Spin coating device, spin coating method and electronic equipment

Abstract

The invention provides a spin coating device, a spin coating method and electronic equipment. The spin coating device comprises a control module, a spin coater module, a liquid supply module and a pipettor arranged on a cross beam structure, the liquid supply module comprises a first support and a second support which are sequentially arranged, the first support is provided with a containing groove used for containing the liquid suction part, and the second support is used for containing the liquid storage device. The control device is used for controlling the pipettor to move to the accommodating groove in the first bracket and is combined and connected with the liquid absorbing piece; the pipettor connected with the liquid suction part in a combined mode is moved to the second support, and the to-be-spin-coated solution is sucked from the liquid storage device through the pipettor; and the control module is used for moving the pipettor which sucks the solution to be spin-coated to a third target position corresponding to the spin coater module for liquid dropping and then carrying out spin-coating film preparation operation. According to the invention, the problems of insufficient precision, strong environmental dependence, complex operation and the like in the traditional spin-coating film preparation process are effectively solved through the technical means of intelligence, environmental self-adaption and the like.

Description

Technical Field

[0001] The present invention relates to the technical field of thin film preparation, and more specifically, to a spin coating device, a spin coating method and an electronic device. Background Art

[0002] In the existing film-making process, when the pipette is draining liquid from the spin coater, it is usually necessary to manually open the upper cover of the spin coater to drain the liquid, or to open a drain port on the upper cover of the spin coater and insert the pipette into the drain port to drain the liquid. However, the method of manually opening and closing the upper cover of the spin coater undoubtedly increases the cost and affects the production efficiency, while the opening of the drain port on the upper cover may cause the solution to be discharged during the spin coating process.

[0003] In addition, the existing film-making process usually requires a variety of solvents of different specifications, which in turn requires absorbent parts of different specifications. During the process of grabbing and selecting these absorbent parts, the positions of the absorbent parts selected according to different needs are also different. How to ensure that the required absorbent parts can be selected every time has become a technical problem that needs to be solved urgently.

[0004] In view of this, it is indeed necessary to improve the existing thin film preparation spin coating device to solve the above problems. Summary of the invention

[0005] In view of the above problems, an object of the present invention is to provide a spin coating device, a spin coating method and an electronic device to solve at least one problem existing in the prior art.

[0006] According to one aspect of the present invention, there is provided a spin coating device, comprising a control module, a support platform and a beam structure arranged above the support platform, a spin coating module and a liquid supply module arranged in sequence on the support platform; a pipette arranged on the beam structure; The liquid supply module comprises a first bracket and a second bracket which are arranged in sequence, the first bracket is provided with a receiving groove for accommodating the liquid absorbing member, and the second bracket is used for accommodating the liquid storage device; The control module is used to control the pipette to move to the receiving groove in the first bracket and connect with the liquid absorption component combination; move the pipette connected with the liquid absorption component combination to the second bracket, and use the pipette to absorb the solution to be spin-coated from the liquid reservoir; move the pipette after absorbing the solution to be spin-coated to the third target position corresponding to the spin coater module for dripping, and then perform spin coating film forming operation.

[0007] Furthermore, a preferred technical solution is that it also includes a recovery box arranged on the supporting platform; the recovery box is arranged on a side of the liquid supply module away from the spin coater module. On the other hand, the present invention also provides a spin coating method, the method comprising: controlling the spin coating device as described above to perform a spin coating film forming operation, the method comprising: Moving the pipette along the first direction and / or the second direction to a first target position corresponding to the target receiving groove in the first bracket to be connected with the target liquid-absorbing component assembly in the target receiving groove; Move the pipette along the first direction and / or the second direction to a second target position corresponding to the target liquid reservoir in the second bracket, and use the target liquid aspirating member to absorb the target solution from the target liquid reservoir; Opening the upper cover of the spin coater module, and controlling the pipette to move to the spin coater module along the first direction and / or the second direction when the upper cover of the spin coater module is opened to a preset opening, so that the pipette moves to a third target position corresponding to the spin coater module when the upper cover of the spin coater module is fully opened; The pipette is controlled to drip liquid, and the upper cover of the spin coater module is controlled to close and activate the spin coater module.

[0008] Furthermore, a preferred technical solution is that the first target position and the second target position are determined according to a preset mapping relationship between the target solution and the coordinate position of the target receiving tank, and a mapping relationship between the target solution and the target liquid reservoir.

[0009] Further, a preferred technical solution is that when the pipette after absorbing the target solution moves to a third target position corresponding to the spin coater module, it also includes obtaining a real-time temperature value and a real-time humidity value at the third target position; Using a preset drop volume evaluation adaptive model, the drop volume corresponding to the target solution is obtained according to the physical property parameters of the target solution, the real-time temperature value, and the real-time humidity value; wherein the physical property parameters of the target solution include surface tension, viscosity, and solvent evaporation rate; The dropping is performed according to the dropping amount.

[0010] Further, a preferred technical solution is that after dripping according to the dripping amount, the method further comprises: Collecting real-time rotation speed data of the spin coater module at preset time intervals; Based on a preset spin coating speed fluctuation threshold, continuously monitoring the fluctuation amplitude of the real-time speed data; If it is detected that the fluctuation amplitude of the real-time speed data exceeds the preset spin coating speed fluctuation threshold, an alarm signal is triggered immediately; wherein, the real-time speed of the spin coating instrument module updates the spin coating speed data set, and the spin coating speed fluctuation threshold is determined by a preset spin coating speed evaluation model; the preset spin coating speed evaluation model is obtained based on the training of the spin coating speed data set.

[0011] Further, a preferred technical solution is that the first bracket includes at least two groups of receiving grooves arranged in an array, different array groups are used to accommodate absorbent members of different specifications, and each group of the receiving grooves is used to accommodate absorbent members of the same specification, and the second bracket includes a liquid storage device corresponding to each group of the receiving grooves arranged in the array, and the method further includes: Determine a target array group to which the target liquid-absorbing member belongs, and determine a first target position corresponding to a target receiving slot receiving the target liquid-absorbing member from the target array group; as well as According to the target array group, a liquid reservoir corresponding to the target array group and a corresponding second target position in the second bracket are determined.

[0012] Further, a preferred technical solution is that the spin coater module also includes a recovery box, and the method further includes: After controlling and activating the spin coater module, controlling the pipette to move to a fourth target position corresponding to the recycling box, and unloading the target liquid-absorbing member; and Return to the step of controlling the pipette to move along the first direction and / or the second direction to a first target position corresponding to the target receiving groove in the first bracket. In a third aspect, the present invention also protects an electronic device, which includes a memory, a processor, and a spin coating program stored in the memory and executable on the processor, wherein the spin coating program implements the spin coating method as described above when executed by the processor. In a fourth aspect, the readable storage medium stores a computer program, and when the computer program is executed by a processor, the spin coating method as described above is implemented. The above spin coating device, spin coating method and electronic equipment, through precise dripping control and real-time environmental adaptability adjustment, significantly improve the yield of thin film preparation and reduce the defective film production rate caused by equipment errors, operating errors or environmental changes. Through automation, intelligence and environmental adaptation and other technical means, the problems of insufficient precision, strong environmental dependence and complex operation in the traditional spin coating film production process are effectively solved, the quality and efficiency of thin film preparation are significantly improved, the production cost is reduced, and it has significant technical advantages and application value.

