Circuit board structure and manufacturing method thereof
By adopting embedded passive elements including spiral metal layer and dielectric interlayer in the circuit board, the problem of providing high-density passive elements in a limited space is solved, and the effect of improving the structural density of the circuit board and reducing the volume is achieved.
Patent Information
- Application Number
- CN202311157194.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-09-08
- Publication Date
- 2025-03-11
AI Technical Summary
In circuit board design, how to provide high-density passive components, especially capacitors and inductors, in a limited space, to meet the needs of high-functional, high-speed signal transmission and high-density circuit components.
An embedded passive element is adopted that includes two spiral metal layers and a dielectric interlayer, which is electrically connected to the line layer, which is between the spiral metal layers, and the dielectric constant of the dielectric material of the dielectric interlayer is greater than that of the dielectric material of the line layer.
It is realized that the passive element density is increased in a limited space, so that the circuit board structure has more volume and surface area can be used for wiring, and is conducive to reducing the volume of the circuit board structure.
Smart Images
Figure CN119603862A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a circuit board structure, and in particular to a circuit board structure with embedded passive components. Background Art
[0002] As the demand for electronic products moves toward higher functionality, faster signal transmission, and higher density of circuit components, the functions of integrated circuit chips are becoming more powerful, and the number of passive components used in consumer electronic products is also increasing rapidly.
[0003] In circuit board design, capacitors and inductors are necessary for impedance matching. As circuit boards become smaller and thinner, the density of circuit components increases. How to provide capacitors and inductors in a limited space is a problem that needs to be solved in this technical field. Summary of the invention
[0004] In view of the above problems, the present invention provides a circuit board structure, which helps to solve the problem of providing high-density passive components in a limited space. The present invention also provides a method for manufacturing the circuit board structure.
[0005] The circuit board structure disclosed in the present invention includes a core board, a circuit layer and an embedded passive component. The circuit layer and the embedded passive component are arranged on the core board, and the embedded passive component is electrically connected to the circuit layer. The embedded passive component includes a first spiral metal layer, a second spiral metal layer and a dielectric interlayer. The first spiral metal layer and the second spiral metal layer are interwoven with each other. The dielectric interlayer is between the first spiral metal layer and the second spiral metal layer. The first spiral metal layer and the second spiral metal layer are separated by the dielectric interlayer at least in the core board.
[0006] In the aforementioned circuit board structure, the dielectric interlayer may be in a spiral shape.
[0007] In the aforementioned circuit board structure, the first spiral metal layer and the second spiral metal layer may extend along the thickness direction of the core board and penetrate the core board.
[0008] In the aforementioned circuit board structure, the dielectric interlayer may include a connected interlayer portion, a first dielectric column, and a second dielectric column. The interlayer portion is between the first spiral metal layer and the second spiral metal layer. The first dielectric column and the second dielectric column extend along the thickness direction of the core board and penetrate the core board. The first dielectric column is located on one side of the first spiral metal layer and the second spiral metal layer, and the second dielectric column is located on the other side opposite to the first spiral metal layer and the second spiral metal layer.
[0009] In the aforementioned circuit board structure, the circuit layer may include a circuit and a dielectric layer. The dielectric layer is disposed on the core board. The circuit is located in the dielectric layer, and the circuit is electrically connected to the first spiral metal layer or the second spiral metal layer. The dielectric material of the dielectric interlayer may have a dielectric constant greater than the dielectric constant of the dielectric material of the dielectric layer, but is not limited thereto.
[0010] In the aforementioned circuit board structure, the embedded passive component may further include a magnetic component disposed in the core board, the magnetic component is spaced apart from the first spiral metal layer, the second spiral metal layer and the dielectric interlayer, and the first spiral metal layer and the second spiral metal layer surround the magnetic component.
[0011] In the aforementioned circuit board structure, the embedded passive component may further include a conductive via disposed in the core board. The first spiral metal layer and the second spiral metal layer surround the conductive via, and the conductive via is electrically connected to the second spiral metal layer via the circuit layer.
[0012] In the aforementioned circuit board structure, the second spiral metal layer may include an outer circle and an inner circle that are connected, and the conductive via is electrically connected to the inner circle.
