equipment automation module (abbreviated as EAP) in accordance with SEMI-related protocols. MES manages equipment and products based on the equipment status information.

[0033] In the above embodiment, the device status information is used to characterize one or more of the device online status, device port status and device processing status. As an example, the device online status is used to indicate that the first semiconductor device is in the Online status or the Offline status; the device port status is used to indicate the port status of the Port (i.e., port) of the first semiconductor device, and the port of the first semiconductor device includes, for example, one or more of the Read To Load port, the Carrier port, the Read To Unload port and the Remove port; the device processing status is used to indicate that the first semiconductor device is in the Idel idle processing state or the Ready ready processing state.

[0034] In the above embodiment, the sensor signal is used to determine whether there is material on the port of the first semiconductor device. For example, the first semiconductor device may be provided with one or more port sensors, and the port sensor is used to detect whether there is material on the port of the first semiconductor device to generate a sensor signal. Specifically, a port sensor (i.e., port sensor) may be provided on the Port of the first semiconductor device to determine whether there is material on the Port of the first semiconductor device. The port sensor includes, for example, a photoelectric detection sensor and / or a press detection sensor. The port sensor can perform signal conversion through a voltage loop, and a loop is connected in parallel to the voltage loop to connect to the control module, so that the On (material) state or Off (no material) state of the Port sensor of the current device (i.e., the first semiconductor device) can be collected.

[0035] It can be seen that the above embodiment adds a control module, the control module can collect the sensor signal of the first semiconductor device, and the control module can collect the device status information reported by the first semiconductor device to the EAP. Specifically, when the first semiconductor device reports the current device status information to the EAP, the EAP can synchronously feed back the device status information to the control module. The control module synchronously collects the sensor signal and the device status information and performs logical judgment, and reserves a communication interface as a safe signal docking bridge with other semiconductor devices (for example, the second semiconductor device), and performs signal docking with other semiconductor devices, so that other semiconductor devices can safely load and unload materials on the first semiconductor device. In other words, without modifying the first semiconductor device (that is, neither the software nor the hardware is modified), by adding a control module, the first semiconductor device and the second semiconductor device can be automatically docked, thereby improving the degree of automation of the wafer manufacturing plant. In this way, by adding a control module, the device status information of the first semiconductor device is obtained by using the current system logic, and a safe and reliable device docking modification can be achieved without modifying the relevant programs of the first semiconductor device.

[0036] In practical applications, the second semiconductor device can be a mobile device (for example, an AMHS automatic transport device) or a fixed-position device (for example, a Robot). The above embodiments do not limit the device type of the second semiconductor device, and can realize the loading and unloading docking transformation between the first semiconductor device and the second semiconductor device.

[0037] See also Figure 2 , Figure 2 It is a structural schematic diagram of a semiconductor device docking system provided in an embodiment of the present application (the second semiconductor device is a mobile device).

[0038] In some embodiments, the second semiconductor device may be a mobile device, and the second semiconductor device is used to send a docking signal to the control module after receiving a transport command from the MES manufacturing execution module. The controlling the second semiconductor device to achieve loading docking and / or unloading docking with the first semiconductor device may include: receiving the docking signal to allow the second semiconductor device to perform a loading docking action and / or unloading docking action with the first semiconductor device.

[0039] In some embodiments, the restricting the second semiconductor device from achieving loading docking and / or unloading docking with the first semiconductor device may include: rejecting the docking signal so as not to allow the second semiconductor device to perform loading docking and / or unloading docking actions with the first semiconductor device.

[0040] In the above embodiment, the first semiconductor device is docked with a mobile device (i.e., a position mobile device) for safe loading and unloading. The mobile device is, for example, an AMHS automatic handling device (abbreviated as AMHS), but is not limited to AMHS. AMHS may include an AGV automatic guided vehicle (abbreviated as AGV), an OHT overhead crane handling device (abbreviated as OHT), etc., which is not limited in the above embodiment. The control module can be used to receive or reject the docking signal of the mobile device. As an example, the transport command of the mobile device can come from MES.

