LED lamp protection foam for FPC and application thereof

Abstract

The invention relates to the technical field of LED lamp protection foam for an FPC and provides LED lamp protection foam for the FPC and application of the LED lamp protection foam for the FPC, effective protection is carried out in a physical isolation mode, and the situation that a flash lamp makes contact with or rubs against or collides with a mold jig in the machining or transferring process, and consequently the appearance or function of the flash lamp is damaged is prevented. The method comprises the following specific steps: S100, making a whole makeup of a single FPC in advance, and processing the single FPC into a to-be-SMT state; s200, FQC appearance inspection is carried out; s300, performing SMT processing on the product, and mounting an LED flash lamp and other devices on a bonding pad on the surface of the FPC; s400, an automatic gummed paper laminating machine is used for laminating the protective foam according to any one of the claims 1-3; s500, adhesive paper is attached, and then the adhesive paper is pressed; s600, the appearance is punched; s700, function testing and packaging box placing are carried out; s800, quality inspection is conducted on the product; and S900, tearing off the protective foam on the FPC, and carrying out next whole machine assembly.

Description

Technical Field

[0001] The present invention relates to the technical field of LED lamp protection foam for FPC, and in particular to an LED lamp protection foam for FPC and application thereof. Background Art

[0002] LED lamp beads are a new type of semiconductor light-emitting device with the advantages of small size, high luminous efficiency and long life. They are widely used in electronic products such as mobile phones, tablets, computers, etc. Its structure can be divided into three main parts: chip, lead and package. The chip is the core part of the LED lamp bead and the source of light. The chip is usually made of semiconductor materials such as gallium nitride (GaN); the lead is the bridge connecting the chip and the external circuit. The lead is generally made of metal material, and the package is the shell that protects the chip, which is generally made of transparent materials such as plastic or glass. The function of the package is to protect the chip from the external environment and can change the light-emitting angle and color of the lamp bead.

[0003] In the prior art, common packaging forms include square, round and rectangular. Since the packaging is made of plastic or glass, its surface hardness is high and it is extremely brittle. It is very easy to be damaged by external forces during the subsequent processing, resulting in surface damage, fracture and other appearance and functional damage. In the actual production process, there is a certain proportion of defects, resulting in product scrapping, yield reduction, large loss and other problems. Therefore, a new process method is urgently needed to effectively protect LED flash lamps. Summary of the invention

[0004] One of the purposes of the present invention is to provide a method for assembling protective foam for LED lights for FPC, which effectively protects by physical isolation to prevent the flash lamp from contacting, rubbing or colliding with the mold during processing or transportation, causing damage to its appearance or function.

[0005] The technical solution of the present invention is as follows:

[0006] The invention discloses an LED lamp protective foam for FPC, comprising a foam main body, wherein the foam main body comprises a PET sheet layer, a common double-sided adhesive layer, a foam layer and strong and weak double-sided adhesive layers from top to bottom.

[0007] Furthermore, the thickness of the PET sheet is 0.1 mm;

[0008] The ordinary double-sided adhesive layer is made of transparent PET material and has a thickness of 0.05mm;

[0009] The thickness of the foam layer is 0.4 mm;

[0010] The strong and weak double-sided adhesive layer is made of transparent PET material and is divided into a strong adhesive surface and a weak adhesive surface, with a thickness of 0.05 mm. The strong adhesive surface is bonded to the foam layer, and the weak adhesive surface is used to bond the external FPC.

[0011] Furthermore, it includes a handle root connected to the foam body, the foam body is an annular structure, and the handle root is rounded.

[0012] Another object of the present invention is to provide a method for preparing an LED lamp, the specific steps of which are as follows:

[0013] S100: Prepare a single FPC sheet in advance and process it into the state ready for SMT;

[0014] S200: Conduct FQC appearance inspection;

[0015] S300: Perform SMT processing on the product and mount the LED flash and other components on the pads on the FPC surface;

[0016] S400: Use an automatic adhesive tape laminating machine to laminat...

