LED support, LED light-emitting device and light-emitting device

Abstract

The invention provides an LED support, an LED light-emitting device and a light-emitting device, the LED support comprises a packaging body and a substrate partially covered by the packaging body, and the packaging body comprises a side wall surrounding the LED support; the substrate comprises a first substrate area and a second substrate area which are insulated from each other, and an insulating area is arranged between the first substrate area and the second substrate area; the first substrate area comprises a substrate main body and at least one supporting part which is connected with the substrate main body and is arranged in the side wall, the supporting part extends from the substrate main body to protrude in the height direction of the substrate main body, and the supporting part extends towards the direction close to the second substrate area to enter a first side wall area corresponding to the insulation area; according to the LED support, the strength of the side wall of the LED support can be improved to a certain extent, a three-dimensional reinforcing structure is formed, and the situation that the side wall of the LED support is broken due to external force is reduced.

Description

[0001] This application is a divisional application of the original Chinese invention patent application entitled “An LED bracket, LED light-emitting device and light-emitting device”. The application number of the original application is 202110323230.1; the application date of the original application is March 26, 2021. Technical Field

[0002] The present invention relates to the field of LED brackets, and in particular to an LED bracket, an LED light-emitting device and a light-emitting apparatus. Background Art

[0003] SMD LEDs (Light Emitting Diodes) are widely used in lighting, decoration, backlighting, display and other fields. SMD LEDs include an LED bracket and an LED chip arranged on the LED bracket. The LED bracket of existing SMD LEDs usually includes a substrate and a package; wherein the package includes a side wall surrounding the LED bracket. However, the side wall strength of the LED bracket of existing SMD LEDs is not high and is easily broken by external forces such as plate deformation. Summary of the invention

[0004] The present invention provides an LED bracket, an LED light-emitting device and a light-emitting apparatus, which mainly solve the technical problem that the side wall strength of the LED bracket of the existing SMD LED is not high and is easily broken by external forces such as plate deformation.

[0005] In order to solve the above technical problems, the present invention provides an LED bracket, the LED bracket comprising: a package body and a substrate partially covered by the package body, the package body comprising a side wall surrounding the LED bracket; The substrate comprises a first substrate region and a second substrate region insulated from each other, wherein an insulating region is provided between the first substrate region and the second substrate region; The first substrate area includes a substrate body and at least one supporting portion connected to the substrate body and arranged within the side wall, the supporting portion extends from the substrate body to protrude in the height direction of the substrate body, and the supporting portion extends toward the direction close to the second substrate area into the first side wall area corresponding to the insulating area, the side wall of the package body has an inclined surface, the angle between the inclined surface and the substrate body is greater than 90 degrees, and the inclined surface corresponding to the supporting portion does not contact the substrate body.

[0006] Optionally, the supporting portion includes a first supporting body forming an angle with the substrate body and a second supporting body extending from the first supporting body and extending toward the second substrate area; the second supporting body protrudes in the height direction of the substrate body and enters the first side wall area.

[0007] Optionally, the support portion extends toward the second substrate region by a distance not less than a width of the insulating region, and the support portion completely passes through the first sidewall region and enters a second sidewall region corresponding to the second substrate.

[0008] Optionally, the first substrate region further includes an arc-shaped connection area, and the connection area connects the support portion and the substrate body.

[0009] Optionally, in a cross section perpendicular to a side on which the support portion is provided, an angle between an extension direction of a top end of the support portion and the substrate body is greater than or equal to 90 degrees and less than 180 degrees.

[0010] Optionally, the inclined surface contacts the substrate body via a vertical plane.

[0011] Optionally, the first substrate region includes two supporting portions, and the two supporting portions are respectively arranged on a first side and a second side opposite to the first side, and the first side is an adjacent side of a side of the first substrate region close to the second substrate region.

