Manufacturing method of electrode microstructure and electrode microstructure thereof

Abstract

The invention discloses a manufacturing method of an electrode microstructure and the electrode microstructure. The manufacturing method of the electrode microstructure comprises the following steps of: taking a flexible plastic part; sputtering a surface structure layer on the surface of the plastic part to form an electrode microstructure; wherein the surface structure layer is composed of a one-dimensional metal nanometer crystal structure, the surface structure layer comprises a plurality of microstructures, the microstructures are distributed on the surface of the plastic part at intervals, each microstructure is provided with at least one pointed body, and the pointed bodies provide point discharge. Therefore, the pointed bodies of the microstructures provide point discharge so as to facilitate the processing efficiency of the subsequent electroplating electrode microstructure, the pointed bodies of the microstructures can also provide a larger surface area to react with an electroplating material, and meanwhile, the rough structural surface of the surface structural layer can also enhance the bonding strength with the electroplating material.

Description

Technical Field

[0001] The present application relates to the technical field of electrode structures, and in particular to a method for manufacturing an electrode microstructure and an electrode microstructure thereof. Background Art

[0002] In the existing technology, nanotechnology covers a wide range, and nanomaterials are only a part of it, but they are the foundation of the development of nanotechnology. The excellent properties of nanomaterials can be applied to various fields. Nanomaterials refer to materials with a scale of nanometers (0.1-100nm) in a certain dimension. They include zero-dimensional, one-dimensional, and two-dimensional nanomaterials. As long as any dimension appears at the nanoscale, it can be called a nanomaterial. When the scale of a material enters the nanoscale, a series of phenomena and effects appear due to its special physical structure, which can produce a series of corresponding applications. Summary of the invention

[0003] The embodiment of the present application provides a method for manufacturing an electrode microstructure and an electrode microstructure thereof, which uses nanomaterials to manufacture the surface microstructure of the electrode structure to effectively improve the electroplating effect.

[0004] In order to solve the above technical problems, this application is implemented as follows:

[0005] The first aspect provides a method for manufacturing an electrode microstructure, the steps of which include: taking a flexible plastic part; and sputtering a surface structure layer on the surface of the plastic part to form an electrode microstructure, wherein the surface structure layer is composed of a one-dimensional metal nanocrystal structure, and the surface structure layer includes a plurality of microstructures, wherein the plurality of microstructures are distributed on the surface of the plastic part at intervals, and each microstructure has at least one pointed body, and the pointed body provides tip discharge.

[0006] In one embodiment, after the step of forming the electrode microstructure, the step further includes rolling the electrode microstructure to form a coil, and rolling the surface of the electrode microstructure having the surface structure layer onto the outer surface of the coil.

[0007] In one embodiment, the material of the surface structure layer is copper-tungsten, silver-tungsten alloy, platinum, nickel fiber, nickel-copper, iridium dioxide, nickel-iridium, copper-iridium or antimony-tin oxide.

[0008] In one embodiment, the nanometer dimensions of the height and width of the microstructures are between 1 nm and 50 nm.

[0009] The second aspect provides an electrode microstructure, comprising: a plastic part and a surface structure layer. The surface structure layer is disposed on the surface of the plastic part, the surface structure layer is composed of a one-dimensional metal nanocrystal structure, the surface structure layer comprises a plurality of microstructures, the plurality of microstructures are spaced apart and distributed on the surface of the plastic part, each microstructure has at least one spike, and the spike provides tip discharge.

[0010] In one embodiment, the structural shapes of the plurality of microstructures include tubular, columnar, linear, ribbon, needle, spiral and / or ring.

[0011] In one embodiment, the nanometer dimensions of the height and width of the microstructures are between 1 nm and 50 nm.

[0012] The present application provides a method for manufacturing an electrode microstructure and an electrode microstructure thereof, wherein the electrode microstructure is formed by directly sputtering a surface structure layer onto a plastic part. The surface structure layer is composed of a one-dimensional metal nanocrystal structure, and the surface structure layer includes a plurality of microstructures, and the plurality of microstructures are distributed on the surface of the plastic part at intervals, and each microstructure has at least one pointed body, so that the pointed body of the microstructure can provide a tip discharge, which is beneficial to the process efficiency of the subsequent electroplating conductive part, and can also provide a larger surface area to react with the electroplating material. At the same time, the surface structure layer is an incomplete rough structure surface, and the rough structure surface can also enhance the bonding strength with the electroplating material. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The exemplary implementation methods and descriptions of the present application are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0014] Figure 1 It is a block diagram of the steps of the method for making the electrode microstructure of the present application;

[0015] Figure 2 is a schematic diagram of the electrode microstructure of the present application; and

[0016] Figure 3 is another schematic diagram of the electrode microstructure of the present application.

