Display device and method for manufacturing display device

Abstract

The embodiment of the invention provides a display device and a manufacturing method of the display device. The display device includes a display panel defined with a folding area and a non-folding area, a first plate disposed on one side of the display panel and including a first area corresponding to the folding area of the display panel, and a second area corresponding to the non-folding area of the display panel, and a cover layer disposed between the first plate and the display panel and in direct contact with at least a portion of the first plate, the first region of the first plate includes a plurality of slits having a length in a first direction parallel to a folding axis of the folding region and at least a portion of which is covered by the cover layer, and a width of the plurality of slits in a second direction perpendicular to the first direction is 100 [mu] m or less.

Description

Technical Field

[0001] Embodiments of the present invention relate to a display device and a method for manufacturing the display device, and more particularly, to a display device having improved impact resistance and a method for manufacturing the display device. Background Art

[0002] Recently, display devices have become diversified in their uses. For the various uses of such display devices, the display devices should be flexible so as to be able to be bent or folded. Therefore, research and development of flexible display devices are being conducted, and flexible display devices are required to be lightweight and thin. Summary of the invention

[0003] However, such a conventional display device has a problem in that the strength of the display device decreases as the display device becomes lighter and thinner.

[0004] The present invention aims to solve various problems including the above-mentioned problems, and its object is to provide a display device and a method for manufacturing a display device having improved impact resistance. However, such technical problems are exemplary, and the scope of the present invention is not limited thereto.

[0005] According to one aspect of the present invention, a display device is provided, comprising a display panel defining a folding area and a non-folding area, a first plate arranged on one surface of the display panel and comprising a first area corresponding to the folding area of ​​the display panel and a second area corresponding to the non-folding area of ​​the display panel, and a covering layer arranged between the first plate and the display panel and in direct contact with at least a portion of the first plate, wherein the first area of ​​the first plate comprises a plurality of slits having a length in a first direction parallel to a folding axis of the folding area and at least a portion of which is covered by the covering layer, and a width of the plurality of slits in a second direction perpendicular to the first direction is less than 100 um.

[0006] In an embodiment, the display device may further include an upper adhesive layer disposed between the first plate and the display panel to be in direct contact with the first plate.

[0007] In one embodiment, the upper adhesive layer may include an upper opening corresponding to the first region, and a thickness of the cover layer may be smaller than a thickness of the upper adhesive layer.

[0008] In one embodiment, a depth of the plurality of slits may be smaller than a thickness of the second region of the first plate.

[0009] In one embodiment, the plurality of slits may be arranged in parallel and spaced apart along the second direction.

[0010] In an embodiment, the display device may further include a second plate disposed at a lower portion of the first plate, and a lower adhesive layer disposed between the first plate and the second plate and including a lower opening corresponding to the first region.

[0011] In an embodiment, the cover layer may include a plurality of cover patterns extending in the second direction perpendicular to the first direction and arranged at intervals along the first direction.

[0012] In one embodiment, the cover layer may include a light shielding material.

[0013] In one embodiment, the cover layer may overlap the first region and the second region in a plane.

[0014] In one embodiment, the covering layer may include at least one of polyethylene terephthalate (PET), polyethylene (PE), polypropylene (PP), polyvinyl chloride (PVC) and polyvinylidene chloride (PVDC).

[0015] According to another aspect of the present invention, there is provided a method for manufacturing a display device, the method comprising: forming a display panel having a folding area and a non-folding area defined therein; and

[0016] A step of forming a first plate arranged on one side of the display panel and including a first area corresponding to the folding area of ​​the display panel and a second area corresponding to the non-folding area of ​​the display panel; the step of forming the first plate includes: a step of forming a plurality of slits having a first preliminary width in the first area; a step of forming a covering layer on the plurality of slits; and a step of applying heat to the covering layer to shrink the plurality of slits into a first width smaller than the first preliminary width.

[0017] In one embodiment, the heat applied to the cover layer may be greater than 60° C. and less than 170° C.

[0018] In one embodiment, a difference between the first preliminary width and the first width may be greater than 20 um and less than 200 um.

[0019] In one embodiment, the first width may be less than 50 um.

[0020] In an embodiment, the plurality of slits may have a length in a first direction parallel to a folding axis of the folding region, and the first width may be a width in a second direction intersecting the first direction.

[0021] In one embodiment, the covering layer may include a plurality of covering patterns arranged along the first direction and having a length in the second direction.

[0022] In an embodiment, the method may further include: forming an upper adhesive layer disposed on the first plate and having an opening corresponding to the first region, and a thickness of the upper adhesive layer may be greater than a thickness of the cover layer.

[0023] In one embodiment, a depth of the plurality of slits may be smaller than a thickness of the second region of the first plate.

[0024] In one embodiment, the cover layer may include a light shielding material.

[0025] In one embodiment, the covering layer may include at least one of polyethylene terephthalate (PET), polyethylene (PE), polypropylene (PP), polyvinyl chloride (PVC) and polyvinylidene chloride (PVDC).

[0026] Other aspects, features, and advantages than those described above will become apparent from the following detailed description, claims, and accompanying drawings for implementing the invention.

[0027] According to one embodiment of the present invention configured as described above, a display device and a method for manufacturing a display device having improved impact resistance can be realized. Of course, the scope of the present invention is not limited to such effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 and Figure 2 is a perspective view schematically showing a display device according to an embodiment of the present invention.

[0029] Figure 3a It is schematically shown Figure 1 A cross-sectional view of a display device taken along line II'.

[0030] Figure 3b is a schematic cross-sectional view according to an embodiment of the present invention.

[0031] Figure 4a and Figure 4b FIG. 1 is an enlarged view showing a part of a first plate and a cover layer according to an embodiment of the present invention.

[0032] Figure 5 It is a tensile force comparison graph of the comparative example and the embodiment.

[0033] Figure 6 The graph is a graph showing the impact resistance according to the slit width.

[0034] Figure 7a and Figure 7b is a diagram schematically showing a part of a manufacturing process according to an embodiment of the present invention.

[0035] Figure 8 is a graph showing the amount of contraction of the slit width according to the temperature of heat applied to the cover layer.

[0036] Figure 9a and Figure 9b are images of a portion of a folding pattern before and after the heat treatment process, respectively.

[0037] Fig.10 is a plan view which enlarges and schematically shows a portion of a folding pattern and a cover layer according to an embodiment of the present invention.

[0038] Fig.11 is a cross-sectional view schematically showing a display device according to an embodiment of the present invention.

[0039] Fig.12 is a cross-sectional view schematically showing a display device according to an embodiment of the present invention.

[0040] Fig.13 FIG. 1 is a plan view schematically showing a display panel included in a display device according to an embodiment of the present invention.

[0041] Fig.14 This is an equivalent circuit diagram schematically showing a certain pixel circuit of a display panel and a display element connected to the pixel circuit.

[0042] Fig.15 is schematically shown along Fig.13 A cross-sectional view of a section taken along line II-II'.

[0043] Description of Reference Numerals

[0044] 10: Display Panel

[0045] FA: Folding Area

[0046] NFA: Non-folding area

[0047] 40: First board

[0048] 40A: First Area

[0049] 40B: Second area

[0050] 40P: Folding pattern

[0051] 40S: Slit

[0052] CV: Overlay

[0053] CVP: Covering Pattern

[0054] ALU: Upper adhesive layer

[0055] ALL: Lower adhesive layer

[0056] W1P: First Preliminary Width

[0057] W1: First width DETAILED DESCRIPTION

[0058] The present invention may be implemented in a variety of variations and may have a variety of embodiments, and specific embodiments are exemplified in the drawings and described in detail in the detailed description. The effects and features of the present invention and methods of achieving them will become clear with reference to the embodiments described in detail below in conjunction with the drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in a variety of forms.

[0059] In the following embodiments, the terms first, second, etc. are not used in a limiting sense but are used for the purpose of distinguishing one constituent element from another constituent element.

[0060] In the following embodiments, unless clearly different meanings are given in the context, an expression in the singular includes an expression in the plural.

[0061] In the following embodiments, terms such as including or having mean the presence of features or constituent elements recorded in the specification, rather than excluding the possibility of adding one or more other features or constituent elements in advance.

[0062] In the following embodiments, when a portion referred to as a film, region, constituent element, etc. is above or on other portions, it includes not only the case where it is directly on the other portions but also the case where other films, regions, constituent elements, etc. are interposed therebetween.

