Tackifying resin and preparation method thereof

Abstract

The present disclosure provides a tackifying resin, comprising: a repeating unit (a) derived from a petroleum resin-based monomer; and a repeating unit (b) derived from a phenolic monomer, in which an ethylenically unsaturated compound containing an epoxy group is bonded to the repeating unit (b), and the tackifying resin may have a large number of residual double bonds, and thus the heat resistance of an acrylic adhesive containing the tackifying resin may be improved.

Description

Technical Field

[0001] The present invention relates to a tackifying resin and a preparation method thereof. Background Art

[0002] Adhesives are used as materials for fixing members in various fields including automobiles, electronic and electrical products, and building materials.

[0003] For example, at automobile manufacturing sites, adhesives are used to fix automobile interior components to the interior of the automobile. In addition, at manufacturing sites for electronic devices such as mobile phones and liquid crystal displays, adhesives are used to fix cushioning materials installed inside electronic products to protect electronic products from impacts, to fix external components of electronic products, and to fix components constituting image display devices such as liquid crystal display devices, organic electroluminescent (EL) display devices, and plasma display panels (PDPs).

[0004] As for adhesives, in order to reduce environmental impact, there is a transition from solvent-based adhesives to water-based adhesives, and in recent years, water-based acrylic adhesives having acrylic polymers dispersed in an aqueous medium are preferably used.

[0005] Acrylic adhesives are often used in admixture with tackifying resins to further improve adhesive properties such as bond strength and constant weight holding power.

[0006] However, when used with such a tackifying resin, the reactivity with the acrylic polymer contained in the acrylic adhesive may be low and the softening point may be low, and thus, the heat resistance may also be deteriorated.

[0007] Therefore, the demand for tackifying resins capable of improving the heat resistance of acrylic adhesives has increased. Summary of the invention

[0008] Technical issues

[0009] In order to solve the above problems, the present disclosure provides a tackifying resin having excellent reactivity with an acrylic polymer and thus improving the heat resistance of an acrylic adhesive, and a method of preparing the tackifying resin.

[0010] Technical Solution

[0011] One aspect of the present disclosure relates to a tackifying resin, comprising: a repeating unit (a) derived from a petroleum resin-based monomer; and a repeating unit (b) derived from a phenol-based monomer, wherein an ethylenically unsaturated compound including an epoxy group is bonded to the repeating unit (b).

[0012] Another aspect of the present disclosure relates to a method for preparing a tackifying resin, comprising: preparing a primary polymer from a first reaction composition comprising a petroleum resin monomer and a phenolic monomer; and preparing the tackifying resin from a second reaction composition, wherein the second reaction composition comprises the primary polymer and an ethylenically unsaturated compound comprising an epoxy group.

[0013] Beneficial Effects

[0014] The tackifying resin according to the present disclosure may have increased reactivity with the acrylic polymer.

[0015] Furthermore, the tackifying resin according to the present disclosure may have excellent reactivity with the acrylic polymer, and thus, the heat resistance of the acrylic adhesive including the acrylic polymer and the tackifying resin may be improved. DETAILED DESCRIPTION

[0016] Hereinafter, further aspects and various embodiments of the present disclosure will be described in more detail.

[0017] The terms or words used herein should not be limited to the usual or dictionary meanings, but should be interpreted as meanings and concepts corresponding to the technical ideas of the present disclosure based on the principle that the inventor can appropriately define term concepts to interpret the present disclosure in the best manner.

[0018] The terms used herein are only used for the purpose of describing specific embodiments and are not intended to limit the present disclosure. Unless the context clearly indicates otherwise, the singular form as used herein is also intended to include the plural form. In the present disclosure, it should be understood that terms such as "comprising" or "having" are intended to specify the presence of features, numbers, steps, operations, components, parts or any combination thereof described in this specification, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts or any combination thereof.

[0019] Specifically, one aspect of the present disclosure relates to a tackifying resin, comprising: a repeating unit (a) derived from a petroleum resin-based monomer; and a repeating unit (b) derived from a phenol-based monomer, wherein an ethylenically unsaturated compound including an epoxy group is bonded to the repeating unit (b).

[0020] For example, the petroleum resin-based monomer may contain an ethylenically unsaturated group or an aromatic group.

[0021] For example, tackifying resin can include a structure comprising repeating units (a) from petroleum resin monomers and repeating units (b) from phenolic monomers, wherein the olefinic unsaturated compound comprising epoxy group is bonded to repeating unit (b), thereby increasing the ratio of residual double bonds in tackifying resin. Therefore, tackifying resin can have the reactivity with the raising of acrylic polymer described below. Therefore, the heat resistance of the adhesive comprising the tackifying resin can be improved.

[0022] For example, the tackifying resin may contain an ethylenically unsaturated compound containing an epoxy group bonded to the repeating unit (b) to further increase the ratio of the residual double bonds, thereby improving the reactivity of the tackifying resin with the acrylic polymer described below.

[0023] According to one embodiment, the repeating unit (b) may include a hydroxyl group. For example, when a petroleum resin monomer and a phenol monomer are catalytically polymerized, the hydroxyl group remains even after the polymerization reaction, and thus, the repeating unit (b) may include a hydroxyl group.

[0024] According to one embodiment, the bond between the hydroxyl group included in the repeating unit (b) and the ethylenically unsaturated compound including an epoxy group may be formed by a reaction between the hydroxyl group included in the repeating unit (b) and the epoxy group included in the ethylenically unsaturated compound.

[0025] For example, the reaction between the hydroxyl group contained in the repeating unit (b) and the epoxy group contained in the ethylenically unsaturated compound can be performed according to the following reaction scheme 1. In this case, the bond between the hydroxyl group contained in the repeating unit (b) and the epoxy group contained in the ethylenically unsaturated compound can be formed by a ring-opening reaction of the epoxy group contained in the ethylenically unsaturated compound with the hydroxyl group contained in the repeating unit (b):

[0026] <Reaction Scheme 1>

[0027]

[0028] According to one embodiment, the petroleum resin-based monomer may include a commercially applicable liquid C5-C20 fraction, a diene, or dicyclopentadiene.

[0029] According to another embodiment, the petroleum resin-based monomer may include a C5 fraction-based monomer, a C9 fraction-based monomer, a diene, or dicyclopentadiene.

