Silicon liquid temporary storage device

Abstract

The invention provides a silicon liquid temporary storage device which comprises a heat preservation shell, a storage cavity used for storing silicon liquid is formed in the heat preservation shell, and the heat preservation shell comprises an outer shell, an inner layer and a heat preservation layer located between the outer shell and the inner layer; and the heating piece is embedded in the heat preservation shell, is positioned on the inner side of the heat preservation layer and is used for heating the silicon liquid stored in the storage cavity. The silicon liquid in the storage cavity is subjected to heat preservation through the heat preservation shell, and the heat loss of the silicon liquid in the storage cavity is reduced; the silicon liquid is heated through the heating piece, and heat is supplemented for the silicon liquid in time, so that solidification caused by temperature reduction of the silicon liquid is prevented.

Description

Technical Field

[0001] The invention relates to the technical field of silicon liquid smelting, in particular to a silicon liquid buffer device. Background Art

[0002] The temperature of silicon liquid produced during the industrial silicon smelting process can reach 1600-1800℃. Usually, after the high-temperature silicon liquid flows out of the smelting furnace, it will be transported a certain distance before the next process. Therefore, a silicon liquid buffer device is needed to transfer and transport the silicon water.

[0003] At present, the silicon liquid buffer device used is divided into an outer shell and an inner lining, the outer shell is a steel shell, and the inner lining uses a refractory casting material. However, if only the casting refractory material is used on the inner wall of the outer shell, the insulation effect is relatively poor, especially during long-distance transportation, the temperature of the silicon liquid drops greatly, the heat loss is large, and the silicon liquid is easily solidified, resulting in low product manufacturing efficiency and high manufacturing cost.

[0004] In view of this, it is necessary to provide a silicon liquid buffer device to solve the above technical problems. Summary of the invention

[0005] In order to achieve the above-mentioned purpose, the present invention provides a silicon liquid caching device, which includes an insulating shell, in which a storage cavity for storing silicon liquid is provided, the insulating shell includes an outer shell, an inner layer and an insulating layer located between the outer shell and the inner layer; a heating element is embedded in the insulating shell and located on the inner side of the insulating layer, for heating the silicon liquid stored in the storage cavity.

[0006] As a further improvement of the present invention, the heat-insulating shell further comprises a protective layer located inside the inner layer, the protective layer is a silicon carbide and / or silicon nitride layer, and the thickness of the protective layer is 0.2 mm to 1 mm.

[0007] As a further improvement of the present invention, the heating element is embedded in the inner layer;

[0008] Or, the heating element is located between the inner layer and the insulation layer;

[0009] Alternatively, the heating element is located between the inner layer and the protective layer.

[0010] As a further improvement of the present invention, the heat-insulating shell includes a bottom wall, side walls and a top wall, and the heating element is embedded in the bottom wall and the side walls.

[0011] As a further improvement of the present invention, the heating elements are arranged at equal intervals along the bottom wall and the side walls.

[0012] As a further improvement of the present invention, the heating element is a heating rod, a heating wire or a heating plate.

[0013] As a further improvement of the present invention, the thermal insulation shell also includes a liquid inlet located at the top and a liquid discharge port located at the bottom thereof. The liquid discharge port is located on a side of the thermal insulation shell away from the liquid inlet, and a sliding water outlet mechanism is provided at the liquid discharge port.

[0014] As a further improvement of the present invention, a buffer block is provided on one side of the bottom of the storage cavity close to the liquid inlet.

[0015] As a further improvement of the present invention, a slag dam is further provided at the bottom of the storage chamber between the liquid inlet and the liquid outlet, the slag dam is located in the middle of the storage chamber, and the height of the slag dam is 1 / 3 to 1 / 2 of the height of the storage chamber.

[0016] As a further improvement of the present invention, a temperature sensor is provided at a middle position of the top of the storage cavity.

[0017] As a further improvement of the present invention, the inner layer is made of high-aluminum casting material, and the thickness of the inner layer is 0.1m to 0.3m;

[0018] The insulation layer is a combination of one or more of siliceous insulation bricks, nano insulation boards, and aluminum silicate fiber felts, and the thickness of the insulation layer is 0.1m to 0.5m;

[0019] The shell is made of low alloy steel, and the thickness of the shell is 0.02m-0.05m.

[0020] As a further improvement of the present invention, the heat-insulating shell is a truncated cone structure or a quadrangular cone structure.

