Module diode with high heat dissipation performance and manufacturing method thereof

Abstract

The invention relates to a module diode with high heat dissipation performance and a manufacturing method thereof, and relates to the technical field of semiconductor chip packaging. The lithium ion battery comprises a positive terminal, a negative terminal and a packaging body arranged between the positive terminal and the negative terminal, an installation groove is formed in the side wall of the packaging body in a penetrating mode, a heat dissipation block is arranged in the installation groove, the ends, facing each other, of the positive terminal and the negative terminal are attached to the heat dissipation block, and an insulation layer is arranged on the side wall of the heat dissipation block; an anti-falling block is arranged on the side wall of the heat dissipation block, and an anti-falling groove allowing the anti-falling block to abut into is formed in the installation groove. The invention has the effect of improving the heat dissipation performance of the diode.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor chip packaging, and in particular to a module diode with high heat dissipation performance and a manufacturing method thereof. Background Art

[0002] A diode is an electronic device made of semiconductor material. It has two electrodes, one positive and one negative, and has the property of unidirectional conduction. In various electronic circuits, diodes are used to make reasonable connections with components such as resistors, capacitors, and inductors to form circuits with different functions, which can realize multiple functions such as rectification of alternating current, detection of modulated signals, and stabilization of power supply voltage.

[0003] In the related art, a module diode includes a positive terminal and a negative terminal, a chip is installed on the positive terminal, and the chip is connected to the negative terminal through a jumper, so that the positive terminal and the negative terminal form a unidirectional conduction circuit; a protrusion is integrally formed on the side wall of the positive terminal facing the negative terminal, and a recess for the protrusion to be pressed into the side wall of the negative terminal facing the positive terminal, and a packaging body covering the protrusion and the recess is installed between the positive terminal and the negative terminal.

[0004] With respect to the above-mentioned related technologies, the inventors found that the heat dissipation performance of conventional diodes is limited. When the power of various components in the electronic circuit continues to increase, the current flowing through the diode also continues to increase, generating a large amount of heat, which can easily cause the diode to burn out and affect the normal operation of the entire electronic circuit. Therefore, there is room for improvement. Summary of the invention

[0005] In order to improve the heat dissipation performance of a diode, the present application provides a module diode with high heat dissipation performance and a manufacturing method thereof.

[0006] In a first aspect, the present application provides a module diode with high heat dissipation performance, which adopts the following technical solution: A module diode with high heat dissipation performance comprises a positive terminal, a negative terminal and a packaging body arranged between the positive terminal and the negative terminal; a mounting groove is provided through the side wall of the packaging body, a heat dissipation block is arranged inside the mounting groove, the ends of the positive terminal and the negative terminal facing each other are both in contact with the heat dissipation block, and an insulating layer is provided on the side wall of the heat dissipation block; an anti-slip block is provided on the side wall of the heat dissipation block, and an anti-slip groove is provided inside the mounting groove for the anti-slip block to press into.

[0007] By adopting the above technical solution, the heat sink block fits tightly with the positive terminal and the negative terminal, the heat sink block made of metal has better thermal conductivity than the plastic package, and the heat sink block replaces part of the package to dissipate heat for the working positive terminal and negative terminal, thereby further improving the heat dissipation performance of the diode; the anti-detachment block abuts against the inner wall of the anti-detachment groove, thereby reducing the phenomenon of the heat sink block detaching from the package due to thermal expansion and contraction of the package during the operation of the diode, thereby ensuring the stable connection between the heat sink block and the package.

[0008] Preferably, a heat dissipation groove is provided on the side wall of the heat dissipation block facing away from the positive terminal, a plurality of groups of heat dissipation fins are arranged at intervals inside the heat dissipation groove, and a protective film for closing the heat dissipation groove is detachably provided on the heat dissipation block.

[0009] By adopting the above technical solution, the heat sink increases the contact area and heat conduction area between the heat sink block and the outside air, so that the heat on the positive terminal and the negative terminal can be more efficiently dissipated through the heat sink block and the heat sink, further improving the heat dissipation performance of the diode; the protective film temporarily closes the heat sink to facilitate the packaging of the positive terminal and the negative terminal; and when the packaging is completed, the protective film is removed to ensure that the heat sink inside the heat sink is in contact with the outside air.

[0010] Preferably, a heat conducting pipe for circulating a heat conducting medium is provided on the package body, and a heat conducting sheet for fitting the positive terminal and the negative terminal is provided on the side wall of the heat conducting pipe, an insulating protective layer is provided on the side wall of the heat conducting sheet facing away from the heat conducting pipe, and a plurality of groups of heat conducting sheets which are inserted into the package body are provided at intervals on the peripheral wall of the heat conducting pipe.

