Manufacturing method for simple blind hole plugging process of high-frequency mixed pressing plate

Abstract

The invention discloses a manufacturing method for a simple blind hole plugging process of a high-frequency mixed-pressing plate, which comprises the following steps of plate cutting, inner-layer circuit manufacturing, primary lamination, mechanical drilling, hole plating, internal light imaging, secondary lamination, mechanical drilling, copper deposition and plate plating, outer-layer circuit manufacturing, resistance welding, character and gold deposition, and belongs to the technical field of high-frequency mixed-pressing plate manufacturing. According to the manufacturing method for the simple blind hole plugging process of the high-frequency mixed pressing plate, the blind hole resin plugging process is omitted, pure glue PP automatically flows into the holes during lamination, the hole plugging action is completed, unnecessary machining processes are reduced, the production efficiency and the product production progress are improved, the plate grinding process is omitted, the damage frequency of the high-frequency plate is reduced, and the production cost is reduced. The method is beneficial for improving the yield of a factory, reducing the material consumption of resin used for plugging holes, saving the material cost of the factory, automatically plugging the holes during lamination, reducing the risk of sunken abnormity of the plugged holes, and removing drilling dirt from redundant resin through a normal process.

Description

Technical Field

[0001] The invention relates to the technical field of high-frequency mixed-pressure board manufacturing, and in particular to a manufacturing method of a high-frequency mixed-pressure board with a simplified blind hole plugging process. Background Art

[0002] High-frequency mixed-pressure boards refer to the use of different materials for lamination on the same circuit board. Usually, high-frequency materials with low dielectric constant and low loss factor are mixed with ordinary FR-4 and other materials to meet the differentiated needs of signal transmission characteristics in different areas of complex circuit design. Through the lamination combination of different materials, the integration of multiple functions of the circuit board is realized;

[0003] High-frequency hybrid boards are widely used in electronics, communications, and radio frequency fields because they have the advantages of improved high-frequency signal integrity, improved impedance control accuracy, reduced costs, improved production yield and manufacturability, and flexible multi-layer structure functional partitioning.

[0004] However, not all layers in the high-frequency board need to transmit high-frequency signals. Ordinary FR-4 boards can be used for the power layer in the board. This mixed lamination method of high-frequency boards and ordinary boards can not only meet the requirements of PCB for high-frequency signal transmission, but also save boards and save costs.

[0005] Prior art 1 (application number CN201910357404.9, Chinese patent with application date of 2019-04-29) A method for manufacturing a high-frequency mixed-pressure printed circuit board solves the problem of incomplete hole filling of high-frequency mixed-pressure HDI boards, optimizes the hole filling and surface copper ratio filling parameters of high-frequency mixed-pressure HDI boards, improves the quality problems of thick surface copper and poor uniformity in traditional processes, reduces manpower and material cost investment, and successfully develops a 120T screen to produce L1-L2, L1-L3 layer blind hole resin plugging process, realizes seamless connection between high-frequency mixed-pressure board design and production, and improves the board warping problem;

[0006] There is also a method for making a high-frequency mixed-pressure board in prior art 2 (application number CN202111398722.3, application date 2021-11-19 Chinese patent), the overall manufacturing method is simple and easy to operate, and compared with the traditional manufacturing method, the high-frequency material layer used in the present invention has better high temperature resistance, adhesion and dielectric properties;

[0007] And prior art 3 (Chinese patent with application number CN201910877949.2 and application date 2019-09-17) is a positioning and pressing method for producing a mixed-pressure board. The bottom of the inner cavity equipped with a heater can be used in conjunction with multiple groups of partitions slotted around the mold. Force can be applied after the high-frequency material board is built in, and the semi-cured liquid that overflows the partition can be scraped off while heating. The speed of heating and curing can be effectively improved while ensuring the removal of excess semi-cured liquid to avoid secondary processing. In the combination of the high-frequency material board and the FR4 material board, the reverse built-in secondary pressing process is combined to make the pressure of the two layers of high-frequency material boards similar, effectively ensuring that the combined thickness is similar when the layers are connected, and both ends are heated, with good stability and strong anti-curling ability;

