Silicon wafer conveying equipment and silicon wafer production line

Abstract

The invention relates to conveying equipment, and discloses silicon wafer conveying equipment which comprises a support structure, a driving assembly, a transmission part and a conveying assembly, an annular rail is arranged on the support structure, and the transmission part is rotatably arranged in the annular rail through the driving assembly. The outer circumferential surface of the transmission part is tangent to the inner circumferential surface of the annular track; the conveying assembly comprises a feeding push rod, the feeding push rod is hinged to the transmission piece through a connecting piece, and the transmission piece rotates around the axis of the transmission piece under the action of the driving assembly and moves along the annular track of the annular track at the same time. And the hinged point of the feeding push rod and the connecting piece reciprocates along a preset straight line under the action of the transmission piece. The silicon wafer conveying equipment is simple in structure, low in production cost, high in conveying precision and high in adaptability.

Description

Technical Field

[0001] The present invention relates to a conveying device, in particular to a silicon wafer conveying device, and furthermore, to a silicon wafer production line having the silicon wafer conveying device. Background Art

[0002] Assembly line production is the mainstream production method. In assembly line production, a linear reciprocating feeding mechanism is an indispensable link. There are many related studies on linear motion mechanisms, including their kinematic and dynamic analysis, failure analysis, and design and application in specific production occasions. In the semiconductor industry, especially in the design of silicon wafer production, it is necessary to use a conveying device to transfer silicon wafers between various processing positions. Common structural forms of silicon wafer conveying devices include cam mechanisms, hydraulic cylinders, gear racks, conveyor belts, etc. However, many silicon wafer conveying devices currently have complex and large mechanisms, insufficient transmission accuracy, low work efficiency, and other problems. In addition, the conveying stroke of the existing conveying mechanism is relatively fixed, so the silicon wafer conveying cannot reach the expected motion position.

[0003] Therefore, it is necessary to design a new type of linear motion equipment. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide a silicon wafer conveying device, which has a simple structure, low production cost, high conveying accuracy and high adaptability.

[0005] In order to achieve the above-mentioned object, the present invention provides a silicon wafer conveying device, comprising a support structure, a driving assembly, a transmission member and a conveying assembly, wherein the support structure is provided with an annular track, the transmission member is rotatably arranged in the annular track through the driving assembly, and the outer circumference of the transmission member is tangent to the inner circumference of the annular track; The conveying assembly includes a feeding push rod, which is hinged to the transmission member through a connecting member. The transmission member rotates around its own axis under the action of the driving assembly and moves along the circular trajectory of the circular track. The hinge point between the feeding push rod and the connecting member reciprocates along a preset straight line under the action of the transmission member.

[0006] Preferably, the driving assembly includes a driving member and a transmission rod, one end of the transmission rod is fixedly connected to the driving member, and the other end of the transmission rod is hinged to the transmission member, so that the transmission member can be driven by the transmission rod to rotate around its own axis and move along the circular trajectory of the circular track.

[0007] Preferably, the annular track is an outer gear ring, the transmission member is a gear, the gear is meshed with the outer gear ring, one end of the connecting member is rotatably connected to the feeding push rod, and the other end of the connecting member is hinged to the center of the gear.

[0008] Preferably, a needle bearing is further provided between the connecting member and the transmission member.

[0009] Preferably, the driving member is installed below the support structure through the mounting assembly, and the mounting assembly includes a suspension rod and a mounting plate, the mounting plate is sleeved on the driving member and fixedly connected to the driving member, and the mounting plate is suspended below the support structure through the suspension rod.

[0010] Preferably, the support structure comprises a mounting platform, a support rod and a mounting seat, the mounting platform is arranged on the ground through the support rod, the mounting seat is arranged above the mounting platform, and the annular track is arranged on the mounting platform through the mounting seat.

[0011] Preferably, a cover shell is provided outside the annular track, and an accommodating cavity capable of accommodating the annular track is formed between the cover shell and the upper surface of the mounting seat, and an accommodating opening capable of accommodating the feeding push rod is opened on the cover shell.

[0012] Preferably, it further comprises a guide mechanism, which comprises a guide sleeve and a mounting member, the guide sleeve is mounted on the cover shell through the mounting member, and the guide sleeve is sleeved on the feeding push rod.

[0013] Preferably, the conveying assembly further comprises a loading structure, and the loading structure is arranged at an end of the feeding push rod away from the transmission member so as to be able to load materials.

