Photovoltaic chip assembly and manufacturing method thereof

Abstract

The invention relates to a photovoltaic chip assembly and a manufacturing method thereof. The photovoltaic chip assembly comprises a photovoltaic chip and a photovoltaic substrate. The photovoltaic chip comprises a chip substrate, at least one positive terminal, at least one negative terminal, at least one first conductive piece and at least one second conductive piece. The chip substrate comprises a chip back face and a chip front face which are arranged back to back in the first direction. The positive terminal is convexly arranged on the back surface of the chip in a first direction, and the first conductive piece is conductively connected between the positive terminal and the photovoltaic substrate; the negative terminal is arranged on the back face of the chip in a protruding mode in the first direction, and the second conductive piece is conductively connected between the negative terminal and the photovoltaic substrate. The positive terminal and the negative terminal are arranged on the back surface of the chip, so that the light receiving area of the front surface of the chip can be effectively increased, and the photoelectric conversion efficiency of the photovoltaic chip is improved; and secondly, the wire welding step caused by the fact that the positive terminal and the negative terminal are arranged on the front face and the back face of the chip respectively can be omitted, and the packaging process is simplified.

Description

Technical Field

[0001] The present disclosure relates to the technical field of photovoltaic chips, and in particular, to a photovoltaic chip assembly and a manufacturing method thereof. Background Art

[0002] Currently, photovoltaic chips generally adopt a vertical structure design, in which the electrodes of the chip are distributed on the front and back of the chip. In the packaging process, the electrode at one end is welded to the substrate, while the electrode at the other end needs to go through the wire bonding step first, and then the lead is connected to the substrate. This method not only has a relatively high packaging cost, but also the electrode solder joints are easy to fall off, which seriously affects the reliability of the chip. Summary of the invention

[0003] The purpose of the present disclosure is to provide a photovoltaic chip assembly and a manufacturing method thereof to solve the technical problems existing in the related art.

[0004] In order to achieve the above-mentioned object, the present disclosure provides a photovoltaic chip assembly, wherein the photovoltaic chip assembly comprises a photovoltaic chip and a photovoltaic substrate; The photovoltaic chip comprises a chip substrate, at least one positive terminal, at least one negative terminal, at least one first conductive member and at least one second conductive member, wherein the chip substrate comprises a chip back side and a chip front side which are arranged opposite to each other in a first direction; The positive terminal is protrudingly disposed on the back side of the chip in the first direction, and the first conductive member is conductively connected between the positive terminal and the photovoltaic substrate; The negative electrode terminal is protrudingly disposed on the back side of the chip in the first direction, and the second conductive member is conductively connected between the negative electrode terminal and the photovoltaic substrate.

[0005] Optionally, the back side of the chip includes a first plane, a second plane and a connection surface, and the first plane and the second plane are connected via the connection surface; The first plane and the second plane are both arranged to extend perpendicularly to the first direction, and the connecting surface is arranged to extend parallel to the first direction; The distance between the first plane and the front surface of the chip in the first direction is a first size, the distance between the second plane and the front surface of the chip in the first direction is a second size, and the first size is greater than the second size; The positive terminal is arranged on the first plane, and the negative terminal is arranged on the second plane.

[0006] Optionally, the first conductive member includes a first end face and a second end face disposed opposite to each other in the first direction, the first end face is conductively connected to an end face of the positive terminal away from the chip substrate, and the second end face is electrically connected to the photovoltaic substrate; The second conductive member comprises a third end face and a fourth end face which are arranged opposite to each other in the first direction, the third end face is conductively connected to the end face of the negative terminal away from the chip substrate, and the fourth end face is electrically connected to the photovoltaic substrate; Wherein, the first end face and the third end face are arranged in a staggered manner, and the second end face and the fourth end face are arranged in a coplanar manner.

[0007] Optionally, the first conductive member is configured as a first electrode pad, and the first end surface of the first electrode pad is welded to an end surface of the positive terminal away from the chip substrate; and / or, The second conductive member is configured as a second electrode pad, and the third end surface of the second electrode pad is welded to an end surface of the negative electrode terminal away from the chip substrate.

