Method for manufacturing rigid-flex printed circuit board with flexible board perpendicular to board surface

Abstract

The invention discloses a method for manufacturing a rigid-flex board with a flexible board perpendicular to a board surface, which comprises the following steps of: attaching a covering film to a partial region of the flexible board, bonding the rest partial region with a rigid board to form a rigid-flex bearing board, and sequentially manufacturing a windowing core board, a windowing covering board and a windowing release layer to form the rigid-flex bearing board. The plate layer is sequentially stacked and then pressed with a release layer and a single-face copper-clad plate, the covering film area of the flexible plate sequentially penetrates through the core plate windowing pattern, the release windowing pattern and the covering plate windowing pattern, and then the whole plate is formed to form the rigid-flexible combined plate; the flexible board is designed to extend out from the plane direction of the board surface of the rigid board to form a structure perpendicular to the board surface, so that the space is effectively utilized, the overall volume of the circuit board is compressed, the design flexibility is enhanced, and more design possibilities are provided for circuit design needing to be bent or folded; effective cooperation is formed before and after the whole machining process, and high-precision machining is achieved.

Description

Technical Field

[0001] The invention relates to the field of rigid-flexible board manufacturing, and in particular to a method for manufacturing a rigid-flexible board in which a flexible board is perpendicular to a board surface. Background Art

[0002] Rigid-flex PCBs are favored by many electronic modules for their flexible assembly characteristics and reliability. With the rapid development of low-altitude aircraft, intelligent connected vehicles and other fields, the demand for rigid-flex PCBs is increasing, which also brings new challenges to the design and processing technology of new rigid-flex PCBs.

[0003] At present, the rigid-flexible board is generally designed in that the flexible board and the rigid board are located on the same horizontal plane, and the flexible board extends out from the side of the rigid board; further, the manufacturing method usually adopts a lamination and pressing method to form a multi-layer circuit board structure, and then "opens the cover" to remove the corresponding rigid board layer covering the surface of the flexible board in the flexible area, exposing the flexible board, and forming a rigid-flexible board.

[0004] In some electronic modules that have requirements for installation space and need to realize complex functions, flexible boards extend from the plane direction of the board surface of the rigid board, forming a rigid-flexible board structure in which the flexible board "stands on" the horizontal surface of the rigid board and the flexible board is perpendicular to the board surface. When used, the flexible board can be plugged in or welded to other electronic components, while the rigid board plays the role of carrying electronic components and fixing the installation.

[0005] Currently, no method for manufacturing such a rigid-flexible board has been found. Therefore, it is necessary to provide a method for manufacturing a rigid-flexible board in which the flexible board is perpendicular to the board surface. Summary of the invention

[0006] The present invention provides a method for manufacturing a rigid-flexible board in which a flexible board is perpendicular to a board surface, and the manufacturing method comprises the following steps: S10: Take a first single-sided copper clad laminate, make a circuit pattern, a solder resist layer and a core board window pattern, and form a core board with a window; the solder resist layer has a single side smaller than the insulating dielectric layer of the core board with a window; S20: taking a prepreg, making a prepreg window pattern, the window prepreg pattern corresponds to the core board window pattern, and forming a window cover plate; then taking a release layer, making a release window pattern, and forming a window release layer, the release window pattern corresponds to the core board window pattern; the size of the window release layer is smaller than that of the window cover plate on one side; S30: taking a flexible board and a rigid board, bonding a part of the plane of the flexible board to the rigid board dielectric layer of the rigid board to form a bonding area, and attaching a covering film to the remaining part of the plane to form a bending area, thereby forming a rigid-flex load-bearing board as a whole; S40: Take the release layer and the second single-sided copper clad laminate, stack the rigid-flex load board, the window core board, the window release layer, the window cover board, the release layer and the second single-sided copper clad laminate in sequence to form a stacked structure, and then press them together to form a pressed board; the bending area in the stacked structure passes through the core board window pattern, the release window pattern and the cover board window pattern in sequence, and the edge of the covering film in the bending area is located within the height range of the window core board; S50: molding the laminated board, removing the window release layer, the window cover board, the release layer and the second single-sided copper clad board, to form a rigid-flexible board in which the flexible board is perpendicular to the board surface.

