Directional local coating structure of electronic component and coating implementation method

Abstract

The invention relates to the technical field of chip component coating, in particular to an electronic component directional local coating structure and a coating implementation method.The electronic component directional local coating structure comprises a chip component body, and a first coating layer is arranged on the upper surface of the chip component body; the first coating layer is located in the middle area of the upper surface of the chip component body, the left side face and the right side face of the chip component body are each provided with a second coating layer, and the second coating layers completely cover the left side face and the right side face of the chip component body. The lower surface of the chip component body is provided with a third coating layer, and the third coating layer completely covers the lower surface of the chip component body. The method has the advantages that the coating efficiency of the chip component is improved, and the coating cost is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of chip component encapsulation, and in particular to a structure for directional partial encapsulation of electronic components and a method for achieving encapsulation. Background Art

[0002] In the production and manufacturing of chip components, electrodes are usually realized by electroplating. In the case of electronic components with low resistivity, the areas that do not need to be electroplated need to be insulated and coated accordingly during the electroplating process to avoid electroplating in the areas that do not need to be electroplated.

[0003] At present, 360° full coating treatment is a common method, that is, the surface of the component is fully coated with insulating material, and then the insulating layer of the electrode area is removed through post-processing processes such as laser stripping or chemical etching to expose the electrode substrate for electroplating. However, this treatment method has the disadvantages of high complexity, cost issues, poor environmental protection and low efficiency. It requires additional post-processing steps, increases process complexity and production costs, and has a certain impact on the environment. Summary of the invention In order to improve the coating efficiency of chip components and reduce the coating cost, the present application provides a structure for directional partial coating of electronic components and a coating implementation method.

[0004] The present application provides a structure for directional partial coating of electronic components and a coating realization method using the following technical solutions: A directional local coating structure for electronic components comprises a chip component body, the upper surface of the chip component body is provided with a first coating, the first coating is located in the middle area of ​​the upper surface of the chip component body, the left and right sides of the chip component body are provided with a second coating, the second coating completely covers the left and right sides of the chip component body, and the lower surface of the chip component body is provided with a third coating, the third coating completely covers the lower surface of the chip component body.

[0005] A method for realizing a directional local coating structure of an electronic component, which is used to realize the above-mentioned directional local coating structure of an electronic component, comprises the following steps: S1: Use a 400-mesh screen printer to print ink on the middle of the upper surface of the chip component body to form an insulating coating of 1.65*0.8mm with a thickness of 15~30 microns to ensure the insulation effect outside the electrode area; S2: Use a roller coater to apply ink on the lower surface of the chip component body and the left and right side surfaces of the chip component body. The ink thickness is also controlled at 15~30 microns to ensure the insulation coating effect on the side. The vertical flow is controlled at 0~0.15mm to avoid excessive ink affecting subsequent processes; S3: Place the printed and coated components in an oven or use a UV lamp for curing to ensure that the ink is fully cured to form a stable insulating coating; S4: Electroplating is performed on the exposed electrode area to form an electrode, ensuring good contact and conductivity between the electrode and the bulk material; S4: After electroplating, necessary post-processing is carried out, including cleaning and drying, followed by quality inspection to ensure the performance and reliability of components.

[0006] Preferably, the method uses a 400-mesh screen printer to print ink on the middle of the upper surface of the chip component body to form an insulating coating of 1.65*0.8 mm, with a thickness controlled at 15-30 microns to ensure the insulation effect outside the electrode area, including the following steps: S11: Design and produce a 400 mesh screen printing template according to the precise size and position of the electrode area to ensure the precise match between the template and the electrode area; S12: Precisely mix epoxy resin ink or UV ink, and adjust the viscosity and fluidity of the ink to meet the process requirements of the screen printer; S13: Use a 400-mesh screen printer to evenly print the prepared ink on the designated area on the upper surface of the chip component body, and control the printing thickness to 15-30 microns; S14: Perform quality inspection on the upper surface of the printed chip component body to check the uniformity, thickness and position accuracy of the ink layer, and make corrections if necessary.

