Modularized self-adaptive immersion jet liquid cooling system for high-power server

Abstract

The invention belongs to the technical field of data center cooling, and relates to a modular self-adaptive immersion jet liquid cooling system for a high-power server, the high-power server comprises a case, the case is provided with a sealed cavity, the sealed cavity is internally provided with a plurality of devices with different heating degrees, the devices are completely immersed in a refrigerant, and the components are arranged in the sealed cavity. A modularized jet flow device is arranged on a device with the relatively high heating degree, the modularized jet flow device independently conducts jet flow cooling on the device with the relatively high heating degree, and the sealing cavity is further provided with a machine box refrigerant inlet and a machine box refrigerant outlet. And the case refrigerant inlet and the case refrigerant outlet penetrate from the inside of the sealing cavity to the outside of the case. The invention aims to solve the problem that high-efficiency and accurate heat dissipation of high-power heating elements such as chips cannot be realized in the prior art.

Description

Technical Field

[0001] The present invention belongs to the technical field of data center cooling, and in particular, relates to a modular adaptive immersion jet liquid cooling system for a high-power server. Background Art

[0002] In the Internet era, the surge in data and information has led to a sharp increase in data center energy consumption, especially the energy consumption of cooling equipment, which has become an important part of the total energy consumption of data centers. Reducing the energy consumption of cooling equipment is one of the key strategies to improve the power efficiency ratio (PUE) of data centers. As the thermal power of heat-generating components such as CPUs and GPUs rises rapidly, traditional air cooling technology can no longer meet the cooling needs of modern data center servers. Therefore, liquid cooling technology is gradually becoming the mainstream of data center cooling solutions.

[0003] Immersion liquid cooling technology involves completely immersing the server in a dielectric fluid and using the circulation of the coolant to remove the heat generated by the device, thereby efficiently managing the thermal energy of the server. However, in traditional immersion liquid cooling technology, the temperature distribution of the liquid refrigerant inside the server is stepped, and the heat generation of different components (such as chips and other components) varies greatly. In the prior art, this problem is usually addressed by increasing the flow rate of the liquid refrigerant and accelerating its circulation, and specific refrigerant flow channels need to be designed. However, this method not only increases the design complexity of the liquid cooling system and increases the manufacturing cost, but also leads to higher energy consumption, which is not conducive to energy saving. Therefore, it is necessary to further explore more efficient heat dissipation methods based on the existing immersion liquid cooling technology to achieve efficient and precise heat dissipation of high-power heating components such as chips. Summary of the invention

[0004] In view of the problem in the prior art that it is impossible to efficiently and accurately dissipate heat for high-power heating elements such as chips, the present invention provides a modular adaptive immersion jet liquid cooling system for high-power servers.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A modular adaptive immersion jet liquid cooling system is used in a high-power server, characterized in that the high-power server includes a chassis, the chassis has a sealed cavity, a plurality of devices with different heat levels are arranged in the sealed cavity, the devices are completely immersed in the refrigerant, a modular jet device is provided on the device with a relatively high heat level, the modular jet device performs jet cooling on the device with a relatively high heat level separately, the sealed cavity is also provided with a chassis refrigerant inlet and a chassis refrigerant outlet, the chassis refrigerant inlet and the chassis refrigerant outlet extend from the inside of the sealed cavity to the outside of the chassis.

[0007] As described above, the modular adaptive immersion jet liquid cooling system, further, the devices include chips, memory, PCB circuit board and hard disk, and the devices with relatively high heat generation level include at least chips.

[0008] As described above, the modular adaptive immersion jet liquid cooling system, further, the chassis refrigerant inlet and the chassis refrigerant outlet are arranged on the back side of the high-power server, and the chassis refrigerant outlet is located in the middle of the back of the high-power server.

[0009] The modular adaptive immersion jet liquid cooling system as described above, further, the chassis refrigerant inlet and the chassis refrigerant outlet are provided with quick connectors.

[0010] The modular adaptive immersion jet liquid cooling system as described above, further, the modular jet device includes a device refrigerant inlet, a liquid extraction micro pump, a sensor control unit and a plurality of jet nozzles, the sensor control unit includes a sensor module and a control module, wherein the control module determines the flow rate required for jet cooling according to the temperature data and power data obtained by the sensor module, and then drives the liquid extraction micro pump to draw refrigerant from the device refrigerant inlet, and sprays it onto the device with relatively high heat level through the plurality of jet nozzles.

