A vertical diffusion furnace wafer transfer robot

Abstract

The present invention relates to the field of wafer transfer technology, and in particular to a vertical diffusion furnace wafer transfer robot, comprising a mounting plate, the mounting plate is sequentially mounted with a mounting frame through a rotating mechanism and a translation mechanism, the rotating mechanism and the translation mechanism are used to realize the rotation and telescopic displacement of the mounting frame; the mounting frame is fixed to a tray, and a clamping part and a pushing part are installed on the mounting frame, the clamping part is used to press the wafer on the tray, and the pushing part is used to push the wafer into the vertical diffusion furnace. The present invention uses the transfer robot to transfer the wafers on the assembly line to the vertical diffusion furnace through an automated machine, which on the one hand avoids the problem of labor cost waste in flexible line operation, and on the other hand improves the problem of poor uniformity and poor placement of wafers in the furnace, thereby greatly improving product quality.

Description

Technical Field

[0001] The invention relates to the technical field of wafer transfer, and in particular to a vertical diffusion furnace wafer transfer robot. Background Art

[0002] The vertical diffusion furnace is an important heat treatment equipment used in the semiconductor field, commonly known as a vertical furnace, and is generally used for batch heat treatment in integrated circuit processes with diameters of 200mm and 300mm. Its structural characteristics are that the heating furnace body, reaction tube and quartz boat carrying the wafer are all placed vertically, and the wafer is placed horizontally. This design makes the vertical diffusion furnace have the characteristics of good uniformity within the wafer and stable system performance, which can meet the needs of large-scale integrated circuit production lines.

[0003] In order to ensure the quality of product heat treatment and product consistency, the wafers in the vertical diffusion furnace are required to be evenly distributed and in place during the heat treatment process, so higher requirements are placed on the loading process of the wafers in the vertical diffusion furnace. In addition, the processing and transportation of wafers generally adopt assembly line operations, so higher requirements are also placed on the loading efficiency of the vertical diffusion furnace.

[0004] Currently, the commonly used furnace loading method is a flexible working line, which requires manual cooperation with an automatic loader and is combined with the furnace loading inspection process. On the one hand, this method is difficult to ensure the uniformity and consistency of the furnace loading, which can easily cause product quality problems; on the other hand, it causes inefficiency and waste of labor costs. Summary of the invention

[0005] In order to solve the aforementioned technical problems, the present invention provides a vertical diffusion furnace wafer transfer robot, by which the wafers on the assembly line are transferred to the vertical diffusion furnace, avoiding the waste of labor costs in flexible line operation and the problems of poor uniformity and placement of wafers in the furnace, which is specifically achieved through the following technical solutions.

[0006] The invention discloses a vertical diffusion furnace wafer transfer robot, comprising a mounting plate, wherein the mounting plate is fixedly mounted on a sliding frame capable of vertical displacement, and the mounting plate is sequentially mounted with a mounting frame via a rotating mechanism and a translation mechanism, wherein the rotating mechanism and the translation mechanism are used to realize the rotation and telescopic displacement of the mounting frame.

[0007] The mounting frame is fixed to the tray, a limiting ring is fixedly installed on the tray, and a first sensor is fixedly installed in the middle of the limiting ring.

[0008] Limiting strips are fixed on both sides of the tray respectively, guide strips are fixed on the inner surfaces of the limiting strips, and the lower surfaces of the guide strips are arranged inclined.

[0009] The mounting frame is provided with a clamping part and a pushing part, and the pushing part is used for pushing the wafer into the vertical diffusion furnace.

[0010] The clamping part comprises a prying rod, the middle part of the prying rod is hinged on the mounting frame through a mounting shaft, a torsion spring is sleeved on the mounting shaft, and the prying rod is fixed to the mounting frame through the torsion spring.

[0011] The first end of the pry rod can be adsorbed by the electromagnet, and the first end of the pry rod is also fixed to the baffle plate, and the baffle plate can trigger the fifth sensor. The top of the first end of the pry rod can abut against the pressure sensor. The electromagnet, the fifth sensor, and the pressure sensor are all fixed on the mounting frame, and the second end of the pry rod is fixedly mounted with a pressing plate.