[0007] Furthermore, the windowed cover plate is formed by taking a single-sided copper-clad laminate, sequentially making a cover plate copper layer pattern and a cover plate window pattern, to form the windowed cover plate; the cover plate window pattern corresponds to the core plate window pattern.

[0008] Furthermore, the cover plate dielectric layer of the window cover plate or the prepreg of the window cover plate are both high-flow adhesive prepregs with an adhesive content of 60% to 68%.

[0009] Furthermore, one side of the release layer is smaller than that of the second single-sided copper clad laminate.

[0010] Furthermore, a single side of the release window pattern is smaller than or equal to that of the core board window pattern.

[0011] Furthermore, one side of the window pattern of the cover plate is larger than the window pattern of the release plate.

[0012] Furthermore, forming the pressed plate includes fixing the stacked structure by riveting, and then pressing to form the pressed plate.

[0013] Furthermore, the pressing is performed by slow heating with a heating rate of 1.8°C / min to 2.2°C / min, a maximum temperature of 160°C to 180°C, a maximum temperature pressing time of 20min to 40min, and a slow cooling method with a cooling rate of 3.8°C / min to 4.5°C / min.

[0014] Furthermore, the forming includes performing controlled-depth milling on the laminate from the core panel window pattern toward the edge of the laminate, and the depth of the controlled-depth milling is from the panel surface of the laminate to the window release layer.

[0015] Furthermore, forming a rigid-flexible board in which the flexible board is perpendicular to the board surface also includes dispensing glue at the junction of the flexible board and the rigid board.

[0016] The technical solution of the present invention provides a rigid-flexible board in which the flexible board is perpendicular to the board surface. The flexible board extends from the plane direction of the board surface of the rigid board to form a structure perpendicular to the board surface. On the one hand, effective use of space is achieved, and the overall volume of the circuit board is compressed, which is particularly suitable for miniaturized and high-density integrated electronic devices. On the other hand, the design flexibility is enhanced, and more design possibilities are provided for circuit designs that need to be bent or folded. The overall processing process adopts a method in which multiple layers of auxiliary core boards are involved in the processing and then removed. The outer layer of the rigid board is first changed to the inner layer core board to prevent the problem that the outer layer circuit pattern and solder mask of the rigid board are difficult to process due to the flexible board extending out of the board surface. Then, the window relationship between the core boards of each layer is formed, and a channel for the flexible board to extend from the plane direction of the board surface of the rigid board is provided. The core board layers are sequentially manufactured, and the stacked structure of auxiliary layers such as the release layer and the coating layer is designed during the subsequent pressing and typesetting, and the molding is coordinated. The auxiliary layer is removed during the forming process to expose the surface circuit pattern and the solder mask layer. The entire processing process forms an effective coordination before and after to achieve high-precision processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0018] Figure 1 Schematic diagram of the process flow of an embodiment of the present invention; Figure 2 A schematic plan view of a window core board according to an embodiment of the present invention; Figure 3 for Figure 2 AA cross-sectional diagram of ; Figure 4 Schematic diagram of the cross-sectional structure of a window covering plate according to an embodiment of the present invention; Figure 5 Schematic diagram of the cross-sectional structure of a rigid-flex loading board according to an embodiment of the present invention; Figure 6 is a schematic cross-sectional structure diagram of a stacked structure according to an embodiment of the present invention; Figure 7 for Figure 6 BB plane structure diagram; Figure 8 is a schematic diagram of the cross-sectional structure of a pressed plate according to an embodiment of the present invention; Fig. 9 Schematic diagram of the cross-sectional structure of a rigid-flex board according to an embodiment of the present invention; Fig.10for Fig. 9 Make a schematic diagram of the cross-section structure with glue.

[0019] Description of Figure Numbers:

[0020] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, inside, outside...) are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0023] In addition, in the present invention, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0024] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0025] See also Figure 1 , Figure 1 Schematic diagram of the process flow of an embodiment of the present invention.

