Circuit board magnetic material landfill method

Abstract

The invention discloses a circuit board magnetic material filling method, which comprises the following steps that a substrate, an isolating membrane and a magnetic membrane are prepared, and the substrate comprises two first surfaces opposite to each other along the thickness direction of the substrate; isolating membranes are arranged on the two first surfaces, a through hole is formed in at least one isolating membrane through machining, a containing hole is formed in the substrate through machining, and the through hole communicates with the containing hole; arranging a magnetic film on the surface of the isolating film with the through hole, and enabling the magnetic film to cover the through hole; the magnetic film is subjected to hot pressing, so that the magnetic material forms a magnetic material in a molten state, and the molten magnetic material enters the containing hole through the through hole; and removing the isolating membrane to take away the residual magnetic material on the surface of the isolating membrane. In the embodiment, the magnetic material and the substrate are separated by the isolating membrane, the magnetic material can be prevented from overflowing to the surface of the substrate during hole filling, and after hole filling is completed, the isolating membrane is torn off to take away the residual magnetic material on the surface of the isolating membrane, so that the processing of the substrate is simpler.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board processing, and in particular to a method for embedding magnetic materials in a circuit board. Background Art

[0002] With the rapid development of electronic technology, especially the widespread application of wireless communication, Internet of Things and high-frequency electronic equipment, the performance requirements of electronic components are increasing day by day. In these applications, magnetic materials play a vital role in signal transmission, electromagnetic shielding, energy conversion and storage due to their unique electromagnetic properties. Especially in high-frequency, high-speed and highly integrated electronic systems, how to effectively use magnetic materials to improve circuit performance, reduce volume, reduce power consumption and cost has become a research hotspot in the current field of electronic engineering technology.

[0003] In some technologies, in order to improve the performance of the circuit board, the substrate is fully coated or covered with magnetic material, and then hot pressed to allow the magnetic material to enter the preset holes, thereby achieving the problem of filling the circuit board with magnetic material. However, this method has the problem of magnetic material overflowing to the surface of the substrate, making the substrate difficult to clean, resulting in difficulty in circuit board processing. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a method for pre-filling a circuit board with magnetic material, which can prevent the magnetic material from overflowing onto a substrate, thereby making the processing of the circuit board simpler.

[0005] According to the first aspect of the present invention, a method for embedding magnetic material in a circuit board includes the following steps:

[0006] Prepare materials: prepare a substrate, an isolation film and a magnetic film, wherein the substrate includes two first surfaces facing each other along its thickness direction;

[0007] Manufacturing a film-bearing substrate: arranging the isolation films on both of the first surfaces, processing and forming a through hole on at least one of the isolation films, processing and forming a receiving hole on the substrate, and making the through hole communicate with the receiving hole;

[0008] Arranging a magnetic film: arranging the magnetic film on the surface of the isolation film having the through hole, and making the magnetic film cover the through hole;

[0009] Filling the hole: hot pressing the magnetic film to form a molten magnetic material, and pressing the magnetic material into the receiving hole;

[0010] Film tearing: removing the isolation film to remove the magnetic material remaining on the surface of the isolation film.

[0011] The method for embedding magnetic materials in a circuit board according to an embodiment of the present invention has at least the following beneficial effects:

[0012] In this embodiment, an isolation film is used to separate the magnetic material and the substrate, which can prevent the magnetic material from overflowing to the surface of the substrate when filling the holes. After the hole filling is completed, the isolation film can be directly torn off to take away the magnetic material remaining on the surface of the isolation film, making it easier to clean the residual magnetic material, thereby making the processing of the circuit board simpler.

[0013] According to some embodiments of the present invention, the specific step of forming a through hole on at least one of the isolation films in the step of manufacturing the film-coated substrate is: forming the through hole on both of the isolation films.

[0014] According to some embodiments of the present invention, the step of preparing the film-bearing substrate comprises the following steps:

[0015] The isolation film is firstly arranged on the substrate to form a film-coated substrate, and then the through hole and the receiving hole are simultaneously processed and formed on the film-coated substrate.

[0016] According to some embodiments of the present invention, the through hole and the receiving hole are formed on the film-coated substrate by laser processing.

[0017] According to some embodiments of the present invention, the step of manufacturing the film-bearing substrate comprises the following steps:

[0018] Firstly, the receiving hole is machined on the substrate, and burrs on the edge of the receiving hole are removed;

[0019] The isolation film is then disposed on the substrate, and the through hole is processed on the isolation film.

