Antenna structure

Abstract

An antenna structure is electrically and fixedly connected to a mainboard of an electronic device and comprises a circuit board, a high-frequency radiation layer and a low-frequency radiation layer. The circuit board is a square body and is provided with a front surface, a back surface, a top edge, a bottom edge and two side edges. The high-frequency radiation layer is arranged on the front surface of the circuit board and is provided with a high-frequency coupling edge; the low-frequency radiation layer is arranged on the back surface of the circuit board and is provided with a low-frequency coupling edge; wherein the high-frequency radiation layer and the low-frequency radiation layer are not overlapped with each other, and the high-frequency coupling edge and the low-frequency coupling edge are coupled to form the bandwidth of the transceiving frequency of the antenna structure. By redesigning the antenna structure, the high-frequency radiation layer and the low-frequency radiation layer on the antenna structure are not mutually overlapped, interfered, blocked or shielded, the manufacturing cost of the antenna structure can be reduced, the structural design of an original mainboard cannot be damaged, and the length of the radiation layer can be prolonged according to the requirement of the receiving and transmitting frequency of the antenna structure.

Description

Technical Field

[0001] The present invention relates to an antenna, and more particularly to an upright antenna structure welded on a circuit board. Background Art

[0002] With the popularization of the Internet, people are becoming more and more dependent on the Internet, and more and more Internet devices have been developed, such as Wi-Fi products, network communication products, Internet of Things, network cameras (IP CAM), routers or modems, etc. Most of the antenna structures used in these devices are made of copper foil on the circuit board to make different radiation layer patterns to receive and transmit signals.

[0003] In the design of the antenna structure in the past, a printed circuit board is provided, and the patterns of the high-frequency radiation layer and the low-frequency radiation layer are respectively made on the front and back of the printed circuit board. After the high-frequency radiation layer and the low-frequency radiation layer are electrically connected to the ground layer of the motherboard, the high-frequency radiation layer and the low-frequency radiation layer are coupled to generate a bandwidth that can receive and transmit frequencies. Although the high-frequency radiation layer and the low-frequency radiation layer are arranged on the front and back of the printed circuit board, the high-frequency radiation layer and the low-frequency radiation layer overlap each other, resulting in mutual interference, blocking or shielding, causing the transmission and reception performance characteristics of the antenna structure to be reduced.

[0004] Most of the antenna structures currently used are of a vertical type and are soldered on the motherboard of the electronic device. When the vertical antenna structure is soldered to the motherboard, the antenna structure directly solders the electrode layer on the circuit board to the electrode layer of the motherboard. Since the electrode layer of the antenna structure uses a large area or a large number, the copper material used is relatively large, which will lead to an increase in production costs. In addition, when the vertical antenna structure is soldered to the motherboard, one or more holes must be drilled at the position of the motherboard where the antenna structure is soldered, so that the antenna structure can be directly inserted into the hole in a vertical manner, so that the electrode layer on the antenna structure can be electrically fixed to the electrode layer at the edge of the hole. In this way, although the antenna structure can be soldered to the motherboard in a vertical manner, such a design will destroy the original structural design of the motherboard, thus resulting in a labor-intensive and time-consuming process in production.

[0005] Furthermore, during the design process of the radiation layer of the vertical antenna structure, when the receiving and transmitting frequency of the radiation layer is to reach a certain receiving and transmitting frequency, if the area of ​​the antenna structure body is insufficient, it will make it difficult to design the pattern of the radiation layer, and it is necessary to make another radiation layer on the motherboard to electrically connect with the radiation layer on the antenna structure to extend the length of the radiation layer of the antenna structure. This will increase the difficulty of manufacturing the antenna structure and the motherboard.

[0006] Therefore, how to improve the transceiver frequency performance characteristics of the antenna structure and reduce the manufacturing cost of the antenna structure without destroying the original motherboard structure design and extending the length of the radiation layer according to the transceiver frequency of the antenna structure is the main problem to be solved by the present invention. Summary of the invention

[0007] Therefore, the main purpose of the present invention is to solve the above defects. The present invention redesigns the antenna structure so that the high-frequency radiation layer and the low-frequency radiation layer on the antenna structure do not overlap, interfere, block or shield each other, and can reduce the manufacturing cost of the antenna structure without destroying the structural design of the original motherboard. The length of the radiation layer can be extended according to the required transceiver frequency of the antenna structure.

