Substrate manufacturing method

Abstract

A substrate manufacturing method includes: attaching a protective film having an adhesive layer formed on one surface thereof to a substrate; providing an etching solution on the substrate attached with the protective film; forming a first planar portion, an inclined portion, and a second planar portion by changing a reaction surface area between the etchant and the substrate by peeling off an end portion of the protective film; and removing the protective film.

Description

Technical Field

[0001] The invention relates to a method for manufacturing a substrate. Background Art

[0002] With the development of display technology in recent years, foldable displays, rollable displays, stretchable displays, etc. have been developed.

[0003] In particular, foldable glass is known as a display material mainly used for smartphones and other electronic devices in recent years. It can be folded or unfolded, thereby improving portability, convenience and durability.

[0004] To make foldable glass, a process is usually required to etch the glass into different thicknesses.

[0005] In addition, foldable glass needs basic physical properties, that is, it basically meets the folding characteristics, the screen does not deform, and it has sufficient strength under repeated contact with a stylus, etc. and a predetermined pressure. Summary of the invention

[0006] Technical issues

[0007] The technical problem of the present invention is to provide a method for manufacturing a substrate in a cover glass that can be installed in electronic devices such as mobile devices and tablet computers, wherein a flat portion and an inclined portion are formed on the substrate by setting different thicknesses.

[0008] Technical Solution

[0009] According to an embodiment of the present invention, a substrate manufacturing method may include: attaching a protective film having an adhesive layer formed on one side to a substrate; providing an etching solution on the substrate to which the protective film is attached; forming a planar portion and an inclined portion by peeling off ends of the protective film; and removing the protective film.

[0010] According to an embodiment of the present invention, a substrate manufacturing method may include: a first step of placing a protective plate on the surface of a substrate to cover a first area of ​​the substrate surface with the protective plate; and a second step of reacting the substrate and the etching liquid by providing the etching liquid to a second area, wherein the second area is an area of ​​the surface of the substrate other than the first area, wherein in the second step, the reaction surface area between the surfaces of the substrate can be changed by moving the protective plate on the surface of the substrate.

[0011] According to an embodiment of the present invention, a substrate manufacturing method may include: a first step of placing a plurality of protective plates on the surface of a substrate to cover a plurality of first areas on the surface of the substrate; and a second step of reacting the substrate and the etching liquid by providing the etching liquid to a second area, wherein the second area is the remaining area except the plurality of first areas, wherein in the second step, the reaction surface area between the etching liquid and the surface of the substrate can be changed by moving at least a portion of the plurality of protective plates on the surface of the substrate.

[0012] Beneficial Effects

[0013] According to an embodiment of the present invention, the amount of etching liquid provided to the substrate can be adjusted by changing the adhesive force of the protective film adhesive layer attached to the substrate, thereby adjusting the etching degree of the substrate.

[0014] According to an embodiment of the present invention, the flow rate and direction of the etching solution can be adjusted by using a liquid control unit that adjusts the flow rate and direction of the etching solution, thereby adjusting the etching degree of the substrate.

[0015] According to an embodiment of the present invention, a holding part can be used to peel off the end of the protective film and control the peeling speed of the end, thereby adjusting the etching degree of the substrate and finally achieving the desired angle and width of the inclined part.

[0016] According to an embodiment of the present invention, a stripping control unit can be used to control the stripping speed of the end of the protective film, thereby adjusting the etching degree of the substrate and finally achieving the desired angle and width of the inclined portion.

[0017] According to an embodiment of the present invention, the protection plate can be provided to the first region of the substrate. In addition, the protection plate can be separated or moved by the protection plate control unit. Thus, the reaction surface area between the etching solution and the substrate can be changed.

[0018] According to an embodiment of the present invention, the etching of the substrate can be adjusted by using a chemical liquid injection unit, wherein the chemical liquid injection unit adjusts the temperature, injection intensity and injection direction of the etching liquid.

[0019] According to an embodiment of the present invention, the shape of the inclined portion, the first plane portion and / or the second plane portion formed on the substrate can be changed by controlling the separation speed and the moving speed of the protection plate, thereby achieving the desired angle and width of the inclined portion.

[0020] Reference numerals

[0021] Figure 1 is a perspective view of an etched substrate according to one embodiment of the present invention.

[0022] Figure 2 It corresponds to Figure 1 A cross-sectional view of the etched substrate along line AA'.

[0023] Figure 3 is a flow chart of a method for manufacturing a substrate according to some embodiments of the present invention.

[0024] FIG. 4A to FIG. 4E It is shown in sequence according to Figure 3 A cross-sectional view of a substrate manufacturing method.

[0025] FIG. 5A to FIG. 5H The invention discloses a cross-sectional view of the angle formed by the inclined portion and the second planar portion in a substrate that can be manufactured according to the present invention (which varies depending on the separation distance and peeling speed of the protective film), the inclined portion, the first planar portion, and the shape of the second planar portion.

[0026] Figure 6 is Figure 3 A cross-sectional view of the protective film stripping step including a stripping control unit based on the protective film stripping step.

[0027] Fig. 6A is a perspective view of a stick that may be included in a peel control portion of the present invention.

[0028] Figure 6B is a perspective view of a squeezer that may be included in a peel control portion of the present invention.

[0029] Figure 7 is a cross-sectional view of foldable glass that may be formed according to one embodiment of the present invention.

[0030] Figure 8 It is a cross-sectional view of an embodiment including a chemical solution control unit and a holding unit in the protective film peeling step of the present invention.

[0031] Fig. 9 It is a cross-sectional view of an embodiment of the protective film peeling step of the present invention, which includes a liquid medicine control unit, a holding unit, and a peeling control unit.

[0032] Fig.10 is a flow chart of a method for manufacturing a substrate according to some embodiments of the present invention.

[0033] FIG. 11A to FIG. 11D It is shown in sequence according to Fig.10 A cross-sectional view of a substrate manufacturing method.

[0034] FIG. 12A to FIG. 12F The cross-sectional view shows the angle formed by the inclined portion and the second planar portion in the substrate that can be manufactured according to the present invention (which varies depending on the moving speed and separation distance of the protection plate), the first planar portion, the inclined portion, and the shape of the second planar portion.

[0035] Fig.13 is shown in the DR2-DR3 plane Fig. 11C Floor plan.

[0036] Fig.14A and Fig. 14B It is a cross-sectional view of an embodiment of an etching groove, a protection plate and a chemical solution injection part in the protection plate moving step of the present invention.

[0037] Fig.15 It is a plan view showing an embodiment of the present invention including an etching groove, a protection plate and a chemical solution injection unit in the protection plate moving step S14 ′ in the DR2 - DR3 plane.