[0013] In the aforementioned circuit board structure, the first spiral metal layer and the second spiral metal layer can each be an inductor.
[0014] In the aforementioned circuit board structure, the first spiral metal layer, the second spiral metal layer and the dielectric interlayer can form a capacitor together.
[0015] The present invention further discloses a method for manufacturing a circuit board structure, which includes the following steps: forming a spiral groove in a core board; forming a metal layer, including a sidewall portion located on the sidewall of the spiral groove and a base portion located on the bottom surface of the spiral groove; removing a portion of the sidewall portion; forming a dielectric interlayer in contact with the metal layer in the spiral groove; removing the base portion, and forming a first spiral metal layer and a second spiral metal layer with a portion of the sidewall portion remaining on the sidewall of the spiral groove; and forming an electrical connection between the circuit layer and at least one of the first spiral metal layer and the second spiral metal layer.
[0016] In the aforementioned manufacturing method, the step of removing a portion of the side wall portion may include removing a portion of the core plate and a portion of the side wall portion to form a through hole communicating with the spiral groove.
[0017] In the aforementioned manufacturing method, the step of forming a dielectric interlayer in the spiral groove may include filling a dielectric material in the spiral groove and in the through hole to form the dielectric interlayer.
[0018] In the aforementioned manufacturing method, the step of removing the base portion may include thinning the core plate by grinding and removing the base portion.
[0019] In the aforementioned manufacturing method, the metal layer may further include a top portion formed on the surface of the core substrate.
[0020] In the aforementioned manufacturing method, the method may further include removing a top portion of the metal layer, wherein the top portion is connected to the sidewall portion.
[0021] In the aforementioned manufacturing method, it may further include forming a dielectric layer on the surface of the core board, and the circuit layer is located in the dielectric layer.
[0022] In the aforementioned manufacturing method, the dielectric material of the dielectric interlayer may have a dielectric constant greater than the dielectric constant of the dielectric material of the dielectric layer, but is not limited thereto.
[0023] According to the circuit board structure and manufacturing method disclosed in the present invention, the embedded passive component including two spiral metal layers and a dielectric interlayer has the functions of both an inductor and a capacitor, which helps to increase the passive component density of the circuit board structure, so that the circuit board structure has more volume and surface area available for wiring, and is also conducive to reducing the volume of the circuit board structure.
[0024] The above description of the content of the present invention and the following description of the implementation modes are used to demonstrate and explain the principles of the present invention and provide a further explanation of the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1 FIG. 4 is a schematic diagram of a circuit board structure according to an embodiment of the present invention.
[0026] Figure 2 for Figure 1 Schematic diagram of the top view of the core board and embedded passive components in the circuit board structure.
[0027] Figures 3 to 12 For manufacturing Figure 1 Schematic diagram of the circuit board structure.
[0028] Fig.13 FIG. 4 is a schematic diagram of a circuit board structure according to another embodiment of the present invention.
[0029] Fig.14 for Fig.13 Schematic diagram of the top view of the core board and embedded passive components in the circuit board structure.
[0030] Fig.15 FIG. 4 is a schematic diagram of a circuit board structure according to another embodiment of the present invention.
[0031] Fig.16 for Fig.15 Schematic diagram of the top view of the core board and embedded passive components in the circuit board structure. DETAILED DESCRIPTION
[0032] The detailed features and advantages of the present invention are described in detail in the following embodiments, and the contents are sufficient to enable any person skilled in the art to understand the technical content of the present invention and implement it accordingly, and any person skilled in the art can easily understand the present invention according to the contents, claims and drawings disclosed in this specification. The following examples further illustrate the viewpoints of the present invention in detail, but are not intended to limit the scope of the present invention in any viewpoint.
[0033] Please refer to Figure 1 and Figure 2 ,in Figure 1 is a schematic diagram of a circuit board structure according to an embodiment of the present invention, and Figure 2 for Figure 1 FIG. 1 is a top view of a core board and embedded passive components in a circuit board structure. In this embodiment, the circuit board structure 1 includes a core board 10, a circuit layer 20, and embedded passive components 30. The core board 10 may be, for example, an electrically insulating substrate made of glass fiber and epoxy resin.