[0008] In order to achieve the above-mentioned purpose, the present invention provides an antenna structure, which is electrically fixed to the main board of the electronic device, including: a circuit board, a high-frequency radiation layer and a low-frequency radiation layer. The circuit board is a square body, having a front side, a back side, a top side, a bottom side and two side sides. The high-frequency radiation layer is arranged on the front side of the circuit board, and has a high-frequency coupling edge thereon. The low-frequency radiation layer is arranged on the back side of the circuit board, and has a low-frequency coupling edge thereon. The high-frequency radiation layer and the low-frequency radiation layer do not overlap with each other, and the high-frequency coupling edge and the low-frequency coupling edge are used to couple the bandwidth of the receiving and transmitting frequency of the antenna structure.

[0009] In one embodiment of the present invention, the high-frequency coupling edge includes a high-frequency straight edge and a high-frequency oblique edge.

[0010] In one embodiment of the present invention, the high-frequency radiation layer is disposed on the front side of the circuit board, and the back side of the circuit board includes a bare area, and the bare area is further provided with another high-frequency radiation layer, so that the high-frequency radiation layer in the bare area on the back side overlaps and is electrically connected with the high-frequency radiation layer on the front side to form a dual-path high-frequency radiation layer.

[0011] In one embodiment of the present invention, the low-frequency radiation layer includes a first low-frequency radiation layer and a second low-frequency radiation layer; in addition, the first low-frequency radiation layer is arranged on the back side of the circuit board, the first low-frequency radiation layer includes the low-frequency coupling edge, and the low-frequency coupling edge includes a low-frequency straight edge and a low-frequency oblique edge.

[0012] In one embodiment of the present invention, the second low-frequency radiation layer is U-shaped and disposed on a bare area on the front side of the circuit board, and overlaps and is electrically connected to the first low-frequency radiation layer on the back side of the circuit board to form a dual-path low-frequency radiation layer.

[0013] In one embodiment of the present invention, the frequency of the high frequency radiation layer is 5.15 GHz. Z~5.85GH Z and 5.925GH Z ~7.125GH Z .

[0014] In one embodiment of the present invention, the frequency of the low frequency radiation layer is 2.4 GHz. Z ~2.5GH Z .

[0015] In one embodiment of the present invention, the high-frequency coupling edge and the low-frequency coupling edge are symmetrical or asymmetrical in pattern design.

[0016] In one embodiment of the present invention, the high-frequency coupling edge and the low-frequency coupling edge are straight lines, oblique edges, polygons, or a mixture of two or more shapes.

[0017] In an embodiment of the present invention, a coupling distance is defined between the high-frequency coupling edge and the low-frequency coupling edge.

[0018] In one embodiment of the present invention, the coupling interval is 0 mm to 8 mm.

[0019] In one embodiment of the present invention, the coupling interval is 0 mm to 3 mm.

[0020] In one embodiment of the present invention, the bottom edge of the circuit board further includes a half-hole electrode layer, one of the half-hole electrode layers is electrically connected to the high-frequency radiation layer on the front side of the circuit board and an electrode layer in a bare area on the back side, and the other half-hole electrode layer is electrically connected to the low-frequency radiation layer on the back side of the circuit board and an electrode layer in a bare area on the front side.

[0021] In one embodiment of the present invention, the bottom edge of the circuit board further includes a half-hole electrode layer, one of the half-hole electrode layers is electrically connected to the high-frequency radiation layer on the front side of the circuit board and another high-frequency radiation layer in a bare area on the back side, and the other half-hole electrode layer is electrically connected to a first low-frequency radiation layer of the low-frequency radiation layer on the back side of the circuit board and a second low-frequency radiation layer in a bare area on the front side.

[0022] In one embodiment of the present invention, one of the side edges or the top edge of the circuit board further includes a half-hole electrode layer, and the half-hole electrode layer is electrically connected to the high-frequency radiation layer to make the radiation field pattern of the antenna structure better.

