Through hole detection device and detection method

Abstract

The invention relates to a through hole detection device and a detection method, and belongs to the technical field of semiconductor manufacturing equipment and microelectronics. The device comprises an object carrying disc which is used for placing a sample sheet to be detected, and an electrode column is arranged in the object carrying disc; the transparent circuit substrate is arranged above the carrying disc and is provided with at least one conductive microprobe; the objective lens is used for observing the through hole in the sample to be detected; injecting a conducting medium into the carrying disc; the conductive medium enters the through hole of the sample to be detected under the capillary action and forms a liquid column, and the through hole is detected after the conductive microprobe is in contact with the conductive medium. According to the invention, the conductive probe is combined with the carrying disc, and the conductivity and capillary action of the liquid metal are utilized to directly detect whether the through hole is suitable for electrical interconnection, so that the test efficiency is high, and the compatibility is good.

Description

Technical Field

[0001] The invention relates to the field of semiconductor manufacturing equipment and microelectronic technology, in particular to a through-hole detection device and a through-hole detection method. Background Art

[0002] With the development of the semiconductor field, through silicon via (TSV) technology and through glass via (TGV) technology have emerged. These two technologies form through holes on silicon and glass substrates respectively to achieve vertical interconnection of electrodes between wafers or chips, as well as microfluidic chip packaging on glass substrates. They have the characteristics of improving integration and performance, which in turn leads to the need for and related methods to detect through-hole quality.

[0003] In the related art, one method is to use a special optical interferometer to detect through silicon vias (TSVs). However, due to the high light transmittance of glass, this method is not effective in detecting through glass vias (TGVs).

[0004] Another method is to use X-ray to scan the through-hole structure layer by layer, synthesize a three-dimensional image of the substrate through image processing, and fit the morphology of the through-hole, and compare it with the pre-designed morphology tolerance to determine whether the through-hole morphology meets the requirements. However, although the above-mentioned X-ray detection method can evaluate the conformity of the through-hole morphology, it has obvious shortcomings. It can only determine whether the through-hole morphology meets the design requirements, but cannot directly evaluate the actual performance of the through-hole in electrical interconnection. In addition, this method also requires the design of the expected morphology in advance to obtain the morphology tolerance, which increases the complexity and time cost of the operation.

[0005] In practical applications, we are more concerned about whether the through-hole can support good electrical interconnection, which is often impossible to accurately judge through simple morphology detection. Summary of the invention

[0006] In view of the shortcomings of the above-mentioned existing production technology, the applicant provides a through-hole detection device and detection method, which is compatible with through-hole detection on substrates such as silicon or glass. While reducing the detection cost, it can quickly detect whether the through-hole can support our subsequent electrical interconnection or packaging.

[0007] The technical solution adopted by the present invention is as follows: a through-hole detection device, comprising:

[0008] A loading tray is used to place the sample to be tested, and an electrode column is arranged in the loading tray;

[0009] A transparent circuit substrate, disposed above the carrier plate, having at least one conductive microprobe;

[0010] Objective lens, used to observe the through-holes on the sample to be tested;

[0011] injecting a conductive medium onto the carrier plate;

[0012] The conductive medium enters the through hole of the sample to be tested under the capillary action and forms a liquid column, and the through hole is tested after the conductive microprobe contacts the conductive medium.

[0013] In one embodiment, the loading tray is a concave loading tray, and a heating mechanism is provided at the bottom of the concave loading tray.

[0014] In one of the embodiments, a leveling mechanism is further included, and the leveling mechanism includes a leveling platform and a plurality of leveling screws for adjusting the horizontality of the loading plate.

[0015] In one embodiment, the conductive microprobe is connected to an external power source or a measuring instrument via a circuit, and the circuit is disposed on a transparent circuit substrate.

[0016] In one embodiment, it further comprises a hollow tube and a hollow bracket, the conductive microprobe is connected to an external power source or a measuring instrument through the hollow tube and the hollow bracket in sequence, and the hollow tube is arranged between the objective lens and the transparent circuit substrate.

