Plasma generation device and control method thereof

Abstract

According to the plasma generating device and the control method of the plasma generating device, the plasma generating efficiency is improved, and the reaction body can be prevented from being damaged by reducing the residual induced voltage. The plasma generating device includes: a reaction body having an internal space; the first conductive part is in a disconnected ring shape and is arranged on one surface of the reaction body; the second conductive part is in a disconnected ring shape and is arranged on the other surface of the reaction body; and a first conductive path connecting the first other end of the first conductive portion and the second other end of the second conductive portion, the second other end of the second conductive portion facing the first other end of the first conductive portion.

Description

Technical Field

[0001] The present invention relates to a plasma generator and a control method for a plasma generator. More specifically, the plasma generator and the control method for a plasma generator not only improve the plasma generation efficiency but also prevent the reaction body from being damaged by reducing the residual induced voltage. Background Art

[0002] Plasma refers to a non-neutral substance in a high-energy state with a sufficiently high density of electric charges. When electrical stimulation or microwaves are applied to a neutral gas, ionized gas molecules and free electrons are generated. Furthermore, under conditions such as an electric field, electrons and ions can achieve a plasma state or maintain the electrical characteristics of plasma through continuous collisions.

[0003] Plasma can be widely used in a variety of industrial fields, including semiconductor processes such as etching, deposition, washing, and ashing, or chamber cleaning processes. Recently, as the size of processed substrates such as wafers increases, there is a need for plasma sources that have high control capabilities for plasma energy, large-area processing capabilities, and can effectively perform post-processing of process byproducts such as exhaust gases. Summary of the invention

[0004] The plasma generating device disclosed in the above patent document comprises: a reaction body made of quartz material; and a conductive part performing the functions of a magnetic core and a winding surrounding the reaction body.

[0005] On the other hand, in the field of plasma generators, an important problem is the generation of foreign matter such as particles. A high initial voltage is required to ionize neutral gas molecules, but this voltage itself can damage the reaction body and generate fine particles. Particles can reduce the precision of processes such as etching, deposition, cleaning, and ashing. In addition, as it was confirmed that the H-field formed by the induced voltage of the plasma generator accelerates the damage to the reaction body, the inventors completed the present invention based on this fact.

[0006] That is, in order to solve the above-mentioned problems, an object of the present invention is to provide a plasma generating apparatus which not only has a high plasma control capability but also can suppress damage caused by induced voltage and generation of particles even when the plasma generating apparatus is enlarged.

[0007] Still another object of the present invention is to provide a control method or process processing method for a plasma generating device which not only has a high plasma control capability but also can suppress damage and particle generation due to induced voltage even when the device is large-scaled.

[0008] Another object of the present invention is to provide a process processing system including the above-mentioned plasma generating device.

[0009] The purpose of the present invention is not limited to the technical purpose mentioned above, and ordinary technicians in the technical field to which the present invention belongs can clearly understand other technical purposes not mentioned through the following records.

[0010] In order to achieve the above-mentioned purpose, a plasma generating device according to one embodiment of the present invention includes: a reaction body having an internal space; a first conductive part in the shape of a broken ring, arranged on one surface of the above-mentioned reaction body; a second conductive part in the shape of a broken ring, at least a part of which is arranged on the above-mentioned reaction body; and a first conductive path connecting the first other end of the above-mentioned first conductive part and the second other end of the above-mentioned second conductive part.

[0011] The second conductive part is arranged on the other surface of the reaction body, and the first other end and the second other end can overlap and face each other.

[0012] Alternatively, the second conductive portion is arranged on the outer peripheral surface of the reaction body, the first end of the first conductive portion and the first end of the second conductive portion are located on the same side based on a virtual standard line, and the first other end and the second other end can be located on the same side based on the virtual standard line.

[0013] Furthermore, the first conductive path may include a first switching element.

[0014] In a plurality of embodiments, the plasma generating device further comprises: a power supply unit; and a second conductive path electrically connecting the power supply unit to the first end of the first conductive unit.

[0015] Furthermore, the second conductive path includes a second switching element, and at any time point, the plasma generating device may be connected to only one of the first switching element and the second switching element.

[0016] In a plurality of embodiments, the plasma generating device may further include a third conductive path, wherein the third conductive path includes a third switching element, and the third conductive path electrically connects the power supply unit to the second other end of the second conductive unit.

[0017] At any time point, the plasma generating device may be connected to only one of the first switching element and the third switching element.

[0018] In multiple embodiments, the plasma generating device may further include: a fourth conductive path electrically connecting the first other end of the first conductive part with the second end of the second conductive part; and a third conductive path including a third switching element electrically grounding the second other end of the second conductive part.

[0019] At any time point, the plasma generating device may be connected to only one of the first switching element and the third switching element.

[0020] The reaction body includes a gas inlet portion, an annular body portion, and a plasma exhaust portion. In a planar view, the first one end and the first other end of the first conductive portion can be separated from each other via the gas inlet portion.

[0021] In order to achieve the above-mentioned another purpose, according to a control method of a plasma generating device according to an embodiment of the present invention, the above-mentioned device includes: a reaction body, having an internal space; a first conductive part, in the shape of a broken ring, arranged on one surface of the above-mentioned reaction body; a second conductive part, in the shape of a broken ring, at least a part of which is arranged on the above-mentioned reaction body; and a first conductive path, connecting the first other end of the above-mentioned first conductive part with the second other end of the above-mentioned second conductive part. The above-mentioned method may include: a first step of applying power through the first end of the above-mentioned first conductive part; and a second step of electrically connecting the above-mentioned first other end with the second other end through the above-mentioned first conductive path.

[0022] The device may further include: a power supply unit; and a second conductive path connecting the power supply unit and the first end.

[0023] In this case, in the first step, the first other end and the second other end are not electrically connected via the first conductive path, and in the second step, the first one end does not receive power via the second conductive path.

[0024] The device may further include: a power supply unit; and a third conductive path connecting the power supply unit and the second other end.

[0025] In this case, in the first step, the first other end and the second other end are not electrically connected via the first conductive path, and in the second step, the second other end does not receive power via the third conductive path.

[0026] Details of other embodiments are included in the detailed description.

[0027] According to an embodiment of the present invention, the induced voltage can be offset by selectively turning on a conductive portion that is beneficial to the initial ignition, generation, maintenance and / or control of plasma, thereby suppressing the damage of the reaction body caused by the H field.

[0028] The effects of the embodiments of the present invention are not limited to the exemplified contents, and the present invention includes other various effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 FIG. 1 is a schematic diagram showing a process processing system according to an embodiment of the present invention.

[0030] Figure 2 FIG. 4 is a three-dimensional diagram of a plasma generating device according to an embodiment of the present invention.

[0031] Figure 3 for Figure 2 An exploded perspective view of a plasma generating device.