[0008] Optionally, the photovoltaic chip assembly further includes a first insulating member, the first insulating member is disposed on the first plane and partially covers the positive terminal, and the first end surface overlaps the first insulating member; and / or, The photovoltaic chip assembly further includes a second insulating member, which is disposed on the second plane and partially covers the negative terminal, and the third end surface is overlapped with the second insulating member.

[0009] Optionally, the positive terminal and the first insulating member have the same size in the first direction; and / or the negative terminal and the second insulating member have the same size in the first direction.

[0010] Optionally, the first insulating member and the second insulating member are constructed as an integrally formed structure.

[0011] The present disclosure further provides a method for manufacturing a photovoltaic chip assembly, the method comprising: Disposing at least one positive terminal and at least one negative terminal on the chip backside of the chip substrate; An insulating member is provided on the back of the chip, and partially covers the positive terminal and the negative terminal; Disposing at least one first conductive member and at least one second conductive member, electrically connecting the first conductive member to the positive terminal, and electrically connecting the second conductive member to the negative terminal; A photovoltaic substrate is provided, and the photovoltaic substrate is electrically connected to the first conductive member and the second conductive member.

[0012] Optionally, providing an insulating member on the back side of the chip and partially covering the positive terminal and the negative terminal comprises: The insulating member formed as a silicon dioxide film layer is prepared on the back side of the chip by chemical vapor deposition.

[0013] Optionally, the providing of at least one first conductive member and at least one second conductive member, electrically connecting the first conductive member to the positive terminal, and electrically connecting the second conductive member to the negative terminal comprises: The positive terminal and the negative terminal are welded to the back of the chip, the first conductive member is welded to the positive terminal, and the second conductive member is welded to the negative terminal; The end surface of the first conductive member electrically connected to the photovoltaic substrate and the end surface of the second conductive member electrically connected to the photovoltaic substrate are arranged on the same plane.

[0014] In the above technical solution, by setting both the positive terminal and the negative terminal on the back of the chip of the chip substrate, the area of ​​the chip front of the chip substrate that receives light can be effectively increased, thereby improving the photoelectric conversion efficiency of the photovoltaic chip; secondly, by setting both the positive terminal and the negative terminal on the back of the chip of the chip substrate, the step of wire bonding caused by setting the positive terminal and the negative terminal on the front and back of the chip respectively can be omitted, thereby reducing costs and simplifying the packaging process. In addition, by setting both the positive terminal and the negative terminal on the back of the chip of the chip substrate, and introducing the first conductive member and the second conductive member, and then electrically connecting with the photovoltaic substrate, the assembly process with the photovoltaic substrate is simplified.

[0015] Other features and advantages of the present disclosure will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings: Figure 1 It is a schematic diagram of the cross-sectional structure of a photovoltaic chip assembly according to an embodiment of the present disclosure.

[0017] Figure 2 A method for manufacturing a photovoltaic chip assembly according to an embodiment of the present invention is disclosed.

[0018] Description of Reference Numerals 1. Photovoltaic chip; 11. Chip substrate; 111. Chip back; 1111. First plane; 1112. Second plane; 1113. Connection surface; 112. Chip front; 12. Positive terminal; 13. Negative terminal; 14. First conductive member; 141. First end face; 142. Second end face; 15. Second conductive member; 151. Third end face; 152. Fourth end face; 2. Photovoltaic substrate; 3. First insulating member; 4. Second insulating member; A. First direction. DETAILED DESCRIPTION

[0019] The specific implementation of the present disclosure is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described herein is only used to illustrate and explain the present disclosure, and is not used to limit the present disclosure.

[0020] Reference Figure 1 As shown, the present disclosure provides a photovoltaic chip assembly, which includes a photovoltaic chip 1 and a photovoltaic substrate 2; the photovoltaic chip 1 includes a chip substrate 11, at least one positive terminal 12, at least one negative terminal 13, at least one first conductive member 14 and at least one second conductive member 15, and the chip substrate 11 includes a chip back surface 111 and a chip front surface 112 that are arranged opposite to each other in a first direction A. The positive terminal 12 is protrudingly arranged on the chip back surface 111 in the first direction A, and the first conductive member 14 is conductively connected between the positive terminal 12 and the photovoltaic substrate 2. The negative terminal 13 is protrudingly arranged on the chip back surface 111 in the first direction A, and the second conductive member 15 is conductively connected between the negative terminal 13 and the photovoltaic substrate 2.