[0023] In one embodiment of the present invention, the semi-porous electrode layer is semicircular, semi-elliptical or polygonal.

[0024] In one embodiment of the present invention, the top edge or one of the side edges of the circuit board further includes a side radiation layer, and the side radiation layer is electrically connected to the high-frequency radiation layer to make the radiation pattern of the antenna structure better.

[0025] In one embodiment of the present invention, the front and back sides of the motherboard respectively have a first grounding layer, a second grounding layer, a first clearance area and a second clearance area which are symmetrical, and the first clearance area has a first electrode fixing layer and a second electrode fixing layer; in addition, a signal feeding layer coupled with the first grounding layer is provided on the front side of the motherboard, and the signal feeding layer is electrically connected to the first electrode fixing layer.

[0026] In an embodiment of the present invention, the first electrode fixing layer and the second electrode fixing layer are respectively electrically connected to a matching element and the first ground layer, and the antenna characteristics are adjusted by the matching element.

[0027] In one embodiment of the present invention, the length of the first clearance area and the second clearance area is 10 mm to 20 mm and the width is 3 mm to 8 mm. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 , a schematic diagram of an exploded view of the antenna structure and the motherboard of the first embodiment of the present invention; Figure 2 , Figure 1 Another perspective of the antenna structure and the exploded diagram of the motherboard; Figure 3 , Figure 1 Schematic diagram of the three-dimensional combination; Figure 4 , Figure 2 Schematic diagram of the three-dimensional combination; Figure 5 , a schematic front view of the antenna structure of the first embodiment of the present invention; Figure 6 , a schematic perspective view of the appearance of the antenna structure of the second embodiment of the present invention; Figure 7 , a schematic perspective view of the appearance of the antenna structure of the third embodiment of the present invention; Figure 8 , a schematic three-dimensional appearance diagram of the antenna structure of the fourth embodiment of the present invention.

[0029] In the figure: Antenna structure 10; circuit board 1; front side 11; bare area 111; back side 12; bare area 121; top side 13; bottom side 14; two side sides 15; high-frequency radiation layer 2; high-frequency coupling side 21; high-frequency straight side 211; high-frequency oblique side 212; Low-frequency radiation layer 3; first low-frequency radiation layer 31; second low-frequency radiation layer 32; low-frequency coupling edge 33; low-frequency straight edge 331; low-frequency oblique edge 332; half-hole electrode layer 4, 4a; electrode layer 5; side radiation layer 6; main board 20; first ground layer 201; second ground layer 202; first clearance area 203; second clearance area 204; first electrode fixing layer 205; The second electrode fixing layer 206 and the signal feeding layer 207 . DETAILED DESCRIPTION

[0030] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention. See also Figure 1 to Figure 4 , the antenna structure and the motherboard decomposition of the first embodiment of the present invention, Figure 1 Another perspective of the antenna structure and motherboard decomposition, Figure 1 and Figure 2 As shown in the figure: the vertical antenna structure of the present invention, the antenna structure 10 includes: a circuit board 1, a high-frequency radiation layer 2 and a low-frequency radiation layer 3. The high-frequency radiation layer 2 and the low-frequency radiation layer 3 do not overlap, interfere, block or shield each other, so as to increase the antenna receiving and transmitting efficiency.

[0031] The circuit board 1 is in the shape of a square body, and has a front side 11, a back side 12, a top side 13, a bottom side 14 and two side sides 15. In this figure, the circuit board 1 is a printed circuit board.

[0032] The high frequency radiation layer 2 is disposed on the front surface 11 of the circuit board 1. The high frequency radiation layer 2 is provided with a high frequency coupling edge 21. The high frequency coupling edge 21 includes a high frequency straight edge 211 and a high frequency oblique edge 212. In this figure, the frequency of the high frequency radiation layer 2 is 5.15 GHz. Z ~5.85GH Z and 5.925GH Z ~7.125GH Z .