[0011] In the modular adaptive immersion jet liquid cooling system as described above, further, the sensing module includes a power monitor and a temperature sensor, wherein the power monitor is used to obtain power data, and the temperature sensor is used to obtain temperature data.

[0012] The modular adaptive immersion jet liquid cooling system as described above, further, the control module includes a flow controller, a data storage device and a feedback controller, wherein the flow controller determines the flow rate required for jet cooling according to the power data obtained by the power monitor and the temperature data obtained by the temperature sensor, and at the same time, the data storage device stores the power data and temperature data obtained historically, and the feedback controller generates a negative feedback signal to control the flow controller according to the power data and temperature data obtained historically.

[0013] As described above, the modular adaptive immersion jet liquid cooling system, further, the liquid pumping micro pump is a cylinder, the top of the liquid pumping micro pump is provided with the sensor control unit, the side column surface of the liquid pumping micro pump is provided with the device refrigerant inlet, and the bottom of the liquid pumping micro pump is provided with a plurality of jet nozzles.

[0014] As described above, in the modular adaptive immersion jet liquid cooling system, further, the area of ​​the liquid extraction micro pump is comparable to the area of ​​the device with relatively high heat generation.

[0015] As described above, the modular adaptive immersion jet liquid cooling system, further, the diameter of the cylinder is 40-60mm, the inner diameter of the terminal nozzle of the jet nozzle is 3mm, and the distance between the terminal nozzle and the device with relatively high heat generation is 1 to 3 times of the inner diameter.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. The modular jet device of the present invention and a single high heat flux density component in a blade server, such as a central processing unit (CPU) or / and a graphics processing unit (GPU), form a heat dissipation unit for jet cooling. The modular jet device extracts the liquid refrigerant inside the blade server and sprays it at high speed onto the hot surface of the high heat flux density component to form a thin thermal boundary layer and a velocity boundary layer, thereby generating a very high heat transfer coefficient and forming a local strong heat exchange area to achieve the purpose of rapid cooling, thereby solving the problem in the prior art that it is impossible to efficiently and accurately dissipate heat for high-power heating components such as chips.

[0018] 2. The refrigerant of the present invention enters the system uniformly through the refrigerant inlet of the chassis. Different from the traditional immersion jet liquid cooling system, the present invention adopts a unique modular design, thereby avoiding the complex design and difficult-to-adjust refrigerant transmission channel.

[0019] 3. The refrigerant injection device of the present invention adopts a modular design. It does not need to design a complex refrigerant transmission channel inside the server and set a high-pressure pump outside the chassis to transport the refrigerant. It can effectively reduce the pressure drop loss of the refrigerant entering and leaving the chassis, while reducing the pump power loss. It can also reduce the risk of refrigerant leakage, which can effectively improve the computing performance and equipment stability of the data center server and increase the effective service life of the server.

[0020] 4. The sensing module of the present invention includes a power monitor and a temperature sensor, which can record and calculate the temperature data and power data of the current heating chip in real time; the control module includes a flow controller, a data storage device and a feedback controller. The data storage device first saves the temperature data and power data of the heating chip recorded by the sensing module, and then adjusts the jet flow rate of the modular jet device based on these data through the feedback controller. Specifically, as the chip temperature increases, the jet flow rate used for cooling increases accordingly; conversely, when the chip temperature decreases, the jet flow rate decreases. Through this negative feedback control mechanism, the system can adaptively adjust the cooling process of the heating chip to ensure that its temperature remains within a safe and reasonable range, while taking into account the dual needs of cooling efficiency and energy saving. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 It is a schematic structural diagram of a modular adaptive immersion jet liquid cooling system for a high-power server in an embodiment of the present invention.

[0023] Figure 2 It is a top view of a modular adaptive immersion jet liquid cooling system for a high-power server in an embodiment of the present invention.

[0024] Figure 3 It is a schematic diagram of the three-dimensional structure of the modular heat dissipation unit in an embodiment of the present invention.

