Wafer contour measuring device

Abstract

The invention relates to the field of wafer detection, and discloses a wafer contour measuring device which is provided with an inner rack and comprises a damping mechanism, a loading mechanism, a transferring mechanism and a measuring mechanism. The damping mechanism comprises a damping assembly and a damping platform, and the damping assembly is arranged between the damping platform and the inner rack; the loading mechanism comprises a first driving piece and a wafer tray, the first driving piece is fixedly connected to the damping platform, the wafer tray is provided with a containing groove used for containing wafers, and the first driving piece is used for driving the wafer tray to move; the transfer mechanism comprises a second driving part, a third driving part and a wafer suction assembly, the second driving part and the third driving part are used for driving the wafer suction assembly to move, and the wafer suction assembly is used for sucking wafers; the measuring mechanism is used for performing parameter detection on the wafer; according to the invention, the working efficiency of the wafer in the transfer detection process is improved through various driving motors and the sliding rails, the problems of unstable placement and reverse direction of the wafer are avoided, and the accuracy of wafer detection is improved.

Description

Technical Field

[0001] The invention relates to the technical field of wafer measurement, and in particular to a wafer profile measuring device. Background Art

[0002] Wafer profile detection is an important process in the semiconductor production process. It can improve wafer production efficiency and quality and reduce production costs and risks.

[0003] Among the existing wafer inspection equipment and technologies, the transfer and inspection of wafers often require a lot of manual operations, and the inspection efficiency and accuracy are low, which makes it difficult to meet the growing production needs. Summary of the invention

[0004] The technical problem to be solved by the present invention is: how to improve the efficiency and accuracy of wafer detection. In order to solve the above technical problem, the present invention provides a wafer profile measurement device, which has an inner frame and a first direction, a second direction and a third direction that are perpendicular to each other, and includes a shock absorbing mechanism, a loading mechanism, a transfer mechanism and a measuring mechanism arranged on the inner frame;

[0005] The shock absorbing mechanism comprises a shock absorbing assembly and a shock absorbing platform, wherein the shock absorbing assembly is arranged between the shock absorbing platform and the inner frame along the third direction;

[0006] The loading mechanism includes a first driving member and a wafer tray, the first driving member is fixedly connected to the shock absorbing platform, the wafer tray is provided with a receiving groove for receiving the wafer, and the first driving member is used to drive the wafer tray to move away from or approach the measuring mechanism along a first direction;

[0007] The transfer mechanism includes a second driving member, a third driving member and a wafer suction assembly, wherein the second driving member is used to drive the third driving member to move away from or close to the wafer tray along a first direction, the third driving member is used to drive the wafer suction assembly to move along a third direction to contact the wafer, and the wafer suction assembly is used to suck the wafer located in the accommodating groove;

[0008] The measuring mechanism includes a plurality of measuring components for performing parameter detection on a wafer.

[0009] Preferably, the first driving member includes a first slide rail and a first driving motor arranged on the shock absorbing platform, the first slide rail extends along a first direction, the first slide rail is slidably connected to the wafer tray, and the output end of the first driving motor is connected to the wafer tray to drive the wafer tray to move along the first slide rail.

[0010] Preferably, a center groove is provided in the middle of the wafer tray, and the center groove penetrates the wafer tray and the receiving groove along the third direction, and the end of the center groove close to the measuring mechanism penetrates the side wall of the wafer tray along the first direction, and the width of the center groove along the second direction is smaller than the diameter of the receiving groove.

[0011] Preferably, the second driving member includes a second slide rail and a second driving motor arranged on the shock absorbing platform, the second slide rail extends along the first direction, the second slide rail is slidably connected to a connecting plate, the second driving motor is used to drive the connecting plate to move along the second slide rail, and the connecting plate is fixedly connected to the third driving member.

[0012] Preferably, the third driving member includes a third slide rail and a third driving motor. The third slide rail is extended along a third direction. The third slide rail is slidably connected to a fixed plate. The third driving motor is used to drive the fixed plate to move along the third slide rail. The fixed plate is fixedly connected to the wafer suction assembly.