[0017] In one embodiment, a lifting mechanism is further included, and the lifting mechanism is used to adjust the height of the carrier plate relative to the transparent circuit substrate and the conductive microprobe.

[0018] In one embodiment, the conductive medium is liquid metal or a conductive solution.

[0019] A through-hole detection method, using the above-mentioned through-hole detection device to perform through-hole detection, comprises the following steps:

[0020] Place the sample to be tested on the loading tray;

[0021] Injecting a conductive medium onto the sample tray, the conductive medium enters the through hole of the sample to be tested under the action of capillarity;

[0022] Observe the conductive medium in the through hole, and adjust the position and height of the carrier plate through the lifting mechanism to make the conductive microprobe contact with the conductive medium;

[0023] The conductive microprobe is connected to an external power source or measuring instrument to detect the conductive performance of the through hole.

[0024] In one embodiment, in the step of injecting the conductive medium, the liquid level of the conductive medium is controlled to be between one quarter and two thirds of the thickness of the substrate of the sample to be tested.

[0025] In one embodiment, the following steps are also included:

[0026] Recover the conductive medium after the test is completed;

[0027] Ultrasonic cleaning of the sample to ensure that no conductive medium remains.

[0028] The beneficial effects of the present invention are as follows:

[0029] The present invention has a compact and reasonable structure, convenient operation method, modular components, and can improve the testing efficiency of micropores, effectively solving the problems of cumbersome operation or complex post-data processing of traditional methods;

[0030] The present invention also has the following advantages:

[0031] (1) The present invention utilizes a conductive medium, specifically a liquid metal or a conductive solution. Since there are many types of liquid metals and conductive solutions, we can select different conductive media to adapt to different substrates according to different substrate types, thicknesses, and pore sizes of micropores on the substrates.

[0032] (2) The present invention can directly measure the on-off status of the microvia and directly judge whether the microvia is suitable for electrical connection. The test efficiency is high, which effectively solves the problem of cumbersome operation or complex data processing in the traditional method.

[0033] (3) Compared with the common method of using SEM to observe the cross-section of the sample after cracking to test the process parameters, the present invention can directly measure the substrate without damaging the substrate because the liquid metal is easy to remove, is basically harmless to the substrate, and can be reused. At the same time, the use of electrical measurement will not lead to excessive energy consumption, and is more economical and suitable for social promotion. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0035] Figure 2 This is a top view of the loading tray after placing the sample in the present invention.

[0036] Figure 3 It is a schematic diagram of the structure of the present invention when used with a microscope stage.

[0037] Among them: 1. objective lens; 2. transparent circuit substrate; 3. loading plate; 4. leveling platform; 5. leveling screws; 6. fixing block; 7. loading table; 8. base; 9. hollow bracket; 10. electrode column; 11. hollow tube; 12. conductive microprobe; 13. gear; 14. support block; 15. limit block; 16. gear fixing block; 17. rack guide rail; 18. sample. DETAILED DESCRIPTION

[0038] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or position relationship based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0039] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0040] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0041] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0042] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0043] like Figure 1-Figure 2 As shown, a schematic diagram of the structure of the through-hole detection device in the present invention is shown.

[0044] In some embodiments, a through-hole detection device of the present invention includes:

[0045] The loading tray 3 is used to place the sample 18 to be tested, and an electrode column 10 is arranged in the loading tray 3; the loading tray 3 cooperates with the transparent circuit substrate 2 to ensure that the sample 18 can be stably placed and tested, and the electrode column 10 is convenient for subsequent connection of the circuit; specifically, the loading tray 3 is a concave loading tray structure, and a heating mechanism is arranged at the bottom of the loading tray 3, so as to heat the conductive medium when necessary;

[0046] Exemplarily, a conductive medium injection mechanism may be provided above the carrier plate 3 to inject the conductive medium onto the carrier plate 3, and the conductive medium enters the through hole of the sample 18 to be tested under capillary action and forms a liquid column;

[0047] The transparent circuit substrate 2 is arranged above the carrier plate 3 and fixed to the main structure of the device; a conductive microprobe 12 is arranged at the bottom of the transparent circuit substrate 2 opposite to the carrier plate 3, and the conductive microprobe 12 is connected to an external power source or a measuring instrument through a circuit. Specifically, the transparent circuit substrate 2 is made of a transparent material, which is convenient for observing the through hole and the conductive medium below;

