Cold plate assembly and heat dissipation system

Abstract

The invention relates to the technical field of thermal management of aircrafts, in particular to a cold plate assembly and a heat dissipation system. The cold plate assembly comprises a first assembling unit, a second assembling unit and a heat exchange unit. The two sides of the heat exchange unit are detachably connected with the first assembling unit and the second assembling unit correspondingly. The heat exchange unit is provided with an inlet end and an outlet end; the heat exchange unit comprises at least one first flow channel and at least one second flow channel; the inlet end, the first runner, the second runner and the outlet end are communicated in sequence; the spacing distance between the first flow channel and the second flow channel is within a set range; the sum of the cross sectional areas of all the first flow channels is smaller than the sum of the cross sectional areas of all the second flow channels. Therefore, the problem of how to improve the heat exchange effect of the cold plate on the electronic equipment is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of aircraft thermal management, and in particular to a cold plate assembly and a heat dissipation system. Background Art

[0002] Currently, aircraft environmental control systems need to address three major thermal management challenges for the hot surfaces of electronic devices: high heat flux density cooling, high power dissipation, and high temperature uniformity control. Traditional electronic device cooling systems mainly include air-cooled and liquid-cooled systems. However, air-cooled systems, due to their low heat dissipation capacity, are no longer sufficient to meet the high-power cooling requirements of electronic devices. At present, liquid-cooled systems are the primary means of thermal management for electronic devices.

[0003] However, with the further increase in the power level of electronic devices, on the one hand, liquid cooling systems need to further increase the circulation flow rate of the liquid coolant to improve their heat dissipation power. This also brings disadvantages such as thicker liquid cooling pipes, larger total system weight, and higher power consumption of the liquid pump. In particular, the thicker liquid cooling pipes make it difficult to arrange equipment in the confined space of the aircraft. On the other hand, liquid cooling systems rely on liquid cooling plates to absorb heat from the surface of electronic devices. Since the heat exchange process of the liquid coolant in the cooling plate is a single-phase heat exchange process, that is, the absorbed heat is only converted into the sensible heat of the liquid itself. Therefore, under high-power heat dissipation conditions, the temperature difference between the inlet and outlet of the liquid cooling plate is large, which leads to local low heat flux density, poor temperature uniformity, and local overheating on the surface of electronic devices, posing a threat to the safety of electronic devices. Summary of the Invention

[0004] In order to solve the problem of how to improve the heat exchange effect of a cold plate on electronic equipment, the present invention provides a cold plate assembly and a heat dissipation system.

[0005] In a first aspect, the present invention provides a cold plate assembly, the cold plate assembly comprising:

[0006] First assembly unit;

[0007] Second assembly unit;

[0008] A heat exchange unit is provided, with its two sides detachably connected to the first assembly unit and the second assembly unit, respectively; the heat exchange unit is provided with an inlet end and an outlet end; the heat exchange unit includes at least one first flow channel and at least one second flow channel; the inlet end, the first flow channel, the second flow channel, and the outlet end are sequentially connected; the interval between the first flow channel and the second flow channel is within a set range; the sum of the cross-sectional areas of all the first flow channels is less than the sum of the cross-sectional areas of all the second flow channels.

[0009] In some embodiments, the first flow channel includes multiple first pipelines and multiple first connecting parts; the multiple first pipelines and the multiple first connecting parts are fixedly connected in sequence at intervals; two adjacent first pipelines are connected through the first connecting parts; the first pipeline at one end of the first flow channel is connected to the inlet end, and the first pipeline at the other end is connected to the second flow channel.

[0010] In some embodiments, the first pipeline includes multiple first straight sections, multiple second straight sections, and multiple first vertical sections; one end of the first vertical section is fixedly connected to the first straight section, and the other end is fixedly connected to the second straight section; the angle between the first straight section and the first vertical section is within a first set angle range; the angle between the second straight section and the first vertical section is within a second set angle range; one end of a first connecting portion is connected to any one of the first straight section, the second straight section, and the first vertical section.

[0011] In some embodiments, the angle between the first connecting portion and the first pipeline is within a third set angle range.

[0012] In some embodiments, the second flow channel includes multiple second pipelines, a second connecting part, a third connecting part, and a fourth connecting part; the third connecting part is connected to the end of the first flow channel away from the outlet end through the second connecting part; the third connecting part and the fourth connecting part are spaced apart; the second pipeline is connected to the third connecting part and the fourth connecting part respectively; multiple second pipelines are spaced apart; the second pipeline at one end of the second flow channel away from the second connecting part is connected to the outlet end.