[0041] like Figure 2 As shown, the first semiconductor device can be used as the main device, and the second semiconductor device is, for example, AMHS. The main device and AMHS are two independent devices. The control module can be attached to the first semiconductor device or can be independently set, and the above embodiment does not limit this. The control module can include a PC control unit and a PLC control unit. In this case, the control module can be called a PC+PLC control system (can be referred to as PC+PLC). As an example, if the loading and unloading docking between AMHS and the main device is to be achieved, the main device can report the port status of the Read To Load port and / or the Read To Unload port to EAP (①), and EAP synchronously feeds back the port status of the Read To Load port and / or the Read To Unload port to the control module (②), and EAP can also synchronously send the port status of the Read To Load port and / or the Read To Unload port to MES (③), and MES processes the corresponding information and sends a transport command to AMHS (④). For example, E84 wireless communication (⑤) is used between AMHS and the control module. When AMHS performs loading and unloading operations on the main device, AMHS can send a docking signal to the control module. The control module can collect the sensor signal of the Port sensor of the main device in real time (⑥), and collect the device status information of the main device in real time. When the status is correct, it receives the docking signal of AMHS to allow AMHS to perform loading and unloading actions (⑦). When the status is incorrect, it rejects the docking signal of AMHS and does not allow AMHS to perform loading and unloading actions, thereby ensuring the safety of device docking.

[0042] As an example, the main device Port has materials ready to be unloaded. At this time, the AMHS has generated a transport command, but the materials have been manually moved away and new materials are being processed. At this time, the main device reports the equipment processing status (used to indicate the material processing status) to the EAP, and the EAP feeds back the equipment processing status to the control module. At this time, the control module does not allow the AMHS to dock. Specifically, when the AMHS docks, the docking signal is rejected by the control module, and the docking operation is not allowed to be implemented to ensure the safety of the equipment.

[0043] See also Figure 3 , Figure 3 It is a structural schematic diagram of a semiconductor device docking system provided in an embodiment of the present application (the second semiconductor device is a fixed position device).

[0044] In some embodiments, the second semiconductor device may be a fixed-position device, and controlling the second semiconductor device to achieve loading and / or unloading docking with the first semiconductor device may include: generating an action command for the second semiconductor device so that the second semiconductor device performs a loading and / or unloading docking action with the first semiconductor device after receiving the action command.

[0045] In some embodiments, restricting the second semiconductor device from achieving loading and unloading docking with the first semiconductor device may include: not generating an action command for the second semiconductor device.

[0046] like Figure 3 As shown, the main device needs to be docked with a fixed-position device, for example, a new Robot is added to replace manual loading and unloading. The control module (for example, PC+PLC) is used to collect the device status information of the main device fed back by the EAP, and the sensor signal of the Port sensor of the main device, and determine the docking status of the main device based on the device status information and the sensor signal. When the control module determines that the docking status of the main device is correct, it generates an action command for the Robot to control the Robot to achieve safe docking.

[0047] An embodiment of the present application also provides a control module, which is used to: receive device status information of a first semiconductor device from an EAP device automation module, and receive a sensor signal from the first semiconductor device; the device status information is used to characterize one or more of the device online status, device port status and device processing status; the sensor signal is used to determine whether there is material on the port of the first semiconductor device; determine the docking status of the first semiconductor device based on the device status information and the sensor signal; the docking status is a correct status or an incorrect status; when the docking status is a correct status, control the second semiconductor device to achieve loading docking and / or unloading docking with the first semiconductor device.

[0048] In some embodiments, the control module may also be used to: when the docking state is incorrect, restrict the second semiconductor device from achieving loading docking and / or unloading docking with the first semiconductor device.

[0049] The above embodiments do not limit the functional design and structural design of the control module. In some embodiments, the control module may include a PC control unit and a PLC control unit. In this case, the control module may be referred to as a PC+PLC control system. The PC control unit is used to receive the device status information of the first semiconductor device from the EAP device automation module. The PLC control unit is used to receive the device status information of the first semiconductor device from the PC control unit and the sensor signal from the first semiconductor device; determine the docking state of the first semiconductor device according to the device status information and the sensor signal; and control the second semiconductor device to achieve loading docking and / or unloading docking with the first semiconductor device when the docking state is correct.