[0021] Beneficial effects of the present invention: The present invention insulates the silicon liquid in the storage cavity by the insulation shell, thereby reducing the heat loss of the silicon liquid in the storage cavity; heats the silicon liquid by the heating element, replenishes heat for the silicon liquid in time, thereby preventing the silicon liquid from solidifying due to a decrease in temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0023] Figure 1 It is a schematic diagram of the overall structure of the heat preservation device of the present invention;

[0024] Figure 2 It is a schematic diagram of the local structure of the housing of the present invention; DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0026] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0027] In the description of the present invention, it is necessary to understand that the orientations or positional relationships indicated by the terms "upper", "lower", "top", "bottom", "inside", "outside", etc. are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0028] In the description of the present invention, unless otherwise specified and limited, it should be noted that the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a mechanical connection or an electrical connection, or it can be the internal connection between two components. It can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances.

[0029] like Figure 1 to Figure 2 As shown, the silicon liquid caching device provided by the present invention includes a heat-insulating shell 100, wherein the heat-insulating shell 100 has a storage cavity 200 for storing silicon liquid; a heating element 300 embedded in the heat-insulating shell 100, wherein the heating element 300 is used to heat the silicon liquid stored in the storage cavity 200.

[0030] The heat preservation shell 100 is used to keep the silicon liquid in the storage cavity 200 warm, thereby reducing the heat loss of the silicon liquid in the storage cavity 200. The heating element 300 heats the silicon liquid, replenishes heat for the silicon liquid in time, thereby preventing the silicon liquid from freezing due to a decrease in temperature.

[0031] Specifically, the heat-insulating shell 100 is a truncated cone structure or a quadrangular cone structure, which includes a bottom wall, a side wall and a top wall, and the bottom wall, the side wall and the top wall together form the storage cavity 200 .

[0032] The heat-insulating shell 100 includes an outer shell 101 , an inner layer 102 , and a heat-insulating layer 103 located between the outer shell 101 and the inner layer 102 . The heat-insulating layer 103 can effectively reduce the heat loss of the silicon liquid in the storage cavity 200 .

[0033] In this embodiment, the shell 101 is made of low alloy steel, so that the shell 101 has good corrosion resistance and wear resistance, and has high strength, which can well protect the inner structure of the heat-insulating shell 100. The thickness of the shell 101 is preferably 0.02m to 0.05m.

[0034] The inner layer 102 is made of high-aluminum casting material. As a refractory material, high-aluminum casting material can remain stable at high temperatures. At the same time, the inner layer 102 prepared with high-aluminum casting material has good thermal conductivity, and its thermal conductivity coefficient is between 0.8 and 1.5 W / (m·K). The heat generated by the heating element 300 can be well transferred to the silicon liquid in the storage cavity 200 through the inner layer 102, increasing the heat conduction area between the heating element 300 and the silicon liquid, thereby improving the temperature balance of the silicon liquid in the storage cavity 200. The thickness of the inner layer 102 is preferably 0.1m to 0.3m.

[0035] The insulation layer 103 is a combination of one or more of silicon insulation bricks, nano insulation boards, and aluminum silicate fiber felt. The insulation layer 103 can effectively reduce the heat loss of the silicon liquid in the storage cavity 200, and can maintain the temperature of the silicon liquid in the storage cavity 200 in conjunction with the heating element 300 to prevent the silicon liquid from solidifying. The thickness of the insulation layer 103 is preferably 0.1m to 0.5m.

[0036] Although the inner layer 102 made of high-alumina casting material can withstand high temperatures, the inner layer 102 is directly in contact with high-temperature silicon liquid, which will inevitably cause ablation of the inner layer 102, thereby introducing impurities into the silicon liquid and reducing the quality of the silicon liquid.

[0037] Based on this, the heat-insulating shell 100 further includes a protective layer 104 located inside the inner layer 102. The protective layer 104 is disposed on the inner wall of the inner layer 102, and the protective layer 104 is directly in contact with the silicon liquid in the storage cavity 200, thereby isolating the silicon liquid from the inner layer 102. That is, the heat-insulating shell 100 has a four-layer structure, which is the protective layer 104, the inner layer 102, the heat-insulating layer 103 and the outer shell 101 from the inside to the outside.

[0038] By arranging the protective layer 104 on the inner side of the inner layer 102, that is, the inner wall of the storage cavity 200 is the protective layer 104, the contact between the silicon liquid and the inner layer 102 is isolated, and the high-temperature silicon liquid is prevented from ablating the inner layer 102 to cause impurities to enter the silicon liquid, thereby reducing the pollution of the silicon liquid and improving the product quality of industrial silicon.

[0039] The protective layer 104 is a silicon carbide layer and / or a silicon nitride layer. The protective layer 104 can be made of either silicon carbide or silicon nitride alone, or a composite coating of silicon carbide and silicon nitride. The thickness of the protective layer 104 is preferably 0.2 mm to 1 mm.

[0040] The heat preservation shell 100 further includes a liquid inlet 105 at the top thereof and a liquid discharge port 106 at the bottom thereof. The liquid discharge port 106 is located at a side of the heat preservation shell 100 away from the liquid inlet 105, and a sliding water gate mechanism is provided at the liquid discharge port 106.