[0008] The high-frequency board in the high-frequency mixed-pressed board generally has blind holes that need to be plugged with resin. When processing the plugging holes, the industry practice is to press the high-frequency board together and then drill the holes that need to be plugged with resin, and then carry out the resin plugging process. After the plugging is completed, the high-frequency board and the ordinary FR-4 board are mixed and pressed to complete the pressing of the finished product. This requires resin grinding. If the finished board still has resin plugging holes, it needs to be ground multiple times. The high-frequency board is thin. After multiple grindings, the high-frequency board will be deformed, pitted, and abnormally expanded and contracted, affecting product quality.

[0009] Therefore, we propose a method for manufacturing a high-frequency mixed-pressure board with a simplified blind hole plugging process in order to solve the above-mentioned problems. Summary of the invention

[0010] The purpose of the present invention is to provide a method for manufacturing a high-frequency mixed-pressure board with a simplified blind hole plugging process, so as to solve the problem raised in the above background technology that the high-frequency mixed-pressure boards on the market currently need to undergo multiple grinding, and the high-frequency boards are relatively thin. After multiple grinding, the high-frequency boards will be deformed, have pits, and expand and shrink abnormally, affecting product quality.

[0011] To achieve the above object, the present invention provides the following technical solution: a method for manufacturing a high-frequency mixed pressure board with a simplified blind hole plugging process, comprising the following steps:

[0012] Step 1: Cutting the sheet material;

[0013] Step 2: internal light imaging;

[0014] Step 3, one-time lamination;

[0015] Step 4: Mechanical drilling;

[0016] Step 5: hole plating;

[0017] Step 6: Internal light imaging;

[0018] Step 7: Secondary pressing;

[0019] Step 8: Mechanical drilling;

[0020] Step 9: Copper deposition and board plating;

[0021] Step 10: outer layer circuit production;

[0022] Step 11, solder resist;

[0023] Step 12: Characters are made in a similar way to solder mask;

[0024] Step 13, immersion gold;

[0025] The primary lamination in step 3 further comprises the following steps:

[0026] S1. PNL board edge design: In order to prevent the pure rubber PP from being too fluid and causing the board to slide, the length and width of PP and pure rubber should be 5mm smaller than that of PNL. In the adjacent PNL edge rail area (the area 5mm away from the board edge), the positive and negative opposite patterns are set. After lamination and rivets are set, the positive and negative opposite patterns will be tightly interlocked like a mortise and tenon structure, reducing the risk of sliding;

[0027] S2, when cutting pp and pure rubber pp, the length and width are 5mm shorter than PNL;

[0028] S3. When designing CAM data, the PNL edge rail area (the area 5mm away from the edge of the board) adjacent to the board edge is set with opposite positive and negative patterns;

[0029] S4. During lamination, the copper blocks in the edge rail area will be tightly inlaid together, reducing the risk of skateboarding.

[0030] Preferably, in step 1, a cutting machine is used to cut the copper clad laminate into a designed size, and L1-L2, L3-L4, and L5-L6 core boards with a thickness of 0.4 mm (excluding copper) and a copper thickness of 1 / 10Z are cut out.

[0031] Preferably, in step 2, the board is pre-processed for graphics to remove dirt from the board surface and roughen the copper surface, a dry film is pasted on the board surface using a film laminating machine, and UV light emitted by the light source of the exposure machine passes through the film (no film during laser exposure) and the protective film and irradiates the dry film to form an anti-corrosion layer with certain graphic characteristics on the board surface, and then passes through the DES line body. The DES has three sections: a developing section, an etching section, and a film stripping section. The board passes through the developing section, and the film that is not irradiated by light is dissolved under the action of the developer. The board passes through the etching section, and the exposed copper is etched away under the action of the acidic etching solution. Finally, the board passes through the film stripping section, and the film is removed under the action of the film stripping solution to expose the inner layer circuit pattern.

[0032] Preferably, in step 3, the L1-L2 and L3-L4 layer high-frequency boards are pressed together, in step 4, holes that need to be plugged with resin in the high-frequency layer are drilled, in step 5, the full holes are plated with copper to make the upper and lower layers conductive, and in step 6, the L1 and L4 layer circuits are produced.