[0013] In order to achieve the above and related purposes, one or more aspects of the present invention include the features that will be described in detail later. The following description and the accompanying drawings describe some exemplary aspects of the present invention in detail. However, these aspects indicate only some of the various ways in which the principles of the present invention can be used. In addition, the present invention is intended to include all these aspects and their equivalents. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] By referring to the following description in conjunction with the accompanying drawings, and with a more comprehensive understanding of the present invention, other objects and results of the present invention will become more apparent and easy to understand. In the accompanying drawings, Figure 1 is a structural schematic diagram of a spin coating device according to an embodiment of the present invention; Figure 2 is another structural schematic diagram of a spin coating device according to an embodiment of the present invention; Figure 3 for Figure 2 The enlarged schematic diagram of the structure in the middle circle; Figure 4 A schematic diagram of the internal structure of an electronic device for implementing a spin coating method provided by an embodiment of the present invention; Figure 5 FIG. 4 is a schematic diagram of a process of a spin coating method according to an embodiment of the present invention.

[0015] The same reference numerals throughout the drawings indicate similar or corresponding features or functions. DETAILED DESCRIPTION

[0016] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0017] The technical solutions in the embodiments of the present application will be described clearly and in detail below in conjunction with the accompanying drawings. In the description of the embodiments of the present application, unless otherwise specified, "and / or" in the text is only a description of the association relationship of the associated objects, indicating that three relationships may exist, for example, A and / or B can represent the existence of A alone, the existence of A and B at the same time, and the existence of B alone.

[0018] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood as suggesting or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In addition, in the description of the embodiments of the present application, "plurality" refers to two or more than two.

[0019] References to "one embodiment" or "some embodiments" etc. described in this specification mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear at different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0020] To describe the spin coating device and method of the present invention in detail, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0021] Artificial intelligence technology is a comprehensive discipline that covers a wide range of fields, including both hardware-level and software-level technologies. The basic technologies of artificial intelligence generally include sensors, dedicated artificial intelligence chips, cloud computing, distributed storage, big data processing technology, operation / interaction devices, mechatronics and other technologies. Artificial intelligence software technology mainly includes computer vision technology, speech processing technology, natural language processing technology, and machine learning / deep learning.

[0022] Machine Learning (ML) is an important branch of Artificial Intelligence (AI), which focuses on studying how to enable computer systems to automatically learn and improve through experience. Machine learning includes supervised learning, unsupervised learning, semi-supervised learning, and reinforcement learning. The main processes of machine learning include data collection, data preprocessing, algorithm selection, training model, evaluation model, deployment model, and monitoring and maintenance. The spin coating speed evaluation model and the drop volume evaluation adaptive model in the present invention are both implemented using machine learning models.

[0023] Computer vision is to obtain the position, shape, posture and other information of an object through machine vision technology, and then guide the robot or automated equipment to perform precise operations. In the present invention, according to the recognition results, the system can adjust the motion trajectory of the pipette in real time and / or detect the film quality during the film making process to complete the precise spin coating film making operation.

[0024] Example 1

[0025] Figure 1~Figure 3 The structure of the spin coating device of the embodiment of the present invention is described in general; wherein, Figure 1 A schematic structural diagram of a spin coating device according to an embodiment of the present invention is shown. Figure 2 Another structural schematic diagram of a spin coating device according to an embodiment of the present invention is shown. Figure 3 for Figure 2 Schematic diagram of the enlarged structure in the middle circle.

[0026] like Figure 1 As shown, the spin coating device 100 provided in this embodiment includes a control module, a support platform and a beam structure arranged above the support platform; a spin coater module 2 and a liquid supply module 3 are arranged in sequence on the support platform; a pipette 1 is arranged on the beam structure; that is, in a direction perpendicular to the horizontal plane, the pipette 1 is arranged above the spin coater module 2 and the liquid supply module 3, and the liquid supply module 3 includes a first bracket 31 and a second bracket 32 ​​arranged in sequence, the first bracket 31 is provided with a receiving groove for accommodating a plurality of liquid absorbent parts, and the second bracket is used to accommodate a plurality of liquid reservoirs; the control module is used to control the pipette to move to the receiving groove in the first bracket and connect with the liquid absorbent assembly; move the pipette connected with the liquid absorbent assembly to the second bracket, and use the pipette to absorb the solution to be spin coated from the liquid reservoir; move the pipette after absorbing the solution to be spin coated to the third target position corresponding to the spin coater module for dripping, and then perform spin coating film forming operation. The pipette 1 is configured to be able to move in at least two directions, so as to move toward the liquid supply module 3 in a first direction and / or a second direction to absorb the solution in the liquid supply module 3, and then move to a position relative to the spin coater module 2 along the first direction and / or the second direction, and drop the solution into the spin coater module 2 to combine with the substrate to be coated in the spin coater module 2 to perform spin coating.

[0027] It should be noted that the first direction and the second direction can be opposite directions, or can be cross or perpendicular directions, which are determined according to the setting positions of the pipette 1, the spin coater module 2 and the liquid supply module 3, and this application does not make any specific limitations.

[0028] The liquid supply module 3 includes a first bracket 31 and a second bracket 32 ​​which are arranged in sequence, wherein the first bracket 31 accommodates a plurality of liquid absorbing parts, and the second bracket 32 ​​accommodates a plurality of liquid reservoirs. The pipette 1 is configured to be able to move along the first direction and / or the second direction to a position opposite to the first bracket 31, and to be connected to one of the liquid absorbing parts; thereafter, the pipette 1 can move along the first direction and / or the second direction to a position opposite to the second bracket 32, and absorb the solution in one of the liquid reservoirs. Preferably, the first bracket 31, the second bracket 32 ​​and the spin coater module 2 are located in the same direction and are arranged in sequence, so that the pipette 1 can sequentially complete the workflow of connecting the liquid absorbing parts, absorbing the solvent and discharging the liquid toward the spin coater module 2.

[0029] Preferably, the spin coater module 2 includes a spin coater cover 21 arranged toward the pipette 1, and the spin coater cover 21 can be activated to open and close in the horizontal or vertical direction, and during the opening process of the spin coater cover 21 of the spin coater module 2, the pipette 1 synchronously moves toward the direction of the spin coater module 2.