[0041] The high-temperature silicon liquid in the smelting furnace enters the storage chamber 200 from the liquid inlet 105, and the transfer and heat preservation of the high-temperature silicon liquid are achieved through the buffer device. When the high-temperature silicon liquid in the storage chamber 200 needs to be discharged, the drain port 106 is opened through the sliding water gate mechanism. At the same time, the silicon liquid in the storage chamber 200 can be discharged in time in an emergency by combining the sliding water gate mechanism with the drain port 106. The drain port 106 is arranged on the side of the insulation shell 100 away from the liquid inlet 105, so as to prevent the high-temperature silicon liquid entering from the liquid inlet 105 from eroding the drain port 106 and the sliding water gate mechanism.

[0042] The storage cavity 200 is formed in the heat-insulating shell 100 . The silicon liquid in the storage cavity 200 can effectively reduce heat loss and impurities under the protection of the heat-insulating shell 100 with a four-layer structure.

[0043] A buffer block 201 is provided on one side of the bottom of the storage cavity 200 near the liquid inlet 105. When the high-temperature silicon liquid enters the storage cavity 200 from the liquid inlet 105, the buffer block 201 can slow down the erosion of the bottom of the storage cavity 200 by the high-temperature silicon liquid, thereby extending the service life of the cache device. Preferably, the buffer block 201 is made of a refractory material sprayed with a silicon carbide layer and / or silicon nitride, and the thickness of the buffer block 201 is 0.01m to 0.03m.

[0044] The bottom of the storage chamber 200 is also provided with a slag dam 202 located between the buffer block 201 and the drain port 106. The slag dam 202 is located in the middle of the storage chamber 200, and the slag dam 202 is conducive to the deposition of silicon slag in the silicon liquid. The high-temperature silicon liquid entering the storage chamber 200 from the liquid inlet 105 is blocked and deposited by the slag dam 202, thereby preventing the silicon slag from being discharged from the drain port 106 along with the silicon liquid, thereby improving the product quality of industrial silicon. Preferably, the height of the slag dam 202 is 1 / 3 to 1 / 2 of the height of the storage chamber 200.

[0045] The storage cavity 200 is also provided with a temperature sensor 203 for detecting the temperature of the silicon liquid in the storage cavity 200. When the temperature sensor 203 detects that the temperature of the silicon liquid is lower than the freezing point of the silicon liquid, the heating element 300 is immediately turned on to heat the silicon liquid in the storage cavity 200.

[0046] The heating element 300 is used to heat the silicon liquid in the storage cavity 200 and replenish heat for the silicon liquid in time. When the temperature sensor 203 detects that the temperature of the silicon liquid in the storage cavity 200 drops, the heating element 300 is started to heat and transfer heat to the silicon liquid in the storage cavity 200, thereby increasing the temperature of the silicon liquid to prevent it from solidifying.

[0047] The heating element 300 is located inside the insulation layer 103. By arranging the heating element 300 inside the insulation layer 103, the heat generated by the heating element 300 can be fully transferred to the silicon liquid without being dissipated into the air, thereby improving the heat utilization rate and effectively preventing the temperature of the silicon liquid from decreasing.

[0048] The heating element 300 is embedded in the bottom wall and the side wall of the heat-insulating housing 100. Therefore, sufficient heat can be provided to the silicon liquid in the storage cavity 200. At the same time, the heating element 300 located at different positions transfers heat to the silicon liquid in the storage cavity 200, so that the temperature of the silicon liquid in the storage cavity 200 can be kept balanced, and the silicon liquid is prevented from solidifying due to the local temperature being too low.

[0049] Preferably, the heating elements 300 are arranged at equal intervals along the bottom wall and the side walls, so as to further improve the temperature balance of the silicon liquid in the storage cavity 200 and prevent the silicon liquid from solidifying due to excessively low local temperature.

[0050] In this embodiment, the temperature sensor 203 is located in the middle of the top of the storage cavity 200. Since the heating element 300 is embedded in the bottom wall and the side wall of the heat-insulating shell 100, and the silicon liquid located in the middle of the top of the storage cavity 200 is farthest from the heating element 300, the silicon liquid temperature at this position is the lowest. The silicon liquid at this position is detected by the temperature sensor 203, so that the silicon liquid at any position of the storage cavity 200 can be guaranteed not to solidify.

[0051] In a specific embodiment, the inner layer 102 made of high-aluminum casting material has good thermal conductivity, and the heating element 300 is embedded in the inner layer 102. The heat generated by the heating element 300 is evenly transferred to the inner layer 102, and then the heat is transferred to the silicon liquid in the storage cavity 200 through the inner layer 102. The heat conduction area between the heating element 300 and the silicon liquid is increased through the inner layer 102, and the temperature balance of the silicon liquid in the storage cavity 200 is improved.