[0033] Preferably, in step 7, pure PP is used for lamination, and the fluidity of pure PP is utilized in combination with the pressure of the laminating steel plates, so that the pure PP automatically flows into the holes of the high-frequency board that need to be plugged with resin.

[0034] Preferably, in step 8, a mechanical drill is used to drill a 0.3mm / 0.25mm through hole from the L1 layer to the L4 layer, and the inner layer L2-L3 layer is conductively connected to other layers by copper deposition + plated copper with a thickness of 20-23 μm.

[0035] Preferably, in step 10, L1 and L6 layer circuits are produced.

[0036] Preferably, in step 11, the solder resist ink is leak-printed on the board surface using a silk screen and pre-baked to remove volatilization to form a semi-cured film layer. Through positional exposure, the illuminated area undergoes a photochemical reaction (chain polymerization) to achieve the effect of selective local hardening without being dissolved by the developer solution, and the unexposed area is developed under the action of alkali solution. Finally, at high temperature, the solder resist is completely cured and attached to the board surface.

[0037] Preferably, in step 13, the immersion gold is deposited on the copper surface through a chemical replacement reaction to deposit a metal nickel layer and a gold layer.

[0038] Compared with the prior art, the beneficial effect of the present invention is that the sub-board resin plugging process is eliminated, pure glue PP is used during lamination, and the flowability of pure glue PP is utilized to complete the plugging. During the secondary lamination, at least one sheet of pure glue PP is required on the side close to the high-frequency board. If the product has a high dielectric thickness requirement, conventional PP can be added according to the thickness requirement:

[0039] (1) The blind hole resin plugging process is cancelled. During lamination, pure PP automatically flows into the hole to complete the plugging action, reducing unnecessary processing processes and improving production efficiency and product production progress;

[0040] (2) The grinding process is eliminated, which reduces the number of damages to high-frequency boards and helps improve the factory yield;

[0041] (3) Reduce the amount of resin used for plugging holes, saving factory material costs;

[0042] (4) Automatic plugging during lamination reduces the risk of abnormal plugging hole depression, and excess resin is removed through the normal process;

[0043] (5) Simplify the process difficulty: Compared with other processes, resin plugging requires higher skills of operators, and quality problems such as uneven resin filling and bubbles may occur during the plugging process, affecting the performance and reliability of the circuit board. Canceling conventional resin plugging can reduce the difficulty of process control;

[0044] (6) During lamination, excess pure glue is squeezed into the hole, reducing the risk of lamination slide deviation. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 It is a schematic diagram of the structure of the present invention;

[0046] Figure 2 This is a cutting diagram of the copper clad laminate of the present invention;

[0047] Figure 3 This is a dry film application diagram of the present invention;

[0048] Figure 4 This is the dry film exposure diagram of the present invention;

[0049] Figure 5 It is the development diagram of the present invention;

[0050] Figure 6 is the etching pattern of the present invention;

[0051] Figure 7 It is the film-fading diagram of the present invention;

[0052] Figure 8 This is a primary lamination diagram of the present invention;

[0053] Fig. 9 It is the mechanical drilling diagram of the present invention;

[0054] Fig.10 is the plated hole diagram of the present invention;

[0055] Fig.11 This is the internal light imaging diagram of the present invention;

[0056] Fig.12 This is a secondary pressing diagram of the present invention;

[0057] Fig.13 It is the mechanical drilling diagram of the present invention;

[0058] Fig.14 It is the copper deposition and plate plating diagram of the present invention;

[0059] Fig.15 Make a diagram for the outer circuit of the present invention;

[0060] Fig.16 Schematic diagram of the aspect ratio of the PNL of the present invention;

[0061] Fig.17This is a schematic diagram of the PNL side track area of ​​the present invention;

[0062] Fig.18 It is a schematic diagram of the lamination of the side rail area of ​​the present invention. DETAILED DESCRIPTION

[0063] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0064] The present invention provides the following technical solutions:

[0065] To solve the problem that the existing high-frequency mixed-pressure plate needs to undergo multiple grinding, and the high-frequency plate is relatively thin, and after multiple grinding, the high-frequency plate will be deformed, pitted, and abnormally expanded and contracted, affecting the product quality;

[0066] The following steps are involved:

[0067] Step 1: Cutting the sheet material;

[0068] Step 2: internal light imaging;

[0069] Step 3, one-time lamination;

[0070] Step 4: Mechanical drilling;

[0071] Step 5: hole plating;

[0072] Step 6: Internal light imaging;

[0073] Step 7: Secondary pressing;

[0074] Step 8: Mechanical drilling;

[0075] Step 9: Copper deposition and board plating;

[0076] Step 10: outer layer circuit production;

[0077] Step 11, solder resist;

[0078] Step 12: Characters are made in a similar way to solder mask;

[0079] Step 13, immersion gold;

[0080] The primary lamination in step 3 further comprises the following steps:

[0081] S1. PNL board edge design: In order to prevent the pure rubber PP from being too fluid and causing the board to slide, the length and width of PP and pure rubber should be 5mm smaller than that of PNL. A positive and negative opposite pattern should be set in the adjacent PNL edge rail area (the area 5mm away from the board edge). After the lamination is nailed with rivets, the positive and negative opposite patterns will be tightly interlocked like a mortise and tenon structure, reducing the risk of sliding;

[0082] S2, when cutting pp and pure rubber pp, the length and width are 5mm shorter than PNL;

[0083] S3. When designing CAM data, the PNL edge rail area (the area 5mm away from the edge of the board) adjacent to the board edge is set with opposite positive and negative patterns;

[0084] S4. During lamination, the copper blocks in the edge rail area will be tightly inlaid together, reducing the risk of skateboarding.

[0085] In step 1, a cutting machine is used to cut the copper clad laminate into the designed size, and the L1-L2, L3-L4, and L5-L6 core boards with a thickness of 0.4 mm (excluding copper) and a copper thickness of 1 / 10Z are cut out.

[0086] In step 2, the board is pre-processed to remove dirt from the board surface and roughen the copper surface. A dry film is pasted on the board surface using a film laminating machine. The UV light emitted by the light source of the exposure machine passes through the film (no film during laser exposure) and the protective film and irradiates the dry film to form an anti-corrosion layer with certain graphic characteristics on the board surface.

[0087] Then it passes through the DES line. The DES has three sections: developing section, etching section, and film stripping section. The board passes through the developing section, where the film that is not exposed to light is dissolved under the action of the developer. It passes through the etching section, where the exposed copper is etched away under the action of the acidic etching solution. Finally, it passes through the film stripping section, where the film is removed under the action of the film stripping solution to expose the inner layer circuit pattern.

[0088] In step 3, the L1-L2 and L3-L4 high-frequency boards are pressed together. In step 4, holes that need to be plugged with resin in the high-frequency layer are drilled. In step 5, the holes are plated with copper to make the upper and lower layers conductive. In step 6, the L1 and L4 layer circuits are produced.

[0089] In step 7, pure PP is used for pressing. By utilizing the fluidity of pure PP and the pressure of the pressed steel plate, pure PP automatically flows into the holes of the high-frequency board that need to be plugged with resin.

[0090] In step 8, a mechanical drill is used to drill 0.3mm / 0.25mm through holes from the L1 layer to the L4 layer, and the copper thickness of the inner layer L2-L3 layer is connected to other layers through copper deposition + plated holes with a thickness of 20-23μm.

[0091] In step 10, L1 and L6 layer circuits are produced.

[0092] In step 11, the solder mask ink is printed on the board surface with a silk screen and pre-baked to remove volatilization to form a semi-cured film layer. Through the positional exposure, the illuminated area undergoes a photochemical reaction (chain polymerization) to achieve the effect of selective local hardening without being dissolved by the developer solution. The unexposed area is developed under the action of alkali solution. Finally, at high temperature, the solder mask is completely cured and attached to the board surface.