[0030] In a preferred implementation, the control module further monitors the opening of the upper cover of the spin coater, and when the upper cover of the spin coater unit is opened to a preset opening, the control module controls the pipette to move to the spin coater module along the first direction and / or the second direction, so that when the upper cover of the spin coater module is fully opened, the pipette moves to the third target position corresponding to the spin coater module. Preferably, in this embodiment, the upper cover 21 of the spin coater opens and closes in the horizontal direction, and the preset opening is 10mm, that is, the movement of the pipette 1 is immediately driven after the upper cover 21 of the spin coater is opened 10mm, which is almost synchronous, greatly shortening the production time.

[0031] The control module is electrically connected to the pipette 1 and the spin coater module 2 , and is capable of driving the pipette 1 to move in at least two directions, activating or disabling the spin coater module 2 , and controlling the opening and closing of the spin coater upper cover 21 .

[0032] In a specific embodiment, the crossbeam structure is arranged in parallel with the support platform, the pipette 1 is slidably arranged on the crossbeam structure, and the second bracket 32 ​​and the first bracket 31 of the spin coater module 2 and the liquid supply module 3 are arranged in sequence on the support platform; only by the pipette 1 sliding back and forth linearly on the crossbeam structure, the pipette 1 can connect the liquid absorbing part from the first bracket 31 of the liquid supply module 3, take liquid from the second bracket 32, and drip liquid for the spin coater module 2. The whole process operation. Furthermore, it also includes a recycling box arranged on the support platform; the recycling box is arranged on the side of the liquid supply module away from the spin coater module. Specifically, the spin coating device 100 is also provided with a recycling box 5. For example, the recycling box 5 is arranged on one side of the second bracket 32, that is, the spin coater module 2, the second bracket 32 ​​of the liquid supply module 3, the first bracket 31 and the recycling box 5 are arranged in sequence on the support platform. Simply by sliding the pipette 1 back and forth on the beam structure, the pipette 1 can connect the liquid-absorbing component to the first bracket 31 of the liquid supply module 3, take liquid from the second bracket 32, drip liquid to the spin coater module 2, and unload the used liquid-absorbing component from the recovery box 5 in the entire process.

[0033] After the spin coater module 2 starts working, the pipette 1 can be selectively moved to a position opposite to the recycling box 5 and unload the liquid absorbing member, and then respectively aligned with the first bracket 31 and the second bracket 32 ​​to exchange for a new liquid absorbing member and absorb the corresponding solution, and then moved to a position opposite to the spin coater module 2 again, so as to perform a second spin coating on the substrate to be coated after the spin coater module 2 completes the spin coating, or perform the first spin coating after the spin coater module 2 replaces the internal substrate to be coated. Of course, in this embodiment, the number of spin coating is not limited to two times, but multiple spin coatings can be performed according to actual needs.

[0034] In a specific embodiment, a visual module is also included; the visual module includes a CCD camera (not shown in the figure), and the CCD camera is arranged above the spin coater module. Exemplarily, the CCD camera is arranged on the side of the pipette 1. It should be noted that the visual module includes a CCD camera, a coaxial optical lens, a light source, etc. The CCD camera is used to capture images, the coaxial optical lens ensures uniform light irradiation, and the light source provides necessary illumination. The CCD camera, the coaxial optical lens, and the light source work together to achieve high-precision image acquisition and processing, so that the image of the rotating platform of the spin coater is obtained through the CCD camera; the center position information of the rotating platform of the spin coater is obtained based on the image of the rotating platform of the spin coater; the displacement adjustment parameters of the pipette are obtained through the center position of the rotating platform, and the pipette is calibrated and aligned based on the displacement adjustment parameters of the pipette. The rotating platform of the spin coater is accurately positioned and calibrated in combination with the visual module (CCD camera). This combination of automation and visual guidance effectively improves the accuracy of the drop position, avoids the film non-uniformity caused by manual operation or equipment precision errors, and significantly improves the film quality. In addition, as an improvement of this embodiment, a CCD camera is used to obtain a film-forming image on the spin coater according to a set time interval; characteristic information of the film is obtained based on the film-forming image; and a film-forming evaluation model is used to monitor the film quality in real time based on the characteristic information of the film.

[0035] In a specific embodiment, the spin coating device further includes a display screen (not shown in the figure) as a human-machine interface. Exemplarily, the display screen is arranged on the beam structure. Through the human-machine interface (which can be a display screen), the user can input or modify the physical parameters of the predetermined target solution, and the system regulates the real-time rotation speed or dripping amount according to the physical parameters of the target solution. In other words, after the system is integrated, the user can conveniently operate and monitor through the human-machine interface to ensure the high efficiency and high quality of the spin coating process.

[0036] Example 2

[0037] Figure 5 FIG. 1 is a schematic diagram of a spin coating method according to an embodiment of the present invention; Figure 5 As shown, it is used to control the spin coating device as described above to perform spin coating film forming operations, and the spin coating method includes steps S110~S140.

[0038] S110, moving the pipette 1 along the first direction and / or the second direction to a first target position corresponding to the target receiving groove in the first bracket, so as to be connected to the target liquid-absorbing component assembly in the target receiving groove.

[0039] For spin coating devices, the applicable film material, i.e., the target solution, can be an organic material, such as a polymer solution (PCDF solution) or an organic photovoltaic material; it can be an inorganic material, such as a silicon dioxide (SiO2) sol and a metal oxide; it can be a composite material, such as an organic-inorganic composite material and a polymer-based composite material; it can be an optoelectronic material, such as a perovskite material, a light-emitting layer material in an organic light-emitting diode (OLED); it can be a photoresist. In the spin coating scenario, there are scenarios where a pipette needs to take liquid multiple times. Multiple liquid taking of the same target solution, for example, for a solution with a low rotation speed (<1000rpm) or a high viscosity, a single liquid taking may be difficult to achieve complete substrate coverage; for example, for a larger substrate, more solution is usually required to cover the entire surface. For example, for a 50×50mm substrate, 100µL of solution may be required. In this case, if the single liquid taking amount is insufficient, multiple liquid takings may be required to ensure sufficient material coverage; for example, in a static dispensing process, sufficient solution is usually dripped onto the substrate at one time until about 50% of the diameter of the substrate is covered. If the material is difficult to spread, multiple liquid extractions may be required to gradually adjust the coverage; for example, in the dynamic dispensing process, the substrate is dispensed during rotation, and multiple liquid extractions are usually required to ensure uniform distribution of the material. In addition, in the scenario of composite film making, multiple liquid extractions for different target solutions are also included. For example, when preparing a PVDF film doped with KNN powder, it is necessary to first prepare a PVDF solution, then disperse the KNN powder in DMF, and finally mix the two before spin coating.