[0038] Description of reference numerals:

[0039] 1: Etched substrate;

[0040] 110: substrate;

[0041] 110a: first area;

[0042] 110b: second area;

[0043] 111: Foldable substrate;

[0044] 113: first page;

[0045] 115: Side 2;

[0046] P1: first plane part;

[0047] S: inclined part;

[0048] P2: second plane part;

[0049] F: foldable portion (inclined portion + second plane portion + inclined portion);

[0050] TH1: thickness of the first plane portion;

[0051] TH2: thickness of the second plane portion;

[0052] WD, WD': width of the inclined part;

[0053] Θ, Θ': angles formed by the inclined portion and the top surface of the second planar portion;

[0054] 130: protective film coated with adhesive;

[0055] 131: adhesive layer;

[0056] 210: liquid medicine control unit (pharmaceutical spray nozzle + chamber base + motor);

[0057] 211: Pharmaceutical spray nozzle;

[0058] 212: Chamber;

[0059] 213: Chamber base;

[0060] 215: Motor;

[0061] 217: Etching liquid;

[0062] 310: gripping part;

[0063] 410: stripping control unit;

[0064] 411: stick;

[0065] 413: Extruder;

[0066] 510: Etching groove;

[0067] 610: protection plate;

[0068] 710: Liquid spraying unit. DETAILED DESCRIPTION

[0069] The present disclosure may be modified in various ways and in various forms, and specific embodiments are shown in the accompanying drawings and described in detail below. However, this is not intended to limit the present disclosure to a specific disclosed form, and should be understood to include all changes, equivalents, and substitutes within the technical concept and technical scope of the present disclosure.

[0070] The present invention relates to a method for manufacturing a substrate, and more particularly to a method for manufacturing a substrate formed with different thicknesses, the substrate being capable of being used as a cover glass that can be mounted on electronic devices such as mobile devices and tablet computers.

[0071] Hereinafter, preferred embodiments of the present invention are described in detail with reference to the accompanying drawings.

[0072] Figure 1 is a perspective view of an etched substrate 1 according to an embodiment of the present invention. Figure 2 It corresponds to Figure 1 FIG. 1 is a cross-sectional view of the etched substrate 1 along line AA'.

[0073] Hereinafter, for convenience of description, the shape of the etched substrate 1 is first described, and then the etching method for manufacturing the substrate is described.

[0074] Reference Figure 1 and Figure 2Due to the etching process, the thickness of the two side portions of the etched substrate 1 may be different. The thickness of one side portion of the etched substrate 1 may be greater than the thickness of the other side portion, and may have a slope between the two side portions. The etched substrate 1 may include a first surface 113 and a second surface 115 opposite to each other. The etched substrate 1 according to an embodiment of the present invention may be in the shape of a rectangular parallelepiped. In addition, the raw material of the etched substrate 1 is glass, but is not limited thereto. For example, silicon may be used as a raw material to produce the etched substrate 1.

[0075] The etched substrate 1 may include a first plane portion P1, an inclined portion S, and / or a second plane portion P2 on the first face 113 and / or the second face 115. For ease of description, the shape and manufacturing method of the etched substrate 1 are described below. The etched substrate 1 includes the first plane portion P1, the inclined portion S, and / or the second plane portion P2 on the first face 113.

[0076] The first plane portion P1 may refer to a region having a relatively large thickness among the regions having a planar shape on the first surface 113 of the etched substrate 1. The first plane portion P1 may be located at a side portion that is not etched in the first surface 113 of the etched substrate 1. In addition, the first plane portion P1 may be located beside the inclined portion S. The thickness of the first plane portion P1 may be relatively greater than the thickness of the second plane portion P2.

[0077] The inclined portion S may refer to a region having a slope on the first surface 113 of the etched substrate 1. The inclined portion S may be located between the first plane portion P1 and the second plane portion P2 on the first surface 113 of the etched substrate 1. In addition, the angle formed by the top surface of the inclined portion S and the second plane portion P2 may be θ, θ' may be an acute angle.

[0078] The second plane portion P2 may refer to a region having a relatively large thickness among the regions having a planar shape on the first surface 113 of the etched substrate 1. The second plane portion P2 may be located on one side of the etched first surface 113 of the etched substrate 1. In addition, the second plane portion P2 may be located on the side of the inclined portion S. The thickness of the second plane portion P2 may be relatively smaller than the thickness of the first plane portion P1.

[0079] The cross-sections of the first plane portion, the second plane portion, and the inclined portion are shown as straight lines, but this is only for description and is not limited to this. In one embodiment of the present invention, at least a portion of the cross-sections of the first plane portion, the second plane portion, and the inclined portion can be formed as a curve. In addition, a portion of the first plane portion, the second plane portion, and the inclined portion can be omitted. For example, one side of the substrate can be composed of the inclined portion alone, or only of the first plane portion and the inclined portion. In addition, the one side of the substrate is composed of only the second plane portion and the inclined portion, without the first plane portion.

[0080] According to the etching position of the substrate, the first plane portion P1 may exist on both sides of the first surface 113 of the substrate, and the inclined portion S, the second plane portion P2, and the inclined portion S region may exist side by side therebetween, which will be described later. The etched substrate having such a shape is easily folded in the region where the inclined portion and the second plane portion are formed, and in view of this, it is hereinafter referred to as a foldable substrate 111.

[0081] In addition, in the foldable substrate 111 , the inclined portion S and the second planar portion P2 that may exist side by side on the first surface 113 , and the inclined portion S are collectively referred to as a foldable portion F.

[0082] In the etched substrate 1 that can be manufactured according to the present invention, the thickness TH1 of the first plane portion may have various values. For example, the thickness TH1 of the first plane portion P1 may be about 30 μm to about 500 μm, about 40 μm to about 300 μm, or about 50 μm to about 200 μm.

[0083] In the etched substrate 1 that can be manufactured according to the present invention, the widths WD and WD' of the inclined portion can have various values. For example, the widths WD and WD' of the inclined portion can be about 0.5 mm to about 30 mm.

[0084] In the etched substrate 1 that can be manufactured according to the present invention, the angles θ and θ' formed by the top surface of the inclined portion and the second planar portion can have various values. For example, the angles θ and θ' formed by the top surface of the inclined portion and the second planar portion can be about 0.3° to about 10°.

[0085] In the etched substrate 1 that can be manufactured according to the present invention, the thickness TH2 of the second plane portion may have various values, for example, the thickness TH2 of the second plane portion may be about 10 μm to about 100 μm, about 20 μm to about 80 μm, or about 30 μm to about 70 μm.

[0086] Figure 3 is a flow chart of a substrate manufacturing method according to some embodiments of the present invention, FIG. 4A to FIG. 4E It is shown in sequence according to Figure 3Slope diagram of the substrate manufacturing method.

[0087] The following describes in detail Figure 3 The steps of the substrate manufacturing method.

[0088] Describe in turn according to Figure 3 The steps of the method for manufacturing the substrate may include a glass substrate preparing step S11, a protective film attaching step S12 coated with an adhesive, an etching solution providing step S13, and a protective film stripping step S14.

[0089] Reference Figure 4A In the glass substrate preparing step S11 , a substrate 100 in an unetched state may be prepared.

[0090] In an embodiment of the present invention, the substrate 110 may have a rectangular parallelepiped shape, but is not limited thereto. For example, it may have a cylindrical shape.

[0091] In addition, the substrate 110 may be made of glass, but is not limited thereto. For example, the substrate 110 may be made of silicon or rubber.

[0092] The substrate 110 is etched through the above-mentioned processes to manufacture an etched substrate 1. As mentioned above, the etched substrate 1 may be made of glass as a raw material, but is not limited thereto.

[0093] Reference Figure 4B In the protective film with adhesive layer attached step S12 , an adhesive layer 131 may be formed on one side of the protective film 130 , and then the protective film 130 with adhesive layer is attached to the first side 113 of the substrate 110 .