[0012] Preferably, the pushing portion includes a guide through hole opened on the mounting frame, a push rod that slides back and forth is arranged in the guide through hole, a push clamp is installed on the first end of the push rod, and the push clamp overlaps the side surface of the wafer.

[0013] The upper surface of the push rod is arranged in the first groove wheel and abuts against the inside thereof, the first groove wheel is coaxially fixed with the output end of the driving motor, the driving motor is fixed to the mounting frame, the lower surface of the push rod is arranged in the second groove wheel and abuts against the inside thereof, and the second groove wheel is rotatably mounted on the mounting frame.

[0014] The push rod can trigger a sixth sensor, and the sixth sensor is fixedly mounted on the mounting frame.

[0015] Preferably, the translation mechanism includes a fixed plate, which is installed at the bottom of the rotating mechanism. A second motor is fixed on the fixed plate. The output end of the second motor is coaxially fixed with the third pulley. The third pulley is driven by a second belt and a fourth pulley. The fourth pulley is rotatably installed on the fixed plate.

[0016] The second belt is fixed to the connecting plate, the connecting plate is fixed to the translation plate, the translation plate is fixed to the slider, the slider is slidably arranged on the guide rail, and the guide rail is fixed to the fixed plate.

[0017] A positioning plate is fixed on the side of the translation plate. The positioning plate can trigger a fourth sensor. The fourth sensor is fixedly mounted on the side of the fixed plate.

[0018] Preferably, the rotating mechanism includes a first motor, which is fixedly mounted on a mounting plate, the output end of the first motor is coaxially fixed with a first pulley, the first pulley is driven by a first belt and a second pulley, the second pulley is coaxially fixed with a rotating shaft, the rotating shaft is rotatably mounted on the mounting plate, a mounting plate is coaxially fixed to the bottom of the rotating shaft, and the fixing plate is mounted on the mounting plate.

[0019] A positioning rod is installed on the fixing plate, and the positioning rod can trigger the second sensor and the third sensor respectively. The second sensor and the third sensor are both fixedly installed at the bottom of the mounting plate.

[0020] Preferably, a plurality of air grooves are provided on the upper surface of the tray, and the plurality of air grooves are connected with air holes, and the air holes penetrate the tray and are fixedly connected with the negative pressure tube.

[0021] Preferably, the lower surface of the guide strip is inclined from top to bottom from close to the limiting ring to far away from the limiting ring.

[0022] Preferably, the limiting ring is an arc-shaped structure, and the diameter of the inner surface of the limiting ring is equal to the diameter of the wafer.

[0023] Preferably, an avoidance groove is provided on the pressing plate.

[0024] Preferably, an annular sleeve made of rubber or latex is fixedly installed inside the first groove wheel.

[0025] Preferably, the structure consisting of the second motor, the third pulley, the second belt, the fourth pulley, the connecting plate, the slider, the guide rail, the positioning plate and the fourth sensor is symmetrically distributed in two groups about the center of the fixed plate.

[0026] After adopting the above technical solution, the beneficial effects of the present invention are:

[0027] 1. The present invention stably clamps the wafer through the tray and the clamping part, so that the position of the wafer is stable during the transportation process, and the loading and unloading process of the wafer on the tray is monitored. When the material is stuck, the machine is stopped in time to avoid damage to the wafer.

[0028] 2. The wafers on the tray are smoothly pushed into the vertical diffusion furnace by the pushing unit. The transfer process is stable and efficient, and the wafer loading position in the vertical diffusion furnace is consistent by controlling the pushing stroke.