[0033] It is worth mentioning that the high-frequency radiation layer 2 is arranged on the front side 11 of the circuit board 1, and the back side 12 of the circuit board 1 further includes a bare area 121, and the bare area 121 is further provided with an electrode layer 5 or another high-frequency radiation layer (not shown in the figure). The high-frequency radiation layer of the bare area 121 of the back side 12 overlaps and is electrically connected with the high-frequency radiation layer 2 of the front side 11 of the circuit board 1 to form a dual-path high-frequency radiation layer 2 design to increase the transceiver performance of the antenna structure 10.

[0034] The low-frequency radiation layer 3 includes a first low-frequency radiation layer 31 and a second low-frequency radiation layer 32. In addition, the first low-frequency radiation layer 31 is disposed on the back surface 12 of the circuit board 1, and does not overlap, interfere, block or shield the high-frequency radiation layer 2. The first low-frequency radiation layer 31 also has a low-frequency coupling edge 33, and the low-frequency coupling edge 33 includes a low-frequency straight edge 331 and a low-frequency oblique edge 332. In addition, the second low-frequency radiation layer 32 is U-shaped and disposed on the bare area 111 of the front surface 11 of the circuit board 1, and overlaps and is electrically connected to the first low-frequency radiation layer 31 on the back surface 12 of the circuit board 1. Since the first low-frequency radiation layer 31 and the second low-frequency radiation layer 32 of the low-frequency radiation layer 3 are respectively disposed on the front surface 11 and the back surface 12 of the circuit board 1, a dual-path low-frequency radiation layer 3 design is formed, which can improve the efficiency of the low-frequency radiation layer 3. In this figure, the frequency of the low frequency radiation layer 3 is 2.4 GH Z ~2.5GH Z .

[0035] When the antenna structure 10 of the present invention is used with the motherboard 20 of the electronic device, the front and back sides of the motherboard 20 respectively have a symmetrical first grounding layer 201, a second grounding layer 202, a first clearance area 203 and a second clearance area 204. The first clearance area 203 of the motherboard 20 has a first electrode fixing layer 205 and a second electrode fixing layer 206. In addition, a signal feeding layer 207 coupled with the first grounding layer 201 is provided on the front side of the motherboard 201. The signal feeding layer 207 is electrically connected to the first electrode fixing layer 205. At the same time, the first electrode fixing layer 205 and the second electrode fixing layer 206 are respectively electrically connected to a matching element (inductor or capacitor) (not shown) and electrically connected to the first grounding layer 201. The antenna characteristics are adjusted by the matching element, and the antenna can be adjusted to achieve the best transmitting and receiving effect. In this figure, the length (L) of the first clearance area 203 and the second clearance area 204 is 10 mm to 20 mm and the width (W) is 3 mm to 8 mm.

[0036] When the antenna structure 10 is welded to the main board 20 , the high-frequency radiation layer 2 and the electrode layer 5 on the circuit board 1 are electrically fixed to the first electrode fixing layer 205 , and the first low-frequency radiation layer 31 and the second low-frequency radiation layer 32 of the low-frequency radiation layer 3 are electrically fixed to the second electrode fixing layer 206 .

[0037] See also Figure 5, which is a front view schematic diagram of the antenna structure of the first embodiment of the present invention. As shown in the figure: the high-frequency radiation layer 2 and the low-frequency radiation layer 3 of the antenna structure 10 of the present invention are respectively arranged on the front side 11 and the back side 12 of the circuit board 1, and the high-frequency radiation layer 2 and the low-frequency radiation layer 3 do not overlap, interfere, block or shield each other, and the high-frequency coupling edge 21 of the high-frequency radiation layer 2 and the low-frequency coupling edge 33 of the low-frequency radiation layer 3 are used to couple the receiving and transmitting frequency characteristics and performance of the antenna structure 10.

[0038] Moreover, the high-frequency coupling edge 21 and the low-frequency coupling edge 33 of the high-frequency radiation layer 2 and the low-frequency radiation layer 3 can use symmetrical or asymmetrical graphic designs, such as straight edges, oblique edges or polygons, or a mixture of two or more shapes, so that the bandwidth of the high-frequency radiation layer 2 and the low-frequency radiation layer 3 can be increased.