[0020] According to some embodiments of the present invention, the following steps are further included before the film-tearing step:

[0021] Cleaning the orifice: forming a separation groove on the magnetic material remaining on the surface of the isolation membrane, so as to separate the magnetic material in the receiving hole from the magnetic material remaining on the surface of the isolation membrane.

[0022] According to some embodiments of the present invention, the following steps are further included after the film-tearing step:

[0023] Leveling: Cleaning the magnetic material so that it is flush with the surface of the substrate.

[0024] According to some embodiments of the present invention, the following steps are further included before the orifice cleaning step:

[0025] Curing: Curing the magnetic material.

[0026] According to some embodiments of the present invention, the magnetic material is solidified in the solidification step, specifically, the magnetic material is pre-solidified;

[0027] The curing step further includes the following step: final curing the magnetic material, wherein the hardness of the magnetic material after pre-curing is less than the hardness of the magnetic material after final curing.

[0028] According to some embodiments of the present invention, during the orifice cleaning step, at least a portion of the isolation film is retained.

[0029] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0031] Figure 1 It is a flow chart of a method for embedding magnetic materials in a circuit board according to an embodiment of the present invention;

[0032] Figure 2 It is a schematic structural diagram of a substrate and an isolation film in the step of making a film-bearing substrate in the method for embedding magnetic materials in a circuit board according to an embodiment of the present invention;

[0033] Figure 3 It is a schematic structural diagram of a substrate, an isolation film, and a magnetic film in the step of providing a magnetic film in the method for embedding magnetic materials in a circuit board according to an embodiment of the present invention;

[0034] Figure 4 It is a schematic structural diagram of a substrate, an isolation film, and a magnetic film in a hole filling step in a method for embedding magnetic materials in a circuit board according to an embodiment of the present invention;

[0035] Figure 5 It is a schematic structural diagram of the substrate, the isolation film, and the magnetic film after the film is torn off in the method for embedding magnetic materials in a circuit board according to an embodiment of the present invention;

[0036] Figure 6 It is a schematic structural diagram of a substrate, an isolation film and a magnetic film in a step of providing a magnetic film in another method for embedding magnetic materials in a circuit board according to an embodiment of the present invention;

[0037] Figure 7 For the corresponding Figure 6 A schematic diagram of the structures of the substrate, the isolation film and the magnetic film in the hole filling step in the method for embedding magnetic materials in a circuit board;

[0038] Figure 8 For the corresponding Figure 6 Schematic diagram of the structure of the substrate, isolation film and magnetic film after the hole cleaning step in the circuit board magnetic material filling method.

[0039] Reference numerals:

[0040] Substrate 100, first surface 110, receiving hole 120;

[0041] Isolation film 200, through hole 210;

[0042] Magnetic film 300 , first magnetic material 310 , second magnetic material 320 , separation groove 330 . DETAILED DESCRIPTION

[0043] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0044] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0045] In the description of the present invention, "several" means more than one, "many" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0046] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0047] In the description of the present invention, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0048] With the rapid development of electronic technology, especially the widespread application of wireless communication, Internet of Things and high-frequency electronic equipment, the performance requirements for electronic components are increasing. In these applications, magnetic materials play a vital role in signal transmission, electromagnetic shielding, energy conversion and storage due to their unique electromagnetic properties. Especially in high-frequency, high-speed and highly integrated electronic systems, how to effectively use magnetic materials to improve circuit performance, reduce volume, reduce power consumption and cost has become a research hotspot in the current field of electronic engineering technology. In some technologies, in order to improve the performance of the circuit board, a magnetic film is set on the surface of the substrate, and then hot pressing is performed to melt the magnetic film and enter the preset holes, thereby realizing the pre-embedded magnetic parts in the substrate. However, this method has the problem of magnetic material overflowing to the surface of the substrate, making the substrate difficult to clean, resulting in difficulty in substrate processing.