[0032] Figure 4 for Figure 2 Front view of the plasma generating device.

[0033] Figure 5 for Figure 2 Side view of a plasma generating device.

[0034] Figure 6 To show Figure 2 A cross-sectional view of the internal space of a plasma generating device in the width direction.

[0035] Figure 7 For illustration Figure 2 Schematic diagram of the electrical connection structure of the plasma generating device of the embodiment.

[0036] Figure 8 The flowchart is a method for controlling a plasma generating device according to an embodiment of the present invention.

[0037] Fig. 9 and Fig.10 Shown respectively Figure 8 Schematic diagram of the electrical connection structure in the first step and the second step of the control method.

[0038] Fig.11 To show Figure 8 Schematic diagram of voltage changes in the first step and the second step of the control method.

[0039] Fig.12 It is a schematic diagram for explaining the electrical connection structure of a plasma generating device according to another embodiment of the present invention.

[0040] Fig.13 It is a schematic diagram for explaining the electrical connection structure of a plasma generating device according to another embodiment of the present invention.

[0041] Figures 14 to 19 They are schematic diagrams for illustrating the electrical connection structure of a plasma generating device according to another embodiment of the present invention.

[0042] Fig. 20 and Fig.21 They are schematic diagrams for illustrating the electrical connection structure of a plasma generating device according to another embodiment of the present invention. DETAILED DESCRIPTION

[0043] The advantages, features and implementation methods of the present invention can be found in the attached Figure 1 The following embodiments will be described in detail. However, the present invention is not limited to the embodiments disclosed below and can be implemented in a variety of different embodiments. The embodiments are only used to make the disclosure of the present invention complete so that ordinary technicians in the technical field to which the present invention belongs can fully understand the scope of the present invention. The present invention is only defined based on the scope of the invention claims.

[0044] Furthermore, the scope of protection claimed for an invention refers to matters that request a certain scope of protection claimed for an invention based on the technical structure disclosed in a specific implementation method, rather than matters used to describe the technical content of the entity of the invention. Therefore, to a certain extent, the scope of protection claimed for an invention is inevitably composed of abstract higher-level concepts including the technology disclosed in the specification. As long as ordinary technicians in the technical field to which the invention belongs can understand the technical structure or its combination and effect within the scope of protection claimed for the invention based on the full text of the specification, the scope of protection claimed for the invention should be regarded as supported by the specification.

[0045] That is, the embodiments disclosed in the present invention can be modified in many ways. It should be understood that the embodiments described below do not limit the implementation methods, and include all modifications, equivalent technical solutions and alternative technical solutions thereof.

[0046] When a term recorded in this specification is used in a specific meaning, its meaning may be defined for use, and it should be interpreted according to the corresponding meaning. In this specification, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meaning as those commonly understood by ordinary technicians in the technical field to which the present invention belongs. In addition, unless explicitly defined, terms defined in commonly used dictionaries should not be interpreted with idealized or overly formal meanings.

[0047] In this specification, "and / or" includes all combinations of the mentioned items and more than one. And, unless otherwise defined, singular statements also include plural forms. In this specification, in addition to the mentioned structural elements, the use of "comprises" and / or "comprising" does not exclude the existence or additional possibility of one or more other structural elements. The numerical range expressed by "to" refers to a numerical range that includes the values ​​recorded before and after as the lower limit and upper limit, respectively. "About" or "approximately" refers to a value or numerical range within 20% of the value or numerical range recorded thereafter.

[0048] In this specification, when specifying structural elements, ordinal modifiers such as "first structural element", "second structural element", "1-1 structural element" are only used to distinguish a certain structural element from other structural elements. Therefore, within the scope of the technical concept of the present invention, the first structural element specified below can be specified as the second structural element. For example, a structure specified as a first structural element in one embodiment can be specified as a second structural element in other embodiments. In addition, a structure specified as a first structural element in the specification can also be specified as a second structural element in the claims.

[0049] The first direction X refers to any direction in a plane, and the second direction Y refers to another direction in the plane that intersects or is perpendicular to the first direction X. The third direction Z refers to another direction that intersects or is perpendicular to the plane.

[0050] In order to ensure convenience and clarity in explanation, the size, thickness, width, length, etc. of the structural elements shown in the drawings may be enlarged or reduced. Therefore, the present invention is not limited to the illustrated form.

[0051] As shown in the figure, spatially relative terms such as "above", "upper", "on", "below", "beneath", "lower" etc. can be used to simply explain the relationship between one element or structural element and other elements or structural elements. It should be understood that spatially relative terms refer to terms that include different directions of elements when used in addition to the directions shown in the drawings. For example, when the elements shown in the drawings are turned over, elements located "below or beneath" other elements can be placed "above" other elements. Therefore, "below" as an exemplary term can include both the lower direction and the upper direction.

[0052] In this specification, the terms "electrical connection" or "electrical conduction" used include not only the situation where a certain structural element is directly connected to other structural elements and forms a DC current flow path between them, but also the situation where they are connected to each other via other conductive paths.

[0053] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

[0054] Figure 1 FIG. 1 is a schematic diagram showing a process processing system according to an embodiment of the present invention.

[0055] First, refer to Figure 1 The process processing system 1 of this embodiment includes one or more plasma generating devices 10 , 10 ′ and a process chamber 30 , and may further include a capture device 40 .

[0056] The first plasma generator 10 is located upstream of the process chamber 30, and the second plasma generator 10' may be located downstream of the process chamber 30. For example, the first plasma generator 10 supplies the generated plasma to the process chamber 30 and uses it for etching, deposition, corrosion, cleaning, ashing processes of a processing substrate (not shown) in the process chamber 30, or may perform cleaning of the process chamber 30. The second plasma generator 10' performs post-processing on the process byproducts in the form of gas or solid generated by the process chamber 30, so that the capture device 40 can easily capture the post-processed substances. Although not shown, a pump may also be provided at the rear end of the second plasma generator 10'. In addition, the second plasma generator 10' forms a parallel flow path with the process chamber 30, or may be located on the path between the process chamber 30 and the capture device 40.

[0057] The following describes the plasma generator of this embodiment that can be used in the process processing system 1. The plasma generator described below can be used as Figure 1 The first plasma generating device 10 or the second plasma generating device 10'.

[0058] Figure 2 FIG. 4 is a three-dimensional diagram of a plasma generating device according to an embodiment of the present invention. Figure 3 for Figure 2 An exploded perspective view of a plasma generating device. Figure 4 for Figure 2 Front view of the plasma generating device. Figure 5 for Figure 2 Side view of a plasma generating device. Figure 6 To show Figure 2 A cross-sectional view of the internal space of a plasma generating device in the width direction. Figure 7 For illustration Figure 2 Schematic diagram of the electrical connection structure of the plasma generating device of the embodiment. Specifically, Figure 7 (a) and (b) are schematic diagrams for explaining the electrical connection structure of the plasma generating device, and the same reference numerals represent corresponding structures. Figures 2 to 6 The power supply unit and the conductive path are omitted. Figure 7 Illustration of the cooling jacket is omitted.