[0012] Optionally, the first substrate region includes a first supporting portion, and the second substrate region includes a second supporting portion, the second supporting portion extends from a substrate body of the second substrate region to protrude in a height direction from the substrate body of the second substrate region, and the second supporting portion extends toward a direction close to the first substrate region into a first sidewall region corresponding to the insulating region; The first supporting portion and the second supporting portion are respectively disposed on a first side and a second side opposite to the first side, and the first side is an adjacent side of a side of the first substrate region close to the second substrate region.

[0013] On the other hand, the present invention further provides an LED light-emitting device, which includes the LED bracket as described above and at least one LED chip arranged on a substrate of the LED bracket.

[0014] On the other hand, the present invention further provides a light-emitting device, comprising the LED light-emitting device as described above. Beneficial Effects

[0015] The LED bracket of the present invention includes a packaging body and a substrate partially covered by the packaging body, the packaging body includes a side wall surrounding the LED bracket; the substrate includes a first substrate area and a second substrate area insulated from each other, and an insulating area is included between the first substrate area and the second substrate area; the first substrate area includes a substrate body and at least one supporting portion connected to the substrate body and arranged within the side wall, the supporting portion extends from the substrate body to protrude in the height direction of the substrate body, and the supporting portion extends in a direction close to the second substrate area into a first side wall area corresponding to the insulating area, the side wall of the packaging body has an inclined surface, the angle between the inclined surface and the substrate body is greater than 90 degrees, and the inclined surface corresponding to the supporting portion does not contact the substrate body. The LED bracket side wall of the present invention is wrapped with a supporting portion, and the supporting portion extends into the first side wall area corresponding to the insulating area, which can increase the strength of the LED bracket side wall to a certain extent, and the supporting portion of the LED bracket also has a certain angle with the substrate body, forming a three-dimensional reinforcement structure. The LED bracket is beneficial to reducing the situation where the side wall of the LED bracket is broken by external force. The side wall of the package body of the present invention includes an inclined surface with an angle greater than 90 degrees with the substrate body. The inclined surface does not contact the substrate body, and the area of ​​the exposed area of ​​the substrate body can be increased without increasing the volume of the package body, thereby improving the light output efficiency of the LED bracket made into an LED light-emitting device. The LED bracket of the present invention has a small volume, high strength, simple structure and low cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic diagram of a top view of an LED bracket provided in the first embodiment of the present invention; Figure 2 A schematic diagram of a top view of an LED bracket provided in the first embodiment of the present invention; Figure 3 for Figure 2 A schematic cross-sectional view of the LED bracket along line AA provided in; Figure 4 A schematic diagram of a top view of an LED bracket provided in the first embodiment of the present invention; Figure 5 A schematic cross-sectional view of an LED bracket provided in Embodiment 1 of the present invention; Figure 6 A schematic cross-sectional view of an LED bracket provided in Embodiment 1 of the present invention; Figure 7 A schematic cross-sectional view of an LED bracket provided in Embodiment 1 of the present invention; Figure 8 A schematic diagram of the top view of the LED bracket provided in the second embodiment of the present invention; Fig. 9 for Figure 8 A schematic cross-sectional view of the LED bracket along line AA provided in; Fig.10 A schematic diagram of a top view of another LED bracket provided in the second embodiment of the present invention; Fig.11 A schematic diagram of a top view of another LED bracket provided in the second embodiment of the present invention; Among them, 1 is the first substrate area; 2 is the second substrate area; 21 is the substrate body; 3 is the insulating area; 4 is the support part; 41 is the first support body; 42 is the second support body; 401 is the first support part; 402 is the second support part; 43 is the connection area; 51 is the first side wall area; 52 is the second side wall area. DETAILED DESCRIPTION

[0017] In order to make the content of the present invention easier to understand, the present invention is further described in detail below through specific implementation methods combined with the accompanying drawings. It should be understood that the specific embodiments described here are only used to explain the present invention and are not used to limit the present invention. Embodiment 1