[0017] S500: Laminating the adhesive tape and then pressing the adhesive tape;

[0018] S600: Punching profile;

[0019] S700: Functional testing and placing packaging boxes;

[0020] S800: Conduct quality inspection on products;

[0021] S900: Tear off the protective foam on the FPC and proceed to the next step of whole machine assembly.

[0022] Furthermore, step S400 is specifically as follows:

[0023] S410: Put the whole product after SMT into the fitting tooling;

[0024] S420: Put the tooling with the product on the platform of the automatic laminating tape machine and transfer it to the set station. At the same time, the rolled foam is fed to the optical fiber sensor according to the set feeder and stops at the receiving platform;

[0025] S430: The XYZR axis of the automatic adhesive tape machine drives the suction head to the top of the material to absorb the foam, and the suction is confirmed to be successful based on the vacuum negative pressure value of the suction head;

[0026] S440: The suction head moves past the CCD camera to take a picture, and then the material position is calculated by the visual algorithm.

[0027] The upper CCD camera takes pictures at the board mounting position and calculates the mounting position through the visual algorithm;

[0028] S450: The automatic tape laminating machine combines the visual calculation results of the upper and lower CCD cameras to automatically adjust the XYZR axis of the device to move the placement head to just above the laminating position;

[0029] S460: The suction head of the placement head controls the vacuum negative pressure suction nozzle to press down to the bonding position of the board according to the setting, completing one bonding;

[0030] S470: The automatic adhesive tape machine repeats steps S430 to S460 until all points are mounted;

[0031] S480: The track stop is released, the board flows out through the track, and the next CT starts.

[0032] Furthermore, the laminating tooling in step S410 includes a cover plate and a base, and the product is located between the cover plate and the base;

[0033] The base is provided with positioning posts corresponding to the positioning holes on the FPC. When the product is placed on the base, the positioning posts are put on and then the cover is replaced;

[0034] A hinge structure is arranged between the cover plate and the base.

[0035] Furthermore, the automatic adhesive tape laminating machine in step S420 includes a frame, an X-axis operating unit, a Y-axis operating unit, a double-track assembly line unit, a tray loading and unloading unit, and a bottom image acquisition unit disposed on the frame;

[0036] The placement components and suction heads used for sucking and placing auxiliary materials are installed on the X-axis operation unit;

[0037] The Y-axis operation unit includes a fixture assembly for clamping a fixture loaded with auxiliary materials to be mounted;

[0038] The dual-track assembly line unit includes an assembly line track assembly for conveying the bonding tooling;

[0039] The pallet loading and unloading unit includes a pallet lifting component that moves the auxiliary material pallet to the mounting component picking position, through the coordination of the frame, dual X-axis operation unit, Y-axis operation unit, dual-track assembly line unit, pallet loading and unloading unit and bottom image acquisition unit.

[0040] Furthermore, the adhesive tape lamination step in step S500 includes:

[0041] S510: Set the pressing parameters: temperature 100°C, pressure 25kg, time 5-15s;

[0042] S520: Use a dummy press to press the adhesive tape onto the FPC surface.

[0043] Furthermore, in step S600, the entire FPC is punched out using a metal mold to make the FPC into a single product, and the punching shape tolerance is controlled to be ≤0.1mm;

[0044] Among them, the foam and device positions need to be avoided and the foam must be prevented from falling off.

[0045] Furthermore, the testing method in step S700 includes:

[0046] S710: When editing the LED part program, the LED type device needs to add a reverse voltage test to identify the reverse-mounted device;

[0047] S720: The maximum color deviation of XYZ needs to be controlled to be 30%, and the program needs to control the LED lampshade damage problem.

[0048] The working principle and beneficial effects of the present invention are:

[0049] 1. The present invention effectively protects the flash lamp by design. The protective foam is immediately attached after SMT. The protective foam is made into a roll material, and is fitted around the LED lamp by an automatic adhesive tape laminating machine through a blowing process in conjunction with a feeder. An isolation protective layer is formed. Effective protection is provided by physical isolation to prevent the flash lamp from contacting, rubbing or colliding with the mold during processing or transportation, thereby causing damage to its appearance or function. The protective foam is not removed until the whole machine is assembled, thereby reducing damage to the lamp caused by post-process operations and improving the yield by 3-10%.