[0039] In addition, the coupling distance 30 between the high-frequency coupling edge 21 of the high-frequency radiation layer 2 and the low-frequency coupling edge 33 of the low-frequency radiation layer 3 is used to achieve the required characteristics of the antenna structure 10. Compared with the high-frequency radiation layer and the low-frequency radiation layer of the old antenna structure in the past, which overlap, interfere, block or shield each other, the high-frequency radiation layer and the low-frequency radiation layer of the antenna structure 10 of the present invention do not overlap, interfere, block or shield each other, so that the efficiency, field pattern and measured data of the antenna structure 10 can be improved. In this figure, the coupling distance 30 is 0mm~8mm, and 0mm~3mm is the best.

[0040] See also Figure 6 , which is a schematic diagram of the appearance of the antenna structure of the second embodiment of the present invention. As shown in the figure: This embodiment is substantially the same as the first embodiment, except that the circuit board 1 further includes a half-hole electrode layer 4, which is respectively arranged on the bottom edge 14 of the circuit board 1, one of the half-hole electrode layers 4 is electrically connected to the high-frequency radiation layer 2 on the front side 11 of the circuit board 1 and the electrode layer 5 or another high-frequency radiation layer (not shown in the figure) in the bare area 121 on the back side 12, and the other half-hole electrode layer 4 is electrically connected to the low-frequency radiation layer 3 or the first low-frequency radiation layer 31 on the back side 12 of the circuit board 1 and the electrode layer (not shown in the figure) or the second low-frequency radiation layer 32 in the bare area 111 on the front side 11.

[0041] The design of the semi-hole electrode layer 4 reduces the manufacturing cost of the antenna structure 10, and can electrically fix the antenna structure 10 with the first electrode fixing layer 205 and the second electrode fixing layer 206 on the main board 20 without destroying the original structure of the main board 20. In this figure, the semi-hole electrode layer 4 is semicircular, semi-elliptical or polygonal.

[0042] See also Figure 7, which is a three-dimensional schematic diagram of the appearance of the antenna structure of the third embodiment of the present invention. As shown in the figure: This embodiment is substantially the same as the first and second embodiments, except that the half-hole electrode layer 4a can be provided on the bottom edge 14 as an electrode layer, and the half-hole electrode 4a can also be provided on the top edge 13 of the circuit board 1 and electrically connected to the high-frequency radiation layer 2, so that the radiation field diagram of the antenna structure 10 is better, so as to improve the receiving and transmitting performance and gain of the antenna structure.

[0043] See also Figure 8 , which is a perspective view of the appearance of the antenna structure of the fourth embodiment of the present invention. As shown in the figure: This embodiment is substantially the same as the first and second embodiments, except that a side radiation layer 6 is further included on the top edge 13 or one side edge 15 of the circuit board 1, and the side radiation layer 6 is electrically connected to the high-frequency radiation layer 2, so that the radiation field diagram of the antenna structure 10 is better, thereby improving the transceiver performance and gain of the antenna structure 10.

[0044] The above-described embodiments are only preferred embodiments for fully illustrating the present invention, and the protection scope of the present invention is not limited thereto. Equivalent substitutions or changes made by those skilled in the art based on the present invention are within the protection scope of the present invention. The protection scope of the present invention shall be subject to the claims.

Claims

1. An antenna structure electrically fixed to a motherboard of an electronic device, characterized in that: include: A circuit board is in the shape of a square body, having a front side, a back side, a top side, a bottom side and two side sides; A high-frequency radiation layer is disposed on the front surface of the circuit board and has a high-frequency coupling edge; A low-frequency radiation layer is disposed on the back surface of the circuit board and has a low-frequency coupling edge; The high-frequency radiation layer and the low-frequency radiation layer do not overlap each other, and the high-frequency coupling edge and the low-frequency coupling edge are used to couple out the bandwidth of the receiving and transmitting frequency of the antenna structure.

2. The antenna structure according to claim 1, characterized in that: The high frequency coupling edge includes a high frequency straight edge and a high frequency oblique edge.

3. The antenna structure according to claim 2, characterized in that: The high-frequency radiation layer is arranged on the front side of the circuit board, and includes a bare area corresponding to the back side of the circuit board. The bare area is further provided with another high-frequency radiation layer, so that the high-frequency radiation layer in the bare area on the back side overlaps and is electrically connected with the high-frequency radiation layer on the front side to form a dual-path high-frequency radiation layer.