[0021] It should be noted that the chip front side 112 of the chip substrate 11 refers to the side facing the sunlight, that is, the incident side of the light, and the chip back side 111 of the chip substrate 11 refers to the side away from the sunlight.

[0022] In the above technical solution, by setting both the positive terminal 12 and the negative terminal 13 on the chip back 111 of the chip substrate 11, the area of ​​the chip front 112 of the chip substrate 11 receiving light can be effectively increased, thereby improving the photoelectric conversion efficiency of the photovoltaic chip 1; secondly, by setting both the positive terminal 12 and the negative terminal 13 on the chip back 111 of the chip substrate 11, the step of wire bonding caused by setting the positive terminal 12 and the negative terminal 13 on the chip front 112 and the chip back 111 respectively can be omitted, thereby reducing costs and simplifying the packaging process. In addition, by setting both the positive terminal 12 and the negative terminal 13 on the chip back 111 of the chip substrate 11, and introducing the first conductive member 14 and the second conductive member 15, and then electrically connecting with the photovoltaic substrate 2, the assembly process with the photovoltaic substrate 2 is simplified.

[0023] In one embodiment, reference Figure 1As shown, the back side 111 of the chip includes a first plane 1111, a second plane 1112 and a connecting surface 1113, and the first plane 1111 and the second plane 1112 are connected by the connecting surface 1113; the first plane 1111 and the second plane 1112 are both extended and arranged perpendicular to the first direction A, and the connecting surface 1113 is extended and arranged parallel to the first direction A; the dimension of the first plane 1111 from the chip front side 112 in the first direction A is a first dimension, and the dimension of the second plane 1112 from the chip front side 112 in the first direction A is a second dimension, and the first dimension is greater than the second dimension; wherein, the positive terminal 12 is arranged on the first plane 1111, and the negative terminal 13 is arranged on the second plane 1112.

[0024] In this embodiment, firstly, the positive terminal 12 is arranged on the first plane 1111, and the negative terminal 13 is arranged on the second plane 1112, and the first plane 1111 and the second plane 1112 are not coplanar, so that the physical distance between the positive terminal 12 and the negative terminal 13 can be increased to a certain extent, the safety and stability of the circuit are improved, and the risk of short circuit is reduced; secondly, by arranging the positive terminal 12 and the negative terminal 13 at different heights, the connection process of the chip and other components can be simplified to a certain extent, for example, when welding or plugging and unplugging operations, mutual interference between the positive terminal 12 and the negative terminal 13 is avoided. In addition, the non-planar design of the back side 111 of the chip can facilitate the realization of more functional partitions or higher density integration, for example, other components such as capacitors, resistors, etc. can be placed on the second plane 1112, and the layout space in the first direction A can be fully utilized. In addition, by arranging the positive terminal 12 and the negative terminal 13 at different heights, and the first size is larger than the second size, the surface area of ​​the area where the positive terminal 12 is located can be increased, which helps to better dissipate heat. At the same time, different heights can also reduce the heat conduction between the positive terminal 12 and the negative terminal 13, thereby optimizing the overall heat dissipation efficiency.

[0025] In another embodiment, referring to Figure 1 As shown, the first conductive member 14 includes a first end face 141 and a second end face 142 disposed opposite to each other in the first direction A, the first end face 141 is conductively connected to the end face of the positive terminal 12 away from the chip substrate 11, and the second end face 142 is electrically connected to the photovoltaic substrate 2. The second conductive member 15 includes a third end face 151 and a fourth end face 152 disposed opposite to each other in the first direction A, the third end face 151 is conductively connected to the end face of the negative terminal 13 away from the chip substrate 11, and the fourth end face 152 is electrically connected to the photovoltaic substrate 2. Among them, the first end face 141 and the third end face 151 are arranged in a staggered manner, and the second end face 142 and the fourth end face 152 are arranged in the same plane.

[0026] In this embodiment, firstly, since the first end face 141 of the first conductive member 14 is directly connected to the positive terminal 12, and the third end face 151 of the second conductive member 15 is directly connected to the negative terminal 13, and both connection points are far away from the chip substrate 11, this helps to reduce the energy loss caused by the tortuous current path, thereby improving the current transmission efficiency.