[0050] 2. The protective foam has a simple structure, low cost, high bonding efficiency, and can be produced in large quantities. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0052] Figure 1 It is a schematic diagram of the structure of the protective foam;

[0053] Figure 2 It is a cross-sectional view of the protective foam;

[0054] Figure 3 This is a schematic diagram of the protective foam roll;

[0055] Figure 4 This is a schematic diagram of the FPC finished product;

[0056] Figure 5 It is a side view of the protective foam fitting tooling;

[0057] Figure 6 This is a schematic diagram of the protective foam lamination tooling;

[0058] Figure 7 It is a plan view of an automatic adhesive tape laminating machine;

[0059] Figure 8 It is a three-dimensional schematic diagram of an automatic adhesive tape laminating machine;

[0060] Fig. 9 Schematic diagram of the protective foam nozzle.

[0061] In the figure: 1. Protective foam; 11. Foam body; 111. PET sheet layer; 112. Ordinary double-sided adhesive layer; 113. Foam layer; 114. Strong and weak double-sided adhesive layer; 12. Root of handle; 13. Bottom film; 14. Separator paper; 2. FPC; 3. LED light; 4. Laminating tooling; 41. Positioning column; 42. Positioning hole; 43. Hinge structure; 44. Base; 45. Cover plate; 51. Air pipe; 52. Mounting head; 53. Suction head; 54. Suction nozzle; 56. Upper CCD camera; 57. Lower CCD camera; 58. Feeding device; 59. Frame; 61. Suction hole; 62. Disassembly hole. DETAILED DESCRIPTION

[0062] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0063] Embodiment 1

[0064] like Figure 1-4 As shown, a protective foam 1 for an LED lamp 3 for an FPC 2 includes a protective foam 11;

[0065] The protective foam 11 includes a PET sheet layer 111 , a common double-sided adhesive layer 112 , a foam layer 113 and a strong and weak double-sided adhesive layer 114 from top to bottom.

[0066] Among them, the material of the PET sheet layer 111 is preferably Jinhengsheng JHS5W000, with a thickness of 0.1mm, which is used to carry the entire protective foam 1 and also serves as a handle for peeling off the foam. The entire protective foam 1 is torn off by the handle before assembling the whole machine;

[0067] The ordinary double-sided adhesive layer 112 is made of transparent PET material, preferably Liwang D5072BH, with a thickness of 0.05mm, and is used to bond the PET sheet layer 111 and the foam layer 113; the ordinary double-sided adhesive layer 112 is based on PET, and is coated on both sides with modified acrylic polymer adhesive; it has excellent moisture resistance and fog resistance, provides reliable adhesion to polar surfaces, and short-term load-bearing; it is suitable for fixing and pasting various electrical appliances and electronics, black in color, thickness: 50±5, peeling force ≥12N / inch. Temperature range -20~100℃.

[0068] The foam layer 113 is the main part of the entire protective material. The material is preferably Shengying PF-480-0.4TP, with a thickness of 0.4mm and moderate elasticity. Its thickness is 0.05mm higher than the device height. The overall height of the protective foam 1 should be at least 0.25mm higher than the LED lamp 3 device.

[0069] The preferred material of the strong and weak double-sided adhesive layer 114 is Liwang D2050BL, which is made of transparent PET material and is divided into a strong adhesive surface and a weak adhesive surface. The thickness is 0.05mm and is used to bond the foam layer 113 and the FPC2 layer. Specifically, the strong adhesive surface is bonded to the foam layer 113, and the weak adhesive surface is used to bond the external FPC2. The weak adhesive surface facilitates the smooth tearing of the protective foam 1 from the FPC2 during peeling. The strong and weak double-sided adhesive layer 114 in this embodiment is a strong and weak black double-sided tape, one side of which is used for medium-adhesive protection, and no residual adhesive is left after tearing; the other side has a strong adhesive force and is used for permanent pasting, and has a better pasting effect on foam and low surface energy materials. The color is black, the thickness is: 50±5, the peeling force of the strong adhesive surface is ≥12N / inch, and the peeling force of the medium adhesive surface is 1-3N / inch.