[0011] By adopting the above technical solution, the metal heat conducting sheet transfers the heat on the positive terminal and the negative terminal to the heat conducting pipe, and the heat conducting sheet transfers the heat inside the package to the heat conducting pipe. The flowing heat conducting medium drives a large amount of heat on the heat conducting pipe, thereby realizing rapid cooling of the module diode and further improving the heat dissipation performance of the diode.

[0012] Second, The present application provides a method for manufacturing a module diode with high heat dissipation performance, comprising the following steps: Stamping: Stamping the positive and negative terminals; Welding: Position the positive terminal and the negative terminal by using a positioning device, then place the chip and the jumper on the positive terminal and the negative terminal inside the positioning device, and weld the above materials by using a welding device; Loading: A protective film that closes the heat dissipation groove is attached to the bottom surface of the heat dissipation block, and the protective film can be peeled off, and the side wall of the heat dissipation block attached with the protective film is placed in the packaging mold downward, and the welded parts prepared in the welding step are placed on the side wall of the heat dissipation block away from the protective film, and the heat dissipation block is kept in close contact with the positive terminal and the negative terminal; the heat pipe is placed on the side wall of the heat dissipation block away from the positive terminal, and the heat conducting sheet is kept in close contact with the positive terminal and the negative terminal, and the packaging mold is used to cover the heat pipe, and the heat conducting sheet, the positive terminal, the negative terminal and the heat dissipation block are made to fit closely; Packaging: Place the loaded packaging mold inside the injection molding device for packaging; Peeling off the material: After packaging, peel off the protective film.

[0013] Preferably, the positioning device includes a positioning platform, two groups of positioning plates movably arranged on the top of the positioning platform, a driving assembly, a pressing assembly and a ejecting assembly; a positioning groove for placing the positive terminal and the negative terminal is opened on the upper surface of the positioning platform, and a clearance space for the positive terminal and the negative terminal to pass through is reserved between the two positioning plates, and the driving assembly is used to drive the two groups of positioning plates to approach or move away from each other; the two positioning plates are relatively distributed at the ends where the positive terminal and the negative terminal are far away from each other, and the pressing assembly is used to drive the positioning plates to press the ends where the positive terminal and the negative terminal are far away from each other; the ejecting assembly is used to eject the welded parts after welding out of the positioning groove.

[0014] By adopting the above technical solution, the driving component adjusts the distance between the two groups of positioning plates so that sufficient space is left between the two groups of positioning plates, so that the operator can quickly pick up the welding parts inside the positioning groove or quickly place the workpiece to be welded inside the positioning groove; when it is necessary to press and fix the positive terminal and the negative terminal, the driving component drives the positioning plates to approach each other, and uses the pressing component to drive the positioning plates gradually close to the positioning table, so as to stably press the positive terminal and the negative terminal inside the positioning groove, thereby facilitating the welding device to weld and fix the chip and the jumper; when the welding of the welding part is completed, the welding part is pushed out of the positioning groove by the ejecting component, so that the operator can quickly pick up the welding part.

[0015] Preferably, the driving assembly comprises a driving guide rod, a driving screw, two sets of sliding blocks, a limit rod and a driving motor; the driving guide rod and the driving screw are both arranged at the bottom of the positioning platform, and the length directions of the driving guide rod and the driving screw are parallel to each other; the two sliding blocks are both sleeved on the driving guide rod and the driving screw, and the driving screw is rotatably connected to the positioning platform; the threads at both ends of the driving screw are opposite, one of the sliding blocks is threadedly connected to one end of the driving screw, and the other sliding block is threadedly connected to the other end of the driving screw; the sliding blocks and the positioning plates are respectively arranged in one-to-one correspondence, and the limit rod is arranged between the corresponding sliding block and the positioning plate; the driving motor is arranged on the positioning platform to drive the driving screw to rotate.

[0016] By adopting the above technical solution, the output end of the driving motor drives the driving screw to rotate, applies force to the sliding block, and drives the guide rod to guide and limit the sliding direction of the sliding block, so that the two groups of sliding blocks drive the two groups of positioning plates to move closer to or away from each other through the limiting rod, thereby realizing the regulation of the distance between the two groups of positioning plates.

[0017] Preferably, the pressing assembly includes a limit nut, a tensioning member and a driving member; the end of each limit rod away from the sliding block passes through the positioning plate, and the positioning plate can slide along the length direction of the limit rod; the limit nut is arranged at the end of each group of limit rods away from the sliding block, and the tensioning member is arranged between the limit nut and the positioning plate to drive the positioning plate away from the positioning platform through its own tension; the driving member is arranged between the positioning platform and the positioning plate to drive the positioning plate close to the positioning platform.