[0040] The first target position and the second target position are determined according to the preset mapping relationship between the coordinate position of the target solution and the target receiving groove, and the mapping relationship between the target solution and the target liquid reservoir. In order to adapt to the above-mentioned scenario where the pipette needs to take liquid multiple times, in a specific embodiment, the first bracket includes at least two groups of receiving grooves arranged in an array, and different array groups are used to accommodate absorbent parts of different specifications, and each group of receiving grooves is used to accommodate absorbent parts of the same specification. In the specific implementation process, the target array group to which the target absorbent part belongs is determined, and the first target position corresponding to the target receiving groove that accommodates the target absorbent part is determined from the target array group.

[0041] In a specific implementation process, a plurality of receiving grooves 311 arranged in an array are provided on the first bracket 31, and the absorbent piece is received in the receiving grooves 311; in the memory module, the receiving grooves 311 are recorded as (X, Y) with the X-axis and Y-axis of the first bracket 31 as directions, and a marking array based on the first bracket 31 is constructed. When the pipette 1 is connected to one of the absorbent pieces, the memory module marks the marking array of the receiving groove 311 corresponding to the absorbent piece.

[0042] In a feasible embodiment, determining the first target position corresponding to the target receiving groove that accommodates the target absorbent member from the target array group includes obtaining a target marking array corresponding to the target receiving groove that accommodates the target absorbent member, and specification parameters corresponding to the target array group; wherein different target array groups correspond to different specification parameters; the specification parameters include the length and / or width of each of the receiving grooves in the array group; and determining the first target position corresponding to the target receiving groove based on the target marking array and the specification parameters.

[0043] like Figure 3 As shown, the first bracket 31 is provided with a plurality of receiving grooves 311 arranged in an array, and the absorbent is received in the receiving grooves 311. In this embodiment, the groove widths of the plurality of receiving grooves 311 are different so as to receive absorbents of different specifications on the first bracket 31, and the pipette 1 is provided with two, and is respectively connected to two absorbents of the same or different specifications.

[0044] In this embodiment, the plane of the first bracket 31 is roughly rectangular, and the array can be counted as ((X0, Y0); (X1, Y0))...(X8, Y12)), and then the width of the receiving grooves in each array group and the distance between two adjacent receiving grooves 311 are obtained, for example, 3 mm. Therefore, it is only necessary to determine the position of one of the arrays, and the positions of the other arrays can be calculated.

[0045] Preferably, the absorbent parts have two specifications and are arranged and accommodated on the first bracket 31 according to a preset ratio. In the memory module, each array of the receiving slots 311 corresponds to a specification of the absorbent parts. The array corresponding to the absorbent parts of the first specification is defined as the first array, and the array corresponding to the absorbent parts of the second specification is defined as the second array. When the number of arrays of the receiving slots 311 marked by the memory module reaches the maximum number of arrays in the first array and / or the second array, the pipette 1 is prohibited from operating.

[0046] Specifically, the receiving slot 311 suitable for the first specification of the absorbent is defined as I, and the receiving slot suitable for the second specification of the absorbent is defined as Q. The number of marks that conform to the first array is represented by I=I+1, and the number of marks that conform to the second array is represented by Q=Q+1. Each time the absorbent is acquired, I / Q is automatically increased by 1, and when I>88, I=1 is assigned; when q>8, I=1 is assigned, that is, the counting is restarted. At this time, the pipette 1 is prohibited from running, and the absorbent is replenished.

[0047] When starting for the first time or when the user replenishes the liquid-absorbing parts at any time, the user can also choose the liquid-absorbing parts to obtain. When all the liquid-absorbing parts are obtained (the system will record the number of times the liquid-absorbing parts are obtained, and when the total number of liquid-absorbing parts is reached, it means that all the liquid-absorbing parts have been obtained, that is, I>88 or Q>8), the system will pop up a warning interface to remind the user to add liquid-absorbing parts; in addition, if the liquid-absorbing parts cannot be obtained (the system will detect whether there are liquid-absorbing parts when the pipette 1 is idle after sending the instruction to obtain the liquid-absorbing parts), an alarm will be prompted on the external touch screen.

[0048] In this embodiment, a monitor is also provided on the pipette 1, and the monitor is configured to monitor the pipette 1 being connected to the liquid absorbing component and driving the liquid absorbing component to break away from the resistance of the first bracket 31, and send a monitoring signal. The control module receives the monitoring signal and controls the pipette 1 to continue moving or abandon the connection with the liquid absorbing component according to the monitoring signal.

[0049] The pipette 1 adopts a force control mode to obtain the liquid-absorbing component, and the power can be set to control the force of obtaining the liquid-absorbing component. It can be seen from the formula P=F·V that when the power P and the speed V are determined, when the resistance F is greater than the actual value, the monitor will send a monitoring signal, the control module will receive the monitoring signal, and control the pipette 1 to return to the initial position to avoid damage to the liquid-absorbing component.

[0050] S120, moving the pipette along the first direction and / or the second direction to a second target position corresponding to the target liquid reservoir in the second bracket, and using the target liquid aspirating member to absorb the target solution from the target liquid reservoir.

[0051] The second support includes a liquid reservoir corresponding to each group of receiving slots arranged in the array. Specifically, the liquid reservoir corresponding to the target array group in the second support and its corresponding second target position are determined according to the target array group.

[0052] The second bracket 32 ​​is provided with a plurality of assembly slots 321 arranged in an array, and the liquid reservoir is accommodated in the assembly slots 321. In the second memory module, the assembly slots 321 are recorded as (A, B) with the X-axis and Y-axis of the second bracket 32 ​​as directions, and a second array model based on the second bracket 32 ​​is constructed. In the first array model and the second array model, the plurality of arrays in the first array model are divided into different batches, and all arrays in each batch correspond to one of the arrays in the second array model. This is because there are more solutions stored in the liquid reservoir, and not all of them can be cleaned up in one suction of the pipette 1. Therefore, according to the needs, multiple liquid aspirators can be set to correspond to the same liquid reservoir to ensure repeated suction.

[0053] Of course, the solutions in the liquid reservoirs are also different. In order to ensure automated use, each liquid-absorbing component corresponds to a specific liquid reservoir, and can determine the positions of the two based on the first array model and the second array model to ensure accuracy.

[0054] In this embodiment, a plurality of the liquid reservoirs have two solutions in total, and the liquid reservoirs having the two solutions are arranged and accommodated on the second bracket 32 ​​in a ratio of 9:6. The control module is further provided with a parameter module, and the parameter module has a plurality of preset parameters, and each array in the first array model corresponds to one of the preset parameters. The control module controls the amount of solution sucked by the pipette through the preset parameters in the parameter module.

