Display panel, manufacturing method thereof and display device

Abstract

The invention discloses a display panel, a manufacturing method thereof and a display device. A first groove and a second groove which are adjacent to each other are formed in the first organic layer, the groove width of one side, far away from the first bottom surface of the first groove, of the first groove is larger than the groove width of one side, close to the first bottom surface, of the first groove, and the groove width of one side, far away from the second bottom surface of the second groove, of the second groove is larger than or equal to the groove width of one side, close to the second bottom surface, of the second groove; the conductive layer is arranged on the first organic layer and comprises a signal transmission part arranged in the first groove; the second organic layer is arranged on the side, away from the first organic layer, of the conductive layer, and the second organic layer covers the signal transmission part and the second groove; wherein the signal transmission part is arranged on the first side wall and the first bottom surface of the first groove, and the signal transmission part and the second groove are not overlapped in the thickness direction of the display panel; the probability of forming an undercut structure in the first organic layer can be reduced, and the probability of stripping of the second organic layer is reduced.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] Organic Light-Emitting Diode (OLED) display panel, also known as organic electroluminescent display panel, has broad application prospects due to its advantages of simple preparation process, low cost, low power consumption, high luminous brightness, wide operating temperature adaptability range, light and thin volume, fast response speed, easy to achieve color display and large-screen display, easy to match with integrated circuit drivers, and easy to achieve flexible display.

[0003] In an OLED display panel, a plurality of organic planar layers are often formed on an array substrate to improve the flatness of the surface of the array substrate, and a metal layer is formed between the plurality of organic planar layers to be used for signal transfer.

[0004] The metal layer is often etched with chlorine, which then needs to be replaced with oxygen to remove residual chlorine. However, oxygen will have an ashing effect on the organic flat layer below the metal layer, which can easily form an undercut structure at the edge of the metal layer. The organic flat layer above the metal layer is difficult to effectively fill the undercut structure. In subsequent processes, the gas in the undercut structure is prone to expansion, which can lead to adverse phenomena such as film shedding. Summary of the invention

[0005] The embodiments of the present application provide a display panel and a manufacturing method thereof, and a display device, which can avoid the formation of an undercut structure between the signal transmission part and the first organic layer, reduce the probability of film layer falling off, and improve the yield rate of the display panel.

[0006] In order to achieve the above object, according to an embodiment of the present application, a display panel is provided, which includes:

[0007] A first organic layer, wherein a first groove and a second groove are formed in the first organic layer, wherein a groove width of the first groove at a side away from a first bottom surface of the first groove is greater than a groove width of the first groove at a side close to the first bottom surface, and a groove width of the second groove at a side away from a second bottom surface of the second groove is greater than or equal to a groove width of the second groove at a side close to the second bottom surface;

[0008] A conductive layer disposed on the first organic layer, wherein the conductive layer includes a signal transmission portion disposed in the first groove;

[0009] A second organic layer is disposed on a side of the conductive layer away from the first organic layer, and the second organic layer covers the signal transmission part and the second groove;

[0010] The signal transmission part is disposed on the first side wall and the first bottom surface of the first groove, and the signal transmission part does not overlap with the second groove along the thickness direction of the display panel.

[0011] In one embodiment of the present application, the angle between the first side wall and the first bottom surface is greater than 90°;

[0012] The second groove has a second side wall, and an angle between the second side wall and the second bottom surface is greater than or equal to 90°.

[0013] In one embodiment of the present application, the width of the first groove gradually increases in a direction from the first organic layer to the second organic layer;

[0014] A groove width of the second groove gradually increases in a direction from the first organic layer to the second organic layer.

[0015] In one embodiment of the present application, the first groove is adjacent to the second groove, the first side wall of the first groove close to the second groove has a first end away from the first bottom surface, the second side wall of the second groove close to the first groove has a second end away from the second bottom surface, and the first end and the second end are connected.

[0016] In one embodiment of the present application, an angle between the first side wall of the first groove close to the second groove and the second side wall of the second groove close to the first groove is greater than or equal to 30°.

[0017] In an embodiment of the present application, the signal transmission portion is connected to the first end portion.

[0018] In one embodiment of the present application, the thickness of the signal transmission part is less than the depth of the first groove, a depression is formed on the side of the signal transmission part away from the first organic layer, and the absolute value of the difference between the depth of the second groove and the depth of the depression is less than 0.1 microns.

[0019] In an embodiment of the present application, the thickness of the signal transmission portion is greater than or equal to the depth of the first groove, and a surface of the signal transmission portion on one side away from the bottom surface of the first groove is a plane.

[0020] In an embodiment of the present application, a surface of the signal transmission portion on one side away from the bottom surface of the first groove is flush with an end of the first organic layer on a side close to the second organic layer.

[0021] In an embodiment of the present application, a plurality of first grooves and a plurality of second grooves are formed in the first organic layer, and the second grooves are located between adjacent first grooves.

[0022] In an embodiment of the present application, the second organic layer covers the second side wall, the second bottom surface and the signal transmission part.