[0018] In order to solve the problem that the side wall strength of the LED bracket of the existing SMD LED is not high and is easy to break, the present embodiment provides an LED bracket. The LED bracket of the present embodiment includes a package body and a substrate partially covered by the package body, and the package body includes a side wall surrounding the LED bracket. It can be understood that the area inside the side wall forms a groove area that can accommodate the LED chip. In practical applications, the inner circumference of the groove area at a position away from the substrate can be larger, while the inner circumference is smaller at a position close to the substrate, and the thickness of the side wall becomes thinner as it is farther away from the substrate, thereby forming a cup-shaped structure. The package body can be formed on the substrate by materials such as plastics through methods including but not limited to injection molding, casting, and molding. In some examples, after the LED chip is set in the groove area, a transparent encapsulation glue or fluorescent glue can also be used to fill the groove area to encapsulate and protect the LED chip.

[0019] The substrate includes a first substrate region and a second substrate region that are insulated from each other, and an insulating region is included between the first substrate region and the second substrate region. Figure 1 , is a top view of an LED bracket provided in this embodiment. It should be noted that in order to better reflect the structure of the LED bracket in the present invention, the package body is perspectively processed in the accompanying drawings, and the shaded part in the accompanying drawings showing a top view is the top of the side wall; wherein, the first substrate area 1 is larger in area, the second substrate area 2 is smaller in area and is separated from the first substrate area 1 by an insulating area 3, and the first substrate area 1 and the second substrate area 2 are both partially covered by the package body. In the groove formed by the package body, a portion of the first substrate area 1 and the second substrate area 2 are exposed, and this exposed area can be used to set the LED chip and connect to the positive and negative electrodes of the LED chip respectively. For example, for Figure 1In the LED bracket shown in , the LED chip can be arranged in the area exposed by the first substrate area 1, or can be arranged in the areas exposed by the first substrate area and the second substrate area at the same time. The positive electrode of the LED chip is connected to one of the substrate areas, and the negative electrode is connected to the other substrate area. The connection method may include but is not limited to connection through gold wire. It can be understood that the first substrate area and the second substrate area can be two separate substrates, and the insulating area between the first substrate area and the second substrate area can be filled with a package or other non-conductive materials; or on the same substrate, the part of the substrate in the insulating area is a non-conductive material. In this embodiment, the first substrate area includes a substrate body and at least one support portion 4 connected to the substrate body and arranged in the side wall, the support portion 4 extends from the substrate body to protrude from the height direction of the substrate body, and the support portion extends in the direction close to the second substrate area 2 into the first side wall area 51 corresponding to the insulating area 3. This embodiment provides a support portion in the side wall. It can be understood that the support portion can provide support or increase strength. For example, its hardness is higher than that of the side wall, which increases the strength of the side wall of the LED bracket to a certain extent. Since the support portion extends toward the second substrate area and enters the first side wall area corresponding to the insulating area, it has a good strength improvement effect especially for the first side wall area corresponding to the insulating area, which reduces the possibility of the side wall breaking when the LED bracket is subjected to external forces from bottom to top caused by, for example, deformation of the plate.

[0020] It should be noted that the first side wall area corresponding to the insulating area referred to in this embodiment refers to the area where the insulating area contacts the side wall. In other words, from a top-down perspective, the extension direction of the insulating area intersects with the support portion, and the support portion of this portion is not on the same plane as the substrate body, forming a three-dimensional reinforcement structure to ensure the strength of the side wall. In some embodiments, the plate material in the insulating area is easier to deform, and the support portion enters the first side wall area, which better strengthens the weaker part of the side wall of the LED bracket. However, in some specific implementation processes, the support portion can also extend in a direction away from the second substrate area to strengthen the side walls of other parts.

