Wafer memory

Abstract

The invention relates to a wafer storage device which comprises a storage bin, a carrying device, a plurality of temporary storage tables and a switching mechanism. The storage bin comprises a side wall provided with a window. The carrying device is rotatably arranged in the storage bin around a main axis and used for carrying the wafer box. The multiple temporary storage tables are arranged in the storage bin and located between the window and the carrying device. The wafer box can be placed on any temporary storage table from the outside through the window, and the wafer box on any temporary storage table can be taken out through the window. The switching mechanism is used for switching the temporary storage tables between the first state and the second state. In the first state, the plurality of temporary storage tables are arranged at intervals along a linear direction, so that the distances from the plurality of temporary storage tables to the window are equal, and an operator can conveniently access the wafer box through the window. And in the second state, the multiple temporary storage tables are arranged at intervals in the direction around the main axis, and the distances from the temporary storage tables to the main axis are equal, so that the moving path of the carrying device during carrying of the wafer box can be reduced, and the carrying efficiency is improved.

Description

Technical Field

[0001] The present disclosure relates to the field of semiconductor manufacturing equipment, and in particular, to a chip memory. Background Art

[0002] In semiconductor manufacturing systems, wafers are loaded into wafer boxes, which are usually temporarily stored in wafer storage devices. The wafer storage device is also equipped with a handling device for automatically picking and placing the wafer boxes.

[0003] However, during the storage and retrieval operation of the wafer box, the handling device needs to be precisely aligned according to the position of each wafer box. This means that the equipment must be repositioned and adjusted every time it is handled, which not only increases the complexity of the operation, but also prolongs the time required for handling, resulting in a decrease in the efficiency of the handling process. Therefore, there is a need to improve the handling efficiency of the wafer box in the wafer storage and shorten the handling time. Summary of the invention

[0004] In view of this, the present disclosure provides a wafer storage device, aiming to improve the handling efficiency of wafer boxes in the wafer storage device.

[0005] The chip storage device provided by the present disclosure includes a storage bin, a handling device, a plurality of temporary storage tables and a switching mechanism. The storage bin includes a side wall provided with a window. The handling device is rotatably arranged in the storage bin around a main axis for carrying a chip box. A plurality of temporary storage tables are arranged in the storage bin and are located between the window and the handling device. The chip box can be placed on any temporary storage table from the outside through the window, and the chip box on any temporary storage table can be taken out through the window. The switching mechanism is used to switch the plurality of temporary storage tables between a first state and a second state. In the first state, the plurality of temporary storage tables are arranged at intervals in a straight line direction, so that the distances from the plurality of temporary storage tables to the window are equal. In the second state, the plurality of temporary storage tables are arranged at intervals in a direction around the main axis, and the distances from the main axis are equal.

[0006] In the first state, the operator can access the wafer boxes on the multiple temporary storage tables through the window. In the second state, the multiple temporary storage tables are arranged in a spaced manner around the main axis, so the handling device can continuously handle the wafer boxes on each temporary storage table by rotating around the main axis. In addition, since the distances from the multiple temporary storage tables to the main axis are equal, when handling wafer boxes on different temporary storage tables, the handling device does not need to change its distance to each temporary storage table, so the moving path of the handling device can be reduced, thereby improving the handling efficiency.

[0007] In a possible implementation, in the first state, each temporary storage table faces a plane that is parallel to both the straight line direction and the extension direction of the main axis; and / or, in the second state, each temporary storage table faces the main axis.

[0008] In the first state, the operator only needs to face the window to ensure that he faces each temporary storage table. In this way, the operator can store and retrieve the wafer box horizontally without rotating or adjusting the position of the wafer box, thereby improving the efficiency of storing and retrieving the wafer box. In the second state, after rotating around the main axis to face the temporary storage table, the handling device moves in a straight line to contact and remove the wafer box on the temporary storage table. In this way, the moving path of the handling device can be effectively reduced, thereby improving the handling efficiency.

[0009] In a possible implementation, the plurality of temporary storage tables include a central temporary storage table and two side temporary storage tables, the central temporary storage table is aligned with the main axis in a straight line direction, and the two side temporary storage tables are respectively located on opposite sides of the central temporary storage table in the straight line direction. As the plurality of temporary storage tables are switched from the first state to the second state, the central temporary storage table is fixed relative to the main axis, and the two side temporary storage tables move closer to the main axis.

