High-precision electronic chip processing and positioning device and use method thereof

Abstract

The invention discloses a high-precision electronic chip processing and positioning device and a using method thereof, and relates to the technical field of electronic chip processing and positioning, the high-precision electronic chip processing and positioning device comprises a first plate body, a rod body and a rotating plate, a control unit is installed at the top of the first plate body, the rod body is installed at the top of the first plate body, and first hydraulic telescopic units are symmetrically installed on one side of the rod body; and the first hydraulic telescopic unit is in electric signal connection with the control unit, a moving frame is installed at the output end of the first hydraulic telescopic unit, a rotary supporting mechanism is arranged in the moving frame, and a laser ranging unit is installed on one side of the rod body and is in electric signal connection with the control unit. The wafer is placed on the rotating plate, and then the moving distance of the wafer can be measured through the laser ranging unit, so that the machining positioning device can be conveniently placed below a cutter cutting device for equal-interval accurate cutting.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic chip processing and positioning, and in particular to a high-precision electronic chip processing and positioning device and a use method thereof. Background Art

[0002] Electronic chips are generally obtained by cutting wafers. Multiple chips are integrated in the wafer. When cutting the wafer to obtain chips, the wafer needs to be fixed to ensure the stability of multiple chips when they are cut and separated. Some processing positioning devices can position and fix the chips.

[0003] The defects of the existing processing positioning device are: 1. The prior art JPH0446727A discloses a plate positioning device in a plate processing line. This technology does not have a structure for evenly spaced movement of the workpiece to be positioned, and cannot make the fixed workpiece move multiple times with equal spacing in one direction. Therefore, a high-precision electronic chip processing positioning device that can move evenly spaced in one direction is needed to solve this problem.

[0004] 2. Prior art JP2003010932A discloses a positioning device for stamping components. This technology does not have the function of changing the direction of the positioned product. The direction of the product cannot be changed after the product is positioned, which makes it inconvenient for the cutter to cut the product from multiple directions. Therefore, a high-precision electronic chip processing positioning device is needed to solve this problem by rotating the chip after positioning it so as to process the chip from multiple directions.

[0005] 3. The prior art JP2001096485A discloses a positioning device and a processing device. This technology does not have a structure for collecting the positioned workpieces. After the positioned workpieces are processed, the workpieces cannot be collected, thereby failing to simplify the collection process of the workpieces. The operation process is cumbersome. Therefore, a high-precision electronic chip processing positioning device that can collect the cut chips is needed to solve this problem.

[0006] 4. The prior art CN209811766U discloses a fixing fixture for processing electronic chips. This technology does not have a structure for collecting the positioned workpiece after processing. When another collection frame is set up to collect the chips, the chips are easily damaged when they fall into the collection frame from a high place. Therefore, a high-precision electronic chip processing positioning device with a collection structure that can prevent the chips from falling into the collection structure and being damaged is needed to solve this problem. Summary of the invention

[0007] One purpose of the present application is to provide a high-precision electronic chip processing positioning device and a method of using the same, which can solve the technical problems raised in the prior art.

[0008] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a high-precision electronic chip processing and positioning device, comprising a plate body one, a rod body and a rotating plate, a control unit is installed on the top of the plate body one, a rod body is installed on the top of the plate body one, a hydraulic telescopic unit one is symmetrically installed on one side of the rod body, and the hydraulic telescopic unit one is connected to the control unit by electrical signals, a moving frame is installed on the output end of the hydraulic telescopic unit one, a rotating support mechanism is arranged inside the moving frame, a laser ranging unit is installed on one side of the rod body, and the laser ranging unit is connected to the control unit by electrical signals; A plurality of plate bodies 2 are installed on the top of the plate body 1, a hydraulic telescopic unit 2 is installed on the front of the plate body 2, and the hydraulic telescopic unit 2 is electrically connected to the control unit, a movable plate 2 is installed at the output end of the hydraulic telescopic unit 2, an electric telescopic unit 2 is installed on the top of the movable plate 2, and the electric telescopic unit 2 is electrically connected to the control unit, and a pressure plate 1 is installed at the output end of the electric telescopic unit 2.

[0009] Preferably, support plates are symmetrically installed on the bottom of the plate body 1.

[0010] Preferably, the rotating support mechanism comprises a rotating column and a rotating plate, the rotating column is movably installed on the bottom inner wall of the moving frame, and the rotating plate is installed on the top of the rotating column.