[0025] Figure 4 Schematic diagram of the structure of a modular jet device in an embodiment of the present invention.

[0026] Figure 5 Schematic diagram of the operation of the modular jet device in an embodiment of the present invention (arrows indicate the flow direction of the refrigerant).

[0027] Among them, 1. Modular jet device; 2. Chip; 3. Memory; 4. PCB circuit board; 5. Hard disk; 6. Chassis refrigerant inlet; 7. Chassis refrigerant outlet; 8. Chassis; 11. Device refrigerant inlet; 12. Liquid extraction micro pump; 13. Sensor control unit; 14. Jet nozzle. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0029] Example:

[0030] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations of the embodiments of the present invention are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0031] In the description of the present invention, "multiple" means at least two, such as two, three, etc., unless otherwise clearly defined. In addition, unless otherwise clearly defined and defined, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] Figure 1 It is a schematic structural diagram of a modular adaptive immersion jet liquid cooling system for a high-power server in an embodiment of the present invention. Figure 2 FIG. 1 is a top view of a modular adaptive immersion jet liquid cooling system for a high-power server in an embodiment of the present invention. Figure 1 and Figure 2 As shown, a modular adaptive immersion jet liquid cooling system in an embodiment of the present invention is used in a high-power server, wherein the high-power server comprises a chassis 8, wherein the chassis 8 has a sealed cavity, wherein a plurality of devices with different heat levels are arranged in the sealed cavity, wherein the devices are completely immersed in a refrigerant, and a modular jet device 1 is arranged on the device with a relatively high heat level, wherein the modular jet device 1 performs jet cooling on the device with a relatively high heat level separately, and the sealed cavity is further provided with a chassis refrigerant inlet 6 and a chassis refrigerant outlet 7, wherein the chassis refrigerant inlet 6 and the chassis refrigerant outlet 7 extend from the inside of the sealed cavity to the outside of the chassis 8.

[0033] In a specific implementation, the high-power server can be a blade server of a certain model, and a plurality of devices with different heat generation levels can include a chip 2, a memory 3, a PCB circuit board 4 and a hard disk 5. The device with a relatively high heat generation level includes at least a chip 2. The above heat generation devices are completely immersed in the refrigerant, and the refrigerant can use a dielectric fluid. The chassis refrigerant inlet 6 and the chassis refrigerant outlet 7 are arranged on the back side of the high-power server, and the chassis refrigerant outlet 7 is located in the middle of the back of the high-power server, which is conducive to achieving uniform distribution of the refrigerant in the chassis 8. It is preferred to use quick connectors for the chassis refrigerant inlet 6 and the chassis refrigerant outlet 7. The modular jet device 1 and a single high heat flux density component in the blade server, such as a central processing unit (CPU) or / and a graphics processing unit (GPU), form a heat dissipation unit for jet cooling. The modular jet device 1 extracts the liquid refrigerant inside the blade server and sprays it at high speed onto the hot surface of the high heat flux density component to form a thin thermal boundary layer and a velocity boundary layer, thereby generating a very high heat transfer coefficient (HTC) and forming a local intense heat exchange area to achieve the purpose of rapid cooling, thereby solving the problem in the prior art that it is impossible to efficiently and accurately dissipate heat for high-power heating components such as the chip 2.

[0034] Figure 3 It is a schematic diagram of the three-dimensional structure of the modular heat dissipation unit in an embodiment of the present invention. Figure 4 Schematic diagram of the structure of a modular jet device in an embodiment of the present invention. Figure 5 FIG. 1 is a schematic diagram of the operation of the modular jet device in an embodiment of the present invention (arrows indicate the flow direction of the refrigerant). Figures 3 to 5 As shown, in some embodiments, the modular jet device 1 includes a device refrigerant inlet 11, a liquid extraction micro pump 12, a sensor control unit 13 and a plurality of jet nozzles 14, wherein the sensor control unit 13 includes a sensor module and a control module, wherein the control module determines the flow required for jet cooling according to the temperature data and power data obtained by the sensor module, and then drives the liquid extraction micro pump 12 to draw the refrigerant from the device refrigerant inlet 11, and sprays it onto the device with a relatively high degree of heat through the plurality of jet nozzles 14. Further, the sensor module includes a power monitor and a temperature sensor, wherein the power monitor is used to obtain power data, and the temperature sensor is used to obtain temperature data. The control module includes a flow controller, a data storage device and a feedback controller, wherein the flow controller determines the flow required for jet cooling according to the power data obtained by the power monitor and the temperature data obtained by the temperature sensor, and at the same time, the data storage device stores the power data and temperature data obtained historically, and the feedback controller generates a negative feedback signal to control the flow controller according to the power data and temperature data obtained historically.

