Electronic device including antenna module

Abstract

According to an embodiment, an electronic device may include a first housing including a first plate, a second housing including a second plate, a display disposed on the first plate of the first housing and the second plate of the second housing, a hinge member disposed between the first housing and the second housing and rotatably connecting the first housing and the second housing, and an antenna module disposed in the first housing. The first plate may include an antenna seating portion on which the antenna module is seated. The antenna seating portion may extend vertically from one surface of the first plate and be formed between a first side wall portion and a second side wall portion facing each other. The antenna module may be disposed such that at least a portion of the antenna module faces the first sidewall portion and the second sidewall portion. The first side wall part comprises a concave-convex structure. Various other embodiments identified by the present specification are possible.

Description

Technical Field

[0001] The present disclosure relates to a foldable electronic device including an antenna module. Background Art

[0002] Due to the rapid increase in mobile traffic, 5th generation (5G) technology based on high-bandwidth frequencies is being developed. High-band frequency signals may include millimeter waves (mmWave) having a frequency band of 20 gigahertz (GHz) to 300 GHz.

[0003] The housing structure of the foldable electronic device may include a first housing and a second housing connected by a hinge structure. The foldable electronic device may be folded and / or unfolded by rotating the first housing and the second housing around the hinge structure. The foldable electronic device may include one or more high-frequency antenna modules (e.g., mmWave antenna modules) for 5G communication.

[0004] The above information is presented as background information only to assist with an understanding of the present disclosure. No determination has been made, and no assertion is made, as to whether any of the above might be applicable as prior art with respect to the present disclosure. Summary of the invention

[0005] Aspects of the present disclosure are to address at least the above-mentioned problems and / or disadvantages and to provide at least the advantages described below. Therefore, one aspect of the present disclosure is to provide a foldable electronic device including an antenna module.

[0006] Additional aspects will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the presented embodiments.

[0007] Technical Solution According to one aspect of the present disclosure, an electronic device is provided. The electronic device includes: a first shell including a first plate, a second shell including a second plate, a display arranged on the first plate of the first shell and the second plate of the second shell, a hinge member arranged between the first shell and the second shell and configured to rotatably connect the first shell and the second shell, and an antenna module arranged in the first shell. The first plate includes an antenna placement portion, and the antenna module is placed on the antenna placement portion. The antenna placement portion is formed between a first side wall portion and a second side wall portion, and the first side wall portion and the second side wall portion extend vertically from a surface of the first plate and face each other. The antenna module is arranged so that at least a portion faces the first side wall portion and the second side wall portion. The first side wall portion includes a concave-convex structure.

[0008] Other aspects, advantages, and salient features of the present disclosure will become apparent to those skilled in the art from the following detailed description which, in conjunction with the accompanying drawings, discloses various embodiments of the present disclosure.

[0009] Beneficial Effects According to an embodiment of the present disclosure, a concavo-convex structure may be formed on a metal housing structure facing the antenna module, thereby reducing an area where the antenna module and the housing structure overlap each other, and ensuring and / or improving performance of the antenna module. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 is a view showing an unfolded state of an electronic device according to an embodiment of the present disclosure; Figure 2 is a view showing a folded state of an electronic device according to an embodiment of the present disclosure; Figure 3 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure; Figure 4 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure; Figure 5a is a view showing a first housing and a second housing of an electronic device according to an embodiment of the present disclosure; Figure 5b is a view showing a first housing, a second housing, and a connecting member of an electronic device according to an embodiment of the present disclosure; Figure 6 is a plan view of an electronic device according to an embodiment of the present disclosure; Figure 7 is a cross-sectional view of an electronic device according to an embodiment of the present disclosure; Figure 8 is a view showing an arrangement structure of a connection member according to an embodiment of the present disclosure; Fig. 9 is a view showing an arrangement structure of a connection member according to an embodiment of the present disclosure; Fig.10 is a view showing a first housing of an electronic device according to an embodiment of the present disclosure; Fig.11 is a view showing a first housing, a first circuit board, and an antenna module of an electronic device according to an embodiment of the present disclosure; Fig.12 is a view showing a first housing and a rear case of an electronic device according to an embodiment of the present disclosure; Fig.13a is a cross-sectional view of a portion of an electronic device according to an embodiment of the present disclosure; Fig.13b is another form of a cross-sectional view of a portion of an electronic device according to an embodiment of the present disclosure; Fig.14 A portion of an electronic device according to an embodiment of the present disclosure is shown provided with a first through hole and a first connecting member; Fig.15 is a view showing an antenna module of an electronic device according to an embodiment of the present disclosure; Fig.16 is a view showing an arrangement structure of an antenna module of an electronic device according to an embodiment of the present disclosure; Fig.17 is a block diagram of an electronic device in a network environment according to an embodiment of the present disclosure; and Fig.18 is a block diagram of an electronic device for supporting traditional network communication and 5G network communication according to an embodiment of the present disclosure.

[0011] Throughout the drawings, like reference numerals will be understood to refer to like parts, components and structures. DETAILED DESCRIPTION

[0012] The following description with reference to the accompanying drawings is provided to assist in a comprehensive understanding of the various embodiments of the present disclosure as defined by the claims and their equivalents. It includes various specific details to assist in understanding, but these details should be considered as merely exemplary. Therefore, it will be appreciated by those of ordinary skill in the art that the various embodiments described herein may be changed and modified without departing from the scope and spirit of the present disclosure. In addition, for the sake of clarity and brevity, the description of well-known functions and recesses may be omitted.

[0013] The terms and words used in the following description and claims are not limited to the bibliographical meanings, but are merely used by the inventor to enable a clear and consistent understanding of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of the present disclosure is provided for illustrative purposes only and not for the purpose of limiting the present disclosure as defined by the appended claims and their equivalents.

[0014] It will be understood that singular forms include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a component surface" includes reference to one or more of such surfaces.

[0015] Figure 1 2 is a view illustrating an unfolded state of an electronic device according to an embodiment of the present disclosure. Figure 2 is a view illustrating a folded state of an electronic device according to an embodiment of the present disclosure.

[0016] Reference Figure 1 and Figure 2 , the electronic device according to the embodiment may include case structures 110 and 120 , a display 130 (or a flexible display), a back cover 140 , and a hinge cover 155 .

[0017] The electronic device 100 may be deformable into an unfolded state (eg, Figure 1 state) and collapsed state (for example, Figure 2 For example, the electronic device 100 may include a pair of housing structures 110 and 120 coupled to each other so as to be rotatable relative to each other, a hinge cover 155 covering the foldable portions of the housing structures 110 and 120, and a display 130 disposed in a space formed by the housing structures 110 and 120.

[0018] In an embodiment of the present disclosure, a surface formed or defined by the display 130 based on the unfolded state of the electronic device 100 may be defined as the front surface of the electronic device 100, and a surface facing away from the front surface may be defined as the rear surface of the electronic device 100. In addition, a surface surrounding a space between the front surface and the rear surface may be defined as a side surface of the electronic device 100.

[0019] The housing structures 110 and 120 may include a first housing 110 and a second housing 120. The first housing 110 and the second housing 120 may be folded or unfolded relative to each other around a virtual folding axis F. The first housing 110 and the second housing 120 may be connected by a hinge structure (e.g., Figure 3 The first housing 110 and the second housing 120 are connected by a hinge structure 151 so as to be rotatable relative to each other and can be folded or unfolded by rotating around their rotation axis. For example, the rotation axis of the first housing 110 and the second housing 120 can be formed by the hinge structure 151.

[0020] The first shell 110 and the second shell 120 may be arranged on opposite sides relative to the folding axis F, and may have a shape that is substantially symmetrical relative to the folding axis F. The angle or distance between the first shell 110 and the second shell 120 may vary depending on whether the electronic device 100 is in an unfolded state (or an open state), a folded state (or a closed state), or an intermediate state. According to various embodiments of the present disclosure, the first shell 110 and the second shell 120 may have an asymmetrical shape relative to the folding axis F. For example, when the electronic device 100 is in a folded state, the first shell 110 and the second shell 120 may have different sizes, or may be folded in an asymmetrical form around the folding axis F so that a portion of the display 130 is exposed outside the electronic device 100.

[0021] The first housing 110 may include a first camera area 113. For example, the first camera area 113 for the function of the camera may be formed or provided in the first housing 110. The first camera area 113 may be located on a partial area of ​​the display 130 or may overlap with a partial area of ​​the display 130. According to various embodiments of the present disclosure, in addition to or instead of the first camera area 113 of the first housing 110, the first camera area 113 may be provided in the second housing 120. A camera (not shown) may be visually exposed through the first camera area 113. For example, the camera exposed through the first camera area 113 may include a perforated camera provided in a hole or groove formed in the display 130. According to various embodiments of the present disclosure, the camera may be provided below the display 130 (e.g., an under-screen camera (UDC)) so as not to be exposed outside the electronic device 100.

[0022] The first housing 110 may include a first surface 111a on which a partial area (e.g., a first area 131) of the display 130 is disposed, a second surface 111b facing away from the first surface 111a and on which the first rear cover 141 is disposed, and a first side member 112 surrounding the periphery of the first surface 111a and the second surface 111b. The first side member 112 may include a first side surface 112a extending substantially parallel to the folding axis F, a second side surface 112b extending from one end of the first side surface 112a in a direction substantially perpendicular to the folding axis F, and a third side surface 112c extending from an opposite end of the first side surface 112a in a direction substantially perpendicular to the folding axis F.

[0023] The second housing 120 may include a third surface 121a on which a partial area (e.g., the second area 132) of the display 130 is disposed, a fourth surface 121b facing away from the third surface 121a and on which the second back cover 142 is disposed, and a second side member 122 surrounding the periphery of the third surface 121a and the fourth surface 121b. The second side member 122 may include a fourth side surface 121a extending substantially parallel to the folding axis F, a fifth side surface 121b extending from one end of the fourth side surface 121a in a direction substantially perpendicular to the folding axis F, and a sixth side surface 121c extending from an opposite end of the fourth side surface 121a in a direction substantially perpendicular to the folding axis F.

[0024] The first housing 110 and the second housing 120 may be at least partially formed of a metal material or a non-metal material. At least a portion of the first housing 110 and at least a portion of the second housing 120 may be formed of a metal or non-metal material having a specified rigidity to support the display 130 .

[0025] The display 130 may be disposed in a space formed by the first housing 110 and the second housing 120. For example, the display 130 may be disposed in a display accommodating portion formed by the first surface 111a and the first side member 112 of the first housing 110 and the third surface 121a and the second side member 122 of the second housing 120. The display accommodating portion may have substantially the same shape or size as the display 130. The display accommodating portion may be formed on the first surface 111a of the first housing 110 and the third surface 121a of the second housing 120. For example, the display 130 may be placed on the first surface 111a of the first housing 110 and the third surface 121a of the second housing 120. The display 130 may be configured to substantially form or define a majority of the front surface of the electronic device 100.

[0026] In response to the folding or unfolding operation of the electronic device 100, the display 130 may be deformed so that a partial area (e.g., the folding area 133) substantially forms a flat surface or a curved surface. For example, the display 130 may be a flexible display. The display 130 may include the folding area 133 that is deformed as the state of the electronic device 100 is changed, the folding area 133 that is deformed from one side (e.g., based on the folding area 133) and the folding area 133 that is deformed from the other side (e.g., based on the folding area 133). Figure 1 The first area 131 extending from the right side of the folding area 133 (for example, based on Figure 1 The shapes of the first region 131 and the second region 132 may be maintained without deformation regardless of the folding or unfolding operation of the electronic device 100. For example, the first region 131 and the second region 132 may remain substantially flat.

[0027] The first area 131 , the second area 132 , and the folding area 133 of the display 130 may be divided from each other based on whether the shape is deformed when the folding operation of the display 130 is performed, and this does not mean that the areas are physically divided or separated from each other or have different characteristics.

[0028] The rear cover 140 may form the exterior of the electronic device 100 together with the case structures 110 and 120. For example, when the electronic device 100 is in an unfolded state, the rear cover 140 may form the rear surface of the electronic device 100. The rear cover 140 may include a first rear cover 141 and a second rear cover 142.

[0029] The first back cover 141 may be coupled to the first housing 110. For example, the first back cover 141 may be disposed on the second surface 111b of the first housing 110. The first back cover 141 may have a substantially rectangular periphery, and at least a portion of the periphery may be surrounded by the first side member 112 of the first housing 110. The first housing 110 and the first back cover 141 may be coupled to each other to provide a space for disposing various components of the electronic device 100 (e.g., a printed circuit board, an antenna module, a sensor module, or a battery).

[0030] The second back cover 142 may be coupled to the second housing 120. For example, the second back cover 142 may be disposed on the fourth surface 121b of the second housing 120. The second back cover 142 may have a substantially rectangular periphery, and at least a portion of the periphery may be surrounded by the second side member 122 of the second housing 120. The second housing 120 and the second back cover 142 may be coupled to each other to provide a space for disposing various components of the electronic device 100 (e.g., a printed circuit board, an antenna module, a sensor module, or a battery).

[0031] Areas in which one or more components are disposed or one or more components are visually exposed may be formed on the first back cover 141 and the second back cover 142. A second camera area 145 in which a camera is disposed or exposed may be formed on the first back cover 141. A cover display area 143 in which a cover display 187 disposed on the rear surface of the second back cover 142 (e.g., between the fourth surface 121b of the second housing 120 and the second back cover 142) is visually exposed may be formed on the second back cover 142. For example, the cover display area 143 of the second back cover 142 may be formed to be transparent so that at least a portion of the cover display 187 is visible. A third camera area 144 in which a camera is disposed or exposed may be formed on the second back cover 142. For example, the camera exposed through the third camera area 144 may include a perforated camera disposed in a hole or groove formed in the cover display 187.

[0032] The hinge cover 155 may be disposed between the first housing 110 and the second housing 120 and may cover the hinge structure (eg, Figure 3 and Figure 4 The hinge structure 151 is not exposed to the outside.

[0033] Depending on the operating state (expanded state or folded state) of the electronic device 100, the hinge cover 155 may be hidden by the first housing 110 and the second housing 120, or may be partially exposed outside the housing structures 110 and 120. For example, when the electronic device 100 is in the expanded state, the hinge cover 155 may be hidden by the first housing 110 and the second housing 120, and may not be exposed outside the electronic device 100. In addition, when the electronic device 100 is in the folded state (e.g., the fully folded state), the hinge cover 155 may be exposed outside the electronic device 100 from between the first housing 110 and the second housing 120. In addition, when the electronic device 100 is in the intermediate folded state where the first housing 110 and the second housing 120 are folded at a certain angle, the hinge cover 155 may be partially exposed outside the electronic device 100 from between the first housing 110 and the second housing 120. An area of ​​the hinge cover 155 exposed to the outside of the electronic device 100 in the intermediate folded state may be smaller than an area of ​​the hinge cover 155 exposed in the fully folded state. The hinge cover 155 may at least partially include a curved surface.

[0034] Hereinafter, operations of the first housing 110 and the second housing 120 depending on the state (eg, the unfolded state and the folded state) of the electronic device 100 and the state of the area of ​​the display 130 will be described.