[0021] The support portion may directly protrude upward from the side of the substrate body, or may extend horizontally from the side of the substrate body for a certain distance and then protrude upward, and the upward protrusion includes a vertical upward protrusion and an oblique upward protrusion. Figure 2 as well as Figure 3 , Figure 2 A top view of another LED bracket provided in this embodiment, Figure 3 for Figure 2 The schematic cross-sectional view of the LED bracket along line AA is shown in FIG. Figure 2 as well as Figure 3In the example of the LED bracket shown, a support portion 4 with a quadrilateral cross section is directly extended from the side of the substrate body near the top, and the thickness of the support portion 4 is generally set to be less than the thickness of the substrate body 21 (the thickness of the support portion and the substrate body here refers to the thickness of the substrate body). Figure 3 The top of the support portion 4 is higher than the substrate body 21, and the support portion 4 is extended along the substrate body 21 of the first substrate area 1 toward the second substrate area 2, and enters the first sidewall area 51. The shape of the support portion can be set as needed, for example, but not limited to a semi-C shape, an inverted L shape, etc. Figure 4 , illustrating a semi-C-shaped support portion, which extends directly from the side of the substrate body and protrudes obliquely upward. Figure 3 The side wall of the package body has an inclined surface, and the angle between the inclined surface and the substrate body 21 is greater than 90 degrees, so that the light is reflected by the side wall to improve the light extraction efficiency, wherein the inclined surface of the side wall corresponding to the support portion 4 extends toward the substrate body 21 but does not contact the substrate body 21. When the support portion 4 is surrounded by the side wall, there must be a certain distance between the support portion 4 and the surrounding surface of the package body to ensure the strength of the package body. Therefore, when the inclined surface of the side wall contacts the substrate body 21, and the support portion 4 is provided inside the side wall, if the area of ​​the exposed area of ​​the substrate body 21 for fixing the LED chip is to be ensured, the support portion 4 must retreat to the outside of the package body, and the volume of the package body will increase. The present invention designs the inclined surface of the side wall not to contact the substrate body 21, so that the area of ​​the exposed area of ​​the substrate body can be increased without increasing the volume of the package body.

[0022] In some embodiments, see Figure 3, the inclined surface of the side wall contacts the substrate body 21 through a vertical plane. In some embodiments, the support portion includes a first support body connected to the substrate body and a second support body extending from the first support body, and the second support body extends from the first support body to the second substrate area for a certain distance and enters the first side wall area corresponding to the insulating area. It should be noted that the support portion can be integrally formed, that is, the first support body and the second support body can be two parts on the integrally formed support portion. It should be noted that the first support body can extend only in the horizontal direction along a direction perpendicular or non-perpendicular to the side of the substrate body, and the second support body protrudes in the height direction after extending from the first support body and extends to the second substrate area; the first support body can also protrude to a certain height, and the second support body extends from the first support body to the second substrate area horizontally; or the first support body and the second support body both protrude in the height direction, as long as at least a part of the second support body entering the first side wall area is higher than the substrate body. Through the support body structure consisting of two sections, the first support body and the second support body, the side wall strength is enhanced while the bonding force between the bracket and the packaging body is ensured. In some implementation processes, the slope of the protrusion of the first support body can be set to be flatter than that of the second support body. The bonding force between the bracket and the packaging body is increased by the flatter first support body, thereby making the bonding between the bracket and the packaging body more stable and less likely to be separated due to external force.

[0023] In some embodiments, the distance that the support portion extends to the second substrate region is not less than the width of the insulating region. It is understandable that the sidewall region reached by the support portion can enhance its strength to a certain extent. The support portion can completely pass through the first sidewall region, that is, the sidewall region corresponding to the insulating region, and enter the second sidewall region corresponding to the second substrate region. The second sidewall region referred to here refers to the part of the region where the second substrate region contacts the sidewall. In such an embodiment, for example Figure 1 The LED bracket, from a top view, the extension direction of the insulating area 3 (i.e. along Figure 1 The support portion 4 extends in the vertical direction and completely intersects with the support portion 4, which can better enhance the strength of the side wall of the insulating area in some scenarios.

