Device and method for measuring heat conductivity coefficient of material

By providing a thermal conductivity measurement device and method including a fixing mechanism, a heating mechanism and a temperature sensing mechanism, the problem of complex and costly measurement methods in the prior art is solved, and efficient and simple thermal conductivity testing is realized, and suitable for materials of different specifications.

CN119619223APending Publication Date: 2025-03-14GUANGZHOU CABLE FACTORY CO LTD
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Patent Information

Application Number
CN202411702941.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-26
Publication Date
2025-03-14

AI Technical Summary

Technical Problem

The existing thermal conductivity measurement methods require special equipment, which are complex in operation, high in cost and poor in adaptability. In the existing technology, the thermal conductivity measurement methods are mainly divided into steady-state method and transient method, which cannot effectively improve measurement efficiency and reduce costs.

Method used

Provided is a material thermal conductivity measurement device and method, including a fixing mechanism, a heating mechanism and a temperature sensing mechanism. By building a test environment model and adjusting the working current or voltage of the measuring device, heating and temperature collection of the material sample to be measured, and determining its thermal conductivity and thermal conductivity in real time.

Benefits of technology

It simplifies testing equipment and methods, improves the efficiency of thermal conductivity testing, and is suitable for materials of different specifications. It has simple operation and strong applicability, which significantly reduces R&D costs and is easy to promote and implement.

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Abstract

The invention provides a material heat conductivity coefficient measuring device and a heat conductivity coefficient measuring method, and the method comprises the following steps: determining parameters of a to-be-measured material sample, building a test environment model, arranging the to-be-measured material sample on the heat conductivity coefficient measuring device in a matching manner, and testing under the test environment model. According to the temperature change and state change parameters of the to-be-measured material sample, the heat conduction performance and the heat conduction coefficient of the to-be-measured material sample are determined, the heat conduction coefficient measuring device comprises a fixing mechanism, a heating mechanism and a temperature sensing mechanism, and the strip-shaped to-be-measured material sample is placed on the fixing mechanism; one end of the sample is heated by the heating mechanism, the surface temperature change parameter of the sample is sensed by the temperature sensing mechanism, the heat-conducting property of the sample is judged, the test efficiency is effectively improved by simplifying the test equipment and the test method, and the device is applicable to materials of different specifications and has the advantages of simplicity in operation, high applicability, remarkable reduction of research and development cost and the like. And popularization and implementation are facilitated.
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Description

Technical Field

[0001] The present application belongs to the technical field of material property testing, and specifically relates to a material thermal conductivity measurement device and a thermal conductivity measurement method. Background Art

[0002] In the prior art, thermal conductivity is an important indicator for judging the thermal conductivity of materials. It describes the ability of a material to transfer heat under a unit temperature gradient, that is, the amount of heat passing through a unit area and temperature difference per unit time, and its unit is W / (m·K).

[0003] In the prior art, the thermal conductivity measurement methods are mainly divided into two categories: steady-state method and transient method. The steady-state method calculates the thermal conductivity by measuring the heat flux density, temperature difference on both sides and thickness of the sample under stable heat transfer conditions. It is suitable for low thermal conductivity materials. The transient method calculates the thermal conductivity by measuring the temperature change and time relationship of the sample under non-stable heat transfer conditions. It is suitable for high thermal conductivity materials. The commonly used thermal conductivity measurement methods are mainly the following: heat flow meter method, protective hot plate method, circular tube method, hot wire method, flash method and laser flash method. Although the existing thermal conductivity measurement technology is relatively mature, there is still room for improvement, especially in improving measurement efficiency, reducing measurement costs and expanding measurement range. The existing thermal conductivity measurement method usually requires the use of special equipment. On the one hand, the operation method is relatively complicated and the functions are relatively redundant. On the other hand, it significantly increases the initial investment cost of the enterprise. Therefore, it is urgent to make improvements. Summary of the invention

[0004] In order to solve the technical problems in the prior art that the thermal conductivity measurement methods are mainly divided into two categories, namely, the steady-state method and the transient method, and both methods require the use of special equipment to be carried out in the actual material measurement process, and the test samples are limited by the special equipment, the adaptability is poor, the measurement efficiency is low, the test cost investment is high, the operation is complex, the localization degree of imported equipment is low, the operation method is complex, the functions are redundant, and the actual use experience is poor, a material thermal conductivity measurement device is proposed;

[0005] In order to solve the technical problem raised by the present application, the present application provides a method for measuring thermal conductivity of a material.