[0023] According to the above-mentioned purpose of the present application, an embodiment of the present application further provides a method for manufacturing a display panel, and the method for manufacturing a display panel comprises the following steps:

[0024] forming a first organic layer, wherein a first groove is formed in the first organic layer, wherein a groove width of the first groove at a side away from the first bottom surface of the first groove is greater than a groove width of the first groove at a side close to the first bottom surface;

[0025] forming a conductive layer on the first organic layer, wherein a signal transmission portion located in the first groove is formed in the conductive layer, and the signal transmission portion is disposed on a first side wall and the first bottom surface of the first groove;

[0026] A second groove adjacent to the first groove is formed in the first organic layer, wherein a groove width of the second groove on a side away from the second bottom surface of the second groove is greater than a groove width of the second groove on a side close to the second bottom surface, and the signal transmission portion and the second groove do not overlap along a thickness direction of the display panel;

[0027] A second organic layer is formed on a side of the conductive layer away from the first organic layer, and the second organic layer covers the signal transmission portion and the second groove.

[0028] In one embodiment of the present application, the step of forming a second groove adjacent to the first groove in the first organic layer includes:

[0029] A replacement gas is used to perform a replacement process on the first organic layer and the conductive layer to form the second groove adjacent to the first groove.

[0030] According to the above-mentioned purpose of the present application, an embodiment of the present application further provides a display device, which includes the display panel.

[0031] The present application provides a display panel and a manufacturing method thereof, and a display device. A first groove that is wide at the top and narrow at the bottom is formed in a first organic layer, and a signal transmission part is arranged on the first side wall and the first bottom surface of the first groove. The signal transmission part located on the first side wall of the first groove is tilted outward in a direction away from the center of the first groove to shield the adjacent first organic layer in a vertical direction. Therefore, in the manufacturing process, the probability of the first organic layer adjacent to the signal transmission part being etched to form an undercut structure can be reduced, the coverage of the first organic layer and the signal transmission part by the second organic layer is improved, and the situation in which the second organic layer cannot effectively cover the first organic layer due to the undercut structure formed in the first organic layer is improved, the probability of the second organic layer being peeled off is reduced, and the yield rate of the display panel is improved.

[0032] Other features and advantages of the present application will be described in detail in the subsequent detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without creative work.

[0034] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings, wherein the same figure numbers represent the same parts in the following description.

[0035] Figure 1 A schematic diagram of the structure of a display panel provided by an embodiment;

[0036] Figure 2 A schematic diagram of the structure of the first organic layer, the conductive layer and the second organic layer provided in an embodiment of the present application;

[0037] Figure 3 A schematic diagram of the structure of the first organic layer provided in an embodiment of the present application;

[0038] Figure 4 A schematic diagram of the structure of a display panel provided in an embodiment of the present application;

[0039] Figure 5 A schematic diagram of the structure of the first organic layer and the conductive layer provided in an embodiment of the present application;

[0040] Figure 6 Another structural schematic diagram of the first organic layer, the conductive layer and the second organic layer provided in an embodiment of the present application;

[0041] Figure 7A flow chart of a method for manufacturing a display panel provided in an embodiment of the present application;

[0042] Figures 8 to 11 A structural schematic diagram of the manufacturing process of the display panel provided in an embodiment of the present application.

[0043] Description of reference numerals:

[0044] 1. First organic flat layer; 2. Metal layer; 3. Second organic flat layer; 4. Undercut structure;

[0045] 10, first organic layer; 101, first groove; 1011, first bottom surface; 1012, first side wall; 102, second groove; 1021, second bottom surface; 1022, second side wall;

[0046] 20. conductive layer; 21. signal transmission portion; 210. recess; 22. conductive material layer;

[0047] 30. second organic layer;

[0048] 40. Substrate;

[0049] 50, thin film transistor layer; 51, thin film transistor; 511, active layer; 512, first gate; 513, second gate; 514, source; 515, drain; 52, buffer layer; 53, first gate insulating layer; 54, second gate insulating layer; 55, first interlayer dielectric layer; 56, second interlayer dielectric layer;

[0050] 61. anode; 62. pixel definition layer; 63. retaining wall;

[0051] 70, mask; 71, semi-transparent area; 72, opaque area;

[0052] 80. Photoresistance. DETAILED DESCRIPTION

[0053] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0054] Please refer to Figure 1At present, the OLED display panel includes a first organic flat layer 1, a metal layer 2 arranged on the first organic flat layer 1, and a second organic flat layer 3 arranged on the first organic flat layer 1 and covering the metal layer 2; the metal layer 2 is often patterned with chlorine, but it needs to be replaced with oxygen to remove the residual chlorine; during the oxygen replacement process, the oxygen will produce an ashing effect on the first organic flat layer 1 below the metal layer 2, and it is easy to form an undercut structure 4 at the edge of the metal layer 2, while the second organic flat layer 3 above the metal layer 2 is difficult to effectively fill the undercut structure 4. In the subsequent process, the gas in the undercut structure 4 is easy to expand, which leads to undesirable phenomena such as film shedding.

[0055] Please combine Figure 2 as well as Figure 3 An embodiment of the present application provides a display panel, which includes a first organic layer 10 , a conductive layer 20 and a second organic layer 30 .