[0013] In some embodiments, a cross-sectional area of ​​the second communication portion is smaller than a cross-sectional area of ​​the third communication portion.

[0014] In some embodiments, cross-sectional areas of the plurality of second pipes increase sequentially along the flow direction of the cooling medium in the third connecting portion.

[0015] In some embodiments, the communication position between the second pipeline and the third communication portion is a first position; the communication position between the second pipeline and the fourth communication portion is a second position;

[0016] The first positions are arranged at intervals along the length direction of the third connecting part; among two adjacent first positions, one of the first positions is arranged adjacent to one side of the third connecting part in the width direction, and the other first position is arranged adjacent to the other side of the third connecting part in the width direction; the second positions are arranged at intervals along the length direction of the fourth connecting part; among two adjacent second positions, one of the second positions is arranged adjacent to one side of the fourth connecting part in the width direction, and the other second position is arranged adjacent to the other side of the fourth connecting part in the width direction; the projection of the first position on the fourth connecting part and the second position are arranged at intervals along the width direction of the fourth connecting part.

[0017] In some embodiments, the second pipeline includes multiple third straight sections, multiple fourth straight sections, and multiple second vertical sections; one end of the second vertical section is fixedly connected to the third straight section, and the other end is fixedly connected to the fourth straight section; the angle between the third straight section and the second vertical section is within the first set angle range; the angle between the fourth straight section and the second vertical section is within the second set angle range.

[0018] In some embodiments, a portion of a sidewall of the first flow channel abuts against a portion of a sidewall of the second flow channel.

[0019] In some embodiments, one side of the first connecting portion abuts against one side of the second pipeline; one side of the second connecting portion abuts against one side of the second pipeline; one side of the third connecting portion abuts against one side of the first pipeline; and one side of the fourth connecting portion abuts against one side of the first pipeline.

[0020] Two adjacent first straight sections along the length direction of the first pipeline respectively abut against two sides of the second pipeline; the first straight section and the second straight section along the width direction of the first pipeline respectively abut against part of the side wall of the second pipeline.

[0021] In some embodiments, the cold plate assembly further includes a support unit; the support unit is disposed between the first flow channel and the second flow channel; and the support unit abuts against a side wall of the first flow channel and a side wall of the second flow channel respectively.

[0022] In a second aspect, the present invention discloses a heat dissipation system, the heat dissipation system comprising a cold plate assembly as described in any one of the above embodiments, the heat dissipation system further comprising:

[0023] A heat dissipation assembly includes a cooling unit, a pressurization unit, a storage unit, a depressurization unit, a charging unit, and a discharging unit; the outlet end of the heat exchange unit, the charging unit, the pressurization unit, the discharging unit, the cooling unit, the depressurization unit, and the inlet end of the heat exchange unit are connected in sequence.

[0024] a cooling medium, wherein at least a portion of the cooling medium is converted from a liquid state to a gaseous state when flowing through the heat dissipation assembly and the cold plate assembly;

[0025] A heat generating component transfers heat to the heat exchange unit.

[0026] To solve the problem of how to improve the heat exchange effect of the cold plate on electronic equipment, the present invention has the following advantages:

[0027] A saturated gas-liquid two-phase cooling medium is used to exchange heat through the first and second flow channels, thereby removing heat from the heat-generating components (i.e., electronic devices). Heat can be transferred between the first and second flow channels, ensuring uniform heat absorption across the surface of the cold plate assembly. Furthermore, the sum of the cross-sectional areas of all first flow channels is smaller than the sum of the cross-sectional areas of all second flow channels. This allows the cooling medium in the first flow channels to decompress and vaporize when it flows into the second flow channels after undergoing a phase change, reducing flow resistance and enhancing the phase change effect, thereby improving the heat exchange efficiency of the cold plate assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A schematic diagram of a cold plate assembly according to an embodiment is shown;

[0029] Figure 2 Shown Figure 1 A schematic plan view of a cold plate assembly in an embodiment;

[0030] Figure 3 A schematic diagram of a first flow channel according to an embodiment is shown;

[0031] Figure 4 Shown Figure 3 A schematic plan view of the first flow channel in the embodiment;

[0032] Figure 5 A schematic diagram of a first pipeline of an embodiment is shown;