[0014] A second aspect of the present invention further provides a silicon wafer production line, comprising the silicon wafer conveying equipment described in any one of the above technical solutions.

[0015] Through the above technical solution, the beneficial effects of the present invention are as follows: The silicon wafer conveying equipment provided by the present invention is provided with a driving component to drive the transmission member on the circular track to rotate along the inner surface of the circular track on the one hand and along the center of the transmission member on the other hand, thereby driving the conveying component to perform linear motion. The guide rails of traditional silicon wafer conveying equipment are removed, and the circular motion is converted into reciprocating linear motion, thus saving space for the silicon wafer conveying equipment. The equipment has a simple structure, high adaptability, high conveying accuracy and low production cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of a specific implementation mode of the silicon wafer conveying device of the present invention; Figure 2 is a structural schematic diagram of a second specific embodiment of the elastic support mechanism of the present invention; Figure 3 It is a schematic structural diagram of the annular track of the elastic support mechanism of the present invention.

[0017] Description of Reference Numerals 1. Support structure; 11. Mounting platform; 12. Support rod; 13. Mounting seat; 2. Driving assembly; 21. Driving member; 22. Transmission rod; 3. Transmission member; 4. Conveying assembly; 41. Feeding push rod; 42. Loading structure; 5. Annular track; 6. Connecting member; 7. Mounting assembly; 71. Suspension rod; 72. Mounting plate; 8. Cover; 9. Guide mechanism; 91. Guide sleeve; 92. Mounting member. DETAILED DESCRIPTION

[0018] The specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present invention, and the protection scope of the present invention is not limited to the following specific embodiments.

[0019] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "disposed", "provided with", "installed", "matched", and "connected" should be understood in a broad sense. For example, the connection can be a direct connection or an indirect connection through an intermediate connector, and can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0020] In the present invention, unless otherwise specified, the directional words used, such as "facing" and "backward", are defined based on the direction in which the elastic support mechanism is used. Specifically, in the drawings provided by the present invention, the orientation or positional relationship used is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. The orientation terms of the present invention should be understood in conjunction with the actual installation state.

[0021] See also Figures 1 to 3In a first aspect, the present invention provides a silicon wafer conveying device, comprising a support structure 1, a driving assembly 2, a transmission member 3 and a conveying assembly 4. A ring track 5 is arranged on the support structure 1. The transmission member 3 is rotatably arranged in the ring track 5 through the driving assembly 2, and the outer circumference of the transmission member 3 is tangent to the inner circumference of the ring track 5; the conveying assembly 4 comprises a feeding push rod 41, which is hinged to the transmission member 3 through a connecting member 6. The transmission member 3 rotates around its own axis under the action of the driving assembly 2 and moves along the ring track of the ring track 5, and the hinge point between the feeding push rod 41 and the connecting member 6 reciprocates along a preset straight line under the action of the transmission member 3.

[0022] It should be noted that the silicon wafer conveying equipment provided by the present invention eliminates the guide rails of the traditional silicon wafer conveying equipment, saves the space of the silicon wafer conveying equipment, has a simple structure, high adaptability, high conveying accuracy and low production cost.

[0023] It should also be noted that the "preset straight line" in the above scheme refers to the feeding direction of the silicon wafer conveying device, that is, the motion trajectory of the feeding push rod 41 doing reciprocating linear motion. It can be understood that the silicon wafer conveying device provided by the present invention can convert circular motion into reciprocating linear motion, thereby saving the space occupied by the conveying mechanism and reducing the space occupied by the entire conveying device. And by setting the connecting member 6, the stroke length of the reciprocating linear motion of the feeding push rod 41 can be changed by changing the length of the connecting member 6.