[0059] Reference Figures 2 to 7The plasma generating device (or plasma generator or plasma generating equipment or plasma generating system) 10 of the present embodiment includes a reaction body 100, a first conductive part 210 and a second conductive part 220 surrounding at least a portion of the reaction body 100, and one or more magnetic cores 500 surrounding at least a portion of the reaction body 100, and may also include cooling jackets 310, 320, one or more power supply parts 600, one or more conductive paths 410, 420, 430 and a control part (not shown).

[0060] The reaction body 100 may include a body portion 110 having an inner space 110s, a gas inlet portion 130 (or a gas inlet opening or a gas inlet) connected to the body portion 110, and a plasma exhaust portion 150 (or a plasma exhaust opening or a plasma exhaust outlet).

[0061] On a plane, the inner space 110s of the body portion 110 may be substantially annular or ring-shaped. In this specification, unless otherwise defined, the term "plane" refers to a plane to which the first direction X and the third direction Z belong. Figure 2 The examples show that the main body 110 is substantially in a circular shape on a plane, but in another embodiment, the main body 110 may also be in a direction, for example, in a ring shape having a relative length along a third direction Z. That is, the main body 110 may have a circular ring structure or a ring structure.

[0062] The electromotive force induced by the primary winding described below is induced in the annular or ring-shaped internal space 110s and excites plasma. Neutral gas and / or excited ionized gas molecules and electrons can be accelerated in the annular internal space 110s and reach a plasma state or maintain a plasma state. Although not shown in the figure, an ignition electrode can also be provided in the internal space 110s of the main body 110 for initial ignition required for generating plasma.

[0063] The gas inlet 130 is connected to the main body 110, and can introduce a neutral gas into the internal space 110s. For example, the gas substance can be oxygen (O2), nitrogen (N2), hydrogen (H2), chlorine (C12), argon (Ar), helium (He), ammonia (NH3), nitrogen fluoride (NF3), carbon fluoride (CHF3, CF4, C2HF5, C3F8, C4F8), chlorine trifluoride (C1F3), etc. The gas can be the gas used in the process chamber or not. The internal space of the gas inlet 130 can be branched along the flow path formed by the annular internal space 110s.

[0064] The plasma exhauster 150 is connected to the main body 110 and can exhaust the plasma formed in the internal space 110s. The flow path formed by the annular internal space 110s can be connected to the internal space of the plasma exhauster 150. In the above process processing system, the plasma exhauster 150 is connected to the process chamber, or can be connected to the capture device.

[0065] The reaction body 100 can be made of a dielectric material such as quartz or glass, or insulating aluminum, insulating iron or an alloy thereof. Although not shown, the body portion 110 can be partially decomposed. As a non-limiting example, the body portion 110 can be divided into an upper body portion (upper portion) and a lower body portion (lower portion) forming a semi-ring, which can be combined with each other. The upper body portion is formed as a whole with the gas inlet portion 130, and the lower body portion can be formed as a whole with the plasma discharge plate 150. The body portion 110 can also be divided into three or more parts. Moreover, although not shown, when the body portion 110 is divided into a plurality of parts, there is one or more insulators and / or dielectric structures between them to prevent current saturation.

[0066] The reaction body 100 may be provided with a first conductive portion 210 (or a first coil conductive portion, a first conductor, a first winding portion, a first conductive disk, a first conductive plate, or a first winding plate) and a second conductive portion 220 (or a second coil conductive portion, a second conductor, a second winding portion, a second conductive disk, a second conductive plate, or a second winding plate). The first conductive portion 210 and the second conductive portion 220 may be made of metal materials, such as copper or aluminum.

[0067] In an exemplary embodiment, the shapes of the first conductive part 210 and the second conductive part 220 correspond roughly to the reaction body 100 on a plane, and specifically, may have a shape corresponding to or covering the internal space 110s of the main body 110. More specifically, the first conductive part 210 and the second conductive part 220 may be annular, and partially interrupted interruption parts 210c and 220c are formed respectively. For example, when the internal space 110s is roughly close to a circular shape on a plane, the first conductive part 210 and the second conductive part 220 may be respectively in the shape of a major arc. In this case, the central angle of the above-mentioned major arc may be about 270° or more, about 280° or more, about 290° or more, about 300° or more, about 310° or more, about 320° or more, about 330° or more, about 340° or more, or about 350° or more.

[0068] The first conductive part 210 and the second conductive part 220 are respectively disconnected rings, and the first conductive part 210 has a first end 210a (or a 1-1 end) on one side and a first other end 210b (or a 1-2 end) on the other side, and the second conductive part 220 may have a second end 220a (or a 2-1 end) on one side and a second other end 220b (or a 2-2 end) on the other side. The first end 210a and the first other end 210b and the second end 220a and the second other end 220b may face each other along the first direction X.

[0069] In the plane angle to which the first direction X and the third direction Z belong, with the virtual standard line VL passing through the center of the plasma generator 10 and extending along the third direction Z as a reference, the second end 220a of the second conductive part 220 refers to the end located on the same side as the first end 210a of the first conductive part 210, and the second other end 220b of the second conductive part 220 refers to the end located on the same side as the first other end 210b of the first conductive part 210. That is, in the plane viewing angle as shown in the figure, if the conductive path from the first end 210a to the first other end 210b of the first conductive part 210 is understood as the counterclockwise direction, the conductive path from the second end 220a to the second other end 220b of the second conductive part 220 can be understood as being formed along the counterclockwise direction.

[0070] The first conductive part 210 and the second conductive part 220 may face each other along the second direction Y across the reaction body 100. In this case, the first end 210a of the first conductive part 210 and the second end 220a of the second conductive part 220 at least partially overlap and face each other along the second direction Y, and the first other end 210b of the first conductive part 210 and the second other end 220b of the second conductive part 220 may at least partially overlap and face each other along the second direction Y. In addition, as described above, the first conductive part 210 and the second conductive part 220 at least partially overlap with the reaction body 100, and specifically, may overlap with the internal space 110s along the second direction Y.

[0071] On the other hand, the first conductive part 210 or the second conductive part 220 may be in the form of a predetermined width W2, rather than a wiring in the form of a metal wire. That is, the width (radial width) of the first conductive part 210 or the second conductive part 220, in other words, the width W2 of the current flow path may be about 50% or more of the width W1 of the internal space 110s of the reaction body 100, or about 60% or more, or about 70% or more, or about 80% or more, or about 90% or more, or about 100% or more, or about 110% or more, or about 120% or more, or about 150% or more. There is no particular limit to the upper limit of the above width, for example, it may be about 500% or less of the width of the internal space 110s.