[0034] The circuit layer 20 is disposed on the surface of the core board 10 . Figure 1 The circuit layers 20 are respectively arranged on the two opposite surfaces of the core board 10, but the number of circuit layers is not intended to limit the present invention. Each circuit layer 20 may include a dielectric layer 210, a circuit 220, a conductive blind hole 230 and an electrode contact 240. The dielectric layer 210 may be a dielectric layer made of a composite material of bakelite, glass fiber, epoxy resin, polyimide or other organic polymer materials and filler materials (Filler). The circuit 220 and the conductive blind hole 230 are arranged in the dielectric layer 210 and are electrically connected to each other. The electrode contact 240 is exposed outside the dielectric layer 210. For the convenience of explanation, the circuit layer 20 above the core board 10 can be interpreted as the upper circuit layer 20a, and the circuit layer 20 below the core board 10 can be interpreted as the lower circuit layer 20b. The structure of the circuit layer 20 provided in this embodiment is only an example, and the present invention is not limited thereto. In some other embodiments, the circuit layer may include conductive through holes and additional circuits connected thereto.
[0035] The embedded passive component 30 is disposed in the core board 10 and is electrically connected to the circuit layer 20. Specifically, the embedded passive component 30 includes a first spiral metal layer 310, a second spiral metal layer 320, and a dielectric interlayer 330. The first spiral metal layer 310 and the second spiral metal layer 320 can each extend along the thickness direction T of the core board 10 and penetrate the core board 10. The dielectric interlayer 330 is disposed between the first spiral metal layer 310 and the second spiral metal layer 320 and can be formed into a spiral shape, and the first spiral metal layer 310 and the second spiral metal layer 320 are separated by the dielectric interlayer 330 at least in the core board 10. The dielectric constant of the dielectric material of the dielectric interlayer 330 can be greater than the dielectric constant of the dielectric material of the dielectric layer 210 of the circuit layer 20, for example, the dielectric interlayer 330 can be formed of an epoxy resin-ceramic composite material with a high dielectric constant.
[0036] The term “spiral metal layer” herein may be understood to refer to a planar spiral coil rather than a helix coil. The planar spiral coil has a thickness defined along a thickness direction T, wherein the thickness of the planar spiral coil may be equal to the thickness of the core plate 10 .
[0037] The first spiral metal layer 310 and the second spiral metal layer 320 may be intertwined. Figure 1 and Figure 2 As shown, the first spiral metal layer 310 includes an outer ring 311 and an inner ring 312 that are connected and both pass through the core plate 10. The first spiral metal layer 310 extends around the reference axis A, and the distance between the first spiral metal layer 310 and the reference axis A decreases continuously or in stages from the outer ring 311 to the inner ring 312. The second spiral metal layer 320 includes an outer ring 321 and an inner ring 322 that are connected and both pass through the core plate 10. The second spiral metal layer 320 extends around the reference axis A, and the distance between the second spiral metal layer 320 and the reference axis A decreases continuously or in stages from the outer ring 321 to the inner ring 322. In the present embodiment, each spiral metal layer can be a coil with at least two turns, wherein the outermost turn can be understood as the outer turn mentioned above, and the innermost turn can be understood as the inner turn mentioned above.
[0038] In addition, the second spiral metal layer 320 extends through the opening between the outer circle 311 and the inner circle 312 of the first spiral metal layer 310, so as to be at least partially surrounded by the first spiral metal layer 310. In the radial direction R of the core plate 10 substantially orthogonal to the thickness direction T, the spacing distance G between the first spiral metal layer 310 and the second spiral metal layer 320 can be maintained constant.
[0039] Figure 2The specific shapes of the first spiral metal layer 310 and the second spiral metal layer 320 of the present embodiment are both square spirals, but the present invention is not limited thereto. In some embodiments, the shape of the spiral metal layer can be a circular spiral, a hexagonal spiral, or an octagonal spiral. The specific shapes of the first spiral metal layer 310 and the second spiral metal layer 320 can be the same or different from each other.