[0056] Among them, the first organic layer 10 is provided with adjacent first grooves 101 and second grooves 102, the groove width of the first groove 101 on the side away from the first bottom surface 1011 of the first groove 101 is greater than the groove width of the first groove 101 on the side close to the first bottom surface 1011, and the groove width of the second groove 102 on the side away from the second bottom surface 1021 of the second groove 102 is greater than or equal to the groove width of the second groove 102 on the side close to the second bottom surface 1021; the conductive layer 20 is arranged on the first organic layer 10, and the conductive layer 20 includes a signal transmission part 21 arranged in the first groove 101; the second organic layer 30 is arranged on the side of the conductive layer 20 away from the first organic layer 10, and the second organic layer 30 covers the signal transmission part 21 and the second groove 102.

[0057] The signal transmission portion 21 is disposed on the first side wall 1012 of the first groove 101 and on the first bottom surface 1011 , and the signal transmission portion 21 does not overlap with the second groove 102 along the thickness direction of the display panel.

[0058] During the implementation and application process, the embodiment of the present application forms the first groove 101 which is wide at the top and narrow at the bottom in the first organic layer 10, and arranges the signal transmission part 21 on the first side wall 1012 and the first bottom surface 1011 of the first groove 101, so that the signal transmission part 21 located on the first side wall 1012 of the first groove 101 will tilt outward in the direction away from the center of the first groove 101 to vertically shield the adjacent first organic layer 10, thereby reducing the probability of the first organic layer 10 adjacent to the signal transmission part 21 being etched to form an undercut structure during the manufacturing process, improving the coverage of the first organic layer 10 and the signal transmission part 21 by the second organic layer 30, and improving the situation where the second organic layer 30 cannot effectively cover the first organic layer 10 due to the undercut structure formed in the first organic layer 10, thereby reducing the probability of peeling of the second organic layer 30 and improving the yield rate of the display panel.

[0059] Specifically, please combine Figure 2 , Figure 3 as well as Figure 4 The first organic layer 10 and the second organic layer 30 are two organic film layers stacked in the display panel, and the conductive layer 20 is located between the first organic layer 10 and the second organic layer 30 .

[0060] In some embodiments, the conductive layer 20 is a metal layer located between the first organic layer 10 and the second organic layer 30 , and the conductive layer 20 may include a stacked structure of Ti / Al / Ti.

[0061] In some embodiments, the display panel also includes a substrate 40 and a thin film transistor layer 50; the first organic layer 10 is disposed on the substrate 40; the thin film transistor layer 50 is disposed between the substrate 40 and the first organic layer 10, the conductive layer 20 is disposed on a side of the first organic layer 10 away from the thin film transistor layer 50 and includes the signal transmission part 21, and the second organic layer 30 is disposed on a side of the first organic layer 10 away from the thin film transistor layer 50 and covers the signal transmission part 21.

[0062] The thin film transistor layer 50 includes a plurality of thin film transistors 51 , and the thin film transistor 51 includes an active layer 511 , a gate, a source 514 , and a drain 515 ; wherein the signal transmission unit 21 is connected to the source 514 or the drain 515 .

[0063] In some embodiments, the gate includes a first gate 512 disposed on a side of the active layer 511 away from the substrate 40 and a second gate 513 disposed on a side of the first gate 512 away from the active layer 511 ; the signal transmission unit 21 is connected to the drain 515 .

[0064] In some embodiments, the thin film transistor layer 50 further includes a plurality of insulating layers covering the thin film transistor 51. Specifically, the thin film transistor layer 50 further includes a buffer layer 52 disposed on the substrate 40, the active layer 511 disposed on the buffer layer 52, a first gate insulating layer 53 disposed on the buffer layer 52 and covering the active layer 511, a first gate 512 disposed on the first gate insulating layer 53 and located on a side of the active layer 511 away from the substrate 40, a second gate insulating layer 54 disposed on the first gate insulating layer 53 and covering the first gate 512, and a second gate insulating layer 55 disposed on the second gate insulating layer 54. A second gate 513 is disposed on and located on a side of the first gate 512 away from the active layer 511, a first interlayer dielectric layer 55 is disposed on the second gate insulating layer 54 and covers the second gate 513, the source 514 and the drain 515 are disposed on the first interlayer dielectric layer 55, and a second interlayer dielectric layer 56 is disposed on the first interlayer dielectric layer 55 and covers the source 514 and the drain 515; the source 514 and the drain 515 pass through the first interlayer dielectric layer 55, the second gate insulating layer 54 and the first gate insulating layer 53 and are respectively connected to the opposite sides of the active layer 511.

[0065] In some embodiments, the display panel also includes an anode 61 disposed on a side of the second organic layer 30 away from the conductive layer 20, a pixel definition layer 62 disposed on a side of the second organic layer 30 away from the conductive layer 20, and a retaining wall 63 disposed on a side of the pixel definition layer 62 away from the second organic layer 30, a pixel opening is opened in the pixel definition layer 62, and the pixel opening corresponds to exposing a portion of the surface of the anode 61, and the anode 61 passes through the second organic layer 30 and is connected to the signal transmission unit 21.