[0094] The adhesive layer 131 may refer to a layer on which one side of the protective film is coated with an adhesive layer. The adhesive layer 131 may be located between one side of the protective film and the first side of the substrate. The adhesive layer 131 may provide a function of attaching the protective film 130 to the substrate 110. Thus, the adhesive layer 131 may be composed of a substance that can attach the substrate 110 and the protective film 130. The adhesive layer 131 may be composed of a substance that is not etched by the etching solution 217. The method for forming the adhesive layer 131 is not limited. For example, an adhesive may be applied or an adhesive tape may be attached.

[0095] In addition, the peeling speed of the end of the protective film 130 can be controlled according to the adhesive force of the adhesive layer 131. For example, when the adhesive force of the adhesive layer 131 is high, the peeling speed when the same force is applied to the end of the protective film 130 may be relatively slow, and on the contrary, when the adhesive force of the adhesive layer 131 is low, the peeling speed when the same force is applied to the end of the protective film 130 may be relatively fast.

[0096] The protective film 130 may be attached to the first surface of the substrate 110. The protective film 130 may have the same rectangular parallelepiped shape as the substrate 110. The protective film 130 may prevent the glass substrate from being etched by the etching solution 217. The etching solution 217 may be composed of a substance having the property of etching the substrate 110. Therefore, the protective film 130 may be composed of a substance that is not etched by the etching solution 217. For example, the protective film 130 may have acid resistance.

[0097] Reference Figure 4C In the etching solution providing step S13, the substrate 110 after the protective film attaching step S12 is placed in the chamber 212. At this time, the etching solution 217 can be provided to the substrate 110 in the chamber 212 by the chemical solution control unit 210.

[0098] The etching liquid 217 can etch the substrate 110. Although not shown in the drawings, the etching liquid 217 can be stored in an etching liquid storage unit. The etching liquid storage unit can be connected to the pharmaceutical spray nozzle 211 through another line. The position of the etching liquid storage unit is not limited. For example, the etching liquid storage unit can be located in an external space other than the chamber 212 and the chamber base 213.

[0099] The etching liquid 217 can be provided to the substrate 110 in various forms. For example, the etching liquid 217 can be provided to the substrate 110 through the pharmaceutical spray nozzle 211. In addition, the etching liquid 217 provided through the pharmaceutical spray nozzle 211 can be stored in the chamber 212. Thus, the substrate 110 can be impregnated with the etching liquid 217 stored in the chamber 212.

[0100] When the etching solution 217 is provided, the substrate 110 can be etched. The etching solution 217 can be composed of a substance that etches the properties of the substrate 110. For example, it is assumed that the material of the substrate 110 is glass. At this time, the etching solution 217 can contain fluoride salts, sulfates, nitrates, hydrofluoric acid, sulfuric acid and / or nitric acid. At this time, the etching solution 217 can be acidic. Glass can be etched by an acidic solution. The etching solution 217 can play a role in etching the substrate 110. The protective film 130 and the adhesive layer 131 can be composed of a substance that is acid-resistant (for example, quartz or plastic). Therefore, the portion of the substrate 110 to which the protective film 130 is attached can not be etched by the acidic etching solution 217. In addition, the portion of the first surface 113 of the substrate 110 where the first surface 11 is peeled off and the portion of the substrate 110 to which the protective film 130 is not attached can be exposed to the etching solution 217 and etched by the etching solution 217. Through such a selective etching process, an inclined portion S and a second planar portion P2 may be formed on the substrate 110 .

[0101] The drug liquid control unit 210 may include a drug injection nozzle 211 , a chamber 212 , a chamber base 213 , and a motor 215 .

[0102] The medicine spray nozzle 211 may be a nozzle for spraying the etching solution 217. The medicine spray nozzle 211 may be located on the side of the substrate 110 or above the first surface 113. Figure 4C In another embodiment of the present invention, the number of the pharmaceutical spray nozzles 211 is different from that shown in the drawings, for example, 1 or 3 or more pharmaceutical spray nozzles 211 may be located on the side surface or above the first surface of the substrate 110.

[0103] The pharmaceutical spray nozzle 211 can provide the etching solution 217 to the first surface 113 of the substrate 110 by a spraying method.

[0104] In addition, the pharmaceutical spray nozzle 211 can adjust the spray intensity and spray direction of the etching liquid 217, so that the flow rate and direction of the etching liquid 217 can be adjusted, and the pharmaceutical spray nozzle 211 can control the etching degree of the substrate 110. For example, in the pharmaceutical spray nozzle 211, when the spray intensity of the etching liquid 217 is increased, the flow rate of the etching liquid 217 can be increased, and the amount of the etching liquid 217 per unit time provided to the substrate 110 can be increased. At this time, the etching level of the substrate 110 can be increased.

[0105] The chamber 212 can provide a space for etching a glass substrate. The chamber 212 can be located above the chamber base 213. The chamber can be provided in a form in which one side (e.g., the upper side) is open or in a form in which all sides are closed. The substrate 110 to be etched and the configuration required for etching the substrate 110 can be provided to the chamber. For example, a protective film 130, an adhesive layer 131, a substrate 110, an etching liquid 217, a pharmaceutical spray nozzle 211, and a holding portion 310 can be provided to the chamber, and according to an embodiment of the present invention, a peeling control portion 410 can be further provided on this basis.

[0106] The chamber base 213 may be a supporting container for supporting the chamber 212. The chamber base 213 may be connected to the bottom surface of the chamber 212.

[0107] like Figure 4C As shown by the arrow in , the chamber base 213 can vibrate the chamber 212 by moving in a first direction DR1 perpendicular to the ground and in the opposite direction of the first direction DR1. In this way, the degree to which the etching liquid 217 is provided to the substrate 110 can be changed, and the slurry formed on the substrate 110 during the etching process can be removed. In this way, the etching degree of the substrate 110 can be adjusted, and more uniform etching can be performed. According to an embodiment of the present invention, the movement direction of the chamber base 213 is the first direction DR1 and the opposite direction of the first direction DR1, but is not limited thereto. For example, the chamber 212 can be vibrated by moving in a second direction DR2 or in the opposite direction of the second direction DR2.

[0108] The motor 215 may be a control device for controlling the spraying and / or movement of the pharmaceutical spray nozzle 211. The motor 215 may be connected to the chamber base 213 and the pharmaceutical spray nozzle 211.

[0109] The motor 215 can provide power to the medicine spray nozzle 211 by driving. Therefore, the height, direction and / or spray speed of the medicine spray nozzle 211 can be adjusted, thereby adjusting the flow rate and direction of the etching solution 217.

[0110] Reference Figure 4B In the protective film stripping step S14, the end of the protective film 130 can be held by the holding part 310. The holding part 310 can strip the protective film 130 in a first direction DR1 perpendicular to the ground. After the protective film 130 is stripped, the etching solution 217 provided by the liquid control part 210 can be exposed to a part or all of the first surface 113 of the substrate 110. Thus, the etched substrate 1 is formed by etching the substrate 110.

[0111] The holding portion 310 may hold an end portion of the protection film 130 and may separate the end portion of the protection film 130 .

[0112] The handle 310 can be driven in the chamber 212. The handle can be located in any space inside or outside the chamber 212.

[0113] The holding portion 310 may have an end portion opposite to the protective film 130. The end portion of the holding portion contacts the top surface of the protective film, thereby holding the end portion of the protective film 130. The holding portion 310 moves in a first direction DR1 perpendicular to the ground to peel off the protective film 130 in the first direction DR1, thereby separating the end portion of the protective film 130 from the first surface 113 of the substrate.