[0026] The manufacturing process of the embodiment of the present invention includes using Figure 1 The following will implement the various steps in the process Figure 1 Each step in the process is further explained step by step.

[0027] See also Figure 2 and Figure 3 , Figure 2A schematic plan view of a window core board according to an embodiment of the present invention; Figure 3 for Figure 2 Schematic diagram of the AA section.

[0028] Step S10: Take the first single-sided copper clad laminate, make a circuit pattern 1010, a solder resist layer 1020 and a core board window pattern 1030, and form a window core board 10.

[0029] Since the flexible board of the rigid-flexible board extends out from the plane direction of the board surface of the rigid board, if the traditional manufacturing method is adopted to manufacture the surface circuit pattern and the solder mask layer after the lamination is completed, a series of problems such as loose dry film, poor exposure, etching solution penetration, and difficulty in silk screen printing will occur due to the influence of the flexible board. Therefore, it is necessary to manufacture the surface circuit pattern and the solder mask layer in advance when manufacturing the core board before lamination, that is, the surface circuit pattern and the solder mask layer of the rigid-flexible board are designed as the core board layer of the lamination board in this embodiment, and then carry out post-processing.

[0030] Therefore, it is only possible to make the circuit pattern 1010 first, and then make the solder resist layer 1020 to protect the circuit pattern 1030. It is worth mentioning that the solder resist layer 1020 is designed to be thicker, 30μm to 45μm, to prevent the circuit pattern 1030 from being broken due to excessive pressure during the pressing process, thereby causing problems such as short circuits in the circuit board during application.

[0031] By making a core board window pattern 1030, the bending area of ​​the flexible board in the subsequent processing can be passed through, providing a processing basis for forming a structure vertical to the board surface of the flexible board in the subsequent process, and the solder resist layer 1020 is smaller than the insulating medium layer 1040 of the window core board 10 on one side, that is, the solder resist layer 1020 does not exceed the edge of the board, so that the pressing board 80 in the subsequent process can form a good fusion at the edge of the board.

[0032] See also Figure 4 , Figure 4 It is a schematic diagram of the cross-sectional structure of a window covering plate according to an embodiment of the present invention.

[0033] Step S20: Take the prepreg and make a prepreg window pattern, the prepreg window pattern corresponds to the core board window pattern 1030, and form a window cover plate 20.

[0034] In this embodiment, the windowed cover plate 20 is produced by taking a single-sided copper clad laminate, and sequentially producing a cover plate copper layer pattern 2010 and a cover plate window pattern 2020 to form the windowed cover plate 20. The bending area 4011a of the flexible board 4010 to which a covering film 4011 is attached does not need to be covered, so that the cover plate copper layer pattern 2010 formed by the single-sided copper clad laminate can, on the one hand, provide a portion of support for the bending area, which is beneficial for the rigid-flexible composite board 90 to have good support during the application process, and on the other hand, it can ensure that one side of the high-flow glue semi-cured sheet is restrained to prevent excessive glue flow, thereby forming a glue flow buffering cover effect on only one side. Furthermore, the cover plate window pattern 2010 corresponds to the core plate window pattern 1030, and has the same function as the windowed core plate 10, which will not be repeated.

[0035] During the lamination process, since the window core board 10 produced in the previous step has already formed the circuit pattern 1010, the coating layer directly corresponding to it needs to use a material with a greater coating effect to form a lamination buffer effect on the circuit pattern 1010, so as to avoid problems such as the circuit pattern 1010 being bent and deformed. Therefore, in this embodiment, the coating medium layer 2030 of the window coating board 20 or the semi-cured sheet of the window coating board 20 are both high-flow glue semi-cured sheets with a glue content of 60% to 68%. The glue content can better fill and penetrate into the gaps between the boards during the lamination process, which helps to eliminate bubbles and voids, enhance the bonding strength between the boards, and help to improve the stability and durability of the entire rigid-flexible board 90. Furthermore, the semi-cured sheet with a glue content in the range of 60% to 68% has good heat resistance, can maintain good physical and chemical stability in a high temperature environment, and helps to enhance the durability and reliability of the rigid-flexible board 90 in a high temperature environment.