[0010] When the middle temporary storage table is aligned with the main axis in the straight line direction, the position of the middle temporary storage table remains unchanged regardless of whether the multiple temporary storage tables are in the first state or the second state. In this way, the middle temporary storage table is set to be fixed relative to the main axis, and the states of the multiple temporary storage tables are changed only by moving the two side temporary storage tables closer to the main axis, which can reduce the number of components required for moving the temporary storage tables, thereby reducing the complexity of the structure.

[0011] In a possible implementation, the switching mechanism includes two connecting parts, and the two connecting parts are respectively connected to the two lateral temporary storage tables. As the multiple temporary storage tables switch between the first state and the second state, each connecting part moves along an arc trajectory with the lateral temporary storage table connected thereto to change the position and orientation of the lateral temporary storage table relative to the main axis.

[0012] Due to the anti-rotation connection with the connecting part, the lateral temporary storage table can face the main axis after moving along the arc trajectory with the connecting part. In other words, when the lateral temporary storage table is anti-rotationally connected with the connecting part, the movement of the connecting part can simultaneously change the position and orientation of the lateral temporary storage table relative to the main axis.

[0013] In a possible implementation, the switching mechanism includes two drive assemblies, the two drive assemblies are used to drive two side temporary storage tables respectively, each drive assembly includes a movable arm and a driver, the first end of the movable arm is rotatably supported around a first rotation axis and its second end forms a corresponding connection portion, the first end of the driver is rotatably supported around a second rotation axis and its second end is rotatably connected to the second end of the movable arm, the first rotation axis and the second rotation axis are both parallel to the main axis, and the first rotation axis and the second rotation axis are spaced apart from each other. The driver is telescopic to drive the movable arm to rotate around the first rotation axis.

[0014] According to the above implementation, as the driver is extended and retracted, the second end of the driver will drive the second end of the movable arm to rotate around the first rotation axis, thereby changing the position of the side temporary storage table.

[0015] In a possible implementation, the chip storage device also includes a support base, which includes a support platform and two recesses on opposite sides of the support platform in a straight line direction, the middle temporary storage table is located on the support platform, and the two side temporary storage tables are respectively located above the two recesses and at the same height as the middle temporary storage table, the first end of the movable arm and the first end of the driver are both connected to the bottom of the support platform, and the second end of the movable arm and the second end of the driver extend into a corresponding recess, so that the second end of the movable arm is connected to the side temporary storage table in the recess.

[0016] According to the above structure, the movable arm and the driver are placed at the bottom of the support platform and in the two recesses, which helps to improve the space utilization of the support seat. In addition, the multiple temporary storage tables are located at the same height, so that the handling device can carry the wafer boxes on the multiple temporary storage tables at the same height, avoiding the height adjustment of the handling device, thereby effectively reducing the moving path of the handling device.

[0017] In a possible implementation, the wafer storage further includes a plurality of storage tables, the plurality of storage tables are used to place wafer boxes, and each of the plurality of storage tables and the plurality of temporary storage tables is equidistant from the main axis.

[0018] According to the above implementation, when the wafer box is transported between the temporary storage station and the storage station, the transport device does not need to adjust its distance to the temporary storage station or the storage station, thereby reducing the moving path of the transport device and improving the transport efficiency.

[0019] In a possible implementation, the plurality of storage tables are supported on the side wall, and the plurality of storage tables are located above or below the plurality of temporary storage tables.

[0020] The plurality of storage tables and the plurality of temporary storage tables are all located between the side wall and the transport device. In other words, the plurality of storage tables and the plurality of temporary storage tables are all located on the same side of the transport device. This enables the transport device to transport the wafer box between the temporary storage table and the storage table without having to rotate to the other side, thereby effectively reducing the moving path of the transport device.

[0021] In a possible implementation, the plurality of temporary storage stations include N temporary storage stations, the plurality of storage stations include N columns of storage stations, and the N columns of storage stations correspond to the N temporary storage stations respectively. In the second state, the orthographic projections of each column of storage stations and the corresponding temporary storage station on a plane perpendicular to the main axis coincide.

[0022] According to the above implementation, in the second state, when the transport device transports the wafer box between each row of storage stations and the corresponding temporary storage station, it only needs to move in the height direction without changing the horizontal position. This can effectively reduce the moving path of the transport device, thereby improving the transport efficiency.