[0024] It is understandable that if Figure 3 As shown, the transmission member 3 moves along the inner circumference of the annular track 5 under the driving action of the driving assembly 2, thereby driving the feeding push rod 41 to move along a preset straight line through the connecting member 6 hinged to itself, and while the transmission member 3 moves along the inner circumference of the annular track 5, the transmission member 3 also rotates around its own axis under the action of the driving assembly 2, as shown in FIG. Figure 3As shown, the connecting member 6 can be a connecting plate, one end of the connecting member 6 can be inserted into the mounting hole on the feeding push rod 41 through a rotating rod so as to be rotatably connected with the feeding push rod 41, and the other end of the connecting member 6 is inserted into the mounting hole on the transmission member 3 through another rotating rod so as to be rotatably connected with the axis of the transmission member 3. The connecting member 6, the feeding push rod 41 and the upper surface of the connecting member 6 are arranged parallel to each other. In this way, the circular motion made by the transmission member 3 moving along the inner circumference of the annular track 5 can be converted into a reciprocating motion along a preset straight line driven by the transmission member 3 through the connecting member 6, and the hinge point When the diameters of the transmission member 3 are different, the distance difference between the axis center of the transmission member 3 and the axis center of the circular track 5 caused by insufficient diameter of the transmission member 3 can be compensated by adjusting the length of the connecting member 6, so that the feeding push rod 41 can always move in a straight line along the preset straight line, thereby improving the adaptability of the silicon wafer conveying equipment, simple structure, high conveying accuracy and low production cost. It can be understood that the adaptability here means that technicians can select the corresponding specifications of the transmission member 3 and the connecting member 6 according to the specific use environment and the actual situation of the production line to meet the production and transportation needs.

[0025] Further, see Figure 1 and Figure 2 As some specific embodiments of the present invention, the driving assembly 2 includes a driving member 21 and a transmission rod 22, one end of the transmission rod 22 is fixedly connected to the driving member 21, and the other end of the transmission rod 22 is hinged to the transmission member 3, so that the transmission member 3 can be driven by the transmission rod 22 to rotate around its own axis while moving along the circular trajectory of the circular track 5. The driving member 21 can be a rotating motor, and the transmission rod 22 can be composed of two sections of rods. One end of the first section of the transmission rod 22 is fixedly connected to the rotating shaft of the rotating motor, and the axis of the rod is coaxial with the center of the circular track 5. The other end of the first section of the rod is connected to one end of the second section of the rod. The second section of the transmission rod 22 is rotatably connected to the center of the transmission member 3 at one end away from the first section of the rod, so that the driving member 21 can drive the transmission rod 22 to drive the transmission member 3 to rotate on the inner circumference of the circular track 5 with the center of the circular track 5 as the axis. At the same time, the second section of the transmission rod 22 is rotatably connected to the center of the transmission member 3, so that the transmission member 3 can rotate on the inner circumference of the circular track 5 with the center of the circular track 5 as the axis while rotating around its own axis, so that the feeding push rod 41 hinged to the transmission member 3 through the connecting member 6 makes the linear motion more stable, thereby improving the conveying accuracy of the silicon wafers.

[0026] Further, see Figure 3 As some specific embodiments of the present invention, the annular track 5 is an outer gear ring, the transmission member 3 is a gear, the gear is meshed with the outer gear ring, one end of the connecting member 6 is rotatably connected to the feeding push rod 41, and the other end of the connecting member 6 is hinged to the center of the gear.

[0027] It can be understood that when the transmission member 3 is a gear and the annular track 5 is an outer gear ring, the driving member 21 drives the gear to move along the track on the inner circumference of the outer gear ring. Due to the meshing between the outer gear ring and the gear, the gear can rotate on the inner circumference of the outer gear ring while rotating around its own axis. The connecting member 6 can be a connecting plate. One end of the connecting member 6 can be rotatably connected to the feed push rod 41 through a rotating rod, and the other end of the connecting member 6 can be rotatably connected to the center of the gear through another rotating rod. The connecting member 6, the feed push rod 41 and the upper surface of the connecting member 6 are arranged parallel to each other so that When the driving member 21 drives the gear to rotate around the central axis of the outer gear ring by driving the transmission rod 22, the gear rotates around its own axis under the meshing with the outer gear ring and the action of the driving member 21. Furthermore, through the driving action of the connecting member 6, the feeding push rod 51 and the hinge point of the connecting member 6 can be driven to move linearly along a preset straight line, and the feeding push rod 51 can be made to move linearly. When the radius of the gear is different, the length of the connecting member 6 can be changed to make the feeding push rod 51 move linearly, thereby improving the applicability, simple structure and low cost of the silicon wafer conveying equipment.

[0028] Further, see Figure 1 and Figure 2 As some specific embodiments of the present invention, a needle bearing is further arranged between the connecting member 6 and the transmission member 3. By arranging the needle bearing between the connecting member 6 and the transmission member 3, the friction coefficient between the connecting member 6 and the transmission member 3 can be reduced and the transmission efficiency can be improved.

