Multilayer circuit board with efficient buffer performance and processing method thereof

Abstract

The invention discloses a multilayer circuit board with efficient buffer performance and a processing method thereof. The multilayer circuit board includes a top layer, a bottom layer, and an insulating layer made of a polymer, ceramic, glass, or silicon material and containing a reinforcing material to enhance mechanical strength and heat resistance. The top layer is provided with a connector installation area, the bottom layer is provided with a wire connection area, and electrical connection consistency is ensured through accurate alignment of the connector installation area and the wire connection area. The top-layer grounding pad and the bottom-layer grounding pad are vertically interconnected through a conductive through hole, and the wall of the through hole is made of copper, gold or nickel. And the buffer structure comprises PacoPads, a silica gel pad and a thermal conductive material layer, is configured between the top layer and the bottom layer, and is used for buffering temperature and pressure in the pressing process, reducing interlayer temperature difference and pressure concentration and improving plate thickness uniformity and mechanical stability. The PacoPads absorb pressure generated by thermal expansion or mechanical shock, the silica gel pad provides additional buffering and stress dispersion, and the thermal conductive material layer realizes rapid heat conduction. The structure effectively improves the stability and durability of the circuit board.

Description

Technical Field

[0001] The present invention relates to circuit board products and manufacturing technologies, and in particular to a multilayer circuit board with high-efficiency buffering performance and a processing method thereof. Background Art

[0002] With the rapid development of electronic technology, multi-layer circuit boards are increasingly used in electronic devices. By arranging circuits on multiple levels, multi-layer circuit boards achieve high-density integration of circuits and improve the performance and reliability of electronic devices. However, the existing multi-layer circuit board design is obviously vulnerable to mechanical shock and thermal stress, which to some extent limits its application in harsh environments.

[0003] Existing multi-layer circuit boards are usually composed of a top layer, a bottom layer, and multiple insulating and conductive layers in between. These layers are tightly bonded together by adhesives or special lamination processes to form the required circuit paths and component mounting areas. Although this structure performs well in circuit connection and signal transmission, its ability to buffer external impact and thermal expansion is far from enough.

[0004] In actual applications, multi-layer circuit boards may be damaged due to falling, squeezing or temperature changes. Due to the lack of an effective buffering mechanism, these external forces directly act on the interlayer structure of the circuit board, causing the circuit layer to break, the conductive via to rupture or the pad to fall off, thereby causing the circuit to short or open, affecting the stability and service life of the equipment. In addition, the internal stress caused by thermal expansion may also cause interlayer delamination, further reducing the reliability of the circuit board. In high-power or high-power density electronic devices, the thermal management problem of multi-layer circuit boards is particularly prominent. Existing circuit board designs often cannot effectively conduct and disperse heat, resulting in concentrated hot spots, affecting circuit performance, and may even cause overheating and damage to the equipment.

[0005] Therefore, it is necessary to develop a new type of multilayer circuit board, which can not only provide excellent circuit connection and signal transmission performance, but also provide sufficient buffer protection when subjected to external force and thermal stress to improve the durability and reliability of the circuit board. This is exactly the technical problem that the present invention aims to solve. Summary of the invention

[0006] In view of this, the present invention aims to address the deficiencies in the prior art, and its main purpose is to provide a multi-layer circuit board with efficient buffering performance and a processing method thereof, which effectively absorbs and disperses the pressure generated by thermal expansion or mechanical impact, reduces the temperature difference and pressure concentration between layers, and thus improves the uniformity of board thickness and the mechanical stability of the circuit board by utilizing the coordinated work of PacoPads, silicone pads and thermal conductive material layers.