[0048] The objective lens 1 is installed above the transparent circuit substrate 2 and is used to magnify and observe the through hole on the sample 18 to be tested; through the objective lens 1, the operator can clearly see the process of the conductive medium entering the through hole and the contact between the conductive microprobe 12 and the conductive medium;

[0049] The hollow tube 11 and the hollow bracket 9 are provided between the objective lens 1 and the transparent circuit substrate 2, and provide a connection channel for the conductive microprobe 12 to connect with an external power source or a measuring instrument; the hollow tube 11 protects the conductive microprobe 12 and avoids the interference of the circuit on the observation; the objective lens 1 and the transparent circuit substrate 2 are supported by the hollow bracket 9, so that the objective lens 1 and the transparent circuit substrate 2 are located above the loading plate 3, and the conductive microprobe 12 is arranged at the bottom of the transparent circuit substrate 2;

[0050] The loading platform 7 is used as a supporting structure to provide support and stability for the loading tray 3 on the fixed block 6; the loading tray 3 is connected to the loading platform 7 through the fixed block 6, and the loading platform 7 can move horizontally on the base 8, thereby changing the horizontal position of the loading tray 3;

[0051] The leveling mechanism includes a leveling platform 4 and a plurality of leveling screws 5, which are used to adjust the horizontality of the loading tray 3, which ensures that the conductive medium can be evenly distributed on the loading tray 3 and smoothly enter all through holes; in a specific embodiment, three leveling screws 5 are arranged on the leveling platform 4 in an equilateral triangle on the plane, and the screws are all pressed against the concave loading tray 3, and there is a raised hemisphere in the middle of the concave loading tray 3, and the leveling platform 4 also has a pit matching the hemisphere at a corresponding position to prevent the loading tray 3 from slipping when adjusting the inclination angle;

[0052] The lifting mechanism includes a fixed block 6, a gear 13, a support block 14, a limit block 15, a gear fixing block 16 and a rack guide rail 17; specifically, rack guide rails 17 are arranged on both sides of the fixed block 6, and the lifting of the fixed block 6 is controlled by the rotation of the gear 13, and the vertical height is fixed by the limit block 15 and the spring below; the gear 13 is connected to the support block 14 through a screw, the support block 14 is connected to the gear fixing block 16, and the gear fixing block 16 is connected to the stage 7.

[0053] A through-hole detection method of the present invention is performed by the above-mentioned through-hole detection device, and the specific steps are as follows:

[0054] Step 1: Place the sample 18 to be tested on the loading plate 3 and ensure that it is stable;

[0055] Step 2: Inject the conductive medium onto the sample tray 3 through the conductive medium injection mechanism. The conductive medium automatically enters the through hole of the sample 18 to be tested under the capillary action and forms a liquid column. At this time, the liquid level of the conductive medium should be controlled to be between one quarter and two thirds of the thickness of the substrate of the sample 18 to be tested.

[0056] Step 3: Observe the conductive medium in the through hole through the objective lens 1, and use the leveling mechanism and the lifting mechanism to adjust the horizontality of the carrier plate 3, adjust the horizontal position of the carrier plate 3 through the stage 7, and adjust the height position of the carrier plate 3 through the lifting mechanism, thereby changing the height of the carrier plate 3 relative to the transparent circuit substrate 2 and the conductive microprobe 12, so that the conductive microprobe 12 is in good contact with the conductive medium;

[0057] Step 4: Connect the electrode column 10 and the conductive microprobe 12 to two test leads of a multimeter respectively, and determine whether the hole of the sample 18 is a through hole by measuring the resistance; and determine whether the interior of the through hole is suitable for subsequent electrical connection according to the deviation of the measured resistance from the expected resistance;

[0058] Step 5: After the test is completed, the conductive medium is recovered and the sample 18 to be tested is treated using ultrasonic cleaning or other techniques to ensure that no conductive medium remains on its surface.