[0063] For the convenience of explanation, the size of the constituent elements in the drawings may be exaggerated or reduced. For example, for the convenience of explanation, the size and thickness of each configuration shown in the drawings are arbitrarily shown, and therefore the present invention is not necessarily limited to what is shown in the drawings.

[0064] In the specification, "A and / or B" means the case of A, the case of B, or the case of A and B. In addition, in the specification, "at least one of A and B" means the case of A, the case of B, or the case of A and B.

[0065] In the following embodiments, the meaning of the wiring "extending in the first direction or the second direction" includes not only the case where it extends in a straight line shape but also the case where it extends in a zigzag shape or a curved line along the first direction or the second direction.

[0066] In the following embodiments, when referred to as "on a plane", it means when the object portion is observed from above. That is, in the specification, "on a plane" may mean "when observed in a direction perpendicular to the substrate 100". In the following embodiments, when referred to as "on a cross section", it means when a cross section cut vertically of the object portion is observed from the side. In the following embodiments, "overlapping" of a first constituent element with a second constituent element means that the first constituent element is located above or below the second constituent element.

[0067] Figure 1 and Figure 2 Schematically shows a perspective view of a display device 1 according to an embodiment of the present invention. Specifically, Figure 1 is a perspective view showing a state where the display device 1 is unfolded, and Figure 2 It is a perspective view showing a state where the display device 1 is folded.

[0068] like Figure 1 and Figure 2 As shown in , the display device 1 may include a housing HS, a display panel 10, and a cover window 20. The housing HS may include an inner side that defines a housing space. The housing HS may include a material having relatively high rigidity. For example, the housing HS may include glass, plastic, or metal, or may include a plurality of frames and / or plates formed by a combination thereof. The housing HS may stably protect the constituent elements of the display device 1 housed in the internal space from being affected by external impacts.

[0069] The display panel 10 can display an image. The display panel 10 may include a main area MA and a component area CA. In one embodiment, the main area MA may be a main display area. A plurality of display elements may be arranged in the main area MA, and the plurality of display elements may emit light. Therefore, the display panel 10 may display an image by light emitted from a plurality of display elements. In one embodiment, the display element may be an organic light emitting diode (OLED) including an organic light emitting layer. Alternatively, the display element may be a light emitting diode (LED). The size of the light emitting diode (LED) may be micrometer (micro) level or nanometer (nano) level. For example, the light emitting diode may be a micro (micro) light emitting diode. Alternatively, the light emitting diode may be a nanorod (nanorod) light emitting diode. The nanorod light emitting diode may include gallium nitride (GaN). In one embodiment, a color conversion layer may be arranged on the nanorod light emitting diode. The color conversion layer may include quantum dots. Alternatively, the display element may be a quantum dot light emitting diode (Quantum dot Light Emitting Diode) including a quantum dot light emitting layer. Alternatively, the display element may be an inorganic light emitting diode including an inorganic semiconductor.

[0070] The component area CA may be an area where an image is displayed and an area overlapped with components for adding various functions. A plurality of display elements may be arranged in the component area CA. The component area CA may be at least partially surrounded by the main area MA. In one embodiment, the component area CA may be entirely surrounded by the main area MA. In one embodiment, the component area CA may include a first component area CA1 and a second component area CA2. In some embodiments, one of the first component area CA1 and the second component area CA2 may be omitted.

[0071] The cover window 20 may protect the display panel 10. In one embodiment, the cover window 20 may be combined with the housing HS to set the appearance of the display device 1. The cover window 20 may include an insulating panel. For example, the cover window 20 may be made of glass, plastic, or a combination thereof. The cover window 20 may define the front surface of the display device 1.

[0072] The cover window 20 may include an optically transparent area. Therefore, the display panel 10 can display an image through the optically transparent transparent area of ​​the cover window 20. In one embodiment, the transparent area may be surrounded by a frame area, and the shape of the transparent area may be defined by the frame area. The light transmittance of the frame area may be lower than the light transmittance of the transparent area. In one embodiment, the frame area may include an opaque substance that shields light. In one embodiment, the frame area may have a predetermined color. The frame area may be defined by a frame layer provided separately from a transparent substrate defining the transparent area, or may be defined by an ink layer inserted into a transparent substrate or formed by coloring.

[0073] like Figure 1 and Figure 2 As shown in , the display device 1 may include a first surface S1 and a second surface S2 opposite to the first surface S1. The display device 1 may display an image on the first surface S1. In one embodiment, the first surface S1 may be the front surface of the display device 1. The second surface S2 may be the back surface of the display device 1. In some embodiments, the display device 1 may also display an image on the second surface S2.

[0074] The display device 1 can be folded with the folding axis FAX crossing the first surface S1 as the center. In one embodiment, the display device 1 can be folded so that a portion of the first surface S1 and another portion of the first surface S1 face each other. In another embodiment, the display device 1 can be folded so that a portion of the second surface S2 and another portion of the second surface S2 face each other.

[0075] In one embodiment, the folding axis FAX may extend in a first direction. In another embodiment, the folding axis FAX may extend in a second direction intersecting the first direction. In one embodiment, the first direction and the second direction may form a right angle. In one embodiment, the first direction and the second direction may form an acute angle or an obtuse angle. Hereinafter, a detailed description will be given with the first direction (e.g., the y direction or the -y direction) and the second direction (e.g., the x direction or the -x direction) being orthogonal to each other.

[0076] Although Figure 1 and Figure 2 Only one folding axis FAX is shown, but in another embodiment, the display device 1 may include a plurality of folding axes FAX. Figure 1 and Figure 2 The folding axis FAX is shown to extend in a first direction (e.g., the y direction or the -y direction), but in another embodiment, the folding axis FAX may extend in a second direction (e.g., the x direction or the -x direction), or may extend in a direction intersecting the second direction (e.g., the x direction or the -x direction) and the first direction (e.g., the y direction or the -y direction).

[0077] The display device 1 may include a housing HS, a display panel 10, and a cover window 20. The display panel 10 may include a main area MA and a component area CA. In one embodiment, the main area MA may include a first main area MA1 and a second main area MA2 arranged across a folding axis FAX. The display panel 10 may include a folding area FA and a non-folding area NFA. The folding area FA may be a portion of the first main area MA1 adjacent to the folding axis FAX and a portion of the second main area MA2 adjacent to the folding axis FAX. The folding area FA may be folded with the folding axis FAX as a reference. The folding area FA may be interposed between the non-folding areas NFA. Figure 1 Although the unfolded area is referred to as a non-folding area in one embodiment of the present invention, this is for the convenience of explanation, and the expression of "non-folding" may include not only a case of being hard and not flexible, but also a case of being flexible but less than the folding area, and a case of being flexible but not folding.

[0078] Figure 3a It is schematically shown Figure 1 A cross-sectional view of a display device taken along line II', and Figure 3b is a schematic cross-sectional view according to an embodiment of the present invention and is enlarged to show Figure 3a Figure 1 shows the A region of the graph. Figure 4a and Figure 4b is an enlarged view showing a folding pattern and a portion of a covering layer according to an embodiment of the present invention, Figure 5 is a tensile force test curve diagram of a comparative example and an embodiment, and Figure 6 The graph is a graph showing the impact resistance according to the slit width.

[0079] Reference Figure 3a The display device 1 may include a housing HS, a display panel 10, a cover window 20, a first protective layer PB1, a second protective layer PB2, a support layer 30, a cover layer CV, a first plate 40, a second plate 60, a cushion layer 70, a waterproof layer 80, an adhesive layer AL and a component COMP.

[0080] The housing HS may include an inner side surface HSIS defining the accommodating space AS. The inner side surface HSIS of the housing HS may not be a surface constituting the appearance of the display device 1. In an embodiment, the housing HS may have a back surface HSS1 and a side surface HSS2. The back surface HSS1 and the side surface HSS2 may not be surfaces constituting the appearance of the display device 1. The display panel 10, the first protective layer PB1, the second protective layer PB2, the support layer 30, the cover layer CV, the first plate 40, the second plate 60, the cushion layer 70, the waterproof layer 80, the adhesive layer AL, and the component COMP may be opposite to the inner side surface HSIS of the housing HS.

[0081] The components of the display device 1 may be arranged in the accommodation space AS. In one embodiment, the display panel 10, the first protective layer PB1, the second protective layer PB2, the support layer 30, the cover layer CV, the first plate 40, the second plate 60, the cushion layer 70, the waterproof layer 80, the adhesive layer AL and the component COMP may be arranged in the accommodation space AS. In one embodiment, the housing HS may include a hinge area HG overlapping the folding axis FAX. Therefore, the housing HS may be folded with the folding axis FAX as the center.

