Transparent power supply device with pre-etching circuit and preparation method thereof

Abstract

The invention relates to the technical field of devices used for replacing metal wires on the surface of any transparent hard substrate to transmit power for electrical equipment, in particular to a transparent power supply device with a pre-etching circuit and a preparation method of the transparent power supply device. The transparent power supply device comprises a low-sheet-resistance conductive film coiled material and an electrode connecting kit matched with the low-sheet-resistance conductive film coiled material. The low-square-resistance conductive film coiled material is connected with the electrode connecting kit, and the electrode connecting kit is connected with a power supply for taking electricity; the low-square-resistance conducting film coiled material comprises a conducting layer, a prefabricated circuit is arranged on the conducting layer and comprises a plurality of parallel conducting areas, an etching circuit is arranged between every two adjacent conducting areas, and the etching circuits are used for insulating every two adjacent conducting areas; comprising the following steps: preparing a prefabricated circuit of a low-sheet-resistance conductive film coiled material, namely processing and forming the prefabricated circuit on the low-sheet-resistance conductive film coiled material by adopting a roll-to-roll continuous etching process; the roll-to-roll continuous etching process comprises the following steps: carrying out circuit pre-preparation on a low-square-resistance conductive film coiled material by adopting roll-to-roll continuous etching equipment; the roll-to-roll continuous etching process comprises the following steps: roll-to-roll continuous etching is carried out along the material pulling direction of equipment; the roll-to-roll continuous etching process comprises the step of roll-to-roll continuous etching in the direction perpendicular to the material pulling direction of the equipment. Compared with the prior art, the transparent power supply device with the pre-etching circuit and the preparation method of the transparent power supply device can effectively overcome the defects of the existing technical scheme, improve the product yield and reduce the production difficulty and threshold, so that the technology can be widely accepted and applied by the market.

Description

[Technical field]

[0001] The present invention relates to the technical field of devices for transmitting power to electrical equipment on the surface of any transparent hard substrate instead of metal wires, and in particular to a transparent power supply device with a pre-etched circuit and a preparation method thereof. [Background technology]

[0002] In recent years, the production process of transparent conductive films has become increasingly mature: the visible light transparency of mainstream transparent conductive films on the market reaches or exceeds 80%, and the conductive properties of the films are also constantly improving.

[0003] Therefore, in the sign and advertising industry, a solution has emerged in which a transparent conductive film is attached to the surface of transparent glass (or other transparent hard substrates) to replace traditional metal wires and directly power advertising signs, corporate logos, LED luminous characters, etc. (hereinafter referred to as electrical equipment).

[0004] With this solution, consumers will only see transparent glass and glowing words and no wires. The entire picture is transparent and simple, with a strong sense of technology and beauty.

[0005] In the market, this solution is called "conductive glass", "wireless luminous characters" or "conductive glass luminous characters".

[0006] The mainstream solution of the existing technology is to use a conductive film as a medium for transmitting electricity. By performing laser etching on the conductive film, the conductive layer (the coating layer on the surface of the substrate) is cut and separated, and then current is input into the separated conductive layers. A circuit is formed through electrical equipment (including luminous characters, signs, neon lights, etc.) to achieve power supply.

[0007] When implementing this solution, the first step is that the provider needs to design the laser etching circuit according to the layout of the positive and negative poles of the electrical equipment, and then cut the transparent conductive film from the roll and place a single piece on the platform of the laser etching equipment to complete the circuit etching.

[0008] Then, a sticky protective film is attached to the surface of the conductive film. In the second step, before the protective film is completely covered, holes need to be dug in the protective film in the area where the positive and negative electrodes of the electrical device are arranged, so that the positive and negative electrodes on the electrical device can be connected to the positive and negative electrodes of the etched conductive film through wires (L).

[0009] The third step is to stick the conductive film to the surface of the transparent hard substrate. The fourth step is to fix the electrical device on the hard substrate. Finally, the electrical device is beautified and covered on the other side of the transparent hard substrate.

[0010] The implementation difficulty of this solution is as follows:

[0011] 1) To implement the first step, a large-format desktop laser etching device is needed. This device is expensive and has a low penetration rate. Most practitioners need to outsource the etching process.