[0023] The present disclosure also provides a chip storage device, including a storage bin, a handling device, a plurality of temporary storage tables and a switching mechanism. The storage bin includes a side wall provided with a window. The handling device is rotatably arranged in the storage bin around a main axis, and is used to carry a chip box. A plurality of temporary storage tables are arranged in the storage bin, and are located between the window and the handling device. A chip box can be placed on any temporary storage table from the outside through the window, and the chip box on any temporary storage table can be taken out through the window. The switching mechanism is used to move at least one of the plurality of temporary storage tables to switch the plurality of temporary storage tables between a first state and a second state. In the first state, each temporary storage table is opposite to a plane parallel to both the straight line direction and the extension direction of the main axis. In the second state, each temporary storage table is opposite to the main axis.

[0024] In the first state, the operator only needs to face the window to ensure that he is facing each temporary storage table. In this way, the operator can store and retrieve the wafer box horizontally without rotating or adjusting the position of the wafer box, thereby improving the efficiency of storing and retrieving the wafer box. In the second state, the handling device can continuously transport the wafer box on each temporary storage table by rotating around the main axis. Furthermore, after rotating around the main axis to face the temporary storage table, the handling device can move in a straight line to contact and remove the wafer box on the temporary storage table, thereby effectively reducing the moving path of the handling device. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments are briefly introduced below.

[0026] It should be understood that the following drawings only illustrate certain embodiments of the present disclosure and should not be viewed as limiting the scope.

[0027] It should also be understood that the same or similar reference numerals are used in the drawings to represent the same or similar elements.

[0028] It should also be understood that the drawings are merely schematic and that the sizes and proportions of elements in the drawings are not necessarily accurate.

[0029] Figure 1 It is a schematic diagram of an application scenario of a chip memory provided according to an embodiment of the present disclosure.

[0030] Figure 2 yes Figure 1 Schematic diagram of the structure of the chip memory.

[0031] Figure 3yes Figure 2 Schematic diagram of the structure of a part of .

[0032] Figure 4 yes Figure 2 Schematic diagram of the structure of the medium handling device.

[0033] Figure 5 yes Figure 2 Schematic diagram of the structure of the wafer box.

[0034] Figure 6 yes Figure 2 Schematic diagram of the switching mechanism of the chip memory

[0035] Fig. 7A and Figure 7B yes Figure 2 A schematic top view of the temporary storage station of the chip memory in FIG. Fig. 7A The temporary storage station is in the first state. Figure 7B The temporary storage station is in the second state.

[0036] Figure 8 yes Figure 2 Schematic diagram of the structure of the support base of the chip storage.

[0037] Fig. 9A and Fig. 9B is a schematic top view of a temporary storage platform of a wafer storage device provided according to another embodiment of the present disclosure, Fig. 9A The temporary storage station is in the first state. Fig. 9B The temporary storage station is in the second state. DETAILED DESCRIPTION

[0038] The following is an exemplary description of the embodiments of the present disclosure in conjunction with the accompanying drawings. It should be understood that the present disclosure can be implemented in a variety of ways and should not be construed as being limited to the embodiments described here. The embodiments described here are only for a more thorough and clear understanding of the present disclosure.

[0039] Figure 1 shows a wafer manufacturing system, see Figure 1 , the wafer manufacturing system includes a wafer storage 100, a wafer transport device 200 and a processing area 300. The wafer storage 100 is used to store wafer boxes. The wafer transport device 200 is used to transport wafer boxes to the wafer storage 100. As an example, the wafer transport device 200 can circulate along the path shown by the dotted line in the figure, and stop when passing through the wafer storage 100, and the operator (or automated handling equipment) stores the wafer box in the wafer storage 100. One side of the wafer storage 100 faces the movement path of the wafer transport device 200, and the other side faces the processing area 300. The wafer storage 100 can store multiple wafer boxes, and the wafers in the wafer boxes can be loaded into the processing area 300 for processing.

[0040] In order to ensure a smooth and efficient manufacturing process, the wafer storage 100 needs to continuously transport wafers to the processing area 300. This requires that the wafer box in the wafer storage 100 needs to be frequently moved to load the wafers in the wafer box into the processing area 300. Therefore, there is a need to improve the transportation efficiency of the wafer box in the wafer storage.