[0017] The following is a description with reference to the accompanying drawings: 1: electrode microstructure; 11: plastic part; 111: inner surface; 112: outer surface; 13: surface structure layer; 131: microstructure; 1311: pointed body; 3: coil. DETAILED DESCRIPTION

[0018] The following will disclose multiple embodiments of the present application with drawings. For the purpose of clear description, many implementation details will be described together in the following description. However, it should be understood that these implementation details should not be used to limit the present application. That is to say, in some embodiments of the present application, these implementation details are not necessary. In addition, in order to simplify the drawings, some conventional structures and components will be illustrated in a simple schematic manner in the drawings. In the following embodiments, the same reference numerals will be used to represent the same or similar components.

[0019] See also Figure 1 and Figure 2 , Figure 1 The method for making the electrode microstructure of the present invention is a block diagram of the steps and Figure 2 Schematic diagram of an electrode microstructure. As shown in the figure, the present application provides a method for manufacturing an electrode microstructure 1, wherein step S comprises:

[0020] Step S100: Take a flexible plastic part 11. In this embodiment, the plastic part 11 is polyethylene terephthalate (PET). The plastic part 11 is taken as a base structure. The plastic part 11 can be bent into a roll structure. The roll structure of the plastic part 11 is convenient for subsequent related processes.

[0021] Step S200: Sputtering a surface structure layer 13 on the surface of the plastic part 11 to form an electrode microstructure 1, wherein the surface structure layer 13 is composed of a one-dimensional metal nanocrystal structure. The surface structure layer 13 includes a plurality of microstructures 131, and the plurality of microstructures 131 are distributed on the surface of the plastic part 11 at intervals. Each microstructure 131 has at least one spike 1311, and the spike 1311 provides tip discharge.

[0022] The present embodiment is to process the plastic part 11 by sputtering. Sputtering is a physical vapor deposition technology, which refers to the physical process in which atoms in the target material are hit by high-energy ions and leave and enter the gas. Sputtering is to pass high-voltage negative electricity in a stable vacuum environment to dissociate the inert gas to form plasma. The target material is set at the cathode position, and the plated object is placed at the anode position. The positive ions of the ionized inert gas bombard the surface of the target material, and the surface atoms of the target material are sputtered out and deposited on the plated object to form a surface structure. In this embodiment, the target material contains copper tungsten, silver tungsten alloy, platinum, nickel fiber, nickel copper, iridium dioxide, nickel iridium, copper iridium or antimony tin oxide. The plated object is a flexible plastic part 11. After the target material containing copper tungsten, silver tungsten alloy, platinum, nickel fiber, nickel copper, iridium dioxide, nickel iridium, copper iridium or antimony tin oxide is bombarded with atoms by the positive ions of the inert gas, it is deposited on the surface of the plastic part 11 to form a surface structure layer 13. The surface structure layer 13 is composed of nanomaterials of one-dimensional nanocrystals. The structure of one-dimensional nanocrystals means that the two dimensions of length, width and height are both nanometers. The nanometer dimensions of height and width of the structure of one-dimensional metal nanocrystals are between 1nm and 50nm. In addition, the shapes of one-dimensional nanocrystals include tubes, columns, lines, ribbons, needles, spirals and / or rings in addition to the pointed body 1311.

[0023] As mentioned above, in the process of the target material gradually forming the surface structure layer 13, the target material sputtered on the surface of the plastic part 11 cannot form a complete surface, that is, the state of the surface structure layer 13 sputtered on the surface of the plastic part 11 cannot reach the structural condition of the two-dimensional metal nanocrystal forming a complete plane. In other words, the state of the surface structure layer 13 sputtered on the surface of the plastic part 11 is in the structural characteristics of an incomplete plane formed by one-dimensional metal nanocrystals. More specifically, the surface structure layer 13 is composed of a plurality of microstructures 131, and the plurality of microstructures 131 of the surface structure layer 13 are separated and distributed on the surface of the plastic part 11. The plurality of microstructures 131 present a block-like island separation structure, and the sides of the plurality of microstructures 131 are not connected to each other.

[0024] Furthermore, when the plurality of microstructures 131 of the surface structure layer 13 are distributed on the plastic part 11, each microstructure 131 has at least one pointed body 1311, wherein the pointed body 1311 of the microstructure 131 can provide tip discharge, that is, the sharper the tip of the conductor, the more obvious the tip effect. Because the surface charge density of the place with large curvature of the surface of the object (such as the top of the sharp edge or small object) is higher, the electric field strength is also stronger, so as to enhance the effect of electron discharge. In other words, since each microstructure 131 is separated from each other, each microstructure 131 can be regarded as a single structure that can discharge, and the pointed bodies 1311 of the plurality of microstructures 131 of the surface structure layer 13 can produce the effect of tip discharge, so as to enhance the effect of electron discharge and improve the process efficiency. In this way, the discharge effect of the pointed bodies 1311 of the plurality of microstructures 131 of the surface structure layer 13 of this embodiment is helpful for the electrolysis of water or the precipitation of materials, etc., and it can be used in accordance with the needs of the user.