[0033] Figure 6 A schematic diagram of a second flow channel according to an embodiment is shown;

[0034] Figure 7 Shown Figure 6 A schematic plan view of the second flow channel in the embodiment;

[0035] Figure 8 A schematic diagram of a third connecting portion of an embodiment is shown;

[0036] Figure 9 A schematic diagram of a fourth connecting portion of an embodiment is shown;

[0037] Figure 10 A schematic diagram of a second pipeline in one embodiment is shown;

[0038] Figure 11 A schematic diagram of a second flow channel in another embodiment is shown;

[0039] Figure 12 A schematic diagram of a heat dissipation system according to a first embodiment is shown;

[0040] Figure 13 A schematic diagram of a heat dissipation system according to a second embodiment is shown;

[0041] Figure 14 A schematic diagram of a heat dissipation system of a third embodiment is shown.

[0042] Reference numerals: 01 cold plate assembly; 11 first assembly unit; 12 second assembly unit; 13 heat exchange unit; 131 first flow channel; 1311 first pipeline; 13111 first straight section; 13112 second straight section; 13113 first vertical section; 1312 first connecting portion; 132 second flow channel; 1321 second pipeline; 13211 third straight section; 13212 fourth straight section; 13213 second vertical section; 1322 second connecting portion; 1 323 third connecting part; 1324 fourth connecting part; 15 supporting unit; 02 heat dissipation component; 21 cooling unit; 211 condenser; 212 pressure relief valve; 22 boosting unit; 221 compressor; 222 regenerator; 223 separator; 224 two-phase pump; 225 check valve; 23 storage unit; 24 pressure reducing unit; 241 filter; 242 expansion valve; 243 three-way valve; 25 charging unit; 26 discharge unit; 03 heating component. DETAILED DESCRIPTION

[0043] The present disclosure will now be discussed with reference to several exemplary embodiments. It should be understood that these embodiments are discussed only to enable those skilled in the art to better understand and implement the present disclosure, rather than to imply any limitation on the scope of the present disclosure.

[0044] As used herein, the term "comprising" and its variations are to be interpreted as open-ended terms meaning "including but not limited to". The term "based on" is to be interpreted as "at least partially based on". The terms "one embodiment" and "an embodiment" are to be interpreted as "at least one embodiment". The term "another embodiment" is to be interpreted as "at least one other embodiment". The terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "vertical", "horizontal", "lateral", "longitudinal", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments and are not intended to limit the indicated devices, elements, or components to having a specific orientation or being constructed and operated in a specific orientation. Furthermore, some of the above terms may be used to indicate other meanings besides orientations or positional relationships; for example, the term "upper" may in some cases indicate a dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application according to the specific circumstances. In addition, the terms "installed", "set up", "equipped with", "connected", and "linked" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, elements, or components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances. Furthermore, the terms "first," "second," etc., are mainly used to distinguish different devices, elements, or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0045] In this embodiment, with the increase in the power of electronic devices, traditional air-cooled and liquid-cooled heat dissipation systems cannot meet the thermal management requirements of high heat flux density cooling, high power dissipation, and high temperature uniformity control. Liquid cooling systems rely on liquid-cooled cold plates to absorb heat from the surface of electronic devices. Since the heat exchange process of the liquid coolant within the cold plate is generally a single-phase heat exchange process, meaning the absorbed heat is only converted into the sensible heat of the liquid itself, and the flow path of the coolant within the cold plate is relatively short, absorbing a large amount of heat in a short time will lead to a large temperature difference between the inlet and outlet of the cold plate, resulting in uneven heat exchange with different areas of the electronic device's surface, affecting the cooling effect and lifespan of the electronic device. Therefore, this embodiment discloses a cold plate assembly 01. Figure 1As shown, the cold plate assembly 01 may include a first assembly unit 11, a second assembly unit 12, and a heat exchange unit 13. The two sides of the heat exchange unit 13 are detachably connected to the first assembly unit 11 and the second assembly unit 12, respectively, so that the cold plate assembly 01 can be installed to an external component through the first assembly unit 11 and the second assembly unit 12, so that the heat exchange unit 13 can exchange heat with components with heat dissipation requirements (i.e., electronic devices). The heat exchange unit 13 is provided with an inlet end and an outlet end, wherein the cooling medium can flow in from the inlet end and flow out from the outlet end. As shown Figure 2 As shown, the heat exchange unit 13 includes at least one first flow channel 131 and at least one second flow channel 132. The inlet end, the first flow channel 131, the second flow channel 132, and the outlet end are connected in sequence. The spacing between the first flow channel 131 and the second flow channel 132 is within a set range, so that heat can be transferred between the first flow channel 131 and the second flow channel 132. The sum of the cross-sectional areas of all the first flow channels 131 is less than the sum of the cross-sectional areas of all the second flow channels 132. When the cooling medium is a fluid in a gas-liquid two-phase saturated state, the principle that the saturation temperature remains basically unchanged during the phase change of the cooling medium during heat exchange can be utilized to make the absolute value of the temperature difference between the inlet end and the outlet end less than a set threshold. At the same time, the flow resistance of the cooling medium increases after the phase change occurs during heat exchange in the first flow channel 131. Setting a larger cross-sectional area of ​​the second flow channel 132 can reduce the flow resistance of the cooling medium, achieve the effect of pressure relief and vaporization when entering a large space from a small space, and facilitate the improvement of the phase change rate of the cooling medium during heat exchange in the second flow channel 132.