[0049] In view of this, the present invention proposes a method for pre-embedding magnetic materials in a substrate, which can prevent the magnetic components from overflowing onto the substrate 100, thereby making the processing of the circuit board simpler. Figures 1 to 5 , Figure 1 This is a flow chart of a method for embedding magnetic materials in a circuit board according to an embodiment of the present invention. Figure 2 Schematic diagram of the structure of the substrate and the isolation film in the step of making a film-bearing substrate in the method for embedding magnetic materials in a circuit board according to an embodiment of the present invention, Figure 3 Schematic diagram of the structure of the substrate, the isolation film, and the magnetic film in the step of providing the magnetic film in the method for embedding magnetic materials in a circuit board according to an embodiment of the present invention. Figure 4 Schematic diagram of the structure of the substrate, the isolation film, and the magnetic film in the hole filling step in the method for embedding magnetic materials in a circuit board according to an embodiment of the present invention. Figure 5 This is a schematic diagram of the structure of the substrate, isolation film, and magnetic film after the film tearing step in the method for embedding magnetic materials in a circuit board in an embodiment of the present invention. The method for embedding magnetic materials in a circuit board in this embodiment includes the following steps: preparing materials, making a substrate with a film, pasting magnetic materials, filling holes, and tearing off films.

[0050] S100 , preparing materials: preparing a substrate 100 , an isolation film 200 and a magnetic film 300 , wherein the substrate 100 includes two first surfaces 110 facing each other along its thickness direction.

[0051] S200, manufacturing a film-coated substrate: providing an isolation film 200 on both first surfaces 110, and processing a through hole 210 on at least one of the isolation films 200, processing a receiving hole 120 on the substrate 100, and making the through hole 210 communicate with the receiving hole 120 (such as Figure 2 shown).

[0052] S300, setting the magnetic film 300: setting the magnetic film 300 on the surface of the isolation film 200 having the through hole 210, and making the magnetic film 300 cover the through hole 210 (such as Figure 3 shown).

[0053] S400, hole filling: hot pressing the magnetic film 300, so that the magnetic material forms a molten magnetic material, and the magnetic material passes through the through hole 210 into the receiving hole 120 (such as Figure 4 shown).

[0054] S500, tearing off the film: removing the isolation film 200 to remove the magnetic material (such as Figure 5 shown).

[0055] Specifically, in this embodiment, an isolation film 200 is arranged on the surface of the substrate 100, and a magnetic film 300 is arranged on the surface of the isolation film 200. Therefore, after the magnetic film 300 is hot-pressed, the isolation film 200 can prevent the magnetic material from overflowing to the surface of the substrate 100, that is, the magnetic material remaining outside the accommodating hole 120 is located on the surface of the isolation film 200. After the hole filling step is completed, the isolation film 200 is directly torn off, and the magnetic material remaining on the surface of the isolation film 200 is taken away (for the convenience of explanation, the magnetic material remaining on the surface of the diaphragm is referred to as the second magnetic material 320, unless otherwise specified, the same below), so that the cleaning of the residual magnetic material is more convenient, thereby making the processing of the circuit board simpler.

[0056] Specifically, the substrate 100 includes but is not limited to substrates 100 that need to be processed, such as copper-clad boards and multilayer boards, and can be flexible substrates 100 or hard substrates 100. The isolation film 200 is, for example, a polyvinyl chloride (PVC) film, a polyethylene naphthalate (PEN) film or a polyethylene terephthalate (PET) film, wherein the PET film is preferably a PET film, which has high temperature resistance and ultra-low shrinkage characteristics, excellent dimensional stability and chemical resistance after the heat treatment process. The isolation film 200 is directly stacked on the surface of the substrate 100, or is adhered to the circuit board through an adhesive, thereby avoiding the dislocation of the isolation film 200 and the substrate 100 during the processing process and improving the processing accuracy. The adhesive is, for example, a special pressure-sensitive adhesive such as a silicone pressure-sensitive adhesive, an acrylic pressure-sensitive adhesive or a polyurethane pressure-sensitive adhesive, which is easy to peel off even after the lamination process, without residual adhesive, making it easier to tear the film. The magnetic film 300 can be directly stacked on the surface of the isolation film 200 facing away from the substrate 100, or adhered to the surface of the isolation film 200 by an adhesive. The hot pressing method of the magnetic film 300 can be but is not limited to vacuum hot pressing. The magnetic film 300 can be set on one side or on both sides, specifically, the magnetic film 300 is set on only one first surface 110, or the magnetic film 300 is set on both first surfaces 110. It is designed according to actual needs, as long as the magnetic film can fill the receiving hole 120 after hot pressing.