[0029] Further, see Figure 1 and Figure 2 As some specific embodiments of the present invention, the driving member 21 is installed below the support structure 1 through the mounting assembly 7. The mounting assembly 7 includes a suspension rod 71 and a mounting plate 72. The mounting plate 72 is sleeved on the driving member 21 and fixedly connected to the driving member 21. The mounting plate 72 is suspended below the support structure 1 through the suspension rod 71. There may be four suspension rods 71, which are arranged below the support structure 1 and fixedly connected to the four corners of the mounting plate 72. The driving member 21 is installed on the mounting plate 72 so that the driving member 21 is fixed to the support structure 1, thereby avoiding displacement of the driving member 21 during use, so as to avoid changing the moving position of the transmission member 3 so that the feeding push rod 51 deviates from the preset straight line direction when moving. At the same time, by arranging the driving member 21 below the support structure 1, it is also possible to save space, reduce the volume of the entire silicon wafer conveying equipment, and improve the stability and conveying accuracy of the silicon wafer conveying equipment.

[0030] Further, see Figure 1 and Figure 2As some specific embodiments of the present invention, the support structure 1 includes a mounting platform 11, a support rod 12 and a mounting seat 13. The mounting platform 11 is set on the ground through the support rod 12, the mounting seat 13 is set above the mounting platform 11, and the annular track 5 is set on the mounting platform 11 through the mounting seat 13.

[0031] It can be understood that there can be four support rods 12, which are connected to the four corners of the mounting platform 11 to set the mounting platform 11 on the ground. A mounting seat 13 is set on the mounting platform 11. The mounting seat 13 can be a circular mounting seat. The annular track 5 is fixed in the annular mounting seat, so that the annular track 5 is fixed on the mounting platform 11. The mounting seat 13 can provide an installation space for the annular track 5, and can also make the transmission member 3 operate stably when rotating along the inner circumference of the annular track 5, avoid changing the moving position of the transmission member 3 so that the feeding push rod 51 deviates from the preset straight line direction when moving, thereby improving the stability and conveying accuracy of the silicon wafer conveying equipment.

[0032] Further, see Figure 2 As some specific embodiments of the present invention, a cover shell 8 is provided outside the annular track 5, and an accommodating cavity capable of accommodating the annular track 5 is formed between the cover shell 8 and the upper surface of the mounting seat 13, and an accommodating opening capable of accommodating the feeding push rod 41 is opened on the cover shell 8.

[0033] It can be understood that the cover shell 8 can be a cylindrical cover shell, which is arranged on the mounting seat 13, and a receiving cavity capable of accommodating the annular track 5 is formed between the cover shell 8 and the upper surface of the mounting seat 13, and the annular track 5 is arranged in the receiving cavity. An accommodating opening is penetrated on the cover shell 8 along the movement direction of the feeding push rod 41, so that an accommodating opening capable of accommodating the annular track 5 is formed between the cover shell 8 and the upper surface of the mounting seat 13, and the feeding push rod 41 can make a linear motion in the accommodating opening. On the one hand, the cover shell 8 covers the driving component 2, the transmission component 3 and the conveying component 4, and protects the driving component 2, the transmission component 3 and the conveying component 4 from interference and damage from the external environment, thereby improving the stability of the silicon wafer conveying equipment. On the other hand, the accommodating opening on the cover shell 8 guides and limits the feeding push rod 41, so that the feeding push rod 41 can move along the specified linear direction, thereby improving the conveying accuracy of the silicon wafer conveying equipment.

[0034] Further, see Figure 2 As some specific embodiments of the present invention, it also includes a guide mechanism 9, which includes a guide sleeve 91 and a mounting member 92. The guide sleeve 91 is mounted on the cover 8 through the mounting member 92, and the guide sleeve 91 is sleeved on the feeding push rod 41.

[0035] It can be understood that the guide sleeve 91 is installed on the cover shell 8 through the mounting piece 92, and the barrel mouth of the guide sleeve 91 is connected to the accommodating port on the cover shell 8, so that the feeding push rod 41 can move along a specified straight line direction in the guide sleeve 91, thereby improving the conveying accuracy of the silicon wafer conveying equipment. A linear motion bearing can also be arranged in the guide sleeve 91, and the feeding push rod 41 performs a circular motion in the guide sleeve 91 along a preset straight line direction through the linear motion bearing, so as to reduce the friction between the feeding push rod 41 and the guide sleeve 91, and guide the feeding push rod 41, thereby improving the conveying accuracy and efficiency of the silicon wafer conveying equipment.