[0007] Preferably, the ink is applied on the lower surface of the chip component body and the left and right side surfaces of the chip component body by a roller coater, and the ink thickness is also controlled at 15-30 microns to ensure the insulation coating effect of the side, and the vertical flow is controlled at 0-0.15 mm to avoid excessive ink affecting subsequent processes, including the following steps: S21: According to the process requirements of the roller coater, adjust the viscosity and fluidity of the ink to ensure that the ink is suitable for the roller coating process and avoid bubbles or unevenness during the coating process; S22: Use a roller coater to apply ink on the lower surface of the chip component body and the left and right side surfaces of the chip component body, and control the ink thickness to 15-30 microns to ensure the insulation coating effect of the side; S23: During the coating process, the viscosity and coating speed of the ink are adjusted to control the side sag at 0~0.15mm to avoid excessive ink affecting subsequent processes and ensure the stability and uniformity of the ink layer; S24: Additional processing is performed on the edges of the lower surface of the chip component body and the left and right side surfaces of the chip component body, using special tools or methods to ensure the integrity and uniformity of the ink layer at the edges.

[0008] Preferably, the printed and coated components are placed in an oven or cured using a UV lamp to ensure that the ink is fully cured to form a stable insulating coating, comprising the following steps: S31: According to the curing characteristics of the ink, set the temperature and time of the oven to ensure that the ink is fully cured at an appropriate temperature; S32: Use UV lamp to irradiate the ink layer to accelerate the curing process, improve production efficiency, and ensure the curing speed and quality of the ink layer; S33: After solidification, cool the components using cooling equipment or natural cooling to avoid deformation or damage caused by excessive temperature and ensure the dimensional stability and structural integrity of the components; S34: Perform quality inspection on the cured ink layer, including the hardness, adhesion and insulation performance of the ink layer, to ensure that the curing effect meets the requirements of subsequent processes.

[0009] Preferably, the electroplating is performed on the exposed electrode area to form the electrode to ensure good contact and conductivity between the electrode and the bulk material, comprising the following sub-steps: S41: pre-treating the exposed electrode area, including cleaning, activation and pre-plating, using cleaning agents and activators, controlling the cleaning time and activation time, and ensuring the cleanliness and activity of the electrode area; S42: In the plating tank, the electrode area is plated, using the plating solution and the plating equipment, controlling the plating time and current density, and ensuring the uniformity and thickness of the electrode; S43: Precisely control the current, time, temperature and pH parameters during the electroplating process, and use the electroplating parameter control equipment to ensure the uniformity and thickness of the electroplated layer; S44: After completing electroplating, necessary post-processing is performed, including cleaning, drying and annealing, using cleaning agents and drying equipment, controlling the cleaning time and drying temperature, and ensuring the cleanliness and dryness of the electrode.

[0010] Preferably, after the electroplating is completed, necessary post-processing is performed, including cleaning and drying, and then quality inspection is performed to ensure the performance and reliability of the components, including the following steps: S41: Clean and dry the electroplated components, use cleaning agents and drying equipment, and control the cleaning time and drying temperature; S42: Conduct electrical performance tests on components, including resistance, inductance and frequency characteristics, use test equipment and test methods, and control test conditions and test accuracy; S43: Conduct durability tests, including temperature cycling, humidity testing and vibration testing, use test equipment and test methods, and control test conditions and test time; S44: Perform final quality control on components, including appearance inspection, dimensional measurement and performance testing, use inspection equipment and inspection methods, and control inspection conditions and inspection accuracy.

[0011] Preferably, the method uses a 400-mesh screen printer to print ink on the middle of the upper surface of the chip component body to form an insulating coating of 1.65*0.8mm with a thickness controlled at 15-30 microns to ensure the insulation effect outside the electrode area, and includes the following steps: A1: Based on design requirements, computer-aided design software is used to virtually model the electrode area; A2: Use electromagnetic field simulation software to perform electromagnetic field simulation analysis on the electrode area to optimize the layout and size of the electrode area.