[0082] The display panel 10 may be arranged at the lower portion of the cover window 20. In one embodiment, the display panel 10 may be arranged in the accommodating space AS. Therefore, the housing HS may protect the display panel 10. The display panel 10 may include a main area MA and a component area CA. In one embodiment, the component area CA may overlap with the component COMP. In one embodiment, the main area MA may include a first main area MA1 and a second main area MA2 arranged across the folding axis FAX.

[0083] The cover window 20 may be arranged on the display panel 10. In one embodiment, the cover window 20 may be arranged at the upper portion of the housing HS. Although not shown, in one embodiment, the cover window 20 may be connected to the housing HS. The cover window 20 may include a window 21, a window adhesive layer 22, an opaque layer 23, a window protective layer 24, and a hard coating layer 25. In one embodiment, the window 21 may include ultra-thin glass. In another embodiment, the window 21 may include a polymer resin.

[0084] The window protection layer 24 can protect the window 21 and prevent or reduce scratches on the window 21. The window protection layer 24 can be disposed on the window 21. In one embodiment, the window protection layer 24 can include a polymer resin. In another embodiment, the window protection layer 24 can include an inorganic substance.

[0085] The window adhesive layer 22 may be disposed between the window protection layer 24 and the window 21. The window adhesive layer 22 may bond the window protection layer 24 and the window 21. In one embodiment, the window adhesive layer 22 may be a pressure sensitive adhesive. In another embodiment, the window adhesive layer 22 may be an optically clear adhesive.

[0086] The opaque layer 23 may be disposed between the window adhesive layer 22 and the window protective layer 24. In some embodiments, the opaque layer 23 may be a part of the window protective layer 24. The opaque layer 23 may include an opaque material so that the wiring or circuit of the display panel 10 is not recognized from the outside. Therefore, the opaque layer 23 may cover the frame area of ​​the window 20.

[0087] The hard coating layer 25 may be disposed on the window protection layer 24. The hard coating layer 25 may be the outermost layer covering the window 20. The hard coating layer 25 may be the outermost layer of the display device 1. The hard coating layer 25 is a layer directly touched by a user, and it may provide a smooth and soft touch. In one embodiment, the hard coating layer 25 may include a polymer resin. In another embodiment, the hard coating layer 25 may include an inorganic substance.

[0088] The first protective layer PB1 may be disposed between the display panel 10 and the cover window 20. The first protective layer PB1 may protect the display panel 10 from external impact. In one embodiment, the first protective layer PB1 may include a polymer resin. For example, the first protective layer PB1 may include at least one of polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyimide, polycarbonate, and cellulose acetate propionate. In another embodiment, the first protective layer PB1 may include a substance such as glass or quartz.

[0089] The second protective layer PB2 may be disposed at a lower portion of the display panel 10. In one embodiment, the display panel 10 may be disposed between the first protective layer PB1 and the second protective layer PB2. The second protective layer PB2 may protect the display panel 10 from external impact. In one embodiment, the second protective layer PB2 may include a polymer substance. In another embodiment, the second protective layer PB2 may include an inorganic substance.

[0090] The support layer 30 may be disposed at the lower portion of the second protective layer PB2. In one embodiment, the second protective layer PB2 may be disposed between the display panel 10 and the support layer 30. The support layer 30 may be disposed at the lower portion of the display panel 10 to support the display panel 10. The support layer 30 may include a polymer substance. The support layer 30 may be provided by a polymer resin such as polyethyleneterephthalate or polyimide.

[0091] The first plate 40 may be disposed at the lower portion of the support layer 30. In one embodiment, the support layer 30 may be disposed between the second protective layer PB2 and the first plate 40. The first plate 40 may be disposed at the lower portion of the support layer 30 to support the display panel 10. Thus, the central portion of the display panel 10 sags less in the -z direction due to its weight, and thus may not be easily damaged even when an external impact is applied.

[0092] The first plate 40 may include at least one of metal, glass, and plastic. In one embodiment, the first plate 40 may include polyurethane. In another embodiment, the first plate 40 may include carbon fiber reinforced plastic (CFRP). The first plate 40 may include a folding pattern 40P, and a cover layer CV may be arranged on the upper portion of the folding pattern 40P. The folding pattern 40P and the cover layer CV of the first plate 40 will be described in detail. Figure 3b To be discussed later.

[0093] The second plate 60 may be arranged at the lower part of the first plate 40. That is, the first plate 40 may be arranged between the support layer 30 and the second plate 60. The second plate 60 may transfer the heat generated in the display device 1 to the outside. In addition, the second plate 60 may protect the display device 1 from external impact. In one embodiment, the second plate 60 may include a substance with a high heat transfer rate. For example, the second plate 60 may include metal or graphite. Compared with the case where the second plate 60 includes metal, in the case where the second plate 60 includes graphite, the second plate 60 may be relatively thin.

[0094] Although not in Figure 3a , but a digitizer (not shown) may be interposed between the first plate 40 and the second plate 60. The digitizer may include a body layer and / or a pattern layer. The digitizer may sense a signal input from an external electronic pen or the like through the pattern layer. In particular, the digitizer may sense the strength, direction, etc. of the signal input from the electronic pen or the like. In this case, the digitizer may include a first digitizer and a second digitizer spaced apart from each other with the folding axis FAX as a reference. Therefore, it is possible to prevent or reduce the situation where the digitizer is damaged when the display device 1 is folded.

[0095] The cushion layer 70 may be arranged at the lower portion of the second plate 60. The second plate 60 may be arranged between the first plate 40 and the cushion layer 70. The cushion layer 70 may prevent or reduce damage to the display device 1 due to external impact. Specifically, in order to fold the display device 1 with the folding axis FAX as the center, the thickness (in the z direction) of the structure included in the display device 1 should be thin. That is, the thickness (in the z direction) of the display panel 10 should be thin. However, in the case where the thickness (in the z direction) of the display panel 10 is thin, the display panel 10 may be easily damaged by external impact. The cushion layer 70 absorbs external impacts applied to the display panel 10, thereby preventing or reducing damage to the display panel 10 due to external impacts.

[0096] In one embodiment, the cushion layer 70 may include a substance having viscoelasticity. Specifically, the cushion layer 70 may include at least one of polyurethane, polyacrylate, and polyethylene. For example, the cushion layer 70 may include at least one of urethane-based resin, acrylate-based resin, and vinyl resin. The cushion layer 70 may be a single layer or multilayer structure, and may be composed of a foam material similar to a sponge. In one embodiment, the cushion layer 70 may also include a pressure-sensitive adhesive. In one embodiment, the cushion layer 70 may include a first portion 70A and a second portion 70B spaced apart from each other with the folding axis FAX as a reference.

[0097] The waterproof layer 80 may be disposed at the outer side of the second plate 60 and the cushion layer 70. The waterproof layer 80 may block or absorb moisture flowing in from the outside of the display device 1 to prevent or reduce damage to the constituent elements of the display device 1 due to moisture. In one embodiment, the waterproof layer 80 may include a tape and / or a sponge.

[0098] The adhesive layer AL may be arranged between the first constituent element and the second constituent element of the display device 1. The adhesive layer AL may bond the first constituent element and the second constituent element to each other. In one embodiment, the adhesive layer AL may be a pressure sensitive adhesive. In another embodiment, the adhesive layer AL may be an optically clear adhesive. The adhesive layer AL may include a first adhesive layer AL1, a second adhesive layer AL2, a third adhesive layer AL3, a fourth adhesive layer AL4, an upper adhesive layer ALU, and a lower adhesive layer ALL.

[0099] The first adhesive layer AL1 may be disposed between the first protective layer PB1 and the cover window 20. The first adhesive layer AL1 may adhere the first protective layer PB1 and the cover window 20 to each other. The second adhesive layer AL2 may be disposed between the first protective layer PB1 and the display panel 10. The second adhesive layer AL2 may adhere the first protective layer PB1 and the display panel 10 to each other. The third adhesive layer AL3 may be disposed between the display panel 10 and the second protective layer PB2. The third adhesive layer AL3 may adhere the display panel 10 and the second protective layer PB2 to each other. The fourth adhesive layer AL4 may be disposed between the second protective layer PB2 and the support layer 30. The fourth adhesive layer AL4 may adhere the second protective layer PB2 and the support layer 30 to each other. The upper adhesive layer ALU may be disposed between the support layer 30 and the first board 40. The upper adhesive layer ALU may adhere the support layer 30 and the first board 40 to each other. The lower adhesive layer ALL may be disposed between the first board 40 and the second board 60. The lower adhesive layer ALL may adhere the first board 40 and the second board 60 to each other.