[0029] 3. The horizontal transfer of wafers placed on the tray is achieved through the rotation mechanism and translation mechanism, which can meet the loading requirements of vertical diffusion furnaces within a certain angle and travel range. It has a wider adaptability and uses parameter adjustment to control wafer transfer with high accuracy, which significantly improves work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0031] Figure 1 This is a three-dimensional diagram of a wafer transfer robot for a vertical diffusion furnace;

[0032] Figure 2 for Figure 1 The structural diagram of some parts in the figure;

[0033] Figure 3 for Figure 1 Installation diagram of some components in the middle;

[0034] Figure 4 for Figure 3 A partial cutaway diagram of

[0035] Figure 5 for Figure 3 A partial cutaway diagram of some of the components in the middle;

[0036] Figure 6 is a schematic diagram of the rotating mechanism from the first perspective;

[0037] Figure 7 is a schematic diagram of the second viewing angle of the rotating mechanism;

[0038] Figure 8 It is a three-dimensional diagram of the translation mechanism.

[0039] Description of reference numerals:

[0040] 101-mounting plate, 102-mounting frame, 103-tray, 104-limiting ring, 105-first sensor, 106-limiting bar, 107-guide bar, 108-air groove, 109-air hole, 110-feeding part;

[0041] 200-rotating mechanism, 201-first motor, 202-first pulley, 203-first belt, 204-second pulley, 205-rotating shaft, 206-mounting plate, 207-second sensor, 208-third sensor, 209-positioning rod;

[0042] 300-translation mechanism, 301-fixed plate, 302-second motor, 303-third pulley, 304-second belt, 305-fourth pulley, 306-connecting plate, 307-translation plate, 308-slider, 309-guide rail, 310-positioning plate, 311-fourth sensor;

[0043] 400-clamping part, 401-prying rod, 402-installing shaft, 403-torsion spring, 404-electromagnet, 405-shielding plate, 406-fifth sensor, 407-pressure sensor, 408-pressing plate, 409-avoidance groove;

[0044] 500-pushing part, 501-guide through hole, 502-push rod, 503-push clamp, 504-first groove wheel, 505-drive motor, 506-second groove wheel, 507-sixth sensor. DETAILED DESCRIPTION

[0045] The features and exemplary embodiments of various aspects of the present invention will be described in detail below. In order to make the purpose, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present invention and are not configured to limit the present invention. For those skilled in the art, the present invention can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present invention by illustrating examples of the present invention.

[0046] The directional words appearing in the following description are all directions shown in the figures, and do not limit the specific structure of the present invention. In the description of the present invention, it should also be noted that, unless otherwise clearly specified and limited, the terms "installation, connection" should be understood in a broad sense, for example, it can be a fixed connection, or a detachable connection or an integral connection; it can be directly connected or indirectly connected. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0047] An embodiment of the present invention provides a vertical diffusion furnace wafer transfer robot, see Figure 1 The vertical diffusion furnace wafer transfer robot includes a mounting plate 101, which is fixedly mounted on a sliding frame that can be displaced in a vertical direction, so as to realize the fixed installation of the wafer transfer robot. In addition, the sliding frame can be displaced in a vertical direction, so that the wafer transfer robot can place the wafer at different horizontal heights in the vertical diffusion furnace.

[0048] The mounting plate 101 is mounted with the mounting frame 102 via a rotating mechanism 200 and a translation mechanism 300. The rotating mechanism 200 is used to realize the deflection of the mounting frame 102 at a certain angle in the same horizontal plane, and the translation mechanism 300 is used to realize the telescopic displacement of the mounting frame 102 in the same horizontal plane.

[0049] One end of the mounting frame 102 away from the mounting plate 101 is fixedly connected to the tray 103, and the tray 103 is used to place the wafer. The mounting frame 102 is equipped with a clamping part 400 and a pushing part 500. The clamping part 400 is used to clamp the wafer placed on the tray 103, and the pushing part 500 is used to push the wafer into the vertical diffusion furnace.

[0050] Among them, Figure 1As shown, the wafers transmitted on the conveyor are transferred to the tray 103 through the loading part 110. The structure of the loading part 110 can be a suction cup or a clamp that can be displaced in the horizontal and vertical directions to grab the wafers, thereby effectively transferring the wafers on the conveyor to the tray 103. This technical means is the existing technology and will not be repeated here.