[0046] In this embodiment, if Figure 3 、 Figure 4 As shown, the first flow channel 131 includes a plurality of first pipelines 1311 and a plurality of first connecting parts 1312. The plurality of first pipelines 1311 and the plurality of first connecting parts 1312 are fixedly connected in sequence at intervals. Two adjacent first pipelines 1311 are connected through the first connecting part 1312. The first pipeline 1311 at one end of the first flow channel 131 is connected to the inlet end, and the first pipeline 1311 at the other end is connected to the second flow channel 132. Through the above arrangement, the plurality of first pipelines 1311 are connected in series, which is convenient for extending the flow path of the cooling medium in the first flow channel 131, and the first flow channel 131 can be distributed in a serpentine shape as a whole in the horizontal direction, so that the cooling medium can flow back and forth left and right in the first flow channel 131, which is convenient for uniform heat exchange and phase change to improve the heat exchange effect.

[0047] In this embodiment, if Figure 3 、 Figure 5As shown, the first conduit 1311 includes multiple first straight segments 13111, multiple second straight segments 13112, and multiple first vertical segments 13113. One end of the first vertical segment 13113 is fixedly connected to the first straight segment 13111, and the other end is fixedly connected to the second straight segment 13112. The angle between the first straight segment 13111 and the first vertical segment 13113 is within a first predetermined angle range. The angle between the second straight segment 13112 and the first vertical segment 13113 is within a second predetermined angle range. One end of a first connecting portion 1312 is connected to any one of the first straight segments 13111, the second straight segments 13112, and the first vertical segments 13113. Because the cooling medium undergoes a heat exchange phase change within the first pipe 1311, there is a temperature difference between the side of the first pipe 1311 closest to the heating surface of the electronic device and the other side. Furthermore, the gaseous cooling medium is mainly concentrated on the side of the first pipe 1311 closest to the heating surface of the electronic device. Through the above arrangement, the first pipe 1311 is arranged in a serpentine pattern in the vertical direction, allowing the cooling medium flowing through the first pipe 1311 to flow vertically up and down, disrupting the flow paths of the gaseous and liquid cooling media. This prevents the gaseous cooling medium from concentrating on one side of the first pipe 1311 and affecting the heat exchange phase change of the liquid cooling medium, thereby reducing the temperature difference in the vertical direction, facilitating the phase change of the cooling medium, and improving the heat exchange effect.

[0048] In this embodiment, if Figure 3 As shown, the angle between the first connecting portion 1312 and the first pipe 1311 is within the third set angle range. This allows the vertical heights of two adjacent first connecting portions 1312 to be inconsistent, further disrupting the flow path of the cooling medium and improving the heat exchange effect.