[0066] In some embodiments, the signal transmission unit 21 can be used to transfer signals, for example, connected between the anode 61 and the drain 515 . The signal transmission unit 21 can also be a VDD signal line. In addition, the signal transmission unit 21 can also be other devices in the conductive layer 20 .

[0067] In the embodiment of the present application, the first organic layer 10 is provided with adjacent first grooves 101 and second grooves 102, the groove width of the first groove 101 on the side away from the first bottom surface 1011 of the first groove 101 is greater than the groove width of the first groove 101 on the side close to the first bottom surface 1011, and the groove width of the second groove 102 on the side away from the second bottom surface 1021 of the second groove 102 is greater than or equal to the groove width of the second groove 102 on the side close to the second bottom surface 1021; the conductive layer 20 is disposed on the first organic layer 10, and the conductive layer 20 includes a signal transmission part 21 disposed in the first groove 101; the second organic layer 30 is disposed on the side of the conductive layer 20 away from the first organic layer 10, and the second organic layer 30 covers the signal transmission part 21 and the second groove 102. Further, the signal transmission part 21 is disposed on the first sidewall 1012 and the first bottom surface 1011 of the first groove 101, and the signal transmission part 21 and the second groove 102 do not overlap along the thickness direction of the display panel.

[0068] In the manufacturing process of the display panel, after the conductive layer 20 is patterned, it is necessary to use a replacement gas to replace the first organic layer 10 and the conductive layer 20 to remove residual etching gas, such as chlorine; and the replacement gas will produce an ashing effect on the first organic layer 10, resulting in a portion of the first organic layer 10 being etched away; in the embodiment of the present application, since the signal transmission part 21 can be located on the first side wall 1012, the signal transmission part 21 located on the first side wall 1012 of the first groove 101 will face away from the first groove The direction of the center of 101 is tilted outward to shield the adjacent first organic layer 10 in the vertical direction, so that in the process, the probability of the first organic layer 10 adjacent to the signal transmission part 21 being etched to form an undercut structure can be reduced, the coverage of the first organic layer 10 and the signal transmission part 21 by the second organic layer 30 is improved, and the situation in which the second organic layer 30 cannot effectively cover due to the undercut structure formed in the first organic layer 10 is improved, the probability of the second organic layer 30 being peeled off is reduced, and the yield rate of the display panel is improved.

[0069] It is understandable that the signal transmission part 21 and the second groove 102 do not overlap along the thickness direction of the display panel, so that the edge position of the signal transmission part 21 does not form an undercut structure, reducing the probability of peeling of the second organic layer 30 and improving the yield rate of the display panel.

[0070] Please combine Figure 2 , Figure 3 as well as Figure 5In some embodiments, the first groove 101 has the first bottom surface 1011 and the first side wall 1012, and the second groove 102 has the second bottom surface 1021 and the second side wall 1022; wherein, the angle A between the first side wall 1012 and the first bottom surface 1011 is greater than 90°; the angle B between the second side wall 1022 and the second bottom surface 1021 is greater than or equal to 90°; it can be understood that the angle A between the first side wall 1012 and the first bottom surface 1011 is greater than 90°, so that the first side wall 1012 tilts outward, thereby ensuring that the signal transmission part 21 located on the first side wall 1012 also tilts outward, and can form a vertical shielding for the adjacent second organic layer 30; and the angle B between the second side wall 1022 and the second bottom surface 1021 is greater than or equal to 90°, so that the second side wall 1022 tilts outward to avoid the formation of an undercut structure in the second groove 102.

[0071] Further, in some embodiments, the angle A between the first side wall 1012 and the first bottom surface 1011 is greater than or equal to 100°; further, the angle A may be greater than or equal to 120° to further improve the shielding effect of the signal transmission part 21 on the adjacent first organic layer 10. It is understood that the angle A is less than 180° to ensure that the first side wall 1012 can shield the adjacent second organic layer 30 in the vertical direction.

[0072] In some embodiments, the angle B between the second side wall 1022 and the second bottom surface 1021 is greater than or equal to 100°; further, the angle B may be greater than or equal to 120°, so as to further reduce the step formed by the second groove 102, improve the filling of the second groove 102 by the second organic layer 30, and improve the coverage of the second side wall 1022 by the second organic layer 30. It is understood that the angle B may be less than or equal to 180°.

[0073] In some embodiments, the thickness of the signal transmission part 21 is less than the depth of the first groove 101, and the signal transmission part 21 can fit the topography of the first groove 101 to cover the first side wall 1012 and the first bottom surface 1011; correspondingly, the angle C between the signal transmission part 21 located on the first side wall 1012 and the signal transmission part 21 located on the first bottom surface 1011 can be equal to the angle A, therefore, the angle C between the signal transmission part 21 located on the first side wall 1012 and the signal transmission part 21 located on the first bottom surface 1011 is greater than 90°, so as to ensure that the signal transmission part 21 located on the first side wall 1012 is tilted outward in a direction away from the center of the first groove 101, so as to shield the adjacent first organic layer 10.