[0012] Preferably, the first coating layer, the second coating layer and the third coating layer are all formed by volatile organic compounds.

[0013] In summary, the present application includes at least one of the following beneficial technical effects: 1. The directional coating solution uses low-VOC materials, which significantly reduces the emission of volatile organic compounds and the impact on the environment. At the same time, it avoids the high equipment investment of the laser paint stripping machine, reduces production costs, and improves the overall economic benefits; 2. Using a 400-mesh screen printer and a roller coater for directional coating not only improves production efficiency, but also ensures the uniformity and consistency of the coating, effectively controls the sag, and ensures the insulation coating effect. At the same time, the precise application of chemical etching and electroplating processes ensures the reliability and conductivity of the electrode area, improving the overall quality of the product; 3. The implementation method of directional local coating structure, combined with low-VOC materials and directional coating technology, embodies process innovation and sustainability, provides a more environmentally friendly, efficient and economical solution for the electronic component manufacturing industry, and promotes the green transformation and sustainable development of the industry. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of a directional local coating structure of an electronic component according to an embodiment of the present application.

[0015] Figure 2 It is a flow chart of a method for implementing the coating of a directional local coating structure of an electronic component in an embodiment of the present application.

[0016] Figure 3 It is a flowchart of the sub-steps of step S1 in the embodiment of the present application.

[0017] Figure 4 It is a flowchart of the sub-steps of step S2 in the embodiment of the present application.

[0018] Figure 5 It is a flowchart of the sub-steps of step S3 in the embodiment of the present application.

[0019] Figure 6 It is a flowchart of the sub-steps of step S4 in the embodiment of the present application.

[0020] Figure 7 It is a flowchart of the sub-steps of step S4 in the embodiment of the present application.

[0021] Figure 8 It is a flow chart of steps A1-A2 in an embodiment of the present application.

[0022] Explanation of the reference numerals: 1. Chip component body; 2. First coating layer; 3. Second coating layer; 4. Third coating layer. DETAILED DESCRIPTION

[0023] The following is combined with Figure 1-Figure 8 This application is described in further detail.

[0024] Reference Figure 1 , the embodiment of the present application discloses a structure for directional partial coating of electronic components and a coating realization method. Figure 1 A structure for directional partial encapsulation of electronic components and a method for encapsulation implementation include a chip component body, a first encapsulation coating 2 is provided on the upper surface of the chip component body, the first encapsulation coating 2 is located in the middle area of ​​the upper surface of the chip component body, the left and right sides of the chip component body are provided with a second encapsulation coating 3, the second encapsulation coating 3 completely covers the left and right sides of the chip component body, and a third encapsulation coating 4 is provided on the lower surface of the chip component body, and the third encapsulation coating 4 completely covers the lower surface of the chip component body.

[0025] In this embodiment, the first coating layer 2, the second coating layer 3 and the third coating layer 4 are all formed of volatile organic compounds, that is, low-VOC environmentally friendly materials. Compared with traditional solvent-based coatings, the low-VOC materials release significantly less harmful volatile organic compounds during the coating process, thereby reducing pollution to the environment and complying with the concepts of green manufacturing and sustainable development.

[0026] Among them, by precisely controlling the edge position of the first coating layer 2, accurate exposure of the electrode area is ensured, which facilitates subsequent electroplating and welding operations and avoids unnecessary material waste. At the same time, the coverage of the second coating layer 3 can be fine-tuned to accommodate chip components of different sizes and shapes, ensuring that while providing adequate protection, it does not affect the heat dissipation and signal transmission of the components. In addition, in this embodiment, the third coating layer 4 can be designed to have a microstructure or special texture to enhance adhesion to the mounting substrate, while providing additional mechanical buffering to reduce damage caused by vibration or impact.

[0027] Reference Figure 2 In this embodiment, a method for implementing the directional local covering structure of an electronic component is also disclosed, which is used to implement the above-mentioned directional local covering structure of an electronic component, and includes the following steps: S1: Use a 400-mesh screen printer to print ink on the middle of the upper surface of the chip component body to form a 1.65*0.8mm insulating coating with a thickness of 15~30 microns to ensure the insulation effect outside the electrode area.