[0011] Preferably, electric telescopic units 1 are symmetrically installed on both sides of the movable frame, and the electric telescopic units 1 are connected to the control unit via electrical signals, and a movable plate 1 is installed at the output end of the electric telescopic units 1.

[0012] Preferably, a plurality of pressure sensing units 1 are installed on one side of the movable plate 1, and the pressure sensing unit 1 is electrically connected to the control unit, a limit plate is installed at the input end of the pressure sensing unit 1, and a rubber pad 4 is installed on one side of the limit plate.

[0013] Preferably, a rubber pad 1 is installed at the bottom of the pressing plate 1.

[0014] Preferably, a right-angle plate is installed on the top of the pressure plate one, a micro motor is installed on the top of the right-angle plate, and the micro motor is electrically connected to the control unit, a rotating rod is installed on the output end of the micro motor, a pressure plate two is installed on one end of the rotating rod, and a rubber pad two is installed on the bottom of the pressure plate two.

[0015] Preferably, a frame is installed on the back of the plate body one, a collection box is installed on the inner side of the frame, an electric telescopic unit three is installed on the bottom inner wall of the collection box, and the electric telescopic unit three is electrically connected to the control unit by signals, a pressure sensing unit two is installed on the output end of the electric telescopic unit three, and the pressure sensing unit two is electrically connected to the control unit by signals, a lifting plate is installed on the input end of the pressure sensing unit two, and a rubber pad three is installed on the top of the lifting plate.

[0016] Preferably, the method for using the high-precision electronic chip processing and positioning device is as follows: S1. The processing positioning device is installed below the cutter cutting device, and then the wafer with multiple chips produced is placed above the rotating plate, and then the limit plates on both sides are moved inward to squeeze and limit the wafer, and at the same time, the pressure sensing unit 1 detects the pressure of the limit plate on the wafer to avoid excessive pressure of the limit plate on the wafer, and then the moving frame moves to the left by the distance of one chip, and the pressure plates 1 and 2 are moved down to press the wafer; S2, the cutter of the cutter cutting device moves down to cut the wafer, and then the first and second pressing plates move up, the moving frame drives the wafer to continue to move to the left by a distance of one chip, and the cutter of the cutter cutting device continues to move down to cut the wafer; S3, then the rotating plate rotates to drive the wafer to rotate 90 degrees, so that the cutter cutting device continues to cut chips on the wafer in a direction perpendicular to the original cutting direction of the wafer; S4. After the cutting is completed, the micro motor drives the second pressing plate to rotate parallel to the first pressing plate, and then the first pressing plate and the second pressing plate move down, and then the first pressing plate and the second pressing plate move backward to push the chip on the rotating plate into the collection box.

[0017] Preferably, the step S4 further includes the following steps: S41. Before the chip enters the collection box, the lifting plate first moves up to reduce the descending distance of the chip, thereby reducing the damage caused by the chip collision. As the pressure detected by the pressure sensing unit 2 increases, the lifting plate moves down accordingly.

[0018] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention places the wafer on a rotating plate, and then measures the moving distance of the wafer through a laser distance measuring unit, so that the processing positioning device can be conveniently placed under the cutter cutting device to perform precise cutting with equal spacing.

[0019] 2. When the present invention is used in a cutter cutting device, after the cutter cuts the wafer at equal intervals from one direction, the wafer can be turned by rotating the rotating plate, thereby facilitating equal interval cutting of the wafer from another direction.

[0020] 3. After the cutting is completed in the present invention, the micro motor drives the second pressing plate to rotate to be parallel to the first pressing plate, and then the first pressing plate and the second pressing plate move down, and then the first pressing plate and the second pressing plate move backward to push the chip on the rotating plate into the collection box. At the same time, the second pressing plate rotates to be parallel to the first pressing plate to facilitate the placement of the wafer on the rotating plate.

[0021] 4. The present invention reduces the chip's descending distance by first moving the lifting plate upward before the chip enters the collection box, thereby reducing damage to the chip caused by collision. As the pressure detected by the pressure sensing unit 2 increases, the lifting plate moves downward accordingly. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A perspective view of the present invention; Figure 2 It is a schematic diagram of the structure of the mobile frame of the present invention; Figure 3 It is a schematic diagram of the structure of the rotating plate of the present invention; Figure 4 It is a structural schematic diagram of a movable plate of the present invention; Figure 5 It is a schematic diagram of the second structure of the plate body of the present invention; Figure 6 It is a structural schematic diagram of the second movable plate of the present invention; Figure 7 It is a schematic diagram of the frame structure of the present invention; Figure 8 It is a schematic diagram of the structure of the collection box of the present invention; Fig. 9 The figure is a flow chart of the method for using the present invention.