[0035] When the electronic device 100 is in the unfolded state (for example, Figure 1 ), the first shell 110 and the second shell 120 may form the same plane while substantially forming an angle of 180 degrees. The first area 131 and the second area 132 of the display 130 may be set to face the same direction. The folding area 133 of the display 130 may form a plane substantially the same as the first area 131 and the second area 132. In the unfolded state, the first area 131, the second area 132 and the folding area 133 may provide a screen display area while forming the front surface of the electronic device 100. According to various embodiments of the present disclosure, in the unfolded state, the folding area 133 may be formed as a curved surface with a curvature of a predetermined size or less, but may have a substantially flat shape.

[0036] When the electronic device 100 is in a folded state (fully folded state) (eg, Figure 2 ), the first housing 110 and the second housing 120 may be arranged to face each other. The first area 131 and the second area 132 of the display 130 may face each other while forming a narrow angle (e.g., between 0 degrees and 10 degrees). At least a portion of the folding area 133 may be formed as a curved surface having a curvature of a specified size or greater.

[0037] When the electronic device 100 is in an intermediate state between the unfolded state and the folded state (e.g., an intermediate folded state), the first housing 110 and the second housing 120 may be set to be at a certain angle. The intermediate state may refer to a state in which the electronic device 100 is in the process of being changed between the unfolded state and the folded state. For example, the intermediate state may refer to a state before the first housing 110 and the second housing 120 are fully unfolded or folded. The angle between the first area 131 and the second area 132 of the display 130 in the intermediate state may be greater than the angle in the folded state, and may be smaller than the angle in the unfolded state. At least a portion of the folding area 133 may be formed as a curved surface having a predetermined curvature, and the curvature may be smaller than the curvature in the folded state and may be greater than the curvature in the unfolded state.

[0038] according to Figure 1 and Figure 2 The electronic device 100 of the illustrated embodiment may be an inner-folding electronic device in which the display 130 is folded inwardly, so that the display 130 is not exposed outside the electronic device 100 in the folded state. However, the electronic device according to the embodiment of the present disclosure is not limited to the illustrated embodiment. According to various embodiments of the present disclosure, the electronic device may be an outer-folding electronic device in which the display 130 is folded outwardly, so that the display 130 is visually exposed outside the electronic device in the folded state. In addition, according to various embodiments of the present disclosure, the electronic device may be a multi-folding electronic device that combines inner folding and outer folding.

[0039] Figure 3 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure. Figure 4 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.

[0040] Figure 4 is shown in the settings Figure 3 An exploded perspective view of a state in which other components in the housing structure are disassembled.

[0041] Reference Figure 3 and Figure 4 According to an embodiment, the electronic device 100 may include a first shell 110, a second shell 120, a display 130, a back cover 140, a hinge member 150, a circuit board 160, a connecting member 170, support members (e.g., a back shell) 181 and 182, a cover display 187, a battery 184 and an antenna 183. Figure 3 and Figure 4 Some components of the electronic device 100 shown in FIG. Figure 1 and Figure 2 Components of the described electronic device 100 are the same or similar, and repeated descriptions will be omitted hereinafter.

[0042] The case structures 110 and 120 may include plates (eg, plate structures) 111 and 121 and side members (eg, side frame structures or side frame structures) 112 and 122 .

[0043] The first housing 110 may include a first plate 111 and a first side member 112 surrounding at least a portion of the periphery of the first plate 111. For example, the first side member 112 may surround the rest of the periphery of the first plate 111 except for a portion of the periphery of the first plate 111 facing the second housing 120 (e.g., an edge portion facing the +x-axis direction). The first plate 111 may include a first surface 111a provided with a display 130 and a second surface 111b facing away from the first surface 111a. In the illustrated embodiment of the present disclosure, the first surface 111a may face the +z-axis direction, and the second surface 111b may face the -z-axis direction. The first plate 111 may be connected to or integrally formed with the first side member 112. For example, the first housing 110 may include a first upper surface 110_up facing the rear surface of the display 130 (e.g., a surface facing the -z-axis direction), a first lower surface 110_dw corresponding to the rear side of the first upper surface 110_up, and a first side portion 110a, a second side portion 110b, a third side portion 110c, and a fourth side portion 110d disposed to protrude from the periphery of the first upper surface 110_up toward the display 130. The first side portion 110a may be disposed adjacent to the second housing 120, or may be coupled to the second housing 120 through a hinge member 150. The protruding height of the first side portion 110a in the z-axis direction (or the direction toward the display 130) may be different from the protruding heights of the other side portions (e.g., the second side portion 110b, the third side portion 110c, and the fourth side portion 110d) in the z-axis direction. For example, the protruding height of the first side portion 110a in the z-axis direction may be smaller than the protruding height of the second side portion 110b (or, the third side portion 110c) in the z-axis direction. Optionally, the first side portion 110a may have a shape that is open in the -x-axis direction based on the second side portion 110b, the third side portion 110c, and the fourth side portion 110d that protrude a predetermined height in the z-axis direction. The first side portion 110a and the fourth side portion 110d may be disposed in parallel with each other with a predetermined gap therebetween, and the second side portion 110b and the third side portion 110c may be disposed in parallel with each other with a predetermined gap therebetween. The second side portion 110b may be disposed on the upper side (e.g., the edge facing the y-axis direction) of the first side portion 110a and the fourth side portion 110d, and the third side portion 110c may be disposed on the lower side (e.g., the edge facing the -y-axis direction) of the first side portion 110a and the fourth side portion 110d. The antenna module (e.g., Figure 7 The antenna module 200 of the first housing 110 may be disposed adjacent to the first side portion 110a of the first housing 110. A through hole (eg, a through hole described below) through which the connection member 170 is disposed Figure 5a or Figure 5b The first through hole h1 of the first housing 110 may be disposed adjacent to the first side portion 110a of the first housing 110. For example, the antenna module 200 may be disposed between the first through hole h1 and the hinge cover 155 (or a second side wall portion (eg, a second side wall portion described below) formed on the first side portion 110a). Fig.10 between the second side wall portions 116)).

[0044] The second housing 120 may include a second plate 121 and a second side member 122 surrounding at least a portion of the periphery of the second plate 121. For example, the second side member 122 may surround the rest of the periphery of the second plate 121 except for a portion of the periphery facing the first housing 110 (e.g., an edge portion facing the -x axis direction). The second plate 121 may include a third surface 121a provided with a display 130 and a fourth surface 121b facing away from the third surface 121a. In the illustrated embodiment of the present disclosure, the third surface 121a may face the +z axis direction, and the fourth surface 121b may face the -z axis direction. The second plate 121 may be connected to or integrally formed with the second side member 122. For example, the second housing 120 may include a second upper surface 120_up, a second lower surface 120_dw, and a fifth side portion 120a, a sixth side portion 120b, a seventh side portion 120c, and an eighth side portion 120d, wherein the second upper surface 120_up faces the rear surface of the display 130 (e.g., a surface facing the -z axis direction) and is disposed to face the same direction as the first upper surface 110_up when the electronic device 100 is in the unfolded state, the second lower surface 120_dw corresponds to the rear side of the second upper surface 120_up, and the fifth side portion 120a, the sixth side portion 120b, the seventh side portion 120c, and the eighth side portion 120d are disposed to protrude from the periphery of the second upper surface 120_up toward the display 130. The fifth side portion 120a may be disposed adjacent to the first housing 110, or may be coupled to the first housing 110 through the hinge member 150. The protruding height of the fifth side portion 120a in the z-axis direction (or in the direction toward the display 130) may be different from the protruding heights of other side portions (e.g., the sixth side portion 120b, the seventh side portion 120c, and the eighth side portion 120d) in the z-axis direction. For example, the protruding height of the fifth side portion 120a in the z-axis direction may be less than the protruding height of the sixth side portion 120b in the z-axis direction. Optionally, similarly to the first side portion 110a, the fifth side portion 120a has a shape that is open in the x-axis direction. The fifth side portion 120a and the eighth side portion 120d may be arranged in parallel to each other with a predetermined gap therebetween, and the sixth side portion 120b and the seventh side portion 120c may be arranged in parallel to each other with a predetermined gap therebetween. The fifth and eighth sides 120a and 120d may correspond to the first and fourth sides 110a and 110d of the first housing 110 , and the sixth and seventh sides 120b and 120c may correspond to the second and third sides 110b and 110c of the first housing 110 .

[0045] The housing structures 110 and 120 may include a hinge recess 188 between the first plate 111 and the second plate 121, and at least a portion of the hinge cover 155 is disposed in the hinge recess 188. The hinge recess 188 may be formed such that at least a portion has a predetermined curvature to correspond to the shape of the hinge cover 155. When the electronic device 100 is in the unfolded state (e.g., Figure 1 , the first support surface 111c and the second support surface 121c can hide the hinge cover 155 by forming a hinge recess 188 to cover the hinge cover 155. The first support surface 111c and the second support surface 121c can move along the curved surface of the hinge cover 155 to a position facing each other to expose the hinge cover 155 to the outside of the electronic device 100.

[0046] The display 130 may be disposed on the first plate 111 of the first housing 110 and the second plate 121 of the second housing 120. The display 130 may be partially supported by the first surface 111a of the first plate 111 and the third surface 121a of the second plate 121. The display 130 may include a first region 131 disposed on the first plate 111, a second region 132 disposed on the second plate 121, and a folding region 133 located between the first region 131 and the second region 132. For example, at least a portion of the first region 131 may be attached to the first surface 111a of the first plate 111, and at least a portion of the second region 132 may be attached to the third surface 121a of the second plate 121.

[0047] The back cover 140 may include a first back cover 141 disposed to face the second surface 111b of the first plate 111 and a second back cover 142 disposed to face the fourth surface 121b of the second plate 121. For example, the first back cover 141 may be disposed below the first plate 111 (e.g., in the −z-axis direction), and the second back cover 142 may be disposed below the second plate 121 (e.g., in the −z-axis direction).

[0048] The first rear cover 141 may be coupled to the first housing 110 to form a predetermined space between the first rear cover 141 and the first board 111, and other components (e.g., the first circuit board 161, the first battery 184a, and the antenna 183) may be accommodated in the predetermined space. The second rear cover 142 may be coupled to the second housing 120 to form a predetermined space between the second rear cover 142 and the second board 121, and other components (e.g., the second circuit board 162, the second battery 184b, and the speakers 185 and 186) may be accommodated in the predetermined space.

[0049] The second camera area 145 may be formed on the first rear cover 141. For example, the second camera area 145 may be formed by a camera decoration member (or, camera decoration), or may be provided in the form of a camera decoration member. The cover display 187 may be provided on one surface of the second rear cover 142. For example, the cover display 187 may be attached to one surface of the second rear cover 142 facing the second board 121 (e.g., a surface facing the +z axis direction), and may be provided between the second rear cover 142 and the second board 121.

[0050] The hinge member 150 may include a hinge structure (or hinge module) 151 and a hinge cover 155. The hinge cover 155 may include an inner space 156 in which at least a portion of the hinge structure 151 is accommodated. The hinge structure 151 may include a first hinge structure 152, a second hinge structure 153, and a third hinge structure 154 arranged in a direction parallel to the folding axis F. For example, the first hinge structure 152 may be disposed adjacent to an edge of the first shell 110 and the second shell 120 facing the +y axis direction. The second hinge structure 153 may be disposed adjacent to an edge of the first shell 110 and the second shell 120 facing the -y axis direction. The third hinge structure 154 may be disposed between the first hinge structure 152 and the second hinge structure 153. However, the illustrated embodiment is illustrative, and according to various embodiments of the present disclosure, the third hinge structure 154 may be omitted.

[0051] The hinge structure 151 may rotatably connect the first housing 110 and the second housing 120. The hinge structure 151 may be disposed between the first housing 110 and the second housing 120, and may be coupled to the first housing 110 and the second housing 120. For example, each of the hinge structures 151 may be configured such that a portion is coupled to the hinge cover 155, and another portion is coupled to the first housing 110 and the second housing 120. The first housing 110 and the second housing 120 may rotate around a rotation axis formed by the hinge structure 151.

[0052] The circuit board 160 may include a first circuit board 161 disposed in the first housing 110 and a second circuit board 162 disposed in the second housing 120. The first circuit board 161 and the second circuit board 162 may be electrically connected by a connection member 170. For example, the circuit board 160 may be a printed circuit board (PCB).

[0053] The first circuit board 161 may be accommodated in a space between the first board 111 and the first back cover 141. The first circuit board 161 may be disposed below the first board 111 (e.g., in the −z-axis direction), and may face a portion of the second surface 111b of the first board 111. For example, the first circuit board 161 may be disposed between the first board 111 and the first supporting member 181, and may be supported by a partial area of ​​the second surface 111b of the first board 111.

[0054] The second circuit board 162 may be accommodated in the space between the second board 121 and the second back cover 142. The second circuit board 162 may be disposed below the second board 121 (e.g., in the −z-axis direction), and may face a portion of the fourth surface 121b of the second board 121. For example, the second circuit board 162 may be disposed between the second board 121 and the second supporting member 182, and may be supported by a partial area of ​​the fourth surface 121b of the second board 121.

[0055] The circuit board 160 may have a processor, a memory, and / or an interface disposed thereon. For example, the processor may include one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. For example, the memory may include a volatile memory or a non-volatile memory. For example, the interface may include a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device 100 to an external electronic device, and may include a USB connector, an SD card / multimedia card (MMC) connector, or an audio connector.

[0056] The connecting member 170 may electrically connect the first circuit board 161 and the second circuit board 162. One end of the connecting member 170 may be connected to the first circuit board 161, and the opposite end of the connecting member 170 may be connected to the second circuit board 162. For example, connectors may be formed on the opposite ends of the connecting member 170. The connecting member 170 may extend in a direction substantially perpendicular to the folding axis F, and may intersect the first housing 110, the hinge cover 155, and the second housing 120. For example, the central portion of the connecting member 170 may extend across the hinge cover 155, and the opposite ends of the connecting member 170 may be connected to the first circuit board 161 disposed on the first board 111 and the second circuit board 162 disposed on the second board, respectively. The connecting member 170 may be formed of a flexible conductive material, and may be moved or deformed in response to the folding and unfolding operation of the electronic device 100. For example, the connecting member 170 may be a flexible printed circuit board (FPCB).

[0057] The connecting member 170 may include a first connecting member 171 and a second connecting member 172. The first connecting member 171 and the second connecting member 172 may be connected to different regions of the first circuit board 161 and the second circuit board 162, respectively. Between the first hinge structure 152 and the third hinge structure 154, the first connecting member 171 may extend across the hinge cover 155. For example, in the inner space 156 of the hinge cover 155, a portion of the first connecting member 171 may be located or accommodated in the space between the first hinge structure 152 and the third hinge structure 154. Between the second hinge structure 153 and the third hinge structure 154, the second connecting member 172 may extend across the hinge cover 155. For example, in the inner space 156 of the hinge cover 155, a portion of the second connecting member 172 may be located or accommodated in the space between the second hinge structure 153 and the third hinge structure 154.