[0057] For example, refer to Figure 6 and Figure 7 , Figure 6Schematic diagram of the structure of the substrate, the isolation film and the magnetic film in the step of providing the magnetic film in another method for embedding magnetic materials in a circuit board according to an embodiment of the present invention. Figure 7 For the corresponding Figure 6 Schematic diagram of the structure of the substrate, the isolation film, and the magnetic film in the hole filling step in the method for embedding magnetic materials in the circuit board. In some embodiments, the isolation films 200 on the two first surfaces 110 are processed to form through holes 210, that is, in the step of setting the magnetic film, the surfaces of the isolation films 200 on the two first surfaces 110 are both provided with magnetic materials (such as Figure 6 As shown). Therefore, during the hot pressing process, it is easier to fill the receiving hole 120, which not only improves the processing efficiency but also saves the amount of magnetic material used.

[0058] Specifically, in order to ensure that the receiving hole 120 is filled with magnetic material, the magnetic material needs to have a certain thickness. For example, in order to ensure that the receiving hole 120 is filled with magnetic material, the thickness of the magnetic film 300 is L. If the magnetic film 300 is set on only one first surface 110, it is necessary to ensure that the thickness of the magnetic film 300 on one surface is L. If the magnetic film is set on both first surfaces 110, the thickness of the magnetic material on the two first surfaces 110 can be L / 2. It can be known that the thicker the magnetic film 300 is, the larger its overflow area will be during the hot pressing process. In this embodiment, the magnetic film 300 is set on both first surfaces 110, which can reduce the thickness of the magnetic film 300 on each first surface 110. It is sufficient to ensure that the sum of the thicknesses of the magnetic films 300 on the two first surfaces is L, thereby reducing the overflow area of ​​the magnetic film after hot pressing (such as Figure 7 As shown), more magnetic material can enter the receiving hole 120 to save the usage of magnetic material.

[0059] It should be noted that, in the step S200 of manufacturing a film-bearing substrate in the above-mentioned embodiment, the order of the three steps of setting the isolation film 200 on the substrate 100, opening the isolation film 200, and opening the substrate 100 is not limited. For example, in some embodiments, the step of manufacturing a film-bearing substrate includes the following steps: firstly setting the isolation film 200 on the substrate 100 to form a film-bearing substrate, and then simultaneously processing and forming the through hole 210 and the receiving hole 120 on the film-bearing substrate, thereby improving work efficiency. Specifically, during the processing, the isolation film 200 is first set on the surface of the substrate 100, and then the through hole 210 is formed on the surface of the isolation film 200, and the receiving hole 120 is further formed on the surface of the substrate 100 through the through hole 210. That is, in this embodiment, the mutually connected receiving hole 120 and the through hole 210 can be simultaneously processed and formed through one processing step, thereby improving the processing efficiency, and the processed through hole 210 has a higher coaxiality with the receiving hole 120, thereby improving the position accuracy between the receiving hole 120 and the through hole 210, thereby improving the quality of the magnetic material buried in the substrate 100.

[0060] On the basis of the above-mentioned embodiment, the specific steps of forming the through hole 210 and the receiving hole 120 on the film substrate are: forming the through hole 210 and the receiving hole 120 on the film substrate simultaneously by laser. Specifically, by laser processing, it is possible to avoid burrs on the edge of the hole when the substrate 100 is opened. On the one hand, it is possible to avoid burrs entering between the isolation film 200 and the substrate 100, thereby avoiding the generation of a gap between the isolation film 200 and the substrate 100, thereby reducing the risk of the melted magnetic material overflowing into the isolation film 200 and the substrate 100, that is, it is possible to reduce the risk of the magnetic material contacting the surface of the substrate 100, thereby reducing the difficulty of cleaning the substrate 100, thereby reducing the difficulty of processing the circuit board and saving manufacturing costs. On the other hand, it is possible to improve the connection strength between the isolation film 200 and the substrate 100, thereby reducing the risk of the isolation film 200 falling off, thereby further reducing the risk of the magnetic material contacting the surface of the substrate 100.