[0007] To achieve the above purpose, the present invention adopts the following technical solutions:

[0008] A multilayer circuit board with efficient buffering performance comprises a top layer and a bottom layer; an insulating layer is arranged between the top layer and the bottom layer, the insulating layer is made of at least one polymer, ceramic, glass or silicon material, and contains reinforcing materials to improve mechanical strength and heat resistance; the top layer is provided with a connector mounting area, the bottom layer is provided with a wire connection area, wherein the connector mounting area is configured to be inserted into a connector; the wire connection area comprises a top layer grounding pad and a bottom layer grounding pad, which are precisely aligned to ensure consistency of electrical connection; the top layer grounding pad and the bottom layer grounding pad are vertically interconnected through conductive through holes;

[0009] at least one conductive via extending from a top-layer grounding pad to a bottom-layer grounding pad and contacting the top-layer grounding pad and the bottom-layer grounding pad, the conductive via comprising a conductive wall made of one or more materials selected from copper, gold or nickel;

[0010] The buffer structure is used to buffer temperature and pressure during the lamination process, reduce temperature differences and pressure concentration between layers, improve the uniformity of board thickness, and provide buffer force when the circuit board is vibrated by external force, so as to keep the circuit board stable and avoid damage to the middle part due to force; the buffer structure is configured between the top layer and the bottom layer, and includes PacoPads, silicone pads and a thermal conductive material layer; the PacoPads are evenly distributed between the insulating layers to absorb the pressure generated by thermal expansion or mechanical impact; the silicone pads cover the PacoPads to provide additional buffering and stress dispersion; the thermal conductive material layer is embedded in the insulating layer and is adjacent to the silicone pad to achieve rapid conduction of heat from the heat source to the heat dissipation area.

[0011] As a preferred solution: the buffer structure further includes at least one buffer spring and a support column, the buffer spring is made of a metal alloy with high elasticity, and the support column is made of a high-strength ceramic material to provide additional buffering force and structural stability; the buffer spring is arranged at the four corners and the center position between the top layer and the bottom layer to provide additional buffering at the edges and the center; the support column is located outside the top layer and the bottom layer, and close to the connector installation area and the wire connection area to provide local support and resist deformation caused by mechanical pressure or thermal expansion; the absorbs and disperses the pressure generated by thermal expansion or mechanical impact; the silicone pad is covered on the PacoPads to provide buffering and stress dispersion between the top layer and the bottom layer; the thermal conductive material layer is embedded in the insulating layer, adjacent to the silicone pad, to achieve rapid conduction of heat from the heat source to the heat dissipation area.

[0012] As a preferred solution: the PacoPads are made of a polymer material with a high elastic modulus, and the polymer material is polyimide, polyetheretherketone or polytetrafluoroethylene, so as to improve the impact resistance and chemical resistance of the circuit board.

[0013] As a preferred solution: the thickness of the silicone pad ranges from 0.1 mm to 2 mm, and a microporous structure is provided on the silicone pad to ensure the buffering effect and thermal management performance of the circuit board in different working environments.

[0014] As a preferred solution: the thermal conductivity of the thermal conductive material layer is at least 5 W / m·K, and the thermal conductive material layer is embedded in the insulating layer in the form of a thin film to improve the thermal management efficiency and uniformity of the circuit board when operating at high power.

[0015] As a preferred solution: the thermal conductive material layer is made of copper.

[0016] A method for manufacturing a multilayer circuit board comprises the following steps:

[0017] S1. Prepare the top and bottom layers, and use copper clad laminate to manufacture the top and bottom layers, where the copper foil layer will be etched into the required circuit pattern; ensure that the size, shape and material properties of the top and bottom layers meet the design specifications;

[0018] S2. Set up an insulating layer, select insulating materials, add reinforcing materials to the insulating materials, and accurately control the thickness of the insulating layer;

[0019] S3, forming a connector installation area and a wire connection area, designing and etching a connector installation area on the top layer for subsequent insertion of the connector; designing and etching a wire connection area on the bottom layer for connection with an external wire;

[0020] S4. Align and set the ground pads, design the top ground pad and the bottom ground pad, and ensure that they are precisely aligned in the vertical direction; the design of the ground pad needs to consider the electromagnetic compatibility and signal integrity of the circuit board;

[0021] S5. Forming a conductive through hole, forming at least one conductive through hole between the top ground pad and the bottom ground pad to achieve electrical connection between the layers; the wall of the conductive through hole is made of one or more materials selected from copper, gold or nickel; forming a conductive wall in the through hole by copper plating, gold plating or nickel plating;

[0022] S6. Configure a buffer structure between the top layer and the bottom layer, including PacoPads, silicone pads and thermal conductive material layers; the design of PacoPads and silicone pads should take into account their compression ratio and recovery rate during the lamination process; the selection of the thermal conductive material layer should be based on its high thermal conductivity;

[0023] S7, lamination process, stack the top layer, insulation layer, pattern layer and bottom layer according to the design requirements, and tightly combine them through the lamination process; during the lamination process, use PacoPads and silicone pads as buffer materials; control the temperature, pressure and time parameters of the lamination.