[0040] The dielectric interlayer 330 may include an interlayer portion 331, a dielectric column 332, and a dielectric column 333 connected to each other. The interlayer portion 331 is between the first spiral metal layer 310 and the second spiral metal layer 320 in the radial direction R. The interlayer portion 331, the dielectric column 332, and the dielectric column 333 extend along the thickness direction T of the core plate 10 and penetrate the core plate 10. The dielectric column 332 is located on one side of the first spiral metal layer 310 and the second spiral metal layer 320. Further, the dielectric column 332 contacts the side edge of the inner circle 312 of the first spiral metal layer 310 and the side edge of the inner circle 322 of the second spiral metal layer 320. The dielectric column 333 is located on the other side opposite to the first spiral metal layer 310 and the second spiral metal layer 320. Specifically, the dielectric pillar 333 contacts the side edge of the outer circle 311 of the first spiral metal layer 310 and the side edge of the outer circle 321 of the second spiral metal layer 320 .
[0041] Figure 2 The dielectric interlayer 330 of this embodiment is exemplarily shown to include two dielectric pillars 332 and 333, but the present invention is not limited thereto. In some embodiments, the dielectric interlayer may only include dielectric pillars contacting the inner circle of the spiral metal layer or dielectric pillars contacting the outer circle of the spiral metal layer.
[0042] The circuit 220 of the circuit layer 20 may be electrically connected to the first spiral metal layer 310 or the second spiral metal layer 320. Figure 1 As shown, one of the circuits 220 of the upper circuit layer 20a is electrically connected to the outer circle 311 of the first spiral metal layer 310, and the other circuit 220 is electrically connected to the outer circle 321 of the second spiral metal layer 320. One of the circuits 220 of the lower circuit layer 20b is electrically connected to the inner circle 312 of the first spiral metal layer 310, and the other circuit 220 is electrically connected to the inner circle 322 of the second spiral metal layer 320.
[0043] The current can pass through the first spiral metal layer 310 and one of the circuits 220 of the lower circuit layer 20b in sequence through one of the circuits 220 of the upper circuit layer 20a, and can pass through the second spiral metal layer 320 and another circuit 220 of the lower circuit layer 20b in sequence through another circuit 220 of the upper circuit layer 20a. In this way, the first spiral metal layer 310 and the second spiral metal layer 320 can each serve as an inductor. In addition, the first spiral metal layer 310, the second spiral metal layer 320 and the dielectric interlayer 330 can be formed together as a capacitor. It can be a MIM (Metal-insulator-metal) capacitor.
[0044] An exemplary method of manufacturing wiring board structure 1 is described below. Figures 3 to 12 For manufacturing Figure 1 Schematic diagram of the circuit board structure. Figure 3 As shown, a core board 10 is provided. The outer surface of the core board 10 may be selectively coated with a metal coating, for example, the outer surface of the core board 10 may be coated with a copper foil. Figure 3 The core board 10 is shown as an example in which the outer surface thereof is not coated.
[0045] like Figure 4 and Figure 5 As shown, a spiral groove 100 is formed in the core plate 10. Figure 5 for Figure 4 The spiral groove 100 extends from the upper surface of the core board 10 toward the lower surface but does not penetrate the core board 10. The spiral groove 100 can be formed by, for example, a photolithography process and / or a dry etching process.
[0046] like Figure 6 As shown, a metal layer 40 is formed in the spiral groove 100. Specifically, the metal layer 40 may include a sidewall portion 410 located on the sidewall of the spiral groove 100, a base portion 420 located on the bottom surface of the spiral groove 100, and a top portion 430 located on the upper surface of the core board 10. The top portion 430 and the base portion 420 are connected to the sidewall portion 410. The formation of the metal layer 40 may be implemented, for example, by physical vapor deposition (PVD), chemical vapor deposition (CVD), sputtering and / or chemical plating and / or electroplating.
[0047] like Figure 7 and Figure 8 As shown, part of the side wall portion 410 is removed. Figure 8 for Figure 7 A schematic cross-sectional view of the structure along line 8-8. Part of the core plate 10 and part of the side wall portion 410 can be removed at opposite ends of the spiral groove 100 to form a through hole 101 connected to the spiral groove 100. Figure 7In the embodiment, since the sidewall portions 410 at both ends of the spiral groove 100 are removed, the metal layer 40 located in the spiral groove 100 can be formed into a structure in which two sidewall portions 410 are separated by the base portion 420. The formation of the through hole 101 can be implemented, for example, by mechanical drilling or laser drilling to simultaneously remove part of the core plate 10 and part of the sidewall portion 410.