[0050] In some embodiments, the PLC control unit may also be used to: when the docking state is incorrect, restrict the second semiconductor device from achieving loading docking and / or unloading docking with the first semiconductor device.

[0051] The PC control unit (abbreviated as PC) and the PLC control unit (abbreviated as PLC) can be integrated into one or independently configured, and the above embodiment does not limit this. In the above embodiment, the PLC is used to collect sensor signals on the main device, and the PC is used to collect status feedback data (i.e., device status information) reported by the main device to the EAP. On this basis, it can be achieved that when the main device reports the current device status information to the EAP, the EAP synchronously feeds back the device status information to the PC+PLC control system. The PC in the PC+PLC control system writes the acquired device status information into the PLC, and the PLC synchronously collects the sensor signals of the main device and the device status information acquired by the PC. The PLC reserves a communication interface with the second semiconductor device as a safe signal docking bridge with the second semiconductor device. After signal docking with the second semiconductor device, the second semiconductor device can safely load and unload materials onto the main device.

[0052] The embodiment of the present application also provides a semiconductor device docking system, the system includes a first semiconductor device, a second semiconductor device, an EAP device automation module and a control module. The EAP device automation module is used to receive device status information of the first semiconductor device; the device status information is used to characterize one or more of the device online status, device port status and device processing status. The control module is used to receive the device status information of the first semiconductor device from the EAP device automation module, and to receive a sensor signal from the first semiconductor device; the sensor signal is used to determine whether there is material on the port of the first semiconductor device; according to the device status information and the sensor signal, determine the docking state of the first semiconductor device; the docking state is a correct state or an incorrect state; when the docking state is a correct state, control the second semiconductor device to achieve loading docking and / or unloading docking with the first semiconductor device.

[0053] like Figure 2 As shown, in some embodiments, the second semiconductor device may be a mobile device, and the system further includes an MES manufacturing execution module. The MES manufacturing execution module may be used to generate a transport command for the second semiconductor device after receiving the device status information of the first semiconductor device from the EAP device automation module. The second semiconductor device is used to send a docking signal to the control module after receiving the transport command. The control module may be used to control the second semiconductor device to achieve loading docking and / or unloading docking with the first semiconductor device in the following manner: receiving the docking signal to allow the second semiconductor device to perform a loading docking action and / or unloading docking action with the first semiconductor device.

[0054] In some embodiments, the mobile equipment may be an AMHS automatic transport equipment, wherein the AMHS automatic transport equipment includes, for example, an AGV automatic guided vehicle and / or an OHT overhead crane transport equipment, which is not limited in the above embodiments.

[0055] like Figure 3 As shown, in some embodiments, the second semiconductor device may be a fixed position device. The control module may be used to control the second semiconductor device to achieve loading docking and / or unloading docking with the first semiconductor device in the following manner: generating an action command for the second semiconductor device, so that the second semiconductor device performs a loading docking action and / or unloading docking action with the first semiconductor device after receiving the action command.

[0056] In some embodiments, the position fixing device may be a Robot.

[0057] In some embodiments, the first semiconductor device may be provided with a port sensor, and the port sensor is used to detect whether there is material on the port of the first semiconductor device to generate the sensor signal.

[0058] It should be noted that each embodiment in the present application is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the product embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0059] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0060] It will be understood that when an element such as a layer, film, region, or substrate is referred to as being “on” or “under” another element, it can be “directly on” or “under” the other element or intervening elements may be present.

[0061] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0062] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A semiconductor device docking method, characterized in that: Applied to a control module, the method comprises: Receiving device status information of a first semiconductor device from an EAP device automation module, and receiving a sensor signal from the first semiconductor device; the device status information is used to characterize one or more of a device online status, a device port status, and a device processing status; the sensor signal is used to determine whether there is material on a port of the first semiconductor device; Determine a docking state of the first semiconductor device according to the device state information and the sensor signal; the docking state is a correct state or an incorrect state; When the docking state is correct, the second semiconductor device is controlled to achieve loading docking and / or unloading docking with the first semiconductor device.