[0074] In some embodiments, the width of the first groove 101 gradually increases in the direction from the first organic layer 10 to the second organic layer 30, that is, the distance from the first side wall 1012 to the center of the first groove 101 gradually increases in the direction from the first organic layer 10 to the second organic layer 30; the width of the second groove 102 gradually increases in the direction from the first organic layer 10 to the second organic layer 30, that is, the distance from the second side wall 1022 to the center of the second groove 102 gradually increases along the direction from the first organic layer 10 to the second organic layer 30.

[0075] Furthermore, the first side wall 1012 and the second side wall 1022 may both be flat surfaces or curved surfaces.

[0076] In some embodiments, the first groove 101 is adjacent to the second groove 102, the first side wall 1012 of the first groove 101 close to the second groove 102 has a first end away from the first bottom surface 1011, and the second side wall 1022 of the second groove 102 close to the first groove 101 has a second end away from the second bottom surface 1021, and the first end and the second end are connected, that is, one end of the first side wall 1012 away from the first bottom surface 1011 and one end of the second side wall 1022 away from the second bottom surface 1021 are connected, and an angle D can be formed.

[0077] In some embodiments, an angle D between the first side wall 1012 of the first groove 101 close to the second groove 102 and the second side wall 1022 of the second groove 102 close to the first groove 101 is greater than or equal to 30°; and as the angle D increases, the slope of the second side wall 1022 of the second groove 102 becomes gentler, which can further improve the coverage of the second organic layer 30 on the second groove 102 and reduce the probability of peeling of the second organic layer 30.

[0078] In some embodiments, the signal transmission part 21 is connected to the first end, that is, the signal transmission part 21 is connected to the end of the first side wall 1012 away from the first bottom surface 1011; in addition, since the second groove 102 is formed by being blocked by the signal transmission part 21 during the replacement process, the signal transmission part 21 is connected to the second end, that is, the signal transmission part 21 is connected to the end of the second side wall 1022 away from the second bottom surface 1021, indicating that the edge of the second groove 102 is adjacent to the signal transmission part 21, that is, the part of the first organic layer 10 not blocked by the signal transmission part 21 is etched, thereby forming the second groove 102.

[0079] In some embodiments, please refer to Figure 2 and Figure 5 The thickness of the signal transmission part 21 is less than the depth of the first groove 101, a depression 210 is formed on the side of the signal transmission part 21 away from the first organic layer 10, and the absolute value of the difference between the depth H2 of the second groove 102 and the depth H1 of the depression 210 is less than 0.1 microns; wherein the depth H2 of the second groove 102 and the depth H1 of the depression 210 are both less than or equal to 0.1 microns, so as to reduce the step difference formed by the first organic layer 10 and the conductive layer 20, and further improve the coverage effect of the second organic layer 30.

[0080] In some embodiments, the depth H1 of the recess 210 is equal to the depth H2 of the second groove 102 .

[0081] In some embodiments, please combine Figure 3 and Figure 6 The thickness of the signal transmission part 21 is greater than or equal to the depth of the first groove 101, and the surface of the signal transmission part 21 on one side away from the bottom surface of the first groove 101 is a plane, that is, the side of the signal transmission part 21 away from the first bottom surface 1011 is a plane; thereby, the flatness of the side of the conductive layer 20 close to the second organic layer 30 can be improved, and the coverage effect of the second organic layer 30 can be further improved.

[0082] In some embodiments, a surface of the signal transmission portion 21 on one side away from the bottom surface of the first groove 101 is flush with an end of the first organic layer 10 close to the second organic layer 30; that is, a surface of the signal transmission portion 21 on one side away from the first bottom surface 1011 is flush with an end of the first organic layer 10 close to the second organic layer 30, so as to further reduce the step difference between the first organic layer 10 and the conductive layer 20, improve the flatness of the first organic layer 10 and the conductive layer 20 close to the second organic layer 30, further improve the covering effect of the second organic layer 30, and reduce the probability of peeling of the second organic layer 30.

[0083] In some embodiments, please combine Figure 2 as well as Figure 4 The number of the signal transmission parts 21 can be multiple. For example, the display panel includes multiple thin film transistors 51, and the conductive layer 20 includes a signal transmission part 21 connected to the multiple thin film transistors 51. Furthermore, the first organic layer 10 is provided with multiple first grooves 101 and multiple second grooves 102, and the second grooves 102 are located between adjacent first grooves 101, and the first groove 101 can also be located between adjacent second grooves 102.

[0084] It can be understood that since the signal transmission part 21 is arranged in the first groove 101, and the first side wall 1012 of the first groove 101 is covered with the signal transmission part 21; on the one hand, compared with the prior art, the space occupied by the signal transmission part 21 in the horizontal direction can be reduced, and the wiring space can be increased; on the other hand, as the depth of the first groove 101 increases, the thickness of the signal transmission part 21 can also be increased, and the resistance of the signal transmission part 21 can be reduced; therefore, compared with the prior art, under the condition of the same resistance, the embodiment of the present application can also reduce the line width of the signal transmission part 21 and increase the space share; or under the condition of the same space share, the embodiment of the present application can reduce the resistance of the signal transmission part 21.