[0023] In the figure: 1. Plate body 1; 2. Control unit; 3. Support plate; 4. Rod body; 5. Hydraulic telescopic unit 1; 6. Moving frame; 7. Rotating column; 8. Rotating plate; 9. Laser ranging unit; 10. Electric telescopic unit 1; 11. Moving plate 1; 12. Plate body 2; 13. Hydraulic telescopic unit 2; 14. Moving plate 2; 15. Electric telescopic unit 2; 16. Pressing plate 1; 17. Right-angle plate; 18. Micro motor; 19. Rotating rod; 20. Pressing plate 2; 21. Rubber pad 1; 22. Rubber pad 2; 23. Frame; 24. Collecting box; 25. Electric telescopic unit 3; 26. Lifting plate; 27. Rubber pad 3; 28. Pressure sensing unit 1; 29. ​​Limiting plate; 30. Rubber pad 4; 31. Pressure sensing unit 2. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0026] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0027] See also Figure 1 , Figure 2 and Figure 3 , an embodiment provided by the present invention: a high-precision electronic chip processing and positioning device; The device comprises a plate body 1, a rod body 4 and a rotating plate 8, a control unit 2 is installed on the top of the plate body 1, a support plate 3 is symmetrically installed on the bottom of the plate body 1, a rod body 4 is installed on the top of the plate body 1, a hydraulic telescopic unit 5 is symmetrically installed on one side of the rod body 4, and the hydraulic telescopic unit 5 is electrically connected to the control unit 2, a moving frame 6 is installed on the output end of the hydraulic telescopic unit 5, a rotating support mechanism is arranged inside the moving frame 6, and the rotating support mechanism comprises a rotating column 7 and a rotating plate 8, the rotating column 7 is movably installed on the bottom inner wall of the moving frame 6, a rotating plate 8 is installed on the top of the rotating column 7, a laser distance measuring unit 9 is installed on one side of the rod body 4, and the laser distance measuring unit 9 is electrically connected to the control unit 2, the plate body 1 can provide an installation position for other components of the device, so that other components of the device have a position for installation, the control unit 2 is a controller, and can receive signals from the laser distance measuring unit 9, the pressure sensing unit 1 28 and the pressure sensing unit 2 31 signal, and can control the hydraulic telescopic unit 15, the electric telescopic unit 10, the hydraulic telescopic unit 2 13, the electric telescopic unit 2 15, the micro motor 18 and the electric telescopic unit 3 25 at the same time; the support plate 3 can support the plate body 1; the rod body 4 can provide an installation position for the hydraulic telescopic unit 15; the hydraulic telescopic unit 15 is a hydraulic cylinder, which can convert hydraulic energy into kinetic energy, thereby driving the moving frame 6 to move left and right; the moving frame 6 can drive the rotating plate 8 to move left and right by moving left and right, thereby driving the wafer placed on the rotating plate 8 to move left and right; the rotating column 7 can rotate, thereby rotating the rotating plate 8; the rotating plate 8 can rotate the wafer placed above the rotating plate 8, thereby facilitating cutting of the wafer from different directions, so that the chip on the wafer can be completely cut out; the laser ranging unit 9 is a laser rangefinder, which can measure the distance between itself and the moving frame 6, thereby facilitating the determination of the position of the wafer.

[0028] See also Figure 1 , Figure 5 and Figure 6 , an embodiment provided by the present invention: a high-precision electronic chip processing and positioning device; The present invention comprises a plate body 12 and a movable plate 14, a plurality of plate bodies 12 are installed on the top of the plate body 1, a hydraulic telescopic unit 13 is installed on the front of the plate body 12, and the hydraulic telescopic unit 13 is connected to the control unit 2 by electrical signals, a movable plate 14 is installed on the output end of the hydraulic telescopic unit 13, an electric telescopic unit 15 is installed on the top of the movable plate 14, and the electric telescopic unit 15 is connected to the control unit 2 by electrical signals, a pressing plate 16 is installed on the output end of the electric telescopic unit 15, and a rubber pad 21 is installed on the bottom of the pressing plate 16, and the plate body 12 can be hydraulically The telescopic unit 2 13 provides an installation position so that the hydraulic telescopic unit 2 13 can be installed. The hydraulic telescopic unit 2 13 is a hydraulic cylinder that can convert hydraulic energy into kinetic energy, thereby driving the movable plate 2 14 to move forward and backward. The movable plate 2 14 can drive the electric telescopic unit 2 15, the pressure plate 1 16 and the pressure plate 2 20 to move forward and backward by moving forward and backward. The electric telescopic unit 2 15 is an electric telescopic rod that can convert electrical energy into kinetic energy, thereby driving the pressure plate 1 16 to move up and down. The rubber pad 1 21 can prevent the pressure plate 16 from directly contacting the wafer, thereby avoiding damage to the wafer.