[0114] In addition, although not shown in the handle 310, the moving speed or moving direction of the handle 310 can be controlled by equipping it with another power device such as a motor. Figure 4D As shown by the middle arrow, by controlling the moving speed of the holding portion in the first direction DR1, the speed at which the protective film 130 is peeled off from the first surface 113 of the substrate 110 can be controlled. Thus, the separation speed of the end of the protective film 130 can be controlled.

[0115] However, the moving direction of the grip portion 310 is not necessarily limited to Figure 4D The direction of the arrow shown in the figure can also be controlled in other directions. For example, the protective film 130 can be peeled off by moving the gripping portion 310 in a direction forming an acute angle with the ground.

[0116] In addition, although not shown in the holding portion 310, the holding portion 310 can be easily held by providing another holding guide substrate. For example, by attaching another holding guide substrate to the holding position of the holding portion, the protective film can be held to the desired holding position in accordance with the holding guide substrate.

[0117] Figure 4E It is a cross-sectional view of the etched substrate 1 after the protective film removal step S15 in the present invention.

[0118] Reference Figure 4E In the protective film removing step S15 , the protective film 130 attached to the etched substrate 1 may be removed.

[0119] In addition, after a series of steps of the manufacturing method according to the present invention, chemical strengthening of the etched substrate can be performed. For example, when the etched substrate is glass, chemical strengthening can be performed by immersing the substrate in a molten salt bath, that is, replacing the metal cations in the glass substrate with larger metal cations, wherein the molten salt bath contains metal cations greater than the metal cations in the glass substrate. At this time, compression strength (CS) may be generated in the glass substrate. Therefore, the strength of the glass substrate to external impact can be improved.

[0120] FIG. 5A to FIG. 5H It is a cross-sectional view of the angle θ formed by the inclined portion S and the second plane portion P2 in the substrate that can be produced according to the present invention (which varies depending on the separation distance and peeling speed of the protective film), the inclined portion, the first plane portion, and the shape of the second plane portion.

[0121] According to an embodiment of the present invention, when the separation distance of the protective film 130 changes, the surface area of ​​the substrate 10 exposed to the etching liquid 217 changes, and thus the etching degree on the substrate 100 may change. At this time, the width WD of the inclined portion S formed on the substrate 110 may change. For example, when the separation distance of the protective film 130 increases, the surface area of ​​the substrate 110 provided with the etching liquid 217 in the separation portion of the protective film 130 increases. That is, the area etched on the substrate 110 may increase. Therefore, the width WD of the inclined portion formed on the substrate 110 may increase. On the contrary, when the separation distance of the protective film 130 decreases, the surface area of ​​the substrate 110 provided with the etching liquid 217 in the separation portion of the protective film 130 decreases. That is, the area etched on the substrate 110 may decrease. Therefore, the width of the inclined portion formed on the substrate 110 may decrease.

[0122] When the peeling speed of the protective film 130 changes, the protective film 130 is peeled off in the first direction DR1 perpendicular to the ground, and the amount of the etching solution 217 provided to the substrate 110 may be different, so that the etching degree on the substrate 110 may change. At this time, the angle θ formed by the inclined portion S and the second plane portion P2 formed on the substrate 110 may change. For example, when the peeling speed of the protective film 130 is fast, the time interval for each portion of the substrate 110 exposed to the etching solution 217 due to the separation of the protective film 130 is shortened. As a result, uniform etching can be achieved, and the angle formed by the inclined portion S and the second plane portion P2 formed on the substrate 110 may be reduced. In addition, when the peeling speed of the protective film 130 is slow, the time interval for each portion of the substrate 110 exposed to the etching solution 217 due to the separation of the protective film 130 is increased. As a result, uneven etching is formed, and the angle formed by the inclined portion S and the second plane portion P2 formed on the substrate 110 may be enlarged.

[0123] Figure 5A , 5C 5E and 5G are cross-sectional views of peeling speeds V0, V1, V2, V3 and separation distances H0, H1, H2, H3 of the protective film in the substrate that can be manufactured according to the present invention.

[0124] Figure 5B Is set to Figure 5A A cross-sectional view of the etched substrate 1 that can be formed when the peeling speed V0 and the separation distance H0 are .

[0125] Figure 5D Is set to Figure 5C A cross-sectional view of the etched substrate 1 that can be formed when the peeling speed V1 and the separation distance H1 are .

[0126] Fig. 5F Is set to Figure 5E A cross-sectional view of the etched substrate 1 that can be formed when the peeling speed V2 and the separation distance H2 are .

[0127] Figure 5H Is set to Figure 5G A cross-sectional view of the etched substrate 1 that can be formed when the peeling speed V3 and the separation distance H3 are .

[0128] As described above, the angle formed by the inclined portion S and the second planar portion P2 may be affected by the peeling speed of the protective film 130. For example, as the peeling speed of the protective film 130 increases, the angle formed by the inclined portion and the second planar portion may decrease.

[0129] As described above, the width of the inclined portion can be affected by the separation distance of the protective film 130. For example, as the separation distance of the protective film 130 increases, the width of the inclined portion can increase.

[0130] When comparing Figure 5A , 5C , 5E and the peeling speed and separation distance of the protective film 130 shown in 5G, V1 < V2 < V3 < V4 and / or H0 < H1 < H2 < H3.

[0131] When comparing Figure 5A , 5C , 5E and the widths of the inclined portions formed on the protective film 130 shown in 5G, WD0 < WD1 < WD2 < WD3. Therefore, as the separation distance of the protective film 130 increases, the width of the inclined portion can increase.

[0132] When comparing Figure 5B , 5D , 5F and the angles formed by the inclined portion S and the second planar portion P2 shown in 5H, Θ0 > Θ1 > Θ2 > Θ3. Therefore, as the peeling speed of the protective film 130 increases, the slope of the inclined portion S gradually becomes gentler.

[0133] The present invention utilizes this principle to control the peeling speed and separation distance of the protective film 130 by moving in the first direction DR1 of the holding portion 310 and the opposite direction of the first direction DR1, thereby controlling the etching degree of the substrate 110. Thus, by etching the substrate 110, the etched substrate 1 having different thicknesses on both sides can be formed.

[0134] In an embodiment of the present invention, by etching the substrate 110 by the above method, an etched substrate 1 having different thicknesses in each region can be produced.

[0135] In an embodiment of the present invention, the peeling control unit 410 can be utilized in the protective film peeling step S14.

[0136] Figure 6 is a cross-sectional view of the protective film peeling step S14 including the peeling control unit 410 based on the protective film peeling step S14 of the present invention.

[0137] The peeling control unit 410 is a device for controlling the peeling of the protective film 130. Specifically, in the protective film peeling step S14 of the present invention, it is a device for controlling the separation when the protective film 130 is peeled by the movement of the holding portion 310.

[0138] The peeling control part 410 may contact the top surface of the protective film 130. The peeling control part 410 may press the separation part of the protective film 130 by applying force in the opposite direction of the first direction DR1 perpendicular to the ground. Thus, the separation distance and the peeling speed of the protective film may be controlled in the peeling step S14 of the protective film.