[0070] In this embodiment, the foam is required to be flat, and the appearance is required to be free of debris, scratches, etc., and also includes a handle root 12 connected to the protective foam 11. The handle root 12 is made of non-glue PET and is rounded. The radius of the rounded corner is greater than 0.5mm. The protective foam 11 is a ring structure, and one side is at least 0.3mm larger than the device to prevent the LED lamp 3 from being crushed due to misalignment.

[0071] The protective foam 1 can be made into a roll material and attached to the LED light 3 position of the FPC 2 by using an automatic adhesive tape laminating machine. The lamination tolerance is controlled to be ≤0.15mm, and no pressing is required after lamination.

[0072] In addition, the processing of protective foam 1 requires smoothness, and the appearance requires no debris, scratches, burrs, etc. The shape tolerance is controlled at ≤0.1mm. It needs to be bonded in a dust-free workshop, and gloves and anti-static wrist straps need to be worn during bonding. The packaging box needs to use an anti-static box.

[0073] Embodiment 2

[0074] like Figure 1-9 As shown, a method for preparing an LED lamp 3, the specific steps are as follows:

[0075] S100: Prepare the entire panel of a single FPC2 in advance and process it into a state ready for SMT;

[0076] The processing procedures include but are not limited to cutting, drilling, copper plating, circuit forming, laminating cover film, gold plating, high voltage testing, pressing steel sheet reinforcement, etc.

[0077] S200: Perform FQC appearance inspection: Use a manual visual operation to blacken the marks (SMT scanning identification points) corresponding to the defective products in the entire product with an oil pen to prevent defective products from being mistakenly SMTed;

[0078] S300: SMT processing is performed on the product, and the LED flash and other devices are mounted on the pads on the surface of FPC2. The steel mesh thickness is 0.08mm or 0.1mm, and the opening rate: opening area / pad area: 80%~110%, width-to-thickness ratio: >1.5, area ratio: >0.7, and the solder paste uses Senju M705-S101ZH-S4 (No. 4 powder) solder paste. Conventionally, 4# powder solder paste is used, and 5# powder solder paste or finer solder paste is used for dense spacing. Solder paste printing parameters: printing speed: 50mm / s±20mm / s, scraper pressure: 3Kg±1Kg, and film stripping speed: 0.3mm / s±0.2mm / s.

[0079] After SMT, products are transported in anti-static special turnover boxes to prevent the LED flash from contacting or colliding with other molds and fixtures. The thickness of the special turnover box is ≥0.6mm and the anti-static material is required to add positioning guide pillars. The avoidance height must be 3≥2mm higher than the LED light.

[0080] S400: Use an automatic adhesive tape laminating machine to laminat protective foam 1;

[0081] Specifically, step S400 is as follows:

[0082] S410: Put the whole product after SMT into the bonding tool 4;

[0083] S420: Put the tooling with the product on the platform of the automatic laminating tape machine and transfer it to the set station. At the same time, the rolled foam is fed to the optical fiber sensor according to the set feeder and stops at the receiving platform;

[0084] S430: The XYZR axis of the automatic adhesive tape machine drives the suction head 53 to the top of the material to suck the foam, and confirms that the suction is successful according to the vacuum negative pressure value of the suction head 53;

[0085] S440: The suction head 53 moves past the lower CCD camera 57 to take a picture, and then the material position is calculated by the visual algorithm.