[0055] The pipette 1 is connected to a monitoring unit and an alarm module in the control module. The monitoring unit is used to monitor the aspiration state of the pipette 1 and the amount of solution in the pipette 1. When the monitoring unit detects that the pipette 1 absorbs air and / or the amount of solution in the pipette 1 is less than a preset value, an alarm is issued through the alarm module.

[0056] Specifically, before aspirating, preset parameters will be set in the parameter module of the control module, that is, an alarm for empty liquid aspiration will be set. When the pipette 1 absorbs insufficient liquid or air, the pipette will flash a red light to alarm and feed back the alarm value to the control module, thereby causing the external touch screen to prompt an alarm. At this time, the pipette 1 can choose to exhaust the insufficient liquid or air that has just been aspirated, and then the control module can be used to control the pipette 1 to move to the newly selected reservoir position to continue the aspiration process. After the aspiration is completed, the pipette 1 can detect a sufficient amount of liquid before proceeding to the next step, otherwise the above steps will be repeated.

[0057] In a specific embodiment, the target solution and its corresponding preset parameters can be determined according to the spin coating requirements, and then the specifications of the selected wicking piece can be determined according to the preset parameters, so as to determine the target array group to which the wicking piece belongs, and based on the historical number of times the wicking piece is removed from the target array group, the marking array corresponding to the receiving slot to which the target wicking piece corresponding to the current stage belongs is determined, and then based on the marking array corresponding to the target receiving slot, the specification parameters of the receiving slot and the distance between the receiving slots in the array group, the coordinate position of the target receiving slot is determined as the first target position, and the pipette is controlled to move along the first direction to the first target position to connect with the target wicking piece combination in the target receiving slot. Furthermore, the pipette is controlled to drive the target absorbent piece to detach from the target receiving groove, and the detachment resistance between the target absorbent piece and the target receiving groove is monitored in real time. If the detachment resistance is greater than the preset resistance, it is determined that the pipette cannot provide sufficient pulling force for the target absorbent piece to detach from the target receiving groove. At this time, the pipette is controlled to detach from the target absorbent piece, and then other absorbent pieces belonging to the same array group as the target absorbent piece are selected as new target absorbent pieces and moved along the first direction and / or the second direction to reach the first target position corresponding to the new target absorbent piece, so as to be combined and connected with the new target absorbent piece.

[0058] Then, the liquid absorbing component is controlled to move along the second direction to the liquid storage device corresponding to the target array group to absorb the target solution of the preset parameter volume. During the absorption process, if the preset liquid absorption program is completed, for example, after a certain time or number of times of absorption of the solution, the air content or the solution content in the target liquid absorption component is monitored. If the air content is greater than the preset air content or the solution content is less than the preset solution content, it is determined that the absorption has not been completed. Then, the insufficient liquid or air just absorbed can be discharged, and then the pipette can be controlled to move to the second target position again to continue the liquid absorption process until the absorption is completed.

[0059] After the liquid aspiration is completed, the upper cover of the spin coater is controlled to open and the opening degree of the upper cover of the spin coater is monitored. When the opening degree of the upper cover of the spin coater reaches the preset opening degree, it is determined that the upper cover of the spin coater is completely opened when the pipette moves from the second target position to the top of the spin coater. This can effectively prevent the pipette from colliding with the upper cover of the spin coater when the spin coater is opened and closed up and down, thereby affecting the implementation of spin coating. At the same time, it can effectively reduce the residence time of the solution in the air, reduce the risk of contamination during the solution transfer process, and improve the reliability of spin coating while improving the overall work efficiency.

[0060] The pipette 1 is also provided with a color sensor 7, which is electrically connected to the control module and configured to sense whether the lid of the liquid reservoir is open. When the color sensor 7 senses that the lid of the liquid reservoir is not open, the color sensor 7 sends a sensor signal, the control module receives the sensor signal, and prohibits the pipette 1 from continuing to work. Preferably, the color sensor 7 adopts a Keyence color sensor, which detects the state of the lid of the liquid reservoir by optical measurement. If it is detected that the lid of the liquid reservoir is not open, the control module will notify the manual operation to manually open the lid of the liquid reservoir or set an automatic lid opening module to open the lid of the liquid reservoir, and the next step of the process is carried out when the manual operation is completely out of the internal state of the instrument, thereby ensuring the safety of the user. In order to ensure that the manual operation can be completely out of the internal state of the spin coating device 100, a grating module 6 is provided at the feeding port of the spin coating device 100, and the grating module 6 is used to monitor whether the hand entering the internal state is out of the device.

[0061] S130, opening the upper cover of the spin coater module, and controlling the pipette to move along the first direction and / or the second direction to the spin coater module when the upper cover of the spin coater is opened to a preset opening, so that the pipette moves to a third target position corresponding to the spin coater module when the upper cover of the spin coater module is fully opened.

[0062] The method for moving the pipette to a third target position corresponding to the spin coater module includes acquiring an image of a rotating platform of the spin coater through a CCD camera, acquiring center position information of the rotating platform of the spin coater based on the image of the rotating platform of the spin coater, acquiring displacement adjustment parameters of the pipette through the center position of the rotating platform, and calibrating and aligning the pipette based on the displacement adjustment parameters of the pipette.

[0063] S140, controlling the pipette to drip liquid, and controlling the upper cover of the spin coater module to close and activate the spin coater module.

[0064] In a specific embodiment, in order to further apply to scenarios where the same spin coater module corresponds to multiple target solutions and a pipette is required to take liquid multiple times during a film forming process, the drop volume is set according to the different target solutions corresponding to each pipette taking liquid and the different real-time temperature and humidity, thereby further improving the accuracy of film forming.

[0065] S1401. When the pipette moves to the third target position corresponding to the spin coater module after absorbing the target solution, the real-time temperature value and the real-time humidity value at the third target position are obtained; S1402. A preset drop volume adaptive evaluation model is used to obtain the drop volume corresponding to the target solution according to the physical property parameters of the target solution, the real-time temperature value, and the real-time humidity value; wherein the physical property parameters of the target solution include surface tension, viscosity, and solvent evaporation rate; S1403. Dropping is performed according to the drop volume.