[0058] For example, a first portion of the connecting member 170 may be placed on the first upper surface 110_up (or, the first lower surface 110_dw) of the first housing 110, a second portion of the connecting member 170 may be placed on the hinge cover 155, and a third portion of the connecting member 170 may be placed on the second upper surface 120_up (or, the second lower surface 120_dw) of the second housing 120. The first housing 110 may include at least one through hole through which the connecting member 170 passes. The at least one through hole may be formed to penetrate the first upper surface 110_up and the first lower surface 110_dw in the up / down direction. The at least one through hole of the first housing 110 may be formed adjacent to the first side portion 110a of the first housing 110. A portion of the first portion of the connecting member 170 may be connected to the first circuit board 161 placed between the first lower surface 110_dw of the first housing 110 and the first back cover 141, and another portion of the first portion of the connecting member 170 may be placed on the first upper surface 110_up through the at least one through hole of the first housing 110. Similarly, the second housing 120 may include at least one through hole through which the connecting member 170 passes. The at least one through hole may be formed to penetrate the second upper surface 120_up and the second lower surface 120_dw in the up / down direction. The at least one through hole of the second housing 120 may be formed adjacent to the fifth side portion 120a of the second housing 120. A portion of the third component of the connecting member 170 may be connected to the second circuit board 162 placed between the second lower surface 120_dw of the second housing 120 and the second back cover 142, and another portion of the third component of the connecting member 170 may be placed on the second upper surface 120_up through the at least one through hole of the second housing 120.

[0059] According to an embodiment, the connection member 170 may extend to pass through through holes (eg, Figure 5a and Figure 5b The following will refer to Figure 5a and Figure 5b The structure in which the connection member 170 extends through the through holes h1 , h2 , h3 , and h4 is described in more detail.

[0060] The support members 181 and 182 may be disposed between the circuit board 160 and the back cover 140. The support members 181 and 182 may include a first support member 181 disposed in the first housing 110 and a second support member 182 disposed in the second housing 120. For example, the first support member 181 may be disposed between the first circuit board 161 and the first back cover 141. The second support member 182 may be disposed between the second circuit board 162 and the second back cover 142 or between the second circuit board 162 and the cover display 187.

[0061] One or more antennas 183 may be disposed or formed on the first supporting member 181. Speaker modules 185 and 186 may be disposed on the second supporting member 182. For example, the first speaker module 185 (e.g., upper speaker module) may be disposed on an upper end portion (e.g., +y-axis direction) of the second supporting member 182, and the second speaker module 186 (e.g., lower speaker module) may be disposed on a lower end portion (e.g., -y-axis direction) of the second supporting member 182.

[0062] The battery 184 may be a device for supplying power to at least one component of the electronic device 100. The battery 184 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. The battery 184 may include a first battery 184a disposed in the first housing 110 and a second battery 184b disposed in the second housing 120. The first battery 184a may be coupled to the first circuit board 161, and the second battery 184b may be coupled to the second circuit board 162.

[0063] The antenna (or antenna structure) 183 may be formed by parts of the side members 112 and 122 and / or the support members 181 and 182, or a combination thereof. For example, the antenna 183 may include a first antenna (e.g., an upper antenna) 183a disposed or formed on one side (e.g., the +y-axis direction) of the first support member 181, a second antenna (e.g., a lower antenna) 183b disposed or formed on the opposite side (e.g., the -y-axis direction) of the first support member 181, and a third antenna 183c disposed or formed between the first antenna 183a and the second antenna 183b. The antenna 183 may include an ultra-wideband (UWB) antenna, a near field communication (NFC) antenna, a wireless charging antenna (e.g., an NFC antenna), and / or a magnetic secure transmission (MST) antenna. For example, the antenna 183 may perform short-range communication with an external device, or may wirelessly send and receive power required for charging. Although not described in detail in the accompanying drawings, the antenna 183 may be a wireless charging antenna (e.g., an NFC antenna), and / or a magnetic secure transmission (MST) antenna. Figure 3 and Figure 4 , but the electronic device 100 may further include an antenna module (eg, Figure 7 The following will refer to the antenna module 200. Fig.10 , Fig.11 , Fig.12 , Fig.13a and Fig.13b The arrangement structure of the antenna module 200 is described.

[0064] Figure 5a 2 is a view showing a first housing and a second housing of an electronic device according to an embodiment of the present disclosure. Figure 5b 2 is a view showing a first housing, a second housing, and a connecting member of an electronic device according to an embodiment of the present disclosure.

[0065] Figure 5a of <501> and Figure 5b of <501> is a plan view of the housing structure when the front surfaces of the first housing and the second housing are viewed from above, and Figure 5a of <502> and Figure 5b of <502> It is a plan view of the housing structure when the rear surfaces of the first housing and the second housing are viewed from above. Figure 5b A state in which a connecting member is provided across a portion of the first housing and a portion of the second housing is shown.

[0066] Reference Figure 4 , Figure 5a and Figure 5b , the electronic device 100 according to the embodiment may include a first housing 110 , a second housing 120 , and a connecting member 170 .

[0067] The first housing 110 may include a first plate 111 (or a first frame or a first bracket) and a first side member 112 (e.g., first to fourth side portions 110a, 110b, 110c, and 110d). The first plate 111 may include a first surface 111a (e.g., a front surface or a first upper surface 110_up) and a second surface 111b (e.g., a rear surface or a first lower surface 110_dw) facing away from the first surface 111a. Figure 4 , the first surface 111a may face the display (eg, Figures 1 to 4 130), and the second surface 111b may face the first rear cover (eg, Figure 1 and Figure 2 The first back cover 141) or the first circuit board (eg, Figure 4The first circuit board 161 of the present invention may be a first circuit board 161 of the present invention. For example, the first surface 111a may face the +z-axis direction, and the second surface 111b may face the -z-axis direction. The first side member 112 may surround a portion of the periphery of the first board 111. For example, the first side member 112 may surround edges of the first board 111 that face the +y-axis direction, the -y-axis direction, and the +x-axis direction, respectively. The first edge 111P of the first board 111 (for example, the edge facing the -x-axis direction) may face the second edge 121P of the second board 121 without being surrounded by the first side member 112.

[0068] The second housing 120 may include a second plate 121 (or a second frame or a second bracket) and a second side member 122 (e.g., the fifth to eighth side portions 120a, 120b, 120c, and 120d). The second plate 121 may include a third surface 121a (e.g., a front surface or a second upper surface 120_up) and a fourth surface 121b (e.g., a rear surface or a second lower surface 120_dw) facing away from the third surface 121a. Figure 4 , the third surface 121a may face the display 130, and the fourth surface 121b may face the second rear cover (eg, Figure 1 and Figure 2 The second back cover 142) or the second circuit board (eg, Figure 4 The second circuit board 162 of the second board 121 may be provided with a third surface 121a. For example, the third surface 121a may face the +z-axis direction, and the fourth surface 121b may face the -z-axis direction. The second side member 122 may surround a portion of the periphery of the second board 121. For example, the second side member 122 may surround edges of the second board 121 that face the +y-axis direction, the -y-axis direction, and the -x-axis direction, respectively. The second edge 121P of the second board 121 (for example, the edge facing the +x-axis direction) may face the first edge 111P of the first board 111 without being surrounded by the second side member 122.

[0069] A hinge region 188 (e.g., Figure 3 The hinge recess 188 may be formed or defined between the first housing 110 and the second housing 120 when the electronic device 100 is in the unfolded state (eg, Figure 1 The hinge area 188 may be formed in a portion where the first plate 111 and the second plate 121 contact each other when the electronic device 100 is in the folded state. For example, the hinge area 188 may be formed in a position overlapping with the first edge 111p of the first plate 111 and the second edge 121p of the second plate 121. When the electronic device 100 is in the folded state, the first surface 111a of the first plate 111 and the third surface 121a of the second plate 121 may face each other. When the electronic device 100 is in the unfolded state, the first surface 111a of the first plate 111 and the third surface 121a of the second plate 121 may face the same direction.

[0070] The connection member 170 may include a first connection member 171 and a second connection member 172. Figure 5a and Figure 5b Although not shown, each of the first and second connection members 171 and 172 may be electrically and physically connected to the first circuit board 161 disposed on the second surface 111 b of the first board 111 and the second circuit board 162 disposed on the fourth surface 121 b of the second board 121 .

[0071] The first connector 174 and the second connector 175 may be formed on opposite ends of the first connection member 171. For example, the first connection member 171 may include a first wiring member 173 and connectors 174 and 175 disposed at opposite ends of the first wiring member 173. The third connector 177 and the fourth connector 178 may be formed on opposite ends of the second connection member 172. For example, the second connection member 172 may include a second wiring member 176 and connectors 176 and 177 formed at opposite ends of the second wiring member 176.

[0072] The first connector 174 of the first connection member 171 and the third connector 177 of the second connection member 172 may be disposed on the second surface 111b of the first board 111. The second connector 175 of the first connection member 171 and the fourth connector 178 of the second connection member 172 may be disposed on the fourth surface 121b of the second board 121. For example, the first connector 174 of the first connection member 171 and the third connector 177 of the second connection member 172 may be electrically connected to the first circuit board 161 disposed on the second surface 111b. For example, the second connector 175 of the first connection member 171 and the fourth connector 178 of the second connection member 172 may be electrically connected to the second circuit board 162 disposed on the fourth surface 121b.

[0073] The first connection member 171 may extend to pass through the through holes h1 and h2 of the first plate 111 and the second plate 121. The first through hole h1 may be formed through the first plate 111, and the second through hole h2 may be formed through the second plate 121. The first through hole h1 may be formed adjacent to the first edge 111p of the first plate 111, and the second through hole h2 may be formed adjacent to the second edge 121p of the second plate 121. The first through hole h1 and the second through hole h2 may be located in a direction perpendicular to the folding axis F with a hinge area 188 therebetween. For example, the hinge area 188 (or, the hinge cover (e.g., Figures 1 to 4 A hinge cover 155)) may be disposed between the first through hole h1 and the second through hole h2.

[0074] The first connecting member 171 may extend from the second surface 111b of the first plate 111 to the first surface 111a of the first plate 111 through the first through hole h1, may extend to the third surface 121a of the second plate 121 across the first edge 111p and the second edge 121p, and may extend to the fourth surface 121b of the second plate 121 through the second through hole h2.

[0075] The first connection member 171 may be provided in a structure in which the first wiring member 173 passes through the first through hole h1 and the second through hole h2 across the first surface 111a of the first board 111 and a partial area (e.g., the hinge area 188) of the third surface 121a of the second board 121, and the first connector 174 and the second connector 175 provided on opposite ends of the first wiring member 173 are provided on the second surface 111b of the first board 111 and the fourth surface 121b of the second board 121, respectively. For example, the first wiring member 173 of the first connection member 171 may extend from the first connector 174 provided on the second surface 111b of the first board 111 through the first through hole h1, and may be located on the first surface 111a of the first board 111. The first wiring member 173 may extend across the hinge area 188 so as to be located on the third surface 121a of the second board 121, and may extend through the second through hole h2 to the second connector 175 provided on the fourth surface 121b of the second board 121.

[0076] The second connection member 172 may extend through the through holes h3 and h4 of the first plate 111 and the second plate 121. The third through hole h3 may be formed through the first plate 111, and the fourth through hole h4 may be formed through the second plate 121. The third through hole h3 may be formed adjacent to the first edge 111p of the first plate 111, and the fourth through hole h4 may be formed adjacent to the second edge 121p of the second plate 121. The third through hole h3 and the fourth through hole h4 may be located in a direction perpendicular to the folding axis F with a hinge area 188 therebetween. For example, the hinge area 188 (or the hinge cover 155) may be disposed between the third through hole h3 and the fourth through hole h4. The third through hole h3 may be spaced apart from the first through hole h1 by a predetermined distance in the direction of the folding axis F (e.g., the -y axis direction), and the fourth through hole h4 may be spaced apart from the second through hole h2 by a predetermined distance in the direction of the folding axis F (e.g., the -y axis direction).

[0077] The second connecting member 172 may extend from the second surface 111b of the first plate 111 to the first surface 111a of the first plate 111 through the third through hole h3, may extend across the first edge 111p and the second edge 121p to the third surface 121a of the second plate 121, and may extend to the fourth surface 121b of the second plate 121 through the fourth through hole h4.

[0078] The second connection member 172 may be provided in a structure in which the second wiring member 176 passes through the third through hole h3 and the fourth through hole h4 across the first surface 111a of the first board 111 and a partial area (e.g., the hinge area 188) of the third surface 121a of the second board 121, and the third connector 177 and the fourth connector 178 provided on the opposite ends of the second wiring member 176 are provided on the second surface 111b of the first board 111 and the fourth surface 121b of the second board 121, respectively. For example, the second wiring member 176 of the second connection member 172 may extend from the third connector 177 provided on the second surface 111b of the first board 111 through the third through hole h3, and may be located on the first surface 111a of the first board 111. The second wiring member 176 may extend across the hinge area 188 so as to be located on the third surface 121a of the second board 121, and may extend to the fourth connector 178 provided on the fourth surface 121b of the second board 121 through the fourth through hole h4.

[0079] According to an embodiment, the electronic device 100 may include various components disposed in the first shell 110 and the second shell 120. Additionally or alternatively, slimming of the electronic device 100 is in progress in relation to weight reduction and thickness optimization. Accordingly, the internal space of the electronic device 100 may be narrowed, and various components required for operating the electronic device 100 may be disposed in a narrow space at a high density. Among the components, a specific component may be an electronic component and may thus electrically affect other components. Therefore, in order to improve space utilization efficiency by using the internal space of the electronic device 100 more three-dimensionally, an antenna module (e.g., Figure 7 The antenna module 200) and the connecting member 170 may be arranged to at least partially overlap each other when viewed in the z-axis direction. In the above-mentioned arrangement structure, the through holes h1 and h2 formed in the first housing 110 and the second housing 120 may be used to reduce the electrical influence between the antenna module and the connecting member 170, and at least a portion of the structure around the through hole through which the antenna module is disposed may be cut or may have a bent shape (or a curved shape), so that the radiation efficiency of the antenna module is higher than or equal to a predetermined reference value.

[0080] The first board 111 may include an antenna module (eg, Figure 7 The antenna module 200 is placed in an antenna placement portion (eg, an antenna mounting portion or an antenna receiving portion). Figure 7The antenna placement portion 114 may be formed on the second surface 111b of the first plate 111. For example, the antenna placement portion 114 may be formed or defined by a partial area of ​​the second surface 111b. The antenna placement portion 114 may be located adjacent to the first through hole h1. For example, the antenna placement portion 114 may be formed between the first edge 111p of the first plate 111 and the first through hole h1. According to various embodiments of the present disclosure, in a state where the hinge cover 155 is disposed in the hinge area 188, the antenna placement portion 114 may be located between the first through hole h1 and the hinge cover 155. Fig.10 , Fig.11 , Fig.12 , Fig.13a and Fig.13b The antenna module 200 and the antenna housing portion 114 are described in more detail.