[0086] The upper CCD camera 56 takes a picture at the board mounting position and calculates the mounting position through a visual algorithm;

[0087] S450: The automatic adhesive tape laminating machine combines the visual calculation results of the upper CCD camera 56 and the lower CCD camera 57 to automatically adjust the XYZR axis of the device to move the placement head 52 to just above the laminating position;

[0088] S460: The suction head 53 of the mounting head 52 controls the vacuum negative pressure suction nozzle 54 to press down to the bonding position of the board according to the setting, and completes one bonding;

[0089] S470: The automatic adhesive tape machine repeats steps S430 to S460 until all points are mounted;

[0090] The best lamination efficiency of this embodiment is: 0.6s / psc; both the X-axis and the Y-axis are suitable for linear motors, the X-axis speed can reach 2.5m / s, the acceleration is 2.5g, the Y-axis speed can reach 2m / s, the acceleration is 2g, and the resolution of the grating encoder is 1um. Because the speed is too fast> 0.6s / psc, the adhesive tape is easy to fall off or shift due to its own inertia and gravity during the movement of the suction nozzle after sucking the adhesive tape, resulting in the adhesive tape cannot be accurately attached to the specified position.

[0091] S480: The track stop is released, the board flows out through the track, and the next CT starts.

[0092] The bonding tool 4 in step S410 includes a cover plate 45 and a base 44, and the product is located between the cover plate 45 and the base 44; the base 44 plays a supporting role and is generally made of a pad with a thickness of about 6 mm.

[0093] The base 44 is provided with positioning posts 41 corresponding to the positioning holes 42 on the FPC2. When the product is placed on the base 44, the positioning posts 41 are put on, and then the cover 45 is replaced; the positioning posts 41 have a size of φ2.0mm, and at least 6 groups are provided, which are the same size and position as the positioning holes 42 of the FPC2.

[0094] A hinge structure 43 is provided between the cover plate 45 and the base 44. The cover plate 45 plays a fixing role and is made of SUS stainless steel with a thickness of 0.2 mm. It is opened or closed by the hinge structure 43 provided thereon. The cover plate 45 needs to avoid the position of the foam for easy identification and fitting. The cover plate 45 avoids 0.5 mm on one side of the foam.

[0095] The automatic adhesive tape laminating machine in step S420 includes a frame 59, an X-axis operating unit, a Y-axis operating unit, a double-track assembly line unit, a tray loading and unloading unit, and a bottom image acquisition unit disposed on the frame 59;

[0096] A placement component and a suction head 53 for sucking and placing auxiliary materials are installed on the X-axis operation unit;

[0097] The Y-axis operation unit includes a fixture assembly for clamping a fixture loaded with auxiliary material products to be mounted;

[0098] The double-track assembly line unit includes an assembly line track assembly for conveying the bonding tool 4;

[0099] The tray loading and unloading unit includes a tray lifting component that moves the auxiliary material tray to the mounting component picking position, and cooperates with the frame 59, the double X-axis operation unit, the Y-axis operation unit, the double-track assembly line unit, the tray loading and unloading unit and the bottom image acquisition unit. The auxiliary materials are fed in the form of trays, and the products are loaded in the bonding tool 4 for automated production. The fully automatic online bonding machine replaces manual operation, improves bonding efficiency, saves manpower and material resources, and the bonding accuracy is controlled to ≤0.15mm.

[0100] S500: Laminating and pressing the adhesive tape, using a dedicated pressing tool to enhance the bonding and retention between the adhesive tape and FPC2;

[0101] Specifically, the adhesive tape lamination step in step S500 includes:

[0102] S510: Set the pressing parameters: temperature 100°C, pressure 25kg, time 5-15s;

[0103] The temperature of 100℃ is the activation temperature of non-high temperature resistant adhesive tape, which can fully activate the activity of the adhesive tape, improve the initial adhesion and holding force. Applying a pressure of 25kg can make the adhesive tape and FPC fully contact. Too much pressure will cause FPC to be crushed, and too little pressure will require a longer pressing time and reduce the efficiency.

[0104] S520: Use a dummy press to press the adhesive tape onto the surface of FPC2.