[0139] In addition, the peeling control unit 410 may be located on the protective film 130 and move in a second direction DR2 parallel to the ground or in a direction opposite to the second direction DR2. Thus, the separation of the protective film 130 may be controlled in accordance with the separation distance and the peeling speed. For example, it is assumed that the etched substrate 1 is manufactured by etching the substrate 110. At this time, the protective film 130 may be peeled in the first direction DR1 by the holding unit 310, while the peeling control unit 410 moves in a direction opposite to the second direction DR2. In this way, the separation may be controlled in accordance with the separation distance of the protective film 130.

[0140] Fig. 6A 4 is a perspective view of a stick 411 that can be used as a peeling control unit 410 in the present invention. The stick 411 can be located on the protective film 130, and can apply force in the opposite direction of a first direction DR1 perpendicular to the ground by rolling, so as to press the separation portion of the protective film 130. In addition, the stick 411 can simultaneously move in a second direction DR2 parallel to the ground or in the opposite direction of the second direction DR2, so as to control the separation in accordance with the separation distance of the protective film 130.

[0141] Figure 6B 4 is a perspective view of a squeezer 413 that can be used as a peeling control unit 410 in the present invention. The squeezer 413 can be located on the protective film 130 and apply force to the protective film 130 in the opposite direction of the first direction DR1 perpendicular to the ground, thereby pressing the separation portion of the protective film. In addition, the squeezer 413 can move in parallel in the second direction DR2 or in the opposite direction of the second direction DR2 at the same time, thereby controlling the separation according to the separation distance of the protective film 130.

[0142] according to Fig. 6A or Figure 6B The peeling control unit 410 may be composed of a stick or a squeezer, but this is only one embodiment of the peeling control unit 410 and is not limited thereto.

[0143] According to an embodiment of the present invention, a method for manufacturing a substrate having different thicknesses in each region may be used to manufacture the foldable substrate 111 .

[0144] Figure 7is a cross-sectional view of a foldable substrate 111 that can be formed according to an embodiment of the present invention. In the foldable substrate 111 , the foldable portion F can be formed at any portion of the first surface of the foldable substrate 111 .

[0145] The raw material of the foldable substrate 111 is glass, but is not limited thereto. For example, silicon can be used as the raw material to manufacture the foldable substrate 111 .

[0146] The following describes the foldable glass that can be manufactured according to an embodiment of the present invention.

[0147] The foldable glass may refer to a foldable cover glass. The foldable glass may include planar portions on both sides of one side thereof, and include an inclined portion and a second planar portion having different thicknesses between the planar portions on both sides.

[0148] Foldable glass requires basic physical properties, namely, it must basically meet the folding characteristics, the screen must not deform, and it must have sufficient strength under repeated contact with a stylus, etc. and constant pressure.

[0149] In order to meet the strength characteristics of such foldable glass, the thickness of the glass should be greater than or equal to a predetermined thickness, and in order to meet the folding characteristics, the thickness of the glass should be less than or equal to a predetermined thickness. Therefore, a manufacturing method is needed to form an optimal glass thickness and structure, wherein the glass meets the strength characteristics and folding characteristics without screen distortion.

[0150] In the foldable substrate 111 that can be manufactured according to the present invention, the thickness TH1 of the first planar portion may have various values. For example, the thickness TH1 of the first planar portion P1 may be about 30 μm to about 500 μm, about 40 μm to about 300 μm, or about 50 μm to about 200 μm.

[0151] In the foldable substrate 111 that can be manufactured according to the present invention, the width WD of the inclined portion may have various values. For example, the width WD of the inclined portion may be about 0.5 mm to about 30 mm.

[0152] In the foldable substrate 111 that can be manufactured according to the present invention, the angle θ formed by the top surface of the inclined portion and the second planar portion can have various values. For example, the angle θ formed by the top surface of the inclined portion and the second planar portion can be about 0.3° to about 10°.

[0153] In the foldable substrate 111 that can be manufactured according to the present invention, the thickness TH2 of the second planar portion may have various values, for example, the thickness TH2 of the second planar portion may be about 10 μm to about 100 μm, about 20 μm to about 80 μm, or about 30 μm to about 70 μm.

[0154] According to an embodiment of the present invention, a foldable substrate 111 having a thickness that satisfies both folding characteristics and strength characteristics can be manufactured. In addition, the foldable substrate 111 can maintain product performance while being bent. Therefore, in the process of manufacturing a thin substrate 110, the damage problem caused by cracking can be improved.

[0155] As the width of the inclined portion of the glass substrate decreases or the angle between the inclined portion and the second planar portion increases, the boundary line of the planar portion and the inclined portion and the degree of light reflection in the inclined portion may increase. Ultimately, the visibility of the glass substrate may deteriorate.

[0156] The foldable substrate 111 manufactured by an embodiment of the present invention can form a foldable portion F having a desired shape. That is, the width of the inclined portion S can be expanded, and the angle between the inclined portion S and the second plane portion P2 can be reduced. Thus, the visibility of the reflective surface in the inclined portion S can be improved, and the visibility of the screen distortion or boundary portion can be minimized.

[0157] Figure 8 It is a cross-sectional view of an embodiment in the protective film peeling step S14 of the present invention, which includes a liquid control unit 210 and a holding unit 310, and forms a foldable portion F on a portion of the substrate by holding both side portions of the protective film 130 and then peeling it.

[0158] according to Figure 8 In the embodiment of the present invention, the etching solution 217 can be provided to the substrate 110 by the chemical solution control unit 210. At this time, the two side portions of the protective film 130 attached to the substrate 110 can also be held by the holding unit 310. The protective film 130 can be peeled off in the first direction DR1 by the holding unit 310. By moving the holding unit 310 in the first direction DR1 and in the opposite direction of the first direction DR1, the peeling speed and the separation distance can be adjusted.

[0159] Figure 8 The arrows shown in the figure respectively indicate the vibration direction of the liquid medicine control unit 210 and the moving direction of the gripping unit 310, and each vibration speed and moving speed may be the same or different. However, the vibration direction of the liquid medicine control unit 210 and the moving direction of the gripping unit 310 are not necessarily limited to Figure 8 The direction of the arrow shown in the figure can also be controlled in other directions. For example, the protective film 130 can be peeled off by moving the gripping portion 310 in a direction forming an acute angle with the ground.

[0160] according to Figure 8 In the embodiment of the present invention, a foldable portion F may be formed on a portion of the substrate 110. Thus, a foldable substrate 111 having a foldable portion F having a desired shape may be manufactured.

[0161] pass Figure 8 The foldable portion F having a desired shape can be formed on the foldable substrate 111 manufactured according to the embodiment. Thus, the visibility of the reflective surface in the inclined portion S can be improved, and the visibility of the screen distortion or boundary portion can be minimized.

[0162] Fig. 9 is Figure 8 The cross-sectional view of an embodiment of the peeling control unit 410 is further included.

[0163] according to Fig. 9 In the embodiment of the present invention, the etching solution 217 can be provided to the substrate 110 by the chemical solution control unit 210. In addition, the two side portions of the protective film 130 attached to the substrate 110 can be held by the holding unit 310. The protective film 130 can be peeled off in the first direction DR1 by the holding unit 310. At the same time, the protective film 130 can be forced in the second direction DR2 and the opposite direction of the second direction DR2 by the peeling control unit 410. In this way, the peeling speed and separation distance of the protective film 130 can be adjusted.