[0059] In some embodiments, the conductive medium is liquid metal or conductive solution.

[0060] In a specific embodiment, the conductive medium is a liquid metal gallium-indium alloy.

[0061] like Figure 3 The figure shows a schematic diagram of the structure of the present invention when used with a microscope stage. Specifically, the assembly process when used with a microscope is as follows:

[0062] Place the fixing block 6 on the microscope stage, and then place the leveling platform 4, leveling screws 5 and bottom heating concave loading plate 3 in sequence, and then place the base 8 on the table, and build the hollow bracket 9, hollow tube 11, transparent circuit substrate 2 and conductive microprobe 12 in sequence.

[0063] The present invention has strong compatibility and can meet the through-hole detection requirements of various substrate materials such as silicon or glass; and has high test efficiency, and determines whether the through-hole is suitable for electrical interconnection by directly measuring the conductive properties of the through-hole, without the need for complex morphology detection or data processing. At the same time, the present invention is easy to operate and has a modular design. Finally, by connecting the electrode column 10 and the conductive microprobe 12 to two test leads of a multimeter respectively, the resistance is measured to determine whether the hole in the sample 18 is a through-hole, thereby reducing the difficulty of operation and time cost. Finally, the present invention is also economical and applicable. The conductive medium in the present invention is easy to remove and can be reused, which reduces the detection cost, and the electrical measurement method has low energy consumption, which is suitable for widespread promotion in society.

[0064] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0065] The above-mentioned embodiments only express the implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A through-hole detection device, characterized in that: include: A loading tray is used to place the sample to be tested, and an electrode column is arranged in the loading tray; A transparent circuit substrate, disposed above the carrier plate, having at least one conductive microprobe; Objective lens, used to observe the through-holes on the sample to be tested; injecting a conductive medium onto the carrier plate; The conductive medium enters the through hole of the sample to be tested under the capillary action and forms a liquid column, and the through hole is tested after the conductive microprobe contacts the conductive medium.

2. The through-hole detection device according to claim 1, characterized in that: The loading tray is a concave loading tray, and a heating mechanism is provided at the bottom of the concave loading tray.

3. The through-hole detection device according to claim 1, characterized in that: It also includes a leveling mechanism, which includes a leveling platform and a plurality of leveling screws for adjusting the horizontality of the loading tray.

4. The through-hole detection device according to claim 1, characterized in that: The conductive microprobe is connected to an external power source or a measuring instrument through a circuit, and the circuit is arranged on a transparent circuit substrate.

5. The through-hole detection device according to claim 4, characterized in that: It also includes a hollow tube and a hollow bracket. The conductive microprobe is connected to an external power source or a measuring instrument through the hollow tube and the hollow bracket in sequence. The hollow tube is arranged between the objective lens and the transparent circuit substrate.

6. The through-hole detection device according to claim 1, characterized in that: The utility model also comprises a lifting mechanism, which is used for adjusting the height between the object carrier plate and the transparent circuit substrate and the conductive micro-probe.

7. The through-hole detection device according to claim 1, characterized in that: The conductive medium is liquid metal or conductive solution.

8. A through-hole detection method, characterized in that: The through-hole detection device according to any one of claims 1 to 7 is used to perform through-hole detection, comprising the following steps: Place the sample to be tested on the loading tray; Injecting a conductive medium onto the sample tray, the conductive medium enters the through hole of the sample to be tested under the action of capillarity; Observe the conductive medium in the through hole, and adjust the position and height of the carrier plate through the lifting mechanism to make the conductive microprobe contact with the conductive medium; Connect the electrode column and the conductive microprobe to the two test leads of the multimeter respectively, and measure the resistance to detect whether the hole on the sample is a through hole.

9. The through-hole detection method according to claim 8, characterized in that: In the step of injecting the conductive medium, the liquid level of the conductive medium is controlled to be between one quarter and two thirds of the thickness of the substrate of the sample to be tested.

10. The through-hole detection method according to claim 8, characterized in that: The following steps are also included: Recover the conductive medium after the test is completed; Ultrasonic cleaning of the sample to ensure that no conductive medium remains.

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