[0024] As a preferred solution: step S7 further includes the following steps:

[0025] S701, after the lamination process in step S7, a buffer spring and a support column are arranged between the top layer and the bottom layer;

[0026] S702, the buffer spring is made of a highly elastic metal alloy, such as stainless steel or nickel-titanium alloy;

[0027] S703, the support column is made of high-strength ceramic material, such as alumina or silicon carbide;

[0028] S704, the layout of the buffer spring and the support column is optimized by finite element analysis to ensure uniform distribution of stress when the circuit board is subjected to vibration or impact;

[0029] S705, the buffer springs are arranged at four corners and a center position between the top layer and the bottom layer;

[0030] S706. The support columns are distributed beside the connector installation area and the wire connection area.

[0031] As a preferred solution: Step S2 further includes the following steps:

[0032] S201, the thickness of the insulation layer ranges from 0.1mm to 2mm, which is adjusted according to performance requirements;

[0033] S202, use high-precision automated equipment to cut and laminate the insulation layer to ensure consistency and accuracy of thickness;

[0034] S203. Implement real-time monitoring and quality control during the manufacturing process to ensure that the thickness of the insulation layer meets the design specifications.

[0035] As a preferred solution: Step S6 further includes the following steps:

[0036] S601. Before selecting a silicone pad, determine the thickness requirement of the silicone pad based on the thermal cycle test result of the circuit board;

[0037] S602, select silicone pad materials with excellent heat resistance, chemical resistance and compression permanent deformation resistance;

[0038] S603. According to the results of the thermal cycle test, adjust the thickness of the silicone pad to ensure that it can maintain good buffering performance and thermal conductivity under extreme temperature changes;

[0039] S604, the silicone pad is provided with a microporous structure to enhance its buffering effect and heat conduction ability;

[0040] S605. After the multi-layer circuit board is assembled, the silicone pad is regularly tested for thermal cycling and thickness to ensure its long-term performance and reliability.

[0041] Compared with the prior art, the present invention has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical solution that by utilizing the coordinated work of PacoPads, silicone pads and thermal conductive material layers, the pressure generated by thermal expansion or mechanical impact can be effectively absorbed and dispersed, reducing the temperature difference and pressure concentration between layers, thereby improving the uniformity of board thickness and the mechanical stability of the circuit board. At the same time, the buffer springs made of highly elastic metal alloys and the support columns made of high-strength ceramic materials provide additional buffering force and structural stability, ensuring that the circuit board remains stable when subjected to external forces and avoiding damage to the middle part due to force. In addition, the circuit board also has excellent electrical performance, efficient thermal management, and excellent environmental adaptability. These characteristics combined enable the circuit board to exhibit excellent reliability and durability under various harsh working conditions.

[0042] In order to more clearly illustrate the structural features and effects of the present invention, it is described in detail below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 It is a schematic diagram of the structure of a multi-layer circuit board of the present invention;

[0044] Figure 2 The figure is a schematic diagram of the process flow of the multi-layer circuit board processing method of the present invention.

[0045] Description of the accompanying drawings:

[0046] 10. Top layer; 11. Connector mounting area; 20. Bottom layer; 21. Wire connection area; 211. Top layer grounding pad; 212. Bottom layer grounding pad; 30. Insulation layer; 40. Pattern layer; 50. Conductive vias; 60. PacoPads; 70. Silicone pads; 80. Thermal conductive material layer; 90. Springs; 100. Support columns. DETAILED DESCRIPTION

[0047] The present invention Figure 1 and Figure 2 As shown, a multi-layer circuit board with high-efficiency buffering performance and a processing method thereof, wherein:

[0048] The multilayer circuit board includes a top layer 10 and a bottom layer 20; an insulating layer 30 is provided between the top layer 10 and the bottom layer 20, and the insulating layer 30 is made of at least one polymer, ceramic, glass or silicon material, and contains reinforcing materials to improve mechanical strength and heat resistance; the top layer 10 is provided with a connector mounting area 11, and the bottom layer 20 is provided with a wire connection area 21, wherein the connector mounting area 11 is configured to be inserted into a connector; the wire connection area 21 includes a top layer grounding pad 211 and a bottom layer grounding pad 212, which are precisely aligned to ensure consistency of electrical connection; the top layer grounding pad 211 and the bottom layer grounding pad 212 are vertically interconnected through a conductive through hole 50;

[0049] At least one conductive through hole 50, the conductive through hole 50 extends from the top ground pad 211 to the bottom ground pad 212 and contacts the top ground pad 211 and the bottom ground pad 212, the conductive through hole 50 includes a conductive wall, the conductive wall is made of one or more materials selected from copper, gold or nickel, and the conductive wall is formed in the through hole by copper plating, gold plating or nickel plating to improve the conductivity and corrosion resistance;

[0050] The buffer structure is arranged between the top layer 10 and the bottom layer 20, and is used to buffer the temperature and pressure during the lamination process, reduce the temperature difference and pressure concentration between layers, improve the uniformity of the board thickness, and provide a buffer force when the circuit board is vibrated by external forces, so as to keep the circuit board stable and avoid damage to the middle part. The buffer structure includes PacoPads 60, silicone pads 70 and a thermal conductive material layer 80; the PacoPads 60 are evenly distributed between the insulating layers 30 to absorb the pressure generated by thermal expansion or mechanical shock; the silicone pads 70 cover the PacoPads 60 to provide additional buffering and stress dispersion; the thermal conductive material layer 80 is embedded in the insulating layer 30 and is adjacent to the silicone pads 70 to achieve rapid conduction of heat from the heat source to the heat dissipation area; the thermal conductive material layer 80 is made of copper. The precise position layout of each component in the buffer structure is intended to improve the mechanical stability and thermal management efficiency of the circuit board, and ensure the reliability and durability of the circuit board under various environmental conditions.

[0051] The buffer structure further includes at least one buffer spring 90 and a support column 100, wherein the buffer spring 90 is made of a metal alloy with high elasticity, and the support column 100 is made of a high-strength ceramic material to provide additional buffering force and structural stability; the buffer spring 90 is arranged at the four corners and the center position between the top layer 10 and the bottom layer 20, providing additional buffering at the edge and the center to achieve an all-round buffering effect; the support column 100 is distributed on the outside of the top layer 10 and the bottom layer 20, and is close to the connector mounting area 11 and the wire connection area 21; the support column 100 provides local support and resists deformation caused by mechanical pressure or thermal expansion; the PacoPads 60 absorbs and disperses the pressure generated by thermal expansion or mechanical impact; the silicone pad 70 covers the PacoPads 60, providing buffering and stress dispersion between the top layer 10 and the bottom layer 20; the thermal conductive material layer 80 is embedded in the insulating layer 30, adjacent to the silicone pad 70, to achieve rapid conduction of heat from the heat source to the heat dissipation area; the buffer spring 90, the support column 100 and the PacoPads The combined use of the silicone pad 70 and the thermal conductive material layer 80 provides a comprehensive buffering and thermal management solution to cope with the mechanical and thermal stresses of the circuit board under different environments and working conditions.

[0052] The PacoPads 60 is made of a polymer material with a high elastic modulus, such as polyimide, polyetheretherketone or polytetrafluoroethylene, to improve the impact resistance and chemical resistance of the circuit board.

[0053] The thickness of the silicone pad 70 ranges from 0.1 mm to 2 mm, and a microporous structure is provided on the silicone pad 70 to ensure the buffering effect and thermal management performance of the circuit board under different working environments.

[0054] The thermal conductivity of the thermal conductive material layer 80 is at least 5 W / m·K, and the thermal conductive material layer 80 is embedded in the insulating layer 30 in the form of a thin film to improve the thermal management efficiency and uniformity of the circuit board during high power operation.