[0030] For example, C5 fraction-class monomers may include 1-pentene, 2-methyl-2-butene-n-pentane, propadiene, cyclopentadiene, piperylene, isoprene, cyclopentene, and the like.

[0031] For example, the C9 fraction-based monomers may include styrene-based monomers, dicyclopentadiene, indene, trans-β-methylstyrene, methylindene, benzene / toluene / xylene (BTX), and the like.

[0032] For example, the diene may include propadiene, dicyclopentadiene, cyclopentene, and the like.

[0033] According to one embodiment, the petroleum resin-based monomers may include C9 fraction-based monomers.

[0034] The C9 fraction-based monomers may include two or more styrene-based monomers represented by Formula 1.

[0035] For example, a styrene monomer may be represented by Formula 1:

[0036] <Formula 1>

[0037]

[0038] Among them, in formula 1,

[0039] a11 is an integer from 0 to 5,

[0040] R 11 and R 12 each independently is: hydrogen, deuterium, -F, -Cl, -Br, -I, cyano or nitro;

[0041] C1-C 20 Alkyl or C1-C 20 Alkoxy, each unsubstituted or substituted with deuterium, -F, -Cl, -Br, -I, cyano, C6-C 20 aryl or any combination thereof; or

[0042] Unsubstituted or deuterated, -F, -Cl, -Br, -I, cyano, C1-C 20 Alkyl, C1-C 20 Alkoxy or any combination thereof substituted C6-C 20 Aryl.

[0043] According to one embodiment, R 11 and R 12 each independently is: hydrogen, deuterium, -F, -Cl, -Br, -I, cyano or nitro;

[0044] methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, isobutyl, tert-butyl, n-pentyl, tert-pentyl, neopentyl, isopentyl, sec-pentyl, 3-pentyl, sec-isopentyl, n-hexyl, isohexyl, sec-hexyl, tert-hexyl, n-heptyl, isoheptyl, sec-heptyl, tert-heptyl, n-octyl, isooctyl, sec-octyl, tert-octyl, n-nonyl, isononyl, sec-nonyl, tert-nonyl, n-decyl, isodecyl, sec-decyl, tert-decyl, methoxy, ethoxy, n-propoxy, isopropoxy, n-butoxy, sec-butoxy, isobutoxy, tert-butoxy, n-pentyloxy, tert-pentyloxy, neopentyloxy, isopentyloxy, sec-pentyloxy, 3-pentyloxy, sec-isopentyloxy, n-hexyloxy, isohexyloxy, sec-hexyloxy, tert-hexyloxy, n-heptyloxy, isoheptyloxy, sec-heptyloxy, tert-heptyloxy, n-octyloxy, isooctyloxy, sec-octyloxy, tert-octyloxy, n-nonyloxy, isononyloxy, sec-nonyloxy, tert-nonyloxy, n-decyloxy, isodecyloxy, sec-decyloxy or tert-decyloxy, each unsubstituted or substituted with deuterium, -F, -Cl, -Br, -I, cyano, C6-C 20 aryl or any combination thereof; or

[0045] Phenyl, naphthyl, anthracenyl, phenanthrenyl or pyrenyl, each unsubstituted or substituted with deuterium, -F, -Cl, -Br, -I, cyano, C1-C 20 Alkyl, C6-C 20 aryl or any combination thereof.

[0046] According to one embodiment, R 11 and R 12 Each of them may independently be hydrogen, methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, isobutyl, tert-butyl, n-pentyl, tert-pentyl, neopentyl, isopentyl, sec-pentyl, 3-pentyl, sec-isopentyl, n-hexyl, isohexyl, sec-hexyl or tert-hexyl.

[0047] According to one embodiment, R 12 It may be hydrogen or methyl.

[0048] According to one embodiment, the C9 fraction type monomers may include styrene monomers and α-methylstyrene monomers.

[0049] According to one embodiment, in the C9 fraction type monomers, the ratio of the amount of the α-methylstyrene monomer to the amount of the styrene monomer may be 0.25 to 2.

[0050] For example, the ratio of the amount of the repeating unit (b) derived from the phenolic monomer to the amount of the repeating unit (a) derived from the petroleum resin monomer may be 0.5 to 2, 0.5 to 1.8, 0.75 to 2, 0.75 to 1.8, 1 to 2, 1 to 1.8, 1.2 to 2, 1.4 to 2, 1.2 to 1.8, or 1.4 to 1.8.

[0051] According to one embodiment, the phenolic monomer may be represented by Formula 2:

[0052] <Formula 2>

[0053]

[0054] Among them, in formula 2,

[0055] a21 is an integer from 0 to 5,

[0056] R 21 is: hydrogen, deuterium, -F, -Cl, -Br, -I, hydroxy, cyano or nitro;

[0057] C1-C 20 Alkyl or C1-C 20 Alkoxy, each unsubstituted or substituted with deuterium, -F, -Cl, -Br, -I, hydroxy, cyano, C6-C 20 aryl or any combination thereof; or

[0058] Unsubstituted or substituted with deuterium, -F, -Cl, -Br, -I, hydroxyl, cyano, C1-C 20 Alkyl, C1-C 20 Alkoxy or any combination thereof substituted C6-C 20 Aryl.

[0059] According to one embodiment, R 21 It can be: hydrogen, deuterium, -F, -Cl, -Br, -I, hydroxyl, cyano or nitro;

[0060] methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, isobutyl, tert-butyl, n-pentyl, tert-pentyl, neopentyl, isopentyl, sec-pentyl, 3-pentyl, sec-isopentyl, n-hexyl, isohexyl, sec-hexyl, tert-hexyl, n-heptyl, isoheptyl, sec-heptyl, tert-heptyl, n-octyl, isooctyl, sec-octyl, tert-octyl, n-nonyl, isononyl, sec-nonyl, tert-nonyl, n-decyl, isodecyl, sec-decyl, tert-decyl, methoxy, ethoxy, n-propoxy, isopropoxy, n-butoxy, sec-butoxy, isobutoxy, tert- butoxy, n-pentyloxy, tert-pentyloxy, neopentyloxy, isopentyloxy, sec-pentyloxy, 3-pentyloxy, sec-isopentyloxy, n-hexyloxy, isohexyloxy, sec-hexyloxy, tert-hexyloxy, n-heptyloxy, isoheptyloxy, sec-heptyloxy, tert-heptyloxy, n-octyloxy, isooctyloxy, sec-octyloxy, tert-octyloxy, n-nonyloxy, isononyloxy, sec-nonyloxy, tert-nonyloxy, n-decyloxy, isodecyloxy, sec-decyloxy or tert-decyloxy, each unsubstituted or substituted with deuterium, -F, -Cl, -Br, -I, hydroxy, cyano, C6-C 20 aryl or any combination thereof; or

[0061] Phenyl, naphthyl, anthracenyl, phenanthrenyl or pyrenyl, each unsubstituted or substituted with deuterium, -F, -Cl, -Br, -I, hydroxyl, cyano, C1-C 20 Alkyl, C6-C 20 aryl or any combination thereof.