[0164] Fig. 9 The arrows shown in the figure respectively indicate the vibration direction of the liquid medicine control unit 210, the moving direction of the gripping unit 310, and the moving direction of the peeling control unit 410, and each vibration speed and moving speed may be the same or different. However, the vibration direction of the liquid medicine control unit 210, the moving direction of the gripping unit 310, and the moving direction of the peeling control unit 410 are not necessarily limited to Fig. 9 The peeling speed and separation distance of the protective film 130 can be adjusted by moving the peeling control unit 410 in a direction that forms an acute angle with the ground.

[0165] according to Fig. 9 In the embodiment of the present invention, a foldable portion F may be formed on a portion of the substrate 110. Thus, a foldable substrate 111 having a foldable portion F having a desired shape may be manufactured.

[0166] pass Fig. 9 The foldable portion F having a desired shape can be formed on the foldable substrate 111 manufactured according to the embodiment. Thus, the visibility of the reflective surface in the inclined portion S can be improved, and the visibility of the screen distortion or boundary portion can be minimized.

[0167] Fig. 9 and Figure 8 The difference lies in whether there is a peeling control unit 410, thereby adjusting the peeling speed and separation distance. Fig. 9 Shows more beneficial effects.

[0168] Fig.10 is a flow chart of a substrate manufacturing method according to some embodiments of the present invention, FIG. 11A to FIG. 11D It is shown in sequence according to Fig.10 A cross-sectional view of a substrate manufacturing method.

[0169] According to FIG. 4A to FIG. 4E The manufacturing method is similar to that of FIG. 11A to FIG. 11D The substrate manufacturing method can obtain an etched substrate 1. The shape of the etched substrate 1 is as described above, and the following is a detailed description of the Fig.10 For ease of explanation, the following is mainly described. Figure 3 In addition, for the sake of convenience, the manufacturing method of the substrate in which the first surface 113 is etched is described, but it is not limited thereto. For example, the etched substrate 1 can be manufactured by etching the second surface 115 or the side surface of the substrate.

[0170] according to Fig.10 The steps of the substrate manufacturing method include, in sequence, a glass substrate preparing step S11', a protection plate introducing step S12', an etching liquid providing step S13', a protection plate moving step S14', and a protection plate removing step S15'.

[0171] Reference Figure 4A In the glass substrate preparing step S11 ′, a substrate 100 in an unetched state may be prepared.

[0172] Reference Fig.11A In the protection plate introducing step S12 ′, the substrate 110 may be placed in the etching groove 510 . Then, the protection plate 610 may be introduced onto the first surface 113 of the substrate 110 .

[0173] The first area 110a on the first surface 113 of the substrate 110 may be covered by the protection plate 610. Thus, the first surface 113 of the substrate 110 may be defined as the first area 110a covered by the protection plate 610 and the second area 110b not covered by the protection plate 610.

[0174] Fig.11A The characteristics of the middle substrate 110 can be Figure 4A The corresponding features of the middle substrate 110 are the same / similar.

[0175] The etching groove 510 can provide a space to perform etching on the substrate 110. The etching groove 510 can be provided in a form in which one side (for example, the upper side) is open or in a form in which all sides are closed. The substrate 110 to be etched and the components required for etching the substrate 110 can be provided in the etching groove 510. For example, the substrate 110, the etching solution 217, the protection plate 610, and the liquid injection unit 710 can be provided in the etching groove 510.

[0176] The protection plate 610 may be located on the first surface 113 of the substrate 110. The protection plate 610 may have the same rectangular parallelepiped shape as the substrate 110. The protection plate 610 may prevent the substrate 110 from being etched by the etching liquid 217. The protection plate 610 may include a substance that is not etched by the etching liquid 217. For example, the protection plate 610 may include an acid-resistant substance (e.g., quartz or plastic).

[0177] Another control unit (not shown) may be connected to a portion of the protection plate 610. The control unit (not shown) may be driven to move or separate the protection plate 610. For example, the protection plate 610 may be introduced onto the first surface 113 of the substrate 110 by driving the control unit (not shown).

[0178] Reference Fig. 11B In the etching solution providing step S13', the etching solution 217 may be provided to the second region 110b of the substrate 110. The second region 110b of the substrate 110 may react with the etching solution 217. On the contrary, the etching solution 217 may not be provided to the first region 110a of the substrate 110 covered by the protection plate 610.

[0179] The etching liquid 217 can etch the substrate 110 by reacting with the substrate 110. The etching liquid 217 can be composed of a substance that has the property of etching the substrate 110. Other characteristics of the etching liquid 217 can be the same as those corresponding to Figure 4C The characteristics of the etching solution 217 are the same / similar.

[0180] The etching liquid 217 can be provided to the substrate 110 in various forms. For example, the etching liquid can be stored in another etching liquid storage part (not shown) and provided to the etching tank 510 through another line (not shown). Thus, the substrate 110 can be immersed in the etching liquid 217 provided to the etching tank 510.

[0181] In addition, the etching liquid 217 may be provided to the substrate 110 by a liquid injection unit 710. The liquid injection unit 710 is a device that can inject the etching liquid 217. The liquid injection unit 710 may be located above or at the side of the first surface 113 of the substrate 110.

[0182] The liquid injection unit 710 can adjust the temperature, injection intensity and / or injection direction of the etching liquid 217, thereby adjusting the injection pressure, injection speed and / or injection position of the etching liquid 217. Thus, the liquid injection unit 710 can adjust the etching degree of the substrate 110. For example, in the liquid injection unit 710, when the injection intensity of the etching liquid 217 is increased, the injection speed of the etching liquid 217 can be increased, and the amount of the etching liquid 217 per unit time provided to the substrate 110 can be increased. At this time, the etching level of the substrate 110 can be increased.

[0183] Reference FIG. 11C to FIG. 11D In the protection plate moving step S14', the protection plate 610 may be separated in a first direction DR1 perpendicular to the substrate 110 or in a direction opposite to the first direction DR1, or the protection plate 610 may be moved in a second direction DR2 parallel to the substrate 110 or in a direction opposite to the second direction DR2. The separation of the protection plate 610 and / or the movement of the protection plate 610 may be performed by driving a protection plate control unit (not shown). In addition, the protection plate control unit (not shown) may control the speed of the separation and / or movement of the protection plate 610.

[0184] The direction of the separation and the movement is not necessarily limited to Fig. 11C and Fig.11D The protection plate 610 may be moved in the direction of the arrow shown in the figure, or in other directions. For example, the protection plate 610 may be moved in the direction forming an acute angle with the ground.

[0185] Thus, the areas of the first region 110a and the second region 110b of the substrate 110 can be changed, and the reaction surface area between the etching liquid 217 and the substrate 110 can be changed. Therefore, the first plane portion P1, the inclined portion S and / or the second plane portion P2 can be formed on the substrate 110. After the etching of the substrate 110 is terminated, an etched substrate 1 can be manufactured.

[0186] In the protection plate removing step S15', the protection plate 610 located on the etched substrate 1 can be removed from the etched substrate 1. Thus, the etched substrate 1 can be finally obtained.

[0187] In addition, after a series of steps of the manufacturing method according to the present invention, a chemical strengthening process of the etched substrate 1 may be performed. The chemical strengthening process may be FIG. 4A to FIG. 4E The chemical strengthening process performed after the above-mentioned manufacturing method is the same / similar.

[0188] By following Figure 3 The substrate manufacturing method can simplify the manufacturing process of the etched substrate 1 and improve productivity. In addition, the manufacturing cost of the etched substrate 1 can be reduced by simplifying the process.