[0051] In this embodiment, after the wafers transported in a flow pattern are placed in the tray 103, the wafers are first clamped in the tray 103 by the clamping part 400, and then the mounting frame 102 and the tray 103 are adjusted to the target position by the angular rotation of the rotating mechanism 200 in the horizontal plane and the extension and retraction of the translation mechanism 300 in the horizontal plane, and then the pushing part 500 is started to push the wafers placed on the tray 103 into the vertical diffusion furnace, thereby completing the loading of the wafers into the furnace.

[0052] In the above process, the wafers are positioned and clamped by the tray 103 and the clamping part 400, and the wafers are accurately pushed by the pushing part 500, so that the uniformity and positioning of the wafers loaded into the vertical diffusion furnace can be kept consistent, avoiding product consistency differences caused by furnace loading problems.

[0053] As a further explanation of the above embodiments, see Figure 2 A limit ring 104 is fixedly installed on one end of the tray 103 close to the mounting frame 102. The limit ring 104 is an arc-shaped structure, and the diameter of the inner surface of the limit ring 104 is equal to the diameter of the wafer, so as to facilitate the positioning of the wafer when it is placed on the tray 103. On the one hand, it is convenient for the fixed clamping of the wafer, and on the other hand, it improves the accuracy of subsequent wafer loading. A first sensor 105 is fixedly installed in the middle of the limit ring 104. The first sensor 105 is used to detect whether the wafer is placed in place.

[0054] Limiting bars 106 are fixedly mounted on the sides of the tray 103 , and the distance between the inner surfaces of the two limiting bars 106 is equal to the diameter of the wafer, so that the two limiting bars 106 and the limiting ring 104 can jointly complete the placement and positioning of the wafer.

[0055] A guide bar 107 is fixed to the end of the inner surface of the limit bar 106 away from the limit ring 104, and the lower surface of the guide bar 107 is inclined, and it is inclined from top to bottom from close to the limit ring 104 to away from the limit ring 104, so as to facilitate further position limitation of the wafer on the tray 103 when it is pushed into the vertical diffusion furnace, thereby improving the precision control of wafer installation.

[0056] A plurality of air grooves 108 are provided on one side of the upper surface of the tray 103 close to the limit ring 104. The plurality of air grooves 108 are connected to the air holes 109. The air holes 109 penetrate the tray 103 from top to bottom and are fixedly connected to the negative pressure tube. This structure is used to attach the wafers placed on the tray 103 to the upper surface of the tray 103 by air suction, thereby preventing the wafers from moving during transportation and enhancing the stability of the wafers during transportation.

[0057] As a further explanation of the above embodiments, see Figure 3 , 4 The clamping portion 400 includes a prying rod 401, the middle part of the prying rod 401 is fixed to the mounting shaft 402, the mounting shaft 402 is perpendicular to the side of the prying rod 401, and the mounting shaft 402 is rotatably mounted on the mounting frame 102, a torsion spring 403 is sleeved on the mounting shaft 402, the end of the torsion spring 403 is fixed to the mounting frame 102, and the middle part of the torsion spring 403 is fixedly mounted on the prying rod 401.

[0058] The side of the prying rod 401 away from the tray 103 can be attracted by the electromagnet 404, and the electromagnet 404 is fixedly mounted on the mounting frame 102. The end of the prying rod 401 away from the tray 103 is fixed to the shielding plate 405, and the shielding plate 405 is arranged between the transmitter and the receiver of the fifth sensor 406. The fifth sensor 406 is fixedly mounted on the mounting frame 102. The top of the end of the prying rod 401 away from the tray 103 can abut against the pressure sensor 407, and the pressure sensor 407 is fixedly mounted on the mounting frame 102.