[0072] In this case, in the plane view to which the first direction X and the third direction Z belong, the interrupted portion 210c of the first conductive portion 210 and / or the interrupted portion 220c of the second conductive portion 220 may be arranged along the side of the gas inlet portion 130. In other words, the interrupted portion 210c of the first conductive portion 210 and the interrupted portion 220c of the second conductive portion 220 may be arranged toward the side of the gas inlet portion 130 (upper side in the third direction Z) instead of toward the plasma exhaust portion 150. For example, the first end 210a and the first other end 210b of the first conductive portion 210 or the second end 220a and the second other end 220b of the second conductive portion 220 may be separated from each other via the gas inlet portion 130. As another example, the first end 210a and the first other end 210b of the first conductive portion 210 or the second end 220a and the second other end 220b of the second conductive portion 220 may be separated from each other via a portion of the internal space 110s connected to the gas inlet portion 130.

[0073] The first conductive part 210 and the second conductive part 220 having the above structure respectively provide a current path of more than one turn, and can form an inductively coupled plasma in the plasma discharge space. That is, the first conductive part 210 and the second conductive part 220 of the substantially superior arc shape can perform the function of a partial coil. For example, as described below, when the first end 210a of the first conductive part 210 receives the power of the power supply unit 600, the current flowing through the first conductive part 210 flows from the first end 210a along the first other end 210b, that is, it can flow in the counterclockwise direction based on the accompanying drawing. In addition, the current flowing along the first conductive part 210 and the current flowing along the second conductive part 220 are coupled to each other, and the first conductive part 210 or the second conductive part 220 can perform a function similar to a primary winding, but the present invention is not limited thereto. Below, the power applied to the first conductive part 210 and the second conductive part 220 and the conductive structure therebetween are described in detail.

[0074] In many embodiments, a first cooling jacket 310 and a second cooling jacket 320 may be provided on the reaction body 100. The first cooling jacket 310 and the second cooling jacket 320 surround the reaction body 100, and a flow path (not shown) for the flow of a refrigerant may be formed therein. The first cooling jacket 310 and the second cooling jacket 320 are shaped to surround the reaction body 100, and can cool the heat generated by the reaction body 100.

[0075] The first cooling jacket 310 is disposed between the reaction body 100 and the first conductive part 210, and the second cooling jacket 320 can be disposed between the reaction body 100 and the second conductive part 220. The first cooling jacket 310 and the second cooling jacket 320 can have a shape corresponding to the reaction body 100, so that the inner side surfaces of the first cooling jacket 310 and the second cooling jacket 320 are closely attached to the reaction body 100.

[0076] The present invention is not limited thereto, and the first cooling jacket 310 and the second cooling jacket 320 may be made of conductive materials, respectively. Moreover, similarly to the first conductive portion 210 and the second conductive portion 220, the first cooling jacket 310 and / or the second cooling jacket 320 may have a partially interrupted shape. That is, on a plane, the first cooling jacket 310 and the second cooling jacket 320 may be respectively in the shape of a major arc or the like. In this case, similarly to the first conductive portion 210 and the second conductive portion 220, the first cooling jacket 310 and the second cooling jacket 320 respectively provide a current path of more than one turn, and may perform a function similar to a partial coil. In this case, the first cooling jacket 310 and / or the second cooling jacket 320 may be respectively electrically connected to one or more of the first conductive portion 210 and the second conductive portion 220 or the power supply portion 600, but the present invention is not limited thereto. In another embodiment, the first cooling jacket 310 and the second cooling jacket 320 may also be made of insulating material.

[0077] The reaction body 100, the first conductive part 210 and the second conductive part 220 and the first cooling jacket 310 and the second cooling jacket 320 are arranged with insulating components, for example, they can be arranged with insulating covers, insulating layers or insulating coatings, etc., to prevent electrical conduction caused by direct face-to-face contact.

[0078] The magnetic core 500 (or magnetic block) may be shaped to surround at least a portion of the reaction body 100. In addition to the reaction body 100, the magnetic core 500 may be shaped to surround a portion of the first conductive portion 210 and the second conductive portion 220. The primary winding may be wound around the magnetic core 500.

[0079] The primary winding may be electrically connected to the power supply unit 600. The primary winding is wound together with the first conductive portion 210 and / or the second conductive portion 220 of the above-mentioned shape in a form that can induce an induced electromotive force in the internal space 110s. In an exemplary embodiment, the primary winding is wound around the magnetic core 500 and may be wound in a clockwise direction or a counterclockwise direction on a plane to which the first direction X and the third direction Z belong.

[0080] For example, a portion of a wire for connecting the power supply unit 600 and the first conductive unit 210 may be used as a primary winding. In this case, the wire may connect the power supply unit 600 and the first conductive unit 210. For example, a portion of the second conductive path 420 described below may be formed as a primary winding.

[0081] As another example, a portion of other conductive wires electrically connected to the first conductive part 210 connected to the power supply part 600 may be used as the primary winding. In this case, the first conductive part 210 may connect the power supply part 600 to the other conductive wires.

[0082] The magnetic core 500 can make the electromagnetic field formed by the current path provided by the primary winding (for example, the second conductive path 420, etc.), the first conductive part 210 and / or the second conductive part 220 be bundled inside the plasma discharge space. The bundled electromagnetic field can induce an electromotive force in the internal space 110s of the reaction body 100. Figure 2 In the embodiment, four magnetic cores 500 are arranged in the annular inner space 110s forming the plasma discharge space, and the four magnetic cores 500 are arranged at the upper right side, the upper left side, the lower left side, and the lower right side on the plane of the inner space 110s for inducing plasma. The four magnetic cores 500 can be arranged roughly in an "X" shape. In addition to the magnetic core material, the magnetic core 500 can include a strong magnetic material, such as ferrite. For the clarity of the drawings, Figure 3 Only two magnetic cores 500 are shown.

[0083] The power supply unit 600 can supply power for the plasma generating device 10 to generate plasma. For example, the power supply unit 600 can provide AC power. The power supply unit 600 includes an additional circuit for supplying power, for example, a resonant circuit.

[0084] Furthermore, the control unit may include at least one processor. It is understood that the following control method is executed by a processor. As an example, the control unit may be a programmable logic controller (PLC) or the like. The control unit may be used to control the power supply unit 600, at least one switching element 415, 425, 435 described below, and other structural elements. For example, the control unit may also include a control circuit for controlling the power supply unit 600 based on electrical parameters or optical parameters observed in the internal space 110s of the reaction body 100. The measurement of the above parameters may be performed by a current probe or an optical detector.