[0012] 2) During the first step, the conductive layer of the conductive film will be exposed to air (oxygen and moisture) for a long time, causing oxidation of the conductive layer; the movement of the conductive film by the operator during the operation will cause the conductive layer to be scratched and contaminated. Currently, the proportion of defective products produced in this process in the industry is 40%-50%.

[0013] 3) The second step is to paste copper foil electrodes and weld wires. This process has the risk of contaminating and damaging the conductive layer, so the operator must be gentle and the operation process should not be too fast, which directly leads to low efficiency.

[0014] In summary, the disadvantages of the existing technical solutions are: low efficiency, high defect rate, high equipment threshold, and difficult operation. These factors seriously restrict the development of the industry and the application scope of the process. [Summary of the invention]

[0015] In order to overcome the above problems, the present invention provides a transparent power supply device with a pre-etched circuit and a preparation method thereof which can effectively solve the above problems.

[0016] A technical solution provided by the present invention to solve the above technical problems is: to provide a transparent power supply device with a pre-etched circuit and a preparation method thereof, including a low-resistance conductive film coil and an electrode connection kit matching the low-resistance conductive film coil, the low-resistance conductive film coil is connected to the electrode connection kit, and the electrode connection kit is connected to a power supply to draw power; the low-resistance conductive film coil includes a conductive layer, a prefabricated circuit is arranged on the conductive layer, the prefabricated circuit includes a plurality of parallel conductive areas, an etching circuit is arranged between two adjacent conductive areas, and the etching circuit is used to insulate the two adjacent conductive areas.

[0017] Preferably, the electrode connection kit includes an input PCB board, which matches the specifications of the low-resistance conductive film coil, is connected to the side of one end of the low-resistance conductive film coil, and is electrically conductive with the low-resistance conductive film coil.

[0018] Preferably, the left and right ends of the input PCB board are provided with first power input terminals; a plurality of continuous conductive units are distributed in the input PCB board, a bare copper electrode is provided in each conductive unit, and the polarities of the electrodes of every two adjacent conductive units are opposite.

[0019] Preferably, the input PCB board is marked with a dotted line, the dotted line is located between every two adjacent conductive units, and the input PCB board obtained after being cut along the dotted line can still be used separately.

[0020] Preferably, electrical conduction is achieved between the input PCB board and the conductive area of ​​the low-square-resistance conductive film coil through conductive cotton; one side of the conductive cotton is adhered to the copper electrode of the input PCB board, and the other side contacts the conductive area of ​​the prefabricated circuit.

[0021] Preferably, the terminal can receive power input from a DC adapter with an output voltage below 36V; the first output terminal is connected to the first power input terminal of the input PCB board through a terminal line.

[0022] A method for preparing a transparent power supply device with a pre-etched circuit is characterized in that it includes the preparation of a prefabricated circuit of a low-resistance conductive film coil, and a roll-to-roll continuous etching process is used to form the prefabricated circuit on the low-resistance conductive film coil.

[0023] Preferably, the roll-to-roll continuous etching process comprises: using a roll-to-roll continuous etching device to perform circuit pre-preparation on a low-resistance conductive film roll.

[0024] Preferably, the roll-to-roll continuous etching process comprises: roll-to-roll continuous etching along a material pulling direction of the equipment.

[0025] Preferably, the roll-to-roll continuous etching process includes: roll-to-roll continuous etching perpendicular to the material pulling direction of the equipment.

[0026] Compared with the prior art, the transparent power supply device with pre-etched circuit and the preparation method thereof of the present invention uses an innovatively designed roll-to-roll continuous etching process to efficiently and batch produce transparent circuits, replacing the conductive film that originally required single etching, directly avoiding the first step of the prior art, and efficiently (roll-to-roll) batch manufacturing of transparent standard circuits (conductive film after etching) of various models (circuit specifications). Users can choose the appropriate model (circuit specification) and match it with a standard interface to easily complete access and power transmission. The present invention simplifies the second step of the prior art through an original standardized electrode connection kit and connection method.

[0027] The present invention can effectively resolve the drawbacks of existing technical solutions, improve product yield, reduce production difficulty and threshold, and enable the technology to be widely accepted and applied by the market.