[0085] For example, Figure 1In the existing display panel shown, the thickness of the metal layer 2 is 0.8 microns, and the step difference between the metal layer 2 and the first organic flat layer 1 is 0.8 microns. If the step difference is to be controlled at the same level, the embodiment of the present application can set the initial depth of the first groove 101 to 0.8 microns, and the thickness of the signal transmission part 21 to 0.8 microns. During the replacement process, the second organic layer 30 will be ashed to obtain a depth of the second groove 102 of 0.4 microns. At this time, the step difference between the bottom surfaces of the signal transmission part 21 and the second groove 102 is 0.4 microns, and then the thickness of the signal transmission part 21 can be increased by 0.4 microns, that is, increased to 1.2 microns, so that the step difference between the bottom surfaces of the signal transmission part 21 and the second groove 102 is 0.8 microns, which remains the same as the existing display panel.

[0086] On the basis of ensuring the same step difference as the prior art, the thickness of the signal transmission part 21 in the embodiment of the present application can be increased by 0.4 microns, that is, increased to 1.2 microns; at this time, the thickness of the signal transmission part 21 is increased to 1.2 / 0.8=1.5 times relative to the metal layer 2 in the existing display panel, and the resistance is reduced to 0.8 / 1.2=2 / 3 times, which indicates that the display panel provided in the embodiment of the present application can effectively reduce the resistance of the signal transmission part 21.

[0087] It should be noted that, since an undercut structure is not formed in the second groove 102 in the embodiment of the present application, the second organic layer 30 can effectively cover the second groove 102; specifically, the second organic layer 30 covers the second side wall 1022, the second bottom surface 1021 and the signal transmission part 21.

[0088] Continuing from the above, the embodiment of the present application forms the first groove 101 which is wide at the top and narrow at the bottom in the first organic layer 10, and arranges the signal transmission part 21 on the first side wall 1012 and the first bottom surface 1011 of the first groove 101, so that the signal transmission part 21 located on the first side wall 1012 of the first groove 101 will tilt outward in the direction away from the center of the first groove 101 to vertically shield the adjacent first organic layer 10, thereby reducing the probability of the first organic layer 10 adjacent to the signal transmission part 21 being etched to form an undercut structure during the manufacturing process, improving the coverage of the first organic layer 10 and the signal transmission part 21 by the second organic layer 30, and improving the situation where the second organic layer 30 cannot effectively cover the first organic layer 10 due to the undercut structure formed in the first organic layer 10, thereby reducing the probability of peeling of the second organic layer 30 and improving the yield rate of the display panel.

[0089] In addition, please combine Figure 2 , Figure 3 , Figure 4 , Figure 7 as well as Figures 8 to 11 The present application also provides a method for manufacturing a display panel, and the method for manufacturing a display panel includes the following steps:

[0090] S10 , forming a first organic layer 10 , wherein a first groove 101 is formed in the first organic layer 10 , wherein a groove width of the first groove 101 at a side away from a first bottom surface 1011 of the first groove 101 is greater than a groove width of the first groove 101 at a side close to the first bottom surface 1011 .

[0091] S20, forming a conductive layer 20 on the first organic layer 10, wherein a signal transmission portion 21 located in the first groove 101 is formed in the conductive layer 20, and the signal transmission portion 21 is disposed on the first side wall 1012 of the first groove 101 and on the first bottom surface 1011.

[0092] S30. A second groove 102 adjacent to the first groove 101 is formed in the first organic layer 10, wherein the groove width of the second groove 102 on the side away from the second bottom surface 1021 of the second groove 102 is greater than the groove width of the second groove 102 on the side close to the second bottom surface 1021, and the signal transmission part 21 does not overlap with the second groove 102 along the thickness direction of the display panel.

[0093] S40 , forming a second organic layer 30 on a side of the conductive layer 20 away from the first organic layer 10 , wherein the second organic layer 30 covers the signal transmission portion 21 and the second groove 102 .

[0094] Specifically, in step S10 , a substrate 40 is first provided.

[0095] Next, the thin film transistor layer 50 is formed on the substrate 40 . The thin film transistor layer 50 includes a plurality of thin film transistors 51 . The thin film transistor 51 includes an active layer 511 , a gate electrode, a source electrode 514 , and a drain electrode 515 .

[0096] In some embodiments, the gate includes a first gate 512 disposed on a side of the active layer 511 away from the substrate 40 and a second gate 513 disposed on a side of the first gate 512 away from the active layer 511 .

[0097] In some embodiments, the thin film transistor layer 50 further includes a plurality of insulating layers covering the thin film transistor 51. Specifically, the thin film transistor layer 50 further includes a buffer layer 52 disposed on the substrate 40, the active layer 511 disposed on the buffer layer 52, a first gate insulating layer 53 disposed on the buffer layer 52 and covering the active layer 511, a first gate 512 disposed on the first gate insulating layer 53 and located on a side of the active layer 511 away from the substrate 40, a second gate insulating layer 54 disposed on the first gate insulating layer 53 and covering the first gate 512, and a second gate insulating layer 55 disposed on the second gate insulating layer 54. A second gate 513 is disposed on and located on a side of the first gate 512 away from the active layer 511, a first interlayer dielectric layer 55 is disposed on the second gate insulating layer 54 and covers the second gate 513, the source 514 and the drain 515 are disposed on the first interlayer dielectric layer 55, and a second interlayer dielectric layer 56 is disposed on the first interlayer dielectric layer 55 and covers the source 514 and the drain 515; the source 514 and the drain 515 pass through the first interlayer dielectric layer 55, the second gate insulating layer 54 and the first gate insulating layer 53 and are respectively connected to the opposite sides of the active layer 511.