[0028] Reference Figure 3 , step S1 correspondingly includes the following sub-steps: S11: Design and produce a 400 mesh screen printing template according to the precise size and position of the electrode area to ensure the precise match between the template and the electrode area.

[0029] S12: Precisely mix epoxy resin ink or UV ink, and adjust the viscosity and fluidity of the ink to meet the process requirements of the screen printing machine.

[0030] S13: Use a 400-mesh screen printer to evenly print the prepared ink on the designated area on the upper surface of the chip component body, and control the printing thickness to 15 to 30 microns.

[0031] S14: Perform quality inspection on the upper surface of the printed chip component body to check the uniformity, thickness and position accuracy of the ink layer, and make corrections if necessary.

[0032] The following examples are given to illustrate steps S11 to S14.

[0033] Taking the chip inductor of 2.01.61.0 as an example, the specific path to implement the above sub-steps is as follows: According to the precise size (1.65*0.8mm) and position of the electrode area, a 400-mesh screen printing template is designed to ensure that the openings of the template are precisely matched with the electrode area to achieve accurate printing of the ink.

[0034] Accurately mix epoxy resin ink or UV ink, adjust the viscosity and fluidity of the ink to ensure that the ink can adapt to the process requirements of the screen printer, and control the thickness of the ink between 15 and 30 microns to meet the insulation and protection requirements of the chip inductor.

[0035] Use a 400-mesh screen printer to evenly print the prepared ink on the designated area of ​​the upper surface (side B) of the chip inductor body, control the printing thickness between 15 and 30 microns, ensure that the uniformity and thickness of the ink layer meet the requirements, and the printing size is 1.65*0.8mm, centered on the upper surface of the inductor body.

[0036] After printing, the upper surface of the chip inductor body is inspected for quality, and the uniformity, thickness and position accuracy of the ink layer are checked to ensure that the printing effect meets the design requirements. If necessary, the printing effect is corrected to achieve the best insulation coating effect.

[0037] Replay Figure 2 , the following steps are also included after step S1.

[0038] S2: Use a roller coater to apply ink on the lower surface of the chip component body and the left and right side surfaces of the chip component body. The ink thickness is also controlled at 15~30 microns to ensure the insulation coating effect on the side. The vertical flow is controlled at 0~0.15mm to avoid excessive ink affecting subsequent processes.

[0039] Reference Figure 4 , step S2 correspondingly includes the following sub-steps.

[0040] S21: According to the process requirements of the roller coater, adjust the viscosity and fluidity of the ink to ensure that the ink is suitable for the roller coating process and avoid bubbles or unevenness during the coating process.

[0041] S22: Use a roller coater to apply ink on the lower surface of the chip component body and the left and right side surfaces of the chip component body, and control the ink thickness to 15~30 microns to ensure the insulation coating effect on the side.

[0042] S23: During the coating process, the viscosity and coating speed of the ink are adjusted to control the side sag at 0~0.15mm to avoid excessive ink affecting subsequent processes and ensure the stability and uniformity of the ink layer.

[0043] S24: Additional processing is performed on the edges of the lower surface of the chip component body and the left and right side surfaces of the chip component body, using special tools or methods to ensure the integrity and uniformity of the ink layer at the edges.

[0044] For steps S21-S24, the embodiment of the present application provides the following examples.

[0045] According to the process requirements of the roller coater, adjust the viscosity and fluidity of the ink to ensure that the ink is suitable for the roller coating process, avoid bubbles or unevenness during the coating process, and achieve uniform coating on the lower surface and sides.

[0046] Use a roller coater to apply ink on the lower surface and left and right sides of the chip inductor body, and control the ink thickness to 15~30 microns to ensure the insulation coating effect on the side while maintaining the stability and uniformity of the ink layer.