Brief Description of the Drawings

[0028] Figure 1 It is a schematic diagram of a low-square-resistance conductive film roll of a transparent power supply device with a pre-etched circuit according to the present invention after continuous roll-to-roll etching in the MD direction;

[0029] Figure 2 It is a schematic diagram of a low-square-resistance conductive film roll of a transparent power supply device with a pre-etched circuit according to the present invention after continuous roll-to-roll etching in the TD direction;

[0030] Figure 3 It is a cross-sectional view of the low-square-resistance conductive film coil of the transparent power supply device with a pre-etched circuit of the present invention after being coated with OCA glue;

[0031] Figure 4 This is a schematic diagram of the input PCB board connection of the transparent power supply device with a pre-etched circuit of the present invention;

[0032] Figure 5 The diagram is a connection diagram of an input PCB board and a prefabricated circuit of a transparent power supply device with a pre-etched circuit according to the present invention. [Specific implementation method]

[0033] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and implementation examples. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0034] It should be noted that in the embodiments of the present invention, all directional indications (such as up, down, left, right, front, back, etc.) are limited to relative positions on the specified view, rather than absolute positions.

[0035] In addition, in the present invention, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0036] See also Figures 1 to 5 The transparent power supply device with a pre-etched circuit of the present invention includes a low-resistance conductive film coil 10 and an electrode connection kit 20 matching the low-resistance conductive film coil 10, wherein the low-resistance conductive film coil 10 is connected to the electrode connection kit 20, and the electrode connection kit 20 is connected to a power source to obtain power.

[0037] The low square resistance conductive film coil 10 includes a conductive layer, a prefabricated circuit is arranged on the conductive layer, and the prefabricated circuit includes a plurality of parallel conductive areas 11, and an etched circuit 12 is arranged between two adjacent conductive areas 11, and the etched circuit 12 is used to insulate the two adjacent conductive areas 11. The etched circuit 12 is a groove with a certain depth.

[0038] The plurality of parallel conductive regions 11 may be along the material drawing direction of the device, or may be perpendicular to the material drawing direction of the device.

[0039] The low-square-resistance conductive film coil 10 can be cut into suitable specifications for use according to actual needs of users.

[0040] The electrode connection kit 20 includes an input PCB board 30, which matches the specifications of the low-resistance conductive film coil 10, is connected to the side of one end of the low-resistance conductive film coil 10, and is electrically conductive with the low-resistance conductive film coil 10.

[0041] The width of the input PCB board 30 is 500mm. The left and right ends of each input PCB board 30 are equipped with a first power input terminal A. A plurality of continuous conductive units 31 are distributed in the input PCB board 30, and the width of the conductive unit 31 can be 10mm, 20mm, 30mm, 50mm, 100mm, 300mm, 600mm and other specifications. A bare copper electrode C with a size of 4mm*4mm is provided in each conductive unit 31, and the polarity of the electrode (positive or negative) is marked next to the bare copper electrode C. The electrode polarities of every two adjacent conductive units 31 are opposite, that is, the positive and negative poles are staggered. The input PCB board 30 is marked with a dotted line E, which is located between every two adjacent conductive units 31. The applicable length is obtained by cutting the PCB along the dotted line E. The input PCB board 30 obtained after cutting along the dotted line E can still be used alone. When the length of the PCB needs to be extended, the first power input terminals A of two PCBs (having a first power input terminal A and at least one copper electrode C) are connected through a terminal wire to achieve the extension.

[0042] The input PCB board 30 and the conductive area 11 of the low-square-resistance conductive film coil 10 are electrically connected through conductive cotton.

[0043] The size of the conductive cotton is 9mm long*9mm wide and 4mm thick. The upper and lower sides of the conductive cotton are sticky and covered with release paper. After tearing off the release paper, one side of the conductive cotton is pasted on the copper electrode C of the input PCB board 30, and the other side contacts the conductive area 11 of the prefabricated circuit. After the copper electrode of the PCB board is pasted with the conductive cotton, it is connected to the corresponding prefabricated circuit.

[0044] The input PCB board 30 is connected to an adapter access PCB board through a terminal line, one end of the adapter access PCB board is configured with a first output terminal, and the other end is configured with a second input terminal. The second input terminal can receive power input from a DC adapter with an output voltage below 36V. The first output terminal is connected to a first power input terminal A of the input PCB board 30 through a terminal line.

[0045] The conductive area 11 of the prefabricated circuit is connected to a metal terminal, and the metal terminal is used to connect the input wire of the electrical device.