[0024] In some embodiments, the first substrate area further includes an arc-shaped connection area, and the connection area connects the support portion and the substrate body. It should be noted that the arc-shaped connection area refers to the arc-shaped corner when the support portion protrudes in the height direction, for example, Figure 5 , Figure 5 Can be Figure 1 or Figure 4 The schematic cross-sectional view of the LED bracket along the line AA is shown. Figure 1 or Figure 4When the support portion of the LED bracket shown is connected to the substrate body 21 through the arc-shaped connection area 43, when the support portion 4 is observed along the cross section of the line AA, it can also be seen that the arc-shaped connection area 43 forms an arc-shaped corner. It can be understood that if the first substrate area is integrally formed, the connection area can be integral with the support portion and the substrate body. If the support portion and the substrate body are independent, the arc-shaped connection area can be an integral structure with either the support portion or the substrate body, and is fixedly connected to the other. In fact, the arc-shaped connection area can be regarded as a part of the support portion or a part extending from the substrate, or in some embodiments, as a part of the first support body. It should be understood that the arc-shaped connection area allows a smooth transition between the support portion and the substrate body, further increases the contact surface with the package body, is conducive to improving airtightness, and is conducive to guiding the incoming water vapor to spread in the direction of the support portion, thereby reducing the risk of moisture inside the LED bracket.

[0025] In some embodiments, the first substrate area includes two supporting portions, which are respectively arranged on a first side and a second side opposite to the first side, wherein the first side is an adjacent side of a side of the first substrate area close to the second substrate area; it can be understood that the second side is another adjacent side of the side of the first substrate area close to the second substrate area.

[0026] In some embodiments, in a cross section perpendicular to the side where the support portion is provided, the support portion extends in a horizontal direction away from the substrate body, and the angle between the top extension direction of the support portion and the substrate body is greater than or equal to 90 degrees and less than 180 degrees, thereby avoiding the formation of a concave cavity and reducing the difficulty of molding the LED bracket. Figure 6 as well as Figure 7 As shown, the angle between the top extension direction of the support portion and the substrate body is equal to 90 degrees; and please refer to Figure 5 , Figure 5 Show Figure 1 or Figure 4 The cross section perpendicular to the side where the support portion is provided (i.e., the cross section along line AA, where line AA is perpendicular to the side where the support portion is provided), wherein the angle between the top extension direction of the support portion and the substrate body is greater than 90 degrees but less than 180 degrees. However, it can be understood that in order to increase the strength of the side wall, the support portion should be wrapped in the side wall of the package body regardless of the angle between the support portion and the substrate body. If the LED bracket includes two support portions, the angle between the top extension direction of the two support portions and the substrate body can be set to be the same, so that the strength of both sides of the LED bracket is more consistent.

[0027] The support portion may be made of a material with a higher hardness than the package body. In one example, the package body may be made of a material such as plastic, and the support portion may have a higher hardness than the plastic used. The support portion may be made of a metal material, or other materials. In some embodiments, the first substrate region is a conductive substrate, and the substrate body thereof uses a conductive metal material. For example, the first substrate region may include but is not limited to a copper substrate, an aluminum substrate, an iron substrate, a silver substrate, etc. The support portion is made of the same material as the substrate body, such as a metal material, and the first substrate region is integrally formed to ensure the integrity of the structure. When forming, for example Figure 1 , Figure 4 In some examples of the LED bracket shown in the figure, the support portion can be an extended area on the first substrate area, which is formed by bending it to a desired angle by stamping or the like; Figure 2 as well as Figure 3 In some examples of the LED bracket shown, the support part and the substrate can be formed into the desired shape by etching and other processes; of course, the formation method of the support part involved in this embodiment is not limited to the above-listed methods. After the support part is formed, it is packaged with plastic and other materials to form a packaging structure such as a side wall.

[0028] The LED bracket provided in this embodiment includes a package body and a substrate partially covered by the package body, the package body includes a side wall surrounding the LED bracket, the substrate includes a first substrate area and a second substrate area insulated from each other, the first substrate area and the second substrate area include an insulating area, the first substrate area includes a substrate body and at least one support portion connected to the substrate body and arranged within the side wall, the support portion extends from the substrate body to protrude from the height direction of the substrate body, and the support portion extends in a direction close to the second substrate area into a first side wall area corresponding to the insulating area. The LED bracket of this embodiment increases the strength of the side wall through the above-mentioned support portion, especially the strength of the first side wall area corresponding to the insulating area is significantly improved, reducing the situation where the side wall is broken due to external forces such as plate deformation, thereby ensuring the quality of the LED bracket and the LED light-emitting device manufactured using the same. Embodiment 2

[0029] This embodiment further illustrates the LED bracket of the present invention in combination with a specific LED bracket structure.