[0013] Preferably, the wafer suction assembly includes a fourth driving motor and a suction cup, the output end of the fourth driving motor is connected to the suction cup, and the fourth driving motor is used to generate negative pressure in the suction cavity of the suction cup to absorb the wafer.

[0014] Preferably, the second slide rail is arranged directly below the center groove, the diameter of the suction cup is smaller than the width of the center groove, the suction cup moves along the third direction in the center groove to adsorb and lift the wafer, and the suction cup device moves along the first direction in the center groove to transfer the wafer between the wafer tray and the measuring mechanism.

[0015] Preferably, the measuring mechanism comprises an edge measuring component, a V-Notch measuring component, a diameter measuring component and a thickness measuring component;

[0016] The edge measurement component is used to measure the edge state of the wafer; the V-Notch measurement component is used to measure the direction and state of the notch on the wafer; the diameter measurement component is used to measure the diameter parameter size of the wafer; and the thickness measurement component is used to measure the thickness parameter size of the wafer.

[0017] Preferably, it further comprises an outer frame, which is arranged above the inner frame, and the outer frame is buckled with the inner frame to form a containing cavity, and the shock absorbing mechanism, loading mechanism, transfer mechanism and measuring mechanism are all arranged in the containing cavity.

[0018] Preferably, the external frame is provided with a loading port corresponding to the wafer tray; the external frame is also provided with a display screen, an operating keyboard and a computer device.

[0019] Compared with the prior art, the wafer profile measurement device provided in the embodiment of the present invention has the following beneficial effects:

[0020] In the present invention, the wafer tray is driven by the first driving member to move to the loading station, and the wafer is placed in the receiving groove of the wafer tray. Then the first driving member drives the wafer tray to reset, and the second driving member and the third driving member drive the wafer suction component to approach and suck the wafer. Then the second driving member and the third driving member drive the wafer suction component and the wafer thereon to move to the measuring mechanism for detection. The whole process reduces manual participation, and the work efficiency of the wafer in the transportation and detection process is greatly improved through various driving motors and slide rails. At the same time, due to the reduction of manual participation, problems such as unstable wafer placement and reversal are avoided, and the setting of the shock absorbing component can reduce the influence of interference factors and unstable factors in the wafer detection process, thereby improving the accuracy of wafer detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a stereoscopic view of the present invention;

[0022] Figure 2 is a structural view of the shock absorbing mechanism of the present invention;

[0023] Figure 3 It is a structural schematic diagram of the transfer mechanism of the present invention;

[0024] Figure 4 It is a structural schematic diagram of the measuring mechanism and the loading mechanism of the present invention.

[0025] In the figure: 1. Inner frame;

[0026] 2. shock absorbing mechanism; 21. shock absorbing assembly; 22. shock absorbing platform;

[0027] 3. Loading mechanism; 31. First driving member; 311. First slide rail; 312. First driving motor; 32. Wafer tray; 321. Accommodating groove; 322. Center groove;

[0028] 4. Transfer mechanism; 41. Second driving member; 411. Second slide rail; 412. Second driving motor; 413. Connecting plate; 42. Third driving member; 421. Third slide rail; 422. Third driving motor; 423. Fixing plate; 43. Wafer suction assembly; 431. Fourth driving motor; 432. Suction cup;

[0029] 5. Measuring mechanism; 51. Edge measuring assembly; 52. V-Notch measuring assembly; 53. Diameter measuring assembly; 54. Thickness measuring assembly;

[0030] 6. Wafer;

[0031] 7. External frame; 71. Loading port; 72. Display screen; 73. Operation keyboard. DETAILED DESCRIPTION

[0032] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0033] like Figures 2 to 4 As shown, a preferred embodiment of the present invention provides a wafer profile measuring device, which has an inner frame 1 and a first direction, a second direction and a third direction that are perpendicular to each other, and includes a shock absorbing mechanism 2, a loading mechanism 3, a transfer mechanism 4 and a measuring mechanism 5 arranged on the inner frame 1;

[0034] The shock absorbing mechanism 2 includes a shock absorbing assembly 21 and a shock absorbing platform 22, wherein the shock absorbing assembly 21 is arranged between the shock absorbing platform 22 and the inner frame 1 along the third direction;

[0035] The loading mechanism 3 includes a first driving member 31 and a wafer tray 32. The first driving member 31 is fixedly connected to the shock absorbing platform 22. The wafer tray 32 is provided with a receiving groove 321 for receiving the wafer 6. The first driving member 31 is used to drive the wafer tray 32 to move away from or approach the measuring mechanism 5 along a first direction.