[0006] The present application adopts the following scheme, a method for measuring thermal conductivity of a material, comprising the following steps:

[0007] Determine the parameters of the material sample to be tested, build a test environment model according to the parameters of the material sample to be tested, match the thermal conductivity measurement device in the test environment model, and match the material sample to be tested on the thermal conductivity measurement device;

[0008] Starting the thermal conductivity measuring device, adjusting the working current or working voltage of the thermal conductivity measuring device according to the parameters of the material sample to be tested, confirming the target heating end of the material sample to be tested, and heating the target heating end through the thermal conductivity measuring device;

[0009] The temperature change distribution and state change parameters of the material sample to be tested are collected in real time, and the thermal conductivity and thermal conductivity coefficient of the material sample to be tested are determined based on the temperature change distribution and state change parameters of the material sample to be tested.

[0010] In one embodiment, the parameters of the material sample to be tested include: the length of the material sample to be tested, the width of the material sample to be tested, the thickness of the material sample to be tested and the thermal expansion coefficient of the material sample to be tested. According to the thermal expansion coefficient of the material sample to be tested, the length range, width range and thickness range of the material sample to be tested are determined respectively.

[0011] In one embodiment, the parameters of the material sample to be tested also include: any one or more of the melting point of the material sample to be tested, the ignition point of the material sample to be tested, and the specific heat capacity of the material sample to be tested.

[0012] In one embodiment, the test environment model includes a closed test area and multiple environmental state parameters within the closed test area, wherein the environmental state parameters include the temperature within the closed test area, the relative humidity within the closed test area, and the vacuum degree within the closed test area.

[0013] In one embodiment, the volume interval of the closed test area is 1m 3 -8m 3 The temperature range in the closed test area is 25℃-28℃, the relative humidity range in the closed test area is 31%-35%, and the vacuum range in the closed test area is 0.01Mpa-0.05Mpa.

[0014] In order to solve the technical problem raised by the present application, the present application also provides a material thermal conductivity measuring device, including a fixing mechanism, a heating mechanism arranged on one end of the fixing mechanism, and a temperature sensing mechanism arranged on a side away from the heating mechanism, the fixing mechanism is used to fix a strip-shaped material sample to be tested, the heating mechanism is used to heat one end of the strip-shaped material sample to be tested, and the temperature sensing mechanism is arranged on the strip-shaped material sample to be tested, and is used to sense the temperature change parameters of the strip-shaped material sample to be tested.

[0015] In one embodiment, the fixing mechanism includes a frame and a fixing roller disposed on one end of the frame, the heating mechanism is matched and disposed on the other end of the frame, the strip sample of the material to be tested is mounted between the fixing roller and the heating mechanism, and the temperature sensing mechanism is disposed on the strip sample of the material to be tested.

[0016] In one embodiment, the heating mechanism includes a heating component body and a wiring port provided on one end of the heating component body, the heating component body is in the shape of a rod, and the cross-sectional radius of the heating component body is equal to the cross-sectional radius of the fixed roller.

[0017] In one embodiment, the temperature sensing mechanism includes a temperature sensor disposed on the upper surface of each strip-shaped material sample to be tested, and a plurality of the temperature sensors are spaced apart along the length direction of the strip-shaped material sample to be tested to sense the temperatures corresponding to different length intervals on the upper surface of the strip-shaped material sample to be tested.

[0018] Compared with the prior art, this application has the following beneficial effects:

[0019] The present application provides a material thermal conductivity measuring device and a thermal conductivity measuring method, which include the following steps: determining the parameters of a material sample to be tested, building a test environment model according to the parameters of the material sample to be tested, matching the thermal conductivity measuring device in the test environment model, and then matching the material sample to be tested on the thermal conductivity measuring device for testing, and determining the thermal conductivity and thermal conductivity of the material sample to be tested according to the temperature change and state change parameters of the material sample to be tested, wherein the thermal conductivity measuring device includes a fixing mechanism, a heating mechanism and a temperature sensing mechanism, and by placing a strip material sample to be tested on the fixing mechanism, and heating one end of the sample by the heating mechanism, and then sensing the temperature change parameters of the sample surface by the temperature sensing mechanism, and then judging the thermal conductivity of the sample, by simplifying the test equipment and the test method, the test efficiency of the thermal conductivity of the sample is effectively improved, and it can be applied to materials of different specifications, and has the advantages of simple operation, strong applicability, significantly reduced research and development costs, and easy promotion and implementation. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a top view of a material thermal conductivity measuring device of the present application;