[0055] The thickness of at least a portion of the insulating layer 30 is designed to be variable to meet the mechanical strength and thermal management requirements of different regions, and the variable thickness regions are achieved through a precisely controlled injection molding process.

[0056] A method for manufacturing a multilayer circuit board, comprising the following steps:

[0057] S1. Prepare the top layer 10 and the bottom layer 20, design and manufacture the top layer 10 and the bottom layer 20, which are usually made of copper clad laminates, in which the copper foil layer will be etched into the required circuit pattern; ensure that the size, shape and material properties of the top layer 10 and the bottom layer 20 meet the design specifications;

[0058] S2. Setting an insulating layer 30, selecting a suitable insulating material, such as polymer, ceramic, glass or silicon material, which should have good electrical insulation and mechanical properties; adding reinforcing materials, such as glass fiber or carbon fiber, to the insulating material to improve the mechanical strength and heat resistance of the insulating layer 30; accurately controlling the thickness of the insulating layer 30 to ensure the stability and performance of the circuit board;

[0059] Step S2 further comprises the following steps:

[0060] S201, the thickness of the insulating layer 30 ranges from 0.1 mm to 2 mm, and is adjusted according to different working conditions and performance requirements;

[0061] S202, using high-precision automated equipment to cut and laminate the insulating layer 30 to ensure consistency and accuracy of thickness;

[0062] S203 . Implement real-time monitoring and quality control during the manufacturing process to ensure that the thickness of the insulating layer 30 meets the design specifications.

[0063] S3, forming a connector installation area 11 and a wire connection area 21, designing and etching the connector installation area 11 on the top layer 10 for subsequent insertion of the connector; designing and etching the wire connection area 21 on the bottom layer 20 for connection with an external wire;

[0064] S4. Align and set the ground pads, design the top ground pad 211 and the bottom ground pad 212, and ensure that they are precisely aligned in the vertical direction; the design of the ground pads needs to consider the electromagnetic compatibility and signal integrity of the circuit board;

[0065] S5. Forming a conductive through hole 50. Forming at least one conductive through hole 50 between the top-layer grounding pad 211 and the bottom-layer grounding pad 212 to achieve electrical connection between layers. The wall of the conductive through hole 50 is made of one or more materials selected from copper, gold or nickel to improve the conductivity and corrosion resistance. The conductive wall is formed in the through hole by copper plating, gold plating or nickel plating.

[0066] S6. Configure a buffer structure, which includes PacoPads 60, silicone pads 70 and a thermal conductive material layer 80 between the top layer 10 and the bottom layer 20. The design of PacoPads 60 and silicone pads 70 should take into account their compression ratio and recovery rate during the lamination process to ensure long-term reliability. The thermal conductive material layer 80 should be selected based on its high thermal conductivity to effectively conduct and disperse heat and prevent hot spot concentration.

[0067] Step S6 further comprises the following steps:

[0068] S601, before selecting the silicone pad 70, determine the thickness requirement of the silicone pad 70 based on the thermal cycle test result of the circuit board;

[0069] S602, select the silicone pad 70 material with excellent heat resistance, chemical resistance and compression permanent deformation resistance;

[0070] S603, according to the thermal cycle test results, adjusting the thickness of the silicone pad 70 to ensure that good buffering performance and thermal conductivity can be maintained under extreme temperature changes;

[0071] S604, the silica gel pad 70 is provided with a microporous structure to enhance its buffering effect and heat conduction capability;

[0072] S605: After the multi-layer circuit board is assembled, the silicone pad 70 is regularly subjected to thermal cycle testing and thickness inspection to ensure its long-term performance and reliability.

[0073] S7, lamination process, stack the top layer 10, the insulating layer 30, the pattern layer 40 and the bottom layer 20 according to the design requirements, and tightly combine them through the lamination process; during the lamination process, use PacoPads60 and silicone pads 70 as buffer materials to improve the uniformity of the board thickness and reduce the interlayer stress; control the temperature, pressure and time parameters of the lamination to ensure uniform bonding of the circuit layer and the insulating layer 30 to avoid overheating or underpressure.