[0081] Figure 6 is a plan view of an electronic device according to an embodiment of the present disclosure. Figure 7 is a cross-sectional view of an electronic device according to an embodiment of the present disclosure. Figure 8 is a view showing an arrangement structure of a connection member according to an embodiment of the present disclosure. Fig. 9 is a view showing an arrangement structure of a connection member according to an embodiment of the present disclosure.

[0082] Figure 6 is from Figure 1 The electronic device is shown in a front plan view with the display omitted. Figure 7 is along Figure 6 A cross-sectional view of the electronic device taken along line AA' in FIG.

[0083] Reference Figure 6 , Figure 7 , Figure 8 and Fig. 9 According to an embodiment, the electronic device 100 may include a first shell 110, a second shell 120, a display 130, a back cover 140, a hinge member 150, a circuit board 160, a connecting member 170, a back shell 194, a cover display 187, a fixing member 189, a reinforcing member 191 and an antenna module 200. Figures 6 to 9 Some components of the electronic device 100 shown in FIG. Figure 3 , Figure 4 , Figure 5a and Figure 5b Components of the described electronic device 100 are the same or similar, and repeated descriptions will be omitted hereinafter.

[0084] The first housing 110 may include a first side member 112 and a first board 111. The first board 111 may include a first surface 111a on which the display 130 is disposed and a second surface 111b facing away from the first surface 111a. The antenna module 200 and the first circuit board 161 may be disposed on the second surface 111b of the first board 111. For example, the antenna module 200 and the first circuit board 161 may be disposed or accommodated in a space between the first rear cover 141 and the first board 111.

[0085] The first plate 111 may have a first through hole h1 formed therein, and at least a portion of the first connecting member 171 passes through the first through hole h1. The first through hole h1 may be located between the hinge cover 155 and the first circuit board 161. An antenna placement portion 114 on which the antenna module 200 is placed may be formed on the first plate 111. The antenna placement portion 114 may be located between the hinge cover 155 and the first through hole h1. The antenna placement portion 114 may provide a space for accommodating at least a portion of the antenna module 200. The first waterproof member 192 may be disposed in the first through hole h1. The first waterproof member 192 may be formed of a liquid material having a predetermined viscosity, and may be tightly disposed in the first through hole h1 and / or a sidewall structure surrounding the first through hole h1. The first connecting member 171 may extend through the first waterproof member 192. The first waterproof member 192 may prevent moisture or foreign matter from being introduced into the space between the first plate 111 and the first back cover 141.

[0086] The second housing 120 may include a second side member 122 and a second plate 121. The second plate 121 may include a third surface 121a on which the display 130 is disposed and a fourth surface 121b facing away from the third surface 121a. The second circuit board 162 may be disposed on the fourth surface 121b of the first plate 111. For example, the second circuit board 162 may be disposed or accommodated in the space between the second rear cover 142 and the first plate 111. The cover display 187 may be disposed between the second rear cover 142 and the second plate 121. For example, the cover display 187 may be attached to the rear surface of the second rear cover 142 facing the second plate 121 (e.g., the surface facing the +z axis direction).

[0087] The second plate 121 may have a second through hole h2 formed therein, and at least a portion of the first connecting member 171 passes through the second through hole h2. The second through hole h2 may be located between the second battery 184b and the second circuit board 162. The second waterproof member 193 may be disposed in the second through hole h2. The second waterproof member 193 may be formed of a liquid material having a predetermined viscosity and may be tightly disposed in the second through hole h2 and / or a sidewall structure surrounding the second through hole h2. The first connecting member 171 may extend through the second waterproof member 193. The second waterproof member 193 may prevent moisture or foreign matter from being introduced into the space between the second plate 121 and the second back cover 142.

[0088] The first connection member 171 may extend from the first plate 111 to the second plate 121 across the hinge cover 155. At least a portion of the first connection member 171 may be disposed in the inner space 156 of the hinge cover 155. For example, the first connection member 171 may include a first wiring member 173 and a first connector 174 and a second connector 175 disposed on opposite ends of the first wiring member 173. The first wiring member 173 may be at least partially disposed in the inner space 156 of the hinge cover 155, and may extend to the first circuit board 161 and the second circuit board 162 through the first through hole h1 and the second through hole h2. The first connector 174 may be connected to the first circuit board 161, and the second connector 175 may be connected to the second circuit board 162. The first wiring member 173 may be at least partially bent. For example, the first wiring member 173 may pass through the first through hole h1 and the second through hole h2 and may be partially bent so as to be accommodated in the hinge cover 155. According to various embodiments of the present disclosure, the shape of a partial area of ​​the first wiring member 173 disposed in the inner space 156 of the hinge cover 155 may be partially changed according to the folding and unfolding operations of the electronic device 100 .

[0089] Reference Figure 7 , the first connector 174 may be coupled to the first circuit board 161 disposed on the second surface 111b of the first board 111, and the first wiring member 173 may extend from the first connector 174 to the first surface 111a of the first board 111 through the first through hole h1. The first wiring member 173 extending to the first surface 111a of the first board 111 may extend into the inner space 156 of the hinge cover 155. The first wiring member 173 extending into the inner space 156 of the hinge cover 155 may extend to the third surface 121a of the second board 121. The first wiring member 173 extending to the third surface 121a of the second board 121 may extend to the fourth surface 121b of the second board 121 through the second through hole h2, and the second connector 175 may be coupled to the second circuit board 162 disposed on the fourth surface 121b of the second board 121. Therefore, the first connection member 171 may cross the hinge cover 155 and may electrically connect the first circuit board 161 disposed on the second surface 111 b and the second circuit board 162 disposed on the fourth surface 121 b .

[0090] Reference Figure 7 and Figure 8, the first connecting member 171 may be fixed to the first plate 111 and the second plate 121 by a fixing member 189. The fixing member 189 may include fixing plates 189a and 189b and fixing brackets 189c and 189d. For example, the fixing member 189 may include a first fixing plate 189a and a first fixing bracket 189c for fixing the first connecting member 171 to the first plate 111 and a second fixing plate 189b and a second fixing bracket 189d for fixing the first connecting member 171 to the second plate 121.

[0091] The first fixing plate 189a may be disposed to overlap a portion of the first connection member 171 and may be coupled to the first plate 111. For example, at least a portion of the first wiring member 173 may be disposed between the first fixing plate 189a and the first surface 111a of the first plate 111, and may be fixed to the first plate 111 when the first fixing plate 189a is fixedly coupled to the first plate 111. For example, the first fixing plate 189a may include a SUS material. However, without being limited thereto, the first fixing plate 189a may be formed of a material having a rigidity sufficient to fix the first connection member 171.

[0092] The first fixing bracket 189c may be at least partially disposed in the first through hole h1, and may guide the first connecting member 171 so that the first connecting member 171 passes through the first through hole h1. For example, the first fixing bracket 189c may be fixed to the first plate 111 so as to be partially inserted into the first through hole h1. The first fixing bracket 189c may include a curved surface to which the first wiring member 173 is fixed, and the first wiring member 173 may be bent along the curved surface of the first fixing bracket 189c and may pass through the first through hole h1. The first fixing bracket 189c may prevent the first waterproof member 192 in a liquid state accommodated in the first through hole h1 from overflowing. The first fixing bracket 189c may be formed of a material having ductility. For example, the first fixing bracket 189c may be formed of a rubber material, but is not limited thereto.

[0093] The second fixing plate 189b may be disposed to overlap a portion of the first connection member 171, and may be coupled to the second board 121. For example, at least a portion of the first wiring member 173 may be disposed between the second fixing plate 189b and the third surface 121a of the second board 121, and may be fixed to the second board 121 when the second fixing plate 189b is fixedly coupled to the second board 121. For example, the second fixing plate 189b may be formed of a material substantially the same as that of the first fixing plate 189a, or may be formed in a shape substantially the same as that of the first fixing plate 189a.

[0094] The second fixing bracket 189d may be at least partially disposed in the second through hole h2, and may guide the first connecting member 171 so that the first connecting member 171 passes through the second through hole h2. For example, the second fixing bracket 189d may be fixed to the second plate 121 so as to be partially inserted into the second through hole h2. The second fixing bracket 189d may include a curved surface to which the first wiring member 173 is fixed, and the first wiring member 173 may be bent along the curved surface of the second fixing bracket 189d and may pass through the second through hole h2. The second fixing bracket 189d may prevent the second waterproof member 193 in a liquid state accommodated in the second through hole h2 from overflowing. The second fixing bracket 189d may be formed of a material substantially the same as that of the first fixing bracket 189c, or may be formed in a shape substantially the same as that of the first fixing bracket 189c.

[0095] Although the arrangement structure and the fixing structure of the first connecting member 171 have been described based on the first connecting member 171, the above description of the first connecting member 171 may be equally applied to the second connecting member (eg, Figure 5b The second connecting member 172).

[0096] Reference Figure 7 and Fig. 9 , the reinforcing member 191 may be disposed between partial areas of the first plate 111 and the second plate 121 and the display 130. The reinforcing member 191 may include a first reinforcing member 191a disposed on the first plate 111 and a second reinforcing member 191b disposed on the second plate 121. For example, the first reinforcing member 191a may be disposed between a partial area of ​​the first surface 111a of the first plate 111 and the display 130. For example, the second reinforcing member 191b may be disposed between a partial area of ​​the third surface 121a of the second plate 121 and the display 130.

[0097] The first reinforcing member 191a may compensate for a step between an area of ​​the first surface 111a of the first board 111 where the first connection member 171 is disposed and another area. Therefore, the display 130 may be flatly attached to the first board 111. For example, the first reinforcing member 191a may be disposed to overlap the first connection member 171, the first fixing plate 189a, and the first through hole h1. The first reinforcing member 191a may have an opening h5 formed therein, through which at least a portion of the first fixing plate 189a is exposed.

[0098] The second reinforcing member 191b may compensate for a step between an area of ​​the third surface 121a of the second plate 121 where the first connection member 171 is disposed and another area. Therefore, the display 130 may be attached flatly to the second plate 121. For example, the second reinforcing member 191b may be disposed to overlap the first connection member 171, the second fixing plate 189b, and the second through hole h2. The second reinforcing member 191b may have an opening h6 formed therein, through which at least a portion of the second fixing plate 189b is exposed.

[0099] The antenna module 200 may be disposed on the first board 111. The antenna module 200 may be mounted or placed on the antenna placement portion 114 formed on the first board 111. The antenna module 200 may be disposed to face the first back cover 141 or the display 130. For example, the antenna module 200 may include an array antenna, and a surface formed with the array antenna may be disposed to face the first back cover 141 or the display 130. According to various embodiments of the present disclosure, the antenna module 200 may radiate a radio frequency (RF) signal by forming a beam pattern in a rear direction (-z axis direction) or a front direction (e.g., +z axis direction) of the electronic device 100 using an array antenna. The array antenna of the antenna module 200 may include a patch antenna and / or a dipole antenna.

[0100] When the electronic device 100 is viewed in a cross section perpendicular to the folding axis F, the antenna module 200 may be disposed between the hinge cover 155 and the first through hole h1. The antenna module 200 may be partially surrounded by the antenna placement portion 114. The illustrated embodiment is illustrative and not limited thereto, and according to various embodiments of the present disclosure, the antenna module 200 may be disposed on the first board 111 instead of the second board 121, or may be additionally disposed in another area of ​​the first board 111 and / or the second board 121.

[0101] Fig.10 is a view showing a first housing of an electronic device according to an embodiment of the present disclosure. Fig.11 is a view illustrating a first housing, a first circuit board, and an antenna module of an electronic device according to an embodiment of the present disclosure.

[0102] Fig.10 is a perspective view of the first housing viewed in the direction of the second surface of the first plate. Fig.11 The first circuit board, the first connecting member and the antenna module are shown to be arranged Fig.10 state on the second surface of the first plate.

[0103] Reference Fig.10 and Fig.11 , according to the electronic device of the embodiment (eg, Figures 1 to 4The electronic device 100 may include a first housing 110, a first circuit board 161, a first connecting member 171, and an antenna module 200. The first circuit board 161 and the antenna module 200 may be disposed in the first housing 110. For example, the first housing 110 may include a first side member 112 and a first plate 111, and the first circuit board 161 and the antenna module 200 may be disposed (or mounted) on a second surface 111b (e.g., Figure 5a and Figure 5b On the second surface 111b).

[0104] The first through hole h1 and the antenna placement portion 114 may be formed in an area adjacent to the first edge 111p of the second surface 111b of the first board 111. For example, a substrate area BA on which the first circuit board 161 is disposed may be formed on the second surface 111b, and the first through hole h1 and the antenna placement portion 114 may be formed between the substrate area BA and the first edge 111p. The substrate area BA may be formed or defined in an area adjacent to an edge of the first board 111 facing the +y-axis direction (or, Figure 1 The antenna module 200 may be provided in an upper region adjacent to the second side surface 112b of the antenna module 200. The antenna placement portion 114 may be formed between the first through hole h1 and the first edge 111p. Since the antenna placement portion 114 is located adjacent to the substrate area BA, the length of the connection substrate 240 electrically connected to the first circuit board 161 of the antenna module 200 may be designed to be short. Therefore, the performance degradation of the antenna module 200 may be prevented or reduced.

[0105] The first board 111 may include a first side wall portion 115 and a second side wall portion 116 forming an antenna placement portion 114. For example, the antenna placement portion 114 may be formed between the first side wall portion 115 and the second side wall portion 116. The antenna placement portion 114 may be defined as a receiving space that is concavely formed as the first side wall portion 115 and the second side wall portion 116 protrude (or extend) from the second surface 111b of the first board 111. The first side wall portion 115 and the second side wall portion 116 may surround at least a portion of the antenna module 200.

[0106] The first plate 111 may include a third side wall portion 117, which, together with the first side wall portion 115, surrounds an area around the first through hole h1. The first side wall portion 115 may be formed between the antenna placement portion 114 and the first through hole h1, and the third side wall portion 117 may extend from the first side wall portion 115 to surround the first through hole h1. The third side wall portion 117 may be connected to a base portion 115c of the first side wall portion 115. For example, the first side wall portion 115 and the third side wall portion 117 may be connected to each other to form a partition wall structure surrounding the first through hole h1. For example, the first side wall portion 115 and the second side wall portion 116 may be formed integrally with each other. The first side wall portion 115 and the third side wall portion 117 may form a space 119, and the first waterproof member 192 is accommodated or inserted in the space 119. For example, the first waterproof member 192 may be inserted (for example, refer to Fig.13a or Fig.13b ) into the partition wall structure formed by the first sidewall portion 115 and the third sidewall portion 117 so as to overlap with the first through hole h1. According to the illustrated embodiment of the present disclosure, the third sidewall portion 117 may have a lower height than the first sidewall portion 115, but is not limited thereto.

[0107] The first connection member 171 may pass through the first through hole h1 and may extend from the second surface 111 b of the first plate 111 to the first surface of the first plate 111 (eg, Figure 5a and Figure 5b The first connection member 171 may be connected to the first circuit board 161 and may extend into the first through hole h1. Although not shown, a liquid waterproof member (eg, Figure 7 The first waterproof member 192 may be accommodated in the space 119 inside the first sidewall portion 115 and the third sidewall portion 117. The waterproof member 192 may surround a portion of the first connection member 171 passing through the first through hole h1.