4. The antenna structure according to claim 3, characterized in that: The low-frequency radiation layer includes a first low-frequency radiation layer and a second low-frequency radiation layer; in addition, the first low-frequency radiation layer is arranged on the back side of the circuit board, the first low-frequency radiation layer includes the low-frequency coupling edge, and the low-frequency coupling edge includes a low-frequency straight edge and a low-frequency oblique edge.

5. The antenna structure according to claim 4, characterized in that: The second low-frequency radiation layer is U-shaped and disposed on a bare area on the front side of the circuit board, and overlaps and is electrically connected with the first low-frequency radiation layer on the back side of the circuit board to form a dual-path low-frequency radiation layer.

6. The antenna structure according to claim 1, characterized in that: The frequency of this high-frequency radiation layer is 5.15GH Z ~5.85GH Z and 5.925GH Z ~7.125GH Z .

7. The antenna structure according to claim 1, characterized in that: The frequency of the low-frequency radiation layer is 2.4GH Z ~2.5GH Z .

8. The antenna structure according to claim 1, characterized in that: The high frequency coupling edge and the low frequency coupling edge are designed in symmetrical or asymmetrical patterns.

9. The antenna structure according to claim 1, characterized in that: The high-frequency coupling edge and the low-frequency coupling edge are straight lines, oblique edges, polygons, or a mixture of two or more shapes.

10. The antenna structure according to claim 1, characterized in that: A coupling distance is provided between the high frequency coupling edge and the low frequency coupling edge.

11. The antenna structure according to claim 10, characterized in that: The coupling interval is 0 mm to 8 mm.

12. The antenna structure according to claim 11, characterized in that: The coupling interval is 0 mm to 3 mm.

13. The antenna structure according to claim 1, characterized in that: The bottom edge of the circuit board further includes a half-hole electrode layer, one of the half-hole electrode layers is electrically connected to the high-frequency radiation layer on the front side of the circuit board and an electrode layer in a bare area on the back side, and the other half-hole electrode layer is electrically connected to the low-frequency radiation layer on the back side of the circuit board and an electrode layer in a bare area on the front side.

14. The antenna structure according to claim 1, characterized in that: The bottom edge of the circuit board further includes a half-hole electrode layer, one of which is electrically connected to the high-frequency radiation layer on the front side of the circuit board and another high-frequency radiation layer in a bare area on the back side, and the other half-hole electrode layer is electrically connected to a first low-frequency radiation layer of the low-frequency radiation layer on the back side of the circuit board and a second low-frequency radiation layer in a bare area on the front side.

15. The antenna structure according to claim 14, characterized in that: The circuit board further includes a half-hole electrode layer on one of the side edges or the top edge. The half-hole electrode layer is electrically connected to the high-frequency radiation layer, so that the radiation field pattern of the antenna structure is better.

16. The antenna structure according to claim 14, characterized in that: The semi-porous electrode layer is semicircular, semi-elliptical or polygonal.

17. The antenna structure according to claim 1, characterized in that: The top edge or one of the side edges of the circuit board further includes a side radiation layer, and the side radiation layer is electrically connected to the high-frequency radiation layer to make the radiation field pattern of the antenna structure better.

18. The antenna structure according to claim 1, characterized in that: The front and back sides of the main board are respectively provided with a first grounding layer, a second grounding layer, a first clearance area and a second clearance area which are symmetrical, and the first clearance area is provided with a first electrode fixing layer and a second electrode fixing layer; in addition, a signal feeding layer coupled with the first grounding layer is provided on the front side of the main board, and the signal feeding layer is electrically connected with the first electrode fixing layer.

19. The antenna structure according to claim 18, characterized in that: The first electrode fixing layer and the second electrode fixing layer are respectively electrically connected to a matching element and the first grounding layer, and the antenna characteristics are adjusted by the matching element.

20. The antenna structure according to claim 18, characterized in that: The length of the first clearance area and the second clearance area is 10 mm to 20 mm and the width is 3 mm to 8 mm.

Images