[0018] By adopting the above technical solution, when the sliding block drives the two groups of positioning plates to approach each other, the driving member drives the positioning plates to gradually approach the positioning table, assists in pressing the positive terminal and the negative terminal inside the positioning groove, and stretches the tensile member; when the two groups of positioning plates move away from each other, the tensile deformed tensile member gradually recovers the deformation, so as to drive the two groups of positioning plates to gradually move away from the positioning table through the pulling force, thereby canceling the pressing on the positive terminal and the negative terminal.

[0019] Preferably, the driving member includes a fixed plate, a guide ring, an extension block and a driving rope; the fixed plates are arranged at both ends of each group of sliding blocks in the length direction, and the guide rings are arranged on the side walls of each group of fixed plates facing the positioning plate; the extension blocks are arranged on both sides of the positioning platform in the width direction, and the extension blocks are located at both ends of the positioning platform; the driving rope is arranged on the side walls of each group of extension blocks facing the adjacent guide rings, and each end of the driving rope away from the extension block passes through the adjacent guide ring and is connected to the positioning plate.

[0020] By adopting the above technical solution, when the two groups of positioning plates approach each other, each group of guide rings gradually moves away from the adjacent extension blocks, and the guide rings pull the driving ropes, so that the driving plates pull the positioning plates to gradually approach and press the positioning platforms, thereby realizing the pressing operation of the positioning plates; when the positioning plates move away from each other, the traction force of the driving ropes on the positioning plates gradually decreases, so that the tension members can drive the positioning plates to reset; the driving members drive the movement of the positioning plates with the help of the sliding blocks, thereby realizing the lifting and lowering drive of the positioning plates, reducing the need for an additional power source to drive the lifting and lowering movement of the positioning plates, thereby saving costs.

[0021] Preferably, the ejection assembly includes a base plate, a lifting guide rod, a lifting plate, a ejection rack, a reset member and a linkage member; the base plate is arranged at the bottom of the positioning platform, and the lifting guide rod is arranged between the positioning platform and the base plate along the height direction of the positioning platform; the lifting plate is slidably sleeved on the lifting guide rod, and the ejection rack is arranged on the side wall of the lifting plate facing the positioning platform, and the bottom wall of the positioning groove is penetrated by a ejection opening for the ejection rack to pass through; the reset member is arranged between the lifting plate and the base plate to drive the lifting plate away from the positioning platform through its own pulling force; the linkage member is arranged between the sliding block and the lifting plate to drive the lifting plate close to the positioning platform.

[0022] By adopting the above technical scheme, the lifting guide rod limits and guides the lifting and lowering movement of the lifting plate and the ejecting rack, and the linkage drives the lifting plate to drive the ejecting rack to gradually approach the positioning table, which can drive the ejecting rack to eject the welding part inside the positioning groove out of the positioning groove and make the reset part stretch and deform; when the force of the linkage on the lifting plate gradually decreases, the stretch-deformed reset part gradually recovers its deformation, so that the lifting plate drives the ejecting rack to gradually approach the bottom plate, so that the positive terminal and the negative terminal can be normally placed inside the positioning groove for welding.

[0023] Preferably, the linkage comprises a wire ring and a traction rope; the lifting plate is located between the two groups of sliding blocks, the wire ring is located between the lifting plate and each group of sliding blocks, and each of the wire rings is connected to the side wall of the positioning platform facing the lifting rack; the traction rope is arranged on each group of sliding blocks, and each end of the traction rope away from the sliding block passes through the adjacent wire ring and is connected to the lifting plate.

[0024] By adopting the above technical scheme, when the welding of the workpieces is completed, the two groups of sliding blocks are driven to move away from each other, and the sliding blocks moving away from each other drive the traction rope to change direction through the force of the wire ring, lift the lifting plate and the ejecting frame, and make the reset part stretch and deform, so that the ejecting frame supports the welding parts inside the positioning groove; when the two groups of sliding blocks approach each other, the lifting force of the traction rope on the lifting plate is reduced, and the lifting plate is driven by the pulling force of the reset part to drive the ejecting frame to descend and reset, so that the positive terminal and the negative terminal are normally placed in the positioning groove; in addition, when the sliding blocks approach each other to make the positioning plate perform a pressing operation, the traction rope is in a relaxed state and does not provide a lifting force to the support plate to ensure the normal use of the positioning groove; by relying on the movement of the sliding block, the ejecting frame is driven to move up and down, reducing the need for an additional power source to drive the ejecting frame to move up and down, thereby saving costs.