[0108] The antenna module 200 may include a base substrate 210, a plurality of radiation members 220, and a connection substrate 240. The plurality of radiation members 220 may be disposed on one surface of the base substrate 210. Each of the radiation members 220 may include at least one antenna element (e.g., Fig.16 The connection substrate 240 may extend from the base substrate 210 and may be connected to the first circuit board 161. For example, the connection substrate 240 may electrically connect the base substrate 210 with the first circuit board 161.

[0109] The antenna module 200 may be disposed on the antenna placement portion 114 so that at least a portion overlaps with the first side wall portion 115 and the second side wall portion 116. The antenna module 200 may be disposed between the first side wall portion 115 and the second side wall portion 116. For example, at least a portion of a side surface (e.g., a surface facing the x-axis direction) of the antenna module 200 may face the first side wall portion 115 and the second side wall portion 116. The first side wall portion 115 and the second side wall portion 116 may be formed in a bumpy structure and / or a step structure so as to reduce an area overlapping with the antenna module 200 or increase a distance from the antenna module 200. Therefore, the performance of the antenna module 200 may be ensured.

[0110] At least a portion of the first side wall portion 115 of the first plate 111 may be formed in an open form, and thus the first side wall portion 115 may be formed so as not to hide some of the plurality of radiation members 220 based on a first direction (e.g., the -x-axis direction). For example, the first direction may be defined as a direction parallel to the base substrate 210 of the antenna module 200 and perpendicular to the first edge 111p. The first side wall portion 115 of the first plate 111 may include a base portion 115c and a base portion 115c extending in a direction perpendicular to the second surface 111b (e.g., toward the first side wall portion 115c). Figure 4 and Figure 7 A plurality of protrusions 115a extending from the base portion 115c in the direction of the first back cover 141 or the -z-axis direction). The plurality of protrusions 115a may extend so as to be spaced apart from each other by a specified gap, and a plurality of recesses 115b may be defined between the plurality of protrusions 115a. For example, the plurality of protrusions 115a may be spaced apart from each other by a predetermined gap in the direction of the first edge 111p of the first plate 111, and the plurality of recesses 115b may be defined as an open area (or, a recessed area) formed by the plurality of protrusions 115a. The recesses 115b may be formed or defined between the protrusions 115a adjacent to each other. Therefore, the plurality of protrusions 115a and the plurality of recesses 115b may be alternately formed and / or arranged in a direction parallel to the first edge 111p (e.g., the y-axis direction).

[0111] The protrusion 115a can support (for example, refer to Fig.13a or Fig.13b ) is disposed on the second surface 111b (eg, Fig.12 and Fig.13a or Fig.13b The protrusion 115a may overlap with the gap G between the plurality of radiation members 220. For example, the plurality of radiation members 220 may be spaced apart from each other, and the gap G (eg, Fig.15 A gap G) may be formed between the plurality of radiation members 220. The protrusion 115a may overlap with the gap G (or may be aligned with the gap G) based on the first direction ①.

[0112] The recess 115b may face the radiation member 220 of the antenna module 200. For example, since the protrusion 115a is formed at a position overlapping with the gap G between the plurality of radiation members 220 based on the first direction (e.g., the -x-axis direction), the recess 115b defined (or formed) between adjacent protrusions 115a may overlap with at least a portion of the radiation member 220. The area where the first sidewall portion 115 overlaps with the radiation member 220 (or the antenna element) based on the first direction may be reduced by the recess 115b. Not limited to Fig.10 and Fig.11 , the protrusion 115a and the recess 115b of the first side wall portion 115 may be variously changed to correspond to the structure or shape of the antenna module 200. According to various embodiments of the present disclosure, the first side wall portion 115 may be modified to include only the first protrusion 115a and the third protrusion 115a of the protrusion 115a shown, omit the second protrusion 115a, and form a recess between the first protrusion 115a and the third protrusion 115a.

[0113] The step portion 116a may be formed on the second sidewall portion 116 of the first plate 111. For example, the second sidewall portion 116 may be formed such that one portion disposed above the step portion 116a is farther away from the antenna module 200 than another portion disposed below the step portion 116a. The distance by which the second sidewall portion 116 is spaced apart from the radiation member 220 or the antenna element may be increased by the step portion 116a.

[0114] Fig.12 is a view showing a first housing and a rear case of an electronic device according to an embodiment of the present disclosure. Fig.13a is a cross-sectional view of a portion of an electronic device according to an embodiment of the present disclosure. Fig.13b is another form of a cross-sectional view of a portion of an electronic device according to an embodiment of the present disclosure.

[0115] Fig.13a The 1301 is with Fig.11 The directions B-B' and Fig.12 The direction D-D' shown in FIG. 1 corresponds to a cross-sectional view of the electronic device, and Fig.13a The 1302 is with Fig.11 The directions C-C' and Fig.12 The direction EE' shown in corresponds to a cross-sectional view of the electronic device. Fig.13b A modified shape of the first side wall portion according to an embodiment of the present disclosure is shown.

[0116] Reference Fig.11 , Fig.12 and Fig.13a, the electronic device 100 according to the embodiment may include a first housing 110 , a first back cover 141 , a first circuit board 161 , a first connection member 171 , a rear case 194 , and an antenna module 200 .

[0117] The rear case 194 may be disposed between the first rear cover 141 and the first board 111. For example, the rear case 194 may be referred to as Figure 4 A portion of the upper end of the first support member 181 shown in FIG. Figure 4 The rear shell 194 may overlap the antenna module 200 and the first connector 174. For example, the rear shell 194 may be disposed on the first board 111 to cover the antenna module 200 and the first connector 174. The rear shell 194 may cover the first connector 174 and the antenna module 200 to prevent the first connector 174 from being separated from the first circuit board 161 or the antenna module 200 from being separated from the antenna placement portion 114. The rear shell 194 may be formed of a moldable material so as not to affect the function or performance of the antenna module 200, but is not limited thereto. The rear shell 194 may be supported by the protrusion 115a of the first side wall portion 115.

[0118] The antenna module 200 may include a base substrate 210, a plurality of radiation members 220 disposed on one surface (e.g., a surface facing the −z-axis direction) of the base substrate 210, and a shield member 230 disposed on an opposite surface (e.g., a surface facing the +z-axis direction) of the base substrate 210. Each of the plurality of radiation members 220 may include an antenna element (e.g., Fig.16 The antenna module 200 may be disposed on the antenna installation portion 114 by an adhesive member disposed between the shielding member 230 and the antenna installation portion 114, but is not limited thereto.

[0119] The antenna module 200 may be arranged to face the first back cover 141. For example, the antenna module 200 may be arranged so that a surface formed with a plurality of antenna elements faces the first back cover 141. The antenna module 200 may radiate an RF signal by forming a beam pattern in a rear direction (e.g., -z axis direction) of the electronic device 100 or in a direction toward the first back cover 141 using a plurality of antenna elements. For example, a directional beam formed by the antenna module 200 may mainly face the first back cover 141. However, the directional beam may partially face the front direction (e.g., +z axis direction) and the lateral direction (e.g., -x / +x axis direction) of the electronic device 100. The direction facing the antenna module 200 is not limited to the illustrated embodiment.

[0120] The first side wall portion 115 and the second side wall portion 116 may be disposed on opposite sides of the antenna installation portion 114. The antenna module 200 may be disposed so that opposite sides in a width direction (e.g., an x-axis direction) face the first side wall portion 115 and the second side wall portion 116. For example, the antenna installation portion 114 may be formed or defined by a space between the first side wall portion 115 and the second side wall portion 116.

[0121] The first side wall portion 115 may include a plurality of protrusions 115a spaced apart from each other. The protrusions 115a may protrude from the base portion 115c toward the rear case 194 (or, toward the first rear cover 141) by a predetermined height to support the rear case 194. For example, the protrusions 115a may contact a portion of the rear case 194 to support the rear case 194 so that the rear case 194 does not sag downward (for example, in the direction toward the first circuit board 161 or the +z-axis direction). The protrusions 115a may be located at substantially the same height as the radiation member 220 of the antenna module 200.

[0122] Since the plurality of protrusions 115a protrude from the base portion 115c of the first side wall portion 115, a recess 115b as a relatively recessed area (or concave area) may be defined or formed on the first side wall portion 115. The recess 115b may overlap with the radiation member 220. At least a portion of a side surface of the radiation member 220 in a width direction (e.g., an x-axis direction) may be exposed through the recess 115b without overlapping with the first side wall portion 115. For example, while referring to Fig.11 13 , when the first sidewall portion 115 is viewed from one side of the first sidewall portion 115 in the +x-axis direction, most of the radiation member 220 may be exposed through the recess 115b without being hidden by the first sidewall portion 115. According to an embodiment of the present disclosure, an area where the radiation member 220 overlaps or faces the first sidewall portion 115 made of a metal material based on a direction parallel to the base substrate 210 may be minimized through the recess 115b, and thus the performance of the antenna module 200 may be improved.

[0123] The second side wall portion 116 may include a step portion 116a. The second side wall portion 116 may include a first portion 116b and a second portion 116c connected in a stepped manner by the step portion 116a. The first portion 116b may extend from the step portion 116a toward the first back cover 141, and the second portion 116c may extend from the step portion 116a in a direction opposite to the extension direction of the first portion 116b. The distance between the first portion 116b and the antenna module 200 may be greater than the distance between the second portion 116c and the antenna module 200. According to an embodiment of the present disclosure, the separation distance between the radiation member 220 and the second side wall portion 116 may be increased by the step portion 116a, and thus the performance of the antenna module 200 may be improved.

[0124] The first side wall portion 115 and the third side wall portion 117 may extend to surround the area around the first through hole h1. For example, the liquid waterproof member 192 (eg, Figure 7 The first waterproof member 192 may be accommodated in a space between the base portion 115c of the first side wall portion 115 and the third side wall portion 117. The first side wall portion 115 and the third side wall portion 117 may protrude to a predetermined height, and thus the waterproof member 192 may be prevented from overflowing toward the antenna module 200 and / or the first circuit board 161.

[0125] Reference Fig.13b , the electronic device 100 according to the embodiment may include a first housing 110, a first rear cover 141, a first circuit board 161, a first connection member 171, a rear shell 194, and an antenna module 200. Fig.13b In addition to the first side wall portion of the first housing 110 in the above components of the electronic device 100 shown in FIG, the first rear cover 141, the first circuit board 161, the first connecting member 171, the rear shell 194 and the antenna module 200 may include the same as those described above. Fig.13a The components of the first back cover 141 , the first circuit board 161 , the first connection member 171 , the rear case 194 , and the antenna module 200 are described as being the same or similar components.

[0126] The first housing 110 may include a first modified sidewall portion 115_c. The first modified sidewall portion 115_c may include a shape in which a plurality of protrusions 115a spaced apart from each other are bent in the x-axis direction. At least a portion of the first modified sidewall portion 115_c (e.g., an upper end of the first modified sidewall portion 115_c (an end facing the -z-axis direction or including at least a portion of the end)) may be spaced apart from the radiation member 220 of the antenna module 200 by a predetermined distance or more, and thus the radiation efficiency of the antenna module 200 may be improved. As described above, the upper end of the first modified sidewall portion 115_c may be spaced apart from the radiation member 220 by a predetermined distance or more to improve the antenna performance of the radiation member 220, while the lower end of the first modified sidewall portion 115_c (e.g., an end facing the z-axis direction or including at least a portion of the end) is in close contact with the antenna module 200 to improve the movement of the base substrate 210 or fix the base substrate 210. Additionally or alternatively, the first modified sidewall portion 115_c may be inclined (or curved) in the x-axis direction (or, in the direction around the waterproof member 192 or in the direction toward the first through hole h1) to guide the first connection member 171 so that the first connection member 171 is well inserted in the direction toward the first rear cover 141 and the inserted first connection member 171 is protected. According to an embodiment, the first modified sidewall portion 115_c formed to be inclined (or curved or curved) in the x-axis direction may be used to prevent the liquid material of the waterproof member 192 from overflowing toward the antenna module 200 in the process in which the waterproof member 192 is formed to close the first through hole h1. The first modified sidewall portion 115_c may be formed to support the rear case 194.

[0127] The first modified side wall portion 115_c may include a modified Fig.13a The form of the protrusion 115a described. Optionally, a structure that does not form a separate protrusion 115a and a separate recess 115b (e.g., a sidewall portion having the height of the protrusion 115a) may be bent (or, tilted) in the x-axis direction to form a first modified sidewall portion 115_c. At least a portion of the corner of the first modified sidewall portion 115_c (e.g., an upper end protruding in the diagonal direction between the x-axis and the -z-axis) may be rounded. Even if a collision occurs during the setting of the first connecting member 171, the rounded corner of the first modified sidewall portion 115_c may prevent damage to the first connecting member 171, or may reduce (or improve) the possibility of damaging the first connecting member 171.

[0128] Fig.14 A portion of an electronic device according to an embodiment of the present disclosure is shown provided with a first through hole and a first connection member.

[0129] Fig.14 Shown with Fig.11 The enlarged view shown in FIG. 1 corresponds to a portion of the electronic device.

[0130] Reference Fig.14 , the electronic device 100 according to the embodiment may include a first case 110 and an antenna module 200 disposed on a first plate 111 of the first case 110. The antenna module 200 may include a base substrate 210 and a plurality of radiation members 220.

[0131] The first plate 111 may include a first side wall portion 115 and a third side wall portion 117 surrounding the first through hole h1 and forming a space 119, a waterproof member (eg, Figure 7 and the first waterproof member 192 of FIG. 13 ) are disposed in the space 119 .

[0132] The first sidewall portion 115 may include concavo-convex structures 115a and 115b. The concavo-convex structures 115a and 115b may include a plurality of protrusions 115a spaced apart from each other. A plurality of recesses 115b as relatively recessed areas may be defined on opposite sides of the plurality of protrusions 115a. For example, the plurality of protrusions 115a may be located between the plurality of recesses 115a adjacent to each other. The plurality of protrusions 115a and the plurality of recesses 115b may be sequentially arranged to form the concavo-convex structures 115a and 115b of the first sidewall portion 115. At least a portion of the plurality of protrusions 115a may overlap with the gap G between the plurality of radiation members 220 of the antenna module 200 based on the first direction ①, or may be aligned. For example, based on the first direction ① (or, when viewed in the first direction ①), the central portion of the protrusion 115a may overlap with the gap G, and the opposite ends of the protrusion 115a may overlap with the portions of the plurality of radiation members 220 adjacent to each other. Based on the first direction ①, the plurality of recesses 115b may overlap or may be aligned with at least a portion of the plurality of radiation members 220. For example, based on the first direction ① (or, when viewed in the first direction ①), most of the plurality of radiation members 220 may be exposed between the protrusions 115a that overlap with the recesses 115b and are adjacent to each other.