[0085] The power supply unit 600, the first conductive unit 210, and the second conductive unit 220 of the plasma generating device 10 may be electrically connected by an electrical conduction path, that is, may be electrically connected by one or more conductive paths 410, 420, and 430. In this specification, the term "conductive path" refers to a structural element that provides a current flow path, including electrical wiring or other conductive structural elements. In this case, the conductive path includes a plurality of structural elements and forms a current path, or may include a case where the conductive path is selectively turned on or turned on according to demand via a switching element, but is not always turned on.

[0086] In an exemplary embodiment, the first conductive path 410 (or the first connection portion or the first path portion) electrically connects the first conductive portion 210 and the second conductive portion 220, and specifically, electrically connects the first other end 210b of the first conductive portion 210 and the second other end 220b of the second conductive portion 220. That is, the first conductive path 410 may be connected near the first other end 210b and the second other end 220b.

[0087] In this specification, the electrical connection between the first conductive element and one end of the second conductive element means that the current flowing from the first conductive element to the second conductive element flows from one end of the second conductive element to the other end.

[0088] On another level, the electrical connection between the first conductive structure element and one end of the second conductive structure element means that the physical length from the position where the first conductive structure element and the second conductive structure element are connected to one end of the second conductive structure element is less than the physical length to the other end. For example, the length to the other end may be more than two times, three times, four times, five times, or ten times the length to one end.

[0089] On another level, the electrical connection between the first conductive structure element and one end of the second conductive structure element means that the linear resistance from the position where the first conductive structure element and the second conductive structure element are connected to one end of the second conductive structure element is smaller than the linear resistance to the other end. For example, the resistance to the other end may be more than two times, three times, four times, five times, or ten times the resistance to one end.

[0090] Furthermore, the first conductive path 410 may include a first switch element 415 that allows current to flow along the conductive path or blocks current flow. The first switch element 415 may be used to electrically connect the first other end 210b of the first conductive portion 210 to the second other end 220b of the second conductive portion 220 or not.

[0091] As a non-limiting example, the first conductive path 410 may include a winding portion. That is, the first conductive path 410 may be a conductive path that is not actually conducive to causing an induced electromotive force. In other words, even when a current flows along the first conductive path 410, an electromagnetic field having at least a main vector in the second direction Y can be prevented from being generated.

[0092] The second conductive path 420 (or the second connection portion or the second path portion) may be defined as a conductive path for electrically connecting the first conductive portion 210 and the power supply portion 600. The second conductive path 420 may include a second switching element 425, which may allow current to flow along its conductive path or block current flow. The second conductive path 420 may be connected near the first end 210a of the first conductive portion 210. When the second switching element 425 is connected, that is, in the on state, the current flowing from the power supply portion 600 flows from the first end 210a of the first conductive portion 210 in the direction of the first other end 210b, that is, it may flow in a counterclockwise direction based on the drawing.

[0093] As a non-limiting example, as described above, a portion of the second conductive path 420 is wound into a coil configuration and may form a portion of the primary winding.

[0094] The third conductive path 430 (or the third connection portion or the third path portion) may be defined as a conductive path for electrically connecting the second conductive portion 220 and the power supply portion 600. The third conductive path 430 may include a third switching element 435, which may allow current to flow along its conductive path or block current flow. The third conductive path 430 may be connected near the second other end 220b of the second conductive portion 220. When the third switching element 435 is connected, that is, in the on state, the current flowing from the power supply portion 600 flows from the second other end 220b of the second conductive portion 220 in the direction of the second one end 220a, that is, it may flow in a clockwise direction based on the drawing, but the present invention is not limited thereto.

[0095] On a physical level, the first conductive path 410 to the third conductive path 430 and the fourth conductive path described in the following further embodiment are all different structural elements, and therefore, can provide different current paths.

[0096] As described above, the plasma generating device 10 includes a coil having at least one turn, for example, the first conductive portion 210 and the second conductive portion 220 as a part of the primary winding, and can generate at least inductively coupled plasma. Therefore, it is relatively easy to ignite and / or maintain plasma under low pressure conditions of less than 1 Torr or high pressure conditions of more than 10 Torr.

[0097] The present invention is not limited to any theory. For example, the potential difference between the first conductive part 210 and the second conductive part 220 through which the current flows can generate an electric field having a vector component in the second direction Y in the inner space 110s toward the plasma discharge space of the reaction body 100. At the same time, as a part of the primary winding, on the plane to which the first direction X and the third direction Z belong, the first conductive part 210 and the second conductive part 220 that provide a current flow path along the rotation direction form a magnetic field along the plane direction to which the first direction X and the third direction Z belong, thereby generating an electric field in the rotation direction in the annular plasma discharge space. The planes of the above electric fields can be orthogonal or at least intersecting.

[0098] In the exemplary embodiment, the plasma generating device 10 may connect only one of the first switch element 415 and the second switch element 425 (i.e., turn on) at any time point and / or connect only one of the first switch element 415 and the third switch element 435 at any time point. In other words, the first switch element 415 and the second switch element 425 are not connected at the same time, and the first switch element 415 and the third switch element 435 may not be connected at the same time. To this end, the control unit (not shown) may also include a control circuit to prevent the first switch element 415, the second switch element 425, or the third switch element 435 from operating at the same time. The second switch element 425 and the third switch element 435 may be connected at the same time at any time point.

[0099] As described above, the first conductive path 410 electrically connects the first other end 210b to the second other end 220b, the second conductive path 420 electrically connects the first one end 210a, and the third conductive path 430 electrically connects the second other end 220b. That is, the second other end 220b of the second conductive part 220 electrically connects the first conductive path 410 and the third conductive path 430.

[0100] On the other hand, the first other end 210b of the first conductive part 210 and / or the second one end 220a of the second conductive part 220 are electrically connected to each other, or one or more of them are grounded or one or more of them are floated. In order to avoid confusion about the essence of this embodiment, the relevant description is omitted below and described in conjunction with another embodiment.

[0101] The plasma generating device 10 of this embodiment electrically connects the first other end 210b and the second other end 220b of the first conductive part 210 and the second conductive part 220, which are respectively used as a part of the primary winding of more than one turn, at any time point in the process. After ignition, the induced voltage remaining in the first conductive part 210 and / or the second conductive part 220 can be offset or eliminated.

[0102] That is, the above-mentioned induction voltage can be offset by selectively connecting the first other end 210b and the second other end 220b electrically through the first conductive path 410 that is actually not conducive to causing the induced electromotive force required to generate / maintain plasma. In other words, in the process of electrical connection between the first conductive part 210 and the second conductive part 220, for example, the first conductive path 410 connecting the first other end 210b and the second other end 220b allows current and / or electrons to flow to achieve the induction voltage offset, rather than through other conductive paths other than the first conductive path 410, such as the second conductive path 420, the third conductive path 430 or the cooling jacket 310, 320 or the fourth conductive path of another embodiment described below. Thus, the H field formed by the induction voltage can suppress the damage to the reaction body 100 and the generation of particles.