[0025] In summary, the present application includes at least one of the following beneficial technical effects: 1. By setting the heat sink to fit closely with the positive terminal and the negative terminal, the heat sink made of metal has better thermal conductivity than the plastic package. The heat sink replaces part of the package to dissipate heat for the working positive terminal and negative terminal, further improving the heat dissipation performance of the diode; 2. A metal heat transfer sheet is provided to transfer the heat from the positive terminal and the negative terminal to the heat pipe. The heat transfer sheet transfers the heat inside the package to the heat pipe. The flowing heat transfer medium drives a large amount of heat on the heat pipe, thereby realizing rapid cooling of the module diode and further improving the heat dissipation performance of the diode. 3. The distance between the two sets of positioning plates is adjusted by setting a driving component, so that the operator can quickly pick up or store the workpiece; the pressing component is used to drive the positioning plate to stably press the positive terminal and the negative terminal inside the positioning groove, so that the welding device can weld and fix the chip and jumper wire; when the welding of the welded part is completed, the welded part is pushed out of the positioning groove by the ejecting component, so that the operator can quickly pick up the welded part. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a structural schematic diagram of a module diode with high heat dissipation performance and a manufacturing method thereof according to an embodiment of the present application.

[0027] Figure 2 It is a cross-sectional schematic diagram used to reflect the internal structure of the package.

[0028] Figure 3 It is a structural schematic diagram for reflecting the positioning device.

[0029] Figure 4 It is a cross-sectional schematic diagram used to reflect the internal structure of the positioning platform.

[0030] Description of reference numerals: 1. Positive terminal; 2. Negative terminal; 3. Package; 31. Mounting slot; 311. Anti-slip slot; 4. Heat sink; 40. Insulation layer; 41. Anti-slip block; 42. Heat sink; 421. Heat sink; 43. Protective film; 5. Heat pipe; 50. Insulation protective layer; 51. Heat conducting sheet; 52. Heat transfer sheet; 6. Positioning platform; 61. Positioning plate; 62. Positioning slot; 63. Ejection port; 7. Drive assembly; 71. Drive guide rod; 72. Drive Moving screw; 73, sliding block; 74, limiting rod; 75, driving motor; 8, pressing assembly; 81, limiting nut; 82, stretching member; 83, driving member; 831, fixing plate; 832, guide ring; 833, extension block; 834, driving rope; 9, ejecting assembly; 91, bottom plate; 92, lifting guide rod; 93, lifting plate; 94, ejecting rack; 95, reset member; 96, linkage member; 961, wire ring; 962, traction rope. DETAILED DESCRIPTION

[0031] The following is combined with Figure 1-4 This application is described in further detail.

[0032] The embodiment of the present application discloses a module diode with high heat dissipation and a manufacturing method thereof, so as to improve the heat dissipation performance of the diode.

[0033] Reference Figure 1 and Figure 2 A module diode with high heat dissipation includes a positive terminal 1 and a negative terminal 2, and a package body 3 is injection molded between the positive terminal 1 and the negative terminal 2. In this embodiment, the positive terminal 1 and the negative terminal 2 can be stamped by copper plates, the package body 3 is made of insulating material, and a negative terminal nose is integrally molded at the end of the negative terminal 2 away from the package body 3.

[0034] Reference Figure 1 and Figure 2 The side wall of the package body 3 is provided with a mounting groove 31, and a heat sink 4 is installed inside the mounting groove 31 of the package body 3. In this embodiment, the heat sink 4 can be made of copper with high thermal conductivity. The surrounding wall of the heat sink 4 is integrally formed with an anti-slip block 41, and the package body 3 is provided with an anti-slip groove 311 on the inner side wall of the mounting groove 31 for the anti-slip block 41 to press into, thereby achieving a stable connection between the heat sink 4 and the package body 3. The side wall of the heat sink 4 is coated with an insulating layer 40. In this embodiment, the insulating layer 40 can be made of a dense metal oxide such as aluminum oxide, which has good corrosion resistance and good heat transfer.

[0035] Reference Figure 1 and Figure 2, the ends of the positive terminal 1 and the negative terminal 2 that are close to each other are in contact with the side walls of the heat sink 4 to facilitate the transfer of heat when the positive terminal 1 and the negative terminal 2 are working. The side wall of the heat sink 4 facing away from the positive terminal 1 is coplanar with the side wall of the package body 3, and a heat sink 42 is provided on the side wall of the heat sink 4 facing away from the positive terminal 1. Several groups of heat sinks 421 made of copper are integrally formed inside the heat sink 42, and all the heat sinks 421 are distributed at intervals inside the heat sink 42. A removable protective film 43 is glued to the side wall of the heat sink 4. In this embodiment, the protective film 43 can withstand the high temperature during the injection molding process of the package body 3 to temporarily close the heat sink 42.