2. The semiconductor device docking method according to claim 1, characterized in that: The second semiconductor device is a mobile device, and the second semiconductor device is used to send a docking signal to the control module after receiving a transport command from the MES manufacturing execution module; The controlling the second semiconductor device to achieve loading docking and / or unloading docking with the first semiconductor device includes: The docking signal is received to allow the second semiconductor device to perform a loading docking action and / or a unloading docking action with the first semiconductor device.

3. The semiconductor device docking method according to claim 1, characterized in that: The second semiconductor device is a fixed position device, and the controlling the second semiconductor device to achieve loading docking and / or unloading docking with the first semiconductor device includes: An action command for the second semiconductor device is generated so that the second semiconductor device performs a loading docking action and / or a unloading docking action with the first semiconductor device after receiving the action command.

4. A control module, characterized in that: The control module is used for: Receiving device status information of a first semiconductor device from an EAP device automation module, and receiving a sensor signal from the first semiconductor device; the device status information is used to characterize one or more of a device online status, a device port status, and a device processing status; the sensor signal is used to determine whether there is material on a port of the first semiconductor device; Determine a docking state of the first semiconductor device according to the device state information and the sensor signal; the docking state is a correct state or an incorrect state; When the docking state is correct, the second semiconductor device is controlled to achieve loading docking and / or unloading docking with the first semiconductor device.

5. The control module according to claim 4, characterized in that: The control module includes a PC control unit and a PLC control unit; The PC control unit is used to receive device status information of the first semiconductor device from the EAP device automation module; The PLC control unit is used to receive device status information of the first semiconductor device from the PC control unit and a sensor signal from the first semiconductor device; determine the docking state of the first semiconductor device according to the device status information and the sensor signal; and control the second semiconductor device to achieve loading docking and / or unloading docking with the first semiconductor device when the docking state is correct.

6. A semiconductor device docking system, characterized in that: The system includes a first semiconductor device, a second semiconductor device, an EAP device automation module, and a control module; The EAP device automation module is used to receive device status information of the first semiconductor device; the device status information is used to represent one or more of a device online status, a device port status, and a device processing status; The control module is used to receive device status information of the first semiconductor device from the EAP device automation module, and to receive a sensor signal from the first semiconductor device; the sensor signal is used to determine whether there is material on the port of the first semiconductor device; the docking status of the first semiconductor device is determined based on the device status information and the sensor signal; the docking status is a correct status or an incorrect status; when the docking status is a correct status, the second semiconductor device is controlled to achieve loading docking and / or unloading docking with the first semiconductor device.

7. The semiconductor device docking system according to claim 6, characterized in that: The second semiconductor device is a mobile device, and the system further includes an MES manufacturing execution module; The MES manufacturing execution module is used to generate a transport command for the second semiconductor device after receiving the device status information of the first semiconductor device from the EAP device automation module; The second semiconductor device is used to send a docking signal to the control module after receiving the transport command; The control module is used to control the second semiconductor device to achieve loading docking and / or unloading docking with the first semiconductor device in the following manner: receiving the docking signal to allow the second semiconductor device to perform a loading docking action and / or an unloading docking action with the first semiconductor device.

8. The semiconductor device docking system according to claim 7, characterized in that: The mobile equipment is AMHS automatic transport equipment.

9. The semiconductor device docking system according to claim 6, characterized in that: The second semiconductor device is a position-fixed device; The control module is used to control the second semiconductor device to achieve loading and / or unloading docking with the first semiconductor device in the following manner: generate an action command for the second semiconductor device so that the second semiconductor device performs a loading and / or unloading docking action with the first semiconductor device after receiving the action command.

10. The semiconductor device docking system according to claim 6, characterized in that: The first semiconductor device is provided with a port sensor, and the port sensor is used to detect whether there is material on the port of the first semiconductor device to generate the sensor signal.

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