[0046] One end of the metal terminal is provided with a metal surface, and the metal surface is attached with conductive cotton and connected to the conductive area 11 of the prefabricated circuit. The other end of the metal terminal is provided with a wiring hole, and the wiring hole is connected to the input wire of the electrical device.

[0047] The method for preparing a transparent power supply device with a pre-etched circuit of the present invention includes preparing a prefabricated circuit of a low-resistance conductive film coil 10, and forming the prefabricated circuit on the low-resistance conductive film coil 10 by a roll-to-roll continuous etching process.

[0048] The roll-to-roll continuous etching process includes: using a roll-to-roll continuous etching device to perform circuit pre-preparation on the low-resistance conductive film roll 10 .

[0049] The roll-to-roll continuous etching equipment includes an unwinding mechanism: the wheel surface of the unwinding mechanism is 1400mm, and it can support operation on an effective (conductive layer) width of 1350mm at most. The maximum load-bearing capacity of the unwinding mechanism is 800kg, and it can support a 1000m length of coils with a thickness of 0.188mm or less. The unwinding speed is controlled by a tension sensor.

[0050] The roll-to-roll continuous etching equipment includes a winding mechanism: the wheel surface of the winding mechanism is 1400mm, the maximum load-bearing capacity of the mechanism is 800kg, and it can support a 1000m length of coiled material with a thickness of 0.188mm or less. The winding speed is controlled by a tension sensor.

[0051] The roll-to-roll continuous etching equipment includes an etching center: the etching center is equipped with 27 lasers, of which 26 lasers operate in the MD (machine material pulling direction), hereinafter referred to as MD lasers, and 1 laser operates in the TD (perpendicular to the machine material pulling direction), hereinafter referred to as TD laser. The laser type is an integrated ultraviolet nanosecond laser machine (including a water cooler). The direction in which the laser emits the laser is perpendicular to the surface of the coil. The laser is fixed on the metal structure of the equipment, and its fixed position can be fine-tuned.

[0052] The roll-to-roll continuous etching process comprises:

[0053] Roll-to-roll continuous etching is performed along the material pulling direction of the equipment, that is, MD direction roll-to-roll continuous etching. When the winding mechanism pulls the coil to move in the horizontal direction, the MD laser works at the same time, and parallel lines (etching lines 12) with a certain width (adjustable from 20 microns to 50 microns) are engraved on the conductive layer on the surface of the coil directly below. The minimum distance between the parallel lines is 50mm. The depth of these parallel lines is adjustable, and the conductive layer is physically cut off, so that the conductive layers on both sides of the lines are insulated from each other to form independent parallel conductive areas 11. The above parallel lines and the conductive areas 11 separated from each other constitute a prefabricated circuit.

[0054] The roll-to-roll continuous etching equipment can simultaneously etch up to 26 parallel lines in the MD direction on a 1350 mm wide coil. When the equipment is set up for operation, the number of parallel lines engraved by the laser on the coil can be reduced by turning off some MD lasers, thereby obtaining coils with conductive areas 11 of different "line widths", which are subsequently referred to as different types of (MD direction) prefabricated circuits.

[0055] The roll-to-roll continuous etching process comprises:

[0056] Roll-to-roll continuous etching is perpendicular to the material pulling direction of the equipment, that is, roll-to-roll continuous etching in the TD direction. The reeling mechanism pulls the coil to move in the horizontal direction. When it reaches the working area, the reeling mechanism stops pulling and the coil is in a stationary state. At this time, the TD laser starts to emit laser and moves in the TD direction, and a line is engraved on the conductive layer on the surface of the coil directly below. The depth of the line is adjustable, and the conductive layer is physically cut off, so that the conductive layers on both sides of the line are insulated from each other. The TD laser stops moving after reaching the stop point in the TD direction and stops emitting laser at the same time. Then the reeling mechanism pulls the coil to move in the horizontal direction again, and stops again after moving to the specified distance. The TD laser moves in the TD direction and emits laser again. The reeling mechanism pulls the coil to move at different distances, thereby obtaining coils with different TD direction etching "line widths", which are subsequently referred to as different models of TD prefabricated circuits. The minimum width between the etched lines 12 in the TD prefabricated circuit can be 10mm.