[0036] Reference Figure 1 and Figure 2 The end of the package body 3 away from the heat sink 4 is penetrated by a heat pipe 5. In this embodiment, the heat pipe 5 can be made of copper with high thermal conductivity for circulating the heat transfer medium. A plurality of heat transfer sheets 52 are integrally formed on the peripheral wall of the heat pipe 5. All the heat transfer sheets 52 are penetrated inside the package body 3, and all the heat transfer sheets 52 are distributed at intervals along the circumference of the heat pipe 5.

[0037] Reference Figure 1 and Figure 2 A heat conducting sheet 51 is integrally formed on the side wall of the heat conducting pipe 5 facing the heat dissipation block 4, and the side wall of the heat conducting sheet 51 is coated with an insulating protective layer 50 formed by a dense metal oxide such as aluminum oxide, and the heat conducting sheet 51 is closely attached to the positive terminal 1 and the negative terminal 2 away from the side wall of the heat conducting pipe 5 to transfer the heat of the positive terminal 1 and the negative terminal 2 during the working process.

[0038] The implementation principle of a module diode with high heat dissipation performance in the embodiment of the present application is as follows: The heat sink 4 fits tightly with the positive terminal 1 and the negative terminal 2. The thermal conductivity of the metal heat sink 4 is greater than that of the plastic package 3. The heat sink 4 replaces part of the package 3 to dissipate heat for the working positive terminal 1 and the negative terminal 2, further improving the heat dissipation performance of the diode.

[0039] The embodiment of the present application also discloses a method for manufacturing a module diode with high heat dissipation performance, comprising the following steps: Stamping: Stamping the positive terminal 1 and the negative terminal 2; Welding: Position the positive terminal 1 and the negative terminal 2 by using a positioning device, then place the chip and the jumper on the positive terminal 1 and the negative terminal 2 inside the positioning device, and weld the above materials by using a welding device; Loading: A protective film 43 that closes the heat dissipation groove 42 is attached to the bottom surface of the heat dissipation block 4, and the protective film 43 can be peeled off, and the side wall of the heat dissipation block 4 attached with the protective film 43 is placed downward into the packaging mold, and the welded parts prepared in the welding step are placed on the side wall of the heat dissipation block 4 away from the protective film 43, and the heat dissipation block 4 is kept in close contact with the positive terminal 1 and the negative terminal 2; the heat pipe 5 is placed on the side wall of the positive terminal 1 away from the heat dissipation block 4, and the heat conductive sheet 51 is kept in close contact with the positive terminal 1 and the negative terminal 2, and the heat dissipation pipe 5 is covered with the packaging mold, and the heat conductive sheet 51, the positive terminal 1, the negative terminal 2 and the heat dissipation block 4 are made to fit closely; Packaging: Place the loaded packaging mold inside the injection molding device for packaging; Material removal: After packaging is completed, the protective film 43 is removed.

[0040] Reference Figure 3 and Figure 4 In this embodiment, the positioning device includes a positioning platform 6, two groups of positioning plates 61 slidably distributed on the top of the positioning platform 6, a driving component 7, a pressing component 8 and a lifting component 9; a positioning groove 62 is opened on the upper surface of the positioning platform 6 for the placement of the positive terminal 1 and the negative terminal 2, and to assist in positioning welding.

[0041] Reference Figure 3 and Figure 4 Two sets of positioning plates 61 are relatively distributed at both ends of the length direction of the positioning groove 62, one set of positioning plates 61 is used to press the end of the positive terminal 1 away from the negative terminal 2, and the other set of positioning plates 61 is used to press the end of the negative terminal 2 away from the positive terminal 1. There is a space between the two positioning plates 61 for the positive terminal 1 and the negative terminal 2 to pass through and be placed inside the positioning groove 62.

[0042] Reference Figure 3 and Figure 4 The driving assembly 7 includes a driving guide rod 71, a driving screw rod 72, two sets of sliding blocks 73, a limiting rod 74 and a driving motor 75; the driving guide rod 71 and the driving screw rod 72 are both installed at the bottom of the positioning platform 6, and the length directions of the driving guide rod 71 and the driving screw rod 72 are parallel to the length direction of the positioning platform 6, and the driving screw rod 72 is rotatably connected to the positioning platform 6. The driving guide rod 71 and the driving screw rod 72 both pass through the two sets of sliding blocks 73. In this embodiment, the threads at both ends of the driving screw rod 72 are opposite, one set of sliding blocks 73 is threadedly connected to one end of the driving screw rod 72, and the other set of sliding blocks 73 is threadedly connected to the other end of the driving screw rod 72.

[0043] Reference Figure 3 and Figure 4In this embodiment, the sliding blocks 73 and the positioning plates 61 are respectively arranged in a one-to-one correspondence. The limiting rods 74 are welded and fixed to both ends of each set of sliding blocks 73 in the length direction. The ends of the limiting rods 74 on each set of sliding blocks 73 away from the sliding blocks 73 penetrate the corresponding positioning plates 61, and the positioning plates 61 can slide along the length direction of the limiting rods 74, so that the sliding blocks 73 drive the corresponding positioning plates 61 to move.