[0049] In this embodiment, if Figure 6 、 Figure 7As shown, the second flow channel 132 includes multiple second pipes 1321, a second connecting portion 1322, a third connecting portion 1323, and a fourth connecting portion 1324. The third connecting portion 1323 is connected to the end of the first flow channel 131 away from the outlet end through the second connecting portion 1322. The third connecting portion 1323 and the fourth connecting portion 1324 are spaced apart. The second pipes 1321 are connected to the third connecting portion 1323 and the fourth connecting portion 1324 respectively. The multiple second pipes 1321 are spaced apart. The second pipe 1321 at the end of the second flow channel 132 away from the second connecting portion 1322 is connected to the outlet end. Through the above arrangement, the multiple second pipes 1321 are connected in parallel. The flow resistance of the cooling medium flowing through the first flow channel 131 is relatively large. When the cooling medium flows into the third connecting part 1323 of the second flow channel 132, the pressure can be released in the third connecting part 1323 and diverted to multiple second pipelines 1321, and finally converge at the fourth connecting part 1324, thereby effectively reducing the flow resistance of the cooling medium and avoiding the accumulation of cooling medium due to excessive flow resistance of the cooling medium in the first flow channel 131.

[0050] In this embodiment, if Figure 8 As shown, the cross-sectional area of ​​the second communication portion 1322 is smaller than the cross-sectional area of ​​the third communication portion 1323. Therefore, the cooling medium in the first flow channel 131 can be depressurized and vaporized when flowing through the second communication portion 1322 and entering the third communication portion 1323, facilitating phase change and improving heat exchange effect.

[0051] In this embodiment, if Figure 11 As shown, the cross-sectional areas of the plurality of second pipes 1321 increase sequentially along the flow direction of the cooling medium in the third connecting portion 1323. This ensures a uniform flow of the cooling medium from the third connecting portion 1323 to the plurality of second pipes 1321, ensuring a balanced heat exchange effect among the plurality of second pipes 1321 and preventing low local heat flux density on the surface of the electronic device.

[0052] In this embodiment, if Figure 8 、 Figure 9 As shown, the communication position between the second pipeline 1321 and the third communication portion 1323 is the first position, and the communication position between the second pipeline 1321 and the fourth communication portion 1324 is the second position.

[0053] The first positions are spaced apart along the length direction of the third connecting portion 1323. Of the two adjacent first positions, one of the first positions is located adjacent to one side of the third connecting portion 1323 in the width direction, and the other first position is located adjacent to the other side of the third connecting portion 1323 in the width direction. The second positions are spaced apart along the length direction of the fourth connecting portion 1324. Of the two adjacent second positions, one of the second positions is located adjacent to one side of the fourth connecting portion 1324 in the width direction, and the other second position is located adjacent to the other side of the fourth connecting portion 1324 in the width direction. The projection of the first position on the fourth connecting portion 1324 is spaced apart from the second position along the width direction of the fourth connecting portion 1324. Through the above arrangement, the inlet and outlet of the second pipeline 1321 are located at different positions in the height direction, which causes flow turbulence when the cooling medium in the third connecting portion 1323 and the fourth connecting portion 1324 is diverted and merged, thereby preventing the gas phase cooling medium from concentrating on one side and affecting the phase change heat transfer effect.

[0054] In this embodiment, if Figure 10 As shown, the second pipeline 1321 includes a plurality of third straight sections 13211, a plurality of fourth straight sections 13212, and a plurality of second vertical sections 13213. One end of the second vertical section 13213 is fixedly connected to the third straight section 13211, and the other end is fixedly connected to the fourth straight section 13212. The angle between the third straight section 13211 and the second vertical section 13213 is within a first set angle range. The angle between the fourth straight section 13212 and the second vertical section 13213 is within a second set angle range. Through the above arrangement, the second pipeline 1321 is distributed in a serpentine shape in the vertical direction, so that the cooling medium in the second pipeline 1321 flows up and down in the vertical direction, avoiding the concentration of the gas phase cooling medium on the side of the second pipeline 1321 close to the electronic equipment, thereby improving the effect of the heat exchange phase change of the cooling medium.

[0055] In this embodiment, if Figure 1 As shown, part of the sidewall of the first flow channel 131 abuts part of the sidewall of the second flow channel 132. This allows the first flow channel 131 and the second flow channel 132 to interlock with each other, allowing for better heat transfer between the first flow channel 131 and the second flow channel 132, balancing the heat absorption of the first flow channel 131 and the second flow channel 132, preventing local overheating of the electronic device, and ensuring uniform heat exchange.

[0056] In this embodiment, if Figure 1 、 Figure 2 As shown, one side of the first connecting portion 1312 abuts against one side of the second pipeline 1321. One side of the second connecting portion 1322 abuts against one side of the second pipeline 1321. One side of the third connecting portion 1323 abuts against one side of the first pipeline 1311. One side of the fourth connecting portion 1324 abuts against one side of the first pipeline 1311. Figure 3and Figure 6 As shown, two adjacent first straight sections 13111 along the length direction of the first pipeline 1311 respectively abut against both sides of the second pipeline 1321. The first straight section 13111 and the second straight section 13112 along the width direction of the first pipeline 1311 respectively abut against part of the side wall of the second pipeline 1321.