[0100] The fourth adhesive layer AL4, the supporting layer 30, the upper adhesive layer ALU, the first plate 40, the lower adhesive layer ALL, the second plate 60 and the pad layer 70 may be provided with through holes overlapping the component area CA, respectively. In this case, the sound transmittance and / or light transmittance reaching the component COMP from the outside may become high. In another embodiment, at least one of the fourth adhesive layer AL4, the supporting layer 30, the upper adhesive layer ALU, the first plate 40, the lower adhesive layer ALL, the second plate 60 and the pad layer 70 may not be provided with a through hole overlapping the component area CA. In one embodiment, the second protective layer PB2 may be arranged continuously in the main area MA and the component area CA. In this case, the second protective layer PB2 may protect the display panel 10. In another embodiment, the second protective layer PB2 may be provided with a through hole overlapping the component area CA.

[0101] The component COMP may be arranged between the housing HS and the display panel 10. In one embodiment, the component COMP may be attached to the housing HS. In another embodiment, the component COMP may be arranged in the accommodating space AS. The component COMP may include an electronic module. For example, the electronic module may include a sensor that receives and utilizes light like an infrared sensor, a camera that receives light and takes an image, a sensor that outputs and senses light or sound to measure distance or recognize fingerprints, etc., a small lamp that outputs light, and / or a speaker that outputs sound. In the case of an electronic module that utilizes light, light of multiple wavelength bands such as visible light, infrared light, and / or ultraviolet light may be utilized.

[0102] In one embodiment, the component COMP may include a light emitting module and a light receiving module. The light emitting module and the light receiving module may be an integrated structure, or as a physically separated structure, a pair of the light emitting module and the light receiving module may constitute a component COMP.

[0103] Figure 3b It is enlarged to show Figure 3a 0 , an upper adhesive layer ALU, a cover layer CV, a first plate 40 , a lower adhesive layer ALL and a second plate 60 are shown in FIG.

[0104] Reference Figure 3b , the first plate 40 may include a first region 40A and a second region 40B. The first region 40A may be aligned with the display panel 10 ( Figure 1 ) of the folding area FA( Figure 1 ), and the second region 40B may correspond to the display panel 10 ( Figure 1 )’s non-folding region NFA( Figure 1 When viewed on a plane, the first area 40A may overlap with the folding area FA, and the second area 40B may overlap with the non-folding area NFA.

[0105] The first plate 40 may include a folding pattern 40P in which a plurality of slits 40S are defined. The folding pattern 40P may include ribs and slits 40S, the ribs may be a part of the main body of the first plate 40 in the first region 40A, and the slits 40S may be through holes provided in the first plate 40. In one embodiment, when the display device 1 is folded, the folding pattern 40P may be folded with the folding axis FAX as the center. The folding pattern 40P may change shape or length when the display device 1 is folded. In one embodiment, the folding pattern 40P may be provided so that both sides are symmetrical with the folding axis FAX as the center.

[0106] The folding pattern 40P of the first plate 40 may be arranged in the first region 40A. In the first region 40A where the folding pattern 40P is located, the upper surface of the first plate 40 may have concavoconvexity. In the second region 40B, the upper surface of the first plate 40 may be flat. The ribs of the folding pattern 40P may contain the same material as that of the second region 40B of the first plate 40 or a different material.

[0107] The cover layer CV may be arranged at the upper portion of the first plate 40. The cover layer CV may be arranged in the first region 40A of the first plate 40. The cover layer CV may be arranged to overlap with the folding pattern 40P of the first plate 40. In one embodiment, when the display device 1 is folded, the cover layer CV may be folded with the folding axis FAX as the center. The cover layer CV may change shape or length when the display device 1 is folded.

[0108] The covering layer CV may be arranged to be in direct contact with the top of the folding pattern 40P, and may cover the plurality of slits 40S. The adhesive force of the covering layer CV at room temperature (about 25°C) may be 1 kg / inch or more, and the adhesive force at high temperature and high humidity (about 60°C and about 93% or more) may be about 0.3 kg / inch or more. The covering layer CV may include a substance with a small amount of deformation (alternatively, a small elastic force). Thus, the covering layer CV may strengthen the response force to the external shear force acting on the display device 1. The covering layer CV may prevent deformation of the folding pattern 40P due to shear stress. The covering layer CV may prevent sagging of the folding pattern 40P.

[0109] Figure 5 The graph of FIG. 1 is a graph comparing the shear tensile force and the tensile length of Example 1 including the cover layer CV and the comparative example not including the cover layer. Specifically, when a force (force) is applied to pull both ends of the display device outward while the display device is tilted at about 23 degrees, the length of the display device elongated is shown. Figure 5 , in the case of Example 1, it was elongated by 3 mm when the force was increased to about 32.8 N, while in the case of the comparative example, it was elongated by 3 mm with only a force of about 1.2 N. In other words, with the stretched length of 3 mm as a reference, Example 1 can withstand a force of up to 32.8 N, and the comparative example can withstand a force of up to 1.2 N. That is, Example 1 including the cover layer CV can be more robust against external shear force than the comparative example.

[0110] The upper adhesive layer ALU may be arranged at the upper portion of the first board 40. The upper adhesive layer ALU may include an upper opening OPU corresponding to the first region 40A. The upper opening OPU may correspond to the cover layer CV. The upper adhesive layer ALU may directly contact the upper surface of the first board 40 in the second region 40B.

[0111] In one embodiment, the thickness THC of the cover layer CV may be less than the thickness THA of the upper adhesive layer ALU. The thickness THC of the cover layer CV and the thickness THA of the upper adhesive layer ALU may be less than 6 um, respectively. The upper adhesive layer ALU has an upper opening OPU corresponding to the cover layer CV and the cover layer CV is formed thinner than the upper adhesive layer ALU, so there may be a predetermined space between the cover layer CV and the supporting layer 30. The top of the cover layer CV may not be in contact with the upper adhesive layer ALU. Thus, when observed from the front of the display device 1, the folding pattern 40P provided with a plurality of slits 40S may not be observed by the user, and the folding characteristics of the display device 1 may be improved.

[0112] The lower adhesive layer ALL may be arranged on the lower side of the first plate 40. The lower adhesive layer ALL may include a lower opening OPL corresponding to the first area 40A. The lower opening OPL may correspond to the folding pattern 40P. The lower opening OPL may correspond to the cover layer CV. The lower adhesive layer ALL may be in direct contact with the lower side of the first plate 40 in the second area 40B. In one embodiment, the second plate 60 may include a 2-1 plate 60A and a 2-2 plate 60B spaced apart from each other with the folding axis FAX as a reference to expose a portion of the lower side of the folding pattern 40P.

[0113] Since one embodiment of the present invention includes the cover layer CV covering the upper surface of the folding pattern 40P, even if the lower surface of the folding pattern 40P is exposed by the lower opening OPL of the lower adhesive layer ALL and the spacing space between the 2-1st plate 60A and the 2-2nd plate 60B, foreign matter can be prevented from flowing into the display panel 10 through the plurality of slits 40S of the folding pattern 40P. That is, since the inflow of foreign matter can be prevented even without a separate layer sealing the lower surface of the folding pattern 40P, the thickness of the display device 1 can be reduced.

[0114] Reference Figure 4a and Figure 4b , the plurality of slits 40S may be arranged along the y direction (length direction, first direction) and the x direction (width direction, second direction) perpendicular to the y direction. The plurality of slits 40S may have a length l in the y direction parallel to the folding axis FAX of the folding area FA. For example, the plurality of slits 40S may be in the shape of an ellipse that is a long hole along the y direction. In one embodiment, as Figure 4a As shown in FIG. 1 , a plurality of slits 40S of the same length in the first region 40A may be arranged spaced apart in the x-direction and the y-direction. The width lw of the rib of the folding pattern 40P may be determined by a first spacing d1 in the x-direction and a second spacing d2 in the y-direction between the slits 40S.

[0115] The embodiments of the present invention are not limited to Figure 4a In one embodiment, the plurality of slits 40S may be arranged at regular or irregular intervals along the y direction and / or the x direction. Figure 7a As shown in , in one embodiment, the folding pattern 40P may include a plurality of slits 40S arranged in parallel and spaced apart along the x direction. The ribs and slits 40S of the folding pattern 40P may alternate in the x direction. The plurality of slits 40S may also have the same shape as each other or different shapes from each other.