[0048] like Fig. 9 and Fig.10 As shown, a dielectric interlayer 330 is formed in the spiral groove 100 and contacts the metal layer 40. Fig.10 for Fig. 9 A top view of the structure of FIG. 1 is a top view of the structure of FIG. 1. A dielectric material is filled in the spiral groove 100 and in the through hole 101 and solidified to form the interlayer portion 331 and dielectric pillars 332 and 333 of the dielectric interlayer 330. The filling of the dielectric material can be implemented, for example, by physical vapor deposition, inkjet printing, or vacuum lamination. In addition, the solidification of the dielectric material can be implemented, for example, by a baking process, and after baking, the excess dielectric material not filled in the spiral groove 100 and the through hole 101 can be removed by a grinding process.
[0049] like Fig.11 As shown, the base 420 of the metal layer 40 is removed to form a first spiral metal layer 310 and a second spiral metal layer 320. Further, by grinding and thinning the core board 10 and removing the base 420, for example, by chemical mechanical polishing (CMP) from the lower surface of the core board 10, the base 420 and a portion of the core board 10 are removed. In addition, the top 430 of the metal layer 40 is removed, for example, by chemical mechanical polishing from the top 430 located on the upper surface of the core board 10 to remove the top 430 and a portion of the dielectric interlayer 330. Thereby, the sidewall portion 410 remaining on the sidewall of the spiral groove 100 is formed into the first spiral metal layer 310 and the second spiral metal layer 320. The above two grinding operations can be performed simultaneously or sequentially. Fig.11 In the embodiment, the first spiral metal layer 310 and the second spiral metal layer 320 are separated by the dielectric interlayer 330 and are not connected to each other.
[0050] like Fig.12As shown, the circuit layer 20 is formed to be electrically connected to at least one of the first spiral metal layer 310 and the second spiral metal layer 320. Further, the dielectric layer 210 is formed on the upper and lower sides of the core board 10, and then the circuit 220 and the conductive blind hole 230 are formed in each dielectric layer 210, so as to form the upper circuit layer 20a and the lower circuit layer 20b. The two circuits 220 of the upper circuit layer 20a are electrically connected to the first spiral metal layer 310 and the second spiral metal layer 320, respectively. The two circuits 220 of the lower circuit layer 20b are electrically connected to the first spiral metal layer 310 and the second spiral metal layer 320, respectively. The formation of the dielectric layer 210 can be implemented, for example, by physical vapor deposition or vacuum pressing or wet coating. The formation of the circuit 220 and the conductive blind hole 230 can be implemented, for example, by photolithography, laser drilling and / or plating. The plating process can be a chemical plating process or an electroplating process.
[0051] According to the circuit board structure 1 disclosed in this embodiment, the embedded passive component 30 including the first spiral metal layer 310, the second spiral metal layer 320 and the dielectric interlayer 330 has the functions of both an inductor and a capacitor, which helps to increase the passive component density of the circuit board structure 1, so that the circuit board structure 1 has more volume and surface area available for wiring, and is also beneficial to reducing the volume of the circuit board structure 1.
[0052] The circuit board structure disclosed in the present invention may include magnetic components. Fig.13 and Fig.14 ,in Fig.13 is a schematic diagram of a circuit board structure according to another embodiment of the present invention, and Fig.14 for Fig.13 Schematic diagram of the core board and embedded passive components in the circuit board structure of FIG. In this embodiment, the circuit board structure 1A includes a core board 10, a circuit layer 20, and an embedded passive component 30A. The core board 10 and the circuit layer 20 of the circuit board structure 1A are respectively the same or similar to Figure 1 The core board 10 and the circuit layer 20 of the circuit board structure 1, so their further description can refer to the aforementioned content related to the circuit board structure 1, and will not be repeated below.
[0053] The embedded passive component 30A includes a first spiral metal layer 310, a second spiral metal layer 320, a dielectric interlayer 330 and a magnetic component 340. The first spiral metal layer 310, the second spiral metal layer 320 and the dielectric interlayer 330 can be further described with reference to the aforementioned contents related to the circuit board structure 1, which will not be repeated here.