[0047] During the coating process, the viscosity and coating speed of the ink are adjusted to control the side sag at 0~0.15mm to avoid excessive ink affecting subsequent processes and ensure the stability and uniformity of the ink layer on the side to avoid uneven distribution affecting the performance and appearance of components.

[0048] The edges of the lower surface and the left and right side surfaces of the chip inductor body are additionally processed using special tools or methods to ensure the integrity and uniformity of the ink layer at the edges, and to avoid the ink layer at the edges being too thin or discontinuous, which would affect the overall insulation effect and mechanical strength.

[0049] Replay Figure 2 , the following steps are also included after step S2.

[0050] S3: Place the printed and coated components in an oven or use UV lamp for curing to ensure that the ink is fully cured to form a stable insulating coating.

[0051] Reference Figure 5 , step S3 correspondingly includes the following sub-steps.

[0052] S31: According to the curing characteristics of the ink, set the temperature and time of the oven to ensure that the ink is fully cured at an appropriate temperature.

[0053] S32: Use UV lamp to irradiate the ink layer to accelerate the curing process, improve production efficiency, and ensure the curing speed and quality of the ink layer.

[0054] S33: After curing, cool the components using cooling equipment or natural cooling to avoid deformation or damage caused by excessive temperature and ensure the dimensional stability and structural integrity of the components.

[0055] S34: Perform quality inspection on the cured ink layer, including the hardness, adhesion and insulation performance of the ink layer, to ensure that the curing effect meets the requirements of subsequent processes.

[0056] In this embodiment, steps S31 to S34 are described by way of example below.

[0057] Taking the chip inductor of 2.01.61.0 as an example, the specific path to implement the above sub-steps is as follows: According to the curing characteristics of the ink, the temperature of the oven is set between 120°C and 150°C, and the time is controlled between 30 and 60 minutes to ensure that the ink is fully cured at an appropriate temperature to achieve the best physical and chemical properties.

[0058] Use UV lamp to irradiate the ink layer, the irradiation intensity is controlled at 800 to 1200mW / cm², and the irradiation time is 10 to 30 seconds to accelerate the curing process and improve production efficiency. At the same time, the curing speed and quality of the ink layer are ensured to meet the production needs of high efficiency and high quality.

[0059] After curing, the components are cooled down to room temperature (20°C to 25°C) using cooling equipment or natural cooling to avoid deformation or damage caused by excessive temperature, ensure the dimensional stability and structural integrity of the components, and provide a stable foundation for subsequent processes.

[0060] The quality of the cured ink layer is checked, including the hardness, adhesion and insulation performance of the ink layer, to ensure that the curing effect meets the requirements of subsequent processes. The hardness test uses a Shore hardness tester, the adhesion test uses the cross-cut method, and the insulation performance test uses an insulation resistance tester to ensure that the comprehensive performance of the ink layer meets the design standards.

[0061] Replay Figure 2 , after step S3, the following steps are also included.

[0062] S4: Electroplating is performed on the exposed electrode area to form an electrode, ensuring good contact and conductivity between the electrode and the bulk material; Reference Figure 6 , step S4 correspondingly includes the following sub-steps.

[0063] S41: Pre-treat the exposed electrode area, including cleaning, activation and pre-plating, use cleaning agents and activators, control the cleaning time and activation time, and ensure the cleanliness and activity of the electrode area.

[0064] S42: In the plating tank, the electrode area is plated, using plating solution and plating equipment, controlling the plating time and current density, and ensuring the uniformity and thickness of the electrode.

[0065] S43: Precisely control the current, time, temperature and pH parameters during the electroplating process, and use electroplating parameter control equipment to ensure the uniformity and thickness of the electroplated layer.

[0066] S44: After completing electroplating, necessary post-processing is performed, including cleaning, drying and annealing, using cleaning agents and drying equipment, controlling the cleaning time and drying temperature, and ensuring the cleanliness and dryness of the electrode.

[0067] For steps S41-S44, the embodiment of the present application provides the following examples.