[0133] The first side wall portion 115 may face at least a portion of the first connection member 171 extending toward the first through hole h1. The first connection member 171 may extend from the first circuit board 161 and may be bent toward the first through hole h1 so as to pass through the first through hole h1. The bent portion of the first connection member 171 may face the first side wall portion 115.

[0134] The first connection member 171 may have a rounded portion to prevent breakage and / or damage of the first connection member 171 when the first connection member 171 contacts the protrusion 115a of the first sidewall portion 115. For example, a corner portion of the protrusion 115a facing the first connection member 171 may be formed as a curved surface R having a predetermined curvature.

[0135] In another example, at least one of the plurality of protrusions 115a of the first sidewall portion 115 may protrude into the gap G formed between the plurality of radiation members 220. Therefore, when viewed in a direction toward the display 130, at least a portion of the at least one protrusion 115a may be disposed in the gap G formed between the plurality of radiation members 220. Considering antenna radiation performance, the length of the portion of the protrusion 115a that enters the gap G may be less than or equal to half the length of the radiation member 220.

[0136] Fig.15 is a view illustrating an antenna module of an electronic device according to an embodiment of the present disclosure. Fig.16 is a view illustrating an arrangement structure of an antenna module of an electronic device according to an embodiment of the present disclosure.

[0137] Reference Fig.15 and Fig.16 , according to the electronic device of the embodiment (eg, Figures 1 to 4 The antenna module 200 of the electronic device 100 may include a base substrate 210, a plurality of radiation members 220, a shielding member 230, a connection substrate 240, and an antenna connector 250. For example, the antenna module may be a high frequency (eg, millimeter wave) antenna module.

[0138] The base substrate 210 may include a plurality of conductive layers and a plurality of non-conductive layers alternately stacked on each other. The base substrate 210 may provide electrical connections between various components disposed inside and / or outside the base substrate 210 using wires and conductive VIAs formed in the conductive layers.

[0139] A plurality of radiation members 220 may be disposed on the first surface 211 of the base substrate 210. The plurality of radiation members 220 may include a first radiation member 221, a second radiation member 222, a third radiation member 223, and a fourth radiation member 224 that are spaced apart from each other. A predetermined gap G may be formed between the plurality of radiation members 220 that are adjacent to each other. Each of the plurality of radiation members 220 may include at least one antenna element 261, 262, 263, 264, and 265. For example, each of the plurality of radiation members 220 may include a substrate including a plurality of layers and antenna elements 261, 262, 263, 264, and 265 formed in at least a portion of the plurality of layers of the substrate. The illustrated embodiment is illustrative and is not limited thereto, and the plurality of radiation members 220 may be integrally formed without being spaced apart from each other.

[0140] The antenna module 200 may include an antenna array that forms a directional beam. The antenna array may include a plurality of antenna elements 261, 262, 263, 264, and 265 formed or disposed on a plurality of radiation members 220. For example, the antenna module 200 may include a patch antenna array 260. The first radiation member 221 may include a first patch antenna element 261. The second radiation member 222 may include a second patch antenna element 262. The third radiation member 223 may include a third patch antenna element 263. The fourth radiation member 224 may include a fourth patch antenna element 264 and a fifth patch antenna element 265. The patch antenna array 260 may include a plurality of patch antenna elements 261, 262, 263, 264, and 265 of the plurality of radiation members 220. Although not shown, according to various embodiments of the present disclosure, the antenna module 200 may include a dipole antenna array.

[0141] The shielding member 230 may be disposed on the second surface 212 (e.g., the surface facing away from the first surface 211) of the base substrate 210. A radio frequency integrated circuit (RFIC) and / or a power management integrated circuit (PMIC) may be disposed on the second surface 212 of the base substrate 210. The shielding member 230 may be disposed on the second surface 212 of the base substrate 210 to electromagnetically shield the RFIC and / or the PMIC. In an embodiment of the present disclosure, the shielding member 602 may include a shielding cover and / or an epoxy resin molding compound.

[0142] The RFIC and the PMIC may be disposed on a second surface 212 facing away from the first surface 211 of the bottom substrate 210 so as to be away from the plurality of radiating members 220. The RFIC may process signals in a selected frequency band transmitted and received through the antenna array. For example, during transmission, the RFIC may up-convert an IF signal obtained from an intermediate frequency integrated circuit (IFIC) to convert the IF signal into an RF signal in a specified frequency band. For example, during reception, the RFIC may down-convert an RF signal received through the antenna array to convert the RF signal into an IF signal, and may transmit the IF signal to the IFIC. The PMIC may be connected to the main PCB (e.g., Figure 4 The first circuit board 161 of the antenna module 200 receives voltage and can provide power required by various components (eg, RFIC) on the antenna module 200 .

[0143] The antenna module 200 may be electrically connected to the first circuit board 161 through the connector 250 and the connection substrate 240. The connector 250 may be disposed on the second surface 212 of the base substrate 210 on which the shielding member 230 is disposed. The connection substrate 240 may be electrically connected to the connector 250 and the first circuit board 161 at opposite ends thereof, and may electrically connect the antenna module 200 (e.g., RFIC and PMIC) to the first circuit board 161. For example, the connection substrate 240 may include a flexible printed circuit board FPCB. The connector 250 and the connection substrate 240 may transmit signals or data related to the operation of the plurality of antenna elements 261, 262, 263, 264, and 265 included in the antenna module 200 between the first circuit board 161 (e.g., communication circuit) and the base substrate 210, and thus may support the antenna module 200 in a specified frequency band (e.g., a frequency band between 3 GHz and 100 GHz) Signal transmission and reception.

[0144] In the following, reference will be made to Fig.14 The relationship between the concavo-convex structures 115a and 115b of the first side wall portion 115 and the antenna module 200 is described together. The concavo-convex structures 115a and 115b may include a plurality of protrusions 115a. As the plurality of protrusions 115a relatively protrude from the base portion 115c, the plurality of recesses 115b may be defined on opposite sides of the plurality of protrusions 115a in the direction of the width w. For example, the width w of the plurality of protrusions 115a may be a length measured in a direction (e.g., a y-axis direction) parallel to the direction in which the plurality of radiation members 220 (or, the plurality of antenna elements 261, 262, 263, 264, and 265) of the antenna module 200 are arranged.

[0145] The protrusion 115a of the concavo-convex structure 115a, 115b may be formed at a position that does not overlap with the plurality of antenna elements 261, 262, 263, 264, 265 included in the plurality of radiation members 220. For example, based on the first direction ①, the protrusion 115a may not overlap with the plurality of antenna elements 261, 262, 263, 264, and 265, but may overlap with a region (e.g., ground VIA region 213) between the plurality of antenna elements 261, 262, 263, 264, and 265. For example, when the first surface 211 of the base substrate 210 is viewed from above, the plurality of protrusions 115a may be aligned with a region between the first antenna element 261 and the second antenna element 262, a region between the second antenna element 262 and the third antenna element 263, and a region between the third antenna element 263 and the fourth antenna element 264 in the first direction ①, respectively. The protrusion 115a may overlap some of the plurality of radiation members 220 and gaps G between the plurality of radiation members 220, and portions of the plurality of radiation members 220 overlapping the protrusion 115a may be portions or regions where the plurality of antenna elements 261, 262, 263, 264, and 265 are not located.

[0146] Since the protrusion 115a is formed so as not to overlap with the plurality of antenna elements 261, 262, 263, 264, and 265, the concave portion 115b of the concavo-convex structures 115a and 115b may overlap with the plurality of antenna elements 261, 262, 263, 264, and 265. For example, based on the first direction ①, the concave portion 115b may overlap with the plurality of antenna elements 261, 262, 263, 264, and 265. When the first surface 211 of the base substrate 210 is viewed from above, the concave portion 115b may overlap with the plurality of antenna elements 261, 262, 263, 264, and 265 in the first direction ①. The first direction ① may be defined as a direction parallel to the base substrate 210 and perpendicular to a direction in which the plurality of antenna elements 261, 262, 263, 264, and 265 are arranged. For example, when the first sidewall portion 115 is viewed in the first direction ①, a portion of the plurality of radiation members 220 overlapping with (or exposed through) the recess 115b may be a portion or region where the plurality of antenna elements 261, 262, 263, 264, and 265 are disposed. According to an embodiment of the present disclosure, the performance of the antenna module 200 may be improved by reducing an area where the plurality of antenna elements 261, 262, 263, 264, and 265 and the first plate 111 (e.g., the first sidewall portion 115) made of a metal material overlap or face each other.

[0147] The base substrate 210 may have a plurality of VIAs formed therein. An antenna element VIA region including VIAs overlapping a plurality of antenna elements 261, 262, 263, 264, and 265 and a ground VIA region 213 disposed between the antenna element VIA regions may be formed or defined in the base substrate 210. In order to stably support the rear case 194, the protrusion 115a may have a maximum width w (e.g., length in the y-axis direction) within a range that does not overlap with the antenna elements 261, 262, 263, 264, and 265 (or, element VIA region). The protrusion 115a may overlap or align with the ground VIA region 213 based on the first direction ①. For example, the width w of the protrusion 115a may be substantially the same as the width of the ground VIA region 213. However, the present disclosure is not limited thereto. In the illustrated embodiment of the present disclosure, the VIA included in the ground VIA region 213 may overlap with a plurality of radiation members 220 based on a direction perpendicular to the first surface 211 of the base substrate 210. However, the present disclosure is not limited thereto.

[0148] The radiation performance of the antenna module 200 according to the embodiment in which the concavo-convex structures 115a and 115b are formed on the first sidewall portion 115 facing the antenna module 200 and the comparative example in which the concavo-convex structures 115a and 115b are not formed can be represented as shown in Table 1 below.

[0149] Table 1

[0150] Table 1 above shows the cumulative distribution function (CDF) characteristics of the antenna module 200 based on the n261 band and the n260 band in the embodiment in which the concavo-convex structures 115a and 115b are formed and the comparative example in which the concavo-convex structures 115a and 115b are not present. Referring to Table 1 above, it can be seen that based on the n261 band, when compared with the gain in the CDF 50% part in the comparative example, the gain in the CDF 50% part in the embodiment is improved. In addition, it can be seen that based on the n260 band, when compared with the gain in the CDF 20% part and the CDF 50% part in the comparative example, the gain in the CDF 20% part and the CDF 50% part in the embodiment is improved. This may mean that the performance of the antenna module 200 is improved by reducing the area of ​​the first side wall portion 115 overlapping the antenna module 200 through the concavo-convex structures 115a and 115b.

[0151] The structure and / or shape of the antenna module 200 is not limited to Fig.15 and Fig.16 . For example, the antenna module 200 may not be composed of a plurality of radiation members 220 spaced apart from each other, and the plurality of antenna elements 261, 262, 263, 264, and 265 may be formed on one surface of one substrate stacked on the base substrate 210 or formed inside the substrate, or may be formed on the first surface 211 of the base substrate 210 or formed inside the base substrate 210. The concavo-convex structures 115a and 115b of the first sidewall portion 115 may be modified to correspond to the structure and / or shape of the antenna module 200. For example, the concavo-convex structures 115a and 115b may be modified differently within a range in which the protrusion 115a does not overlap with at least some of the plurality of antenna elements 261, 262, 263, 264, and 265 based on the direction (e.g., the first direction ①) in which the first sidewall portion 115 and the antenna module 200 face each other.

[0152] Fig.17 is a block diagram of an electronic device in a network environment according to an embodiment of the present disclosure.

[0153] Reference Fig.17 , an electronic device 301 (eg, Figure 1 and Figure 2The electronic device 100 of the embodiment of the present disclosure may communicate with the external electronic device 302 via a first network 398 (e.g., a short-range wireless communication network), or may communicate with at least one of the external electronic device 304 or the server 308 via a second network 399 (e.g., a long-range wireless communication network). According to an embodiment of the present disclosure, the electronic device 301 may communicate with the external electronic device 304 via the server 308. According to an embodiment of the present disclosure, the electronic device 301 may include a processor 320, a memory 330, an input module 350, a sound output module 355, a display module 360, an audio module 370, a sensor module 376, an interface 377, a connection terminal 378, a haptic module 379, a camera module 380, a power management module 388, a battery 389, a communication module 390, a user identification module (SIM) 396, or an antenna module 397. In some embodiments of the present disclosure, at least one of the above components (e.g., the connection terminal 378) may be omitted from the electronic device 301, or one or more other components may be added to the electronic device 301. In some embodiments of the present disclosure, some of the above-mentioned components (eg, the sensor module 376, the camera module 380, or the antenna module 397) may be implemented as a single component (eg, the display module 360).

[0154] The processor 320 may run, for example, software (e.g., program 340) to control at least one other component (e.g., hardware component or software component) of the electronic device 301 connected to the processor 320, and may perform various data processing or calculations. According to one embodiment of the present disclosure, as at least part of the data processing or calculation, the processor 320 may store a command or data received from another component (e.g., sensor module 376 or communication module 390) in the volatile memory 332, process the command or data stored in the volatile memory 332, and store the result data in the non-volatile memory 334. According to an embodiment of the present disclosure, the processor 320 may include a main processor 321 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 323 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor 321 in operation. For example, when the electronic device 301 includes a main processor 321 and an auxiliary processor 323, the auxiliary processor 323 may be adapted to consume less power than the main processor 321, or adapted to be dedicated to a specific function. The auxiliary processor 323 may be implemented as a separate part from the main processor 321, or as part of the main processor 321.

[0155] When the main processor 321 is in an inactive (e.g., sleep) state, the auxiliary processor 323 (rather than the main processor 321) may control at least some of the functions or states related to at least one component among the components of the electronic device 301 (e.g., display module 360, sensor module 376, or communication module 390), or when the main processor 321 is in an active state (e.g., running an application), the auxiliary processor 323 may control at least some of the functions or states related to at least one component among the components of the electronic device 301 (e.g., display module 360, sensor module 376, or communication module 390) together with the main processor 321. According to an embodiment of the present disclosure, the auxiliary processor 323 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., a camera module 380 or a communication module 390) that is functionally related to the auxiliary processor 323. According to an embodiment of the present disclosure, the auxiliary processor 323 (e.g., a neural processor) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated through machine learning. For example, such learning may be performed by the electronic device 301 where the artificial intelligence is executed or via a separate server (e.g., server 308). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or alternatively, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0156] The memory 330 may store various data used by at least one component of the electronic device 301 (e.g., the processor 320 or the sensor module 376). The various data may include, for example, software (e.g., the program 340) and input data or output data for commands related thereto. The memory 330 may include a volatile memory 332 or a non-volatile memory 334.

[0157] The program 340 may be stored as software in the memory 330 , and may include, for example, an operating system (OS) 342 , middleware 344 , or an application 346 .

[0158] The input module 350 may receive commands or data to be used by other components (e.g., the processor 320) of the electronic device 301 from outside (e.g., a user) of the electronic device 301. The input module 350 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0159] The sound output module 355 can output sound signals to the outside of the electronic device 301. The sound output module 355 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to an embodiment of the present disclosure, the receiver can be implemented as a separate speaker or as part of the speaker.