[0103] In this regard, additional reference is made to Figures 8 to 11 The control method of the plasma generating device and the cancellation of the induced voltage of this embodiment are further described in detail.

[0104] Figure 8 The flowchart is a method for controlling a plasma generating device according to an embodiment of the present invention. Fig. 9 and Fig.10 Shown respectively Figure 8 Schematic diagram of the electrical connection structure in the first step and the second step of the control method. Fig.11 To show Figure 8 Schematic diagram of voltage changes in the first step and the second step of the control method.

[0105] Further references Figures 8 to 11 The control method (or process processing method) of the plasma generating device of this embodiment may at least include: a first step S100, applying power to the first conductive part 210; and a second step S200, connecting the first conductive path 410 to offset the induced voltage.

[0106] The first step S100 may include an ignition step (or ignition phase) for generating plasma. As described above, the first conductive portion 210 may receive power from the power supply portion 600 through the second conductive path 420. Therefore, the second switching element 425 may be connected in the first step S100.

[0107] In various embodiments, the first step S100 may further include a step of applying power to the second conductive part 220. In this case, the second conductive part 220 is electrically connected to the power supply part 600 through the third conductive path 430. Therefore, in the first step S100, the third switch element 435 may be connected. That is, one or more of the second switch element 425 and the third switch element 435 may be connected.

[0108] In an exemplary embodiment, in the first step S100, the first switch element 415 of the first conductive path 410 may be in an unconnected off state. That is, the first conductive path 410 is disconnected, and the first other end 210b of the first conductive portion 210 and the second other end 220b of the second conductive portion 220 may not be directly conductive to each other.

[0109] As described above, a portion of the second conductive path 420, the first conductive portion 210 and / or the second conductive portion 220 together form a primary winding, and an electromotive force is induced in the internal space 110s of the reaction body 100 by the AC power provided by the power supply unit. In addition, as the injected neutral gas is separated into ionized gas molecules and electrons, plasma can be generated, maintained, or amplified.

[0110] In the case of this embodiment, not only the coil and the wire wound into the primary winding are used, but also the plasma discharge can be easily achieved under relatively low voltage or high voltage conditions by making the current flow in the first conductive part 210 and / or the second conductive part 220 having a specified area and conductive width and arranging the first conductive part 210 and the second conductive part 220 facing each other. However, there is an induced voltage in the first conductive part 210 and / or the second conductive part 220 having a specified current flow path width. In this regard, the control method of this embodiment can offset the induced voltage through the second step S200.

[0111] The second step S200 may include a step of electrically connecting the first other end 210b of the first conductive part 210 to the second other end 220b of the second conductive part 220. The connection between the first other end 210b and the second other end 220b may be performed by the first conductive path 410. Therefore, the first switch element 415 may be connected in the second step S200.

[0112] In the exemplary embodiment, the first switch element 415 and the second switch element 425 and the first switch element 415 and the third switch element 435 are not connected at the same time. In other words, in the process steps using the plasma generating apparatus 10 of the present embodiment and the process system including the same, only one of the first switch element 415 and the second switch element 425 or the first switch element 415 and the third switch element 435 may be electrically connected at any time point.

[0113] For example, in the second step S200 defined as conducting the first conductive path 410 by connecting the first switch element 415, the second conductive path 420 and the third conductive path 430 are both disconnected, and the second switch element 425 and the third switch element 435 may be turned off. Therefore, in the second step S200, the first conductive portion 210 and the second conductive portion 220 may not receive power from the power supply portion 600 at least along the second conductive path 420 and the third conductive path 430, respectively.

[0114] like Fig.11As shown, in the first step S100, AC power is applied to the first conductive part 210 and the second conductive part 220, and current can flow. Moreover, in the case where the first conductive part 210 and the second conductive part 220 cannot be powered because the second conductive path 420 and the third conductive path 430 are disconnected, for example, when the first switch element 215 to the third switch element 235 are all in the closed state, as a non-limiting example, between the first step S100 and the second step S200, due to the presence of a prescribed induced voltage in the first conductive part 210 and the second conductive part 220, the reaction body 100 made of a dielectric material such as quartz may be damaged. In this regard, after the first step S100, the method of this embodiment can offset the induced voltage by disconnecting the first other end 210b of the first conductive part 210 and the second other end 220b of the second conductive part 220 through the first conductive path 410.

[0115] Hereinafter, another embodiment of the present invention will be described, but the description of the structure that is substantially the same as or extremely similar to the above embodiment will be omitted, and those skilled in the art can clearly understand this by referring to the accompanying drawings.

[0116] Fig.12 It is a schematic diagram for explaining the electrical connection structure of a plasma generating device according to another embodiment of the present invention.

[0117] Reference Fig.12 The plasma generating device 11 of the present embodiment includes: a reaction body 100; a first conductive portion 210 and a second conductive portion 220, which surround at least a portion of the reaction body 100; a magnetic core (not shown); a first conductive path 410 to a third conductive path 430; and a power supply unit 600. Figure 7 The illustrated embodiment differs in that a load 429 is also included.

[0118] The load 429 may be electrically connected to the second conductive path 420 .

[0119] In addition, the description of the structure is as described above, so repeated description will be omitted. In addition, although not shown in the figure, the first other end of the first conductive part 210 and the first one end of the second conductive part 220 are electrically connected to each other, or one or more of them can be grounded or one or more of them can be floating. This is described in conjunction with another embodiment below.

[0120] Fig.13 It is a schematic diagram for explaining the electrical connection structure of a plasma generating device according to another embodiment of the present invention.

[0121] Reference Fig.13The plasma generating device 12 of the present embodiment includes: a reaction body 100; a first conductive portion 210 and a second conductive portion 220, which surround at least a portion of the reaction body 100; a magnetic core (not shown); a first conductive path 410 to a third conductive path 430; and power supply portions 610 and 620, wherein the first conductive portion 210 receives AC power from the first power supply portion 610 and is connected to the above-mentioned Figure 7 The illustrated embodiment differs in that the second conductive portion 220 receives AC power from a second power supply portion 620 .

[0122] At any time point, the first power supply unit 610 and the second power supply unit 620 may provide current to the first conductive part 210 and the second conductive part 220 in the same or different directions.

[0123] In addition, the description of the structure is as described above, so repeated description will be omitted. In addition, although not shown in the figure, the first other end of the first conductive part 210 and the first one end of the second conductive part 220 are electrically connected to each other, or one or more of them can be grounded or one or more of them can be floating. This is described in conjunction with another embodiment below.

[0124] Fig.14 It is a schematic diagram for explaining the electrical connection structure of a plasma generating device according to another embodiment of the present invention.