[0074] Step S7 further comprises the following steps:

[0075] S701, after the lamination process of step S7, a buffer spring 90 and a support column 100 are arranged between the top layer 10 and the bottom layer 20;

[0076] S702, the buffer spring 90 is made of a highly elastic metal alloy, such as stainless steel or nickel-titanium alloy, to provide long-lasting elasticity and corrosion resistance;

[0077] S703, the support column 100 is made of high-strength ceramic material, such as alumina or silicon carbide, to provide excellent wear resistance and thermal stability;

[0078] S704, the layout of the buffer spring 90 and the support column 100 is optimized by finite element analysis to ensure that stress is evenly distributed when the circuit board is subjected to vibration or impact;

[0079] S705, the buffer springs 90 are arranged at four corners and a central position between the top layer 10 and the bottom layer 20 to achieve an all-round buffering effect;

[0080] S706. The support columns 100 are distributed in key areas of the circuit board, such as near the connector mounting area 11 and the wire connection area 21, to provide additional local support.

[0081] The design focus of the present invention is to effectively absorb and disperse the pressure caused by thermal expansion or mechanical impact by utilizing the coordinated work of PacoPads, silicone pads and thermal conductive material layers, reduce the temperature difference and pressure concentration between layers, and thus improve the uniformity of board thickness and the mechanical stability of the circuit board. At the same time, the buffer springs made of highly elastic metal alloys and the support columns of high-strength ceramic materials provide additional buffering force and structural stability, ensuring that the circuit board remains stable when subjected to external forces and avoiding damage to the middle part due to force. In addition, the circuit board also has excellent electrical performance, efficient thermal management, and excellent environmental adaptability. These characteristics combined enable the circuit board to exhibit excellent reliability and durability under various harsh working conditions.

[0082] The above description is only a preferred embodiment of the present invention and does not limit the technical scope of the present invention. Therefore, any slight modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A multi-layer circuit board with high efficiency buffering performance, characterized in that: Included A top layer and a bottom layer; an insulating layer is provided between the top layer and the bottom layer; the top layer is provided with a connector mounting area, and the bottom layer is provided with a wire connection area, wherein the connector mounting area is configured to be inserted into a connector; the wire connection area includes a top layer grounding pad and a bottom layer grounding pad, which are precisely aligned to ensure consistency of electrical connection; the top layer grounding pad and the bottom layer grounding pad are vertically interconnected through conductive through holes; at least one conductive via extending from a top-layer grounding pad to a bottom-layer grounding pad and contacting the top-layer grounding pad and the bottom-layer grounding pad, the conductive via comprising a conductive wall; The buffer structure is used to buffer the temperature and pressure during the lamination process, reduce the temperature difference and pressure concentration between layers, improve the uniformity of the board thickness, and provide a buffer force when the circuit board is vibrated by external forces, so as to keep the circuit board stable and avoid damage to the middle part due to force; the buffer structure is arranged between the top layer and the bottom layer, and includes PacoPads, a silicone pad and a thermal conductive material layer; The PacoPads are evenly distributed in the insulating layer to absorb the pressure caused by thermal expansion or mechanical impact; the silicone pad covers the PacoPads to provide additional buffering and stress dispersion; the thermal conductive material layer is adjacent to the silicone pad to achieve rapid conduction of heat from the heat source to the heat dissipation area.

2. The multilayer circuit board according to claim 1, characterized in that: The buffer structure further includes at least one buffer spring and a support column, wherein the buffer spring is made of a metal alloy with high elasticity, and the support column is made of a high-strength ceramic material to provide additional buffering force and structural stability; the buffer spring is arranged at four corners and a center position between the top layer and the bottom layer to provide additional buffering at the edge and the center; The support column is located outside the top layer and the bottom layer and close to the connector mounting area and the wire connection area to provide local support and resist deformation caused by mechanical pressure or thermal expansion; The absorption and dispersion of pressure due to thermal expansion or mechanical impact; The silicone pad covers the PacoPads to provide buffering and stress dispersion between the top layer and the bottom layer; the thermal conductive material layer is embedded in the insulating layer and is adjacent to the silicone pad to achieve rapid conduction of heat from the heat source to the heat dissipation area.