[0160] The display module 360 ​​may visually provide information to the outside of the electronic device 301 (e.g., a user). The display module 360 ​​may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment of the present disclosure, the display module 360 ​​may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0161] The audio module 370 can convert sound into an electrical signal, and vice versa. According to an embodiment of the present disclosure, the audio module 370 can obtain sound via the input module 350, or output sound via the sound output module 355 or an earphone of an external electronic device (e.g., external electronic device 302) directly (e.g., wired) or wirelessly connected to the electronic device 301.

[0162] The sensor module 376 may detect an operating state (e.g., power or temperature) of the electronic device 301 or an environmental state (e.g., a state of a user) outside the electronic device 301, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment of the present disclosure, the sensor module 376 may include, for example, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0163] The interface 377 may support one or more specific protocols to be used to connect the electronic device 301 directly (e.g., wired) or wirelessly to an external electronic device (e.g., external electronic device 302). According to an embodiment of the present disclosure, the interface 377 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0164] The connection end 378 may include a connector, wherein the electronic device 301 may be physically connected to an external electronic device (e.g., the external electronic device 302) via the connector. According to an embodiment of the present disclosure, the connection end 378 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0165] The haptic module 379 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment of the present disclosure, the haptic module 379 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0166] The camera module 380 may capture a still image or a moving image. According to an embodiment of the present disclosure, the camera module 380 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0167] The power management module 388 may manage power supply to the electronic device 301. According to an embodiment of the present disclosure, the power management module 388 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0168] The battery 389 may power at least one component of the electronic device 301. According to an embodiment of the present disclosure, the battery 389 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0169] The communication module 390 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 301 and an external electronic device (e.g., external electronic device 302, external electronic device 304, or server 308), and perform communication via the established communication channel. The communication module 390 may include one or more communication processors capable of operating independently from the processor 320 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment of the present disclosure, the communication module 390 may include a wireless communication module 392 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 394 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 398 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 399 (e.g., a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 392 can identify and authenticate the electronic device 301 in a communication network (such as the first network 398 or the second network 399) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 396.

[0170] The wireless communication module 392 can support 5G networks after the fourth generation (4G) network and next generation communication technologies (e.g., new radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low latency communication (URLLC). The wireless communication module 392 can support high frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 392 can support various technologies for ensuring performance on high frequency bands, such as, for example, beamforming, massive multiple input multiple output (massive MIMO), full dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 392 can support various requirements specified in the electronic device 301, an external electronic device (e.g., an external electronic device 304), or a network system (e.g., a second network 399). According to an embodiment of the present disclosure, the wireless communication module 392 may support a peak data rate for implementing eMBB (e.g., 20 gigabits per second (Gbps) or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less for a round trip).

[0171] The antenna module 397 may transmit a signal or power to the outside of the electronic device 301 (e.g., an external electronic device) or receive a signal or power from the outside of the electronic device 301 (e.g., an external electronic device). According to an embodiment of the present disclosure, the antenna module 397 may include an antenna including a radiating element including a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment of the present disclosure, the antenna module 397 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 398 or the second network 399) may be selected from the plurality of antennas by, for example, the communication module 390 (e.g., the wireless communication module 392). A signal or power may then be transmitted or received between the communication module 390 and the external electronic device via the selected at least one antenna. According to an embodiment of the present disclosure, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as a part of the antenna module 397.

[0172] According to various embodiments of the present disclosure, the antenna module 397 may form a millimeter wave antenna module. According to an embodiment of the present disclosure, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or adjacent to the first surface of the printed circuit board, and is capable of supporting a specified high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or adjacent to the second surface, and are capable of transmitting or receiving signals of the specified high frequency band.

[0173] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transfer signals (e.g., commands or data) therebetween.

[0174] According to an embodiment of the present disclosure, a command or data may be sent or received between the electronic device 301 and the external electronic device 304 via the server 308 connected to the second network 399. Each of the external electronic device 302 or the external electronic device 304 may be a device of the same type as the electronic device 301, or a device of a different type from the electronic device 301. According to an embodiment of the present disclosure, all or some operations to be executed in the electronic device 301 may be executed in one or more of the external electronic device 302, the external electronic device 304, or the server 308. For example, if the electronic device 301 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 301 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 301 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices that receive the request may execute at least part of the requested function or service, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 301. The electronic device 301 may provide the result as at least a partial reply to the request with or without further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology, or client-server computing technology, for example, may be used. The electronic device 301 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment of the present disclosure, the external electronic device 304 may include an Internet of Things (IoT) device. The server 308 may be an intelligent server using machine learning and / or neural networks. According to an embodiment of the present disclosure, the external electronic device 304 or the server 308 may be included in the second network 399. The electronic device 301 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology or IoT-related technologies.

[0175] Fig.18 400 is a block diagram of an electronic device for supporting traditional network communication and 5G network communication according to an embodiment of the present disclosure.

[0176] Reference Fig.18 , the electronic device 301 (eg, Figure 1 and Figure 2The electronic device 100 may include a first communication processor 412, a second communication processor 414, a first radio frequency integrated circuit (RFIC) 422, a second RFIC 424, a third RFIC 426, a fourth RFIC 428, a first radio frequency front end (RFFE) 432, a second RFFE 434, a first antenna module 442, a second antenna module 444, and an antenna 448. The electronic device 301 may also include a processor 320 and a memory 330. The second network 399 may include a first cellular network 492 and a second cellular network 494. According to another embodiment of the present disclosure, the electronic device 301 may also include Figure 3 , and the second network 399 may also include at least one of the components shown in , and the second network 399 may also include at least one other network. According to an embodiment of the present disclosure, the first communication processor 412, the second communication processor 414, the first RFIC 422, the second RFIC 424, the fourth RFIC 428, the first RFFE 432, and the second RFFE 434 may form at least a part of the wireless communication module 392. According to another embodiment of the present disclosure, the fourth RFIC 428 may be omitted or may be included as a part of the third RFIC 426.

[0177] The first communication processor 412 may establish a communication channel of a frequency band to be used for wireless communication with the first cellular network 492, and may support traditional network communication through the established communication channel. According to various embodiments of the present disclosure, the first cellular network 492 may be a traditional network including a second generation (2G), a third generation (3G), a 4G, and / or a long term evolution (LTE) network. The second communication processor 414 may establish a communication channel corresponding to a specified frequency band (e.g., about 6 GHz to about 60 GHz) in the frequency band to be used for wireless communication with the second network 494, and may support 5G network communication through the established communication channel. According to various embodiments of the present disclosure, the second cellular network 494 may be a 5G network defined in the third generation partnership project (3GPP). In addition, according to an embodiment of the present disclosure, the first communication processor 412 or the second communication processor 414 may establish a communication channel corresponding to another specified frequency band (e.g., about 6 GHz or lower) in the frequency band to be used for wireless communication with the second network 494, and may support 5G network communication through the established communication channel. According to an embodiment of the present disclosure, the first communication processor 412 and the second communication processor 414 may be implemented in a single chip or a single package. According to various embodiments of the present disclosure, the first communication processor 412 or the second communication processor 414 may be implemented in a single chip or a single package. Fig.17 The processor 320, the auxiliary processor 323, or the communication module 390 are implemented together in a single chip or a single package.

[0178] In the case of transmitting a signal, the first RFIC 422 may convert a baseband signal generated by the first communication processor 412 into a radio frequency (RF) signal of about 700 megahertz (MHz) to about 3 GHz used in the first cellular network 492 (e.g., a legacy network). In the case of receiving a signal, the RF signal may be obtained from the first cellular network 492 (e.g., a legacy network) through an antenna (e.g., the first antenna module 442) and may be pre-processed by an RFFE (e.g., the first RFFE 432). The first RFIC 422 may convert the pre-processed RF signal into a baseband signal so that the pre-processed RF signal can be processed by the first communication processor 412.

[0179] In the case of transmitting a signal, the second RFIC 424 may convert a baseband signal generated by the first communication processor 412 or the second communication processor 414 into an RF signal in a Sub6 frequency band (e.g., about 6 GHz or lower) used in a second cellular network 494 (e.g., a 5G network) (hereinafter, referred to as a "5G Sub6 RF signal"). In the case of receiving a signal, a 5G Sub6 RF signal may be obtained from a second cellular network 494 (e.g., a 5G network) through an antenna (e.g., the second antenna module 444) and may be pre-processed by an RFFE (e.g., the second RFFE 434). The second RFIC 424 may convert the pre-processed 5G Sub6 RF signal into a baseband signal so that the pre-processed 5G Sub6 RF signal can be processed by a corresponding one of the first communication processor 412 or the second communication processor 414.

[0180] The third RFIC 426 may convert the baseband signal generated by the second communication processor 414 into an RF signal (hereinafter, referred to as a "5G Above6 RF signal") in a 5G Above6 frequency band (e.g., about 6 GHz to about 60 GHz) to be used in the second cellular network 494 (e.g., 5G network). In the case of receiving a signal, the 5G Above6 RF signal may be obtained from the second cellular network 494 (e.g., 5G network) through an antenna (e.g., antenna 448) and may be pre-processed by the third RFFE 436. For example, the third RFFE 436 may perform pre-processing on the signal by using a phase shifter 438. The third RFIC 426 may convert the pre-processed 5G Above6 RF signal into a baseband signal so that the pre-processed 5G Above6 RF signal can be processed by the second communication processor 414. According to an embodiment of the present disclosure, the third RFFE 436 may be implemented as a part of the third RFIC 426.

[0181] According to an embodiment of the present disclosure, the electronic device 301 may include a fourth RFIC 428 that is independent of the third RFIC 426 or as at least a part of the third RFIC 426. In this case, the fourth RFIC 428 may convert the baseband signal generated by the second communication processor 414 into an RF signal (hereinafter, referred to as an "IF signal") in an intermediate frequency band (e.g., about 9 GHz to about 11 GHz), and may transmit the IF signal to the third RFIC 426. The third RFIC 426 may convert the IF signal into a 5G Above 6 RF signal. In the case of receiving a signal, the 5G Above 6 RF signal may be received from the second cellular network 494 (e.g., a 5G network) through an antenna (e.g., the third antenna 448) and may be converted into an IF signal through the third RFIC 426. The fourth RFIC 428 may convert the IF signal into a baseband signal so that the IF signal can be processed by the second communication processor 414.

[0182] According to an embodiment of the present disclosure, the first RFIC 422 and the second RFIC 424 may be implemented with at least a portion of a single package or a single chip. According to an embodiment of the present disclosure, the first RFFE 432 and the second RFFE 434 may be implemented with at least a portion of a single package or a single chip. According to an embodiment of the present disclosure, at least one of the first antenna module 442 or the second antenna module 444 may be omitted or may be combined with any other antenna module to process RF signals in multiple frequency bands.

[0183] According to an embodiment of the present disclosure, the third RFIC 426 and the antenna 448 may be disposed at the same substrate to form a third antenna module 446. For example, the wireless communication module 392 or the processor 320 may be disposed at a first substrate (e.g., a main PCB). In this case, the third RFIC 426 may be disposed in a local area (e.g., on the lower surface) of a second substrate (e.g., a sub-PCB) independent of the first substrate, and the antenna 448 may be disposed in another local area (e.g., on the upper surface) of the second substrate. In this way, the third antenna module 446 may be formed. According to an embodiment of the present disclosure, the antenna 448 may include, for example, an antenna array that can be used for beamforming. Since the third RFIC 426 and the antenna 448 are disposed at the same substrate, it is possible to reduce the length of the transmission line between the third RFIC 426 and the antenna 448. For example, the reduction in the length of the transmission line may prevent the signal in the high frequency band (e.g., about 6 GHz to about 60 GHz) used for 5G network communication from being lost (or attenuated) due to the transmission line. In this way, the electronic device 301 can improve the quality or speed of communication with the second cellular network 494 (e.g., a 5G network).

[0184] The second cellular network 494 (e.g., a 5G network) may be used independently of the first cellular network 492 (e.g., a legacy network) (e.g., this scheme is referred to as "standalone (SA)"), or may be used in conjunction with the first cellular network 492 (e.g., this scheme is referred to as "non-standalone (NSA)"). For example, only an access network (e.g., a 5G radio access network (RAN) or a next generation RAN (NG RAN)) may exist in the 5G network, and a core network (e.g., a next generation core (NGC)) may not exist in the 5G network. In this case, the electronic device 301 may access the access network of the 5G network, and then may access an external network (e.g., the Internet) under the control of the core network (e.g., an evolved packet core (EPC)) of the legacy network. Protocol information for communicating with the legacy network (e.g., LTE protocol information) or protocol information for communicating with the 5G network (e.g., new air interface (NR) protocol information) may be stored in the memory 330 so as to be accessed by any other component (e.g., the processor 320, the first communication processor 412, or the second communication processor 414).

[0185] Due to the arrangement of the hinge structure, the foldable electronic device may have limitations in the installation position of the high-frequency antenna module, and it may be difficult to ensure a sufficient spacing distance from the housing structure made of a metal material. When the antenna module and the metal housing structure are located close to each other, interference between the metal housing structure and the antenna module may occur, and the performance of the antenna may be deteriorated.

[0186] Embodiments of the present disclosure described herein relate to a mounting structure of an antenna module for ensuring the performance of a high-frequency antenna module in a foldable electronic device.

[0187] The technical problems to be solved by the present disclosure are not limited to the aforementioned problems, and any other technical problems not mentioned herein will be clearly understood by those skilled in the art to which the present disclosure belongs from the following description.

[0188] The electronic device 100 according to an embodiment of the present disclosure may include: a first housing 110 including a first plate 111, a second housing 120 including a second plate 121, a display 130 disposed on the first plate 111 of the first housing 110 and the second plate 121 of the second housing 120, a hinge member 150 disposed between the first housing 110 and the second housing 120 and rotatably connecting the first housing 110 and the second housing 120, and an antenna module disposed in the first housing 110. The first plate 111 may include an antenna placement portion 114 on which the antenna module 200 is placed. The antenna placement portion 114 may be formed between a first side wall portion 115 and a second side wall portion 116, which extend vertically from one surface 111b of the first plate 111 and face each other. The antenna module 200 may be disposed so that at least a portion faces the first side wall portion 115 and the second side wall portion 116. The first side wall portion 115 may include concave-convex structures 115a and 115b.

[0189] In an embodiment of the present disclosure, the concavo-convex structures 115 a and 115 b of the first sidewall portion 115 may include a plurality of protrusions 115 a spaced apart from each other.

[0190] In an embodiment of the present disclosure, the electronic device 100 may further include a first circuit board 161 disposed in the first housing 110 and a second circuit board 162 disposed in the second housing 120, and a connecting member 170 electrically connecting the first circuit board 161 and the second circuit board 162. The connecting member 170 may extend over the first housing 110, the hinge member 150, and the second housing 120.

[0191] In an embodiment of the present disclosure, a first edge 111p of the first plate 111 and a second edge 121p of the second plate 121 may contact each other in the unfolded state of the electronic device 100. The antenna placement portion 114 may be located between the first circuit board 161 and the first edge 111p of the first plate 111. The unfolded state may be defined as a state in which the first housing 110 and the second housing 120 are located on substantially the same line.