[0125] Reference Fig.14 The plasma generating device 13 of the present embodiment includes: a reaction body 100; a first conductive portion 210 and a second conductive portion 220, which surround at least a portion of the reaction body 100; a magnetic core (not shown); a first conductive path 410 to a third conductive path 430; and a power supply unit 600, which is similar to the above Figure 7 The difference of the illustrated embodiment is that the direction of the current provided to the first conductive portion 210 and the direction of the current provided to the second conductive portion 220 at any point in time are different.

[0126] In addition, the description of the structure is as described above, so repeated description will be omitted. In addition, although not shown in the figure, the first other end of the first conductive part 210 and the first one end of the second conductive part 220 are electrically connected to each other, or one or more of them can be grounded or one or more of them can be floating. This is described in conjunction with another embodiment below.

[0127] Fig.15 It is a schematic diagram for explaining the electrical connection structure of a plasma generating device according to another embodiment of the present invention.

[0128] Reference Fig.15The plasma generating device 14 of the present embodiment includes: a reaction body 100; a first conductive portion 210 and a second conductive portion 220, which surround at least a portion of the reaction body 100; a magnetic core (not shown); a first conductive path 410 to a third conductive path 430; and a power supply unit 600, which is similar to the above Figure 7 The illustrated embodiment differs in that the second conductive portion 220 receives power from the power supply portion 600 .

[0129] The second conductive part 220 may be grounded, specifically, the second other end of the second conductive part 220 may be grounded. Therefore, the plasma generating device 14 of this embodiment may omit the third conductive path.

[0130] In addition, the description of the structure is as described above, so repeated description will be omitted. In addition, although not shown in the figure, the first other end of the first conductive part 210 and the first one end of the second conductive part 220 are electrically connected to each other, or one or more of them can be grounded or one or more of them can be floating. This is described in conjunction with another embodiment below.

[0131] Further reference is made to Figures 16 to 19 The electrical connection between the first other end of the first conductive part 210 and the second one end of the second conductive part 220 is described in detail. In order to avoid confusing the essence of the present invention, the connection structure between the first other end and the second one end is described, but this can be understood in conjunction with the above embodiment.

[0132] Fig.16 It is a schematic diagram for explaining the electrical connection structure of a plasma generating device according to another embodiment of the present invention.

[0133] Reference Fig.16 The plasma generating device 15 of this embodiment includes: a reaction body 100; a first conductive part 210 and a second conductive part 220, which surround at least a portion of the reaction body 100; a magnetic core (not shown); a first conductive path 410 to a third conductive path 430; and a power supply part 600, which may also include a fourth conductive path 440, so that the first other end of the first conductive part 210 is electrically connected to the second end of the second conductive part 220.

[0134] The fourth conductive path 440 may perform the function of a conductive path so that the current applied by the power supply unit 600 flows along the first conductive part 210 and the second conductive part 220. In this case, the first conductive part 210 is connected in series with the second conductive part 220, and the first other end of the first conductive part 210 is cross-connected with the second one end of the second conductive part 220, so that the current can flow in the same direction. As a non-limiting example, a portion of the fourth conductive path 440 may be wound into a coil form and form a portion of the primary winding.

[0135] Fig.17It is a schematic diagram for explaining the electrical connection structure of a plasma generating device according to another embodiment of the present invention.

[0136] Reference Fig.17 The plasma generating device 16 of this embodiment includes: a reaction body 100; a first conductive portion 210 and a second conductive portion 220, which surround at least a portion of the reaction body 100; a magnetic core (not shown); a first conductive path 410 to a fourth conductive path 440; and a power supply unit 600, and the fourth conductive path 440 may include a fourth switch element 445.

[0137] Fig.18 It is a schematic diagram for explaining the electrical connection structure of a plasma generating device according to another embodiment of the present invention.

[0138] Reference Fig.18 The plasma generating device 17 of the present embodiment includes: a reaction body 100; a first conductive part 210 and a second conductive part 220, which surround at least a portion of the reaction body 100; a magnetic core (not shown); a first conductive path 410 to a fourth conductive path 440; and a power supply unit 600, wherein the fourth conductive path 440 may include one or more passive elements of a load 446, an inductor 447, or a capacitor 448. In order to improve the overall working efficiency of the plasma generating device 17, an additional circuit including the above passive elements may be selected.

[0139] Fig.19 It is a schematic diagram for explaining the electrical connection structure of a plasma generating device according to another embodiment of the present invention.

[0140] Reference Fig.19 The plasma generating device 18 of the present embodiment includes: a reaction body 100; a first conductive part 210 and a second conductive part 220, which surround at least a portion of the reaction body 100; a magnetic core (not shown); a first conductive path 410 to a fourth conductive path 440; and a power supply part 600, wherein at least one of the first other end of the first conductive part 210 and the second one end of the second conductive part 220 may be grounded. As a non-limiting example, except for the first conductive path 410, the first conductive part 210 and the second conductive part 220 may not constitute a path electrically connected to each other.

[0141] Fig. 20 It is a schematic diagram for explaining the electrical connection structure of a plasma generating device according to another embodiment of the present invention.

[0142] Reference Fig. 20 The plasma generating device 19 of the present embodiment includes: a reaction body 100; a first conductive portion 210 and a second conductive portion 220, which are arranged on the reaction body 100 and are connected to the reaction body 100; Figure 7The difference of the illustrated embodiment is that a plurality of at least one of the first conductive portion 210 and the second conductive portion 220 is provided.

[0143] The conductive portion provided on one side of the reaction body 100 is designated as the first conductive portion 210, and the conductive portion provided on the other side may be designated as the second conductive portion 220. Specifically, the 1-1 conductive portion 211, the 1-2 conductive portion 212, and the 1-3 conductive portion 213 are provided on one side of the reaction body 100, and the 2-1 conductive portion 221, the 2-2 conductive portion 222, and the 2-3 conductive portion 223 may be provided on the other side. In the accompanying drawings, although the first conductive portion 210 and the second conductive portion 220 are respectively provided with three, the present invention is not limited thereto. In another embodiment, one or more of the first conductive portion 210 and the second conductive portion 220 may be provided with four or more, or one of the first conductive portion 210 and the second conductive portion 220 may also provide only one conductive portion.

[0144] The 1-1 conductive part 211 to the 1-3 conductive part 213 and the 2-1 conductive part 221 to the 2-3 conductive part 223 may have substantially the same shape and arrangement as the first conductive part and the second conductive part. In this case, the plurality of conductive parts 210 and 220 may be overlapped along the second direction.

[0145] In an exemplary embodiment, one end of the 1-1 conductive portion 211 located at the outermost side of the first conductive portion 210 may receive power from the power supply portion 600 through the second conductive path 420. Also, the other end of the 1-1 conductive portion 211 may be electrically connected in series with one end of the 1-2 conductive portion 212, and the other end of the 1-2 conductive portion 212 may be electrically connected in series with one end of the 1-3 conductive portion 213.