[0093] In step 13, immersion gold deposits a metal nickel layer and a gold layer on the copper surface through a chemical replacement reaction;

[0094] Embodiment 1 discloses:

[0095] Step 1: Cutting the sheet material;

[0096] Step 2: internal light imaging;

[0097] Step 3, one-time lamination;

[0098] Step 4: Mechanical drilling;

[0099] Step 5: hole plating;

[0100] Step 6: Internal light imaging;

[0101] Step 7: Secondary pressing;

[0102] Step 8: Mechanical drilling;

[0103] Step 9: Copper deposition and board plating;

[0104] Step 10: outer layer circuit production;

[0105] Step 11, solder resist;

[0106] Step 12: Characters are made in a similar way to solder mask;

[0107] Step 13, immersion gold;

[0108] The primary lamination in step 3 further comprises the following steps:

[0109] S1. PNL board edge design: In order to prevent the pure rubber PP from being too fluid and causing the board to slide, the length and width of PP and pure rubber should be 5mm smaller than that of PNL. A positive and negative opposite pattern should be set in the adjacent PNL edge rail area (the area 5mm away from the board edge). After the lamination is nailed with rivets, the positive and negative opposite patterns will be tightly interlocked like a mortise and tenon structure, reducing the risk of sliding;

[0110] S2, when cutting pp and pure rubber pp, the length and width are 5mm shorter than PNL;

[0111] S3. When designing CAM data, the PNL edge rail area (the area 5mm away from the edge of the board) adjacent to the board edge is set with opposite positive and negative patterns;

[0112] S4. During lamination, the copper blocks in the edge rail area will be tightly inlaid together, reducing the risk of skateboarding.

[0113] In step 1, a cutting machine is used to cut the copper clad laminate into the designed size, and the L1-L2, L3-L4, and L5-L6 core boards with a thickness of 0.4 mm (excluding copper) and a copper thickness of 1 / 10Z are cut out.

[0114] In step 2, the board is pre-processed to remove dirt from the board surface and roughen the copper surface. A dry film is pasted on the board surface using a film laminating machine. The UV light emitted by the light source of the exposure machine passes through the film (no film during laser exposure) and the protective film and irradiates the dry film to form an anti-corrosion layer with certain graphic characteristics on the board surface.

[0115] Then it passes through the DES line. The DES has three sections: developing section, etching section, and film stripping section. The board passes through the developing section, where the film that is not exposed to light is dissolved under the action of the developer. It passes through the etching section, where the exposed copper is etched away under the action of the acidic etching solution. Finally, it passes through the film stripping section, where the film is removed under the action of the film stripping solution to expose the inner layer circuit pattern.

[0116] In step 3, the L1-L2 and L3-L4 high-frequency boards are pressed together. In step 4, holes that need to be plugged with resin in the high-frequency layer are drilled. In step 5, the holes are plated with copper to make the upper and lower layers conductive. In step 6, the L1 and L4 layer circuits are produced.

[0117] In step 7, pure PP is used for pressing. By utilizing the fluidity of pure PP and the pressure of the pressed steel plate, pure PP automatically flows into the holes of the high-frequency board that need to be plugged with resin.

[0118] In step 8, a mechanical drill is used to drill 0.3mm / 0.25mm through holes from the L1 layer to the L4 layer, and the inner layer L2-L3 layer is connected to other layers through copper deposition + plated copper with a thickness of 20μm.

[0119] In step 10, L1 and L6 layer circuits are produced.

[0120] In step 11, the solder mask ink is printed on the board surface with a silk screen and pre-baked to remove volatilization to form a semi-cured film layer. Through the positional exposure, the illuminated area undergoes a photochemical reaction (chain polymerization) to achieve the effect of selective local hardening without being dissolved by the developer solution. The unexposed area is developed under the action of alkali solution. Finally, at high temperature, the solder mask is completely cured and attached to the board surface.