[0066] Specifically, by confirming the above-mentioned first target position and second target position, the target solution can be obtained through the pipette 1. The surface tension, viscosity and solvent volatilization rate of the target solution, the real-time temperature value and the real-time humidity value obtained in real time are input into the preset drop volume evaluation adaptive model in the control module, and the drop volume evaluation adaptive model outputs the drop volume corresponding to the target solution; then the spin coater module is dripped according to the drop volume. The output of the drop volume evaluation adaptive model is the optimal drop volume corresponding to the target solution. The model introduces an adaptive function based on the input physical parameters and environmental conditions, so that the model can dynamically adjust the drop volume according to the real-time environmental parameters and the physical property parameters of the solution, and calculate the drop volume suitable for the current working conditions, thereby ensuring the stability of the spin coating process and the quality of the film. It should be noted that by collecting a large amount of experimental data, setting initial parameters according to experimental data or experience, such as the relationship between surface tension, viscosity, solvent evaporation rate and drip volume, the model is trained to learn the complex relationship between drip volume and input parameters. The specific implementation method can be linear regression, support vector machine or neural network model. For example, it can be implemented by particle swarm optimization (PSO) algorithm and K-means clustering algorithm, which are not specifically limited here. During the operation of the model, the model parameters are dynamically adjusted according to the real-time collected temperature, humidity and solution physical property parameters to adapt to environmental changes, and the model is fed back through the actual drip effect to further optimize the model parameters. Furthermore, it is also possible to combine physical models (such as fluid mechanics models) and machine learning algorithms, using physical models to provide theoretical basis, and fitting and optimizing experimental data through machine learning algorithms.

[0067] In the spin coating process, the film quality of different materials has different sensitivities to the rotation speed and its fluctuations. In order to further apply to the same spin coater module corresponding to multiple target solutions and the scenario where the pipette needs to take liquid multiple times during a film forming process, different rotation speed fluctuation thresholds are set according to the different target solutions corresponding to each pipette taking liquid, thereby further improving the accuracy of film forming. The specific steps include: S151, collecting real-time rotation speed data of the spin coater module at preset time intervals; S152, based on the preset spin coating speed fluctuation threshold, continuously monitoring the fluctuation amplitude of the real-time rotation speed data; S153, if it is detected that the fluctuation amplitude of the real-time rotation speed data exceeds the preset spin coating speed fluctuation threshold, an alarm signal is immediately triggered; wherein, the real-time rotation speed of the spin coater module updates the spin coating speed data set, and the spin coating speed fluctuation threshold is determined by a preset spin coating speed evaluation model; the preset spin coating speed evaluation model is obtained by training based on the spin coating speed data set. Specifically, the surface tension, viscosity and solvent evaporation rate of the target solution, the temperature value and the humidity value obtained in real time are input into the preset spin coating speed evaluation model in the control module, and the spin coating speed evaluation model outputs the optimal speed range and spin coating speed fluctuation threshold corresponding to the target solution; then the film forming operation is performed according to the optimal speed range and spin coating speed fluctuation threshold. The spin coating speed evaluation model outputs the optimal speed range and spin coating speed fluctuation threshold corresponding to the target solution. In addition, a flow and spreading model of the solution during spin coating can be established by numerical simulation (such as COMSOL simulation), considering the influence of factors such as surface tension, viscosity, solvent evaporation rate on film thickness and uniformity. It should be noted that by collecting a large amount of experimental data, the model is trained to learn the complex relationship between the speed and the input parameters. The specific implementation method can be linear regression, support vector machine or neural network model, which is not specifically limited here. Further, it is also possible to combine physical models (such as fluid mechanics models) and machine learning algorithms, use physical models to provide theoretical basis, and fit and optimize experimental data through machine learning algorithms. For example, for polymer solutions (such as PVDF solutions), the rotation speed is usually in the range of 1000-5000. If the rotation speed fluctuates by more than 200 rpm, the film thickness will be uneven. For organic photovoltaic materials (such as OLED light-emitting layer materials), the rotation speed is generally set at 1000-3000 rpm. If the rotation speed fluctuates by more than 200 rpm, the film thickness will be uneven. For silicon dioxide (SiO2) sol, the rotation speed is generally 2000-6000 rpm. If the rotation speed fluctuates by more than 200 rpm, the film thickness will be uneven. For metal oxides (such as TiO2), the rotation speed is usually 2000-5000 rpm. If the rotation speed fluctuates by more than 200 rpm, the film thickness will be uneven, affecting the performance after subsequent sintering. For organic-inorganic composite materials, the rotation speed is generally 1000-5000 rpm.The speed fluctuation exceeds 300 rpm, resulting in uneven film thickness and affecting the uniform dispersion of the composite material. For polymer-based composite materials, the speed is usually between 1000-3000 rpm. The speed fluctuation exceeds 280 rpm, resulting in uneven film thickness and affecting the mechanical properties of the material. For perovskite materials, the speed is usually between 1000-6000 rpm. The speed fluctuation exceeds 200 rpm, resulting in uneven film thickness and affecting the crystallization quality. For organic light-emitting diode (OLED) light-emitting layer materials, the speed is generally between 1000-3000 rpm. The speed fluctuation exceeds 200 rpm, resulting in uneven film thickness and affecting the luminous efficiency. For photoresist, the optimal speed for thin photoresist is 2000-4000 rpm, and for thick photoresist is 250-2000 rpm. The speed fluctuation exceeds 300 rpm, resulting in uneven film thickness and affecting the photolithography resolution. In the specific implementation process, if the speed is higher than the set maximum speed or the temperature is lower than the set minimum speed, and / or the speed fluctuation amplitude is greater than the speed fluctuation threshold, an alarm is triggered and the spin coating is stopped. Dynamic display and alarm can be performed on the human-machine interface, making it easy for management personnel to monitor the entire spin coating process.

[0068] In a specific embodiment, the method further includes obtaining a film-forming image on a spin coater according to a set time interval using a CCD camera; obtaining characteristic information of the film based on the film-forming image; and monitoring the film quality in real time based on the characteristic information of the film using a film-forming evaluation model. Specifically, the film-forming image can be obtained by fluorescence spectrum detection means or photoelectric detection means. No specific limitation is made here.

[0069] In addition, the rotation speed and dripping amount of the film during the spin coating process can also be recorded and traced. If quality problems of the film are found during subsequent product testing or use, the physical parameters, temperature, humidity, rotation speed and dripping amount of the target solution can be used to analyze the spin coating operation status, quickly locate the cause of the problem, and take corresponding improvement measures, thereby achieving effective control and continuous improvement of the spin coating film quality.

[0070] The spin coater module also includes a recycling box 5, and the method also includes, S161, after controlling the activation of the spin coater module 2, controlling the pipette to move to the fourth target position corresponding to the recycling box, and unloading the target liquid-absorbing part; and S162, returning to execute the step of controlling the pipette to move along the first direction and / or the second direction to the first target position corresponding to the target receiving groove in the first bracket. That is to say, after the spin coater module 2 starts working, the pipette 1 can be selectively moved to the relative position with the recycling box 5 and unload the liquid-absorbing part, and then respectively aligned with the first bracket 31 and the second bracket 32 ​​to exchange for a new liquid-absorbing part and absorb the corresponding solution, and then moved to the relative position with the spin coater module 2 again, so as to perform a secondary spin coating on the substrate to be coated after the spin coater module 2 is spin-coated or perform the first spin coating after the spin coater module 2 replaces the internal substrate to be coated. Of course, in this embodiment, the number of spin coatings is not limited to twice, but can be spin-coated multiple times according to actual needs.