[0036] The transfer mechanism 4 includes a second driving member 41, a third driving member 42 and a wafer suction assembly 43. The second driving member is used to drive the third driving member 42 to move away from or approach the wafer tray 32 along the first direction. The third driving member 42 is used to drive the wafer suction assembly 43 to move along the third direction to contact the wafer 6. The wafer suction assembly 43 is used to suck the wafer 6 located in the accommodating groove 321.

[0037] The measuring mechanism 5 includes a plurality of measuring components for performing parameter detection on the wafer 6 .

[0038] Specifically, the first direction, the second direction and the third direction are marked as X, Y and Z in the figure respectively. In the actual wafer 6 detection process, the first driving member 31 drives the wafer tray 32 to move in the direction away from the measuring mechanism 5 to the loading station, and then the wafer 6 of the previous process is placed in the receiving groove 321 of the wafer tray 32. The receiving groove 321 can be provided with positioning holes or positioning members and other structures to determine whether the orientation of the wafer 6 is correct, thereby avoiding the problem of the wafer 6 being placed upside down and improving the accuracy and stability of the wafer 6 detection. After the wafer 6 is accurately placed in the receiving groove 321, the first driving member 31 drives the wafer tray 32 to move toward the direction of the measuring mechanism 5 to the position to be transported, and then the second driving member 41 drives the third driving member 42 and the wafer suction assembly 43 to move directly below the wafer 6. After the wafer suction assembly 43 moves directly below the wafer 6, the third driving member 42 drives the wafer suction assembly 43 to move upward along the third direction until the wafer suction assembly 43 contacts the wafer 6, and then the wafer suction assembly 43 absorbs and fixes the wafer 6, and the third driving member 42 continues to drive the wafer suction assembly 43 to move upward until the wafer 6 is out of the receiving groove 321. When the wafer 6 is out of the receiving groove 321, the second driving member 41 will drive the third driving member 42 and the wafer suction assembly 43 to move toward the measuring mechanism 5, so as to transport the wafer 6 to be inspected to the measuring mechanism 5 for parameter, size and appearance inspection. During the entire detection process, the position of wafer 6 is transferred by the driving member, which reduces manual intervention, makes the position of wafer 6 more stable during the transfer and detection process, and makes the transfer faster. It is less likely to cause problems such as wafer 6 being placed upside down, and the detection efficiency and accuracy of wafer 6 are higher. In addition, the shock absorbing assembly 21 can reduce the impact of interference factors such as vibration that occur during the transfer of wafer 6 on the detection of wafer 6, thereby further improving the accuracy and stability of the detection of wafer 6.

[0039] It should be noted that edge refers to the edge of the wafer 6 , and V-Notch refers to the V-shaped notch on the wafer 6 .

[0040] In some embodiments, the first driving member 31 includes a first slide rail 311 and a first driving motor 312 disposed on the shock absorbing platform 22. The first slide rail 311 is extended along a first direction. The first slide rail 311 is slidably connected to the wafer tray 32. The output end of the first driving motor 312 is connected to the wafer tray 32 to drive the wafer tray 32 to move along the first slide rail 311.

[0041] Specifically, in a specific embodiment, two first slide rails 311 are provided, and the two first slide rails 311 are respectively slidably connected to the two side edges of the bottom of the wafer tray 32, and the first drive motor 312 is fixed relative to the first slide rail 311. The output end of the first drive motor 312 can drive the wafer tray 32 to move along the first slide rail 311 through a gear and a rack structure. Of course, in some other embodiments, the output end of the first drive motor 312 can also be connected to a lead screw structure, which is connected to the wafer tray 32, and the wafer tray 32 is driven to move by the lead screw. In addition, in other embodiments, the first drive motor 312 can also be replaced with a structure such as a hydraulic rod, and the wafer tray 32 is pushed to move along the first slide rail 311 by hydraulic pressure.