[0041] In view of this, refer to Figure 2 and Figure 3 The present disclosure provides a wafer storage device 100, which includes a storage bin 10, a handling device 20, a wafer box 30, and a plurality of temporary storage tables 40. The storage bin 10 includes a side wall 11 provided with a window 12. The handling device 20 is rotatably disposed in the storage bin 10 around a main axis AA, and is used to carry the wafer box 30. A plurality of temporary storage tables are disposed in the storage bin 10, and are located between the window 12 and the handling device 20. The wafer box 30 can be placed on any temporary storage table 40 from the outside through the window 12, and the wafer box 30 on any temporary storage table 40 can be taken out through the window 12. Figure 6 The chip storage device 100 further includes a switching mechanism 50, which is used to switch the plurality of temporary storage stations 40 between the first state and the second state. Fig. 7A In the first state, the plurality of temporary storage tables 40 are arranged in a spaced relationship along a straight line BB, so that the distances from the plurality of temporary storage tables 40 to the window 12 are equal. Figure 7B In the second state, the plurality of temporary storage tables 40 are arranged at intervals along a direction around the main axis AA, and the distances from the main axis AA are equal.

[0042] In the first state, the operator can access the wafer boxes 30 on the plurality of temporary tables 40 through the window 12. In the second state, the plurality of temporary tables 40 are arranged at intervals in the direction around the main axis AA, so the handling device 20 can continuously handle the wafer boxes 30 on each temporary table 40 by rotating around the main axis AA. In addition, since the distances from the plurality of temporary tables 40 to the main axis AA are equal, when handling the wafer boxes 30 on different temporary tables 40, the handling device 20 does not need to change its distance to each temporary table 40, so the moving path of the handling device 20 can be reduced, thereby improving the handling efficiency.

[0043] refer to Figure 4 The handling device 20 may include a main shaft 21, a first rotating arm 22, a second rotating arm 23, and a clamping member 24. The first end of the first rotating arm 22 is rotatably connected to the main shaft 21 around the main axis AA, one end of the second rotating arm 23 is rotatably connected to the second end of the first rotating arm 22, and the other end of the second rotating arm 23 is non-rotatably connected to the clamping member 24. The clamping member 24 can clamp and release the wafer box 30.

[0044] In a possible implementation, the main shaft 21 may be provided with a lifting member (not shown in the figure), through which the handling device 20 can change its height in the vertical direction, and at the same time, the rotation of the first rotating arm 22 and the second rotating arm 23 can accurately adjust the horizontal position and angle of the clamping member 24. In this way, the clamping member 24 can move in three-dimensional space to complete the handling of the wafer box 30.

[0045] Continue to refer Figure 4 The clamping member 24 includes two arms 241, which can be driven to move along a straight line, which is perpendicular to the up-down direction. Each arm 241 is provided with a clamping portion 242 extending along the up-down direction, and the two clamping portions 242 are arranged opposite to each other, and each clamping portion 242 is recessed in a direction away from the other clamping portion 242 to form a groove 2421.

[0046] Combination Figure 5 The wafer box 30 includes an opening 31 and two matching parts 32. The opening 31 is for wafers to be taken out of or put into the wafer box 30, and the opening direction of the opening 31 is the direction in which the wafers are taken out of or put into the wafer box 30. The two matching parts 32 are located on one side of the opening direction, and can respectively match with the two clamping parts 242 to realize the transportation of the wafer box 30. Specifically, when the wafer box 30 is placed between the two clamping parts 242, the two arm parts 241 move toward each other, so that the two matching parts 32 are respectively placed in the two grooves 2421, so that the clamping member 24 can stably clamp the wafer box 30. After the wafer box 30 is transported to the target position, the two arm parts 241 move in opposite directions, so that the two matching parts 32 are disengaged from the two grooves 2421, so that the clamping member 24 releases the wafer box 30.

[0047] It is understandable that there are many ways to drive the arm 241 to move, for example, the arm 241 can be driven to move by hydraulic, pneumatic or electric means, and the present disclosure does not impose any particular limitation on this.

[0048] refer to Fig. 7A In the first state, each temporary storage table 40 faces a plane parallel to the direction of the straight line BB and the extension direction of the main axis AA. In other words, the first end surface 401 of each temporary storage table 40 is parallel to the plane where the window 12 is located. Therefore, the operator only needs to face the window 12 to ensure that he faces each temporary storage table 40. In this way, the operator can access the wafer box 30 horizontally without rotating or adjusting the position of the wafer box 30, thereby improving the operating efficiency of accessing the wafer box 30.