[0146] Similarly, the other end of the 2-3 conductive portion 223 located at the outermost side of the second conductive portion 220 can receive power or ground from the power supply unit 600 through the third conductive path 430. In addition, one end of the 2-3 conductive portion 223 can be electrically connected in series with the other end of the 2-2 conductive portion 222, and one end of the 2-2 conductive portion 222 can be electrically connected in series with the other end of the 2-1 conductive portion 221.

[0147] As described above in conjunction with the various embodiments, the other end of the 1-3 conductive portion 213 and one end of the 2-1 conductive portion 221 are electrically connected to each other, or one or more of them may be grounded or one or more of them may be floating.

[0148] The first conductive path 410 can electrically connect the other end of one of the first conductive parts 210 to the other end of one of the second conductive parts 220. In the drawings, although the other end of the innermost 1-3 conductive part 213 of the first conductive part 210 and the other end of the innermost 2-1 conductive part 221 of the second conductive part 220 are connected through the first conductive path 410, in another embodiment, the other end of the 1-3 conductive part 213 and the other end of the outermost 2-3 conductive part 223 of the second conductive part 220 can be connected through the first conductive path.

[0149] Although not shown in the figure, if the conductive paths between the above-mentioned conductive parts 211, 212, 213, 221, 222, and 223 are excluded, insulating components are inserted between the multiple first conductive parts 210 and between the multiple second conductive parts 220 to prevent electrical conduction due to direct face-to-face contact between the conductive parts 211, 212, 213, 221, 222, and 223. For example, an insulating cover, an insulating layer, or an insulating coating may be inserted.

[0150] The first conductive part 210 and the second conductive part 220 of the plasma generator 19 of this embodiment can perform a function similar to a winding. For example, the current flowing from the power supply part 600 toward one end of the 1-1 conductive part 211 flows along the plurality of first conductive parts 210 and the plurality of second conductive parts 220, and can flow in a counterclockwise direction based on the drawing.

[0151] Except for this, the description about the structure is as described above, so the repeated description will be omitted.

[0152] Fig.21 It is a schematic diagram for explaining the electrical connection structure of a plasma generating device according to another embodiment of the present invention.

[0153] Reference Fig.21 The plasma generating device 20 of the present embodiment includes: a reaction body 100; a first conductive portion 210 and a second conductive portion 220, which surround at least a portion of the reaction body 100, and the second conductive portion 230 is not disposed on the other side of the reaction body 100 in the second direction Y. Figure 7 The difference of the illustrated embodiment is that it is arranged on the outer circumference of the annular reaction body 100 .

[0154] That is, the second conductive portion 230 may at least partially overlap the reaction body 100 along the first direction X and / or the third direction Z. However, the present invention is not limited thereto, and the second conductive portion 230 may not at least partially overlap the first conductive portion 210 along the second direction Y.

[0155] Except for this, the description about the structure is as described above, so the repeated description will be omitted.

[0156] Although the embodiments of the present invention are described above, they are only examples, and the present invention is not limited thereto. A person skilled in the art of the present invention may make various modifications and applications not shown above without departing from the basic features of the embodiments of the present invention. For example, it should be understood that this specification includes a disclosed embodiment composed of a combination of technical features respectively represented by a plurality of embodiments, as long as the technical features respectively represented by the plurality of embodiments are different, conflicting or contradictory.

[0157] Therefore, the scope of the present invention includes technical solutions, equivalent technical solutions and alternative technical solutions based on the above illustrative technical ideas. For example, the various structural elements specifically represented by the embodiments of the present invention can be deformed. Moreover, the differences related to such deformation and application also fall within the scope of the present invention as specified in the scope of the invention claims.

Claims

1. A plasma generating device, characterized in that: include: A reaction body, having an internal space; A first conductive portion, in a broken ring shape, is disposed on one surface of the reaction body; The second conductive part is in a broken ring shape, at least a part of which is disposed on the reaction body; as well as The first conductive path connects the first other end of the first conductive portion and the second other end of the second conductive portion.

2. The plasma generating device according to claim 1, characterized in that: The second conductive part is arranged on the other side of the reaction body, The first other end overlaps with the second other end and faces each other.

3. The plasma generating device according to claim 1, characterized in that: The second conductive part is arranged on the outer peripheral surface of the reaction body, The first end of the first conductive portion and the first end of the second conductive portion are located on the same side with respect to a virtual standard line, and the first other end and the second other end are located on the same side with respect to the virtual standard line.

4. The plasma generating device according to claim 1, characterized in that: The first conductive path includes a first switching element.

5. The plasma generating device according to claim 4, characterized in that: Also includes: Power supply department; as well as The second conductive path electrically connects the power supply unit and the first end of the first conductive unit.

6. The plasma generating device according to claim 5, characterized in that: The second conductive path includes a second switching element, At any point in time, only one of the first switching element and the second switching element is connected.

7. The plasma generating device according to claim 5, characterized in that: further comprising a third conductive path, the third conductive path comprising a third switching element, the third conductive path electrically connecting the power supply unit and the second other end of the second conductive unit, At any point in time, only one of the first switching element and the third switching element is connected.

8. The plasma generating device according to claim 5, characterized in that: Also includes: a fourth conductive path electrically connecting the first other end of the first conductive portion and the second one end of the second conductive portion; as well as a third conductive path including a third switch element and electrically grounding the second other end of the second conductive portion; At any point in time, only one of the first switching element and the third switching element is connected.

9. The plasma generating device according to claim 1, characterized in that: The reaction body includes a gas inlet portion, an annular body portion and a plasma exhaust portion. In a planar view, the first one end and the first other end of the first conductive portion are separated from each other via the gas inlet portion.

10. A method for controlling a plasma generating device, characterized in that: The plasma generating device comprises: Reaction ontology; A first conductive portion, in a broken ring shape, is disposed on one surface of the reaction body; A second conductive portion, in the form of a broken ring, at least a portion of which is disposed on the reaction body; and a first conductive path connecting a first other end of the first conductive portion and a second other end of the second conductive portion, The control method comprises: In a first step, power is applied through a first end of the first conductive portion; and In a second step, the first other end is electrically connected to the second other end through the first conductive path.

11. The control method of a plasma generating device according to claim 10, characterized in that: The plasma generating device further comprises: Power supply unit; and A second conductive path connects the power supply unit and the first end, In the first step, the first other end is not electrically connected to the second other end through the first conductive path, In the second step, the first end does not receive power through the second conductive path.

12. The control method of the plasma generating device according to claim 10, characterized in that: The plasma generating device further comprises: Power supply unit; and A third conductive path connects the power supply unit and the second other end, In the first step, the first other end is not electrically connected to the second other end through the first conductive path, In the second step, the second other end does not receive power through the third conductive path.

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