Powder dipping process for improving bubble problem caused by edge warping after busbar welding
After ultrasonic welding of the stacked busbar, the edges of the busbar are riveted and fixed, and the coating is melted at the stacked busbar by electrostatic spraying and high-temperature baking, which solves the bubble problem caused by the curling edges after welding, and significantly improves the product yield.
Patent Information
- Application Number
- CN202411758034.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-03
- Publication Date
- 2025-03-14
AI Technical Summary
During the manufacturing process of stacked busbars, gaps caused by curling edges after ultrasonic welding will not easily cure under the powder immersion process and produce bubbles, affecting product quality.
After ultrasonic welding, the edges of the busbar lamination position are riveted and fixed, and the paint is melted at the busbar lamination position by electrostatic spraying and high-temperature baking.
It effectively avoids the gaps generated by ultrasonic vibration of the stacked busbar, reduces the generation of bubbles under the powder immersion process, and significantly improves product yield.
Smart Images
Figure CN119629892A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the field of powder dipping technology for laminated busbars, and in particular to a powder dipping technology for improving the problem of bubbles caused by edge warping after busbar welding. Background Art
[0002] With the rapid development of the electronics industry, the integration and performance requirements of electronic products are getting higher and higher, and the layout density and reliability requirements of circuit boards are also getting higher and higher. As a new type of circuit board structure, the laminated busbar can achieve high-density wiring and signal transmission by stacking multiple conductive layers together. However, there are some technical problems that need to be solved in the manufacturing and use of the laminated busbar. For example, when the laminated busbar is ultrasonically welded, it is easy to produce gaps (warping edges) due to vibration, and it is not easy to solidify and produce bubbles in the powder dipping process ( Figure 1 ), thus affecting product quality.
[0003] Therefore, in view of the shortcomings of the existing technology, it is necessary to design a powder dipping process to improve the bubble problem caused by warping after busbar welding, so as to solve the above problems. Summary of the invention
[0004] In order to overcome the above-mentioned deficiencies in the prior art, the present invention aims to provide a powder dipping process for improving the problem of bubbles caused by edge warping after busbar welding.
[0005] To achieve the above-mentioned purpose and other related purposes, the technical solution provided by the present invention is: a powder dipping process for improving the bubble problem caused by edge warping after busbar welding, comprising the following steps: Step 1: Busbar positioning; Step 2: Weld at the center of the busbar stacking position; Step 3: Rivet the edges of the busbar stacking positions; Step 4: Dip the busbars in powder and bake them at the stacking position.
[0006] The preferred technical solution is: in step 1, at least two groups of copper bars are stacked and positioned and fixed using a positioning fixture.
[0007] The preferred technical solution is: in step 2, ultrasonic welding is used to fuse the center of the busbar stacking position into a whole.
[0008] The preferred technical solution is: in step 3, the edges of the busbar stacking positions are riveted and fixed by TOX riveting.
[0009] The preferred technical solution is: in step 4, the coating is first sprayed on the busbar stacking position by electrostatic spraying, and then the coating is melted at the busbar stacking position by high-temperature baking.
[0010] Due to the application of the above technical solution, the present invention has the following beneficial effects: The present invention provides a powder dipping process for improving the problem of bubbles caused by warping after busbar welding. After ultrasonic welding, the edges of the busbar stacking position are riveted and fixed to avoid gaps between the stacked busbars due to ultrasonic vibration. In the powder dipping process, bubbles are easily generated. This process can greatly improve the product yield. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1 This is a physical picture of the busbar under the existing powder dipping and baking process.
[0012] Figure 2 This is a physical picture of the busbar using the powder dipping process of this scheme. DETAILED DESCRIPTION
[0013] The following is a description of the implementation of the present invention by means of specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.
[0014] See also Figure 1-Figure 2 . It should be noted that in the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the invented product is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", "third" and the like are only used to distinguish the descriptions, and cannot be understood as indicating or implying relative importance. Terms such as "horizontal", "vertical", and "overhanging" do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0015] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection, it can be a mechanical connection, it can be an electrical connection, it can be a direct connection, it can be indirectly connected through an intermediate medium, and it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0016] Example: According to an overall technical concept of the present invention, a powder dipping process is provided to improve the problem of bubbles caused by warping after busbar welding, comprising the following steps: Step 1: Busbar positioning; Step 2: Weld at the center of the busbar stacking position; Step 3: Rivet the edges of the busbar stacking positions; Step 4: Dip the busbars in powder and bake them at the stacking position.
[0017] like Figure 2 As shown, in an exemplary embodiment of the present invention, in the step 1, at least two groups of copper bars are stacked and positioned and fixed using a positioning fixture.
[0018] like Figure 2 As shown, in an exemplary embodiment of the present invention, in the step 2, ultrasonic welding is used to fuse the center of the busbar stacking position into a whole.
[0019] like Figure 2 As shown, in an exemplary embodiment of the present invention, in step 3, the edges of the busbar stacking positions are riveted and fixed by TOX riveting.
[0020] like Figure 2 As shown, in an exemplary embodiment of the present invention, in the step 4, the coating is first sprayed on the busbar stacking position by electrostatic spraying, and then the coating is melted at the busbar stacking position by high-temperature baking.
[0021] Therefore, the present invention has the following advantages: The present invention provides a powder dipping process for improving the problem of bubbles caused by warping after busbar welding. After ultrasonic welding, the edges of the busbar stacking position are riveted and fixed to avoid gaps between the stacked busbars due to ultrasonic vibration. In the powder dipping process, bubbles are easily generated. This process can greatly improve the product yield.
[0022] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.
Claims
1. A powder dipping process for improving the bubble problem caused by edge warping after busbar welding, characterized in that: The following steps are involved: Step 1: Busbar positioning; Step 2: Welding at the center of the busbar stacking position; Step 3: Rivet the edges of the busbar stacking positions; Step 4: Dip the busbars in powder and bake them at the stacking position.
2. A powder dipping process for improving the bubble problem caused by edge warping after busbar welding according to claim 1, characterized in that: In the step 1, at least two groups of copper bars are stacked and positioned and fixed using a positioning fixture.
3. The powder dipping process for improving the bubble problem caused by edge warping after busbar welding according to claim 1 is characterized in that: In the step 2, ultrasonic welding is used to fuse the center of the busbar stacking position into a whole.
4. The powder dipping process for improving the bubble problem caused by edge warping after busbar welding according to claim 1 is characterized in that: In the step 3, the edges of the busbar stacking positions are riveted and fixed by TOX riveting.
5. The powder dipping process for improving the bubble problem caused by edge warping after busbar welding according to claim 1 is characterized in that: In the step 4, the coating is first sprayed on the busbar stacking position by electrostatic spraying, and then the coating is melted at the busbar stacking position by high-temperature baking.