[0062] According to one embodiment, R 21 It may be hydrogen, methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, isobutyl, tert-butyl, n-pentyl, tert-pentyl, neopentyl, isopentyl, sec-pentyl, 3-pentyl, sec-isopentyl, n-hexyl, isohexyl, sec-hexyl or tert-hexyl.

[0063] According to one embodiment, the (meth)acrylic acid monomer may include methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, methyl methacrylate, ethyl methacrylate, propyl methacrylate, butyl methacrylate, or any combination thereof.

[0064] According to one embodiment, the phenolic monomer may include phenol.

[0065] According to one embodiment, the ratio of the amount of the repeating unit (b) derived from the phenol-based monomer to the amount of the repeating unit (a) derived from the petroleum resin-based monomer may be 0.15 to 1.

[0066] For example, the ratio of the amount of the repeating unit (b) derived from the phenolic monomer to the amount of the repeating unit (a) derived from the petroleum resin monomer may be 0.2 to 1, 0.2 to 0.8, 0.2 to 0.6, 0.2 to 0.5, 0.2 to 0.45, 0.22 to 1, 0.23 to 1, or 0.23 to 0.5.

[0067] According to one embodiment, the ethylenically unsaturated monomer including an epoxy group may include a vinyl group, an allyl group, or an acryl group.

[0068] According to one embodiment, the ethylenically unsaturated monomer including an epoxy group may be a compound represented by Formula 3:

[0069] <Formula 3>

[0070]

[0071] Among them, in formula 3,

[0072] L 31 It may be *-C(=O)-*', *-C(=S)-*', *-C(=O)-O-*', *-O-*' or *-S-*'.

[0073] According to one embodiment, L 31It can be *-C(=O)-*', *-C(=O)-O-*' or *-O-*'. According to another embodiment, L 31 It may be *-C(=O)-O-* or *-O-*'.

[0074] * and *' may each refer to a binding site with an adjacent atom.

[0075] n31 and n32 may each independently be an integer of 0 to 5.

[0076] According to one embodiment, n31 and n32 may each independently be an integer from 0 to 3.

[0077] According to another embodiment, n31 may be an integer from 0 to 2. In addition, n32 may be an integer from 1 to 3.

[0078] R 31 To R 34 are each independently: hydrogen, deuterium, -F, -Cl, -Br, -I, hydroxyl, cyano or nitro;

[0079] C1-C 20 Alkyl or C1-C 20 Alkoxy, each unsubstituted or substituted with deuterium, -F, -Cl, -Br, -I, hydroxy, cyano, C6-C 20 aryl or any combination thereof; or

[0080] Unsubstituted or substituted with deuterium, -F, -Cl, -Br, -I, hydroxyl, cyano, C1-C 20 Alkyl, C1-C 20 Alkoxy or any combination thereof substituted C6-C 20 Aryl.

[0081] According to one embodiment, in Formula 3, R 31 To R 34 may each independently be: hydrogen, deuterium, -F, -Cl, -Br, -I, cyano or nitro;

[0082] methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, isobutyl, tert-butyl, n-pentyl, tert-pentyl, neopentyl, isopentyl, sec-pentyl, 3-pentyl, sec-isopentyl, n-hexyl, isohexyl, sec-hexyl, tert-hexyl, n-heptyl, isoheptyl, sec-heptyl, tert-heptyl, n-octyl, isooctyl, sec-octyl, tert-octyl, n-nonyl, isononyl, sec-nonyl, tert-nonyl, n-decyl, isodecyl, sec-decyl, tert-decyl, methoxy, ethoxy, n-propoxy, isopropoxy, n-butoxy, sec-butoxy, isobutoxy, tert-butoxy, n-pentyloxy, tert-pentyloxy, neopentyloxy, isopentyloxy, sec-pentyloxy, 3-pentyloxy, sec-isopentyloxy, n-hexyloxy, isohexyloxy, sec-hexyloxy, tert-hexyloxy, n-heptyloxy, isoheptyloxy, sec-heptyloxy, tert-heptyloxy, n-octyloxy, isooctyloxy, sec-octyloxy, tert-octyloxy, n-nonyloxy, isononyloxy, sec-nonyloxy, tert-nonyloxy, n-decyloxy, isodecyloxy, sec-decyloxy or tert-decyloxy, each unsubstituted or substituted with deuterium, -F, -Cl, -Br, -I, cyano, C6-C 60 aryl or any combination thereof; or

[0083] Phenyl, naphthyl, anthracenyl, phenanthrenyl or pyrenyl, each unsubstituted or substituted with deuterium, -F, -Cl, -Br, -I, cyano, C1-C 20 Alkyl, C6-C 20 aryl or any combination thereof.

[0084] According to one embodiment, in Formula 3, R 31 To R 34 may each independently be: hydrogen, deuterium, -F, -Cl, -Br, -I, cyano or nitro; or

[0085] methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, isobutyl, tert-butyl, n-pentyl, tert-pentyl, neopentyl, isopentyl, sec-pentyl, 3-pentyl, sec-isopentyl, n-hexyl, isohexyl, sec-hexyl, tert-hexyl, n-heptyl, isoheptyl, sec-heptyl, tert-heptyl, n-octyl, isooctyl, sec-octyl, tert-octyl, n-nonyl, isononyl, sec-nonyl, tert-nonyl, n-decyl, isodecyl, sec-decyl, tert-decyl, methoxy, ethoxy, n-propoxy, isopropoxy, n-butoxy, sec-butoxy, isobutoxy, tert-butoxy, n-pentyloxy, tert-pentyloxy, neopentyloxy, isopentyloxy, sec-pentyloxy, 3-pentyloxy, sec-isopentyloxy, n-hexyloxy, isohexyloxy, sec-hexyloxy, tert-hexyloxy, n-heptyloxy, isoheptyloxy, sec-heptyloxy, tert-heptyloxy, n-octyloxy, isooctyloxy, sec-octyloxy, tert-octyloxy, n-nonyloxy, isononyloxy, sec-nonyloxy, tert-nonyloxy, n-decyloxy, isodecyloxy, sec-decyloxy or tert-decyloxy, each unsubstituted or substituted with deuterium, -F, -Cl, -Br, -I, cyano, C6-C 60 aryl or any combination thereof.