[0116] The degree of flexibility and impact resistance of the first region 40A may be determined by at least one of the length l and the width sw of the slits 40S, and the first interval d1 and the second interval d2 between the slits 40S. Figure 6It is a drop ball test curve graph according to the width of the slit. The x-axis of the curve graph represents the width of the slit, and the y-axis of the curve graph represents the drop ball height, and the drop ball height means the maximum height that can be tolerated in the test within the width of the slit. Figure 6 , when the slit width is 0.2mm (200um), the ball drop height is about 2cm, when the slit width is 0.1mm (100um), the ball drop height is about 6cm, and as the slit width approaches 0, the ball drop height approaches about 8cm. This means that as the slit width becomes narrower, the impact resistance is improved.

[0117] According to an embodiment of the present invention, the width sw of the slit 40S may be less than 100 um, or may be approximately 50 um. In an embodiment, the slit 40S of the folding pattern 40P may be formed by an etching process, a laser process, a sandblasting process, etc. However, if only the process described above is applied, it may be difficult to reduce the width sw of the slit 40S to less than a certain size.

[0118] Figure 7a and Figure 7b is a diagram schematically showing a part of a manufacturing process according to an embodiment of the present invention, and Figure 8 is a graph showing the amount of contraction of the slit width according to the temperature of heat applied to the cover layer. Figure 9a and Figure 9b Figures are images of a portion of the folding pattern before and after the heat treatment process. Figure 7a In the example shown in the figure, the case where the folding pattern 40P includes a plurality of slits 40S arranged in parallel and spaced apart in the x direction is described, but the embodiment of the present invention is not limited thereto. Figure 4a As shown, the slits 40S may be arranged spaced apart in the x-direction and the y-direction.

[0119] Reference Figure 7a In the first region 40A of the first plate, the folding pattern 40P may include ribs and a plurality of slits 40S having a first preliminary width W1P. The first preliminary width W1P may be the width of the slit 40S in the x direction and may be the spacing between the ribs. In one embodiment, the plurality of slits 40S may be formed by an etching process, a laser process, a sandblasting process, or the like. In one embodiment, the first preliminary width W1P may be greater than 100um. A covering layer CV may be formed on the slits 40S having the first preliminary width W1P. The covering layer CV may be in direct contact with the folding pattern 40P. The covering layer CV may be located on the plurality of slits 40S.

[0120] A heat treatment process may be performed on the cover layer CV arranged on the plurality of slits 40S having the first preliminary width W1P. In one embodiment, the heat treatment process may be a baking process. Figure 7b The slits 40S and the cover layer CV after the heat treatment process are shown. The manufacturing method of the display device according to an embodiment of the present invention may include: forming a plurality of slits 40S having a first preliminary width W1P in the first region 40A; forming a cover layer CV on the plurality of slits 40S; and applying heat to the cover layer CV to deform the plurality of slits 40S into a first width W1 smaller than the first preliminary width W1P. The first width W1 corresponds to Figure 4b The width sw of the slit 40S mentioned above in the above-mentioned figure can be 100 um or less or 50 um or more. The difference between the first width W1 and the first preliminary width W1P can be 20 um or more and 200 um or less.

[0121] In one embodiment, the cover layer CV may include a material capable of heat shrinkage. In one embodiment, the cover layer CV may include at least one of polyethylene terephthalate, low density polyethylene, polyethylene, polypropylene, polyvinyl chloride, and polyvinylidene chloride. Since the cover layer CV includes a material capable of heat shrinkage, when heat is applied to the cover layer CV, as the cover layer CV shrinks, the folding pattern 40P below it may also shrink together. As the folding pattern 40P shrinks, the width sw ( Figure 4b ) is retractable.

[0122] The heat applied to the cover layer CV may be 60° C. or more and 170° C. or less. That is, the heat treatment process may be performed at 60° C. or more and 170° C. or less. Figure 8 , as the temperature becomes higher, the amount of contraction of the width of the slit increases. When the heat temperature is above 60°C, the width of the slit can shrink by more than 0.02mm (20um). For example, when the heat treatment temperature is 100°C, the width of the slit can shrink by 0.10mm (100um), and this means that the slit can be shrunk to 100um after the width is formed to 200um by a process such as etching. As mentioned above, although it is difficult to form the width of the slit to be smaller than a specific size by etching, etc., according to one embodiment of the present invention, after the slit is formed to have a first preliminary width, heat is applied to the covering layer having a heat shrinkage property to shrink the first preliminary width to the first width, thereby reducing the difficulty of the process. Figure 9a shows the folding pattern before the heat treatment process, and Figure 9b is an image showing the folding pattern after the heat treatment process. Figure 9a The first preliminary width W1P shrinks to less than its Figure 9b The first width W1.

[0123] Fig.10 FIG. 1 is a plan view that enlarges and schematically shows a portion of a folding pattern and a covering layer according to an embodiment of the present invention. Fig.10 In, with Figures 3a to 4b The same reference numerals denote the same constituent elements, and thus repeated description thereof will be omitted.

[0124] Reference Fig.10 , the first plate may include a first region 40A and a second region 40B, and a plurality of slits 40S and a cover layer CV may be positioned in the first region 40A. In an embodiment, a portion of the cover layer CV may overlap with the second region 40B.

[0125] In one embodiment, the cover layer CV may include a plurality of cover patterns CVP. Fig.10 As shown, a plurality of cover patterns CVP may be arranged to be spaced apart from each other. In one embodiment, a plurality of cover patterns CVP may be in a form in which a region is connected to each other. A plurality of cover patterns CVP may be in a shape extending in the x direction (second direction). A plurality of cover patterns CVP may be arranged along the y direction (first direction). That is, a plurality of cover patterns CVP may be arranged along the y direction and may have a length in the x direction. Thus, the cover layer CV may expose a portion of the folding pattern and may improve the folding characteristics of the display device.

[0126] Fig.11 and Fig.12 FIG. 1 is a cross-sectional view schematically showing a display device according to an embodiment of the present invention. Fig.11 and Fig.12 In, with Figure 3a and Figure 3b The same reference numerals denote the same constituent elements, and thus repeated description thereof will be omitted.

[0127] Reference Fig.11 , the cover layer CV may be arranged on the first area 40A and the second area 40B of the first plate 40. The cover layer CV may not only cover the folding pattern 40P of the first plate 40, but also cover at least a portion of the second area 40B. In one embodiment, the cover layer CV may contain a light shielding substance to absorb light reflected by the constituent elements of the display device. The upper adhesive layer ALU may bond the second protective layer PB2 and the cover layer CV. Figure 3a The support layer 30 and the fourth adhesive layer AL4 may be omitted, and the cover layer CV may replace the support layer 30 ( Figure 3a ) function. Thus, the thickness of the display device can be reduced.

[0128] Reference Fig.12 , the depth DS of the plurality of slits 40S of the folding pattern 40P may be less than the thickness TH2 of the second region 40B of the first plate 40. In other words, the thickness of the folding pattern 40P arranged in the first region 40A may be less than the thickness TH2 of the second region 40B where the folding pattern 40P is not arranged. The cover layer CV may be arranged on the folding pattern 40P. Figure 3b , the upper adhesive layer ALU may be formed thicker than the cover layer CV so that the cover layer CV is spaced apart from the support layer 30. Fig.12 In the case of the upper adhesive layer ALU, even if the thickness THA of the upper adhesive layer ALU is less than the thickness THC of the cover layer CV, the cover layer CV may be separated from the layer spacer disposed at the upper portion of the upper adhesive layer ALU. In one embodiment, the sum of the thickness THC of the cover layer CV and the depth DS of the slit 40S may be less than the thickness TH2 (THC+DS) of the second region 40B. <TH2)。

[0129] Although Fig.12 The upper adhesive layer ALU is shown to be provided with an upper opening OPU corresponding to the folding pattern 40P, but the embodiments of the present invention are not limited thereto. In another embodiment, the upper adhesive layer ALU may be arranged to overlap with the folding pattern 40P on a plane. The upper adhesive layer ALU may be arranged to overlap with the cover layer CV on a plane. In the case where the depth DS of the slit 40S is less than the thickness TH2 of the second region 40B of the first plate 40, even if the upper adhesive layer ALU is arranged to overlap with the cover layer CV, the cover layer CV and the upper adhesive layer ALU are arranged spaced apart, so the visibility of the folding pattern 40P can be reduced.