[0057] Through the above-mentioned arrangement, the first flow channel 131 and the second flow channel 132 are distributed in a mesh-like staggered manner, forming a spatial structure like a "Chinese knot", so that heat can be transferred to each other between the first flow channel 131 and the second flow channel 132. At the same time, the flow path of the cooling medium is made to flow horizontally left and right, front and back, and vertically up and down in space, thereby achieving uniform heat exchange at each point in the contact area of ​​the cold plate assembly 01 with the heating surface of the electronic equipment, thereby avoiding local overheating of the electronic equipment.

[0058] In this embodiment, if Figure 1 、 Figure 2 As shown, the cold plate assembly 01 also includes a support unit 15. The support unit 15 is arranged between the first flow channel 131 and the second flow channel 132. The support unit 15 abuts against the side walls of the first flow channel 131 and the side walls of the second flow channel 132 respectively. The support unit 15 can offset the stress when the cold plate assembly 01 is tightened, so that one side of the heat exchange unit 13 is more closely fitted to the heat source, and the support unit 15 can transfer heat to the heat exchange unit 13, thereby increasing the heat exchange area between the cold plate assembly 01 and the heat source and improving the heat exchange effect. At the same time, it can withstand the metal deformation caused by the thermal stress generated by the heat exchange unit 13 during heat exchange. In addition, it can also cooperate with the positioning pins inserted from one side of the cold plate assembly 01 for positioning and reinforcement.

[0059] In this embodiment, a heat dissipation system is disclosed. The heat dissipation system includes a cold plate assembly 01 according to any one of the above embodiments, such as Figure 12 As shown, the heat dissipation system may further include a heat dissipation component 02, a heat generating component 03, and a cooling medium. Heat dissipation component 02 includes a cooling unit 21, a pressurizing unit 22, a storage unit 23, a pressure reducing unit 24, a charging unit 25, and a discharge unit 26. The outlet of the heat exchange unit 13 of the cold plate assembly 01, the charging unit 25, the pressurizing unit 22, the discharge unit 26, the cooling unit 21, the pressure reducing unit 24, and the inlet of the heat exchange unit 13 of the cold plate assembly 01 are sequentially connected. When the cooling medium flows through the heat dissipation component 02 and the cold plate assembly 01, at least a portion of the cooling medium is converted from liquid to gas. The heat generating component 03 transfers heat to the heat exchange unit 13. As a result, the heat exchange unit 13 absorbs heat through the cooling medium, undergoing a phase change, rapidly removing heat from the heat generating component 03. The cooling medium can be a two-phase fluid such as aviation fuel, aviation antifreeze, air, deionized water, liquid nitrogen, or liquid hydrogen.

[0060] In other embodiments, Figure 12As shown, the cooling unit 21 may include a condenser 211 and a pressure relief valve 212. The pressure reducing unit 24 may include a filter 241 and an expansion valve 242. The cold plate assembly 01, the filling unit 25, the pressurizing unit 22, the discharge unit 26, the condenser 211, the storage unit 23, the filter 241, and the expansion valve 242 are sequentially connected through pipelines to form a closed loop. The filling unit 25 and the discharge unit 26 may both be straight-through structures and equipped with plugs for filling or discharging the cooling medium inside the heat dissipation system. One end of the pressure relief valve 212 is connected to the condenser 211. When the pressure of the cooling medium in the condenser 211 (the highest pressure point inside the system) exceeds the set pressure threshold, the pressure relief valve 212 opens to relieve the pressure in the heat dissipation system to reduce the pressure inside the heat dissipation system. The storage unit 23 may be used to store part of the cooling medium. The filter 241 is used to filter impurities in the cooling medium and dry the cooling medium.