[0042] In some embodiments, a center groove 322 is provided in the middle of the wafer tray 32, and the center groove 322 penetrates the wafer tray 32 and the receiving groove 321 along the third direction, and the end of the center groove 322 close to the measuring mechanism 5 penetrates the side wall of the wafer tray 32 along the first direction, and the width of the center groove 322 along the second direction is smaller than the diameter of the receiving groove 321.

[0043] Specifically, the setting of the center groove 322 can, on the one hand, reduce the weight of the wafer tray 32 and reduce the driving resistance of the first driving member 31, making the transfer process of the wafer 6 more convenient; on the other hand, the center groove 322 can provide space for the movement of the wafer suction assembly 43, making it convenient for the wafer suction assembly 43 to lift the wafer 6 from bottom to top through the center groove 322. After the wafer suction assembly 43 lifts the wafer 6, the wafer suction assembly 43 can also move back and forth between the tray and the measuring mechanism 5 to transfer the wafer 6.

[0044] In some embodiments, the second driving member 41 includes a second slide rail 411 and a second driving motor 412 arranged on the shock absorbing platform 22, the second slide rail 411 is extended along the first direction, the second slide rail 411 is slidably connected to a connecting plate 413, the second driving motor 412 is used to drive the connecting plate 413 to move along the second slide rail 411, and the connecting plate 413 is fixedly connected to the third driving member 42.

[0045] Specifically, in a specific embodiment, the output end of the second drive motor 412 is connected to a lead screw, and the lead screw is connected to the connecting plate 413. The second drive motor 412 drives the connecting plate 413 to move along the second slide rail 411 through the lead screw, thereby driving the third drive member 42 and the wafer suction assembly 43 to move. The second slide rail 411 is a plate-like structure, and a slider is provided at the bottom of the connecting plate 413, and a slide hole for the second slide rail 411 to pass through is provided in the middle of the slider. Of course, in other embodiments, the output end of the second drive motor 412 can also be connected to a gear to drive the connecting plate 413 to move through a gear rack structure. The second drive motor 412 can also be replaced by a hydraulic structure to drive the connecting plate 413 to move.

[0046] In some embodiments, the third driving member 42 includes a third slide rail 421 and a third driving motor 422. The third slide rail 421 is extended along a third direction. The third slide rail 421 is slidably connected to a fixed plate 423. The third driving motor 422 is used to drive the fixed plate 423 to move along the third slide rail 421. The fixed plate 423 is fixedly connected to the wafer suction assembly 43.

[0047] Specifically, the third driving motor 422 also drives the fixing plate 423 to move on the third slide rail 421 along the third direction through the lead screw, so that the wafer suction assembly 43 can move along the third direction, contact the wafer 6, and lift the wafer 6 away from the accommodating groove 321, thereby realizing the transfer and transportation of the wafer 6. The entire transfer process of the wafer 6 is more convenient and quick.

[0048] In some embodiments, the wafer suction assembly 43 includes a fourth driving motor 431 and a suction cup 432 , the output end of the fourth driving motor 431 is connected to the suction cup 432 , and the fourth driving motor 431 is used to generate negative pressure in the suction cavity of the suction cup 432 to absorb the wafer 6 .

[0049] Specifically, the fourth drive motor 431 uses a hollow motor, the output end of the hollow motor is connected to the main shaft of the suction cup 432, and the other end of the main shaft of the suction cup 432 is connected to the suction cup 432, and the main shaft of the suction cup 432 and the suction cup 432 are both rotating body structures, and the hollow axis of the fourth drive motor 431 is colinear with the axis of the main shaft of the suction cup 432 and the axis of the suction cup 432, and the compressed air can enter the contact surface between the suction cup 432 and the wafer 6 through the main shaft of the suction cup 432, and the compressed air in the negative pressure state adsorbs the wafer 6. In this embodiment, the suction cup 432 is used to absorb the wafer 6. Compared with other structures such as manipulators, the surface of the wafer 6 is not prone to scratches and other damages, which improves the yield and detection efficiency of the wafer 6, and compared with the manipulator lamp structure, the suction cup 432 will not affect the subsequent measurement of the wafer 6 by each measurement component in the measurement mechanism 5.