[0052] Of course, in other embodiments, the heating element 300 may also be disposed between the inner layer 102 and the thermal insulation layer 103 , or the heating element 300 may be disposed between the inner layer 102 and the protective layer 104 .

[0053] The heating element 300 is a heating rod, a heating wire or a heating plate. By energizing the heating element 300, the heating element 300 generates heat to heat the silicon liquid in the storage cavity 200. Preferably, the heating element 300 is a silicon-molybdenum rod heater, which has a high operating temperature, a fast heating-up time and a long service life. When the temperature of the silicon liquid decreases, the silicon liquid can be well heated by energizing the silicon-molybdenum rod heater, thereby effectively preventing the silicon liquid from solidifying.

[0054] In summary, the present invention can effectively reduce the heat loss of the silicon liquid in the storage cavity 200 through the insulation layer 103 in the insulation shell 100, and cooperate with the heating element 300 to maintain the temperature of the silicon liquid in the storage cavity 200 to prevent the silicon liquid from solidifying.

[0055] It should be understood that although the present specification is described according to embodiments, not every embodiment contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0056] The series of detailed descriptions listed above are only specific descriptions of feasible embodiments of the present invention and are not intended to limit the scope of protection of the present invention. All equivalent embodiments or changes that do not deviate from the technical spirit of the present invention should be included in the scope of protection of the present invention.

Claims

1. A silicon liquid buffer device, characterized in that: include: A heat-insulating shell (100) is provided with a storage cavity (200) for storing silicon liquid, the heat-insulating shell (100) comprising an outer shell (101), an inner layer (102), and a heat-insulating layer (103) located between the outer shell (101) and the inner layer (102); A heating element (300) is embedded in the heat-insulating shell (100) and located on the inner side of the heat-insulating layer (103), and is used to heat the silicon liquid stored in the storage cavity (200).

2. The silicon liquid buffer device according to claim 1, characterized in that: The heat-insulating shell (100) further comprises a protective layer (104) located on the inner side of the inner layer (102); the protective layer (104) is a silicon carbide layer and / or a silicon nitride layer; and the thickness of the protective layer (104) is 0.2 mm to 1 mm.

3. The silicon liquid buffer device according to claim 2, characterized in that: The heating element (300) is embedded in the inner layer (102); Or, the heating element (300) is located between the inner layer (102) and the thermal insulation layer (103); Alternatively, the heating element (300) is located between the inner layer (102) and the protective layer (104).

4. The silicon liquid buffer device according to any one of claims 1 to 3, characterized in that: The heat-insulating shell (100) comprises a bottom wall, a side wall and a top wall, and the heating element (300) is embedded in the bottom wall and the side wall.

5. The silicon liquid buffer device according to claim 4, characterized in that: The heating elements (300) are arranged at equal intervals along the bottom wall and the side wall.

6. The silicon liquid buffer device according to claim 1, characterized in that: The heating element (300) is a heating rod, a heating wire or a heating plate.

7. The silicon liquid buffer device according to claim 1, characterized in that: The heat-insulating shell (100) further comprises a liquid inlet (105) located at the top thereof and a liquid discharge port (106) located at the bottom thereof; the liquid discharge port (106) is located on a side of the heat-insulating shell (100) away from the liquid inlet (105); and a sliding water gate mechanism is provided at the liquid discharge port (105).

8. The silicon liquid buffer device according to claim 7, characterized in that: A buffer block (201) is provided on one side of the bottom of the storage cavity (200) close to the liquid inlet (105).

9. The silicon liquid buffer device according to claim 7 or 8, characterized in that: The bottom of the storage chamber (200) is also provided with a slag dam (202) located between the liquid inlet (105) and the liquid outlet (106); the slag dam (202) is located in the middle of the storage chamber (200); and the height of the slag dam (202) is 1 / 3 to 1 / 2 of the height of the storage chamber (200).

10. The silicon liquid buffer device according to claim 1, characterized in that: A temperature sensor (203) is provided at the middle position of the top of the storage cavity (200).

11. The silicon liquid buffer device according to claim 1, characterized in that: The inner layer (102) is made of high-aluminum casting material, and the thickness of the inner layer (102) is 0.1m to 0.3m; The thermal insulation layer (103) is a combination of one or more of siliceous thermal insulation bricks, nano thermal insulation boards, and aluminum silicate fiber felts, and the thickness of the thermal insulation layer (103) is 0.1m to 0.5m; The shell (101) is made of low alloy steel, and the thickness of the shell (101) is 0.02m-0.05m.

12. The silicon liquid buffer device according to claim 1, characterized in that: The heat-insulating shell (100) is a truncated cone structure or a quadrangular cone structure.

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