[0071] Of course, when there are two pipettes 1, after the pipette 1 is discharged, the spin coater module 2 closes the spin coater cover 21 and starts spin coating (the user can freely set the spin coating time). After the set time is reached, the second pipette 1 performs the second spin coating after dripping in the above process. The time of the first spin coating and the second spin coating can be accurately controlled and adjusted. The spin coater is powerful, has a recipe function, a rotation speed accuracy of 1-10000RPM, and a heating function. There is no limit to the number of spin coating data (time speed) each time, and ten speeds are standard, so that different types of films can be prepared.

[0072] The more specific implementation methods of the above spin coating method can refer to the above-mentioned description of the embodiment of the spin coating device, which will not be described in detail here. The above spin coating method and spin coating device can be applied to the coating of photoresist, the preparation of high-performance coatings for automotive products or aerospace products, the preparation of sensitive film materials for biomedical sensors, etc.

[0073] Example 3

[0074] like Figure 4 As shown, the present invention also provides an electronic device 4 for implementing the spin coating method. In the specific implementation process, the electronic device 4 is equivalent to the control module in the spin coating device of the above embodiment.

[0075] The electronic device 4 may include a processor 40, a memory 41 and a bus, and may also include a computer program stored in the memory 41 and run on the processor 40, such as a spin coating program 42. The memory 41 may also include both an internal storage unit of the spin coating device and an external storage device. The memory 41 may be used not only to store application software and various data installed, such as the code of the spin coating program, but also to temporarily store data that has been output or is to be output.

[0076] The electronic device 4 may include a processor 40, a memory 41 and a bus, and may also include a computer program stored in the memory 41 and run on the processor 40, such as a spin coating program 42. The memory 41 may also include both an internal storage unit of the spin coating device and an external storage device. The memory 41 may be used not only to store application software and various data installed, such as the code of the spin coating program, but also to temporarily store data that has been output or is to be output.

[0077] The memory 41 includes at least one type of readable storage medium, and the readable storage medium includes a flash memory, a mobile hard disk, a multimedia card, a card-type memory (for example, an SD or DX memory, etc.), a magnetic memory, a disk, an optical disk, etc. In some embodiments, the memory 41 may be an internal storage unit of the electronic device 4, such as a mobile hard disk of the electronic device 4. In other embodiments, the memory 41 may also be an external storage device of the electronic device 4, such as a plug-in mobile hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (SecureDigital, SD) card, a flash card (Flash Card), etc. equipped on the electronic device 4. Further, the memory 41 may also include both an internal storage unit and an external storage device of the electronic device 4. The memory 41 may not only be used to store application software and various types of data installed in the electronic device 4, such as the code of the spin coating program, etc., but also be used to temporarily store data that has been output or is to be output.

[0078] The processor 40 may be composed of an integrated circuit in some embodiments, for example, a single packaged integrated circuit, or a plurality of packaged integrated circuits with the same or different functions, including one or more central processing units (CPUs), microprocessors, digital processing chips, graphics processors, and a combination of various control chips, etc. The processor 40 is the control core (Control Unit) of the electronic device, and uses various interfaces and lines to connect various components of the entire electronic device, and executes various functions and processes data of the electronic device 4 by running or executing programs or modules (such as spin coating programs, etc.) stored in the memory 41, and calling data stored in the memory 41.

[0079] The bus may be a peripheral component interconnect (PCI) bus or an extended industry standard architecture (EISA) bus, etc. The bus may be divided into an address bus, a data bus, a control bus, etc. The bus is configured to realize connection and communication between the memory 41 and at least one processor 40, etc.

[0080] Figure 4 Only an electronic device with components is shown, and those skilled in the art will understand that Figure 4 The structure shown does not constitute a limitation on the electronic device 4, and may include fewer or more components than shown in the figure, or combine certain components, or arrange the components differently.

[0081] For example, although not shown, the electronic device 4 may also include a power source (such as a battery) for supplying power to various components. Preferably, the power source may be logically connected to the at least one processor 40 through a power management device, so that the power management device can realize functions such as charging management, discharging management, and power consumption management. The power source may also include any components such as one or more DC or AC power sources, recharging devices, power failure detection circuits, power converters or inverters, and power status indicators. The electronic device 4 may also include a variety of sensors, Bluetooth modules, Wi-Fi modules, etc., which will not be described in detail here.

[0082] Furthermore, the electronic device 4 may also include a network interface. Optionally, the network interface may include a wired interface and / or a wireless interface (such as a WI-FI interface, a Bluetooth interface, etc.), which is usually used to establish a communication connection between the electronic device 4 and other electronic devices.

[0083] Optionally, the electronic device 4 may further include a user interface, which may be a display, an input unit (such as a keyboard), or a standard wired interface or a wireless interface. Optionally, in some embodiments, the display may be an LED display, a liquid crystal display, a touch-sensitive liquid crystal display, and an OLED (Organic Light-Emitting Diode) touch device. The display may also be appropriately referred to as a display screen or a display unit, which is used to display information processed in the electronic device 4 and to display a visual user interface.

[0084] It should be understood that the embodiment is for illustration only and the scope of the patent application is not limited to this structure.

[0085] The spin coating program 42 stored in the memory 41 in the electronic device 4 is a combination of multiple instructions. When running in the processor 40, it can be realized that the pipette is moved along the first direction and / or the second direction to a first target position corresponding to the target receiving groove in the first bracket to connect with the target liquid absorption component combination in the target receiving groove; the pipette is moved along the first direction and / or the second direction to a second target position corresponding to the target liquid reservoir in the second bracket, and the target liquid absorption component is used to absorb the target solution from the target liquid reservoir; the upper cover of the spin coater module is opened, and the pipette is controlled to move along the first direction and / or the second direction to the spin coater module when the upper cover of the spin coater is opened to a preset opening, so that the pipette moves to a third target position corresponding to the spin coater module when the upper cover of the spin coater module is fully opened; the pipette is controlled to drip, and the upper cover of the spin coater module is controlled to close and activate the spin coater module.

[0086] Specifically, the specific implementation method of the processor 40 for the above instructions can refer to Figure 1 The description of the relevant steps in the corresponding embodiment is not repeated here. Furthermore, if the module / unit integrated in the electronic device 4 is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. The computer-readable medium may include any entity or device, recording medium, USB flash drive, mobile hard disk, disk, optical disk, computer memory, read-only memory (ROM, Read-Only Memory) that can carry the computer program code.