[0036] Further, see Figure 1 and Figure 2 As some specific embodiments of the present invention, the conveying component 4 also includes a loading structure 42, which is arranged at one end of the feeding push rod 41 away from the transmission member 3 so as to be able to load materials. The loading structure 42 can be set as a tray to carry silicon wafers for movement to prevent silicon wafers from falling, thereby improving the stability of the silicon wafer conveying equipment. At the same time, the loading structure 42 can be changed according to the conveying requirements, such as changing the size of the tray, etc., to adapt to different conveying requirements in turn, thereby improving the applicability of the silicon wafer conveying equipment.

[0037] In addition, the second aspect of the present invention also provides a silicon wafer production line, which includes the silicon wafer conveying equipment described in any one of the technical solutions. The silicon wafer conveying equipment used in the silicon wafer production line has a simple and stable structure, low production cost and high transportation accuracy. By using the silicon wafer conveying equipment, the transportation accuracy of the silicon wafer production line can be improved and the production cost can be reduced.

[0038] In order to better understand the technical solution and use method of the present invention, the preferred embodiments are described below in combination with relatively comprehensive preferred technical features.

[0039] See also Figures 1 to 3Four support rods 12 are fixedly installed at the four corners of the mounting platform 11, and the four support rods 12 fix the mounting platform 11 on the ground. A mounting seat 13 is arranged on the mounting platform 11, and the mounting seat 13 is a circular mounting seat. A cover shell 8 is arranged on the mounting seat 13, and the cover shell 8 is a cylindrical cover shell. There is an accommodating cavity between the cover shell 8 and the upper surface of the mounting seat 13, and an annular track 5 is fixed in the accommodating cavity, wherein the annular track 5 is an outer gear ring, and four suspension rods 71 ​​are arranged below the mounting platform 11, and the suspension rods 71 ​​are fixedly connected to the four corners of the mounting plate 72, and the driving member 21 is installed on the mounting plate 72 through, wherein the driving member 21 can be a rotating motor, and a transmission rod 22 is connected to the rotating motor, and the transmission rod 22 is composed of two sections of rods, and the first section of the transmission rod 22 One end of a rod is fixedly connected to the rotating motor, the axis of the rod is coaxial with the center of the circular track 5, the other end of the first rod is connected to one end of the second rod, and the end of the second rod of the transmission rod 22 away from the first rod is rotatably connected to the center of the transmission member 3, wherein the transmission member 3 can be a gear, the gear is meshed with the outer gear ring, and the gear is connected to the feeding push rod 41 through a connecting member 6, wherein one end of the connecting member 6 can be rotatably connected to the feeding push rod 41 through a rotating rod, and the other end of the connecting member 6 is rotatably connected to the center of the gear through another rotating rod, and the connecting member 6, the feeding push rod 41 and the connecting member 6 are arranged parallel to each other, so that the feeding push rod 41 on the gear can be driven to move when the gear rotates along the inner circumference of the outer gear ring. When the gear is in motion, the gear rotates around its own axis, thereby driving the feed push rod 51 connected to the connecting piece 6 for parallel rotation to rotate, so that the feed push rod 51 can slide on the gear, so that the hinge point of the feed push rod 51 and the connecting piece 6 can make a linear motion. In this way, the circular motion of the transmission member 3 moving along the inner circumference of the annular track 5 can be converted into a reciprocating motion along a preset straight line driven by the transmission member 3 through the connecting piece 5. When the diameter of the transmission member 3 is different, the distance difference between the axis center of the transmission member 3 and the axis center of the annular track 5 caused by the insufficient diameter of the transmission member 3 can be supplemented by adjusting the length of the connecting piece, so that the feed push rod 41 can always make a linear motion, thereby improving The silicon wafer conveying equipment has good adaptability, simple structure, high conveying accuracy and low production cost. A receiving opening is provided on the cover shell 8 along the movement direction of the feeding push rod 41. The guide sleeve 91 is installed on the cover shell 8 through the mounting member 92. The tube mouth of the guide sleeve 91 is communicated with the receiving opening on the cover shell 8, so that the feeding push rod 41 can move along a specified straight line direction in the guide sleeve 91. A tray can be provided at the end of the feeding push rod 41 away from the transmission member 3 for carrying silicon wafers, so as to carry the silicon wafers for movement and prevent the silicon wafers from falling, thereby improving the stability of the silicon wafer conveying equipment. At the same time, the loading structure 42 can be changed according to the conveying requirements, such as changing the size of the tray, etc., to adapt to different conveying requirements in turn, thereby improving the applicability of the silicon wafer conveying equipment.