[0061] It is understandable that laser processing has certain requirements for the thickness of the substrate 100. When the thickness of the substrate 100 is large, it is difficult for the laser to penetrate the substrate 100. Based on this, when the thickness of the substrate 100 is large, in some embodiments, the step of making the film-bearing substrate includes the following steps: firstly, a receiving hole 120 is machined on the substrate 100, for example, a hole is drilled by a drill bit, and after the hole is opened, the burrs at the edge of the receiving hole 120 are cleaned, and then the isolation film 200 is set on the substrate 100, and a through hole 210 is machined on the isolation film 200. The reason why the burrs need to be removed is that during the machining process, burrs will be generated on the edge of the receiving hole 120, so there is a risk that the burrs will enter between the isolation membrane 200 and the substrate 100. The present embodiment can effectively improve this problem. By using the processing method of the present embodiment, not only can the processing of thicker circuit boards be completed, but also the burrs can be prevented from entering between the isolation membrane 200 and the substrate 100, thereby avoiding the generation of a gap between the isolation membrane 200 and the substrate 100. This can reduce the risk of the melted magnetic material overflowing into the space between the isolation membrane 200 and the substrate 100, that is, it can reduce the risk of the magnetic material contacting the surface of the substrate 100, thereby reducing the difficulty of cleaning the substrate 100, thereby reducing the difficulty of processing the circuit board and saving manufacturing costs.

[0062] It should be noted that the processing method of this embodiment is not limited to processing thicker circuit boards. According to actual needs, it can also be used for processing thinner circuit boards, as long as burrs can be avoided between the isolation film 200 and the surface of the substrate 100 during the processing. In this embodiment, the hole opening process of the isolation film 200 can be formed by machining or laser processing. When formed by machining, since the through hole 210 of the isolation film 200 has the same diameter as the receiving hole 120 on the substrate 100, there is no need to replace other processing equipment, which makes the processing cost lower and the equipment occupies less space. When laser processing is used, the hole opening efficiency can be improved, thereby improving the processing efficiency of the circuit board.

[0063] Reference Figure 8 , Figure 8 For the corresponding Figure 6 Schematic diagram of the structure of the substrate, isolation film, and magnetic film after cleaning the orifice in the method for filling the magnetic material of the circuit board in the circuit board magnetic material, in some embodiments, the following steps are also included before the film tearing step: cleaning the orifice: processing a separation groove 330 in the magnetic material (first magnetic material 310) remaining on the surface of the isolation film 200, so that the magnetic material located inside the receiving hole 120 (the magnetic material located inside the receiving hole 120 is referred to as the second magnetic material 320, the same below unless otherwise specified) is separated from the first magnetic material 310. Specifically, in the actual processing process, after the magnetic material is hot-pressed into the receiving hole 120, a certain amount of magnetic material will remain on the surface of the isolation film 200, so there may be a risk of taking away the second magnetic material 320 during the film tearing process. Based on this, in this embodiment, the first magnetic material 310 is grooved to separate the first magnetic material 310 and the second magnetic material 320, thereby reducing the risk of the second magnetic material 320 detaching during the film tearing step. For example, in some embodiments, the openings around the through-holes 210 are drilled or laser processed to the isolation film 200, or in some embodiments, the openings around the through-holes 210 are drilled or laser processed to the copper layer of the substrate 100, or in some embodiments, the openings around the through-holes 210 are drilled or laser processed to the isolation film 200, and the magnetic material is flush with the surface of the isolation film 200. Further, in some embodiments, the openings around the through-holes 210 are drilled or laser processed to the surface of the substrate 100, and the magnetic material is flush with the surface of the substrate 100, so that the subsequent process does not need to level the circuit board again, making the processing efficiency of the circuit board higher.

[0064] In some embodiments, the following steps are further included after the film peeling step: Leveling: cleaning the magnetic material so that the surface of the magnetic material is flush with the substrate 100 (eg Figure 5Specifically, after the film-tearing step, the magnetic material may protrude from the surface of the substrate 100, resulting in an uneven surface of the circuit board. Based on this, in this embodiment, after the film-tearing step, the surface of the magnetic material is cleaned to make the surface of the magnetic material flush with the surface of the substrate 100, thereby improving the quality of the circuit board.

[0065] In some embodiments, the following steps are also included before the hole cleaning step: solidification: solidifying the molten magnetic material to improve the adhesion between the magnetic material and the wall of the receiving hole 120 and the stability of the shape of the magnetic material, which can further reduce the risk of the magnetic material escaping from the receiving hole 120, thereby improving the quality of the circuit board.