[0044] Reference Figure 3 and Figure 4 The driving motor 75 is installed on the positioning platform 6, and the output end of the driving motor 75 is drivingly connected to the end of the driving screw 72 to drive the driving screw 72 to rotate, thereby driving the two sets of sliding blocks 73 to drive the positioning plates 61 to move closer to or away from each other.

[0045] Reference Figure 3 and Figure 4 The pressing assembly 8 includes a limiting nut 81, a tensioning member 82 and a driving member 83; the limiting nut 81 is threadedly connected to the end of each group of limiting rods 74 away from the sliding block 73. In this embodiment, the tensioning member 82 is a tension spring. The tensioning member 82 is installed between each group of limiting nuts 81 and the adjacent positioning plate 61; the tensioning member 82 and the limiting rod 74 are respectively arranged one by one, and each group of limiting rods 74 penetrates the corresponding tensioning member 82 to limit the extension direction of the tensioning member 82, so that the tensioning member 82 can drive the positioning plate 61 away from the positioning platform 6 through its own tension.

[0046] Reference Figure 3 and Figure 4 The driving member 83 is installed between the positioning platform 6 and the positioning plate 61 to drive the positioning plate 61 to approach the positioning platform 6 and to drive the positioning plate 61 to press the ends of the positive terminal 1 and the negative terminal 2 that are away from each other. The driving member 83 includes a fixing plate 831, a guide ring 832, an extension block 833 and a driving rope 834; the fixing plates 831 are located at both ends of each group of sliding blocks 73 in the length direction, and the fixing plates 831 are distributed on both sides of the positioning platform 6 in the width direction, and the fixing plates 831 are welded and fixed to the limit rods 74 adjacent to the ends of each group of sliding blocks 73.

[0047] Reference Figure 3 and Figure 4, the extension blocks 833 are welded and fixed on both sides of the positioning platform 6 in the width direction, and the extension blocks 833 are relatively distributed at both ends of the positioning platform 6 in the length direction. The guide rings 832 are welded and fixed to the side wall of each set of fixing plates 831 facing the positioning plate 61, and the guide rings 832 on the same side of the positioning platform 6 are located between the two sets of extension blocks 833 on the same side, and each set of guide rings 832 corresponds to the adjacent extension blocks 833. The driving rope 834 is glued and connected to the side wall of each set of extension blocks 833 facing the corresponding guide ring 832, and the end of each driving rope 834 away from the extension block 833 passes through the corresponding guide ring 832, and is glued and connected to the side wall of the positioning plate 61 facing the guide ring 832.

[0048] Reference Figure 3 and Figure 4 When the sliding block 73 drives the two groups of positioning plates 61 to approach each other, the driving rope 834 pulls the positioning plate 61 to gradually approach the fixed plate 831, so that the positioning plate 61 gradually approaches the positioning platform 6 and presses the positive terminal 1 and the negative terminal 2 inside the positioning groove 62.

[0049] Reference Figure 3 and Figure 4 The ejection assembly 9 includes a bottom plate 91, a lifting guide rod 92, a lifting plate 93, a ejection frame 94, a reset member 95 and a linkage member 96; the bottom plate 91 is welded and fixed to the bottom of the positioning platform 6, the lifting guide rod 92 is welded and installed between the side wall of the positioning platform 6 and the bottom plate 91 along the height direction of the positioning platform 6, the lifting plate 93 is slidably sleeved on the lifting guide rod 92, and the lifting plate 93 is located between the two sets of sliding blocks 73.

[0050] Reference Figure 3 and Figure 4 The ejector rack 94 is welded and installed on the side wall of the lifting plate 93 facing the positioning platform 6, and a ejector opening 63 is opened through the bottom wall of the positioning groove 62 for the end of the ejector rack 94 away from the lifting plate 93 to pass through and lift up the welded parts of the positive terminal 1 and the negative terminal 2.

[0051] Reference Figure 3 and Figure 4 In this embodiment, the reset member 95 is a tension spring. The reset member 95 is sleeved on each set of lifting guide rods 92, and the reset member 95 is installed between the lifting plate 93 and the bottom plate 91, so that the lifting plate 93 is driven to move toward the direction close to the bottom plate 91 by the tension of the reset member 95 itself, thereby driving the ejecting rack 94 to approach the bottom plate 91.

