Lifting type drying equipment suitable for processing wafers of multiple sizes

Abstract

The invention relates to lifting type drying equipment suitable for multi-size wafer processing, and belongs to the technical field of wafer production equipment. The lifting type drying equipment suitable for processing the wafers of multiple sizes is composed of a groove body, a cover body, a water vapor supply system and a wafer lifting mechanism, and a wafer basket supporting frame is arranged on the wafer lifting mechanism. According to the wafer basket supporting frame, the first supporting block, the second supporting block and the third supporting block and the two side plates are used for supporting a first wafer basket and a second wafer basket which are different in size through one supporting frame, so that the wafer cleaning production equipment can directly adapt to wafers different in size, and the adaptability of the equipment is improved; and meanwhile, the wafer basket is stably and reliably supported.

Description

Technical Field

[0001] The present application belongs to the technical field of wafer production equipment, and in particular, relates to a lifting drying equipment suitable for processing wafers of multiple sizes. Background Art

[0002] For semiconductor wafer cleaning, the wafer needs alkaline cleaning solution cleaning, pure water cleaning, hydrofluoric acid cleaning, ozone water cleaning, drying and other processes. Wafer drying is generally the last step of wafer cleaning, which can remove the residual cleaning solution on the surface of the wafer, prevent the wafer from oxidation, and control the surface moisture and surface cleanliness. Whether it is drying or cleaning, a support frame is needed to support the wafer basket. Chinese patent document CN115295441A discloses a wafer cleaning and drying equipment, which consists of a tank body, a cover body, a water and gas supply system and a wafer lifting mechanism. The support frame of the wafer basket is set on the wafer lifting mechanism. The wafer is placed in the wafer basket in the tank body to complete the cleaning. When drying, the wafer lifting mechanism lifts the wafer basket, and then the wafer is sent into the cover body alone to complete the drying in the cover body. At present, wafers have a variety of sizes such as 6 inches, 8 inches and even 12 inches. Sometimes wafers of different sizes need to be processed in one device. At this time, the existing wafer cleaning and drying equipment cannot adapt to wafer baskets and wafers of different sizes at the same time. Summary of the invention

[0003] The technical problem to be solved by the present invention is: to solve the deficiencies in the prior art, thereby providing a lifting drying device that can be suitable for processing wafers of multiple sizes.

[0004] The technical solution adopted by the present invention to solve its technical problem is: A lifting drying device suitable for processing wafers of multiple sizes, comprising: Tank body; A cover body is arranged above the trough body and can reach or leave the opening of the trough body under the drive of the translation mechanism. A wafer guide groove is arranged on the inner wall of the cover body and can cooperate with the wafer groove in the wafer basket; A water and gas supply system, used to supply cleaning water to the tank body or to supply drying gas to the cover body; A wafer lifting mechanism is used to carry a wafer basket and bring the wafer into the tank body, and when drying, the wafer is pushed into the cover body. The wafer lifting mechanism is provided with a wafer basket support frame for supporting the wafer basket; The wafer basket support frame comprises: Base; There are two side panels, located at both ends of the base; The first support block, the second support block and the third support block are all arranged on the base and located between the two side plates, and the third support block is located between the first support block and the second support block; The first support block is provided with a first step tread and a second step tread, the second support block is provided with a third step tread, the third support block is provided with a fourth step tread, the third step tread is provided at a lower height than the second step tread, the first step tread and the third step tread are at the same height, and the second step tread and the fourth step tread are at the same height; The first step tread and the third step tread are used to support the bottom of the first wafer basket, and the side surface of the second support block and one of the side plates limit the side surface of the first wafer basket; The second step tread and the fourth step tread are used to support the bottom of the second wafer basket and the two side plates limit the side surfaces of the second wafer basket.

[0005] Preferably, in the lifting drying equipment applicable to multi-size wafer processing of the present invention, the orientation of the first step riser corresponding to the second step tread is opposite to the orientation of the second step riser corresponding to the third step tread.

[0006] Preferably, in the lifting drying equipment applicable to multi-size wafer processing of the present invention, the first supporting block has a U-shaped groove, and the bottom of the U-shaped groove is the first step tread.

[0007] Preferably, in the lifting drying equipment applicable to multi-size wafer processing of the present invention, the middle of the side plate is hollowed out, and the top plate is installed on the side plate.

[0008] Preferably, in the lifting drying equipment applicable to multi-size wafer processing of the present invention, the top surfaces of the first step tread, the second step tread, the third step tread and the fourth step tread are inclined surfaces.