[0036] Please read first Figure 6 , Figure 6 Schematic diagram of the cross-sectional structure of the stacked structure according to the embodiment of the present invention.

[0037] Then take the release layer and make a release window pattern 3010 to form a window release layer 30, which provides separability for removing excess board layers in subsequent processes. The material of the release layer is PI, PTFE, TPX, ETFE, silicone sheet and other materials. The thickness of the release layer is relatively thin, which is 5μm to 20μm. Furthermore, the release window pattern 3010 corresponds to the core board window pattern 1030, and has the same function as the window core board 10, which will not be repeated.

[0038] Furthermore, the size of the window release layer 30 is smaller on one side than the window cover plate 20, that is, the window release layer 30 will not completely cover the edge portion of the window cover plate 20, so that the pressed board 80 in the subsequent process forms a good fusion at the edge of the board, which is conducive to forming a stable pressed board 80 structure.

[0039] In this embodiment, the single side of the release window pattern 3010 is less than or equal to the core board window pattern 1030, which is beneficial to form an effective isolation of the flowing colloid between the window core board 10 and the window covering board 20 during the pressing process, preventing the colloid of the insulating dielectric layer of the window core board 10 and the covering board dielectric layer 2030 of the window covering board 20 from flowing into the core board window pattern 1030 to form adhesion, which will affect the removal of excess board layers above the release layer 50 in the subsequent process and even cause the board to be scrapped.

[0040] In this embodiment, one side of the cover plate window pattern 2020 is larger than the release window pattern 3010, which effectively reduces the risk of the fluid semi-cured sheet flowing into the core plate window pattern 1030 during the lamination process, thereby preventing the colloid from flowing into the core plate window pattern 1030, making it difficult to release in subsequent processes and to peel off the window cover plate 20.

[0041] See also Figure 5 , Figure 5 It is a schematic diagram of the cross-sectional structure of a rigid-flex loading board according to an embodiment of the present invention.

[0042] Step S30: Take the flexible board 4010 and the rigid board 4020, bond a part of the plane area of ​​the flexible board 4010 to the rigid board dielectric layer 4021 of the rigid board 4020 to form a bonding area 4021a, and attach a covering film 4011 to the remaining part of the plane area to form a bending area 4011a, and form a rigid-flexible carrier board 40 as a whole; because a part of the flexible board 4010 needs to extend out from the window patterns of each layer during lamination and typesetting, the part of the flexible board 4010 that does not need to extend out is bonded to the rigid board 4020 to fix the flexible board 4010 on the rigid board 4020, so as to provide a core board processing basis for stacking and lamination in the subsequent process.

[0043] Covering films 4011 are attached to both sides of the bending area 4011a of the flexible board 4010. On the one hand, they can isolate and protect the covering film 4011, preventing the flexible board 4010 from being exposed to the air and being oxidized or corroded. On the other hand, the covering film 4011 (the common material is polyimide) has good bending resistance and can provide sufficient toughness and support when the flexible board 4010 is bent, preventing the circuit pattern of the flexible board 4010 from being damaged during the bending process.

[0044] It is worth noting that the covering film 4011 in the bending area 4011a is retracted relative to the board edge, which is beneficial for the subsequent process of forming a good fusion of the pressed board 80 at the board edge to form a stable pressed board 80 structure.

[0045] Please refer again Figure 6 , and see Figure 7 and Figure 8 , Figure 7 for Figure 6 BB plane structure diagram, Figure 8 It is a schematic diagram of the cross-sectional structure of a pressed plate according to an embodiment of the present invention.

[0046] Step S40: Take the release layer 50 and the second single-sided copper clad laminate 60, and stack the rigid-flex load board 40, the window core board 10, the window release layer 30, the window cover board 20, the release layer 50 and the second single-sided copper clad laminate 60 in sequence to form a stacked structure 70, and then press them together to form a pressed board 80, and then make the surface circuit pattern.

[0047] The bending zone 4011a in the stacked structure 70 passes through the core board window pattern 1030, the release window pattern 3010 and the covering board window pattern 2020 in sequence, and the edge of the covering film 4011 in the bending zone 4011a is located within the height range of the window core board 10.