[0052] Reference Figure 3 and Figure 4The linkage member 96 is installed between the sliding block 73 and the lifting plate 93 to drive the lifting plate 93 to approach the positioning platform 6 and drive the ejection rack 94 to eject the welded parts out of the positioning groove 62. The linkage member 96 includes a wire ring 961 and a traction rope 962; the wire ring 961 is located on both sides of the width direction of the lifting plate 93, each group of wire rings 961 is located between the lifting plate 93 and the sliding block 73, and each wire ring 961 is welded and fixed to the side wall of the positioning platform 6 facing the lifting plate 93.

[0053] Reference Figure 3 and Figure 4 , the traction rope 962 is glued to each set of sliding blocks 73, the traction rope 962 corresponds to the adjacent wire ring 961, and the end of each traction rope 962 away from the sliding block 73 passes through the corresponding wire ring 961 and is glued to the lifting plate 93. When the two sets of sliding plates are away from each other, the traction rope 962 pulls the lifting plate 93, so that the lifting plate 93 drives the ejecting frame 94 to move in a direction away from the bottom plate 91. In this embodiment, when the traction rope 962 is in a relaxed state, the reset member 95 supports the lifting plate 93, and makes the side wall of the ejecting frame 94 away from the lifting plate 93 coplanar with the bottom wall of the positioning groove 62, so as to support the positive terminal 1 and the negative terminal 2.

[0054] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A module diode with high heat dissipation performance, comprising a positive terminal (1), a negative terminal (2) and a package (3) arranged between the positive terminal (1) and the negative terminal (2); characterized in that: The side wall of the packaging body (3) is provided with a mounting groove (31) extending therethrough, a heat sink (4) is arranged inside the mounting groove (31), the ends of the positive terminal (1) and the negative terminal (2) facing each other are both in contact with the heat sink (4), and the side wall of the heat sink (4) is provided with an insulating layer (40); the side wall of the heat sink (4) is provided with an anti-slip block (41), and an anti-slip groove (311) is provided inside the mounting groove (31) for the anti-slip block (41) to be pressed against.

2. The module diode with high heat dissipation performance according to claim 1, characterized in that: A heat dissipation groove (42) is provided on the side wall of the heat dissipation block (4) facing away from the positive terminal (1), a plurality of groups of heat dissipation fins (421) are arranged at intervals inside the heat dissipation groove (42), and a protective film (43) for sealing the heat dissipation groove (42) is detachably provided on the heat dissipation block (4).

3. The module diode with high heat dissipation performance according to claim 1, characterized in that: The packaging body (3) is provided with a heat conducting pipe (5) for circulating a heat conducting medium, the side wall of the heat conducting pipe (5) is provided with a heat conducting sheet (51) for affixing the positive terminal (1) and the negative terminal (2), the side wall of the heat conducting sheet (51) facing away from the heat conducting pipe (5) is provided with an insulating protective layer (50), and a plurality of groups of heat conducting sheets (52) are provided at intervals on the peripheral wall of the heat conducting pipe (5) and are inserted into the interior of the packaging body (3).

4. A method for manufacturing a module diode with high heat dissipation performance according to any one of claims 1 to 3, characterized in that: The steps include: Stamping: Stamping the positive terminal (1) and the negative terminal (2); Welding: positioning the positive terminal (1) and the negative terminal (2) by means of a positioning device, placing the chip and the jumper on the positive terminal (1) and the negative terminal (2) inside the positioning device, and welding the above materials by means of a welding device; Loading: a protective film (43) that seals the heat dissipation groove (42) is attached to the bottom surface of the heat dissipation block (4), and the protective film (43) can be peeled off, and the side wall of the heat dissipation block (4) attached with the protective film (43) is placed in the packaging mold downward, and the welded part obtained in the welding step is placed on the side wall of the heat dissipation block (4) away from the protective film (43), and the heat dissipation block (4) is kept in close contact with the positive terminal (1) and the negative terminal (2); a heat pipe (5) is placed on the side wall of the positive terminal (1) away from the heat dissipation block (4), and the heat conductive sheet (51) is kept in close contact with the positive terminal (1) and the negative terminal (2), and the packaging mold is used to cover the heat pipe (5), and the heat conductive sheet (51), the positive terminal (1), the negative terminal (2) and the heat dissipation block (4) are made to fit closely; Packaging: Place the loaded packaging mold inside the injection molding device for packaging; After packaging, the protective film (43) is removed.

5. The method for manufacturing a module diode with high heat dissipation performance according to claim 4, characterized in that: The positioning device comprises a positioning platform (6), two groups of positioning plates (61) movably arranged on the top of the positioning platform (6), a driving component (7), a pressing component (8) and a pushing component (9); the upper surface of the positioning platform (6) is provided with a positioning groove (62) for placing the positive terminal (1) and the negative terminal (2); a clearance space for the positive terminal (1) and the negative terminal (2) to pass through is reserved between the two positioning plates (61); the driving component (7) is used to drive the two groups of positioning plates (61) to move closer to each other or farther away from each other; the two positioning plates (61) are relatively distributed at the ends of the positive terminal (1) and the negative terminal (2) that are away from each other; the pressing component (8) is used to drive the positioning plates (61) to press the ends of the positive terminal (1) and the negative terminal (2) that are away from each other; the pushing component (9) is used to push the welded part out of the positioning groove (62).