[0050] In some embodiments, the second slide rail 411 is correspondingly arranged directly below the central groove 322, the diameter of the suction cup 432 is smaller than the width of the central groove 322, the suction cup 432 moves in the central groove 322 along the third direction to absorb and lift the wafer 6, and the suction cup 432 moves in the central groove 322 along the first direction to transfer the wafer 6 between the wafer tray 32 and the measuring mechanism 5. The setting of the position of the central groove 322 and the size of the suction cup 432 are both to facilitate the suction cup 432 to move in the central groove 322, to facilitate the use and transfer of the wafer 6, and to avoid the problem of the structure blocking the position transfer of the wafer 6.

[0051] In some embodiments, the measuring mechanism 5 includes an edge measuring component 51, a V-Notch measuring component 52, a diameter measuring component 53 and a thickness measuring component 54;

[0052] The edge measurement component 51 is used to measure the edge state of the wafer 6; the V-Notch measurement component 52 is used to measure the direction and state of the notch on the wafer 6; the diameter measurement component 53 is used to measure the diameter parameter size of the wafer 6; and the thickness measurement component 54 is used to measure the thickness parameter size of the wafer 6. Among them, the edge measurement component 51 includes a light source and a camera, and the light source and the camera are respectively arranged on both sides of the wafer 6 detection position along the second direction, while the V-Notch measurement component 52, the diameter measurement component 53 and the thickness measurement component 54 are arranged above the wafer 6 detection position along the third direction. In some other embodiments, according to the different size parameters of the wafer 6 to be measured, multiple measurement components can be additionally arranged to meet the measurement requirements. In this embodiment, since multiple measurement components are integrated together, not only the space utilization rate is higher, but also multiple parameters of the wafer 6 can be measured at the same time, and the measurement efficiency of the entire wafer 6 is also higher.

[0053] like Figure 1 As shown, in some embodiments, it also includes an outer frame 7, which is arranged above the inner frame 1. The outer frame 7 is buckled with the inner frame 1 to form a accommodating cavity, and the shock absorbing mechanism 2, the loading mechanism 3, the transfer mechanism 4 and the measuring mechanism 5 are all arranged in the accommodating cavity.

[0054] Furthermore, the external frame 7 is provided with a loading port 71 corresponding to the wafer tray 32; the external frame 7 is also provided with a display screen 72, an operating keyboard 73 and a computer device. Specifically, the damping mechanism 2, the loading mechanism 3, the transfer mechanism 4 and the measuring mechanism 5 are all arranged in the accommodating chamber, which can reduce the interference of the external environment on the measuring mechanism 5 and improve the accuracy of the measurement mechanism 5 in detecting the wafer 6. The setting of the loading port 71 enables the wafer tray 32 to extend from the accommodating chamber to the loading station, which is convenient for placing the wafer 6 in the accommodating groove 321, and then the wafer tray 32 can transport the wafer 6 into the accommodating chamber. The setting of the display screen 72 can display the results of the wafer 6 detection in real time, and the keyboard and computer equipment are convenient for the staff to control the working status of the damping mechanism 2, the loading mechanism 3, the transfer mechanism 4 and the measuring mechanism 5.

[0055] In summary, an embodiment of the present invention provides a wafer 6 contour measurement device, which realizes automatic transfer and automatic detection of wafer 6 during the wafer 6 detection process, reduces manual participation, and integrates multiple measurement components together, so that the wafer 6 detection efficiency is higher and the detection results are more stable, accurate and reliable.

[0056] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present invention. These improvements and substitutions should also be regarded as the scope of protection of the present invention.