[0009] Preferably, in the lifting drying equipment applicable to multi-size wafer processing of the present invention, the third supporting block is located at the midpoint of the two side plates.

[0010] Preferably, in the lifting drying equipment applicable to multi-size wafer processing of the present invention, the middle of the side plate is hollowed out, and a top block is installed between the two side plates.

[0011] Preferably, in the lifting drying equipment applicable to multi-size wafer processing of the present invention, rows of positioning grooves are formed on the top block.

[0012] Preferably, the lifting drying equipment suitable for multi-size wafer processing of the present invention has three mounting grooves formed on the base, and the first support block, the second support block and the third support block are installed in the mounting grooves, and the installation of the first support block, the second support block and the third support block can be positioned through the mounting grooves.

[0013] Preferably, in the lifting drying equipment applicable to multi-size wafer processing of the present invention, the first wafer basket is a 6-inch wafer basket for accommodating 6-inch wafers, and the second wafer basket is an 8-inch wafer basket for accommodating 8-inch wafers.

[0014] The beneficial effects of the present invention are: The lifting drying equipment applicable to multi-size wafer processing of the present application is composed of a trough body, a cover body, a water vapor supply system and a wafer lifting mechanism. A wafer basket support frame is arranged on the wafer lifting mechanism. The wafer lifting mechanism can push the wafers in the wafer basket on the wafer basket support frame into the cover body to complete drying in the cover body. At this time, the wafers are separated from the wafer basket, which completely overcomes the obstruction of the wafer basket to the drying gas and achieves an efficient wafer drying effect. The wafer basket support frame uses three support blocks, namely the first support block, the second support block and the third support block, and two side plates to realize a support frame to support the first wafer basket and the second wafer basket of two different sizes, so that the lifting drying equipment can directly adapt to wafers of different sizes, improve the adaptability of the equipment, and at the same time, the support for the wafer basket is stable and reliable. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The technical solution of the present application is further described below in conjunction with the accompanying drawings and embodiments.

[0016] Figure 1 is a three-dimensional diagram of a lifting drying device suitable for processing wafers of multiple sizes according to an embodiment of the present application; Figure 2 is a three-dimensional diagram of a wafer lifting mechanism according to an embodiment of the present application; Figure 3 It is a schematic diagram of the structure of the wafer basket support frame of the embodiment of the present application when supporting a 6-inch wafer basket; Figure 4 It is a schematic diagram of the structure of the wafer basket support frame of the embodiment of the present application when supporting an 8-inch wafer basket; Figure 5 It is a schematic diagram of the structure of the wafer lifting mechanism of the embodiment of the present application when supporting a 6-inch wafer basket; Figure 6 It is a structural schematic diagram of the wafer lifting mechanism of the embodiment of the present application when supporting an 8-inch wafer basket; The reference numerals in the figure are: 1 Wafer basket support frame; 2 tank body; 3. Cover; 4. Water and gas supply system; 5. Wafer lifting mechanism; 11 base; 12 side panels; 13 first support block; 14 second supporting block; 15 third support block; 16 top block; 51 Mounting seat; 52 stand; 54 guide block; 55 connecting rod mechanism; 56 rollers; 57 Synchronous wheel; 58 wafer basket support rod; 59 ram; 91 1st wafer basket; 92 second wafer basket; 111 mounting slot; 131 First step tread; 132 Second stair tread; 133 First step riser; 141 Third step tread; 142 Second step riser; 151 Fourth step tread; 521 slide rail; 522 ball screw transmission pair; 531 first slider; 532 Second slider. DETAILED DESCRIPTION

[0017] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application may be combined with each other.

[0018] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present application. In addition, the terms "first", "second", etc. are used only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the invention, unless otherwise specified, "multiple" means two or more.

[0019] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood by specific circumstances.