[0021] Figure 2 It is a side view of a material thermal conductivity measuring device of the present application;

[0022] Figure 3 It is a flow chart of a material thermal conductivity measurement method of the present application. DETAILED DESCRIPTION

[0023] Combination Figure 1-3The content shown further illustrates the technical solution provided by this application, see Figure 3 , a method for measuring thermal conductivity of a material, comprising the following steps:

[0024] Determine the parameters of the material sample to be tested, build a test environment model according to the parameters of the material sample to be tested, match the thermal conductivity measurement device in the test environment model, and match the material sample to be tested on the thermal conductivity measurement device;

[0025] Starting the thermal conductivity measuring device, adjusting the working current or working voltage of the thermal conductivity measuring device according to the parameters of the material sample to be tested, confirming the target heating end of the material sample to be tested, and heating the target heating end through the thermal conductivity measuring device;

[0026] The temperature change distribution and state change parameters of the material sample to be tested are collected in real time, and the thermal conductivity and thermal conductivity coefficient of the material sample to be tested are determined based on the temperature change distribution and state change parameters of the material sample to be tested.

[0027] The present application provides a material thermal conductivity measuring device and a thermal conductivity measuring method, which include the following steps: determining the parameters of a material sample to be tested, building a test environment model according to the parameters of the material sample to be tested, matching the thermal conductivity measuring device in the test environment model, and then matching the material sample to be tested on the thermal conductivity measuring device for testing, and determining the thermal conductivity and thermal conductivity of the material sample to be tested according to the temperature change and state change parameters of the material sample to be tested, wherein the thermal conductivity measuring device includes a fixing mechanism, a heating mechanism and a temperature sensing mechanism, and by placing a strip material sample to be tested on the fixing mechanism, and heating one end of the sample by the heating mechanism, and then sensing the temperature change parameters of the sample surface by the temperature sensing mechanism, and then judging the thermal conductivity of the sample, by simplifying the test equipment and the test method, the test efficiency of the thermal conductivity of the sample is effectively improved, and it can be applied to materials of different specifications, and has the advantages of simple operation, strong applicability, significantly reduced research and development costs, and easy promotion and implementation.

[0028] During the implementation of this embodiment, the parameters of the material sample to be tested include: the length of the material sample to be tested, the width of the material sample to be tested, the thickness of the material sample to be tested and the thermal expansion coefficient of the material sample to be tested. According to the thermal expansion coefficient of the material sample to be tested, the length range, width range and thickness range of the material sample to be tested are determined respectively.

[0029] During the implementation of this embodiment, the parameters of the material sample to be tested also include: any one or more of the melting point of the material sample to be tested, the ignition point of the material sample to be tested, and the specific heat capacity of the material sample to be tested.

[0030] During the implementation of this embodiment, the test environment model includes a closed test area and multiple environmental state parameters within the closed test area, wherein the environmental state parameters include the temperature within the closed test area, the relative humidity within the closed test area, and the vacuum degree within the closed test area.

[0031] During the implementation of this embodiment, the volume interval of the closed test area is 1m 3 -8m 3 The temperature range in the closed test area is 25℃-28℃, the relative humidity range in the closed test area is 31%-35%, and the vacuum range in the closed test area is 0.01Mpa-0.05Mpa.

[0032] In actual implementation, the average volume of the sealed test area is 2.5m 3 , the average temperature in the sealed test area is 27.3℃, and the average vacuum degree in the sealed test area is 0.03Mpa;

[0033] By measuring the thermal conductivity of materials in a negative pressure closed space, the heat loss of the material sample during the heating process can be measured, which can significantly improve the experimental accuracy while controlling the cost.