[0121] In step 13, immersion gold deposits a metal nickel layer and a gold layer on the copper surface through a chemical replacement reaction;

[0122] Embodiment 2, unlike Embodiment 1, discloses:

[0123] Step 1: Cutting the sheet material;

[0124] Step 2: Inner layer imaging;

[0125] Step 3, one-time lamination;

[0126] Step 4: Mechanical drilling;

[0127] Step 5: hole plating;

[0128] Step 6: Internal light imaging;

[0129] Step 7: Secondary pressing;

[0130] Step 8: Mechanical drilling;

[0131] Step 9: Copper deposition and board plating;

[0132] Step 10: outer layer circuit production;

[0133] Step 11, solder resist;

[0134] Step 12: Characters are made in a similar way to solder mask;

[0135] Step 13, immersion gold;

[0136] The primary lamination in step 3 further comprises the following steps:

[0137] S1. PNL board edge design: In order to prevent the pure rubber PP from being too fluid and causing the board to slide, the length and width of PP and pure rubber should be 5mm smaller than that of PNL. A positive and negative opposite pattern should be set in the adjacent PNL edge rail area (the area 5mm away from the board edge). After the lamination is nailed with rivets, the positive and negative opposite patterns will be tightly interlocked like a mortise and tenon structure, reducing the risk of sliding;

[0138] S2, when cutting pp and pure rubber pp, the length and width are 5mm shorter than PNL;

[0139] S3. When designing CAM data, the PNL edge rail area (the area 5mm away from the edge of the board) adjacent to the board edge is set with opposite positive and negative patterns;

[0140] S4. During lamination, the copper blocks in the edge rail area will be tightly inlaid together, reducing the risk of skateboarding.

[0141] In step 1, a cutting machine is used to cut the copper clad laminate into the designed size, and the L1-L2, L3-L4, and L5-L6 core boards with a thickness of 0.4 mm (excluding copper) and a copper thickness of 1 / 10Z are cut out.

[0142] In step 2, the board is pre-processed to remove dirt from the board surface and roughen the copper surface. A dry film is pasted on the board surface using a film laminating machine. The UV light emitted by the light source of the exposure machine passes through the film (no film during laser exposure) and the protective film and irradiates the dry film to form an anti-corrosion layer with certain graphic characteristics on the board surface.

[0143] Then it passes through the DES line. The DES has three sections: developing section, etching section, and film stripping section. The board passes through the developing section, where the film that is not exposed to light is dissolved under the action of the developer. It passes through the etching section, where the exposed copper is etched away under the action of the acidic etching solution. Finally, it passes through the film stripping section, where the film is removed under the action of the film stripping solution to expose the inner layer circuit pattern.

[0144] In step 3, the L1-L2 and L3-L4 high-frequency boards are pressed together. In step 4, holes that need to be plugged with resin in the high-frequency layer are drilled. In step 5, the holes are plated with copper to make the upper and lower layers conductive. In step 6, the L1 and L4 layer circuits are produced.

[0145] In step 7, pure PP is used for pressing. By utilizing the fluidity of pure PP and the pressure of the pressed steel plate, pure PP automatically flows into the holes of the high-frequency board that need to be plugged with resin.

[0146] In step 8, a mechanical drill is used to drill a 0.3mm / 0.25mmL1mm through hole from the L1 layer to the L4 layer, and the copper thickness of the inner layer L2-L3 layer is connected to other layers through copper deposition + plated holes with a thickness of 22μm.

[0147] In step 10, L1 and L6 layer circuits are produced.

[0148] In step 11, the solder mask ink is printed on the board surface with a silk screen and pre-baked to remove volatilization to form a semi-cured film layer. Through the positional exposure, the illuminated area undergoes a photochemical reaction (chain polymerization) to achieve the effect of selective local hardening without being dissolved by the developer solution. The unexposed area is developed under the action of alkali solution. Finally, at high temperature, the solder mask is completely cured and attached to the board surface.