[0059] A pressing plate 408 is fixedly installed at one end of the prying rod 401 close to the tray 103. The pressing plate 408 is used to press the wafer on the upper surface of the tray 103. An avoidance groove 409 is opened on the pressing plate 408. The avoidance groove 409 is used to avoid the loading part 110, so that the loading part 110 can place the wafer in the tray 103 conveniently.

[0060] In the above embodiment, when the loading part 110 transfers the wafer into the tray 103 and is arranged between the first sensors 105, the first sensor 105 detects that the wafer has been moved into place, and the electromagnet 404 stops working and no longer attracts the prying rod 401 away from one end of the tray 103. At this time, the prying rod 401 rotates around the axis of the mounting shaft 402 under the elastic force of the torsion spring 403, and then pries the pressing plate 408 downward to press the wafer down to the upper surface of the tray 103, thereby placing the wafer.

[0061] After the pressing plate 408 swings downward to the final position, that is, after the wafer is successfully pressed down to the upper surface of the tray 103, the side of the prying rod 401 away from the tray 103 just abuts against the pressure sensor 407, indicating that the wafer is in place and there is no jamming. On the contrary, when the electromagnet 404 stops working and no longer absorbs the prying rod 401, the prying rod 401 does not abut against the pressure sensor 407, indicating that a jamming failure has occurred. At this time, an alarm is sounded and the machine is shut down to avoid damage to the product.

[0062] On the contrary, when the wafer is transferred to the target position, the electromagnet 404 is started, so that the electromagnet 404 absorbs the prying rod 401 again, thereby driving the pressing plate 408 to swing upward and releasing the pressure on the wafer. At this time, the baffle plate 405 is just configured between the transmitter and the receiver of the fifth sensor 406, that is, it is detected that the pressing plate 408 is lifted successfully; on the contrary, when the electromagnet 404 is started and re-absorbs the prying rod 401, the baffle plate 405 is not configured between the transmitter and the receiver of the fifth sensor 406, indicating a material jam failure, triggering an alarm shutdown to avoid product damage.

[0063] This embodiment presses and releases the wafer by the pressing plate 408. On the one hand, this allows the position of the wafer on the tray 103 to remain fixed, avoiding changes in the position of the wafer during rotation, which would affect the final consistency of the wafer in the vertical diffusion furnace. On the other hand, the fifth sensor 406 and the pressure sensor 407 detect the position of the prying rod 401 to determine whether a material jam has occurred, and provide timely feedback to avoid product damage.

[0064] As a further explanation of the above embodiments, see Figure 1 , 5 The pushing parts 500 are symmetrically distributed in two groups on both sides of the mounting frame 102, and are used together to complete the pushing of the wafers placed on the tray 103, thereby maintaining the stability of the wafer pushing.

[0065] The pushing part 500 includes a guide hole 501 opened on the mounting frame 102, and a push rod 502 is arranged in the guide hole 501 and slides back and forth along it. A push clamp 503 is fixedly installed on one end of the push rod 502 close to the tray 103, and the push clamp 503 overlaps the side of the wafer, so as to facilitate pushing the wafer out of the tray 103.

[0066] The upper surface of the push rod 502 is configured in the first groove wheel 504 and abuts against the inside thereof. The first groove wheel 504 is coaxially fixed with the output end of the driving motor 505. The driving motor 505 is fixed to the mounting frame 102. The lower surface of the push rod 502 is configured in the second groove wheel 506 and abuts against the inside thereof. The second groove wheel 506 is rotatably mounted on the side of the mounting frame 102. The push rod 502 is configured between the transmitter and the receiver of the sixth sensor 507. The sixth sensor 507 is fixedly mounted on the side of the mounting frame 102.

[0067] Among them, an annular sleeve made of rubber or latex material can be fixedly installed inside the first groove wheel 504 to increase the friction between the first groove wheel 504 and the push rod 502, so as to facilitate the first groove wheel 504 to drive the push rod 502 to reciprocate.

[0068] The push rod 502 has a square cross-sectional shape, and the guide hole 501 has a square cross-sectional shape that matches the push rod 502 , so that the guide hole 501 can accurately guide the push rod 502 to prevent the push rod 502 from deviating and causing material jamming.