[0087] An embodiment of the present invention also provides a computer-readable storage medium, which can be non-volatile or volatile, and stores a computer program. When the computer program is executed by a processor, the pipette is moved along the first direction and / or the second direction to a first target position corresponding to a target receiving groove in the first bracket to be connected with a target liquid-absorbing component combination in the target receiving groove; the pipette is moved along the first direction and / or the second direction to a second target position corresponding to a target liquid reservoir in the second bracket, and the target liquid-absorbing component is used to absorb the target solution from the target liquid reservoir; the upper cover of the spin coater module is opened, and the pipette is controlled to move along the first direction and / or the second direction to the spin coater module when the upper cover of the spin coater is opened to a preset opening, so that the pipette moves to a third target position corresponding to the spin coater module when the upper cover of the spin coater module is fully opened; the pipette is controlled to drip, and the upper cover of the spin coater module is controlled to close and activate the spin coater module.

[0088] Specifically, the specific implementation method when the computer program is executed by the processor can refer to the description of the relevant steps in the wearing detection method in the embodiment, which will not be repeated here.

[0089] In the several embodiments provided by the present invention, it should be understood that the disclosed devices, apparatuses and methods can be implemented in other ways. For example, the device embodiments described above are only schematic, for example, the division of the modules is only a logical function division, and there may be other division methods in actual implementation.

[0090] The modules described as separate components may or may not be physically separated, and the components shown as modules may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0091] In addition, each functional module in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of hardware plus software functional modules.

[0092] It is obvious to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention.

[0093] Therefore, no matter from which point of view, the embodiments should be regarded as illustrative and non-restrictive, and the scope of the present invention is limited by the appended claims rather than the above description, so it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention. Any attached figure mark in the claims should not be regarded as limiting the claims involved.

[0094] In addition, it is obvious that the word "comprising" does not exclude other units or steps, and the singular does not exclude the plural. The multiple units or devices stated in the device claim can also be implemented by one unit or device through software or hardware.

[0095] As described above with reference to the accompanying drawings, the spin coating device and the spin coating method according to the present invention are described by way of example. However, it should be understood by those skilled in the art that various improvements can be made to the spin coating method and the spin coating device proposed by the present invention without departing from the content of the present invention. Therefore, the protection scope of the present invention should be determined by the content of the attached claims.

Claims

1. A spin coating device, characterized in that: It includes a control module, a support platform and a crossbeam structure arranged above the support platform, a spin coater module and a liquid supply module are arranged in sequence on the support platform; a pipette is arranged on the crossbeam structure; The liquid supply module comprises a first bracket and a second bracket which are arranged in sequence, the first bracket is provided with a receiving groove for accommodating the liquid absorbing member, and the second bracket is used for accommodating the liquid storage device; The control module is used to control the pipette to move to the receiving groove in the first bracket and connect with the liquid absorbing component assembly; move the pipette connected with the liquid absorbing component assembly to the second bracket, and use the pipette to absorb the solution to be spin-coated from the liquid reservoir; After the pipette absorbs the solution to be spin-coated, it is moved to the third target position corresponding to the spin-coating device module to drip the solution, and then the spin-coating film-forming operation is performed.

2. The spin coating device according to claim 1, characterized in that: It also includes a recovery box arranged on the support platform; the recovery box is arranged on a side of the liquid supply module away from the spin coater module.

3. A spin coating method, characterized in that: The method is used to control the spin coating device according to claim 1 to perform spin coating film forming operation, the method comprising: Moving the pipette along the first direction and / or the second direction to a first target position corresponding to the target receiving groove in the first bracket to be connected with the target liquid-absorbing component assembly in the target receiving groove; Move the pipette along the first direction and / or the second direction to a second target position corresponding to the target liquid reservoir in the second bracket, and use the target liquid aspirating member to absorb the target solution from the target liquid reservoir; Opening the upper cover of the spin coater module, and controlling the pipette to move to the spin coater module along the first direction and / or the second direction when the upper cover of the spin coater module is opened to a preset opening, so that the pipette moves to a third target position corresponding to the spin coater module when the upper cover of the spin coater module is fully opened; The pipette is controlled to drip liquid, and the upper cover of the spin coater module is controlled to close and activate the spin coater module.

4. The spin coating method according to claim 3, characterized in that: The first target position and the second target position are determined according to a preset mapping relationship between the target solution and the coordinate position of the target receiving tank, and a mapping relationship between the target solution and the target liquid reservoir.

5. The spin coating method according to claim 3, characterized in that: When the pipette after absorbing the target solution moves to a third target position corresponding to the spin coater module, it also includes obtaining a real-time temperature value and a real-time humidity value at the third target position; Using a preset drop volume evaluation adaptive model, the drop volume corresponding to the target solution is obtained according to the physical property parameters of the target solution, the real-time temperature value, and the real-time humidity value; wherein the physical property parameters of the target solution include surface tension, viscosity, and solvent evaporation rate; The dropping is performed according to the dropping amount.

6. The spin coating method according to claim 5, characterized in that: After dripping according to the dripping amount, the method further comprises: Collecting real-time rotation speed data of the spin coater module at preset time intervals; Based on a preset spin coating speed fluctuation threshold, continuously monitoring the fluctuation amplitude of the real-time speed data; If it is detected that the fluctuation amplitude of the real-time speed data exceeds the preset spin coating speed fluctuation threshold, an alarm signal is triggered immediately; wherein, the real-time speed of the spin coating instrument module updates the spin coating speed data set, and the spin coating speed fluctuation threshold is determined by a preset spin coating speed evaluation model; the preset spin coating speed evaluation model is obtained based on the training of the spin coating speed data set.

7. The spin coating method according to claim 3, characterized in that: The first bracket includes at least two groups of receiving grooves arranged in an array, different array groups are used to receive absorbent members of different specifications, and each group of receiving grooves is used to receive absorbent members of the same specification, and the second bracket includes a liquid storage device corresponding to each group of receiving grooves arranged in the array, and the method further includes: Determine a target array group to which the target liquid-absorbing member belongs, and determine a first target position corresponding to a target receiving slot receiving the target liquid-absorbing member from the target array group; as well as A liquid reservoir corresponding to the target array group and a corresponding second target position thereof in the second bracket are determined according to the target array group.

8. The spin coating method according to claim 3, characterized in that: The spin coater module also includes a recovery box, and the method further includes: After controlling and activating the spin coater module, controlling the pipette to move to a fourth target position corresponding to the recycling box, and unloading the target liquid-absorbing component; as well as Return to the step of controlling the pipette to move along the first direction and / or the second direction to a first target position corresponding to the target receiving groove in the first bracket.

9. An electronic device, characterized in that: The electronic device comprises a memory, a processor and a spin coating program stored in the memory and executable on the processor, wherein the spin coating program implements the spin coating method according to any one of claims 3 to 8 when executed by the processor.

10. A computer-readable storage medium, characterized in that: The storage medium stores a computer program, and when the computer program is executed by a processor, the spin coating method according to any one of claims 3 to 8 is implemented.

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