[0048] In this embodiment, the release layer 50 is smaller on one side than the second single-sided copper clad laminate 60, that is, the area between the molding line 7020 and the board edge, so that the lamination board 80 in the subsequent process forms a good fusion at the board edge, which is conducive to forming a stable lamination structure.

[0049] In this embodiment, forming the laminated plate 80 includes fixing the stacked structure 70 with rivets 7010, and then laminating to form the laminated plate 80. On the one hand, pre-fixing by riveting 7010 before laminating can ensure that each layer of material maintains good alignment and flatness during the laminating process, especially ensuring that the portion of the flexible plate 4010 extending out of the window area is effectively fixed, thereby preventing the flexible plate 4010 from wrinkling, denting, etc. due to unevenness or loose fixation during laminating; and reducing defects such as displacement and bubbles that occur during the laminating process, avoiding problems such as poor laminating due to material displacement, and effectively improving the yield rate of the laminated plate 80. On the other hand, the pre-fixed stacked structure 70 can more easily achieve uniform pressure distribution during the laminating process, thereby improving the overall structural stability of the laminated plate 80 and the quality of laminating.

[0050] In the present embodiment, the stacked structure 70 is formed by stacking multiple layers of composite materials. Therefore, in order to improve the stability and reliability of the pressed plate 80, a temperature control method of slow heating and slow cooling is adopted for pressing. That is, the pressing is carried out by slow heating with a heating rate of 1.8°C / min to 2.2°C / min and slow cooling with a cooling rate of 3.8°C / min to 4.5°C / min. On the one hand, slow heating can gradually soften the material, making it easier to flow and combine during the pressing process, thereby improving the bonding strength of the material, which is conducive to the formation of a relatively slow coating and buffering effect between layers. On the other hand, slow heating and slow cooling can effectively reduce the thermal stress inside the material and avoid material cracking or deformation caused by rapid heating and cooling.

[0051] Furthermore, the maximum temperature for pressing is 160°C to 180°C, and the maximum temperature pressing time is 20min to 40min. On the one hand, the higher temperature (160°C to 180°C) ensures that the material is fully softened and solidified, so that each layer of material forms a closer bond, thereby improving the overall mechanical strength and durability. On the other hand, the longer maximum temperature pressing time (20min to 40min) can ensure uniform temperature distribution during the pressing process. Uniform temperature distribution helps each layer of material to fuse better, reduces the generation of bubbles and voids, and improves the flatness and density of the pressed plate 80.

[0052] See also Fig. 9 , Fig. 9 This is a schematic diagram of the cross-sectional structure of a rigid-flexible board in which the flexible board is perpendicular to the board surface according to an embodiment of the present invention.

[0053] Step S50: The laminated board 80 is formed, and the window release layer 30, the window cover board 20, the release layer 50 and the second single-sided copper clad board 60 are removed to form a rigid-flexible board 90 in which the flexible board is perpendicular to the board surface.

[0054] In this embodiment, the molding includes controlled-depth milling of the laminated board 80 from the core board window pattern 1030 to the board edge of the laminated board 80. The depth of the controlled-depth milling is from the board surface of the laminated board 80 to the window release layer 30. The controlled-depth milling can ensure that only the window release layer 30 is milled, thereby effectively avoiding milling damage to the window core board 10, resulting in exposure of the circuit pattern 1010, and problems such as short circuits in subsequent applications, thereby improving the yield rate of the circuit board.

[0055] See also Fig.10 , Fig.10 for Fig. 9 Make a schematic diagram of the cross-section structure with glue.

[0056] In this embodiment, forming a rigid-flexible board 90 in which the flexible board is perpendicular to the board surface also includes dispensing glue 9010 at the junction of the flexible board 4010 and the rigid board 4020; dispensing glue 9010 can significantly enhance the bonding strength between the two, ensure that the rigid-flexible board 90 remains stable during application, extend the service life of the product, and improve the sealing of the junction between the flexible board and the rigid board.