[0086] According to one embodiment, in Formula 3, R 31 To R 34 They may each independently be: hydrogen, deuterium, -F, -Cl, -Br, -I, cyano or nitro; or methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, isobutyl, tert-butyl, n-pentyl, tert-pentyl, neopentyl, isopentyl, sec-pentyl, 3-pentyl, sec-isopentyl, n-hexyl, isohexyl, sec-hexyl, tert-hexyl, n-heptyl, isoheptyl, sec-heptyl, tert-heptyl, n-octyl, isooctyl, sec-octyl, tert-octyl, n-nonyl, isononyl, sec-nonyl, tert-nonyl, n-decyl, isodecyl, sec-decyl or tert-decyl.

[0087] According to another embodiment, in Formula 3, R 31 To R 34 They may each independently be hydrogen, deuterium, -F, -Cl, -Br, -I, hydroxy, cyano, nitro, methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, isobutyl or tert-butyl.

[0088] According to one embodiment, the ethylenically unsaturated monomer including an epoxy group may be a compound represented by Formula 3-1:

[0089] <Formula 3-1>

[0090]

[0091] Among them, in formula 3-1,

[0092] R 31 To R 34 and n32 may be the same as described herein.

[0093] According to another embodiment, the ethylenically unsaturated monomer including an epoxy group may be a compound represented by Formula 3-2:

[0094] <Formula 3-2>

[0095]

[0096] According to one embodiment, the amount of the repeating unit (a) derived from the petroleum resin-based monomer may be 40 wt % to 70 wt % based on the total weight of the tackifying resin, the amount of the repeating unit (b) derived from the phenolic monomer may be 10 wt % to 40 wt % based on the total weight of the tackifying resin, and the amount of the ethylenically unsaturated compound containing an epoxy group bonded to the repeating unit (b) may be 10 wt % to 40 wt % based on the total weight of the tackifying resin.

[0097] For example, the amount of the repeating unit (a) derived from the petroleum resin-based monomer may be 45 to 70 wt%, 50 to 70 wt%, 40 to 69 wt%, 40 to 68 wt%, or 45 to 69 wt%, based on the total weight of the tackifying resin.

[0098] For example, the amount of repeating units (b) derived from the phenolic monomer can be 12 wt % to 30 wt %, 14 wt % to 30 wt %, 15 wt % to 30 wt %, 10 wt % to 28 wt %, 10 wt % to 26 wt %, 10 wt % to 25 wt %, or 14 wt % to 26 wt %, based on the total weight of the tackifying resin.

[0099] For example, the amount of the ethylenically unsaturated compound containing an epoxy group bonded to the repeating unit (b) can be 15 wt % to 40 wt %, 19 wt % to 40 wt %, 20 wt % to 40 wt %, 21 wt % to 40 wt %, 22 wt % to 40 wt %, 10 wt % to 30 wt %, 10 wt % to 28 wt %, 10 wt % to 27 wt %, or 19 wt % to 28 wt %, based on the total weight of the tackifying resin.

[0100] According to one embodiment, by 1 The amount of double bonds in the tackifying resin measured by H-NMR may be 2 mol % to 10 mol %.

[0101] For example, by 1 The amount of double bonds in the tackifying resin measured by H-NMR may be 2 mol % to 5 mol %, 2 mol % to 4.5 mol %, 2 mol % to 4.4 mol %, 2.2 mol % to 5 mol %, 2.7 mol % to 5 mol %, 2.8 mol % to 5 mol %, 3.0 mol % to 5 mol %, 2.2 mol % to 4.5 mol %, 2.7 mol % to 4.5 mol %, 2.8 mol % to 4.5 mol %, 3.0 mol % to 4.5 mol %, 2.2 mol % to 4.4 mol %, 2.7 mol % to 4.4 mol %, 2.8 mol % to 4.4 mol %, or 3.0 mol % to 4.4 mol %.

[0102] The amount of double bonds (mol%) in the tackifying resin can be determined by dissolving the tackifying resin in CDCl3 solvent to a concentration of 10% and then measuring the double bonds using a 400 MHz 1 H-NMR. For example, 1 H-NMR measures the NMR peaks of the entire range (9.0 ppm to 0.0 ppm), and then calculates the ratio of the integrated value of the double bond range (6.2 ppm to 5.1 ppm) to the integrated value of the entire range (9.0 ppm to 0.0 ppm) to measure the amount (mol %) of double bonds in the tackifying resin.

[0103] According to one embodiment, the weight average molecular weight (Mw) of the tackifying resin may be from 400 g / mol to 3,000 g / mol.

[0104] For example, the weight average molecular weight (Mw) of the tackifying resin can be 800 g / mol to 3,000 g / mol, 1,200 g / mol to 3,000 g / mol, 1,700 g / mol to 3,000 g / mol, 1,800 g / mol to 3,000 g / mol, 1,900 g / mol to 3,000 g / mol, 400 g / mol to 2,800 g / mol, 800 g / mol to 2,800 g / mol, 1,200 g / mol to 2,800 g / mol, 1,200 g / mol to 2,600 g / mol, or 1,700 g / mol to 2,600 g / mol.

[0105] According to another embodiment, the weight average molecular weight (Mw) of the tackifying resin may be 400 g / mol to 600 g / mol, 400 g / mol to 580 g / mol, or 400 g / mol to 550 g / mol.

[0106] According to one embodiment, the number average molecular weight (Mn) of the tackifying resin may be 400 g / mol to 6,000 g / mol.

[0107] For example, the number average molecular weight (Mn) of the tackifying resin can be 500 g / mol to 6,000 g / mol, 600 g / mol to 6,000 g / mol, 700 g / mol to 6,000 g / mol, 800 g / mol to 6,000 g / mol, 500 g / mol to 5,000 g / mol, 600 g / mol to 5,000 g / mol, 700 g / mol to 5,000 g / mol, 800 g / mol to 5,000 g / mol, 500 g / mol to 4,500 g / mol, 600 g / mol to 4,500 g / mol, 700 g / mol to 4,500 g / mol, or 800 g / mol to 4,500 g / mol.