[0130] Fig.13 is a plan view schematically showing a display panel 10 included in a display device according to an embodiment of the present invention, and Fig.14 Schematically shows an equivalent circuit diagram of a certain pixel circuit PC of the display panel 10 and a display element DPE connected to the pixel circuit PC.

[0131] Reference Fig.13 and Fig.14 , the display panel 10 may include a main area MA, a component area CA, and a peripheral area PRA. The display panel 10 may include a substrate 100, a pixel circuit PC, a scan line SL, a data line DL, a driving voltage line PL, and a display element DPE. In one embodiment, a main area MA, a component area CA, and a peripheral area PRA may be defined in the substrate 100. In other words, the substrate 100 may include a main area MA, a component area CA, and a peripheral area PRA. The following will be described in detail with the case where the substrate 100 includes the main area MA, the component area CA, and the peripheral area PRA as the center.

[0132] The pixel circuit PC and the display element DPE may overlap at least one of the main area MA and the component area CA. The pixel circuit PC may include a driving thin film transistor T1, a switching thin film transistor T2, and a storage capacitor Cst. The display element may emit red, green, or blue light, or may emit red, green, blue, or white light.

[0133] The switching thin film transistor T2 may be connected to the scan line SL and the data line DL, and transmits a data voltage or a data signal input from the data line DL to the driving thin film transistor T1 according to a scan voltage or a scan signal input from the scan line SL.

[0134] The storage capacitor Cst may be connected to the switching thin film transistor T2 and the driving voltage line PL, and stores a voltage corresponding to a difference between a voltage received from the switching thin film transistor T2 and a first power source voltage ELVDD supplied to the driving voltage line PL.

[0135] The driving thin film transistor T1 may be connected to the driving voltage line PL and the storage capacitor Cst, and controls the driving current flowing from the driving voltage line PL to the display element DPE corresponding to the voltage value stored in the storage capacitor Cst. The display element DPE may emit light with a predetermined continuous reading by the driving current. The opposite electrode (e.g., cathode) of the display element DPE may be supplied with the second power supply voltage ELVSS.

[0136] Although Fig.14 It is shown that the pixel circuit PC includes 2 thin film transistors and 1 storage capacitor, but the pixel circuit PC may include 3 or more thin film transistors.

[0137] The component area CA may be at least partially surrounded by the main area MA. In one embodiment, the component area CA may be entirely surrounded by the main area MA. The component area CA may include a pixel area where the display element DPE is arranged, and a transmission area where the display element DPE is not arranged. Therefore, the light transmittance of the display panel 10 in the component area CA may be higher than the light transmittance of the display panel 10 in the main area MA. In one embodiment, the component area CA may include a first component area CA1 and a second component area CA2.

[0138] The peripheral area PRA may be arranged at the outer side of the main area MA. In one embodiment, the peripheral area PRA may surround the main area MA. A scan driver (not shown) for providing a scan signal to the pixel circuit PC, a data driver (not shown) for providing a data signal, a power wiring (not shown) for providing a first power supply voltage ELVDD and / or a second power supply voltage ELVSS, etc. may be arranged in the peripheral area PRA. The peripheral area PRA may include a soldering plate area PADA. A soldering plate (not shown) may be arranged in the soldering plate area PADA, and the display circuit board may be connected to the soldering plate.

[0139] Fig.15 is schematically shown along Fig.13 The cross-sectional view of the cross section taken along the II-II' line. Fig.15 As shown in , the display panel 10 may include a substrate 100, a display layer 200, an encapsulation layer 300, a touch sensor layer 400, and a reflection prevention layer 500. The substrate 100 may include glass or a polymer resin such as polyethersulfone, polyarylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyimide, polycarbonate, triacetyl cellulose, cellulose acetate propionate, etc. In one embodiment, the substrate 100 may be a multilayer structure including a base layer including the aforementioned polymer resin and a barrier layer (not shown). The substrate 100 including the polymer resin may have characteristics such as flexibility, curling, bending, etc.

[0140] The display layer 200 may be disposed on the substrate 100. The display layer 200 may include a pixel circuit layer 210 and a display element layer 220.

[0141] The pixel circuit layer 210 may include a first barrier layer BRL1, a first metal layer BML1, a second barrier layer BRL2, a pixel circuit PC, a connection electrode CM, and a plurality of insulating layers. The pixel circuit PC may include a first thin film transistor TFT1, a second thin film transistor TFT2, and a storage capacitor Cst. The first thin film transistor TFT1 may include a first semiconductor layer Act1, a first gate electrode GE1, a first source electrode SE1, and a first drain electrode DE1. The second thin film transistor TFT2 may include a second semiconductor layer Act2, a second gate electrode GE2, a second source electrode SE2, and a second drain electrode DE2. The storage capacitor Cst may include a first electrode CE1 and a second electrode CE2. The plurality of insulating layers may include a buffer layer 211, a first inorganic insulating layer 212, a second inorganic insulating layer 213, an intermediate insulating layer 214, a third inorganic insulating layer 215, a fourth inorganic insulating layer 216, a first organic insulating layer 217, a second organic insulating layer 218, and a third organic insulating layer 219.

[0142] The first barrier layer BRL1 may be disposed on the substrate 100. The first barrier layer BRL1 may include silicon oxide (SiO X ), Silicon Nitride (SiN X ) or silicon oxynitride (SiO X N Y ) of inorganic substances.

[0143] In some embodiments, the first barrier layer BRL1 may include amorphous silicon (a-Si). In one embodiment, the first barrier layer BRL1 may be a single layer or multiple layers including the aforementioned substances.

[0144] The first metal layer BML1 may be arranged on the first barrier layer BRL1. The first metal layer BML1 may overlap with the first thin film transistor TFT1. The first metal layer BML1 may play a role of protecting the lower protective metal of the layer overlapping with it. In one embodiment, the first metal layer BML1 may not overlap with the second thin film transistor TFT2. In some embodiments, the first metal layer BML1 may be applied with a rated voltage or signal. The first metal layer BML1 may more easily supply charges to the back channel portion of the pixel circuit PC. The first metal layer BML1 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W) and / or copper (Cu). In one embodiment, the first metal layer BML1 may include doped amorphous silicon. The first metal layer BML1 may be provided as a single layer or multiple layers of the aforementioned substances.

[0145] The second barrier layer BRL2 may be disposed on the first barrier layer BRL1. The second barrier layer BRL2 may include silicon oxide (SiO X ), Silicon Nitride (SiN X ) or silicon oxynitride (SiO X N Y ) inorganic substances. In some embodiments, the second barrier layer BRL2 may include amorphous silicon (a-Si). In one embodiment, the second barrier layer BRL2 may be a single layer or multiple layers including the aforementioned substances.

[0146] The buffer layer 211 may be disposed on the second barrier layer BRL2. The buffer layer 211 may include silicon oxide (SiO X ), Silicon Nitride (SiN X ) or silicon oxynitride (SiO X N Y ) and may be a single layer or multiple layers comprising the aforementioned inorganic substance.

[0147] The first semiconductor layer Act1 may be disposed on the buffer layer 211. The first semiconductor layer Act1 may include a silicon semiconductor. In one embodiment, the first semiconductor layer Act1 may include polycrystalline silicon. The first semiconductor layer Act1 may include a channel region and a drain region and a source region respectively disposed at both sides of the channel region. In another embodiment, the first semiconductor layer Act1 may include an organic semiconductor or an oxide semiconductor.

[0148] The first inorganic insulating layer 212 may be disposed on the first semiconductor layer Act1. The first inorganic insulating layer 212 may include silicon oxide (SiO X ), Silicon Nitride (SiN X ) or silicon oxynitride (SiO X N Y ) or the like. That is, the first inorganic insulating layer 212 may include silicon oxide (SiO X ), Silicon Nitride (SiN X ) and silicon oxynitride (SiO X N Y ). In one embodiment, the first inorganic insulating layer 212 may include aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ) or zinc oxide (ZnO).

[0149] The first gate electrode GE1 may be disposed on the first inorganic insulating layer 212. The first gate electrode GE1 may overlap the first semiconductor layer Act1. The first gate electrode GE1 may include molybdenum (Mo). The first gate electrode GE1 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W) and / or copper (Cu), and may be a single layer or multiple layers of the foregoing substances.