[0020] The technical solution of the present application will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0021] Example This embodiment provides a lifting drying device suitable for processing wafers of multiple sizes, such as Figure 1 As shown, including: Tank 2; The cover body 3 is arranged above the trough body 2 and can reach or leave the opening of the trough body 2 driven by the translation mechanism. The inner wall of the cover body 3 is provided with a wafer guide groove and can cooperate with the wafer groove in the wafer basket; A water and gas supply system 4, used to supply cleaning water to the tank body 2 or supply drying gas to the tank body 2 and / or the cover body 3; The wafer lifting mechanism 5 is used to carry the wafer basket and bring the wafer into the tank body 2. When drying, the wafer is pushed into the cover body 3. The wafer lifting mechanism 5 is provided with a wafer basket support frame 1 for supporting the wafer basket; like Figure 2-6 As shown, the wafer basket support frame 1 includes: Base 11; There are two side panels 12, which are respectively located at two ends of the base 11; The first support block 13, the second support block 14 and the third support block 15 are all arranged on the base 11 and located between the two side plates 12, and the third support block 15 is located between the first support block 13 and the second support block 14; The first support block 13 is provided with a first step tread 131 and a second step tread 132, the second support block 14 is provided with a third step tread 141, the third support block 15 is provided with a fourth step tread 151, the third step tread 141 is provided at a lower height than the second step tread 132, the first step tread 131 and the third step tread 141 are at the same height, and the second step tread 132 and the fourth step tread 151 are at the same height; The first step tread 131 and the third step tread 141 are used to support the bottom of the first wafer basket, and the side surface of the second support block 14 and one of the side plates 12 limit the side surface of the first wafer basket; The second step tread 132 and the fourth step tread 151 are used to support the bottom of the second wafer basket, and the two side plates 12 limit the side surfaces of the second wafer basket.

[0022] The lifting drying equipment applicable to multi-size wafer processing of the present application is composed of a trough body 2, a cover body 3, a water and gas supply system 4 and a wafer lifting mechanism 5, and a wafer basket support frame 1 is arranged on the wafer lifting mechanism 5. The wafer basket support frame 1 uses three support blocks, namely, a first support block 13, a second support block 14 and a third support block 15, and two side plates 12 to realize that one support frame supports two first wafer baskets and a second wafer basket of different sizes, so that the wafer cleaning production equipment can directly adapt to wafers of different sizes, improve the adaptability of the equipment, and at the same time, the support for the wafer basket is stable and reliable.

[0023] like Figure 2 As shown, the wafer lifting mechanism 5 includes a mounting seat 51, a stand 52 arranged on the mounting seat 51, a slide rail 521 and a ball screw transmission pair 522 are arranged on the stand 52, a first slider 531 and a second slider 532 are slidably arranged on the slide rail 521, the first slider 531 is connected to the ball screw transmission pair 522, and a connecting rod mechanism 55 and a guide block 54 are further arranged on one side of the stand 52, the connecting rod mechanism 55 connects the first slider 531 and the second slider 532, and is used to realize the linkage of the first slider 531 and the second slider 532. The guide block 54 has a guide surface that cooperates with the roller 56 on the connecting rod mechanism 55. When the ball screw transmission pair 522 rotates to drive the first slider 531 to move, the roller 56 moves on the guide surface and limits the relative movement of the first slider 531 and the second slider 532. The relative movement of the first slider 531 and the second slider 532 will make; the first slider 531 is respectively connected to the L-shaped wafer basket support rod 58, and the second slider 532 is connected to the L-shaped top rod 59; the wafer basket support frame 1 is installed on the two wafer basket support rods 58; The mounting seat 51 is provided with a motor to drive the synchronous wheel 57 to rotate. The synchronous wheel 57 is coaxially arranged with the screw of the ball screw transmission pair 522. The whole movement process is as follows (when the wafer basket mounting plate gradually rises from the lowest point): the first slider 531 and the second slider 532 are connected together to make vertical upward movement. When rising to near the cover body 3, the first slider 531 and the second slider 532 are separated. During the separation process, the rising height of the push rod 59 is higher than the rising height of the wafer basket support rod 58. The push rod 59 (a push block directly in contact with the wafer is arranged above the push rod 59, and the push block extends under the wafer basket) gradually lifts the wafer, separates the wafer from the wafer basket, and pushes the wafer into the cover body 3.

[0024] Furthermore, the orientation of the first step riser surface 133 corresponding to the second step tread 132 is opposite to the orientation of the second step riser surface 142 corresponding to the third step tread 141, and the wafer basket is positioned laterally by the two riser surfaces.

[0025] Furthermore, the first support block 13 has a U-shaped groove, and the bottom of the U-shaped groove is the first step 131. The U-shaped groove is also used to clamp the bottom of the first wafer basket 91.

[0026] Furthermore, the middle of the side plate 12 is hollowed out, and a top block 16 (mounted on the base 11) is installed between the two side plates 12. The top block 16 is formed with rows of positioning grooves. The wafer basket is placed on a support frame suitable for multi-size wafer baskets. The top block 16 can lift the wafers in the wafer basket to a certain height. The positioning groove fixes the position of the wafer so that it can be aligned with the wafer slot in the cover body 3. A space is formed between the two top blocks 16 to avoid the lifting and lowering of the top rod 59.

[0027] Furthermore, the top surfaces of the first step 131 and the second step 132 , the third step 141 and the fourth step 151 are inclined surfaces, forming pointed ends to reduce the contact area with the wafer basket.