[0040] The silicon wafer conveying equipment provided by the present invention drives the transmission member 3 on the circular track 5 by setting a driving component 2 to rotate along the inner surface of the circular track 5 on the one hand and along the center of the transmission member 3 on the other hand, thereby driving the conveying component 4 to perform linear motion, thereby removing the guide rails of the traditional silicon wafer conveying equipment, converting the circular motion into reciprocating linear motion, saving space for the silicon wafer conveying equipment, and having a simple structure, high adaptability, high conveying accuracy, and low production cost.

[0041] The preferred embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited thereto. Within the technical concept of the present invention, the technical solution of the present invention can be subjected to a variety of simple modifications, including the combination of various specific technical features in any appropriate manner. In order to avoid unnecessary repetition, the present invention will not further describe various possible combinations. However, these simple modifications and combinations should also be regarded as the contents disclosed by the present invention and belong to the protection scope of the present invention.

Claims

1. A silicon wafer conveying device, characterized in that: The invention comprises a support structure (1), a driving assembly (2), a transmission member (3) and a conveying assembly (4), wherein an annular track (5) is arranged on the support structure (1), the transmission member (3) is rotatably arranged in the annular track (5) through the driving assembly (2), and the outer peripheral surface of the transmission member (3) is tangent to the inner peripheral surface of the annular track (5); The conveying assembly (4) comprises a feeding push rod (41), wherein the feeding push rod (41) is hinged to the transmission member (3) via a connecting member (6), and the transmission member (3) rotates around its own axis under the action of the driving assembly (2) and moves along the circular track of the circular track (5), and the hinge point between the feeding push rod (41) and the connecting member (6) reciprocates along a preset straight line under the action of the transmission member (3).

2. The silicon wafer conveying equipment according to claim 1, characterized in that: The driving assembly (2) comprises a driving member (21) and a transmission rod (22), one end of the transmission rod (22) being fixedly connected to the driving member (21), and the other end of the transmission rod (22) being hinged to the transmission member (3), so that the transmission member (3) can be driven by the transmission rod (22) to rotate around its own axis and move along the annular track of the annular track (5) at the same time.

3. The silicon wafer conveying equipment according to claim 2, characterized in that: The annular track (5) is an outer gear ring, the transmission member (3) is a gear, the gear is meshed with the outer gear ring, one end of the connecting member (6) is rotatably connected to the feeding push rod (41), and the other end of the connecting member (6) is hinged to the center of the gear.

4. The silicon wafer conveying equipment according to claim 3, characterized in that: A needle bearing is also provided between the connecting member (6) and the transmission member (3).

5. The silicon wafer conveying equipment according to claim 4, characterized in that: The driving member (21) is installed below the support structure (1) via a mounting assembly (7); the mounting assembly (7) comprises a suspension rod (71) and a mounting plate (72); the mounting plate (72) is sleeved on the driving member (21) and fixedly connected to the driving member (21); the mounting plate (72) is suspended below the support structure (1) via the suspension rod (71).

6. The silicon wafer conveying equipment according to any one of claims 2 to 5, characterized in that: The support structure (1) comprises a mounting platform (11), a support rod (12) and a mounting seat (13); the mounting platform (11) is arranged on the ground via the support rod (12); the mounting seat (13) is arranged above the mounting platform (11); and the annular track (5) is arranged on the mounting platform (11) via the mounting seat (13).

7. The silicon wafer conveying equipment according to claim 6, characterized in that: The annular track (5) is also covered by a cover shell (8), a receiving cavity capable of receiving the annular track (5) is formed between the cover shell (8) and the upper surface of the mounting seat (13), and a receiving opening capable of receiving the feeding push rod (41) is provided on the cover shell (8).

8. The silicon wafer conveying equipment according to claim 7, characterized in that: It also includes a guide mechanism (9), the guide mechanism (9) including a guide sleeve (91) and a mounting member (92), the guide sleeve (91) being mounted on the cover shell (8) via the mounting member (92), and the guide sleeve (91) being sleeved on the feeding push rod (41).

9. The silicon wafer conveying equipment according to claim 8, characterized in that: The conveying assembly (4) further comprises a loading structure (42), wherein the loading structure (42) is arranged at an end of the feeding push rod (41) away from the transmission member (3) so as to be capable of loading materials.

10. A silicon wafer production line, characterized in that: It comprises the silicon wafer conveying equipment according to any one of claims 1 to 9.

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