[0029] See also Figure 1 , Figure 2 and Figure 4 , an embodiment provided by the present invention: a high-precision electronic chip processing and positioning device; It includes an electric telescopic unit 10 and a moving plate 11. The electric telescopic units 10 are symmetrically installed on both sides of the moving frame 6, and the electric telescopic units 10 are electrically connected to the control unit 2. The output end of the electric telescopic unit 10 is installed with the moving plate 11. One side of the moving plate 11 is installed with multiple pressure sensing units 28, and the pressure sensing units 28 are electrically connected to the control unit 2. A limit plate 29 is installed at the input end of the pressure sensing unit 28, and a rubber pad 4 30 is installed on one side of the limit plate 29. The electric telescopic unit 10 is an electric telescopic rod, which can convert electrical energy into kinetic energy, thereby driving the moving plate 11 to move left and right. The moving plate 11 can drive the limit plate 29 to move left and right by moving left and right. The pressure sensing unit 28 is a pressure sensor, which can detect the pressure of the limit plate 29 on the wafer. The limit plate 29 can limit the wafer so that the wafer is located in the middle position of the rotating plate 8. The rubber pad 4 30 can prevent the limit plate 29 from directly contacting the wafer and causing damage to the wafer.

[0030] See also Figure 1 , Figure 5 and Figure 6 , an embodiment provided by the present invention: a high-precision electronic chip processing and positioning device; It includes a right-angle plate 17 and a micro motor 18. The top of the pressure plate 16 is installed with the right-angle plate 17, the top of the right-angle plate 17 is installed with the micro motor 18, and the micro motor 18 is connected to the control unit 2 by electrical signals. The output end of the micro motor 18 is installed with a rotating rod 19, one end of the rotating rod 19 is installed with a pressure plate 20, and the bottom of the pressure plate 20 is installed with a rubber pad 22. The right-angle plate 17 can provide an installation position for the micro motor 18. The micro motor 18 can convert electrical energy into kinetic energy, thereby driving the rotating rod 19 to rotate. The rotating rod 19 can drive the pressure plate 20 to rotate by rotating. The pressure plate 20 moves downward to press the wafer. At the same time, the pressure plate 20 can be rotated to be parallel to the pressure plate 16 to conveniently move backward to push the cut chip into the collection box 24. The rubber pad 22 can prevent the pressure plate 20 from directly contacting the chip and causing chip damage.

[0031] See also Figure 1 , Figure 7 and Figure 8 , an embodiment provided by the present invention: a high-precision electronic chip processing and positioning device; The frame 23 is installed on the back of the plate 1, and a collection box 24 is installed on the inner side of the frame 23. An electric telescopic unit 3 25 is installed on the inner wall of the bottom of the collection box 24, and the electric telescopic unit 3 25 is connected to the control unit 2 by electrical signals. A pressure sensing unit 2 31 is installed on the output end of the electric telescopic unit 3 25, and the pressure sensing unit 2 31 is connected to the control unit 2 by electrical signals. A lifting plate 26 is installed on the input end of the pressure sensing unit 2 31, and a rubber pad 3 27 is installed on the top of the lifting plate 26. The frame 23 can It can provide an installation position for the collection box 24, and the collection box 24 plays the role of collecting chips. The electric telescopic unit three 25 is an electric telescopic rod, which can convert electrical energy into kinetic energy, thereby driving the pressure sensing unit two 31 and the lifting plate 26 to move up and down. The pressure sensing unit two 31 can detect the pressure of the chip above the lifting plate 26. The lifting plate 26 can reduce the distance the chip falls by moving upward, thereby reducing the collision damage when the chip falls. The rubber pad three 27 can prevent the chip from directly colliding with the lifting plate 26 and causing damage to the lifting plate 26.