[0054] The magnetic member 340 is, for example, iron oxide, and is disposed in the core plate 10. Specifically, the magnetic member 340 is spaced apart from the first spiral metal layer 310, the second spiral metal layer 320, and the dielectric interlayer 330. The first spiral metal layer 310 and the second spiral metal layer 320 surround the magnetic member 340, so that the magnetic member 340 is conducive to enhancing the effect of the first spiral metal layer 310 and the second spiral metal layer 320 as an inductor. Fig.13 and Fig.14 The core plate 10 is rectangular and exposed on the upper and lower surfaces of the core plate 10 , but its shape, Z-axis position and thickness are not limited.
[0055] The circuit board structure disclosed in the present invention may include conductive through holes. Fig.15 and Fig.16 ,in Fig.15 is a schematic diagram of a circuit board structure according to another embodiment of the present invention, and Fig.16 for Fig.15 Schematic diagram of the core board and embedded passive components in the circuit board structure of FIG. In this embodiment, the circuit board structure 1B includes a core board 10, a circuit layer 20, and an embedded passive component 30B. The core board 10 and the circuit layer 20 of the circuit board structure 1B are respectively the same or similar to Figure 1 The core board 10 and the circuit layer 20 of the circuit board structure 1, so their further description can refer to the aforementioned content related to the circuit board structure 1, and will not be repeated below.
[0056] The embedded passive component 30B includes a first spiral metal layer 310, a second spiral metal layer 320, a dielectric interlayer 330 and a conductive via 350. The first spiral metal layer 310, the second spiral metal layer 320 and the dielectric interlayer 330 can be further described with reference to the aforementioned contents related to the circuit board structure 1, which will not be repeated below.
[0057] The conductive via 350 is disposed in the core board 10. Specifically, the conductive via 350 is, for example, a through hole formed in the core board 10 and having a metal coating on the side wall. The first spiral metal layer 310 and the second spiral metal layer 320 surround the conductive via 350, and the conductive via 350 is electrically connected to the circuit layer 20 and the second spiral metal layer 320. Specifically, one end of the conductive via 350 is electrically connected to the inner circle 322 of the second spiral metal layer 320 via the circuit 220 of the upper circuit layer 20a, and the other end of the conductive via 350 is electrically connected to the inner circle 322 of the second spiral metal layer 320 via the circuit 220 of the lower circuit layer 20b. The conductive via 350 is beneficial for filtering noise through the inductance structure when the signal is transmitted up and down in the via, thereby achieving a better signal transmission effect.
[0058] In summary, according to the circuit board structure and manufacturing method disclosed in the present invention, the embedded passive component including two spiral metal layers and a dielectric interlayer has the functions of both an inductor and a capacitor, which helps to increase the passive component density of the circuit board structure, so that the circuit board structure has more volume and surface area available for wiring, and is also conducive to reducing the volume of the circuit board structure.
[0059]
Explanation of symbols
[0060] 1. 1A, 1B: Circuit board structure
[0061] 10: Core board
[0062] 20: Circuit layer
[0063] 20a: Upper circuit layer
[0064] 20b: Lower circuit layer
[0065] 210: Dielectric layer
[0066] 220: Line
[0067] 230: Conductive blind via
[0068] 240: Electrode contact
[0069] 30, 30A, 30B: Embedded passive components
[0070] 310: First spiral metal layer
[0071] 311: Outer ring
[0072] 312: Inner Circle
[0073] 320: Second spiral metal layer
[0074] 321: Outer ring
[0075] 322: Inner Circle
[0076] 330: Dielectric interlayer
[0077] 331: Mezzanine
[0078] 332, 333: Dielectric pillars
[0079] 340: Magnetic parts
[0080] 350: Conductive vias
[0081] 100: Spiral groove
[0082] 101: Through hole
[0083] 40: Metal layer
[0084] 410: Side wall
[0085] 420: Base
[0086] 430: Top
[0087] A: Reference axis
[0088] G: Interval distance
[0089] R: Radial direction
[0090] T: thickness direction.