[0030] See also Figure 8 as well as Fig. 9 In one example, the first substrate area 1 and the second substrate area 2 of the LED bracket structure in this embodiment are two independent conductive metal substrates, and support parts are symmetrically arranged on both sides of the first substrate area 1 about the direction perpendicular to the line AA, and the support parts extend from the substrate body of the first substrate area 1.

[0031] The support portion includes a first support body 41, and a second support body 42 extends from the top of the first support body 41. The second support body 42 extends toward the second substrate area 2 along a direction parallel to the side edge of the first side. The second support body 42 passes through the first side wall area 51 corresponding to the insulating area 3 and enters the second side wall area 52 corresponding to the second substrate area 2, thereby enhancing the overall side wall strength of the LED bracket, especially the strength of the area where the second support body 51 is provided in the side wall is significantly improved.

[0032] For example Fig. 9 ,for Figure 8 In the cross-sectional diagram along line AA, the arc-shaped connection area 43 realizes a smooth transition between the substrate body 21 and the first support body 41, which is beneficial to guide the water vapor that has entered to spread toward the support part, reducing the risk of moisture inside the LED bracket in some implementation processes.

[0033] See also Fig.10 , which is an example of another LED bracket provided in this embodiment. In this example, a first support portion 401 and a second support portion 402 are respectively provided on the substrate bodies of the first substrate area 1 and the second substrate area 2. Similar to the first support portion 401, the second support portion 402 extends from the substrate body of the second substrate area 2 to protrude in the height direction of the substrate body of the second substrate area 2, and extends in the direction of the first substrate area into the first side wall area corresponding to the insulating area, and the first support portion 401 and the second support portion 402 are respectively provided on the first side and the second side opposite to the first side. In this example, the first support portion 401 and the second support portion 402 are centrally symmetrically arranged about the center of the insulating area 3, and the first support portion 401 and the second support portion 402 have the same shape.

[0034] See also Fig.11 In the example shown, the first support portion 401 and the second support portion 402 are respectively provided on the substrate bodies of the first substrate area 1 and the second substrate area 2. The area of ​​the first substrate area 1 is larger than that of the second substrate area 2, and the first support portion 401 connected thereto is arranged at a longer distance in the direction perpendicular to the line AA, which also improves the strength of the side wall next to the first substrate area 1. In the direction perpendicular to the line AA, the first support portion 401 and the second support portion 402 cover most of the area, and the overall strength of the side wall of the LED bracket is better guaranteed.

[0035] The LED bracket of the present embodiment has a supporting portion inside the side wall. The supporting portion is not on the same plane as the substrate body, and extends from the side wall areas on both sides of the first substrate area to the second side wall area corresponding to the second substrate area, thereby enhancing the strength of the side wall. At the same time, the substrate body and the supporting portion of the LED bracket of the present embodiment have a smooth transition through an arc-shaped connecting area, thereby reducing the risk of moisture inside the LED bracket. Embodiment 3

[0036] This embodiment provides an LED light-emitting device, which includes the LED bracket exemplified in the above-mentioned embodiment 1 or embodiment 2, and at least one LED chip arranged on a substrate of the above-mentioned LED bracket.