[0057] The roll-to-roll continuous etching process comprises:

[0058] In the latter process, after the operation on the etching equipment is completed, the conductive surface and the back surface of the rolled material are coated with OCA glue 40 in the same workshop. The back surface is OCA glue 40 with a release film, and the conductive surface is OCA glue 40 with a protective film. At this point, the production process of the prefabricated circuit of the roll material has been completed.

[0059] Compared with the prior art, the transparent power supply device with pre-etched circuit and the preparation method thereof of the present invention uses an innovatively designed roll-to-roll continuous etching process to efficiently and batch produce transparent circuits, replacing the conductive film that originally required single etching, directly avoiding the first step of the prior art, and efficiently (roll-to-roll) batch manufacturing of transparent standard circuits (conductive films after etching) of various models (circuit specifications). Users can choose the appropriate model (circuit specification) and match it with a standard interface to easily complete access and power transmission. The present invention simplifies the second step of the prior art through an original standardized electrode connection kit 20 and connection method.

[0060] The present invention can effectively resolve the drawbacks of existing technical solutions, improve product yield, reduce production difficulty and threshold, and enable the technology to be widely accepted and applied by the market.

[0061] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any modifications, equivalent substitutions and improvements made within the concept of the present invention should be included in the patent protection scope of the present invention.

Claims

1. A transparent power supply device with a pre-etched circuit, characterized in that: It includes a low-square-resistance conductive film coil and an electrode connection kit matched with the low-square-resistance conductive film coil, wherein the low-square-resistance conductive film coil is connected to the electrode connection kit, and the electrode connection kit is connected to a power source to obtain power; The low-square-resistance conductive film coil comprises a conductive layer, a prefabricated circuit is arranged on the conductive layer, the prefabricated circuit comprises a plurality of parallel conductive areas, an etching circuit is arranged between two adjacent conductive areas, and the etching circuit is used to insulate the two adjacent conductive areas.

2. The transparent power supply device with a pre-etched circuit according to claim 1, characterized in that: The electrode connection kit includes an input PCB board, which matches the specifications of the low-resistance conductive film coil. The input PCB board is connected to the side of one end of the low-resistance conductive film coil, and the input PCB board is electrically conductive with the low-resistance conductive film coil.

3. The transparent power supply device with a pre-etched circuit according to claim 1, characterized in that: The left and right ends of the input PCB board are provided with first power input terminals; a plurality of continuous conductive units are distributed in the input PCB board, each conductive unit is provided with a bare copper electrode, and the electrodes of every two adjacent conductive units have opposite polarities.

4. The transparent power supply device with a pre-etched circuit according to claim 3, characterized in that: The input PCB is marked with a dotted line, which is located between every two adjacent conductive units. The input PCB obtained after being cut along the dotted line can still be used separately.

5. The transparent power supply device with a pre-etched circuit according to claim 1, characterized in that: Electrical conduction is achieved between the input PCB board and the conductive area of ​​the low-square-resistance conductive film coil through conductive cotton; one side of the conductive cotton is adhered to the copper electrode of the input PCB board, and the other side contacts the conductive area of ​​the prefabricated circuit.

6. The transparent power supply device with a pre-etched circuit according to claim 3, characterized in that: The input PCB board is connected to an adapter access PCB board through a terminal line, one end of the adapter access PCB board is configured with a first output terminal, and the other end is configured with a second input terminal; the second input terminal can receive power input from a DC adapter with an output voltage below 36V; the first output terminal is connected to the first power input terminal of the input PCB board through a terminal line.

7. A method for preparing a transparent power supply device with a pre-etched circuit, characterized in that: The invention comprises the preparation of prefabricated circuit of low-square-resistance conductive film coil, and adopts roll-to-roll continuous etching process to form prefabricated circuit on low-square-resistance conductive film coil.

8. The method for preparing a transparent power supply device with a pre-etched circuit according to claim 7, characterized in that: The roll-to-roll continuous etching process comprises: using a roll-to-roll continuous etching device to pre-prepare a circuit for a low-resistance conductive film roll.

9. The method for preparing a transparent power supply device with a pre-etched circuit according to claim 8, characterized in that: The roll-to-roll continuous etching process includes: roll-to-roll continuous etching along the material pulling direction of the equipment.

10. The method for preparing a transparent power supply device with a pre-etched circuit according to claim 8, characterized in that: The roll-to-roll continuous etching process includes: roll-to-roll continuous etching perpendicular to the material pulling direction of the equipment.

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