6. The method for manufacturing a module diode with high heat dissipation performance according to claim 5, characterized in that: The driving assembly (7) comprises a driving guide rod (71), a driving screw rod (72), two sets of sliding blocks (73), a limiting rod (74) and a driving motor (75); the driving guide rod (71) and the driving screw rod (72) are both arranged at the bottom of the positioning platform (6), and the length directions of the driving guide rod (71) and the driving screw rod (72) are parallel to each other; the two sliding blocks (73) are both sleeved on the driving guide rod (71) and the driving screw rod (72), and the driving screw rod (72) is rotationally connected to the positioning platform (6). The threads at both ends of the driving screw (72) are opposite, one of the sliding blocks (73) is threadedly connected to one end of the driving screw (72), and the other sliding block (73) is threadedly connected to the other end of the driving screw (72); the sliding blocks (73) and the positioning plates (61) are respectively arranged in a one-to-one correspondence, and the limiting rod (74) is arranged between the corresponding sliding blocks (73) and the positioning plates (61); the driving motor (75) is arranged on the positioning platform (6) to drive the driving screw (72) to rotate.

7. The method for manufacturing a module diode with high heat dissipation performance according to claim 6, characterized in that: The pressing assembly (8) comprises a limiting nut (81), a tensioning member (82) and a driving member (83); the end of each limiting rod (74) away from the sliding block (73) passes through the positioning plate (61), and the positioning plate (61) can slide along the length direction of the limiting rod (74); the limiting nut (81) is arranged at the end of each group of limiting rods (74) away from the sliding block (73), and the tensioning member (82) is arranged between the limiting nut (81) and the positioning plate (61) to drive the positioning plate (61) away from the positioning platform (6) through its own tension; the driving member (83) is arranged between the positioning platform (6) and the positioning plate (61) to drive the positioning plate (61) close to the positioning platform (6).

8. The method for manufacturing a module diode with high heat dissipation performance according to claim 7, characterized in that: The driving member (83) comprises a fixed plate (831), a guide ring (832), an extension block (833) and a driving rope (834); the fixed plate (831) is arranged at both ends of each group of sliding blocks (73) in the length direction, and the guide ring (832) is arranged on the side wall of each group of fixed plates (831) facing the positioning plate (61); the extension block (833) is arranged on both sides of the width direction of the positioning platform (6), and the extension blocks (833) are located at both ends of the positioning platform (6); the driving rope (834) is arranged on the side wall of each group of extension blocks (833) facing the adjacent guide ring (832), and the end of each driving rope (834) away from the extension block (833) passes through the adjacent guide ring (832) and is connected to the positioning plate (61).

9. The method for manufacturing a module diode with high heat dissipation performance according to claim 6, characterized in that: The ejection assembly (9) comprises a bottom plate (91), a lifting guide rod (92), a lifting plate (93), an ejection frame (94), a reset member (95) and a linkage member (96); the bottom plate (91) is arranged at the bottom of the positioning platform (6), the lifting guide rod (92) is arranged between the positioning platform (6) and the bottom plate (91) along the height direction of the positioning platform (6); the lifting plate (93) is slidably sleeved on the lifting guide rod (92), and the ejection frame (94) is arranged On the side wall of the lifting plate (93) facing the positioning platform (6), the bottom wall of the positioning groove (62) is penetrated by a material ejection opening (63) for the ejection rack (94) to pass through; the reset member (95) is arranged between the lifting plate (93) and the bottom plate (91) to drive the lifting plate (93) away from the positioning platform (6) through its own pulling force; the linkage member (96) is arranged between the sliding block (73) and the lifting plate (93) to drive the lifting plate (93) close to the positioning platform (6).

10. The method for manufacturing a module diode with high heat dissipation performance according to claim 9, characterized in that: The linkage member (96) comprises a wire ring (961) and a traction rope (962); the lifting plate (93) is located between the two groups of sliding blocks (73), the wire ring (961) is located between the lifting plate (93) and each group of sliding blocks (73), and each of the wire rings (961) is connected to the side wall of the positioning platform (6) facing the ejection rack (94); the traction rope (962) is arranged on each group of sliding blocks (73), and the end of each of the traction ropes (962) away from the sliding block (73) passes through the adjacent wire ring (961) and is connected to the lifting plate (93).

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