[0150] The second inorganic insulating layer 213 may be disposed on the first gate electrode GE1. The second inorganic insulating layer 213 may include silicon oxide (SiO X ), Silicon Nitride (SiN X ) or silicon oxynitride (SiO X N Y ) or the like. That is, the second inorganic insulating layer 213 may include silicon oxide (SiO X ), Silicon Nitride (SiN X ) and silicon oxynitride (SiO X N Y In one embodiment, the second inorganic insulating layer 213 may include aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ) or zinc oxide (ZnO).

[0151] The second electrode CE2 may be arranged on the second inorganic insulating layer 213. In one embodiment, the second electrode CE2 may overlap the first gate electrode GE1. The second electrode CE2 may set a storage capacitor Cst together with the first gate electrode GE1 overlapped with the second inorganic insulating layer 213. That is, the first gate electrode GE1 may serve as the first electrode CE1 of the storage capacitor Cst. As described above, the storage capacitor Cst may overlap the first thin film transistor TFT1. In another embodiment, the storage capacitor Cst may not overlap the first thin film transistor TFT1. The second electrode CE2 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W) and / or copper (Cu), and may be a single layer or multiple layers of the foregoing substances.

[0152] The intermediate insulating layer 214 may be disposed on the second electrode CE2. The intermediate insulating layer 214 may include silicon oxide (SiO X ), Silicon Nitride (SiNX ) or silicon oxynitride (SiO X N Y ) or other inorganic insulating materials. That is, the intermediate insulating layer 214 may include silicon oxide (SiO X ), Silicon Nitride (SiN X ) and silicon oxynitride (SiO X N Y In one embodiment, the intermediate insulating layer 214 may include aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ) or zinc oxide (ZnO).

[0153] The second semiconductor layer Act2 may be arranged on the intermediate insulating layer 214. That is, the second semiconductor layer Act2 may be arranged at the upper portion of the second inorganic insulating layer 213. The second semiconductor layer Act2 may include a channel region and a source region and a drain region arranged at both sides of the channel region. The second semiconductor layer Act2 may include an oxide semiconductor. For example, the second semiconductor layer Act2 may be a Zn oxide-based substance, which may be formed of Zn oxide, In-Zn oxide, Ga-In-Zn oxide, etc. Alternatively, the second semiconductor layer Act2 may be provided by IGZO (In-Ga-Zn-O), ITZO (In-Sn-Zn-O) or IGTZO (In-Ga-Sn-Zn-O) semiconductor containing metals such as indium (In), gallium (Ga), and tin (Sn) in zinc oxide (ZnO).

[0154] The source region and the drain region of the second semiconductor layer Act2 can be formed by adjusting the carrier concentration of the oxide semiconductor and making it conductive. For example, the source region and the drain region of the second semiconductor layer Act2 can be formed by increasing the carrier concentration in the oxide semiconductor by plasma treatment using a hydrogen-based gas, a fluorine-based gas, or a combination thereof.

[0155] The third inorganic insulating layer 215 may be disposed on the second semiconductor layer Act2. The third inorganic insulating layer 215 may include silicon oxide (SiO X ), Silicon Nitride (SiN X ) or silicon oxynitride (SiO X N Y ) or the like. That is, the third inorganic insulating layer 215 may include silicon oxide (SiO X ), Silicon Nitride (SiN X ) and silicon oxynitride (SiO X N YIn one embodiment, the third inorganic insulating layer 215 may include aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ) or zinc oxide (ZnO).

[0156] The second gate electrode GE2 may be disposed on the third inorganic insulating layer 215. The second gate electrode GE2 may overlap the second semiconductor layer Act2. The second gate electrode GE2 may overlap the channel region of the second semiconductor layer Act2. The second gate electrode GE2 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W) and / or copper (Cu), and may be a single layer or multiple layers of the foregoing substances.

[0157] The fourth inorganic insulating layer 216 may be disposed on the second gate electrode GE2. The fourth inorganic insulating layer 216 may include silicon oxide (SiO X ), Silicon Nitride (SiN X ) or silicon oxynitride (SiO X N Y ) or the like. That is, the fourth inorganic insulating layer 216 may include silicon oxide (SiO X ), Silicon Nitride (SiN X ) and silicon oxynitride (SiO X N Y In one embodiment, the fourth inorganic insulating layer 216 may include aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ) or zinc oxide (ZnO). The fourth inorganic insulating layer 216 may be a single layer or multiple layers including the aforementioned inorganic insulating materials.

[0158] The first source electrode SE1 and the first drain electrode DE1 may be disposed on the fourth inorganic insulating layer 216. The first source electrode SE1 and the first drain electrode DE1 may be connected to the first semiconductor layer Act1. In one embodiment, the first source electrode SE1 and the first drain electrode DE1 may be connected to the first semiconductor layer Act1 through contact holes of the insulating layer, respectively. For example, the first source electrode SE1 and the first drain electrode DE1 may be connected to the first semiconductor layer Act1 through contact holes of the first inorganic insulating layer 212, contact holes of the second inorganic insulating layer 213, contact holes of the intermediate insulating layer 214, contact holes of the third inorganic insulating layer 215, and contact holes of the fourth inorganic insulating layer 216, respectively. The contact holes of the first inorganic insulating layer 212, the contact holes of the second inorganic insulating layer 213, the contact holes of the intermediate insulating layer 214, the contact holes of the third inorganic insulating layer 215, and the contact holes of the fourth inorganic insulating layer 216 may overlap with each other.

[0159] The second source electrode SE2 and the second drain electrode DE2 may be disposed on the fourth inorganic insulating layer 216. The second source electrode SE2 and the second drain electrode DE2 may be connected to the second semiconductor layer Act2. The second source electrode SE2 and the second drain electrode DE2 may be connected to the second semiconductor layer Act2 through the contact holes of the third inorganic insulating layer 215 and the contact holes of the fourth inorganic insulating layer 216, respectively.

[0160] The first source electrode SE1, the first drain electrode DE1, the second source electrode SE2, and the second drain electrode DE2 may include a material with good conductivity. The first source electrode SE1, the first drain electrode DE1, the second source electrode SE2, and the second drain electrode DE2 may include a conductive substance including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed as a multilayer or a single layer including the materials. As an embodiment, the first source electrode SE1, the first drain electrode DE1, the second source electrode SE2, and the second drain electrode DE2 may have a multilayer structure of Ti / Al / Ti.

[0161] The first thin film transistor TFT1 provided with the first semiconductor layer Act1 including a silicon semiconductor can have high reliability and can realize a high-quality display panel 10 by being adopted as a driving thin film transistor.

[0162] Since oxide semiconductors have high carrier mobility and low leakage current, the voltage drop can be small even if the driving time is long. That is, since the color change of the image according to the voltage drop is not large during low-frequency driving, low-frequency driving is possible. As described above, since oxide semiconductors have the advantage of less leakage current, it is possible to prevent leakage current and reduce power consumption by using oxide semiconductors in at least one of the other thin film transistors other than the driving thin film transistor. For example, the second thin film transistor TFT2 may be provided with a second semiconductor layer Act2 containing an oxide semiconductor.

[0163] The first organic insulating layer 217 may be arranged to cover the first source electrode SE1, the first drain electrode DE1, the second source electrode SE2, and the second drain electrode DE2. The first organic insulating layer 217 may include an organic substance. For example, the first organic insulating layer 217 may include an organic insulator such as a general-purpose polymer (such as polymethylmethacrylate (PMMA) or polystyrene (PS)), a polymer derivative having a phenol group, an acrylic polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorine polymer, a p-xylene polymer, a vinyl alcohol polymer, and a blend thereof.

[0164] The connection electrode CM may be disposed on the first organic insulating layer 217. The connection electrode CM may be connected to the first drain electrode DE1 or the first source electrode SE1 through a contact hole of the first organic insulating layer 217. The connection electrode CM may include a material with good conductivity. The connection electrode CM may include a conductive substance including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed as a multilayer or single layer including the materials. As an embodiment, the connection electrode CM may have a multilayer structure of Ti / Al / Ti.

[0165] The second organic insulating layer 218 and the third organic insulating layer 219 may be arranged on the connection electrode CM. The second organic insulating layer 218 and the third organic insulating layer 219 may include an organic substance. For example, at least one of the second organic insulating layer 218 and the third organic insulating layer 219 may include an organic insulator, such as a general-purpose polymer (such as polymethylmethacrylate (PMMA) or polystyrene (PS)), a polymer derivative having a phenolic group, an acrylic polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorine polymer, a p-xylene polymer, a vinyl alcohol polymer, and a blend thereof. Since the second organic insulating layer 218 and the third organic insulating layer 219 are stacked sequentially, the display element layer 220 may be arranged on the flat pixel circuit layer 210. In some embodiments, the third organic insulating layer 219 may be omitted.