[0027] Secondly, the first end face 141 and the third end face 151 are arranged in a staggered manner, so that the positive and negative conductive parts can be separated in a limited space without interfering with each other. This design can effectively utilize space and improve compactness.

[0028] In addition, by setting the corresponding end faces of the first conductive member 14 and the second conductive member 15 (i.e., the second end face 142 and the fourth end face 152) to be coplanar, a stable electrical connection between the second end face 142 and the fourth end face 152 and the photovoltaic substrate 2 is ensured, while also reducing the risk of short circuit.

[0029] In addition, the same-side arrangement can simplify the assembly steps in the manufacturing process, because all key connections can be completed on the same side, reducing the need for multi-angle and multi-side operations and improving production efficiency.

[0030] Optionally, the first conductive member 14 is configured as a first electrode pad, and the first end surface 141 of the first electrode pad is welded to the end surface of the positive terminal 12 away from the chip substrate 11. Welding can effectively enhance the stability of the connection and effectively reduce the risk of separation.

[0031] Optionally, the second conductive member 15 is configured as a second electrode pad, and the third end face 151 of the second electrode pad is welded to the end face of the negative terminal 13 away from the chip substrate 11. Welding can effectively enhance the stability of the connection and effectively reduce the risk of separation.

[0032] In one embodiment, reference Figure 1 As shown, the photovoltaic chip assembly further includes a first insulating member 3 , which is disposed on the first plane 1111 and partially covers the positive terminal 12 , and the first end surface 141 overlaps the first insulating member 3 .

[0033] In this embodiment, the first insulating member 3 effectively prevents possible short circuits by partially covering the positive terminal 12, and further enhances electrical safety, especially in complex installation environments, such as under adverse conditions such as moisture and dust. Secondly, the presence of the insulating member ensures that the current flows only through a predetermined path, reducing the risk of accidental leakage.

[0034] In addition, the first end surface 141 is directly overlapped on the first insulating member 3, which not only provides a stable mechanical connection, but also ensures good contact between the two, and maintains a stable electrical connection even in the case of temperature changes or vibrations. For example, the first end surface 141 and the first insulating member 3 can be connected by bonding.

[0035] Optionally, the positive terminal 12 and the first insulating member 3 have the same size in the first direction A. The design of the same size can ensure the precise alignment between the positive terminal 12 and the first insulating member 3. This helps to reduce errors during the assembly process and ensure that the first end face 141 can be accurately overlapped on the first insulating member 3, thereby achieving reliable electrical connection and mechanical support.

[0036] When the positive terminal 12 and the first insulating member 3 have the same size in the first direction A, they can be arranged more closely in a limited space, reducing unnecessary gaps or redundant spaces. This compact design not only helps to reduce the volume, but also improves the efficiency of the use of the internal space.

[0037] In another embodiment, referring to Figure 1 As shown, the photovoltaic chip assembly further includes a second insulating member 4 , which is disposed on the second plane 1112 and partially covers the negative terminal 13 , and the third end surface 151 overlaps the second insulating member 4 .

[0038] In this embodiment, the second insulating member 4 effectively prevents possible short circuits by partially covering the negative terminal 13, and further enhances electrical safety, especially in complex installation environments, such as under adverse conditions such as moisture and dust. Secondly, the presence of the insulating member ensures that the current flows only through a predetermined path, reducing the risk of accidental leakage.

[0039] In addition, the third end face 151 is directly overlapped on the second insulating member 4, which not only provides a stable mechanical connection, but also ensures good contact between the two, and maintains a stable electrical connection even in the case of temperature changes or vibrations. For example, the third end face 151 and the second insulating member 4 can be connected by bonding.

[0040] Optionally, the negative terminal 13 and the second insulating member 4 have the same size in the first direction A. The design of the same size can ensure the precise alignment between the negative terminal 13 and the second insulating member 4. This helps to reduce errors during the assembly process and ensure that the third end surface 151 can be accurately overlapped on the second insulating member 4, thereby achieving reliable electrical connection and mechanical support.

[0041] When the negative terminal 13 and the second insulating member 4 have the same size in the first direction A, they can be arranged more closely in a limited space, reducing unnecessary gaps or redundant spaces. This compact design not only helps to reduce the volume of the overall assembly, but also improves the efficiency of the use of the internal space.