[0108] According to one embodiment, the Z average molecular weight (Mz) of the tackifying resin may be 30,000 g / mol to 120,000 g / mol.

[0109] For example, the Z-average molecular weight of the tackifying resin may be 33,000 g / mol to 120,000 g / mol, 35,000 g / mol to 120,000 g / mol, 30,000 g / mol to 110,000 g / mol, 33,000 g / mol to 110,000 g / mol, 35,000 g / mol to 110,000 g / mol, 30,000 g / mol to 80,000 g / mol, 33,000 g / mol to 80,000 g / mol, 35,000 g / mol to 80,000 g / mol, 30 ... 0,000 g / mol, 35,000 g / mol to 80,000 g / mol, 30,000 g / mol to 70,000 g / mol, 35,000 g / mol to 70,000 g / mol, 30,000 g / mol to 65,000 g / mol, 33,000 g / mol to 65,000 g / mol, 35,000 g / mol to 65,000 g / mol, or 35,000 g / mol to 63,000 g / mol.

[0110] According to one embodiment, the polymer dispersion index (PDI) of the tackifying resin may be 2 to 10. For example, the polymer dispersion index (PDI) of the tackifying resin may be 2 to 9, 2 to 8.5, 2 to 8, 2 to 5, 2 to 4, 2 to 3.6, 2 to 3, or 2.1 to 3.

[0111] For example, when the average molecular weight value and PDI of the tackifying resin satisfy the above ranges, the tackifying resin may have increased reactivity with the acrylic polymer.

[0112] According to one embodiment, the softening point of the tackifying resin may be 100° C. or lower.

[0113] For example, the softening point of the tackifying resin can be 20°C to 100°C, 20°C to 80°C, 20°C to 70°C, 20°C to 65°C, 30°C to 100°C, 35°C to 100°C, 40°C to 100°C, 42°C to 100°C, 45°C to 100°C, or 20°C to 68°C.

[0114] Another aspect of the present disclosure provides a method for preparing a tackifying resin, comprising: preparing a primary polymer from a first reaction composition comprising a petroleum resin monomer and a phenolic monomer; and preparing the tackifying resin from a second reaction composition, wherein the second reaction composition comprises the primary polymer and an ethylenically unsaturated compound comprising an epoxy group.

[0115] For example, the types, properties, amounts of the petroleum resin-based monomers, phenolic monomers, and epoxy-containing ethylenically unsaturated compounds, and the properties of the tackifying resin are the same as those described herein.

[0116] According to one embodiment, the ratio of the amount of the phenolic monomer to the amount of the petroleum resin monomer in the first reaction composition may be 0.15 to 1.

[0117] For example, the ratio of the amount of phenolic monomer to the amount of petroleum resin monomer in the first reaction composition can be 0.2 to 0.8, 0.2 to 0.6, 0.2 to 0.5, 0.2 to 0.45, 0.22 to 1, 0.23 to 1, or 0.23 to 0.5.

[0118] For example, the monomer in the first reaction composition may refer to the remaining components except the solvent among the components included in the first reaction composition.

[0119] According to one embodiment, the first reaction composition may further comprise a solvent.

[0120] For example, the solvent may include xylene.

[0121] According to one embodiment, the amount of the solvent in the first reaction composition may be 30 wt % to 70 wt % based on the total weight of the first reaction composition.

[0122] According to one embodiment, the ratio of the weight of total monomers to the weight of solvent in the first reaction composition may be 0.5 to 2.

[0123] According to one embodiment, the first reactant composition may further comprise a catalyst.

[0124] For example, the catalyst may include an acid catalyst. For example, the acid catalyst may include a BF3 catalyst or an AlCl3 catalyst.

[0125] According to one embodiment, the amount of the catalyst in the first reaction composition may be 0.05 wt % to 0.3 wt % based on the total amount of monomers.

[0126] For example, the amount of catalyst in the first reaction composition can be 0.1 wt % to 0.3 wt %, 0.15 wt % to 0.3 wt %, 0.16 wt % to 0.3 wt %, 0.05 wt % to 0.25 wt %, or 0.05 wt % to 0.2 wt %, based on the total amount of monomers.

[0127] According to one embodiment, the preparation of the primary polymer may include performing catalytic polymerization to prepare the primary polymer from the first reaction composition.

[0128] According to one embodiment, the catalytic polymerization may be carried out at a temperature below 100°C. For example, the catalytic polymerization may be carried out at a temperature below 80°C, below 60°C, below 50°C, or in a temperature range of -20°C to 60°C.

[0129] According to one embodiment, the preparation of the primary polymer may include performing catalytic polymerization and then performing a first degassing reaction to prepare the primary polymer.

[0130] For example, the first degassing reaction may be performed at a temperature of 150° C. to 300° C. and a pressure of 1 mbar to 50 mbar for 1 minute to 20 minutes.

[0131] According to another embodiment, the first degassing reaction may be performed at a temperature of 220 to 280° C. and a pressure of 5 to 25 mbar for 5 to 15 minutes, or at a temperature of 240 to 260° C. and a pressure of 5 to 15 mbar for 8 to 12 minutes.

[0132] For example, in preparing the primary polymer, catalytic polymerization may be performed to prepare the primary polymer containing a hydroxyl group. For example, the hydroxyl group contained in the primary polymer may undergo a bonding reaction with an ethylenically unsaturated compound containing an epoxy group, which will be described below.

[0133] According to one embodiment, in preparing the tackifying resin from the second reaction composition, a bonding reaction between a hydroxyl group in the primary polymer included in the first reaction composition and an epoxy group in the ethylenically unsaturated compound may be performed to prepare the tackifying resin.

[0134] For example, the bonding reaction between the hydroxyl group contained in the primary polymer and the epoxy group contained in the ethylenically unsaturated compound can be performed according to Reaction Scheme 1:

[0135] <Reaction Scheme 1>

[0136]

[0137] According to one embodiment, preparing the tackifying resin may include thermally polymerizing the second reaction composition to prepare the tackifying resin.

[0138] For example, the bonding reaction between the hydroxyl group in the primary polymer and the epoxy group in the ethylenically unsaturated compound can be performed by thermal polymerization.