[0035] In a specific implementation, the sensing module includes a power monitor and a temperature sensor, which can record and calculate the temperature data and power data of the current heating chip 2 in real time; the control module includes a flow controller, a data storage device and a feedback controller. The data storage device first saves the temperature data and power data of the heating chip 2 recorded by the sensing module, and then adjusts the jet flow rate of the modular jet device 1 based on these data through the feedback controller. Specifically, as the temperature of the chip 2 increases, the jet flow rate used for cooling increases accordingly; conversely, when the temperature of the chip 2 decreases, the jet flow rate decreases. Through this negative feedback control mechanism, the system can adaptively adjust the cooling process of the heating chip 2 to ensure that its temperature remains within a safe and reasonable range, while taking into account the dual needs of cooling efficiency and energy saving.

[0036] In some embodiments, the liquid pump 12 is a cylinder, the top of the liquid pump 12 is provided with the sensor control unit 13, the side cylinder of the liquid pump 12 is provided with the device refrigerant inlet 11, and the bottom of the liquid pump 12 is provided with a plurality of jet nozzles 14. The area of ​​the liquid pump 12 is equivalent to the area of ​​the device with a relatively high degree of heat generation. The diameter of the cylinder is 40-60 mm, the inner diameter of the terminal nozzle of the jet nozzle 14 is 3 mm, and the distance between the terminal nozzle and the device with a relatively high degree of heat generation is 1 to 3 times the inner diameter.

[0037] During specific implementation, for the modular jet device 1, the size of the chassis refrigerant inlet 6 is calculated based on the maximum heating power and required flow rate of the chip 2, and can be designed with reference to the jet pipe diameter of the conventional immersion jet liquid cooling server chassis 8. A sensor control unit 13 is integrated above the liquid extraction micro pump 12 to accurately monitor key information such as the temperature and power of the chip 2, and to make real-time adjustments, thereby achieving efficient and energy-saving heat dissipation. The bottom surface size of the liquid extraction micro pump 12 matches the heating chip 2, usually a circular area with a diameter of 40-60mm. Multiple jet nozzles 14 are regularly distributed on the bottom surface of the micro pump body to ensure that its effective spray area can evenly cover the surface of the heating chip 2. The inner diameter of the nozzle end is generally about 3mm, and the distance between the nozzle end and the heating chip 2 is generally 1 to 3 times the inner diameter. The refrigerant is sprayed to the heating surface of the chip 2 through the jet nozzle 14 for forced convection heat exchange.

[0038] The working principle and process of the modular adaptive immersion jet liquid cooling system for high-power servers of the present invention are as follows: the refrigerant enters uniformly through the chassis refrigerant inlet 6. Unlike the traditional immersion jet liquid cooling system, the present invention adopts a unique modular design, thereby avoiding the refrigerant transmission channel with complex design and difficult adjustment. Therefore, the chassis refrigerant inlet 6 does not need a high-pressure pump to transport high-flow and high-pressure refrigerant. All heat-generating units in the server are immersed in the refrigerant, and the heat dissipation of low heat flux density components and the heat dissipation of part of the chip 2 are achieved through normal circulation flow. For local high heat flux density components (such as GPU, CPU and other chips), jet cooling is performed separately through the modular jet device 1 to enhance local heat exchange: first, the sensor control unit 13 adjusts the required heat dissipation flow according to the real-time recorded chip 2 temperature, power and other data, and then the liquid pump 12 pumps the refrigerant from the device refrigerant inlet 11 into the pump body of the liquid pump 12, and evenly sprays it onto the surface of the chip 2 through multiple jet nozzles 14 for efficient heat dissipation. The sensor control unit 13 adjusts the refrigerant flow rate pumped by the liquid extraction micro pump 12 according to the real-time data feedback such as the temperature change of the chip 2, realizes the adaptive control of the jet flow rate, and satisfies the heat dissipation demand of the chip 2 in an efficient and energy-saving manner. At the end of the entire circulation system, all the refrigerants in the chassis 8 are discharged from the system through the chassis refrigerant outlet 7.