[0049] refer to Figure 7BIn the second state, each temporary storage table 40 faces the main axis AA, and each wafer box 30 on the temporary storage table 40 also faces the main axis AA. Figure 5 , when a plane is perpendicular to the opening direction, the plane is facing the wafer box 30. Assuming that there is a plane in the transport device 20, that is, the plane defined by the two clamping parts 242 mentioned above, when the transport device 20 rotates around the main axis AA so that the plane is perpendicular to the opening direction of the wafer box 30, the transport device 20 moves along the opening direction of the wafer box 30 to clamp and take away the wafer box 30. In this way, the moving path of the transport device 20 can be effectively reduced, thereby improving the transport efficiency.

[0050] refer to Fig. 7A and Figure 7B , the multiple temporary storage tables 40 include a central temporary storage table 41 and two side temporary storage tables 42. The central temporary storage table 41 is aligned with the main axis AA in the straight direction, and the two side temporary storage tables 42 are respectively located on opposite sides of the central temporary storage table 41 in the straight direction. As the multiple temporary storage tables 40 switch from the first state to the second state, the central temporary storage table 41 is fixed relative to the main axis AA, and the two side temporary storage tables 42 move closer to the main axis AA. When the central temporary storage table 41 is aligned with the main axis AA in the straight direction, the position of the central temporary storage table 41 does not change regardless of whether the multiple temporary storage tables 40 are in the first state or the second state. In this way, the central temporary storage table 41 is set to be fixed relative to the main axis AA, and the state of the multiple temporary storage tables 40 is changed only by moving the two side temporary storage tables 42 closer to the main axis AA, which can reduce the number of components required to move the temporary storage tables 40, thereby reducing the complexity of the structure.

[0051] It is understandable that the number of temporary storage tables can also be other values, and the present disclosure does not make any special settings for this. For example, when the number of temporary storage tables is still an odd number, the middle temporary storage table can be set to be aligned with the main axis AA in the straight line direction and fixed relative to the main axis AA, thereby reducing the number of components required to move the temporary storage table.

[0052] refer to Figure 3 and Figure 6 The switching mechanism 50 includes two connecting parts 51, and the two connecting parts 51 are respectively connected to the two side temporary storage tables 42 for rotation prevention. As the multiple temporary storage tables 40 switch between the first state and the second state, each connecting part 51 moves along a circular arc trajectory with the side temporary storage table 42 connected thereto to change the position and orientation of the side temporary storage table 42 relative to the main axis AA. Due to the rotation prevention connection with the connecting part 51, the side temporary storage table 42 can face the main axis AA after moving along the circular arc trajectory with the connecting part 51. In other words, when the side temporary storage table 42 is connected to the connecting part 51 for rotation prevention, the movement of the connecting part 51 can simultaneously change the position and orientation of the side temporary storage table 42 relative to the main axis AA.

[0053] refer to Figure 6 The switching mechanism 50 includes two driving components 52, which are used to drive two side temporary storage tables 42 respectively. Each driving component 52 includes a movable arm 521 and a driver 522. The first end of the movable arm 521 is rotatably supported around the first rotation axis CC and its second end forms a corresponding connecting portion 51. The first end of the driver 522 is rotatably supported around the second rotation axis DD and its second end is rotatably connected to the second end of the movable arm 521. The first rotation axis CC and the second rotation axis DD are both parallel to the main axis AA, and the first rotation axis CC and the second rotation axis DD are spaced apart from each other. The driver 522 is extended and retracted to drive the movable arm 521 to rotate around the first rotation axis CC. According to the above implementation, as the driver 522 is extended and retracted, the second end of the driver 522 will drive the second end of the movable arm 521 to rotate around the first rotation axis CC, thereby changing the position of the side temporary storage table 42.

[0054] It is understandable that there are many ways to implement the driver 522. For example, the driver 522 may be an electric push rod, or the driver 522 may be a cylinder. The present disclosure does not impose any particular limitation on this.

[0055] It is understood that the drive assembly 52 can also be implemented in other forms, and the present disclosure does not impose any particular limitation on this. As an example, the drive assembly 52 can include a slider and a driver, the slider is fixedly connected to the side temporary storage table, and the driver drives the slider to move along the arc track.