[0042] Optionally, the first insulating member 3 and the second insulating member 4 are constructed as an integrally formed structure. The integrally formed structure eliminates the connection seam or joint between the two independent insulating members, reducing the risk of loosening or separation due to assembly error, material aging or external impact. This not only enhances the mechanical strength of the overall structure, but also ensures stability and reliability in long-term use.

[0043] Reference Figure 2 As shown, the present disclosure also provides a method for manufacturing a photovoltaic chip assembly, the manufacturing method comprising: S11; at least one positive terminal 12 and at least one negative terminal 13 are provided on the chip back side 111 of the chip substrate 11; S12; an insulating member is provided on the back side of the chip 111, and the positive terminal 12 and the negative terminal 13 are partially covered; S13; providing at least one first conductive member 14 and at least one second conductive member 15, so that the first conductive member 14 is electrically connected to the positive terminal 12, and the second conductive member 15 is electrically connected to the negative terminal 13; S14 ; setting up the photovoltaic substrate 2 , and electrically connecting the photovoltaic substrate 2 to the first conductive member 14 and the second conductive member 15 .

[0044] In the above technical solution, by setting both the positive terminal 12 and the negative terminal 13 on the chip back 111 of the chip substrate 11, the area of ​​the chip front 112 of the chip substrate 11 receiving light can be effectively increased, thereby improving the photoelectric conversion efficiency of the photovoltaic chip 1; secondly, by setting both the positive terminal 12 and the negative terminal 13 on the chip back 111 of the chip substrate 11, the step of wire bonding caused by setting the positive terminal 12 and the negative terminal 13 on the chip front 112 and the chip back 111 respectively can be omitted, thereby reducing costs and simplifying the packaging process. In addition, by setting both the positive terminal 12 and the negative terminal 13 on the chip back 111 of the chip substrate 11, and introducing the first conductive member 14 and the second conductive member 15, and then electrically connecting with the photovoltaic substrate 2, the assembly process with the photovoltaic substrate 2 is simplified.

[0045] Optionally, providing an insulating member on the back side 111 of the chip and partially covering the positive terminal 12 and the negative terminal 13 includes: An insulating member constructed as a silicon dioxide film layer is prepared on the back side 111 of the chip by chemical vapor deposition.

[0046] In this embodiment, silicon dioxide is a high-quality electrical insulating material with high breakdown voltage and low leakage current characteristics. The silicon dioxide film layer formed by the CVD (Chemical Vapor Deposition) process can provide excellent electrical insulation effect and effectively prevent the occurrence of short circuits and other electrical faults. However, the present disclosure does not limit the specific molding method and specific material of the insulating member.

[0047] Optionally, providing at least one first conductive member 14 and at least one second conductive member 15, electrically connecting the first conductive member 14 to the positive terminal 12, and electrically connecting the second conductive member 15 to the negative terminal 13 includes: The positive terminal 12 and the negative terminal 13 are welded to the back side 111 of the chip, the first conductive member 14 is welded to the positive terminal 12, and the second conductive member 15 is welded to the negative terminal 13; The end surface of the first conductive member 14 electrically connected to the photovoltaic substrate 2 and the end surface of the second conductive member 15 electrically connected to the photovoltaic substrate 2 are arranged on the same plane.

[0048] In this embodiment, the welding process can provide reliable mechanical and electrical connections to ensure efficient transmission of current between the components. The low resistance characteristics of the welding point reduce energy loss. The electrical connection end faces of the first conductive member 14 and the second conductive member 15 are designed to be arranged in the same plane, which can effectively utilize space and improve compactness, which not only helps to reduce the overall size, but also facilitates installation and maintenance.

[0049] The preferred embodiments of the present disclosure are described in detail above in conjunction with the accompanying drawings; however, the present disclosure is not limited to the specific details in the above embodiments. Within the technical concept of the present disclosure, a variety of simple modifications can be made to the technical solution of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.

[0050] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.

[0051] In addition, various embodiments of the present disclosure may be arbitrarily combined, and as long as they do not violate the concept of the present disclosure, they should also be regarded as the contents disclosed by the present disclosure.