[0192] In an embodiment of the present disclosure, the first board 111 may include a first through hole h1 penetrating the first board 111, and the connecting member 170 may pass through the first through hole h1. The second board 121 may include a second through hole h2 penetrating the second board, and the connecting member 170 may pass through the second through hole h2. The first through hole h1 may be located between the antenna placement portion 114 and the first circuit board 161.

[0193] In an embodiment of the present disclosure, a third sidewall portion 117 extending from the first sidewall portion 115 may be formed on the first plate 111. The first sidewall portion 115 and the third sidewall portion 117 may be configured to surround a region around the first through hole h1.

[0194] In an embodiment of the present disclosure, the first sidewall portion 115 and the third sidewall portion 117 may form a predetermined space in which the waterproof member 192 is disposed. The waterproof member 192 may overlap the first through hole h1 or may be at least partially received in the first through hole h1.

[0195] In an embodiment of the present disclosure, the first sidewall portion 115 may be located between at least a portion of the antenna module 200 and the first through hole h1 .

[0196] In an embodiment of the present disclosure, the first board 111 may include a first surface 111a on which the display 130 is disposed and a second surface 111b facing away from the first surface 111a, and the second board 121 may include a third surface 121a on which the display 130 is disposed and a fourth surface 121b facing away from the third surface 121a. The antenna placement portion 114 may be formed on a partial area of ​​the second surface 111b of the first board 111. The first side wall portion 115 and the second side wall portion 116 may extend from the second surface 111b to a predetermined height.

[0197] In an embodiment of the present disclosure, the first circuit board 161 may be disposed on the second surface 111b of the first board 111. The second circuit board 162 may be disposed on the fourth surface 121b of the second board 121. The connecting member 170 may extend from the second surface 111b to the fourth surface 121b across the first surface 111a, the hinge member 150, and the third surface 121a.

[0198] In an embodiment of the present disclosure, the hinge assembly 150 may include a plurality of hinge structures 151 and a hinge cover 155, the first plate 111 and the second plate 121 are connected to the plurality of hinge structures 151 so as to be rotatable, the hinge cover 155 is coupled to the plurality of hinge structures 151 and includes an internal space 156, and the plurality of hinge structures 151 are partially accommodated in the internal space 156.

[0199] In an embodiment of the present disclosure, the second sidewall portion 116 may include a step portion 116a, a first portion 116c extending from the step portion 116a toward the display 130, and a second portion 116b extending from the step portion 116a in a direction opposite to the first portion 116c. The distance between the second portion 116b and the antenna module 200 may be greater than the distance between the first portion 116c and the antenna module 200.

[0200] In an embodiment of the present disclosure, the electronic device 100 may further include a rear case 194 disposed on one surface 111b of the first board 111 to cover a portion of the first circuit board 161 and the antenna module 200. The rear case 194 may contact the protrusion 115a of the first sidewall portion 115.

[0201] In an embodiment of the present disclosure, the rear housing 194 may include a moldable material.

[0202] In an embodiment of the present disclosure, the connection member 170 may include a wiring member 173, a first connector 174 disposed on one end of the wiring member 173 and electrically coupled to the first circuit board 161, and a second connector 175 disposed on an opposite end of the wiring member 173 and electrically coupled to the second circuit board 162. A portion of the rear case 194 may overlap with the first connector 174.

[0203] In an embodiment of the present disclosure, the antenna module 200 may include a base substrate 210 disposed on an antenna placement portion 114 and a plurality of antenna elements 261, 262, 263, 264, and 265 disposed on one surface 211 of the base substrate 210. A plurality of recesses 115b may be defined on opposite sides of the plurality of protrusions 115a in the direction of the width w. When the one surface 211 of the base substrate 210 is viewed from above, the recesses 115b may be aligned with at least some of the plurality of antenna elements 261, 262, 263, 264, and 265 in a first direction ①.

[0204] In an embodiment of the present disclosure, a plurality of antenna elements 261, 262, 263, 264, and 265 may be spaced apart from each other at a specified gap. The first direction ① may be parallel to the base substrate 210 and perpendicular to the direction in which the plurality of antenna elements 261, 262, 263, 264, and 265 are arranged. The concave-convex structures 115a and 115b may be configured such that the protrusion 115a does not overlap with the plurality of antenna elements 261, 262, 263, 264, and 265 based on the first direction ①.

[0205] In an embodiment of the present disclosure, the width w of the protrusion 115a may be a distance corresponding to a direction parallel to a direction in which the plurality of antenna elements 261, 262, 263, 264, and 265 are arranged. The width w of the protrusion 115a may be substantially the same as the gaps between the plurality of antenna elements 261, 262, 263, 264, and 265.

[0206] In an embodiment of the present disclosure, a plurality of VIAs may be formed in the base substrate 210. The base substrate 210 may include a plurality of antenna element VIA regions and a ground VIA region 213 formed between the plurality of antenna element VIA regions, the plurality of antenna element VIA regions including a VIA among the plurality of VIAs overlapping the plurality of antenna elements 261, 262, 263, 264, and 265. The protrusion 115a may overlap the ground VIA region 213 based on the first direction ①.

[0207] In an embodiment of the present disclosure, the width w of the protrusion 115 a may be substantially the same as the width of the ground VIA region 213 .

[0208] An electronic device according to an embodiment of the present disclosure may include a first housing in which a first circuit board is disposed, a second housing in which a second circuit board is disposed, a connecting member connecting the first circuit board and the second circuit board, a display at least partially disposed on the first housing and the second housing, a hinge member disposed between the first housing and the second housing and rotatably connecting the first housing and the second housing, and an antenna module disposed in the first housing. The first housing may include an antenna placement portion on which the antenna module is placed. The antenna placement portion may be formed between a first side wall portion and a second side wall portion spaced apart from each other. When viewed in a first direction toward the display, at least a portion of the antenna module may overlap with the connecting member.

[0209] In an embodiment, the first housing may include a first through hole through which a portion of the connection member is disposed, and the second housing may include a second through hole through which a portion of the connection member is disposed.

[0210] In an embodiment, the first housing may include a first side portion on one side of which a hinge member is disposed, a second side portion and a third side portion disposed on the opposite side of the first side portion, and a fourth side portion spaced apart from the first side portion. The first through hole may be disposed adjacent to the first side portion while penetrating the upper surface and the lower surface of the first housing. The second housing may include a fifth side portion on the opposite side of which a hinge member is disposed, a sixth side portion and a seventh side portion disposed on the opposite side of the fifth side portion, and an eighth side portion spaced apart from the fifth side portion, and when the electronic device is in an unfolded state, the fifth side portion is disposed adjacent to the first side portion.

[0211] In an embodiment, the second through hole may be disposed adjacent to the fifth side portion while penetrating the upper and lower surfaces of the second housing.

[0212] In an embodiment, the first side wall portion may include a plurality of protrusions (or at least one protrusion) having a greater height than the surroundings in the second direction toward the display, and at least one recess (or a plurality of recesses) having a smaller height than the plurality of protrusions (or at least one protrusion) in the second direction.

[0213] In an embodiment, the plurality of protrusions may be disposed to at least partially overlap gaps between the plurality of radiation members disposed in the antenna module when viewed in a direction perpendicular to the first direction toward the display and parallel to a surface of the display.

[0214] In an embodiment, when viewed in a direction perpendicular to the first direction toward the display and parallel to the surface of the display, at least one recess may be disposed to at least partially overlap each radiation member of the antenna module.

[0215] In an embodiment, the plurality of protrusions may be formed to be inclined in a direction from the first side portion to the first through hole.

[0216] In an embodiment, the connection member may be provided on the first housing, the hinge member, and the second housing.

[0217] In an embodiment, the first housing may include a third sidewall portion extending from the first sidewall portion, and the first sidewall portion and the third sidewall portion may surround a region around the first through hole.

[0218] In an embodiment, the antenna module may include a base substrate disposed on an antenna placement portion and a plurality of antenna elements disposed on a surface of the base substrate, and when the surface of the base substrate is observed from above, at least one recess may be aligned with at least a portion of the plurality of antenna elements.

[0219] In an embodiment, the plurality of antenna elements may be spaced apart from each other by a designated gap, and at least some of the plurality of protrusions may not overlap with the plurality of antenna elements based on a third direction parallel to the surface of the display.

[0220] In an embodiment, the width of the plurality of protrusions may correspond to the spacing distance between the plurality of antenna elements.

[0221] In an embodiment, a plurality of VIAs may be formed in a base substrate. The base substrate may include a plurality of antenna element VIA regions and a ground VIA region formed between the plurality of antenna element VIA regions, the plurality of antenna element VIA regions including a VIA overlapping the plurality of antenna elements among the plurality of VIAs. The plurality of protrusions may overlap the ground VIA region based on a direction parallel to the surface of the display.

[0222] In addition, in the above description, the structure in which the antenna module is disposed adjacent to the first side of the first housing has been illustrated, but the present disclosure is not limited thereto. For example, a plurality of antenna modules may be provided, and a specific antenna module may be disposed adjacent to the fifth side of the second housing. In this case, as described above, at least a portion of the connecting member and the specific antenna module may overlap with each other (or may be aligned with each other) in the up / down direction (e.g., in the direction toward the display).

[0223] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but rather include various changes, equivalents, or alternative forms for the corresponding embodiments. As used herein, each of the phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish a corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “coupled with another element (e.g., the second element)”, “coupled to another element (e.g., the second element)”, “connected with another element (e.g., the second element)”, or “connected to another element (e.g., the second element)” with or without the terms “operably” or “communicatively” being used, it means that the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0224] As used in connection with various embodiments of the present disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, according to an embodiment of the present disclosure, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0225] The various embodiments described herein may be implemented as software (e.g., program 340) including one or more instructions stored in a storage medium (e.g., internal memory 336 or external memory 338) that can be read by a machine (e.g., electronic device 301). For example, under the control of a processor, a processor (e.g., processor 320) of the machine (e.g., electronic device 301) may call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. A machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" only means that the storage medium is a tangible device and does not include a signal (e.g., an electromagnetic wave), but the term does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

[0226] According to an embodiment of the present disclosure, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be released in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., Play Store TM ) the computer program product may be published (e.g., downloaded or uploaded) online, or the computer program product may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, a server of an application store, or a forwarding server).

[0227] According to various embodiments of the present disclosure, each of the above-mentioned components (e.g., a module or a program) may include a single entity or multiple entities, and some of the multiple entities may be separately arranged in different components. According to various embodiments of the present disclosure, one or more of the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., a module or a program) may be integrated into a single component. In this case, according to various embodiments of the present disclosure, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding one of the multiple components performing one or more functions before integration. According to various embodiments of the present disclosure, the operations performed by a module, a program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more of the operations may be run or omitted in a different order, or one or more other operations may be added.

[0228] While the present disclosure has been shown and described with reference to various embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present disclosure as defined by the appended claims and their equivalents.

Claims

1. An electronic device, comprising: A first housing having a first circuit board disposed therein; a second housing having a second circuit board disposed therein; a connecting member configured to connect the first circuit board and the second circuit board; a display, at least partially disposed on the first housing and the second housing; a hinge member disposed between the first housing and the second housing and configured to rotatably connect the first housing and the second housing; as well as The antenna module is disposed in the first housing. The first housing includes an antenna placement portion, and the antenna module is placed on the antenna placement portion. wherein the antenna placement portion is formed between a first side wall portion and a second side wall portion which are spaced apart from each other, Wherein, when viewed in a first direction toward the display, at least a portion of the antenna module overlaps with the connecting member.

2. The electronic device according to claim 1, wherein: The first housing includes a first through hole through which a portion of the connecting member is disposed, and The second shell includes a second through hole, and a part of the connecting member is arranged through the second through hole.

3. The electronic device as claimed in claim 2, wherein: The first housing includes a first side portion, a second side portion and a third side portion disposed on opposite sides of the first side portion, and a fourth side portion spaced apart from the first side portion, one side of the hinge member being disposed on the first side portion, wherein the first through hole is disposed adjacent to the first side portion while penetrating the upper surface and the lower surface of the first housing, The second housing includes a fifth side portion, a sixth side portion and a seventh side portion disposed on opposite sides of the fifth side portion, and an eighth side portion spaced apart from the fifth side portion, the opposite side of the hinge member is disposed on the fifth side portion, and when the electronic device is in the unfolded state, the fifth side portion is disposed adjacent to the first side portion, and The second through hole is disposed adjacent to the fifth side portion while penetrating the upper surface and the lower surface of the second housing.

4. The electronic device as claimed in claim 3, wherein: The first side wall portion includes a plurality of protrusions having a height greater than surroundings in a second direction toward the display, and at least one recess having a height smaller than the plurality of protrusions in the second direction.

5. The electronic device as claimed in claim 4, wherein: The plurality of protrusions are disposed to at least partially overlap gaps between a plurality of radiation members provided in the antenna module when viewed in a direction perpendicular to the first direction toward the display and parallel to a surface of the display.

6. The electronic device as claimed in claim 4, wherein: The at least one recess is disposed to at least partially overlap each radiating member of the antenna module when viewed in a direction perpendicular to the first direction toward the display and parallel to a surface of the display.

7. The electronic device as claimed in claim 4, wherein: The plurality of protrusions are formed to be inclined in a direction from the first side portion to the first through hole.

8. The electronic device as claimed in claim 1, wherein: The connecting member is provided on the first housing, the hinge member and the second housing.

9. The electronic device as claimed in claim 2, wherein: The first housing includes a third side wall portion configured to extend from the first side wall portion, and The first side wall portion and the third side wall portion are configured to surround an area around the first through hole.

10. The electronic device according to claim 9, wherein: The first side wall portion and the third side wall portion form a space in which the waterproof member is provided, and The waterproof member overlaps with the first through hole or is at least partially accommodated in the first through hole.

11. The electronic device according to any one of claims 1 to 10, wherein: The hinge components include: a plurality of hinge structures to which the first housing and the second housing are connected so as to be rotatable; and A hinge cover is coupled to the plurality of hinge structures, the hinge cover comprising an inner space in which the plurality of hinge structures are partially accommodated.

12. The electronic device according to any one of claims 1 to 11, wherein: The second side wall portion includes a step portion, a first portion and a second portion, the first portion being configured to extend from the step portion toward the display, the second portion being configured to extend from the step portion in a direction opposite to the first portion, and The distance between the second part and the antenna module is greater than the distance between the first part and the antenna module.

13. The electronic device according to any one of claims 1 to 12, further comprising: a rear housing, configured to cover a portion of the first circuit board and the antenna module, Wherein, the rear shell contacts the protrusion of the first side wall portion.

14. The electronic device as claimed in claim 13, wherein: The rear housing includes a moldable material.

15. The electronic device according to any one of claims 11 to 14, wherein: The connecting member includes a wiring member, a first connector provided on one end of the wiring member and electrically coupled to the first circuit board, and a second connector provided on an opposite end of the wiring member and electrically coupled to the second circuit board, and Wherein, a portion of the rear shell overlaps with the first connector.

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