[0139] According to one embodiment, the thermal polymerization may be performed at a temperature range of 150 to 300° C. For example, the thermal polymerization may be performed at a temperature range of 160 to 300° C., 180 to 300° C., 150 to 260° C., 150 to 220° C., or 160 to 220° C.

[0140] According to one embodiment, the second reaction composition may include a catalyst. For example, the catalyst included in the second reaction composition may include a base catalyst.

[0141] According to one embodiment, the base catalyst may include NaOH or KOH.

[0142] According to one embodiment, when the second reaction composition comprises a catalyst, thermal polymerization may be performed at a temperature range of 50° C. to 120° C. For example, thermal polymerization of the second reaction composition may be performed at a temperature range of 60° C. to 120° C., 70° C. to 120° C., 50° C. to 110° C., 50° C. to 100° C., or 50° C. to 95° C.

[0143] According to one embodiment, the preparation of the tackifying resin may include, after performing thermal polymerization, performing a second degassing reaction to prepare the tackifying resin.

[0144] For example, the second degassing reaction may be performed at a temperature of 120° C. to 250° C. and a pressure of 1 mbar to 50 mbar for 1 minute to 20 minutes.

[0145] According to another embodiment, the second degassing reaction may be performed at a temperature of 150 to 250° C. and a pressure of 5 to 25 mbar for 5 to 15 minutes, or at a temperature of 180 to 220° C. and a pressure of 5 to 15 mbar for 8 to 12 minutes.

[0146] According to one embodiment, the tackifying resin may be applied to an adhesive. According to another embodiment, the tackifying resin may be applied to an acrylic adhesive.

[0147] Another aspect of the present disclosure may provide an adhesive comprising the above-mentioned tackifying resin. For example, the tackifying resin may impart adhesive strength to the adhesive.

[0148] According to one embodiment, the adhesive may be an acrylic adhesive comprising a tackifying resin and an acrylic polymer. For example, the tackifying resin may have excellent reactivity with the acrylic polymer, thereby improving the heat resistance of the acrylic adhesive. For example, as the amount of residual double bonds in the tackifying resin increases, the reactivity with the acrylic polymer may be excellent, and therefore, the heat resistance of the acrylic adhesive may be excellent.

[0149] According to one embodiment, the acrylic adhesive may be a photocurable acrylic adhesive.

[0150] For example, the acrylic adhesive may further contain a crosslinking agent, a polymerization initiation catalyst, a curing accelerator, and the like in addition to the tackifying resin and the acrylic polymer.

[0151] According to one embodiment, in the acrylic adhesive, the amount of the tackifying resin may be 5 wt % or more based on the total weight of the acrylic adhesive.

[0152] According to another embodiment, in the acrylic adhesive, the amount of the tackifying resin may be 5 wt % to 30 wt %, 5 wt % to 25 wt %, or 5 wt % to 20 wt %, based on the total weight of the acrylic adhesive.

[0153] According to one embodiment, the acrylic adhesive may have excellent heat resistance and be transparent. In this case, the acrylic adhesive may allow light to penetrate uniformly therein, allowing the photocuring reaction to proceed uniformly. Therefore, the heat resistance of the acrylic adhesive may be further improved.

[0154] [Definition of terms]

[0155] In this manual, C1-C 20 The alkyl group refers to a linear or branched aliphatic hydrocarbon monovalent group having 1 to 20 carbon atoms, and specific examples thereof include methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, isobutyl, tert-butyl, n-pentyl, tert-pentyl, neopentyl, isopentyl, sec-pentyl, 3-pentyl, sec-isopentyl, n-hexyl, isohexyl, sec-hexyl, tert-hexyl, n-heptyl, isoheptyl, sec-heptyl, tert-heptyl, n-octyl, isooctyl, sec-octyl, tert-octyl, n-nonyl, isononyl, sec-nonyl, tert-nonyl, n-decyl, isodecyl, sec-decyl, tert-decyl, and the like. In the present specification, C1-C 20 Alkylene refers to a C1-C 20 Alkyl is a divalent group of the same structure.

[0156] In this manual, C1-C 20 Alkoxy refers to a group having the formula -OA 101 A monovalent group (wherein A 101 It is C1-C 20 Specific examples thereof include methoxy, ethoxy, isopropoxy and the like.

[0157] In this manual, C6-C 20 Aryl refers to a monovalent group of a carbocyclic aromatic system having 6 to 20 carbon atoms, including phenyl, naphthyl, anthracenyl, phenanthrenyl, pyrenyl, etc. 20 When the aryl group includes two or more rings, the two or more rings may be linked to each other.

[0158] Hereinafter, the present disclosure will be described in more detail by way of examples. These examples are only for illustrative purposes to describe the present disclosure in more detail, and it is obvious to those skilled in the art that these examples should not be construed as limiting the scope of the present disclosure.

[0159] Example 1. Preparation of tackifying resin

[0160] In a 1000 ml kettle, monomers (ASM: α-methylstyrene, ST: styrene, and phenol) were injected according to the mixing amounts (weight %) described in Table 1 below, and 375 g of xylene was added as a solvent to prepare a first reaction composition.

[0161] 3.46 g (0.24 wt % based on the total weight of the monomers) of catalyst BF3-phenolate (BF3 26%) was added to the first reaction composition, and then polymerization was performed at 0° C. for 120 minutes. Subsequently, a first degassing reaction was performed at a temperature of 250° C. and a pressure of 10 mbar for 10 minutes to prepare a primary polymer.

[0162] Subsequently, the primary polymer and an ethylenically unsaturated compound containing an epoxy group (GMA: glycidyl methacrylate) were mixed according to the mixing amounts (weight %) described in Table 1 below to prepare a second reaction composition.

[0163] The second reaction composition was thermally polymerized at 210° C. for 1 hour. Subsequently, a second degassing reaction was performed at a temperature of 210° C. and a pressure of 10 mbar for 10 minutes to prepare a tackifying resin.

[0164] Examples 2 to 7 and Comparative Example 1

[0165] A tackifying resin was prepared in the same manner as in Example 1, except that the amounts of the monomer, catalyst, and ethylenically unsaturated compound and the reaction conditions were changed as shown in Table 1 below.

[0166] In Comparative Example 1, a tackifying resin was prepared in the same manner as in Example 1, except that the bonding reaction of the ethylenically unsaturated compound was not performed, as shown in Table 1 below.