Claims

1. A photovoltaic chip assembly, characterized in that: The photovoltaic chip assembly includes a photovoltaic chip and a photovoltaic substrate; The photovoltaic chip comprises a chip substrate, at least one positive terminal, at least one negative terminal, at least one first conductive member and at least one second conductive member, wherein the chip substrate comprises a chip back side and a chip front side which are arranged opposite to each other in a first direction; The positive terminal is protrudingly disposed on the back side of the chip in the first direction, and the first conductive member is conductively connected between the positive terminal and the photovoltaic substrate; The negative electrode terminal is protrudingly disposed on the back side of the chip in the first direction, and the second conductive member is conductively connected between the negative electrode terminal and the photovoltaic substrate.

2. The photovoltaic chip assembly according to claim 1, characterized in that: The back side of the chip comprises a first plane, a second plane and a connection surface, and the first plane and the second plane are connected via the connection surface; The first plane and the second plane are both arranged to extend perpendicularly to the first direction, and the connecting surface is arranged to extend parallel to the first direction; The distance between the first plane and the front surface of the chip in the first direction is a first size, the distance between the second plane and the front surface of the chip in the first direction is a second size, and the first size is greater than the second size; The positive terminal is arranged on the first plane, and the negative terminal is arranged on the second plane.

3. The photovoltaic chip assembly according to claim 2, characterized in that: The first conductive member comprises a first end face and a second end face which are arranged opposite to each other in the first direction, the first end face is conductively connected to the end face of the positive terminal away from the chip substrate, and the second end face is electrically connected to the photovoltaic substrate; The second conductive member comprises a third end face and a fourth end face which are arranged opposite to each other in the first direction, the third end face is conductively connected to the end face of the negative terminal away from the chip substrate, and the fourth end face is electrically connected to the photovoltaic substrate; Wherein, the first end face and the third end face are arranged in a staggered manner, and the second end face and the fourth end face are arranged in a coplanar manner.

4. The photovoltaic chip assembly according to claim 3, characterized in that: The first conductive member is configured as a first electrode pad, and the first end surface of the first electrode pad is welded to the end surface of the positive terminal away from the chip substrate; and / or, The second conductive member is configured as a second electrode pad, and the third end surface of the second electrode pad is welded to an end surface of the negative electrode terminal away from the chip substrate.

5. The photovoltaic chip assembly according to claim 3, characterized in that: The photovoltaic chip assembly further includes a first insulating member, which is disposed on the first plane and partially covers the positive terminal, and the first end surface overlaps the first insulating member; and / or, The photovoltaic chip assembly further includes a second insulating member, which is disposed on the second plane and partially covers the negative terminal, and the third end surface is overlapped with the second insulating member.

6. The photovoltaic chip assembly according to claim 5, characterized in that: The positive terminal has the same size as the first insulating member in the first direction; and / or the negative terminal has the same size as the second insulating member in the first direction.

7. The photovoltaic chip assembly according to claim 5, characterized in that: The first insulating member and the second insulating member are constructed as an integrally formed structure.

8. A method for manufacturing a photovoltaic chip assembly, characterized in that: The manufacturing method comprises: Disposing at least one positive terminal and at least one negative terminal on the chip backside of the chip substrate; An insulating member is provided on the back of the chip, and partially covers the positive terminal and the negative terminal; Disposing at least one first conductive member and at least one second conductive member, electrically connecting the first conductive member to the positive terminal, and electrically connecting the second conductive member to the negative terminal; A photovoltaic substrate is provided, and the photovoltaic substrate is electrically connected to the first conductive member and the second conductive member.

9. The method for manufacturing a photovoltaic chip assembly according to claim 8, characterized in that: The step of providing an insulating member on the back of the chip and partially covering the positive terminal and the negative terminal comprises: The insulating member formed as a silicon dioxide film layer is prepared on the back side of the chip by chemical vapor deposition.

10. The method for manufacturing a photovoltaic chip assembly according to claim 8, characterized in that: The step of providing at least one first conductive member and at least one second conductive member, electrically connecting the first conductive member to the positive terminal, and electrically connecting the second conductive member to the negative terminal comprises: The positive terminal and the negative terminal are welded to the back of the chip, the first conductive member is welded to the positive terminal, and the second conductive member is welded to the negative terminal; The end surface of the first conductive member electrically connected to the photovoltaic substrate and the end surface of the second conductive member electrically connected to the photovoltaic substrate are arranged on the same plane.

Images