[0057] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A method for manufacturing a rigid-flexible board in which a flexible board is perpendicular to a board surface, characterized in that: The production method comprises the following steps: S10: Take the first single-sided copper clad laminate, make a circuit pattern, a solder mask layer and a core board window pattern, and form a window core board; The solder resist layer has a single side smaller than the insulating dielectric layer of the window core board; S20: taking a prepreg and making a prepreg window pattern, wherein the window prepreg pattern corresponds to the core board window pattern, to form a window cover plate; Then taking the release layer, making a release window pattern, and forming a window release layer, wherein the release window pattern corresponds to the core board window pattern; The size of the window release layer is smaller than that of the window cover plate on one side; S30: taking a flexible board and a rigid board, bonding a part of the plane of the flexible board to the rigid board dielectric layer of the rigid board to form a bonding area, and attaching a covering film to the remaining part of the plane to form a bending area, thereby forming a rigid-flex load-bearing board as a whole; S40: taking the release layer and the second single-sided copper clad laminate, stacking the rigid-flex load board, the window core board, the window release layer, the window cover board, the release layer and the second single-sided copper clad laminate in sequence to form a stacked structure, and then pressing them together to form a pressed board; The bending area in the stacked structure sequentially passes through the core plate window pattern, the release window pattern and the cover plate window pattern, and the edge of the covering film in the bending area is located within the height range of the window core plate; S50: molding the laminated board, removing the window release layer, the window cover board, the release layer and the second single-sided copper clad board, to form a rigid-flexible board in which the flexible board is perpendicular to the board surface.

2. A method for manufacturing a rigid-flexible board in which a flexible board is perpendicular to a board surface as claimed in claim 1, characterized in that: The window-opening cover plate is formed by taking a single-sided copper-clad plate, sequentially making a cover plate copper layer pattern and a cover plate window pattern, and forming the window-opening cover plate; the cover plate window pattern corresponds to the core plate window pattern.

3. A method for manufacturing a rigid-flexible board in which a flexible board is perpendicular to a board surface as claimed in claim 1 or 2, characterized in that: The cover plate dielectric layer of the window cover plate or the prepreg of the window cover plate are both high-flow adhesive prepregs with an adhesive content of 60% to 68%.

4. The method for manufacturing a rigid-flexible board in which a flexible board is perpendicular to a board surface as claimed in claim 1, characterized in that: The release layer has a single side smaller than the second single-sided copper clad laminate.

5. The method for manufacturing a rigid-flexible board in which a flexible board is perpendicular to a board surface as claimed in claim 1, characterized in that: The single side of the release window pattern is smaller than or equal to the core board window pattern.

6. A method for manufacturing a rigid-flexible board in which a flexible board is perpendicular to a board surface as claimed in claim 1 or 5, characterized in that: The cover plate window pattern has a single side larger than the release plate window pattern.

7. The method for manufacturing a rigid-flexible board in which a flexible board is perpendicular to a board surface as claimed in claim 1, characterized in that: Forming the pressed plate includes fixing the stacked structure by riveting and then pressing to form the pressed plate.

8. The method for manufacturing a rigid-flexible board in which a flexible board is perpendicular to a board surface as claimed in claim 2, characterized in that: The pressing is performed by slowly heating at a heating rate of 1.8°C / min to 2.2°C / min, a maximum temperature of 160°C to 180°C, a maximum temperature pressing time of 20min to 40min, and a slow cooling method of cooling at a cooling rate of 3.8°C / min to 4.5°C / min.

9. The method for manufacturing a rigid-flexible board in which a flexible board is perpendicular to a board surface as claimed in claim 1, characterized in that: The forming includes performing controlled-depth milling on the laminate from the core plate window pattern to the plate edge of the laminate, wherein the depth of the controlled-depth milling is from the plate surface of the laminate to the window release layer.

10. The method for manufacturing a rigid-flexible board in which a flexible board is perpendicular to a board surface as claimed in claim 1, characterized in that: Forming a rigid-flexible board in which the flexible board is perpendicular to the board surface also includes dispensing glue at the bonding position between the flexible board and the rigid board.

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