[0025] Furthermore, the surface structure layer 13 is an incomplete plane rough structure surface composed of a one-dimensional metal nanocrystal structure, that is, the spikes 1311 of each microstructure 131 make the surface of the surface structure layer 13 present an uneven three-dimensional structure. In this way, the surface structure layer 13 composed of one-dimensional metal nanocrystals has a larger surface area than a general complete plane, which is conducive to providing a larger surface area for electroplating with electroplating materials. The rough structure surface of the surface structure layer 13 can also enhance the bonding strength with the electroplating material.

[0026] Please also read Figure 1 and Figure 3 , Figure 3 It is another schematic diagram of the electrode microstructure of the present application. As shown in the figure, in this embodiment, step S300: since this embodiment uses a flexible plastic part 11 as a substrate, it can further form a coil 3 by rolling the electrode microstructure 1 after the step of forming the coil 3, and roll the surface of the electrode microstructure 1 having the surface structure layer 13 on the outer surface 112 of the coil 3. In addition, according to the needs of the user, another surface structure layer can also be made for the inner surface 111 of the plastic part 11 relative to the other surface of the outer surface 112 (not shown in the figure).

[0027] In summary, the present application provides a method for manufacturing an electrode microstructure and its electrode microstructure, which forms a surface structure layer composed of a one-dimensional metal nanocrystal structure on a conductive part, and the surface structure layer is an incomplete rough structure surface to form a larger surface area. The surface structure layer includes a plurality of microstructures, and the plurality of microstructures are distributed on the conductive layer, and each microstructure has at least one pointed body. Such a pointed body of the microstructure can provide tip discharge, which is beneficial to the process efficiency of the subsequent electroplating of the conductive part, and can also provide a larger surface area to react with the electroplating material. At the same time, the rough structure surface of the surface structure layer can also strengthen the bonding strength with the electroplating material.

[0028] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the process, method, commodity or device including the elements.

[0029] The above description shows and describes several preferred embodiments of the present application, but as mentioned above, it should be understood that the present application is not limited to the form disclosed herein, and should not be regarded as excluding other embodiments, but can be used in various other combinations, modifications and environments, and can be modified within the scope of the invention of the present invention through the above teachings or the technology or knowledge of the relevant field. The changes and modifications made by those skilled in the art do not depart from the spirit and scope of the present application, and should be within the scope of protection of the claims attached to the present application.

Claims

1. A method for manufacturing an electrode microstructure, characterized in that: The steps include: Take a flexible plastic piece; and A surface structure layer is sputtered on the surface of the plastic part to form the electrode microstructure, wherein the surface structure layer is composed of a one-dimensional metal nanocrystal structure, and the surface structure layer includes a plurality of microstructures, and the plurality of microstructures are distributed on the surface of the plastic part at intervals, and each of the microstructures has at least one spike, and the spike provides tip discharge.

2. The method for manufacturing an electrode microstructure according to claim 1, characterized in that: After the step of forming the electrode microstructure, the method further includes rolling the electrode microstructure to form a coil, and rolling the surface of the electrode microstructure having the surface structure layer onto the outer surface of the coil.

3. The method for manufacturing an electrode microstructure according to claim 1, characterized in that: The material of the surface structural layer is copper-tungsten, silver-tungsten alloy, platinum, nickel fiber, nickel-copper, iridium dioxide, nickel-iridium, copper-iridium or antimony-tin oxide.

4. The method for manufacturing an electrode microstructure according to claim 1, characterized in that: The nanometer dimensions of height and width of the microstructures are between 1 nm and 50 nm.

5. An electrode microstructure, characterized in that: include: Plastic parts; as well as A conductive layer, sputtered on the surface of the plastic part; as well as A surface structure layer is arranged on the surface of the plastic part. The surface structure layer is composed of a one-dimensional metal nanocrystal structure. The surface structure layer includes a plurality of microstructures. The plurality of microstructures are distributed on the surface of the plastic part at intervals. Each microstructure has at least one pointed body, and the pointed body provides tip discharge.

6. The electrode microstructure according to claim 5, characterized in that: The structural shapes of the plurality of microstructures further include tubular, columnar, linear, ribbon, needle, spiral and / or ring shapes.

7. The electrode microstructure according to claim 5, characterized in that: The nanometer dimensions of height and width of the microstructures are between 1 nm and 50 nm.

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