[0166] The display element layer 220 may be arranged on the pixel circuit layer 210. The display element layer 220 may include a display element, for example, an organic light emitting diode OLED. A plurality of organic light emitting diodes OLED may be provided in the main area MA. That is, a plurality of organic light emitting diodes OLED may be arranged in the main area MA. The organic light emitting diode OLED may include a pixel electrode 221, a light emitting layer 223, an opposite electrode 225, and a pixel defining film 227.

[0167] The pixel electrode 221 may be disposed on the third organic insulating layer 219. The pixel electrode 221 may be connected to the connection electrode CM through the contact hole 218H of the second organic insulating layer 218 and the contact hole 219H of the third organic insulating layer 219. The pixel electrode 221 may include an indium tin oxide (ITO; indium tin oxide), indium zinc oxide (IZO; indium zinc oxide), zinc oxide (ZnO; zinc oxide), indium oxide (In 2 O 3 ; indium oxide), indium gallium oxide (IGO; indiumgallium oxide) or aluminum zinc oxide (AZO; aluminum zinc oxide). As another embodiment, the pixel electrode 221 may include a reflective film containing silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr) or a compound thereof. As yet another embodiment, the pixel electrode 221 may also include a reflective film made of ITO, IZO, ZnO or In on / under the aforementioned reflective film. 2 O 3 The film formed.

[0168] The pixel defining film 227 may be provided with an opening 227OP exposing at least a portion of the pixel electrode 221. The opening 227OP of the pixel defining film 227 may define a light emitting region ER of the organic light emitting diode OLED. For example, a minimum length 227OPd of the opening 227OP of the pixel defining film 227 defines the light emitting region ER of the organic light emitting diode OLED. The light emitting region ER of the organic light emitting diode OLED may mean a sub-pixel. In an embodiment, the pixel defining film 227 may be provided with a plurality of openings 227OP. The plurality of openings 227OP may define a plurality of light emitting regions ER of a plurality of organic light emitting diodes OLED.

[0169] The pixel defining film 227 may include an organic insulator. In another embodiment, the pixel defining film 227 may include an organic insulator such as silicon oxide (SiO X ), Silicon Nitride (SiN X ) or an inorganic insulator of silicon oxynitride (SiON). In yet another embodiment, the pixel defining film 227 may include an organic insulator and an inorganic insulator. In some embodiments, the pixel defining film 227 may include a light-shielding substance and may be set to black. The light-shielding substance may include carbon black, carbon nanotubes, a resin or paste containing a black dye, metal particles (e.g., nickel, aluminum, molybdenum and alloys thereof), metal oxide particles (e.g., chromium oxide), or metal nitride particles (e.g., chromium nitride), etc. In the case where the pixel defining film 227 includes a light-shielding substance, the external light reflection according to the metal structure arranged at the lower portion of the pixel defining film 227 can be reduced.

[0170] The light-emitting layer 223 may be arranged in the opening 227OP of the pixel defining film 227. The light-emitting layer 223 may include a polymer or low-molecular organic substance that emits a predetermined color. Although not shown, a first functional layer and a second functional layer may be arranged under and above the light-emitting layer 223, respectively. The first functional layer may include, for example, a hole transport layer (HTL: Hole Transport Layer), or may include a hole transport layer and a hole injection layer (HIL: Hole Injection Layer). The second functional layer is a constituent element arranged on the light-emitting layer 223, which is optional. The second functional layer may include an electron transport layer (ETL: Electron Transport Layer) and / or an electron injection layer (EIL: Electron Injection Layer). Similar to the relative electrode 225 to be described later, the first functional layer and / or the second functional layer may be a common layer formed to cover the substrate 100 as a whole.

[0171] The relative electrode 225 may be arranged on the light emitting layer 223. The relative electrode 225 may be composed of a conductive material with a low work function. For example, the relative electrode 225 may include a (semi) transparent layer containing silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca) or an alloy thereof. Alternatively, the relative electrode 225 may also include a (semi) transparent layer containing the aforementioned substances such as ITO, IZO, ZnO or In 2 O 3 In some embodiments, a capping layer (not shown) may be further disposed on the counter electrode 225. The capping layer may include LiF, inorganic matter, or / and organic matter.

[0172] The encapsulation layer 300 may be disposed on the display element layer 220. The encapsulation layer 300 may protect the display element layer 220. In one embodiment, the encapsulation layer 300 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. The at least one inorganic encapsulation layer may include aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O 5 ), zinc oxide (ZnO), silicon oxide (SiO X ), Silicon Nitride (SiN X ), silicon oxynitride (SiO X N Y ). At least one organic encapsulation layer may include a polymer-based substance. As a polymer-based material, it may include acrylic resin, epoxy resin, polyimide and polyethylene, etc. As an embodiment, at least one organic encapsulation layer may include acrylate. In an embodiment, the encapsulation layer 300 may include a first inorganic encapsulation layer 310, an organic encapsulation layer 320 and a second inorganic encapsulation layer 330 stacked sequentially.

[0173] For the convenience of explanation, the above description is based on a display device provided with an organic light emitting diode as a display element. However, the embodiments of the present invention are applicable to various display devices such as a liquid crystal display device, an electrophoretic display device, and an inorganic EL display device.

[0174] The display device according to the embodiment of the present invention can be implemented as an electronic device such as a smart phone, a mobile phone, a smart watch, a navigation device, a game console, a TV, a head unit for a vehicle, a notebook computer, a laptop computer, a tablet computer, a personal media player (PMP; Personal Media Player), a personal digital assistant (PDA; Personal Digital Assistants), etc. In addition, the electronic device can be a flexible device.

[0175] As mentioned above, although the present invention is described with reference to an embodiment shown in the drawings, this is only exemplary, and a person skilled in the art will understand that various modifications and variations of the embodiments can be made therefrom. Therefore, the true protection scope of the present invention should be defined by the technical ideas of the attached claims.

Claims

1. A display device, comprising: A display panel, wherein the display panel defines a folding area and a non-folding area; a first plate, the first plate being arranged on one surface of the display panel and comprising a first area corresponding to the folding area of ​​the display panel and a second area corresponding to the non-folding area of ​​the display panel; as well as a cover layer disposed between the first plate and the display panel and in direct contact with at least a portion of the first plate, The first region of the first plate includes a plurality of slits having a length in a first direction parallel to a folding axis of the folding region and at least a portion of which is covered by the covering layer, A width of the plurality of slits in a second direction perpendicular to the first direction is less than 100 um.

2. The display device according to claim 1, further comprising: An upper adhesive layer is disposed between the first plate and the display panel to be in direct contact with the first plate.

3. The display device according to claim 2, wherein: The upper adhesive layer includes an upper opening corresponding to the first area, The cover layer has a thickness smaller than that of the upper adhesive layer.

4. The display device according to claim 2, wherein: The depth of the plurality of slits is less than the thickness of the second region of the first plate.

5. The display device according to claim 1, further comprising: a second plate disposed at a lower portion of the first plate; as well as A lower adhesive layer is disposed between the first plate and the second plate and includes a lower opening corresponding to the first area.

6. The display device according to claim 1, wherein: The covering layer comprises: A plurality of covering patterns extend in the second direction perpendicular to the first direction and are arranged at intervals along the first direction.

7. A method for manufacturing a display device, comprising the following steps: forming a display panel, wherein the display panel defines a folding area and a non-folding area; as well as forming a first plate, the first plate being arranged on one surface of the display panel and including a first area corresponding to the folding area of ​​the display panel and a second area corresponding to the non-folding area of ​​the display panel, The step of forming the first plate comprises the following steps: forming a plurality of slits having a first preliminary width in the first region; forming a cover layer on the plurality of slits; and Heat is applied to the cover layer to shrink the plurality of slits to have a first width that is smaller than the first preliminary width.

8. The method for manufacturing a display device according to claim 7, wherein: The heat applied to the cover layer is 60° C. or higher and 170° C. or lower.

9. The method for manufacturing a display device according to claim 7, wherein: A difference between the first preliminary width and the first width is greater than or equal to 20 um and less than or equal to 200 um.

10. The method for manufacturing a display device according to claim 7, wherein: The first width is less than 50 um.

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