[0056] refer to Figure 6 and Figure 8 The chip storage device 100 may further include a support base 60, the support base 60 includes a support platform 61 and two recesses 62 on opposite sides thereof in a straight line direction, the middle temporary storage platform 41 is located on the support platform 61, the two side temporary storage platforms 42 are respectively located above the two recesses 62 and are located at the same height as the middle temporary storage platform 41, the first end of the movable arm 521 and the first end of the driver 522 are both connected to the bottom of the support platform 61, and the second end of the movable arm 521 and the second end of the driver 522 extend into a corresponding recess 62, so that the second end of the movable arm 521 is connected to the side temporary storage platform 42 in the recess 62. According to the above structure, the movable arm 521 and the driver 522 are placed at the bottom of the support platform 61 and in the two recesses 62, which helps to improve the space utilization of the support base 60. In addition, the multiple temporary storage tables 40 are located at the same height, so that the handling device 20 can carry the wafer boxes 30 on the multiple temporary storage tables 40 at the same height, avoiding the height adjustment of the handling device 20, thereby effectively reducing the moving path of the handling device 20.

[0057] Back to Figure 3The wafer storage device 100 may further include a plurality of storage tables 70 for placing the wafer box 30, and each of the plurality of storage tables 70 and the plurality of temporary storage tables 40 is at an equal distance from the main axis AA. According to the above implementation, when the wafer box 30 is transported between the temporary storage table 40 and the storage table 70, the transport device 20 does not need to adjust the distance from the temporary storage table 40 or the storage table 70, thereby reducing the moving path of the transport device 20 and improving the transport efficiency.

[0058] Continue to refer Figure 3 , a plurality of storage tables 70 are supported on the side wall 11, and the plurality of storage tables 70 are located above or below the plurality of temporary tables 40. The plurality of storage tables 70 and the plurality of temporary tables 40 are both located between the side wall 11 and the transport device 20. In other words, the plurality of storage tables 70 and the plurality of temporary tables 40 are both located on the same side of the transport device 20, which makes it unnecessary for the transport device 20 to rotate to the other side when transporting the wafer box 30 between the temporary table 40 and the storage table 70, thereby effectively reducing the moving path of the transport device 20.

[0059] Continue to refer Figure 3 , the plurality of temporary storage tables 40 include three temporary storage tables 40, and the plurality of storage tables 70 include three columns of storage tables 70, and the three columns of storage tables 70 correspond to the three temporary storage tables 40 respectively. In the second state, the orthographic projections of each column of storage tables 70 and the corresponding temporary storage table 40 on the plane perpendicular to the main axis AA coincide. According to the above implementation, in the second state, when the handling device 20 carries the wafer box 30 between each column of storage tables 70 and the corresponding temporary storage table 40, it only needs to move in the height direction without changing the horizontal position. This can effectively reduce the moving path of the handling device 20, thereby improving the handling efficiency.

[0060] It can be understood that the number of temporary storage stations and the number of columns of storage stations can be other values, as long as the number of temporary storage stations and storage stations satisfy that N columns of storage stations correspond to N temporary storage stations respectively.

[0061] It should be understood that there are many ways to implement the chip memory disclosed in the present invention, and it should not be construed as being limited to the embodiments described above. Fig. 9A and Fig. 9B , the modified examples of the present disclosure are illustrated. It should be noted that the aforementioned embodiment and the following modified examples have some common elements. In the following modified examples, these elements will continue to use the figure numerals in the aforementioned embodiment to omit repeated description.

[0062] In a variation of the present disclosure, a switching mechanism 50a (not shown) in a wafer storage device 100a (not shown) is used to move at least one of the plurality of temporary storage tables 40a to switch the plurality of temporary storage tables 40a between a first state and a second state. Fig. 9AIn the first state, each temporary storage station 40a faces a plane parallel to both the straight line direction and the extension direction of the main axis AA. Fig. 9A , in the second state, each temporary storage table 40a is facing the main axis AA. In the first state, the operator only needs to face the window 12 to ensure that he faces each temporary storage table 40a. In this way, the operator can access the wafer box 30 horizontally without rotating or adjusting the position of the wafer box 30, thereby improving the operational efficiency of accessing the wafer box 30. In the second state, the handling device 20 can continuously handle the wafer box 30 on each temporary storage table 40a by rotating around the main axis AA. Furthermore, after rotating around the main axis AA to face the temporary storage table 40a, the handling device 20 can move in a straight line to contact and remove the wafer box 30 on the temporary storage table, which can effectively reduce the moving path of the handling device 20.

[0063] It should be understood that the term "including" and its variations used in the present disclosure are open inclusions, i.e., "including but not limited to". The term "according to" means "at least in part according to". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least another embodiment".