[0098] Next, the first organic layer 10 is formed on the side of the thin film transistor layer 50 away from the substrate 40; wherein the first organic layer 10 is patterned using a mask 70, and the mask 70 includes a semi-transparent area 71 and an opaque area 72; after exposure, development and other treatments, the first groove 101 is formed at a position of the first organic layer 10 corresponding to the semi-transparent area 71, such as Figure 8 As shown, the first groove 101 has a first bottom surface 1011 and a first side surface 1012 .

[0099] The groove width of the first groove 101 on the side away from the first bottom surface 1011 of the first groove 101 is greater than the groove width of the first groove 101 on the side close to the first bottom surface 1011, and the angle A between the first side wall 1012 and the first bottom surface 1011 is greater than 90°, so that the first side wall 1012 is inclined outward in a direction away from the center of the first groove 101.

[0100] In step S20, a conductive material layer 22 is formed on the first organic layer 10, and the conductive material layer 22 covers the first bottom surface 1011 and the first side surface 1012 of the first groove 101. Fig. 9 shown.

[0101] In some embodiments, the conductive material layer 22 may include a stacked structure of Ti / Al / Ti.

[0102] Next, a photoresist 80 is formed in the first groove 101, as shown in FIG. Fig.10 shown.

[0103] The conductive material layer 22 is then patterned to form the conductive layer 20, in which a signal transmission part 21 is formed and located in the first groove 101, and the signal transmission part 21 covers the first bottom surface 1011 and the first side wall 1012 of the first groove 101; therefore, the signal transmission part 21 located on the first side wall 1012 will also tilt outward in a direction away from the center of the first groove 101 to shield the adjacent first organic layer 10 in the vertical direction.

[0104] In some embodiments, chlorine gas may be used to perform dry etching on the conductive material layer 22 . However, during etching, chlorine gas or chlorine element may remain on the surface of the film layer, which may damage the film layer and affect subsequent support.

[0105] In step S30 , a replacement gas is used to perform a replacement treatment on the first organic layer 10 and the conductive layer 20 to form the second groove 102 adjacent to the first groove 101 .

[0106] Among them, the replacement gas may include oxygen to remove residual chlorine gas or chlorine element, and at the same time, it will also have an etching effect on the first organic layer 10; because the signal transmission part 21 on the first side wall 1012 can block the etching of the replacement gas, the first organic layer 10 blocked by the signal transmission part 21 in the vertical direction will not be etched, thereby reducing the probability of generating an undercut structure.

[0107] The replacement gas may form the second groove 102 adjacent to the signal transmission portion 21 and the first groove 101 in the first organic layer 10. Fig.11 shown.

[0108] The groove width of the second groove 102 on the side away from the second bottom surface 1021 is greater than or equal to the groove width of the second groove 102 on the side close to the second bottom surface 1021, the angle B between the second side wall 1022 and the second bottom surface 1021 is greater than or equal to 90°, and the signal transmission part 21 and the second groove 102 do not overlap along the thickness direction of the display panel; therefore, the edge position of the signal transmission part 21 will not form an undercut structure, thereby reducing the probability of peeling of the second organic layer 30 and improving the yield rate of the display panel.

[0109] In step S40 , the second organic layer 30 is formed on a side of the first organic layer 10 away from the thin film transistor layer 50 , and the second organic layer 30 covers the second side wall 1022 , the second bottom surface 1021 and the signal transmission portion 21 .

[0110] In some embodiments, the display panel also includes an anode 61 formed on the side of the second organic layer 30 away from the conductive layer 20, a pixel definition layer 62 arranged on the side of the second organic layer 30 away from the conductive layer 20, and a retaining wall 63 arranged on the side of the pixel definition layer 62 away from the second organic layer 30, a pixel opening is opened in the pixel definition layer 62, and the pixel opening corresponds to exposing a portion of the surface of the anode 61, and the anode 61 passes through the second organic layer 30 and is connected to the signal transmission unit 21.

[0111] It should be noted that the signal transmission part 21 can be used to transfer signals, for example, connected between the anode 61 and the drain 515 . The signal transmission part 21 can also be a VDD signal line. In addition, the signal transmission part 21 can also be other devices in the conductive layer 20 .