[0105] S600: Punching profile;

[0106] The entire FPC2 is punched out through a metal mold to turn the FPC2 into a single product, and the punching shape tolerance is controlled to ≤0.1mm;

[0107] Among them, the foam and device positions need to be avoided, with a single side of at least ≥0.5mm, and the foam must be prevented from falling off.

[0108] When punching, it is forbidden to use an air gun to blow away dust from the blade. You can use a dust-free cloth to wipe it. When taking and placing products, you must use anti-static tweezers and wear an anti-static wrist guard to avoid electrostatic damage to the device.

[0109] S700: Functional test and packaging box placement, test the welding performance of the product through ICT fixture, and test the brightness and color performance of LED flash light;

[0110] Specific testing methods include:

[0111] S710: When editing the LED part program, the LED type device needs to add a reverse voltage test to identify the reverse-mounted device;

[0112] S720: The maximum deviation of the color quality XYZ that needs to be controlled is 30%. The program needs to control the damage of the 3 covers of the LED lamp (the degree of damage is too small to be effectively intercepted).

[0113] This step uses a special test LED light box 3 to collect light with optical fiber as an auxiliary tool. After the FPC2 light is on, the optical fiber is used to collect the brightness and color of the light, and then the test results are reflected in the test software. Functional test operators need to wear anti-static clothing, masks, gloves or finger caps, and work in a dust-free environment. Temperature / humidity requirements: room temperature 20-30℃, humidity 65%RH-75%RH. After the functional test, put the single PCS product into a special blister box. The blister box is made of anti-static material with a thickness of ≥0.6mm. The LED light 3 is placed upwards for easy post-process inspection.

[0114] Through environmental control, the workshop can maintain a constant temperature and humidity, which is conducive to the stability of the expansion and contraction of FPC products and the accuracy and consistency of the fitting of auxiliary materials. Too high or too low temperature is not conducive to the stability of expansion and contraction. Too high or too low humidity will cause insufficient activity of the adhesive tape, resulting in abnormal misalignment of the adhesive tape or non-separation.

[0115] S800: Quality inspection of products: 100% CCD inspection of fragile components of LED flash, using 40x stereoscope to inspect each box;

[0116] S900: Tear off the protective foam 1 on FPC2, inspect the product before assembly, confirm whether the foam has fallen off and whether the LED lamp 3 is damaged, peel off the entire foam with the PET tearing hand, and confirm whether there is any foam and glue residue during the process, and then proceed to the next step of whole machine assembly.

[0117] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A protective foam (1) for an LED lamp (3) for an FPC (2), comprising a foam body (11), characterized in that: The foam body (11) comprises, from top to bottom, a PET sheet layer (111), a common double-sided adhesive layer (112), a foam layer (113) and a strong and weak double-sided adhesive layer (114).

2. A protective foam (1) for an LED lamp (3) for an FPC (2) as claimed in claim 1, characterized in that: The thickness of the PET sheet layer (111) is 0.1 mm; The common double-sided adhesive layer (112) is made of transparent PET material and has a thickness of 0.05 mm; The foam layer (113) has a thickness of 0.4 mm; The strong and weak double-sided adhesive layer (114) is made of transparent PET material and is divided into a strong adhesive surface and a weak adhesive surface, with a thickness of 0.05 mm. The strong adhesive surface is bonded to the foam layer (113), and the weak adhesive surface is used to bond the external FPC (2).

3. A protective foam (1) for an LED lamp (3) for an FPC (2) as claimed in claim 1 or 2, characterized in that: It comprises a handle root (12) connected to a foam body (11), wherein the foam body (11) is an annular structure, and the handle root (12) is rounded.

4. A method for preparing an LED lamp (3), characterized in that: The specific steps are as follows: S100: pre-assemble a single FPC (2) into a whole sheet and process it into a state ready for SMT; S200: Conduct FQC appearance inspection; S300: Perform SMT processing on the product and mount the LED flash and other components on the surface pads of the FPC (2); S400: Using an automatic adhesive tape laminating machine to laminat the protective foam (1) as described in any one of claims 1 to 3; S500: Laminating the adhesive tape and then pressing the adhesive tape; S600: Punching profile; S700: Functional testing and placing packaging boxes; S800: Conduct quality inspection on products; S900: Tear off the protective foam (1) on the FPC (2) and proceed to the next step of whole device assembly.