[0034] In order to solve the technical problem raised by the present application, a material thermal conductivity measuring device is provided, comprising a fixing mechanism 1, a heating mechanism 2 arranged on one end of the fixing mechanism 1, and a temperature sensing mechanism 3 arranged on a side away from the heating mechanism 2, wherein the fixing mechanism 1 is used to fix a strip material sample to be tested, the heating mechanism 2 is used to heat one end of the strip material sample to be tested, and the temperature sensing mechanism 3 is arranged on the strip material sample to be tested, and is used to sense the temperature change parameters of the strip material sample to be tested.

[0035] During the implementation of this embodiment, the fixing mechanism 1 includes a frame and a fixing roller 10 arranged on one end of the frame, the heating mechanism 2 is matched and arranged on the other end of the frame, the strip-shaped sample of the material to be tested is arranged between the fixing roller 10 and the heating mechanism 2, and the temperature sensing mechanism 3 is arranged on the strip-shaped sample of the material to be tested.

[0036] During the implementation of this embodiment, the heating mechanism 2 includes a heating component body 20 and a wiring port 21 arranged on one end of the heating component body 20. The heating component body 20 is in the shape of a rod, and the cross-sectional radius of the heating component body 20 is equal to the cross-sectional radius of the fixed roller 10.

[0037] like Figure 2As shown, the two ends of the material sample to be tested are semicircular rings, and the fixed roller and the heating component body can be matched and extended into the installation groove surrounded by the semicircular rings, so that the material sample to be tested is matched and fixed on the fixed roller and is in a straightened and non-deformed state.

[0038] During the implementation of this embodiment, the temperature sensing mechanism 3 includes a temperature sensor 30 arranged on the upper surface of each strip-shaped material sample to be tested. A plurality of temperature sensors 30 are arranged at intervals along the length direction of the strip-shaped material sample to be tested to sense the temperatures corresponding to different length intervals on the upper surface of the strip-shaped material sample to be tested.

[0039] like Figure 2 As shown, during the implementation process, the cross-sectional area A of the sample to be tested can be obtained according to the length, width and thickness of the sample to be tested, the temperature difference sensed by the two temperature sensors is T1, the distance between the two temperature sensors is L, and the calculation formula of the convenient thermal conductivity X of the sample to be tested is as follows: X=T1 / A×L;

[0040] In the actual implementation process, in the use scenario of rapid measurement, the material samples to be tested with the same length, width and thickness specifications are selected, and temperature sensors with a spacing of L are set on each material sample to be tested, and the starting temperature of the temperature sensor is recorded. At the same time, one end of the material sample to be tested is heated, and the thermal conductivity of the material sample to be tested is judged according to the order of temperature changes sensed by the temperature sensor. The thermal conductivity of the material sample to be tested that has a temperature change first is large, and the thermal conductivity of the material sample to be tested that has a temperature change later is small.

[0041] In the actual implementation process, in another scenario of rapid measurement, a standard strip sample is selected, and its convenient thermal conductivity is defined as 1. A sample of the material to be tested with the same specifications as the standard strip sample is taken, and temperature sensors with a spacing of L are set on both test samples, and the starting temperature of the temperature sensor is recorded. At the same time, one end of the sample of the material to be tested is heated, and the time intervals of the temperature change of the temperature sensor are recorded, and they are defined as t1 and t2 respectively. The convenient thermal conductivity of the sample of the material to be tested is t2 / t1;

[0042] In the actual implementation process, it is further simplified by taking the center line of the heating component body as the starting point and the position of the temperature sensor as the end point. There is no need to record the starting temperature of the temperature sensor. The heating component body is started, and one end of the standard sample and the sample of the material to be tested are heated at the same time. The time intervals for the temperature changes of the temperature sensor are recorded respectively and defined as t1 and t2 respectively. The convenient thermal conductivity of the sample of the material to be tested is t2 / t1.

[0043] The present application provides a material thermal conductivity measuring device and a thermal conductivity measuring method, which include the following steps: determining the parameters of a material sample to be tested, building a test environment model according to the parameters of the material sample to be tested, matching the thermal conductivity measuring device in the test environment model, and then matching the material sample to be tested on the thermal conductivity measuring device for testing, and determining the thermal conductivity and thermal conductivity of the material sample to be tested according to the temperature change and state change parameters of the material sample to be tested, wherein the thermal conductivity measuring device includes a fixing mechanism, a heating mechanism and a temperature sensing mechanism, and by placing a strip material sample to be tested on the fixing mechanism, and heating one end of the sample by the heating mechanism, and then sensing the temperature change parameters of the sample surface by the temperature sensing mechanism, and then judging the thermal conductivity of the sample, by simplifying the test equipment and the test method, the test efficiency of the thermal conductivity of the sample is effectively improved, and it can be applied to materials of different specifications, and has the advantages of simple operation, strong applicability, significantly reduced research and development costs, and easy promotion and implementation.