3. The multi-layer circuit board according to claim 1, characterized in that: The PacoPads are made of a polymer material with a high elastic modulus, such as polyimide, polyetheretherketone or polytetrafluoroethylene, to improve the impact resistance and chemical resistance of the circuit board.

4. The multi-layer circuit board according to claim 1, characterized in that: The thickness of the silicone pad ranges from 0.1 mm to 2 mm, and a microporous structure is provided on the silicone pad to ensure the buffering effect and thermal management performance of the circuit board under different working environments.

5. The multi-layer circuit board according to claim 1, characterized in that: The thermal conductivity of the thermal conductive material layer is at least 5 W / m·K, and the thermal conductive material layer is embedded in the insulating layer in the form of a thin film to improve the thermal management efficiency and uniformity of the circuit board during high power operation.

6. The multi-layer circuit board according to claim 1, characterized in that: The thermal conductive material layer is made of copper.

7. A method for processing a multilayer circuit board according to any one of claims 1 to 6, characterized in that: The following steps are involved: S1. Prepare the top layer and the bottom layer, and use copper clad laminate to manufacture the top layer and the bottom layer, wherein the copper foil layer will be etched into the required circuit pattern; Ensure that the size, shape, and material properties of the top and bottom layers meet design specifications; S2. Setting an insulating layer, selecting insulating materials, and adding reinforcing materials to the insulating materials; Precisely control the thickness of the insulation layer; S3, forming a connector installation area and a wire connection area, designing and etching a connector installation area on the top layer for subsequent insertion of the connector; designing and etching a wire connection area on the bottom layer for connection with an external wire; S4. Align and set the ground pads, design the top ground pad and the bottom ground pad, and ensure that they are precisely aligned in the vertical direction; the design of the ground pad needs to consider the electromagnetic compatibility and signal integrity of the circuit board; S5, forming a conductive through hole, forming at least one conductive through hole between the top ground pad and the bottom ground pad to achieve electrical connection between the layers; forming a conductive wall in the conductive through hole by copper plating, gold plating or nickel plating; S6. Configure a buffer structure between the top layer and the bottom layer, including PacoPads, silicone pads and thermal conductive material layers; the design of PacoPads and silicone pads should take into account their compression ratio and recovery rate during the lamination process; the selection of the thermal conductive material layer should be based on its high thermal conductivity; S7, lamination process, stack the top layer, insulation layer, pattern layer and bottom layer according to the design requirements, and tightly combine them through the lamination process; during the lamination process, use PacoPads and silicone pads as buffer materials; control the temperature, pressure and time parameters of the lamination.

8. The processing method according to claim 7, characterized in that: Step S7 further comprises the following steps: S701, after the lamination process in step S7, a buffer spring and a support column are arranged between the top layer and the bottom layer; S702, the buffer spring is made of a highly elastic metal alloy; S703, the support column is made of high-strength ceramic material, such as alumina or silicon carbide; S704, arranging the buffer springs and support columns to ensure that stress is evenly distributed when the circuit board is subjected to vibration or impact; S705, the buffer springs are arranged at four corners and a center position between the top layer and the bottom layer; S706. The support columns are distributed beside the connector installation area and the wire connection area.

9. The processing method according to claim 7, characterized in that: Step S2 further comprises the following steps: S201, the thickness of the insulation layer ranges from 0.1mm to 2mm, which is adjusted according to performance requirements; S202, use high-precision automated equipment to cut and laminate the insulation layer to ensure consistency and accuracy of thickness; S203. Implement real-time monitoring and quality control during the manufacturing process to ensure that the thickness of the insulation layer meets the design specifications.

10. The processing method according to claim 7, characterized in that: Step S6 further comprises the following steps: S601. Before selecting a silicone pad, determine the thickness requirement of the silicone pad based on the thermal cycle test result of the circuit board; S602, select silicone pad material; S603. According to the results of the thermal cycle test, adjust the thickness of the silicone pad to ensure that it can maintain good buffering performance and thermal conductivity under extreme temperature changes; S604. After the multi-layer circuit board is assembled, the silicone pads are regularly tested for thermal cycling and thickness to ensure their long-term performance and reliability.

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