[0066] On the basis of the above-mentioned embodiment, the magnetic material is solidified in the solidification step, specifically, the magnetic material is pre-solidified, and the following step is also included after the leveling step, the magnetic material is finally solidified, wherein the hardness of the magnetic material after the pre-solidification is less than the hardness of the magnetic material after the final solidification. Specifically, after the magnetic material is completely solidified (finally solidified), the hardness of the magnetic material is relatively large, which increases the difficulty of processing the magnetic material. In this embodiment, the solidification of the magnetic material is divided into pre-solidification before cleaning the hole and final solidification after leveling. The pre-solidified magnetic material can ensure a certain bonding force and fixed shape with the hole wall, and can also be easily drilled, milled, brushed and laser processed, thereby making the cleaning of the hole and leveling simpler and more convenient. At the same time, the final solidification is used to ensure that the magnetic material located in the receiving hole 120 has sufficient hardness, thereby improving the quality of the circuit board.

[0067] In short, the segmented curing in this embodiment can ensure that the magnetic material is cured under the optimal temperature conditions, thereby improving its magnetic properties and stability. At the same time, the final curing step after leveling can further eliminate surface unevenness and internal stress, so that the final circuit board has a better surface finish and higher precision.

[0068] In some embodiments, during the step of cleaning the orifice, at least a portion of the isolation film 200 is retained to avoid accidental damage to the substrate 100 during the step of cleaning the orifice, thereby improving the quality of the processed circuit board.

[0069] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the purpose of the present invention. In addition, the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

Claims

1. A method for embedding magnetic materials in a circuit board, characterized in that: The steps include: Prepare materials: prepare a substrate, an isolation film and a magnetic film, wherein the substrate includes two first surfaces facing each other along its thickness direction; Manufacturing a film-bearing substrate: arranging the isolation films on both of the first surfaces, processing and forming a through hole on at least one of the isolation films, processing and forming a receiving hole on the substrate, and making the through hole communicate with the receiving hole; Arranging a magnetic film: arranging the magnetic film on the surface of the isolation film having the through hole, and making the magnetic film cover the through hole; Filling the hole: hot pressing the magnetic film to form a molten magnetic material, and pressing the magnetic material into the receiving hole; Film tearing: removing the isolation film to remove the magnetic material remaining on the surface of the isolation film.

2. The method for embedding magnetic material in a circuit board according to claim 1, characterized in that: The specific step of forming a through hole on at least one of the isolation films in the step of manufacturing the film-coated substrate is: forming the through hole on both of the isolation films.

3. The method for embedding magnetic material in a circuit board according to claim 1 or 2, characterized in that: The step of making a film-coated substrate comprises the following steps: The isolation film is firstly arranged on the substrate to form a film-coated substrate, and then the through hole and the receiving hole are simultaneously processed and formed on the film-coated substrate.

4. The method for embedding magnetic material in a circuit board according to claim 3, characterized in that: The through hole and the receiving hole are formed on the film-attached substrate by laser processing.

5. The method for embedding magnetic material in a circuit board according to claim 1 or 2, characterized in that: The step of making a film-bearing substrate comprises the following steps: Firstly, the receiving hole is machined on the substrate, and burrs on the edge of the receiving hole are removed; The isolation film is then disposed on the substrate, and the through hole is processed on the isolation film.

6. The method for embedding magnetic material in a circuit board according to claim 1, characterized in that: The method further includes the following steps before the film-tearing step: Cleaning the orifice: forming a separation groove on the magnetic material remaining on the surface of the isolation membrane, so as to separate the magnetic material in the receiving hole from the magnetic material remaining on the surface of the isolation membrane.

7. The method for embedding magnetic material in a circuit board according to claim 1, characterized in that: The method further comprises the following steps after the film tearing step: Leveling: Cleaning the magnetic material so that it is flush with the surface of the substrate.

8. The method for embedding magnetic material in a circuit board according to claim 5, characterized in that: The method further includes the following steps before the orifice cleaning step: Curing: Curing the magnetic material.

9. The method for embedding magnetic material in a circuit board according to claim 7, characterized in that: The magnetic material is solidified in the solidification step, specifically, the magnetic material is pre-solidified; The curing step further includes the following step: final curing the magnetic material, wherein the hardness of the magnetic material after pre-curing is less than the hardness of the magnetic material after final curing.

10. The method for embedding magnetic material in a circuit board according to claim 7, characterized in that: During the orifice cleaning step, at least a portion of the isolation film is retained.

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