Claims
1. A circuit board structure, characterized in that: Include: Core board; A circuit layer is disposed on the core board; and The embedded passive component is disposed in the core board and electrically connected to the circuit layer, and the embedded passive component includes: a first spiral metal layer; a second spiral metal layer interlaced with the first spiral metal layer; and The dielectric interlayer is between the first spiral metal layer and the second spiral metal layer. The first spiral metal layer and the second spiral metal layer are separated by the dielectric interlayer at least in the core board.
2. The circuit board structure according to claim 1, wherein the dielectric interlayer is spiral-shaped. 3 . The circuit board structure according to claim 1 , wherein the first spiral metal layer and the second spiral metal layer extend along the thickness direction of the core board and penetrate the core board. 4 . The circuit board structure according to claim 1 , wherein the first spiral metal layer and the second spiral metal layer are each an inductor. 5 . The circuit board structure according to claim 1 , wherein the first spiral metal layer, the second spiral metal layer and the dielectric interlayer together form a capacitor.
6. The circuit board structure according to claim 1, wherein the dielectric interlayer comprises a connected interlayer portion, a first dielectric column and a second dielectric column, the interlayer portion is between the first spiral metal layer and the second spiral metal layer, the first dielectric column and the second dielectric column extend along the thickness direction of the core board and penetrate the core board, the first dielectric column is located on one side of the first spiral metal layer and the second spiral metal layer, and the second dielectric column is located on the other side opposite to the first spiral metal layer and the second spiral metal layer.
7. The circuit board structure according to claim 1, wherein the circuit layer comprises a circuit and a dielectric layer, the dielectric layer is disposed on the core board, the circuit is located in the dielectric layer, the circuit is electrically connected to the first spiral metal layer or the second spiral metal layer, and the dielectric constant of the material of the dielectric interlayer is greater than the dielectric constant of the material of the dielectric layer.
8. The circuit board structure according to claim 1, wherein the embedded passive component further includes a magnetic component disposed in the core board, the magnetic component is separated from the first spiral metal layer, the second spiral metal layer and the dielectric interlayer, and the first spiral metal layer and the second spiral metal layer surround the magnetic component.
9. The circuit board structure according to claim 1, wherein the embedded passive component further includes a conductive through hole arranged in the core board, the first spiral metal layer and the second spiral metal layer surround the conductive through hole, and the conductive through hole is electrically connected to the second spiral metal layer through the circuit layer. 10 . The circuit board structure according to claim 9 , wherein the second spiral metal layer comprises an outer circle and an inner circle connected to each other, and the conductive via is electrically connected to the inner circle.
11. A method for manufacturing a circuit board structure, characterized in that: Include: Forming a spiral groove in the core plate; forming a metal layer, the metal layer comprising a sidewall portion located on the sidewall of the spiral groove and a base portion located on the bottom surface of the spiral groove; removing a portion of the side wall; forming a dielectric interlayer in contact with the metal layer in the spiral groove; The base portion is removed, and a portion of the sidewall portion remaining on the sidewall of the spiral groove forms a first spiral metal layer and a second spiral metal layer; as well as A circuit layer is formed to be electrically connected to at least one of the first spiral metal layer and the second spiral metal layer.
12. The method for manufacturing a circuit board structure according to claim 11, wherein the removing part of the side wall portion comprises: A portion of the core plate and a portion of the side wall are removed to form a through hole communicating with the spiral groove.
13. The method for manufacturing a circuit board structure according to claim 12, wherein the dielectric interlayer formed in the spiral groove and contacting the metal layer comprises: A dielectric material is filled in the spiral groove and the through hole to form the dielectric interlayer.
14. The method for manufacturing a circuit board structure according to claim 11, wherein removing the base portion comprises: The base portion and a portion of the core plate are removed by grinding. 15 . The method for manufacturing a circuit board structure according to claim 11 , wherein forming the metal layer further comprises forming a top portion on the surface of the core board, and the top portion is connected to the side wall portion.
16. The method for manufacturing a circuit board structure according to claim 15, wherein: Also includes: The top portion of the metal layer is removed.
17. The method for manufacturing a circuit board structure according to claim 11, wherein: Also includes: A dielectric layer is formed on the surface of the core board, and the circuit layer is located in the dielectric layer. 18 . The method for manufacturing a circuit board structure according to claim 17 , wherein a dielectric constant of a material of the dielectric interlayer is greater than a dielectric constant of a material of the dielectric layer.