[0032] The method of using the high-precision electronic chip processing positioning device is as follows: S1. The processing positioning device is installed below the cutter cutting device, and then the wafer with multiple chips produced is placed above the rotating plate 8. Then the limit plates 29 on both sides move inward to squeeze and limit the wafer. At the same time, the pressure sensing unit 1 28 detects the pressure of the limit plate 29 on the wafer to avoid excessive pressure of the limit plate 29 on the wafer. Then the moving frame 6 moves to the left by the distance of one chip, and the pressing plate 1 16 and the pressing plate 2 20 move down to press the wafer. S2, the cutter of the cutter cutting device moves down to cut the wafer, then the pressure plate 16 and the pressure plate 2 20 move up, the moving frame 6 drives the wafer to continue to move to the left by a distance of a chip, and the cutter of the cutter cutting device continues to move down to cut the wafer; S3, then the rotating plate 8 rotates to drive the wafer to rotate 90 degrees, so that the cutter cutting device continues to cut chips on the wafer in a direction perpendicular to the original cutting direction of the wafer; S4, after the cutting is completed, the micro motor 18 drives the second pressing plate 20 to rotate parallel to the first pressing plate 16, and then the first pressing plate 16 and the second pressing plate 20 move down, and then the first pressing plate 16 and the second pressing plate 20 move backward to push the chip on the rotating plate 8 into the collection box 24.

[0033] S4 also includes the following steps: S41, before the chip enters the collection box 24, the lifting plate 26 first moves up to reduce the descending distance of the chip, thereby reducing the damage caused by the chip collision. As the pressure detected by the pressure sensing unit 2 31 increases, the lifting plate 26 moves down accordingly.

[0034] Working principle: Before using the high-precision electronic chip processing and positioning device, you should first check whether the high-precision electronic chip processing and positioning device has any problems that affect its use, install the processing and positioning device under the cutter cutting device, and then place the completed wafer with multiple chips on top of the rotating plate 8, and then the limit plates 29 on both sides move inward to squeeze and limit the wafer, and at the same time, the pressure sensing unit 1 28 detects the pressure of the limit plate 29 on the wafer to avoid excessive pressure of the limit plate 29 on the wafer, and then the moving frame 6 moves to the left by the distance of a chip, and the pressure plate 1 16 and the pressure plate 2 20 move down to press the wafer, and then the cutter of the cutter cutting device moves down to cut the wafer, and then the pressure plate 1 16 and the pressure plate 2 20 move up, and the moving frame 6 drives The wafer continues to move to the left the distance of a chip, and the cutter of the cutter cutting device continues to move down to cut the wafer, and then the rotating plate 8 rotates to drive the wafer to rotate ninety degrees, so that the cutter cutting device continues to cut the chip on the wafer in a direction perpendicular to the original cutting direction of the wafer. After the cutting is completed, the micro motor 18 drives the pressure plate 20 to rotate to be parallel to the pressure plate 1 16, and then the pressure plate 1 16 and the pressure plate 2 20 move down, and then the pressure plate 1 16 and the pressure plate 2 20 move backward to push the chip on the rotating plate 8 into the collection box 24. Before the chip enters the collection box 24, the lifting plate 26 moves up first to reduce the descending distance of the chip, thereby reducing the damage to the chip caused by collision. As the pressure detected by the pressure sensing unit 2 31 increases, the lifting plate 26 moves down accordingly.

[0035] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, from all points of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention, and any reference signs in the claims should not be regarded as limiting the rights involved.

Claims

1. A high-precision electronic chip processing and positioning device, characterized in that: It comprises a plate body (1), a rod body (4) and a rotating plate (8), wherein a control unit (2) is mounted on the top of the plate body (1), a rod body (4) is mounted on the top of the plate body (1), a hydraulic telescopic unit (5) is symmetrically mounted on one side of the rod body (4), and the hydraulic telescopic unit (5) is electrically connected to the control unit (2), a moving frame (6) is mounted on the output end of the hydraulic telescopic unit (5), a rotating support mechanism is arranged inside the moving frame (6), a laser distance measuring unit (9) is mounted on one side of the rod body (4), and the laser distance measuring unit (9) is electrically connected to the control unit (2); A plurality of plate bodies 2 (12) are mounted on the top of the plate body 1 (1), a hydraulic telescopic unit 2 (13) is mounted on the front of the plate body 2 (12), and the hydraulic telescopic unit 2 (13) is electrically connected to the control unit (2), a movable plate 2 (14) is mounted on the output end of the hydraulic telescopic unit 2 (13), an electric telescopic unit 2 (15) is mounted on the top of the movable plate 2 (14), and the electric telescopic unit 2 (15) is electrically connected to the control unit (2), and a pressure plate 1 (16) is mounted on the output end of the electric telescopic unit 2 (15).