[0028] Furthermore, the third support block 15 is located at the midpoint of the two side panels 12 .

[0029] Furthermore, three mounting grooves 111 are formed on the base 11, and the first support block 13, the second support block 14 and the third support block 15 are mounted in the mounting grooves 111. The first support block 13, the second support block 14 and the third support block 15 can be positioned through the mounting grooves 111. The first support block 13, the second support block 14 and the third support block 15 are mounted on the base 11 by screws, and the first support block 13, the second support block 14 and the third support block 15 are provided with long holes to facilitate position adjustment.

[0030] The applicable multi-size wafer basket support frame of the present application can be used for accommodating a 6-inch wafer basket (first wafer basket 91 ) for accommodating 6-inch wafers or an 8-inch wafer basket (second wafer basket 92 ) for accommodating 8-inch wafers.

[0031] Based on the above ideal embodiments of this application, the relevant staff can make various changes and modifications without departing from the technical concept of this application through the above description. The technical scope of this application is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A lifting drying device suitable for processing wafers of multiple sizes, characterized in that: include: Tank body (2); A cover body (3) is arranged above the trough body (2) and can reach or leave the opening of the trough body (2) under the drive of the translation mechanism; a wafer guide groove is arranged on the inner wall of the cover body (3) and can cooperate with the wafer groove in the wafer basket; A water and gas supply system (4) is used to supply cleaning water into the tank body (2) or supply drying gas into the cover body (3); A wafer lifting mechanism (5) is used to carry a wafer basket and bring the wafers into the tank body (2), and to push the wafers into the cover body (3) during drying. A wafer basket support frame (1) for supporting the wafer basket is provided on the wafer lifting mechanism (5); The wafer basket support frame (1) comprises: Base (11); Two side panels (12) are respectively located at two ends of the base (11); The first support block (13), the second support block (14) and the third support block (15) are all arranged on the base (11) and located between the two side plates (12), and the third support block (15) is located between the first support block (13) and the second support block (14); The first support block (13) is provided with a first step tread (131) and a second step tread (132), the second support block (14) is provided with a third step tread (141), and the third support block (15) is provided with a fourth step tread (151), the third step tread (141) is provided at a lower height than the second step tread (132), the first step tread (131) and the third step tread (141) are of the same height, and the second step tread (132) and the fourth step tread (151) are of the same height; The first step tread (131) and the third step tread (141) are used to support the bottom of the first wafer basket, and the side surface of the second support block (14) and one of the side plates (12) limit the side surface of the first wafer basket; The second step tread (132) and the fourth step tread (151) are used to support the bottom of the second wafer basket, and the two side plates (12) limit the side surfaces of the second wafer basket.

2. The lifting drying equipment suitable for multi-size wafer processing according to claim 1 is characterized in that: The orientation of the first step riser (133) corresponding to the second step tread (132) is opposite to the orientation of the second step riser (142) corresponding to the third step tread (141).

3. The lifting drying equipment suitable for multi-size wafer processing according to claim 1 is characterized in that: The first support block (13) has a U-shaped groove, and the bottom of the U-shaped groove is the first step surface (131).

4. The lifting drying equipment suitable for multi-size wafer processing according to claim 1 is characterized in that: The top surfaces of the first step tread (131), the second step tread (132), the third step tread (141) and the fourth step tread (151) are inclined surfaces.

5. The lifting drying equipment suitable for multi-size wafer processing according to claim 1 is characterized in that: The third support block (15) is located at the midpoint of the two side plates (12).

6. The lifting drying equipment suitable for multi-size wafer processing according to claim 1 is characterized in that: The wafer lifting mechanism (5) comprises a lifting rod (59) that can be lifted and lowered, and a lifting block (16) is mounted on the lifting rod (59).

7. The lifting drying equipment suitable for multi-size wafer processing according to claim 6 is characterized in that: The top block (16) is formed with rows of positioning grooves.

8. The lifting drying equipment suitable for multi-size wafer processing according to claim 1 is characterized in that: The base (11) is formed with three mounting grooves (111), and a first support block (13), a second support block (14) and a third support block (15) are mounted in the mounting grooves (111). The first support block (13), the second support block (14) and the third support block (15) can be positioned by the mounting grooves (111).

9. The lifting drying equipment suitable for multi-size wafer processing according to claim 1, characterized in that: The first wafer basket is a 6-inch wafer basket for accommodating 6-inch wafers, and the second wafer basket is an 8-inch wafer basket for accommodating 8-inch wafers.

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