[0068] Taking the chip inductor of 2.01.61.0 as an example, the specific path to implement the above sub-steps is as follows: Pre-treat the exposed electrode area, including cleaning, activation and pre-plating. Use cleaning agents (such as isopropyl alcohol, acetone, etc.) and activating agents (such as sulfuric acid, nitric acid, etc.), control the cleaning time and activation time, ensure the cleanliness and activity of the electrode area, and provide a good substrate for the subsequent electroplating process.

[0069] In the electroplating tank, the electrode area is electroplated using electroplating solution (such as copper sulfate, nickel sulfate, etc.) and electroplating equipment to control the electroplating time and current density to ensure the uniformity and thickness of the electrode in order to achieve the required electroplating layer thickness and electrical properties.

[0070] Precisely control the current, time, temperature and pH parameters during the electroplating process, and use electroplating parameter control equipment such as constant current power supply, temperature controller and pH meter to ensure the uniformity and thickness of the electroplating layer and avoid defects in the electroplating layer such as pinholes, cracks or uneven distribution.

[0071] After electroplating, necessary post-treatment is performed, including cleaning, drying and annealing. Use cleaning agents (such as deionized water, isopropyl alcohol, etc.) and drying equipment (such as hot air dryer, vacuum drying oven, etc.), control the cleaning time and drying temperature, ensure the cleanliness and dryness of the electrode, and perform annealing at the same time to improve the adhesion and electrical properties of the electroplating layer.

[0072] Replay Figure 2 , the following steps are also included after step S4.

[0073] S4: After electroplating, necessary post-processing is carried out, including cleaning and drying, followed by quality inspection to ensure the performance and reliability of components.

[0074] Reference Figure 7 , step S4 correspondingly includes the following sub-steps.

[0075] S41: Clean and dry the electroplated components, use cleaning agents and drying equipment, and control the cleaning time and drying temperature.

[0076] S42: Conduct electrical performance tests on components, including resistance, inductance and frequency characteristics, using test equipment and test methods, and controlling test conditions and test accuracy.

[0077] S43: Conduct durability tests, including temperature cycling, humidity testing, and vibration testing, using test equipment and test methods, and controlling test conditions and test time.

[0078] S44: Perform final quality control on components, including appearance inspection, dimensional measurement and performance testing, use inspection equipment and inspection methods, and control inspection conditions and inspection accuracy.

[0079] The following examples are given for steps S41-S44.

[0080] Clean and dry the electroplated components, use cleaning agents (such as deionized water, isopropyl alcohol, etc.) and drying equipment (such as hot air dryer, vacuum drying oven, etc.), control the cleaning time and drying temperature, ensure the cleanliness and dryness of the component surface, and provide good conditions for subsequent testing and inspection.

[0081] Conduct electrical performance tests on components, including resistance, inductance and frequency characteristics, use test equipment (such as LCR tester, network analyzer, etc.) and test methods, control test conditions and test accuracy, and ensure that the electrical performance of components meets the design requirements, including key parameters such as resistance value, inductance value and frequency response.

[0082] Conduct durability tests, including temperature cycling, humidity testing, and vibration testing, using test equipment (such as temperature cycling chambers, humidity chambers, and vibration tables, etc.) and test methods, controlling test conditions and test time, to ensure the stability and reliability of components under various environmental conditions, including performance under harsh conditions such as high temperature, low temperature, high humidity, and vibration.

[0083] Carry out final quality control on components, including appearance inspection, dimensional measurement and performance testing, use inspection equipment (such as microscopes, calipers and testers, etc.) and inspection methods, control inspection conditions and inspection accuracy, and ensure that the appearance, size and performance of components meet the design requirements, including key indicators such as no defects in appearance, high dimensional accuracy and stable performance.

[0084] On the other hand, refer to Figure 8 , before step S1, comprising the following steps: A1: Based on design requirements, computer-aided design software is used to virtually model the electrode area; A2: Use electromagnetic field simulation software to perform electromagnetic field simulation analysis on the electrode area to optimize the layout and size of the electrode area.