[0189] FIG. 12A to FIG. 12F The angle θ' formed by the inclined portion and the second planar portion in the substrate that can be manufactured according to the present invention (which varies depending on the moving speed and separation distance of the protection plate), and the cross-sectional view of the shapes of the first planar portion, the inclined portion, and the second planar portion.

[0190] According to an embodiment of the present invention, when the separation distance H' of the protective plate 610 changes, the surface area of ​​the substrate 10 exposed to the etching solution 217 changes, and thus the etching degree on the substrate 100 may change. At this time, the width WD' of the inclined portion S formed on the substrate 110 may change. For example, if the separation distance H' of the protective plate 610 increases, the surface area of ​​the substrate 110 to which the etchant 217 is supplied from the spaced portion of the protective plate 610 may increase.

[0191] That is, the area etched on the substrate 110 may be increased. Therefore, the width WD' of the inclined portion formed on the substrate 110 may be increased. In contrast, when the separation distance H' of the protection plate 610 is reduced, the surface area of ​​the substrate 110 to which the etching liquid 217 is provided in the separation portion of the protection plate 610 may be reduced. That is, the area etched on the substrate 110 may be reduced. Therefore, the width WD' of the inclined portion S formed on the substrate 110 may be reduced.

[0192] When the moving speed V' of the protection plate 610 changes, as the protection plate 610 moves in the second direction DR2 parallel to the ground or in the opposite direction of the second direction DR2, the amount of the etching liquid 217 provided to the substrate 110 may be different, and thus the etching degree on the substrate 100 may change. At this time, the angle θ formed by the inclined portion S and the second plane portion P2 formed on the substrate 110 may change. For example, when the moving speed V' of the protection plate 610 is fast, the time interval for each portion of the substrate 110 exposed to the etching liquid 217 due to the movement of the protection plate 610 to be exposed to the etching liquid 217 can be shortened. Thus, uniform etching can be achieved, and thus the angle θ' formed by the inclined portion S and the second plane portion P2 formed on the substrate 110 may be reduced. In addition, when the moving speed V' of the protection plate 610 is slow, the time interval for each portion of the substrate 110 exposed to the etching liquid 217 due to the movement of the protection plate 610 to be exposed to the etching liquid 217 can be increased. Thus, non-uniform etching may be formed, and the angle θ′ formed by the inclined portion S formed on the substrate 110 and the second planar portion P2 may increase.

[0193] Fig. 12A , 12C 12E are cross-sectional views of the moving speeds V0', V1', V2', and the separation distances H0', H1', ​​H2' of the protection plate 610 in the etched substrate that can be manufactured according to the present invention.

[0194] Fig. 12B Is set to Fig. 12A A cross-sectional view of the etched substrate 1 that can be formed when the moving speed V0' and the separation distance H0' are .

[0195] Fig.12D Is set to Fig. 12C A cross-sectional view of the etched substrate 1 that can be formed when the moving speed V1' and the separation distance H1' are .

[0196] Fig.12F Is set to Fig.12E A cross-sectional view of the etched substrate 1 that can be formed when the moving speed V2' and the separation distance H2' are .

[0197] As described above, the angle formed by the inclined portion S and the second planar portion P2 may be affected by the moving speed V' of the protection plate 610. For example, as the moving speed V' of the protection plate 610 increases, the angle θ formed by the inclined portion and the second planar portion may decrease.

[0198] As described above, the width WD' of the inclined portion may be affected by the separation distance H' of the protection plate 610. For example, as the separation distance H' of the protection plate 610 increases, the width WD' of the inclined portion may increase.

[0199] When comparing Fig. 12A 、 12C and the moving speed and separation distance of the protection plate 610 shown in 12E, V0’ < V1’ < V2' and H0’ < H1’ < H2’.

[0200] When comparing Fig. 12A 、 12C and the width of the inclined portion formed on the protection plate 610 shown in 12E, WD0’ < WD1’ < WD2’. Therefore, as the separation distance of the protection plate 610 increases, the width of the inclined portion can increase.

[0201] When comparing Fig. 12B 、 12D and the angle formed by the inclined portion S and the second planar portion P2 shown in 12F, Θ0’ > Θ1’ > Θ2’. Therefore, as the moving speed of the protection plate 610 increases, the slope of the inclined portion S can gradually become gentler.

[0202] The present invention utilizes this principle. By separating the protection plate 610 in the first direction DR1 and the opposite direction of the first direction DR1, and moving in the second direction DR2 and the opposite direction of the second direction DR2, the separation distance and moving speed of the protection plate 610 can be controlled. Thereby, the etching degree of the substrate 110 can be adjusted, and the etched substrate 1 with different thicknesses on both sides can be formed.

[0203] In an embodiment of the present invention, by etching the substrate 110 through the above method, an etched substrate 1 with different thicknesses in each region can be produced.

[0204] Fig.13 is a plan view shown in the DR2 - DR3 plane Fig. 11C of.

[0205] Referring to Fig.13 , in the protection plate moving step S14’, the protection plate 610 can be moved in the second direction DR2 or the opposite direction of the second direction DR2. By the movement of the protection plate 610, the area of the second region 110b of the substrate 110 can be adjusted. Thereby, the etching solution 217 can be provided onto the second region 110b of the substrate 110. As the area of the second region 110b is adjusted, the reaction surface area between the etching solution 217 and the surface of the substrate 110 can change, and the etching of the substrate 110 can be achieved. The shape of the first planar portion P1, the inclined portion S, and / or the second planar portion P2 that can be formed by the etching of the substrate 110 can change.

[0206] Fig.14A and Fig. 14BIt is a cross-sectional view of an embodiment including an etching groove, a protection plate and a chemical solution spraying part in the protection plate moving step S14 ′ of the present invention.

[0207] Reference Fig.14A and Fig. 14B The substrate 110 may be located inside the etching groove 510 . A plurality of protection plates 610 may be located on the plurality of first regions 110 a of the substrate 110 .

[0208] The etching liquid 217 may be provided on the second regions 110 b of the plurality of substrates 110 . The second regions 110 b may be the remaining regions except for the plurality of first regions 110 a covered with the plurality of protection plates 610 in the first surface 113 of the substrate 110 .

[0209] As described above, the etching liquid 217 may be provided to the substrate 110 in various forms. For example, the etching liquid 217 may be provided to the second region 110 b of the substrate 110 through the chemical liquid injection unit 710 .

[0210] The plurality of protection plates 610 may be separated in a first direction DR1 perpendicular to the substrate 110 or in a direction opposite to the first direction DR1, or may be moved in a second direction DR2 parallel to the substrate 110 or in a direction opposite to the second direction DR2. The separation of the plurality of protection plates 610 and / or the movement of the plurality of protection plates 610 may be performed by driving a protection plate control unit (not shown). In addition, the protection plate control unit (not shown) may control the speed of the separation and / or movement of the plurality of protection plates 610.

[0211] The direction of the separation and the movement is not necessarily limited to Fig.14A and Fig. 14B The arrow direction shown in the figure can also be controlled in other directions. For example, the plurality of protection plates 610 can be moved in a direction forming an acute angle with the ground.

[0212] The separation direction and the separation speed and the moving direction and the moving speed of each of the plurality of protection plates 610 may be different. That is, the movement and the separation of each of the plurality of protection plates 610 may be performed independently.