2. A high-precision electronic chip processing and positioning device according to claim 1, characterized in that: A support plate (3) is symmetrically mounted on the bottom of the plate body 1 (1).

3. The high-precision electronic chip processing and positioning device according to claim 1, characterized in that: The rotating support mechanism comprises a rotating column (7) and a rotating plate (8); the rotating column (7) is movably mounted on the bottom inner wall of the moving frame (6); and the rotating plate (8) is mounted on the top of the rotating column (7).

4. The high-precision electronic chip processing and positioning device according to claim 1, characterized in that: Electric telescopic units (10) are symmetrically mounted on both sides of the movable frame (6), and the electric telescopic units (10) are electrically signal-connected to the control unit (2), and a movable plate (11) is mounted on the output end of the electric telescopic units (10).

5. A high-precision electronic chip processing and positioning device according to claim 4, characterized in that: A plurality of pressure sensing units (28) are installed on one side of the movable plate (11), and the pressure sensing unit (28) is electrically connected to the control unit (2). A limit plate (29) is installed at the input end of the pressure sensing unit (28), and a rubber pad (30) is installed on one side of the limit plate (29).

6. The high-precision electronic chip processing and positioning device according to claim 1, characterized in that: A rubber pad 1 (21) is installed at the bottom of the pressing plate 1 (16).

7. The high-precision electronic chip processing and positioning device according to claim 1, characterized in that: A right-angle plate (17) is installed on the top of the first pressing plate (16), a micro motor (18) is installed on the top of the right-angle plate (17), and the micro motor (18) is connected to the control unit (2) via an electrical signal, a rotating rod (19) is installed on the output end of the micro motor (18), a second pressing plate (20) is installed on one end of the rotating rod (19), and a second rubber pad (22) is installed on the bottom of the second pressing plate (20).

8. The high-precision electronic chip processing and positioning device according to claim 1, characterized in that: A frame body (23) is installed on the back of the plate body 1 (1), a collection box (24) is installed on the inner side of the frame body (23), an electric telescopic unit 3 (25) is installed on the inner wall of the bottom of the collection box (24), and the electric telescopic unit 3 (25) is connected to the control unit (2) via an electrical signal, a pressure sensing unit 2 (31) is installed on the output end of the electric telescopic unit 3 (25), and the pressure sensing unit 2 (31) is connected to the control unit (2) via an electrical signal, a lifting plate (26) is installed on the input end of the pressure sensing unit 2 (31), and a rubber pad 3 (27) is installed on the top of the lifting plate (26).

9. A method for using a high-precision electronic chip processing and positioning device according to any one of claims 1 to 8, characterized in that: The method of using the high-precision electronic chip processing and positioning device is as follows: S1, the processing positioning device is installed below the cutter cutting device, and then the wafer with multiple chips that has been produced is placed above the rotating plate (8), and then the limiting plates (29) on both sides are moved inward to squeeze and limit the wafer, and at the same time, the pressure sensing unit 1 (28) detects the pressure of the limiting plate (29) on the wafer to avoid excessive pressure of the limiting plate (29) on the wafer, and then the moving frame (6) is moved to the left by the distance of one chip, and the pressing plate 1 (16) and the pressing plate 2 (20) are moved downward to press the wafer; S2, the cutter of the cutter cutting device moves downward to cut the wafer, then the pressure plate 1 (16) and the pressure plate 2 (20) move upward, the moving frame (6) drives the wafer to continue to move to the left by the distance of one chip, and the cutter of the cutter cutting device continues to move downward to cut the wafer; S3, then the rotating plate (8) rotates to drive the wafer to rotate 90 degrees, so that the cutter cutting device continues to cut the chips on the wafer in a direction perpendicular to the original cutting direction of the wafer; S4. After the cutting is completed, the micro motor (18) drives the second pressing plate (20) to rotate parallel to the first pressing plate (16), and then the first pressing plate (16) and the second pressing plate (20) move downward, and then the first pressing plate (16) and the second pressing plate (20) move backward to push the chip on the rotating plate (8) into the collection box (24).

10. The method for using the high-precision electronic chip processing and positioning device according to claim 9, characterized in that: The step S4 also includes the following steps: S41. Before the chip enters the collection box (24), the lifting plate (26) first moves upward to reduce the descending distance of the chip, thereby reducing the damage caused by the chip collision. As the pressure detected by the second pressure sensing unit (31) increases, the lifting plate (26) moves downward accordingly.

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