[0064] The protection scope of the present disclosure is not limited to the above-mentioned embodiments. Any changes or substitutions that can be conceived by any person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A chip memory, characterized in that: include: A storage bin including a side wall provided with a window; A handling device, rotatably disposed about a main axis in the storage bin, for handling the wafer box; A plurality of temporary storage tables are arranged in the storage bin and between the window and the handling device; a wafer box can be placed on any temporary storage table through the window from the outside, and a wafer box on any temporary storage table can be taken out through the window; as well as A switching mechanism, used to switch the plurality of temporary storage tables between a first state and a second state; in the first state, the plurality of temporary storage tables are arranged at intervals along a straight line so that the distances from the plurality of temporary storage tables to the window are equal; In the second state, the plurality of temporary storage tables are arranged at intervals along a direction around the main axis, and are equidistant from the main axis.

2. The chip memory according to claim 1, characterized in that: In the first state, each temporary storage table faces a plane parallel to both the straight line direction and the extension direction of the main axis; and / or, in the second state, each temporary storage table faces the main axis.

3. The chip memory according to claim 1 or 2, characterized in that: The multiple temporary storage tables include a central temporary storage table and two side temporary storage tables, the central temporary storage table is aligned with the main axis in the straight line direction, and the two side temporary storage tables are respectively located on opposite sides of the central temporary storage table in the straight line direction; as the multiple temporary storage tables are switched from the first state to the second state, the central temporary storage table is fixed relative to the main axis, and the two side temporary storage tables move closer to the main axis.

4. The chip memory according to claim 3, characterized in that: The switching mechanism includes two connecting parts, and the two connecting parts are respectively connected to the two side temporary storage tables for rotation. As the multiple temporary storage tables switch between the first state and the second state, each connecting part moves along an arc trajectory with the side temporary storage table connected thereto to change the position and orientation of the side temporary storage table relative to the main axis.

5. The chip memory according to claim 4, characterized in that: The switching mechanism includes two driving components, which are respectively used to drive the two side temporary storage tables, each driving component includes a movable arm and a driver, the first end of the movable arm is rotatably supported around a first rotation axis and its second end forms a corresponding connecting portion, the first end of the driver is rotatably supported around a second rotation axis and its second end is rotatably connected to the second end of the movable arm, the first rotation axis and the second rotation axis are both parallel to the main axis, and the first rotation axis and the second rotation axis are spaced apart from each other; the driver is telescopic to drive the movable arm to rotate around the first rotation axis.

6. The chip memory according to claim 5, characterized in that: It also includes a support base, which includes a support platform and two recessed portions on opposite sides of the support platform in the straight direction. The middle temporary storage table is located on the support platform, and the two side temporary storage tables are respectively located above the two recessed portions and at the same height as the middle temporary storage table. The first end of the movable arm and the first end of the driver are both connected to the bottom of the support platform, and the second end of the movable arm and the second end of the driver extend into a corresponding recess, so that the second end of the movable arm is connected to the side temporary storage table in the recess.

7. The chip memory according to claim 1 or 2, characterized in that: Also included are a plurality of storage tables for placing wafer boxes, wherein each of the plurality of storage tables and the plurality of temporary storage tables is equidistant from the main axis.

8. The chip memory according to claim 7, characterized in that: The plurality of storage tables are supported on the side walls, and the plurality of storage tables are located above or below the plurality of temporary storage tables.

9. The chip memory according to claim 8, characterized in that: The multiple temporary storage tables include N temporary storage tables, and the multiple storage tables include N columns of storage tables, and the N columns of storage tables correspond to the N temporary storage tables respectively; in the second state, the orthographic projections of each column of storage tables and the corresponding temporary storage table on a plane perpendicular to the main axis coincide.

10. A chip memory, characterized in that: include: A storage bin including a side wall provided with a window; A handling device, rotatably disposed about a main axis in the storage bin, for handling the wafer box; A plurality of temporary storage tables are arranged in the storage bin and between the window and the handling device; a wafer box can be placed on any temporary storage table through the window from the outside, and a wafer box on any temporary storage table can be taken out through the window; as well as A switching mechanism is used to move at least one of the multiple temporary storage tables to switch the multiple temporary storage tables between a first state and a second state; in the first state, each temporary storage table faces a plane parallel to both the straight line direction and the extension direction of the main axis; in the second state, each temporary storage table faces the main axis.

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