[0085] The implementation principle of the structure and method for directional partial coating of electronic components in the embodiment of the present application is as follows: Precisely coat specific areas of electronic components to protect sensitive areas while keeping other areas open to meet electrical performance and heat dissipation requirements. The specific implementation steps include: first, accurately position the electronic components and use positioning tools or equipment to ensure the accuracy of the coating area; then, mask the areas that do not need to be coated, and use masking tape or masking covers to prevent the coating material from adhering to non-target areas; then, select suitable coating materials such as epoxy resin, silicone or polyurethane according to design requirements, and perform pretreatment to ensure the uniformity and fluidity of the material; then, use precision glue application equipment to accurately apply the coating material to the target area, control the amount and speed of glue application, and ensure the uniformity and thickness of the coating; finally, cure the applied coating material, and use curing equipment to control the curing time and temperature to ensure the curing degree and performance of the coating. Through this series of steps, directional local coating of electronic components is achieved to improve their reliability and service life, while maintaining electrical performance and heat dissipation performance to meet high-precision and high-reliability application requirements.

[0086] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A directional local coating structure for electronic components, characterized in that: The invention comprises a chip component body, wherein the upper surface of the chip component body is provided with a first encapsulating coating (2), the first encapsulating coating (2) is located in the middle area of ​​the upper surface of the chip component body, the left and right side surfaces of the chip component body are provided with a second encapsulating coating (3), the second encapsulating coating (3) completely covers the left and right side surfaces of the chip component body, and the lower surface of the chip component body is provided with a third encapsulating coating (4), the third encapsulating coating (4) completely covers the lower surface of the chip component body.

2. A method for implementing a directional partial covering structure of an electronic component, used to implement a directional partial covering structure of an electronic component as claimed in claim 1, characterized in that: The following steps are involved: S1: Use a 400-mesh screen printer to print ink on the middle of the upper surface of the chip component body to form an insulating coating of 1.65*0.8mm with a thickness of 15~30 microns to ensure the insulation effect outside the electrode area; S2: Use a roller coater to apply ink on the lower surface of the chip component body and the left and right side surfaces of the chip component body. The ink thickness is also controlled at 15~30 microns to ensure the insulation coating effect on the side. The vertical flow is controlled at 0~0.15mm to avoid excessive ink affecting subsequent processes; S3: Place the printed and coated components in an oven or use a UV lamp for curing to ensure that the ink is fully cured to form a stable insulating coating; S4: Electroplating is performed on the exposed electrode area to form an electrode, ensuring good contact and conductivity between the electrode and the bulk material; S4: After electroplating, necessary post-processing is carried out, including cleaning and drying, followed by quality inspection to ensure the performance and reliability of components.

3. The method for implementing the directional partial coating structure of an electronic component according to claim 2, characterized in that: The method uses a 400-mesh screen printer to print ink on the middle of the upper surface of the chip component body to form an insulating coating of 1.65*0.8 mm, with a thickness controlled at 15-30 microns to ensure the insulation effect outside the electrode area, including the following steps: S11: Design and produce a 400 mesh screen printing template according to the precise size and position of the electrode area to ensure the precise match between the template and the electrode area; S12: Precisely mix epoxy resin ink or UV ink, and adjust the viscosity and fluidity of the ink to meet the process requirements of the screen printer; S13: Use a 400-mesh screen printer to evenly print the prepared ink on the designated area on the upper surface of the chip component body, and control the printing thickness to 15-30 microns; S14: Perform quality inspection on the upper surface of the printed chip component body to check the uniformity, thickness and position accuracy of the ink layer, and make corrections if necessary.