[0149] In step 13, immersion gold deposits a metal nickel layer and a gold layer on the copper surface through a chemical replacement reaction;

[0150] Embodiment 3, unlike Embodiment 2, discloses:

[0151] Step 1: Cutting the sheet material;

[0152] Step 2: internal light imaging;

[0153] Step 3, one-time lamination;

[0154] Step 4: Mechanical drilling;

[0155] Step 5: hole plating;

[0156] Step 6: Internal light imaging;

[0157] Step 7: Secondary pressing;

[0158] Step 8: Mechanical drilling;

[0159] Step 9: Copper deposition and board plating;

[0160] Step 10: outer layer circuit production;

[0161] Step 11, solder resist;

[0162] Step 12: Characters are made in a similar way to solder mask;

[0163] Step 13, immersion gold;

[0164] The primary lamination in step 3 further comprises the following steps:

[0165] S1. PNL board edge design: In order to prevent the pure rubber PP from being too fluid and causing the board to slide, the length and width of PP and pure rubber should be 5mm smaller than that of PNL. A positive and negative opposite pattern should be set in the adjacent PNL edge rail area (the area 5mm away from the board edge). After the lamination is nailed with rivets, the positive and negative opposite patterns will be tightly interlocked like a mortise and tenon structure, reducing the risk of sliding;

[0166] S2, when cutting pp and pure rubber pp, the length and width are 5mm shorter than PNL;

[0167] S3. When designing CAM data, the PNL edge rail area (the area 5mm away from the edge of the board) adjacent to the board edge is set with opposite positive and negative patterns;

[0168] S4. During lamination, the copper blocks in the edge rail area will be tightly inlaid together, reducing the risk of skateboarding.

[0169] In step 1, a cutting machine is used to cut the copper clad laminate into the designed size, and the L1-L2, L3-L4, and L5-L6 core boards with a thickness of 0.4 mm (excluding copper) and a copper thickness of 1 / 10Z are cut out.

[0170] In step 2, the board is pre-processed to remove dirt from the board surface and roughen the copper surface. A dry film is pasted on the board surface using a film laminating machine. The UV light emitted by the light source of the exposure machine passes through the film (no film during laser exposure) and the protective film and irradiates the dry film to form an anti-corrosion layer with certain graphic characteristics on the board surface.

[0171] Then it passes through the DES line. The DES has three sections: developing section, etching section, and film stripping section. The board passes through the developing section, where the film that is not exposed to light is dissolved under the action of the developer. It passes through the etching section, where the exposed copper is etched away under the action of the acidic etching solution. Finally, it passes through the film stripping section, where the film is removed under the action of the film stripping solution to expose the inner layer circuit pattern.

[0172] In step 3, the L1-L2 and L3-L4 high-frequency boards are pressed together. In step 4, holes that need to be plugged with resin in the high-frequency layer are drilled. In step 5, the holes are plated with copper to make the upper and lower layers conductive. In step 6, the L1 and L4 layer circuits are produced.

[0173] In step 7, pure PP is used for pressing. By utilizing the fluidity of pure PP and the pressure of the pressed steel plate, pure PP automatically flows into the holes of the high-frequency board that need to be plugged with resin.

[0174] In step 8, a mechanical drill is used to drill a 0.3mm / 0.25mmL1mm through hole from the L1 layer to the L4 layer, and the copper thickness of the inner layer L2-L3 layer is connected to other layers through copper deposition + plated holes with a thickness of 23μm.

[0175] In step 10, L1 and L6 layer circuits are produced.

[0176] In step 11, the solder mask ink is printed on the board surface with a silk screen and pre-baked to remove volatilization to form a semi-cured film layer. Through the positional exposure, the illuminated area undergoes a photochemical reaction (chain polymerization) to achieve the effect of selective local hardening without being dissolved by the developer solution. The unexposed area is developed under the action of alkali solution. Finally, at high temperature, the solder mask is completely cured and attached to the board surface.

[0177] In step 13, immersion gold deposits a metal nickel layer and a gold layer on the copper surface through a chemical replacement reaction.