[0061] For example, when heat generating assembly 03 is operating, the low-dryness cooling medium (dryness less than 0.3) at the inlet of heat exchange unit 13 of cold plate assembly 01 absorbs the heat generated by heat generating assembly 03 within heat exchange unit 13, transforming into superheated gas (superheat of 3°C to 5°C) before leaving cold plate assembly 01. The gaseous cooling medium, after exiting cold plate assembly 01, is heated and pressurized by booster unit 22, with the superheat further raised to above 15°C. It then flows into the hot fluid channel of condenser 211, exchanging heat with the cold fluid in the cold fluid channel of condenser 211. The hot and cold fluid channels within condenser 211 are arranged in a cross-flow pattern. The high-pressure superheated gaseous cooling medium is cooled into a high-pressure subcooled liquid (subcooling degree is 5°C to 10°C) inside the condenser 211, and then enriched and stabilized by the storage unit 23, and dried and filtered by the filter 241 for impurities. Finally, it is throttled by the expansion valve 242, cooled and reduced in temperature and pressure to become a low-pressure, low-temperature, and low-dryness gas-liquid two-phase cooling medium, and re-enters the cold plate assembly 01 to absorb heat.

[0062] In other embodiments, Figure 13As shown, the booster unit 22 may include a compressor 221 and a regenerator 222. The regenerator 222 may include a hot fluid channel and a cold fluid channel. The cooling medium discharged from the cold plate assembly 01 first flows into the cold fluid channel of the regenerator 222. After absorbing heat transferred from the hot fluid channel of the regenerator 222, it enters the compressor 221 as a superheated gas. After being compressed by the compressor 221, the temperature and pressure are increased, and the superheat is further increased to above 15°C. The high-temperature, high-pressure gaseous cooling medium at the outlet of the compressor 221 then enters the hot fluid channel of the regenerator 222. After being cooled by the cooling medium in the cold fluid channel, the superheat is reduced and the cooling medium enters the condenser 211 for further cooling. This prevents the "liquid hammer" phenomenon caused by the high-speed suction of the gas-liquid two-phase cooling medium by the compressor 221, preventing damage to the internal components of the compressor 221 caused by the impact of the cooling medium.

[0063] In other embodiments, Figure 14 As shown, the boost unit 22 may include a compressor 221, a separator 223, a two-phase pump 224, and a check valve 225. The pressure reduction unit 24 also includes a three-way valve 243. The separator 223, the two-phase pump 224, and the check valve 225 are sequentially connected to form a first branch. The end of the check valve 225 away from the two-phase pump 224 is connected to the pipeline between the cold plate assembly 01 and the expansion valve 242 through the three-way valve 243. The check valve 225 may be a one-way valve that prevents the cooling medium from flowing from the pipeline between the cold plate assembly 01 and the expansion valve 242 to the two-phase pump 224. The outlet of the separator 223 is connected to the compressor 221 and the two-phase pump 224 respectively. The inlet of the separator 223 is connected to the cold plate assembly 01. Separator 223 separates the cooling medium discharged from cold plate assembly 01 into gas and liquid, allowing the gaseous cooling medium to flow into compressor 221, preventing damage to compressor 221 caused by "liquid hammer." At the same time, it stores the liquid cooling medium. If the speed of compressor 221 fails to reach the rated operating speed or the amount of cooling medium flowing into cold plate assembly 01 is insufficient, liquid cooling medium can be replenished into cold plate assembly 01 through the first branch, ensuring the heat exchange effect between cold plate assembly 01 and heat generating component 03.

[0064] Those skilled in the art will appreciate that the above-mentioned embodiments are specific examples for implementing the present disclosure, and that in actual applications, various changes may be made thereto in form and detail without departing from the scope of the present disclosure.

Claims

1. A cold plate assembly, characterized in that: The cold plate assembly comprises: First assembly unit; Second assembly unit; A heat exchange unit, wherein both sides of the heat exchange unit are detachably connected to the first assembly unit and the second assembly unit respectively; the heat exchange unit is provided with an inlet end and an outlet end; the heat exchange unit comprises at least one first flow channel and at least one second flow channel; the inlet end, the first flow channel, the second flow channel and the outlet end are connected in sequence; the interval distance between the first flow channel and the second flow channel is within a set range; the sum of the cross-sectional areas of all the first flow channels is smaller than the sum of the cross-sectional areas of all the second flow channels.

2. A cold plate assembly according to claim 1, characterized in that: The first flow channel includes multiple first pipelines and multiple first connecting parts; the multiple first pipelines and the multiple first connecting parts are fixedly connected in sequence at intervals; two adjacent first pipelines are connected through the first connecting parts; the first pipeline at one end of the first flow channel is connected to the inlet end, and the first pipeline at the other end is connected to the second flow channel.