[0167] Comparative Example 2

[0168] In a 1000ml chemical reactor equipped with a stirrer, a reflux condenser, a thermometer and a nitrogen injection device, 180g of α-methylstyrene, 120g of styrene, 75g of phenol and 75g of glycidyl methacrylate were injected, and 450g of xylene was added as a solvent to prepare a first reaction composition.

[0169] 3.46 g (0.24 wt % based on the total weight of the monomers) of catalyst BF3 was added to the first reaction composition, and then polymerization was performed at 0° C. for 120 minutes. Subsequently, a first degassing reaction was performed at a temperature of 250° C. and a pressure of 10 mbar for 10 minutes to prepare a tackifying resin.

[0170] [Table 1]

[0171]

[0172] Evaluation Example 1. Molecular weight measurement

[0173] The weight average molecular weight (Mw), number average molecular weight (Mn), Z average molecular weight (Mz) and polymer dispersion index (PDI) of the tackifying resins prepared in Examples 1 to 7 and Comparative Examples 1 and 2 were measured using gel permeation chromatography (GPC, a product of Hewlett Packard, model name HP-1100).

[0174] The measurement of Mw, Mn, Mz and PDI of the tackifying resin was carried out at 30°C, wherein each 100 μl of the tackifying resin prepared in Examples 1 to 7 and Comparative Examples 1 and 2 was dissolved in tetrahydrofuran to a concentration of 4,000 ppm, injected into the GPC, and then flowed at a flow rate of 1.0 mL / min while using tetrahydrofuran as the mobile phase of the GPC. For the column, three Plgels (1,000+500+100A) of Agilent Technologies, Inc. were connected in series. As a detector, an RI detector (product of Hewlett Packard, HP-1047A) was used, and the measurement was carried out at 30°C. The measurement results are shown in Table 2 below.

[0175] Evaluation Example 2-1. Amount of GMA in Resin (mol %)

[0176] For the tackifying resins prepared in Examples 1 to 7 and Comparative Examples 1 and 2, the moles of GMA reacted were calculated by subtracting the moles of unreacted GMA remaining after preparing the tackifying resin from the moles of GMA added during the preparation.

[0177] The mole % of GMA was calculated by calculating the ratio of the mole number of the primary polymer added during the preparation of the tackifying resin to the mole number of GMA participating in the reaction. The results are shown in Table 2 below.

[0178] Evaluation Example 2-2. Measurement of the amount of double bonds in resin (mol %)

[0179] Each tackifying resin prepared in Examples 1 to 7 and Comparative Examples 1 and 2 was added to a CDCl3 solvent to prepare a sample having a concentration of 10%. For each sample, the concentration of tackifying resin was measured from 0.0 ppm to 9.0 ppm by using a 400 MHz NMR device. 1 H-NMR spectrum. The peak value in the range of 6.2 ppm to 5.1 ppm was integrated, and then the ratio thereof to the integrated value of the entire range was calculated to calculate the amount of double bonds (mol %). The results are shown in Table 2 below.

[0180] Evaluation Example 3. Measurement of softening point

[0181] The softening points of the tackifying resins prepared in Examples 1 to 7 and Comparative Examples 1 and 2 were measured by using a ring and ball softening method (ASTM E 28). Each of the tackifying resins prepared in Examples 1 to 7 and Comparative Examples 1 and 2 was melted and poured into a ring mold, placed in a beaker containing glycerin, a ball was placed on the ring mold containing each resin, and then the temperature was increased by 2.5° C. / min to measure the temperature (softening point) at which the resin melted and the ball fell.

[0182] [Table 2]

[0183]

[0184] Preparation of acrylic adhesive

[0185] 15 wt % of each tackifying resin of Examples 1 to 7 and Comparative Examples 1 and 2 was mixed with 85 wt % of an acrylic polymer to prepare an acrylic adhesive.

[0186] Evaluation Example 4. Heat resistance evaluation

[0187] According to the ASTM D3654 method, the heat resistance of each acrylic adhesive containing the tackifying resin of Examples 1 to 7 and Comparative Examples 1 and 2 was evaluated. Each acrylic adhesive containing the tackifying resin of Examples 1 to 7 and Comparative Examples 1 and 2 was coated on a PET film at a thickness of 50 μm to prepare an adhesive tape. Each prepared adhesive tape was UV-irradiated by an exposure device, and then the tape was cut into a 1 inch×6 inch piece to prepare a test specimen.

[0188] The prepared samples are attached to the cleaned SUS 304 steel plates respectively. At this time, for the samples not attached to the steel plates, the required part for measurement is compressed by moving the roller back and forth once on them using a roll down device from Cheminstruments, Inc. Subsequently, the samples not attached to the SUS 304 steel plates are cut into a size of about 3 inches using scissors. The samples not attached to the SUS 304 steel plates are inserted into the rings for measuring cohesion. On the front and back sides of the SUS 304 steel plates, two transparent tapes for fixing are attached in parallel with the horizontal ends of the rings for measuring cohesion into which the samples are inserted, and then the samples are fixed by stapling 2 times in parallel between the rings for cohesion measurement and the SUS 304 steel plates. The remaining samples are cut so that the samples are attached to the SUS 304 steel plates with a size of 1 inch wide and 1 inch high.

[0189] The SUS 304 steel plate with the sample attached was hung on the SUS steel plate holder in the shear test oven. A 1 kg weight was hung on the ring for measuring the holding force attached to the sample. Then, the temperature of the oven was increased at a rate of 0.5 degrees per minute, and the temperature at which the weight was dropped is shown in Table 3 below.

[0190] [Table 3]

[0191] Classification Heat resistance(℃) Example 1 70.3 Example 2 69.5 Example 3 71.6 Example 4 72.3 Example 5 70.4 Example 6 75.2 Example 7 65.5 Comparative Example 1 40.2 Comparative Example 2 Gel formed and could not be measured

[0192] As shown in Table 3, when the heat resistance and adhesive strength of the acrylic adhesives of Examples 1 to 7 and Comparative Examples 1 and 2 were compared, Examples 1 to 7 had excellent heat resistance.

[0193] The above embodiments and comparative examples are described as embodiments for illustrating the present disclosure, and therefore the present disclosure is not limited thereto. It is obvious to those skilled in the art that various modifications can be made to implement the present disclosure, and therefore, the technical protection scope of the present disclosure should be limited by the attached claims.