[0044] The above are only embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for measuring thermal conductivity of a material, characterized in that: The following steps are involved: Determine the parameters of the material sample to be tested, build a test environment model according to the parameters of the material sample to be tested, match the thermal conductivity measurement device in the test environment model, and match the material sample to be tested on the thermal conductivity measurement device; Starting the thermal conductivity measuring device, adjusting the working current or working voltage of the thermal conductivity measuring device according to the parameters of the material sample to be tested, confirming the target heating end of the material sample to be tested, and heating the target heating end through the thermal conductivity measuring device; The temperature change distribution and state change parameters of the material sample to be tested are collected in real time, and the thermal conductivity and thermal conductivity coefficient of the material sample to be tested are determined based on the temperature change distribution and state change parameters of the material sample to be tested.

2. A method for measuring thermal conductivity of a material according to claim 1, characterized in that: The parameters of the material sample to be tested include: the length of the material sample to be tested, the width of the material sample to be tested, the thickness of the material sample to be tested and the thermal expansion coefficient of the material sample to be tested. According to the thermal expansion coefficient of the material sample to be tested, the length range, width range and thickness range of the material sample to be tested are determined respectively.

3. A method for measuring thermal conductivity of a material according to claim 1, characterized in that: The parameters of the material sample to be tested also include: any one or more of the melting point of the material sample to be tested, the ignition point of the material sample to be tested, and the specific heat capacity of the material sample to be tested.

4. A method for measuring thermal conductivity of a material according to claim 1, characterized in that: The test environment model includes a closed test area and a plurality of environmental state parameters in the closed test area, wherein the environmental state parameters include the temperature in the closed test area, the relative humidity in the closed test area and the vacuum degree in the closed test area.

5. A method for measuring thermal conductivity of a material according to claim 4, characterized in that: The volume interval of the closed test area is 1m 3 -8m 3 The temperature range in the closed test area is 25℃-28℃, the relative humidity range in the closed test area is 31%-35%, and the vacuum range in the closed test area is 0.01Mpa-0.05Mpa.

6. A material thermal conductivity measuring device, characterized in that: A method for measuring thermal conductivity of a material as claimed in any one of claims 1 to 5, comprising a fixing mechanism (1), a heating mechanism (2) arranged at one end of the fixing mechanism (1), and a temperature sensing mechanism (3) arranged on a side away from the heating mechanism (2), wherein the fixing mechanism (1) is used to fix a strip-shaped material sample, the heating mechanism (2) is used to heat one end of the strip-shaped material sample to be tested, and the temperature sensing mechanism (3) is arranged on the strip-shaped material sample to be tested and is used to sense temperature change parameters of the strip-shaped material sample to be tested.

7. A material thermal conductivity measuring device according to claim 6, characterized in that: The fixing mechanism (1) comprises a frame and a fixing roller (10) arranged on one end of the frame, the heating mechanism (2) is matched and arranged on the other end of the frame, a strip-shaped sample of the material to be tested is arranged between the fixing roller (10) and the heating mechanism (2), and the temperature sensing mechanism (3) is arranged on the strip-shaped sample of the material to be tested.

8. A material thermal conductivity measuring device according to claim 7, characterized in that: The heating mechanism (2) comprises a heating component body (20) and a connection port (21) arranged on one end of the heating component body (20); the heating component body (20) is in the shape of a rod, and the cross-sectional radius of the heating component body (20) is equal to the cross-sectional radius of the fixed roller (10).

9. A material thermal conductivity measuring device according to claim 6, characterized in that: The temperature sensing mechanism (3) comprises a temperature sensor (30) arranged on the upper surface of each strip-shaped material sample to be tested, wherein a plurality of the temperature sensors (30) are arranged at intervals along the length direction of the strip-shaped material sample to be tested, so as to sense the temperatures corresponding to different length intervals on the upper surface of the strip-shaped material sample to be tested.

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