[0069] In the above embodiment, the driving motor 505 drives the push rod 502 to reciprocate along its length direction through the first groove wheel 504, so as to push out the wafer placed on the tray 103. When the push rod 502 moves away from one end of the push clamp 503 and no longer blocks the transmitter of the sixth sensor 507, the push rod 502 moves to the maximum stroke.

[0070] Therefore, by adjusting the position of the sixth sensor 507, the movement stroke of the push rod 502 can be adjusted to meet the pushing requirements of the wafer, and through the consistency of the movement stroke of the push rod 502, the consistency of the position of the wafer when it is pushed into the vertical diffusion furnace is maintained.

[0071] The push rod 502 and the push clamp 503 are arranged as follows: Figure 2 The limiting ring 104 and the limiting strip 106 are shown, thereby avoiding interference between the push rod 502 and the push clamp 503 during the reciprocating motion.

[0072] As a further explanation of the above embodiments, see Figure 6 , Figure 7 The rotating mechanism 200 includes a first motor 201, a mounting plate 101 fixedly connected to the first motor 201, an output end of the first motor 201 coaxially fixed to a first pulley 202, the first pulley 202 is driven by a first belt 203 and a second pulley 204, a rotating shaft 205 is coaxially fixedly mounted on the second pulley 204, the rotating shaft 205 is rotatably mounted on the mounting plate 101, a mounting plate 206 is coaxially fixed to the bottom of the rotating shaft 205, and a translation mechanism 300 is fixedly mounted on the mounting plate 206.

[0073] The second sensor 207 and the third sensor 208 are installed at the bottom of the mounting plate 101 . The positioning rod 209 can be respectively arranged between the transmitter and the receiver of the second sensor 207 and the third sensor 208 . The positioning rod 209 is fixedly connected to the translation mechanism 300 .

[0074] In the above embodiment, the first motor 201 drives the first pulley 202 to rotate, and further drives the second pulley 204, the rotating shaft 205 and the mounting plate 206 to rotate through the belt transmission relationship among the first pulley 202, the first belt 203 and the second pulley 204. Due to the fixed installation relationship between the mounting plate 206 and the translation mechanism 300, the rotation of the mounting plate 206 smoothly drives the translation mechanism 300 to swing within the same horizontal plane.

[0075] The swing of the translation mechanism 300 further drives the swing of the positioning rod 209. When the positioning rod 209 is configured between the transmitter and the receiver of the second sensor 207, the first motor 201 stops rotating. Conversely, when the positioning rod 209 is configured between the transmitter and the receiver of the second sensor 207, the first motor 201 also stops rotating. Thus, the rotation angle of the translation mechanism 300 is limited through the coordination relationship between the second sensor 207 and the third sensor 208 and the positioning rod 209.

[0076] Of course, those skilled in the art can adjust the positions of the second sensor 207 and the third sensor 208 according to actual needs, so as to conveniently control the deflection angles of the translation mechanism 300 and the mounting frame 102 to meet the needs of wafer transportation.

[0077] As a further explanation of the above embodiments, see Figure 8 The translation mechanism 300 includes a fixed plate 301, the mounting disk 206 is fixedly connected to the fixed plate 301, a second motor 302 is fixed on the fixed plate 301, an output end of the second motor 302 is coaxially fixed with a third pulley 303, the third pulley 303 is driven by a second belt 304 and a fourth pulley 305, and the fourth pulley 305 is rotatably mounted on the upper surface of the fixed plate 301.

[0078] The second belt 304 is fixed to the first end of the connecting plate 306, and the second end of the connecting plate 306 is fixed to the translation plate 307. A slider 308 is fixedly installed on the top of the translation plate 307. The slider 308 is configured on and moves along the guide rail 309. The guide rail 309 is fixedly installed at the bottom of the fixed plate 301.