Claims

1. A tackifying resin comprising: Repeating units (a) derived from petroleum resin monomers; and Repeating units (b) derived from phenolic monomers, in, An ethylenically unsaturated compound including an epoxy group is bonded to the repeating unit (b).

2. The tackifying resin according to claim 1, in, The bond between the repeating unit (b) and the ethylenically unsaturated compound including an epoxy group is formed by a reaction between a hydroxyl group included in the repeating unit (b) and an epoxy group included in the ethylenically unsaturated compound.

3. The tackifying resin according to claim 1, in, The petroleum resin monomers include C9 fraction monomers.

4. The tackifying resin according to claim 3, in, The C9 fraction-based monomers include two or more styrene-based monomers represented by Formula 1: <Formula 1> Among them, in formula 1, a11 is an integer from 0 to 5, R 11 and R 12 each independently is: hydrogen, deuterium, -F, -Cl, -Br, -I, cyano or nitro; C1-C 20 Alkyl or C1-C 20 Alkoxy, each unsubstituted or substituted with deuterium, -F, -Cl, -Br, -I, cyano, C6-C 20 aryl or any combination thereof; or Unsubstituted or deuterated, -F, -Cl, -Br, -I, cyano, C1-C 20 Alkyl, C1-C 20 Alkoxy or any combination thereof substituted C6-C 20 Aryl.

5. The tackifying resin according to claim 3, in, The C9 fraction-class monomers include styrene monomers and α-methylstyrene monomers.

6. The tackifying resin according to claim 5, in, In the C9 fraction-based monomers, a ratio of the amount of the α-methylstyrene monomer to the amount of the styrene monomer is 0.25 to 2.

7. The tackifying resin according to claim 1, in, The phenolic monomer is represented by Formula 2: <Formula 2> Among them, in formula 2, a21 is an integer from 0 to 5, R 21 is: hydrogen, deuterium, -F, -Cl, -Br, -I, hydroxy, cyano or nitro; C1-C 20 Alkyl or C1-C 20 Alkoxy, each unsubstituted or substituted with deuterium, -F, -Cl, -Br, -I, hydroxy, cyano, C6-C 20 aryl or any combination thereof; or Unsubstituted or substituted with deuterium, -F, -Cl, -Br, -I, hydroxyl, cyano, C1-C 20 Alkyl, C1-C 20 Alkoxy or any combination thereof substituted C6-C 20 Aryl.

8. The tackifying resin according to claim 1, in, The weight ratio of the repeating unit (b) derived from the phenolic monomer to the repeating unit (a) derived from the petroleum resin monomer is 0.15 to 1.

9. The tackifying resin according to claim 1, in, The ethylenically unsaturated compound containing an epoxy group contains a vinyl group, an allyl group, or an acryloyl group.

10. The tackifying resin according to claim 1, in, The ethylenically unsaturated compound containing an epoxy group is represented by Formula 3: <Formula 3> Among them, in formula 3, L 31 is *-C(=O)-*′, *-C(=S)-*′, *-C(=O)-O-*′, *-O-*′ or *-S-*′, n31 and n32 are each independently an integer from 0 to 5, R 31 To R 34 are each independently: hydrogen, deuterium, -F, -Cl, -Br, -I, hydroxyl, cyano or nitro; C1-C 20 Alkyl or C1-C 20 Alkoxy, each unsubstituted or substituted with deuterium, -F, -Cl, -Br, -I, hydroxy, cyano, C6-C 20 aryl or any combination thereof; or Unsubstituted or substituted with deuterium, -F, -Cl, -Br, -I, hydroxyl, cyano, C1-C 20 Alkyl, C1-C 20 Alkoxy or any combination thereof substituted C6-C 20 Aryl.

11. The tackifying resin according to claim 1, in, The amount of the repeating unit (a) derived from a petroleum resin monomer is 40 wt % to 70 wt % based on the total weight of the tackifying resin. The amount of the repeating unit (b) derived from the phenolic monomer is 10 wt % to 40 wt % based on the total weight of the tackifying resin, and The amount of the ethylenically unsaturated compound including an epoxy group bonded to the repeating unit (b) is 10 wt % to 40 wt % based on the total weight of the tackifying resin.

12. The tackifying resin according to claim 1, in, pass 1 The amount of double bonds in the tackifying resin measured by H-NMR is 2 mol% to 10 mol%.

13. The tackifying resin according to claim 1, in, The weight average molecular weight (Mw) of the tackifying resin is 400 g / mol to 3,000 g / mol, The number average molecular weight (Mn) of the tackifying resin is 400 g / mol to 6,000 g / mol, The Z average molecular weight (Mz) of the tackifying resin is 30,000 g / mol to 120,000 g / mol, The polymer dispersion index (PDI) of the tackifying resin is 2 to 10.

14. The tackifying resin according to claim 1, in, The softening point of the tackifying resin is 100° C. or lower.

15. A method for preparing a tackifying resin, comprising: preparing a primary polymer from a first reaction composition comprising a petroleum resin monomer and a phenolic monomer; and The tackifying resin is prepared from a second reaction composition comprising the primary polymer and an ethylenically unsaturated compound comprising epoxy groups.

16. The method for preparing a tackifying resin according to claim 15, in, The first reaction composition further comprises a catalyst, and The preparation of the primary polymer includes performing catalytic polymerization to prepare the primary polymer from the first reaction composition.

17. The method for preparing a tackifying resin according to claim 16, in, The catalytic polymerization is carried out at a temperature of 100° C. or less in the presence of an acid catalyst.

18. The method for preparing a tackifying resin according to claim 15, in, The preparation of the tackifying resin from the second reaction composition includes performing a bonding reaction between the hydroxyl groups in the primary polymer and the epoxy groups in the ethylenically unsaturated compound to prepare the tackifying resin.

19. The method for preparing a tackifying resin according to claim 18, in, The bonding reaction between the hydroxyl groups in the primary polymer and the epoxy groups in the ethylenically unsaturated compound to prepare the tackifying resin includes thermal polymerization at a temperature of 150°C to 300°C.

20. The method for preparing a tackifying resin according to claim 18, in, The second reaction composition comprises a base catalyst, The bonding reaction between the hydroxyl group in the primary polymer and the epoxy group in the ethylenically unsaturated compound is carried out at a temperature of 50° C. to 120° C. in the presence of the base catalyst.

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