[0213] By the movement and separation of the plurality of protection plates 610, the area of ​​the second region 110b in the first face 113 of the substrate 110 can be adjusted. As the area of ​​the second region 110b is adjusted, the reaction surface area between the etching liquid 217 and the surface of the substrate 110 can be changed, and etching of the substrate 110 can be achieved. The shapes of the first plane portion P1, the inclined portion S, and / or the second plane portion P2 that can be formed by etching the substrate 110 can be changed.

[0214] Through this process, the foldable portion F may be formed on a portion of the substrate 110 , thereby manufacturing the foldable substrate 111 formed with the foldable portion F having a desired shape.

[0215] Fig.15 It is a plan view showing an embodiment of the present invention including an etching groove, a protection plate and a chemical solution injection unit in the protection plate moving step S14 ′ in the DR2 - DR3 plane.

[0216] Reference Fig.15 , the plurality of substrates 110 may be located inside the etching groove 510. The plurality of protection plates 610 may be located on the plurality of first regions 110a of the plurality of substrates 110. Parts of the plurality of protection plates 610 may respectively cover the plurality of first regions 110a.

[0217] The etching liquid 217 may be provided on the second regions 110b of the substrates 110. The second regions 110b may be the remaining regions except the first regions 110a covered with the protection plates 610 in the first surface 113 of the substrates 110.

[0218] As described above, the etching liquid 217 may be provided to the second regions 110 b of the substrates 110 in various forms. For example, the etching liquid 217 may be provided to the second regions 110 b of the substrates 110 by the chemical liquid spraying unit 710 .

[0219] The etching liquid 217 may be provided to at least a portion of the plurality of substrates 110 . The temperature, the injection speed and / or the injection direction of the etching liquid 217 may be adjusted by the liquid injection unit 710 , so that the etching liquid 217 may be provided to a portion of the plurality of substrates 110 .

[0220] At least a portion of the plurality of protection plates 610 may be separated in a first direction DR1 perpendicular to the substrate 110 or in a direction opposite to the first direction DR1, or at least a portion of the plurality of protection plates 610 may be moved in a second direction DR2 parallel to the substrate 110 or in a direction opposite to the second direction DR2. The separation of at least a portion of the plurality of protection plates 610 and / or the movement of at least a portion of the plurality of protection plates 610 may be performed by driving a protection plate control unit (not shown). In addition, the protection plate control unit (not shown) may control the speed of the separation and / or movement of at least a portion of the plurality of protection plates 610.

[0221] The separation direction (arrows not shown) and the moving direction are not necessarily limited to Fig.15 The arrow direction shown in the figure can also be controlled in other directions. For example, the plurality of protection plates 610 can be moved in a direction forming an acute angle with the ground.

[0222] The separation direction and the separation speed and the moving direction and the moving speed of each of the plurality of protection plates 610 may be different. That is, the movement and the separation of each of the plurality of protection plates 610 may be performed independently.

[0223] The rest of the manufacturing method is FIG. 14A to FIG. 14B The manufacturing method is the same / similar to that described in .

[0224] Through such a process, the foldable portion F may be formed on a portion of the plurality of substrates 110 , thereby manufacturing a plurality of foldable substrates 111 formed with the foldable portion F having a desired shape.

[0225] In the plurality of foldable substrates 111, visibility of the reflective surface in the inclined portion S can be improved, and visibility of screen distortion or boundary portions can be minimized.

[0226] The preferred embodiments of the present invention have been described above, and those skilled in the art will appreciate that various modifications and changes may be made to the present invention without departing from the concept and technical scope of the present invention as described in the claims.

[0227] Therefore, the technical scope of the present invention is not limited by the detailed description but depends on the claims.

Claims

1. A method for manufacturing a substrate, comprising: A protective film having an adhesive layer formed on one side is attached to the substrate; Providing an etching solution on the substrate with the protective film attached thereto; By peeling off the end of the protective film, the reaction surface area between the etching solution and the substrate is changed, thereby forming a first plane portion, an inclined portion, and a second plane portion; as well as The protective film is removed.

2. The method for manufacturing a substrate according to claim 1, wherein: In the protective film, the separation speed of the end portion thereof is controlled according to the adhesive force of the adhesive layer.

3. The substrate manufacturing method according to claim 1, wherein: The protective film is acid-resistant.

4. The method for manufacturing a substrate according to claim 1, comprising: The flow rate and direction of the etching solution are controlled by a liquid control unit.

5. The method for manufacturing a substrate according to claim 4, wherein: The liquid medicine control unit includes at least one of a chamber base or an etching liquid medicine jet nozzle.

6. The method for manufacturing a substrate according to claim 1, comprising: The end of the protective film is gripped by a gripping portion, and a force is applied in a first direction perpendicular to the one surface of the substrate to separate the end of the protective film from the one surface of the substrate.

7. The method for manufacturing a substrate according to claim 6, wherein: The holding portion adjusts the angle of the inclined portion by controlling a peeling speed of an end portion of the protective film.

8. The method for manufacturing a substrate according to claim 1, comprising: The peeling control part contacts the top surface of the protective film and applies pressure in a direction opposite to a first direction perpendicular to one surface of the substrate when peeling off the end of the protective film.

9. The method for manufacturing a substrate according to claim 8, wherein: The peeling control part includes any one of a roller and a squeezer.

10. A method for manufacturing a substrate, comprising: In a first step, a protective plate is placed on the surface of the substrate to cover a first area of ​​the surface of the substrate; as well as In a second step, the etching solution is provided to a second region so that the substrate and the etching solution react, wherein the second region is a region of the surface of the substrate other than the first region. Wherein, in the second step, the reaction surface area between the surfaces of the substrates is changed by moving the protection plate on the surfaces of the substrates.

11. The method for manufacturing a substrate according to claim 10, wherein: The second step includes a process of separating the protection plate from the surface of the substrate in a first direction perpendicular to the substrate or in a direction opposite to the first direction.

12. The method for manufacturing a substrate according to claim 11, wherein: The separation speed of the protection plate is controlled.

13. The method for manufacturing a substrate according to claim 10, wherein: The second step includes a process of moving the protection plate in a second direction parallel to the substrate or in a direction opposite to the second direction.

14. The method for manufacturing a substrate according to claim 13, wherein: The moving speed of the protection plate is controlled.

15. The method for manufacturing a substrate according to claim 10, wherein: The protection plate includes an acid-resistant substance.

16. The method for manufacturing a substrate according to claim 10, comprising: The temperature, spraying speed and / or spraying direction of the etching solution are adjusted by the chemical solution spraying unit.

17. A method for manufacturing a substrate, comprising: In a first step, a plurality of protective plates are placed on the surface of the substrate, thereby covering a plurality of first areas on the surface of the substrate; as well as In a second step, the etching solution is provided to a second region so that the substrate and the etching solution react with each other, wherein the second region is the remaining region except the plurality of first regions. Wherein, in the second step, the reaction surface area between the etching liquid and the surface of the substrate is changed by moving at least a part of the plurality of protection plates on the surface of the substrate.

18. The method for manufacturing a substrate according to claim 17, comprising: A process of separating at least a portion of the plurality of protection plates in a first direction perpendicular to the substrate or in a direction opposite to the first direction; and / or A process of moving at least a portion of the plurality of protection plates in a second direction parallel to the substrate or in a direction opposite to the second direction.

19. The method for manufacturing a substrate according to claim 17, comprising: The temperature, spraying speed and / or spraying direction of the etching solution are adjusted by the chemical solution spraying unit.

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