[0079] A positioning plate 310 is fixed to the side of the translation plate 307 . The positioning plate 310 can be arranged between the transmitter and the receiver of the fourth sensor 311 . The fourth sensor 311 is fixedly mounted on the side of the fixed plate 301 .

[0080] Among them, the structure composed of the second motor 302, the third pulley 303, the second belt 304, the fourth pulley 305, the connecting plate 306, the slider 308, the guide rail 309, the positioning plate 310, and the fourth sensor 311 is symmetrically distributed in two groups about the center of the fixed plate 301, and is used together to complete the reciprocating sliding of the translation plate 307 relative to the fixed plate 301, with the purpose of maintaining the stability of the translation plate 307 during the sliding process.

[0081] The positioning rod 209 is fixedly mounted on the fixing plate 301 , so that the rotation angle of the translation mechanism 300 can be controlled by the rotation mechanism 200 .

[0082] The above-mentioned embodiment is used to realize the reciprocating sliding of the translation plate 307 relative to the fixed plate 301, which is convenient for the position transfer and position adjustment of the mounting frame 102 and the tray 103 installed on the translation plate 307. The specific implementation process is: the second motor 302 drives the third pulley 303 to rotate, and further drives the connecting plate 306 to reciprocate along the length direction of the fixed plate 301 through the belt transmission relationship of the third pulley 303, the second belt 304, and the fourth pulley 305. Finally, through the connection relationship of the connecting plate 306, the reciprocating sliding of the translation plate 307 is driven.

[0083] The above embodiment limits the sliding position of the translation plate 307 through the configuration relationship between the fourth sensor 311 and the positioning plate 310. When the positioning plate 310 slides with the translation plate 307 to between the transmitter and the receiver of the fourth sensor 311, the second motor 302 stops rotating to prevent the translation plate 307 from sliding further.

[0084] According to the embodiments of the present invention as described above, these embodiments do not describe all the details in detail, nor do they limit the invention to the only specific embodiments. Obviously, based on the above description, many modifications and changes can be made. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can make good use of the present invention and the modified use based on the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A vertical diffusion furnace wafer transfer robot, comprising a mounting plate (101), characterized in that: The mounting plate (101) is fixedly mounted on a sliding frame capable of vertical displacement, and the mounting plate (101) is mounted with a mounting frame (102) in sequence via a rotating mechanism (200) and a translation mechanism (300), wherein the rotating mechanism (200) and the translation mechanism (300) are used to realize rotation and telescopic displacement of the mounting frame (102); The mounting frame (102) is fixed to the tray (103); a limit ring (104) is fixedly mounted on the tray (103); and a first sensor (105) is fixedly mounted in the middle of the limit ring (104); Limiting strips (106) are fixed on both sides of the tray (103), guide strips (107) are fixed on the inner surface of the limiting strips (106), and the lower surface of the guide strips (107) is inclined; A clamping portion (400) and a pushing portion (500) are installed on the mounting frame (102), and the pushing portion (500) is used to push the wafer into the vertical diffusion furnace; The clamping portion (400) comprises a prying rod (401), the middle portion of the prying rod (401) is hinged on the mounting frame (102) via a mounting shaft (402), a torsion spring (403) is sleeved on the mounting shaft (402), and the prying rod (401) is fixed to the mounting frame (102) via the torsion spring (403); The first end of the prying rod (401) can be adsorbed by the electromagnet (404), and the first end of the prying rod (401) is also fixed to the shielding plate (405), and the shielding plate (405) can trigger the fifth sensor (406). The top of the first end of the prying rod (401) can abut against the pressure sensor (407), and the electromagnet (404), the fifth sensor (406), and the pressure sensor (407) are all fixed on the mounting frame (102). The second end of the prying rod (401) is fixedly mounted with a pressing plate (408).