5. A method for preparing an LED lamp (3), characterized in that: Step S400 is specifically as follows: S410: Put the whole product after SMT into the bonding tool (4); S420: Put the tooling with the product on the platform of the automatic laminating tape machine and transfer it to the set station. At the same time, the rolled foam is fed to the optical fiber sensor according to the set feeder and stops at the receiving platform; S430: The XYZR axis of the automatic adhesive tape machine drives the suction head (53) to the top of the material to suck the foam, and confirms that the suction is successful based on the vacuum negative pressure value of the suction head (53); S440: The suction head (53) moves past the lower CCD camera (57) to take a picture, and then the material position is calculated by a visual algorithm. The upper CCD camera (56) takes a picture at the board mounting position and calculates the mounting position through a visual algorithm; S450: The automatic adhesive tape laminating machine combines the visual calculation results of the upper CCD camera (56) and the lower CCD camera (57) to automatically adjust the XYZR axis of the device to move the placement head (52) to the position just above the laminating position; S460: The suction head (53) of the mounting head (52) controls the vacuum negative pressure suction nozzle (54) to press down to the bonding position of the board according to the setting, and completes one bonding; S470: The automatic adhesive tape machine repeats steps S430 to S460 until all points are mounted; S480: The track stop is released, the board flows out through the track, and the next CT starts.

6. A method for preparing an LED lamp (3) according to claim 5, characterized in that: The laminating tool (4) in step S410 comprises a cover plate (45) and a base (44), and the product is located between the cover plate (45) and the base (44); The base (44) is provided with a positioning column (41) for corresponding to the positioning hole (42) on the FPC (2). When the product is placed on the base (44), the positioning column (41) is put on, and then the cover plate (45) is replaced; A hinge structure (43) is provided between the cover plate (45) and the base (44).

7. A method for preparing an LED lamp (3) according to claim 6, characterized in that: The automatic adhesive tape laminating machine in step S420 comprises a frame (59), an X-axis operating unit, a Y-axis operating unit, a double-track assembly line unit, a tray loading and unloading unit, and a bottom image acquisition unit arranged on the frame (59); A placement component and a suction head (53) for sucking and placing auxiliary materials are installed on the X-axis operation unit; The Y-axis operation unit includes a fixture assembly for clamping a fixture loaded with auxiliary materials to be mounted; The double-track assembly line unit comprises an assembly line track assembly for conveying the bonding tooling (4); The tray loading and unloading unit comprises a tray lifting component for moving the auxiliary material tray to the mounting component picking position, through the cooperation of a frame (59), a double X-axis operation unit, a Y-axis operation unit, a double-track assembly line unit, a tray loading and unloading unit and a bottom image acquisition unit.

8. A method for preparing an LED lamp (3) according to claim 7, characterized in that: The adhesive tape lamination step in step S500 includes: S510: Set the pressing parameters: temperature 100°C, pressure 25kg, time 5-15s; S520: Use a dummy press to press the adhesive tape onto the surface of the FPC (2).

9. A method for preparing an LED lamp (3) according to claim 8, characterized in that: Step S600: punching the entire FPC (2) into a shape by a metal mold, so that the FPC (2) becomes a single product, and the punching shape tolerance is controlled to be ≤0.1mm; Among them, the foam and device positions need to be avoided and the foam must be prevented from falling off.

10. A method for preparing an LED lamp (3) according to claim 9, characterized in that: The testing method in step S700 includes: S710: When editing the LED part program, the LED type device needs to add a reverse voltage test to identify the reverse-mounted device; S720: The maximum deviation of the color quality XYZ needs to be controlled to be 30%, and the program needs to control the LED lamp (3) cover damage problem.

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