4. The method for implementing the directional partial coating structure of an electronic component according to claim 2, characterized in that: The roller coater is used to apply ink on the lower surface of the chip component body and the left and right side surfaces of the chip component body. The ink thickness is also controlled at 15-30 microns to ensure the insulation coating effect of the side. The vertical flow is controlled at 0-0.15mm to avoid excessive ink affecting subsequent processes, including the following steps: S21: According to the process requirements of the roller coater, adjust the viscosity and fluidity of the ink to ensure that the ink is suitable for the roller coating process and avoid bubbles or unevenness during the coating process; S22: Use a roller coater to apply ink on the lower surface of the chip component body and the left and right side surfaces of the chip component body, and control the ink thickness to 15-30 microns to ensure the insulation coating effect of the side; S23: During the coating process, the viscosity and coating speed of the ink are adjusted to control the side sag at 0~0.15mm to avoid excessive ink affecting subsequent processes and ensure the stability and uniformity of the ink layer; S24: Additional processing is performed on the edges of the lower surface of the chip component body and the left and right side surfaces of the chip component body, using special tools or methods to ensure the integrity and uniformity of the ink layer at the edges.

5. The method for implementing the coating of a directional local coating structure of an electronic component according to claim 2, characterized in that: The printed and coated components are placed in an oven or cured using a UV lamp to ensure that the ink is fully cured to form a stable insulating coating, including the following steps: S31: According to the curing characteristics of the ink, set the temperature and time of the oven to ensure that the ink is fully cured at an appropriate temperature; S32: Use UV lamp to irradiate the ink layer to accelerate the curing process, improve production efficiency, and ensure the curing speed and quality of the ink layer; S33: After solidification, cool the components using cooling equipment or natural cooling to avoid deformation or damage caused by excessive temperature and ensure the dimensional stability and structural integrity of the components; S34: Perform quality inspection on the cured ink layer, including the hardness, adhesion and insulation performance of the ink layer, to ensure that the curing effect meets the requirements of subsequent processes.

6. The method for implementing the directional partial coating structure of an electronic component according to claim 2, characterized in that: The step of electroplating the exposed electrode area to form an electrode and ensuring good contact and conductivity between the electrode and the bulk material comprises the following sub-steps: S41: pre-treating the exposed electrode area, including cleaning, activation and pre-plating, using cleaning agents and activating agents, controlling the cleaning time and activation time, and ensuring the cleanliness and activity of the electrode area; S42: In the plating tank, the electrode area is plated, using the plating solution and the plating equipment, controlling the plating time and current density, and ensuring the uniformity and thickness of the electrode; S43: Precisely control the current, time, temperature and pH parameters during the electroplating process, and use the electroplating parameter control equipment to ensure the uniformity and thickness of the electroplated layer; S44: After completing electroplating, necessary post-processing is performed, including cleaning, drying and annealing, using cleaning agents and drying equipment, controlling the cleaning time and drying temperature, and ensuring the cleanliness and dryness of the electrode.

7. The method for implementing the directional partial coating structure of an electronic component according to claim 7, characterized in that: After the electroplating is completed, necessary post-processing is performed, including cleaning and drying, and then quality inspection is performed to ensure the performance and reliability of the components, including the following steps: S41: Clean and dry the electroplated components, use cleaning agents and drying equipment, and control the cleaning time and drying temperature; S42: Conduct electrical performance tests on components, including resistance, inductance and frequency characteristics, use test equipment and test methods, and control test conditions and test accuracy; S43: Conduct durability tests, including temperature cycling, humidity testing and vibration testing, use test equipment and test methods, and control test conditions and test time; S44: Perform final quality control on components, including appearance inspection, dimensional measurement and performance testing, use inspection equipment and inspection methods, and control inspection conditions and inspection accuracy.

8. The method for implementing the coating of a directional local coating structure of an electronic component according to claim 7, characterized in that: The method uses a 400-mesh screen printer to print ink on the middle of the upper surface of the chip component body to form an insulating coating of 1.65*0.8mm with a thickness of 15-30 microns to ensure the insulation effect outside the electrode area, including the following steps: A1: Based on design requirements, computer-aided design software is used to virtually model the electrode area; A2: Use electromagnetic field simulation software to perform electromagnetic field simulation analysis on the electrode area to optimize the layout and size of the electrode area.

9. The method for implementing the coating of a directional local coating structure of an electronic component according to claim 2, characterized in that The first coating layer (2), the second coating layer (3) and the third coating layer (4) are all formed by volatile organic compounds.

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