2. The vertical diffusion furnace wafer transfer robot according to claim 1, characterized in that: The pushing portion (500) comprises a guide through hole (501) formed on the mounting frame (102), a push rod (502) being arranged in the guide through hole (501) and being capable of reciprocating sliding, a push clamp (503) being mounted on the first end of the push rod (502), and the push clamp (503) being overlapped with the side surface of the wafer; The upper surface of the push rod (502) is arranged in the first groove wheel (504) and abuts against the inside thereof; the first groove wheel (504) is coaxially fixed with the output end of the driving motor (505); the driving motor (505) is fixed to the mounting frame (102); the lower surface of the push rod (502) is arranged in the second groove wheel (506) and abuts against the inside thereof; the second groove wheel (506) is rotatably mounted on the mounting frame (102); The push rod (502) is capable of triggering a sixth sensor (507), and the sixth sensor (507) is fixedly mounted on the mounting frame (102).

3. The vertical diffusion furnace wafer transfer robot according to claim 1, characterized in that: The translation mechanism (300) comprises a fixed plate (301), the fixed plate (301) is mounted on the bottom of the rotation mechanism (200), a second motor (302) is fixed on the fixed plate (301), an output end of the second motor (302) is coaxially fixed with a third pulley (303), the third pulley (303) is driven by a second belt (304) and a fourth pulley (305), and the fourth pulley (305) is rotatably mounted on the fixed plate (301); The second belt (304) is fixed to the connecting plate (306), the connecting plate (306) is fixed to the translation plate (307), the translation plate (307) is fixed to the slider (308), the slider (308) is slidably arranged on the guide rail (309), and the guide rail (309) is fixed to the fixed plate (301); A positioning plate (310) is fixed to the side of the translation plate (307); the positioning plate (310) is capable of triggering a fourth sensor (311); and the fourth sensor (311) is fixedly mounted on the side of the fixed plate (301).

4. The vertical diffusion furnace wafer transfer robot according to claim 3, characterized in that: The rotating mechanism (200) comprises a first motor (201), the first motor (201) is fixedly mounted on a mounting plate (101), an output end of the first motor (201) is coaxially fixed with a first pulley (202), the first pulley (202) is driven by a second pulley (204) via a first belt (203), the second pulley (204) is coaxially fixed with a rotating shaft (205), the rotating shaft (205) is rotatably mounted on the mounting plate (101), a mounting plate (206) is coaxially fixed to the bottom of the rotating shaft (205), and the fixing plate (301) is mounted on the mounting plate (206); A positioning rod (209) is mounted on the fixing plate (301), and the positioning rod (209) can respectively trigger a second sensor (207) and a third sensor (208), and the second sensor (207) and the third sensor (208) are both fixedly mounted on the bottom of the mounting plate (101).

5. The vertical diffusion furnace wafer transfer robot according to claim 1, characterized in that: A plurality of air grooves (108) are provided on the upper surface of the tray (103), and the plurality of air grooves (108) are in communication with air holes (109). The air holes (109) penetrate the tray (103) and are fixedly connected to the negative pressure tube.

6. The vertical diffusion furnace wafer transfer robot according to claim 1, characterized in that: The lower surface of the guide strip (107) is inclined from top to bottom in a direction from close to the limiting ring (104) to far away from the limiting ring (104).

7. The vertical diffusion furnace wafer transfer robot according to claim 1, characterized in that: The limiting ring (104) is an arc-shaped structure, and the diameter of the inner surface of the limiting ring (104) is equal to the diameter of the wafer.

8. The vertical diffusion furnace wafer transfer robot according to claim 1, characterized in that: The pressing plate (408) is provided with an avoidance groove (409).

9. The vertical diffusion furnace wafer transfer robot according to claim 2, characterized in that: An annular sleeve made of rubber or latex is fixedly installed inside the first groove wheel (504).

10. The vertical diffusion furnace wafer transfer robot according to claim 3, characterized in that: The structure consisting of the second motor (302), the third pulley (303), the second belt (304), the fourth pulley (305), the connecting plate (306), the slider (308), the guide rail (309), the positioning plate (310) and the fourth sensor (311) is symmetrically distributed in two groups about the center of the fixed plate (301).

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