Claims

1. A wafer profile measuring device, comprising an inner frame and a first direction, a second direction and a third direction which are perpendicular to each other, characterized in that: It includes a shock absorbing mechanism, a loading mechanism, a transporting mechanism and a measuring mechanism which are arranged on the inner frame; The shock absorbing mechanism comprises a shock absorbing assembly and a shock absorbing platform, wherein the shock absorbing assembly is arranged between the shock absorbing platform and the inner frame along the third direction; The loading mechanism includes a first driving member and a wafer tray, the first driving member is fixedly connected to the shock absorbing platform, the wafer tray is provided with a receiving groove for receiving the wafer, and the first driving member is used to drive the wafer tray to move away from or approach the measuring mechanism along a first direction; The transfer mechanism includes a second driving member, a third driving member and a wafer suction assembly, wherein the second driving member is used to drive the third driving member to move away from or close to the wafer tray along a first direction, the third driving member is used to drive the wafer suction assembly to move along a third direction to contact the wafer, and the wafer suction assembly is used to suck the wafer located in the accommodating groove; The measuring mechanism comprises a plurality of measuring components for performing parameter detection on the wafer.

2. The wafer profile measuring device according to claim 1, characterized in that: The first driving component includes a first slide rail and a first driving motor arranged on the shock absorbing platform, the first slide rail extends along a first direction, the first slide rail is slidably connected to the wafer tray, and the output end of the first driving motor is connected to the wafer tray to drive the wafer tray to move along the first slide rail.

3. The wafer profile measuring device according to claim 1, characterized in that: A center groove is provided in the middle of the wafer tray, and the center groove penetrates the wafer tray and the receiving groove along the third direction, and the end of the center groove close to the measuring mechanism penetrates the side wall of the wafer tray along the first direction, and the width of the center groove along the second direction is smaller than the diameter of the receiving groove.

4. The wafer profile measuring device according to claim 3, characterized in that: The second driving member includes a second slide rail and a second driving motor arranged on the shock absorbing platform, the second slide rail extends along the first direction, the second slide rail is slidably connected to a connecting plate, the second driving motor is used to drive the connecting plate to move along the second slide rail, and the connecting plate is fixedly connected to the third driving member.

5. The wafer profile measuring device according to claim 4, characterized in that: The third driving member includes a third slide rail and a third driving motor. The third slide rail is extended along a third direction. The third slide rail is slidably connected to a fixed plate. The third driving motor is used to drive the fixed plate to move along the third slide rail. The fixed plate is fixedly connected to the wafer suction assembly.

6. The wafer profile measuring device according to claim 5, characterized in that: The wafer suction assembly includes a fourth driving motor and a suction cup. The output end of the fourth driving motor is connected to the suction cup. The fourth driving motor is used to generate negative pressure in the suction cavity of the suction cup to absorb the wafer.

7. The wafer profile measuring device according to claim 6, characterized in that: The second slide rail is correspondingly arranged directly below the center groove, the diameter of the suction cup is smaller than the width of the center groove, the suction cup moves along the third direction in the center groove to adsorb and lift the wafer, and the suction cup device moves along the first direction in the center groove to transfer the wafer between the wafer tray and the measuring mechanism.

8. The wafer profile measuring device according to claim 1, characterized in that: The measuring mechanism includes an edge measuring component, a V-Notch measuring component, a diameter measuring component and a thickness measuring component; The edge measurement component is used to measure the edge state of the wafer; the V-Notch measurement component is used to measure the direction and state of the notch on the wafer; the diameter measurement component is used to measure the diameter parameter size of the wafer; and the thickness measurement component is used to measure the thickness parameter size of the wafer.

9. The wafer profile measuring device according to claim 1, characterized in that: It also includes an outer frame, which is arranged above the inner frame. The outer frame is buckled with the inner frame to form a containing cavity. The shock absorbing mechanism, the loading mechanism, the transport mechanism and the measuring mechanism are all arranged in the containing cavity.

10. The wafer profile measuring device according to claim 9, characterized in that: The outer frame is provided with a loading port corresponding to the wafer tray; the outer frame is also provided with a display screen, an operating keyboard and computer equipment.

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