3. A cold plate assembly according to claim 2, characterized in that: The first pipeline includes multiple first straight sections, multiple second straight sections, and multiple first vertical sections; one end of the first vertical section is fixedly connected to the first straight section, and the other end is fixedly connected to the second straight section; the angle between the first straight section and the first vertical section is within a first set angle range; the angle between the second straight section and the first vertical section is within a second set angle range; one end of a first connecting portion is connected to any one of the first straight section, the second straight section, and the first vertical section.

4. A cold plate assembly according to claim 3, characterized in that: An included angle between the first connecting portion and the first pipeline is within a third set included angle range.

5. A cold plate assembly according to claim 4, characterized in that: The second flow channel includes multiple second pipelines, a second connecting part, a third connecting part, and a fourth connecting part; the third connecting part is connected to an end of the first flow channel away from the outlet end through the second connecting part; the third connecting part and the fourth connecting part are arranged at intervals; the second pipeline is connected to the third connecting part and the fourth connecting part respectively; multiple second pipelines are arranged at intervals; the second pipeline at an end of the second flow channel away from the second connecting part is connected to the outlet end.

6. A cold plate assembly according to claim 5, characterized in that: The cross-sectional area of ​​the second communication portion is smaller than the cross-sectional area of ​​the third communication portion.

7. A cold plate assembly according to claim 5, characterized in that: The cross-sectional areas of the plurality of second pipelines increase sequentially along the flow direction of the cooling medium in the third connecting portion.

8. A cold plate assembly according to claim 5, characterized in that: The communication position between the second pipeline and the third communication portion is the first position; the communication position between the second pipeline and the fourth communication portion is the second position; The first positions are arranged at intervals along the length direction of the third connecting part; among two adjacent first positions, one of the first positions is arranged adjacent to one side of the third connecting part in the width direction, and the other first position is arranged adjacent to the other side of the third connecting part in the width direction; the second positions are arranged at intervals along the length direction of the fourth connecting part; among two adjacent second positions, one of the second positions is arranged adjacent to one side of the fourth connecting part in the width direction, and the other second position is arranged adjacent to the other side of the fourth connecting part in the width direction; the projection of the first position on the fourth connecting part is arranged at intervals from the second position along the width direction of the fourth connecting part.

9. A cold plate assembly according to claim 5, characterized in that: The second pipeline includes multiple third straight segments, multiple fourth straight segments, and multiple second vertical segments; one end of the second vertical segment is fixedly connected to the third straight segment, and the other end is fixedly connected to the fourth straight segment; the angle between the third straight segment and the second vertical segment is within the first set angle range; the angle between the fourth straight segment and the second vertical segment is within the second set angle range.

10. A cold plate assembly according to claim 9, characterized in that: A portion of the side wall of the first flow channel abuts against a portion of the side wall of the second flow channel.

11. A cold plate assembly according to claim 10, characterized in that: One side of the first connecting portion abuts against one side of the second pipeline; one side of the second connecting portion abuts against one side of the second pipeline; one side of the third connecting portion abuts against one side of the first pipeline; one side of the fourth connecting portion abuts against one side of the first pipeline; Two adjacent first straight sections along the length direction of the first pipeline are respectively abutted against two sides of the second pipeline; The first straight section and the second straight section along the width direction of the first pipeline are respectively in contact with a portion of the side wall of the second pipeline.

12. A cold plate assembly according to claim 1, characterized in that: The cold plate assembly further includes a supporting unit; the supporting unit is disposed between the first flow channel and the second flow channel; the supporting unit abuts against a side wall of the first flow channel and a side wall of the second flow channel respectively.

13. A heat dissipation system, characterized in that: The heat dissipation system comprises a cold plate assembly according to any one of claims 1 to 11, and the heat dissipation system further comprises: A heat dissipation component, wherein the heat dissipation component comprises a cooling unit, a pressurizing unit, a storage unit, a pressure reducing unit, a filling unit, and a discharge unit; the outlet end of the heat exchange unit, the filling unit, the pressurizing unit, the discharge unit, the cooling unit, the pressure reducing unit, and the inlet end of the heat exchange unit are sequentially connected; A cooling medium, wherein at least a portion of the cooling medium is converted from a liquid state to a gas state when flowing through the heat dissipation assembly and the cold plate assembly; A heat generating component transfers heat to the heat exchanging unit.

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