[0039] In the present invention, the information collected by the modular jet device 1 can be visualized by data acquisition instruments or software, and can also realize real-time monitoring and recording of server power consumption, effectively preventing and avoiding dangerous situations such as server overload and insufficient heat dissipation capacity that excessively waste the service life of the server. This significantly improves the equipment stability and reliability of the liquid cooling server and ensures the computing performance of the server.

[0040] It should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0041] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0042] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0043] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable ordinary technicians in the field to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made based on the essence of the content of the present invention should be included in the protection scope of the present invention.

Claims

1. A modular adaptive immersion jet liquid cooling system for high power servers, characterized in that: The high-power server includes a chassis having a sealed cavity therein. A variety of devices with different heat levels are arranged in the sealed cavity. The devices are completely immersed in a refrigerant. A modular jet device is provided on the device with a relatively high heat level. The modular jet device performs jet cooling on the device with a relatively high heat level separately. The sealed cavity is also provided with a chassis refrigerant inlet and a chassis refrigerant outlet. The chassis refrigerant inlet and the chassis refrigerant outlet extend from the inside of the sealed cavity to the outside of the chassis.

2. The modular adaptive immersion jet liquid cooling system according to claim 1, characterized in that: The devices include chips, memory, PCB circuit boards and hard disks, and the devices with relatively high heat generation levels include at least chips.

3. The modular adaptive immersion jet liquid cooling system according to claim 1, characterized in that: The chassis refrigerant inlet and the chassis refrigerant outlet are arranged on one side of the back of the high-power server, and the chassis refrigerant outlet is located in the middle of the back of the high-power server.

4. The modular adaptive immersion jet liquid cooling system according to claim 1, characterized in that: The chassis refrigerant inlet and the chassis refrigerant outlet are provided with quick connectors.

5. The modular adaptive immersion jet liquid cooling system according to claim 1, characterized in that: The modular jet device includes a refrigerant inlet of the device, a liquid extraction micro pump, a sensor control unit and a plurality of jet nozzles, wherein the sensor control unit includes a sensor module and a control module, wherein the control module determines the flow rate required for jet cooling according to the temperature data and power data obtained by the sensor module, and then drives the liquid extraction micro pump to draw refrigerant from the refrigerant inlet of the device, and sprays it onto the device with relatively high heat generation through the plurality of jet nozzles.

6. The modular adaptive immersion jet liquid cooling system according to claim 5, characterized in that: The sensing module includes a power monitor and a temperature sensor, wherein the power monitor is used to obtain power data, and the temperature sensor is used to obtain temperature data.

7. The modular adaptive immersion jet liquid cooling system according to claim 6, characterized in that: The control module includes a flow controller, a data storage device and a feedback controller, wherein the flow controller determines the flow rate required for jet cooling based on the power data obtained by the power monitor and the temperature data obtained by the temperature sensor. At the same time, the data storage device stores historically obtained power data and temperature data. The feedback controller generates a negative feedback signal to control the flow controller based on the historically obtained power data and temperature data.

8. The modular adaptive immersion jet liquid cooling system according to claim 5, characterized in that: The liquid pumping micro pump is a cylinder, the top of the liquid pumping micro pump is provided with the sensor control unit, the side column surface of the liquid pumping micro pump is provided with the device refrigerant inlet, and the bottom of the liquid pumping micro pump is provided with a plurality of jet nozzles.

9. The modular adaptive immersion jet liquid cooling system according to claim 5, characterized in that: The area of ​​the liquid pumping micro pump is equivalent to the area of ​​the device with relatively high heat generation.

10. The modular adaptive immersion jet liquid cooling system according to claim 8, characterized in that: The diameter of the cylinder is 40-60 mm, the inner diameter of the terminal nozzle of the jet nozzle is 3 mm, and the distance between the terminal nozzle and the device with relatively high heat generation is 1 to 3 times of the inner diameter.

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