[0112] In summary, the embodiment of the present application forms the first groove 101 which is wide at the top and narrow at the bottom in the first organic layer 10, and arranges the signal transmission part 21 on the first side wall 1012 and the first bottom surface 1011 of the first groove 101, so that the signal transmission part 21 located on the first side wall 1012 of the first groove 101 will tilt outward in the direction away from the center of the first groove 101 to vertically shield the adjacent first organic layer 10, thereby reducing the probability of the first organic layer 10 adjacent to the signal transmission part 21 being etched to form an undercut structure during the manufacturing process, improving the coverage of the first organic layer 10 and the signal transmission part 21 by the second organic layer 30, and improving the situation where the second organic layer 30 cannot effectively cover the first organic layer 10 due to the undercut structure formed in the first organic layer 10, thereby reducing the probability of peeling of the second organic layer 30 and improving the yield rate of the display panel.

[0113] In addition, an embodiment of the present application further provides a display device, which includes the display panel described in the above embodiment.

[0114] It can be understood that, since the display device includes the display panel described in the above embodiment, the display device has the same beneficial effects as in the above embodiment, which will not be described in detail herein.

[0115] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0116] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0117] The embodiments, implementation methods and related technical features of the present application can be combined and replaced with each other without conflict.

[0118] The above are only preferred embodiments of the present application and do not constitute any form of limitation to the present application. However, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application are still within the scope of the technical solution of the present application.

Claims

1. A display panel, characterized in that: include: A first organic layer, wherein a first groove and a second groove are formed in the first organic layer, wherein a groove width of the first groove at a side away from a first bottom surface of the first groove is greater than a groove width of the first groove at a side close to the first bottom surface, and a groove width of the second groove at a side away from a second bottom surface of the second groove is greater than or equal to a groove width of the second groove at a side close to the second bottom surface; A conductive layer disposed on the first organic layer, wherein the conductive layer includes a signal transmission portion disposed in the first groove; A second organic layer is disposed on a side of the conductive layer away from the first organic layer, and the second organic layer covers the signal transmission part and the second groove; The signal transmission part is disposed on the first side wall and the first bottom surface of the first groove, and the signal transmission part does not overlap with the second groove along the thickness direction of the display panel.

2. The display panel according to claim 1, characterized in that: The angle between the first side wall and the first bottom surface is greater than 90°; The second groove has a second side wall, and an angle between the second side wall and the second bottom surface is greater than or equal to 90°.

3. The display panel according to claim 2, characterized in that: The groove width of the first groove gradually increases in a direction from the first organic layer to the second organic layer; A groove width of the second groove gradually increases in a direction from the first organic layer to the second organic layer.

4. The display panel according to claim 2, characterized in that: The first groove is adjacent to the second groove, the first side wall of the first groove close to the second groove has a first end away from the first bottom surface, the second side wall of the second groove close to the first groove has a second end away from the second bottom surface, and the first end and the second end are connected.

5. The display panel according to claim 4, characterized in that: An angle between the first side wall of the first groove close to the second groove and the second side wall of the second groove close to the first groove is greater than or equal to 30°.

6. The display panel according to claim 4, characterized in that: The signal transmission portion is connected to the first end portion.

7. The display panel according to claim 1, characterized in that: The thickness of the signal transmission part is smaller than the depth of the first groove, a depression is formed on a side of the signal transmission part away from the first organic layer, and an absolute value of a difference between a depth of the second groove and a depth of the depression is smaller than 0.1 micrometers.

8. The display panel according to claim 1, characterized in that: The thickness of the signal transmission portion is greater than or equal to the depth of the first groove, and a surface of the signal transmission portion on one side away from the bottom surface of the first groove is a plane.

9. The display panel according to claim 8, characterized in that: A surface of the signal transmission portion that is away from the bottom surface of the first groove is flush with an end of the first organic layer that is close to the second organic layer.

10. The display panel according to claim 1, characterized in that: A plurality of the first grooves and a plurality of the second grooves are formed in the first organic layer, and the second grooves are located between adjacent first grooves.

11. The display panel according to any one of claims 2 to 10, characterized in that: The second organic layer covers the second side wall, the second bottom surface, and the signal transmission portion.

12. A method for manufacturing a display panel, characterized in that: The manufacturing method of the display panel comprises the following steps: forming a first organic layer, wherein a first groove is formed in the first organic layer, wherein a groove width of the first groove at a side away from the first bottom surface of the first groove is greater than a groove width of the first groove at a side close to the first bottom surface; forming a conductive layer on the first organic layer, wherein a signal transmission portion located in the first groove is formed in the conductive layer, and the signal transmission portion is disposed on a first side wall and the first bottom surface of the first groove; A second groove adjacent to the first groove is formed in the first organic layer, wherein a groove width of the second groove on a side away from the second bottom surface of the second groove is greater than a groove width of the second groove on a side close to the second bottom surface, and the signal transmission portion and the second groove do not overlap along a thickness direction of the display panel; A second organic layer is formed on a side of the conductive layer away from the first organic layer, and the second organic layer covers the signal transmission portion and the second groove.

13. The method for manufacturing a display panel according to claim 12, characterized in that: The step of forming a second groove adjacent to the first groove in the first organic layer comprises: A replacement gas is used to perform a replacement process on the first organic layer and the conductive layer to form the second groove adjacent to the first groove.

14. A display device, characterized in that: The display device comprises the display panel according to any one of claims 1 to 11.

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