[0178] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for making a high-frequency mixed pressure board with a simplified blind hole plugging process, comprising the following steps: Step 1: Cutting the sheet material; Step 2: internal light imaging; Step 3, one-time lamination; Step 4: Mechanical drilling; Step 5: hole plating; Step 6: Internal light imaging; Step 7: Secondary pressing; Step 8: Mechanical drilling; Step 9: Copper deposition and board plating; Step 10: outer layer circuit production; Step 11, solder resist; Step 12: Characters are made in a similar way to solder mask; Step 13: immersion gold; The primary lamination in step 3 further comprises the following steps: S1. PNL board edge design: In order to prevent the pure rubber PP from being too fluid and causing the board to slide, the length and width of PP and pure rubber should be 5mm smaller than that of PNL. A positive and negative opposite pattern should be set in the adjacent PNL edge rail area (the area 5mm away from the board edge). After the lamination is nailed with rivets, the positive and negative opposite patterns will be tightly interlocked like a mortise and tenon structure, reducing the risk of sliding; S2, when cutting pp and pure rubber pp, the length and width are 5mm shorter than PNL; S3. When designing CAM data, the PNL edge rail area (the area 5mm away from the edge of the board) adjacent to the board edge is set with opposite positive and negative patterns; S4. During lamination, the copper blocks in the edge rail area will be tightly inlaid together, reducing the risk of skateboarding.

2. The method for manufacturing a high-frequency mixed pressure board with simplified blind hole plugging process according to claim 1, characterized in that: In the step 1, a cutting machine is used to cut the copper clad laminate into a designed size, and L1-L2, L3-L4, and L5-L6 core boards with a thickness of 0.4 mm (excluding copper) and a copper thickness of 1 / 10Z are cut out.

3. The method for manufacturing a simplified blind hole plugging process of a high-frequency mixed pressure board according to claim 1, characterized in that: In step 2, the board is pre-processed to remove dirt from the board surface and roughen the copper surface, and a dry film is pasted on the board surface using a film laminating machine. The UV light emitted by the light source of the exposure machine passes through the film (no film during laser exposure) and the protective film, and is irradiated onto the dry film to form an anti-corrosion layer with certain graphic characteristics on the board surface; Then it passes through the DES line. The DES has three sections: developing section, etching section, and film stripping section. The board passes through the developing section, where the film that is not exposed to light is dissolved under the action of the developer. It passes through the etching section, where the exposed copper is etched away under the action of the acidic etching solution. Finally, it passes through the film stripping section, where the film is removed under the action of the film stripping solution to expose the inner layer circuit pattern.

4. The method for manufacturing a high-frequency mixed pressure board with simplified blind hole plugging process according to claim 1, characterized in that: In step 3, the L1-L2 and L3-L4 high-frequency boards are pressed together, in step 4, holes that need to be plugged with resin in the high-frequency layer are drilled, in step 5, the holes are plated with copper to make the upper and lower layers conductive, and in step 6, the L1 and L4 layer circuits are produced.

5. The method for manufacturing a high-frequency mixed pressure board with simplified blind hole plugging process according to claim 1, characterized in that: In step 7, pure PP is used for lamination. By utilizing the fluidity of pure PP and the pressure of the laminating steel plates, pure PP automatically flows into the holes of the high-frequency board that need to be plugged with resin.

6. The method for manufacturing a high-frequency mixed pressure board with simplified blind hole plugging process according to claim 1, characterized in that: In step 8, a mechanical drill is used to drill a 0.3mm / 0.25mm through hole from the L1 layer to the L4 layer, and the inner layer L2-L3 layer is connected to other layers by copper deposition + plated copper with a thickness of 20-23μm.

7. The method for manufacturing a high-frequency mixed pressure board with simplified blind hole plugging process according to claim 1, characterized in that: In step 10, L1 and L6 layer circuits are produced.

8. The method for manufacturing a high-frequency mixed pressure board with simplified blind hole plugging process according to claim 1, characterized in that: In the step 11, the solder resist ink is leak-printed on the board surface by a silk screen, and volatilization is removed by pre-baking to form a semi-cured film layer. Through the alignment exposure, the illuminated area undergoes a photochemical reaction (chain polymerization) to achieve the effect of selective local hardening without being dissolved by the developer solution, and the unexposed area is developed under the action of alkali solution. Finally, at high temperature, the solder resist is completely cured and attached to the board surface.

9. The method for manufacturing a high-frequency mixed pressure board with simplified blind hole plugging process according to claim 1, characterized in that: In step 13, the immersion gold deposits a metal nickel layer and a gold layer on the copper surface through a chemical replacement reaction.

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