[0037] This embodiment provides a light-emitting device, which includes the LED light-emitting device of the above example. It can be applied to various light-emitting fields, for example, it can be made into a backlight module for display backlight field (it can be a backlight module of a terminal such as a TV, a display, a mobile phone, etc.). At this time, it can be applied to a backlight module. In addition to being applied to the display backlight field, it can also be applied to the key backlight field, the shooting field, the home lighting field, the medical lighting field, the decoration field, the automotive field, the transportation field, etc. When applied to the key backlight field, it can be used as a key backlight light source for mobile phones, calculators, keyboards, etc. with key devices; when applied to the shooting field, it can be made into a camera flash; when applied to the home lighting field, it can be made into a floor lamp, a table lamp, a lighting lamp, a ceiling lamp, a downlight, a projection lamp, etc.; when applied to the medical lighting field, it can be made into a surgical lamp, a low electromagnetic lighting lamp, etc.; when applied to the decoration field, it can be made into various decorative lamps, such as various colored lights, landscape lighting lamps, and advertising lamps; when applied to the automotive field, it can be made into car lights, car indicator lights, etc.; when applied to the transportation field, it can be made into various traffic lights, and it can also be made into various street lights. The above applications are merely several applications exemplified in this embodiment. It should be understood that the application of the light emitting device in this embodiment is not limited to the several fields exemplified above.

[0038] It should be noted that the number, shape and size relationship of each element in the drawings do not represent the actual situation of the elements, but are only schematic diagrams for easy understanding. The embodiments of the present invention are described above in conjunction with the drawings, but the present invention is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are only illustrative and not restrictive. Under the enlightenment of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the present invention and the claims, which are all within the protection of the present invention.

Claims

1. An LED bracket, characterized in that: The LED bracket comprises: a package body and a substrate partially covered by the package body, wherein the package body comprises a side wall surrounding the LED bracket; The substrate comprises a first substrate region and a second substrate region insulated from each other, wherein an insulating region is provided between the first substrate region and the second substrate region; The first substrate region includes a substrate body and at least one supporting portion connected to the substrate body and disposed within the side wall, the supporting portion extending from the substrate body to protrude in a height direction of the substrate body, and the supporting portion extends toward a direction close to the second substrate region into a first side wall region corresponding to the insulating region; The side wall of the package body has an inclined surface, and the angle between the inclined surface and the substrate body is greater than 90 degrees. The inclined surface corresponding to the supporting part does not contact the substrate body.

2. The LED bracket according to claim 1, characterized in that: The supporting portion includes a first supporting body connected to the substrate body and a second supporting body extending from the first supporting body and toward the second substrate region; the second supporting body protrudes in a height direction of the substrate body and enters the first sidewall region.

3. The LED bracket according to claim 1, characterized in that: The support portion extends toward the second substrate region by a distance not less than a width of the insulating region, and the support portion completely passes through the first sidewall region and enters a second sidewall region corresponding to the second substrate.

4. The LED bracket according to any one of claims 1 to 3, characterized in that: The first substrate region further includes an arc-shaped connection area, and the connection area connects the support portion and the substrate body.

5. The LED bracket according to any one of claims 1 to 3, characterized in that: In a cross section perpendicular to a side where the support portion is provided, an angle between an extension direction of a top end of the support portion and the substrate body is greater than or equal to 90 degrees and less than 180 degrees.

6. The LED bracket according to any one of claims 1 to 3, characterized in that: The inclined surface contacts the substrate body via a vertical plane.

7. The LED bracket according to claim 1, characterized in that: The first substrate region includes two supporting portions, and the two supporting portions are respectively arranged on a first side and a second side opposite to the first side, and the first side is an adjacent side of a side of the first substrate region close to the second substrate region.

8. The LED bracket according to claim 1, characterized in that: The first substrate region includes a first supporting portion, and the second substrate region includes a second supporting portion, the second supporting portion extends from a substrate body of the second substrate region to protrude in a height direction from the substrate body of the second substrate region, and the second supporting portion extends toward a direction close to the first substrate region into a first sidewall region corresponding to the insulating region; The first supporting portion and the second supporting portion are respectively disposed on a first side and a second side opposite to the first side, and the first side is an adjacent side of a side of the first substrate region close to the second substrate region.

9. An LED light-emitting device, characterized in that: The LED light-emitting device comprises the LED bracket according to any one of claims 1 to 8 and at least one LED chip arranged on a substrate of the LED bracket.

10. A light emitting device, characterized in that: The light emitting device comprises the LED light emitting device according to claim 9.

Images