Voltage-regulator tube chip packaging equipment and packaging process

Abstract

The invention relates to the technical field of voltage-regulator tube chip packaging, and particularly discloses voltage-regulator tube chip packaging equipment and a packaging process, the voltage-regulator tube chip packaging equipment comprises a packaging machine main body, a packaging disc is fixedly connected in the packaging machine main body, two ends of the packaging disc are respectively and fixedly connected with a feeding plate and a discharging plate, and a voltage-regulator tube chip is carried above the packaging disc; the glue spraying mechanism is located above the packaging disc, and the glue spraying mechanism can spray out packaging glue and package the voltage stabilizing tube chip; the overturning mechanism is located on the periphery of the packaging disc, and the overturning mechanism can drive the voltage-regulator tube chip to overturn. During use, the interior of the voltage-regulator tube chip can be filled with packaging glue through the glue spraying mechanism, the fluidity of the packaging glue is improved through the preheating plate, the packaging glue can conveniently enter the interior of the voltage-regulator tube chip, bubbles are prevented from appearing in the voltage-regulator tube chip, and the packaging quality of the voltage-regulator tube chip is improved. And after filling is completed, the voltage-regulator tube chip is slowly overturned through the overturning mechanism, so that the opening of the voltage-regulator tube chip is upward, the next processing step is facilitated, and the device is very convenient to use.

Description

Technical Field

[0001] The present invention relates to the technical field of voltage regulator chip packaging, and in particular to voltage regulator chip packaging equipment and a packaging process. Background Art

[0002] The packaging of Zener chip is an important part of semiconductor packaging and testing equipment. The packaging of Zener chip can protect the chip and facilitate installation and use on the circuit board. The Zener chip is an electronic component used to stabilize the voltage. When the power supply voltage fluctuates, the output voltage is kept stable through the internal adjustment mechanism of the Zener chip. At the same time, the Zener chip is isolated from the external environment to prevent it from being affected by external factors such as moisture and dust.

[0003] When a Zener chip is packaged using a Zener packaging machine, the bubbles generated by the packaging glue after the packaging glue enters the interior of the Zener chip not only affect the heat conduction performance of the packaging glue, but also the bubbles solidify in the packaging glue, which may cause the colloid to expand, thereby causing damage or failure of the chip. For this reason, we propose a Zener chip packaging equipment and packaging process. Summary of the invention

[0004] The purpose of the present invention is to provide a Zener chip packaging device and packaging process to solve the problem raised in the above background technology that after the packaging glue enters the interior of the Zener chip, the bubbles generated by the packaging glue not only affect the heat conduction performance of the packaging glue, but also the bubbles solidify in the packaging glue, which may cause the colloid to expand, thereby causing damage to or failure of the chip.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a voltage regulator chip packaging device, comprising a packaging machine body, a packaging plate is fixedly connected inside the packaging machine body, a feed plate and a discharge plate are fixedly connected at both ends of the packaging plate, and a voltage regulator chip is carried on the top of the packaging plate;

[0006] The glue spraying mechanism is located above the packaging plate and can spray the packaging glue and package the voltage regulator chip;

[0007] The flipping mechanism is located at the periphery of the packaging disk and can drive the Zener chip to flip.

[0008] Among them, the glue spraying mechanism includes a driving motor fixedly connected to the bottom of the packaging machine body, one end of the motor output shaft of the driving motor is fixedly connected to a glue dispensing disk, the glue dispensing disk is located in the center of the packaging disk, a packaging glue nozzle is arranged above the glue dispensing disk, the packaging glue nozzle is fixedly connected to the upper inner wall of the packaging machine body, the bottom of the packaging glue nozzle is located above the glue dispensing disk, a plurality of glue spraying holes are arranged at the bottom of the packaging glue nozzle, and a glue dispensing component is arranged above the glue dispensing disk for diverting the packaging glue sprayed from the packaging glue nozzle.

[0009] Among them, the glue dispensing part includes a plurality of preheating plates fixedly connected to the upper end of the glue dispensing disk, each preheating plate is arranged equidistantly in a ring shape, a plurality of glue outlet holes are opened on the side of the glue dispensing disk, each glue outlet hole corresponds to the gap position between every two preheating plates, and a rotating ring is fixedly connected to the outer wall of the glue dispensing disk, which is located above the packaging disk and is rotatably connected to the packaging disk.

[0010] Among them, each preheating plate is made of ceramic material.

[0011] Among them, the flipping mechanism includes a plurality of flipping grooves opened on the upper end of the rotating ring, each flipping groove corresponds to the position of the glue outlet hole, a flip rod is fixedly connected to the inner wall of the flipping groove, a flip plate is rotatably connected to the outer periphery of the flip rod, the flip plate is L-shaped, and an inclined plate is fixedly connected to one end of the flip plate away from the glue outlet hole, and a driving member that can drive the flip plate to rotate is provided on one side of the flip plate.

[0012] Among them, the driving part includes a driving cylinder fixedly connected to the upper end of the rotating plate, a spring fixedly connected to the inner wall of the driving cylinder, a baffle fixedly connected to the side of the spring close to the glue dispensing disk, a counterweight block fixedly connected to the end of the baffle away from the spring, a connecting rod fixedly connected to the end of the baffle close to the glue dispensing disk, and the connecting rod is located on one side of the counterweight block.

[0013] The driving cylinder is located at one end of the flip groove away from the feed plate, and the driving cylinder is located at one end of the flip groove in the counterclockwise direction. The driving cylinder is used to abut against the voltage regulator chip.

[0014] Among them, the connecting rod is movably connected to a driving ring at one end away from the baffle, and a fixed rod is rotatably connected to the center of the driving ring. The fixed rod is located above the flip rod and fixedly connected to the outer wall of the rotating ring. The outer wall of the driving ring is fixedly connected to the driving rod, and the driving rod is located above the flip plate.

[0015] Among them, a gel piece capable of quickly solidifying the packaging glue inside the Zener chip is provided above the packaging disk. The gel piece includes a gel box fixedly connected to the upper end of the packaging disk, and multiple heating plates are fixedly connected to the inner wall of the gel box. The heating plates are located above the Zener chip.

[0016] A voltage regulator chip packaging process, used in conjunction with a voltage regulator chip packaging device according to any one of claims 1 to 9:

[0017] The packaging glue of the voltage regulator chip is ordinary epoxy resin packaging glue. Ordinary epoxy resin packaging glue usually has a certain fluidity at room temperature, but as the temperature of the preheating plate increases, its fluidity will be further enhanced. When the temperature is between 40℃ and 80℃, its fluidity will increase significantly, which helps to fill the gap between the chip and the substrate during the packaging process.

[0018] Ordinary epoxy resin encapsulation glue usually starts to solidify quickly when heated to a certain temperature. When the temperature of the heating plate reaches about 100℃ to 150℃, its solidification speed will be significantly accelerated;

[0019] The temperature range of ordinary voltage regulator tubes is usually between 0℃ and 150℃. Within this temperature range, the voltage regulator tube can maintain stable electrical properties, such as stable output voltage and current.

[0020] The Zener chip enters the packaging tray from the feed plate. The packaging port of the Zener chip is close to and aligned with the glue outlet hole. The driving motor drives the glue dispensing tray to rotate. The ordinary epoxy resin packaging glue sprayed by the packaging glue nozzle flows between every two preheating plates. The ceramic bottom plate is not easy to adhere to the packaging glue. After the high-fluidity packaging glue enters the interior of the Zener chip, it is not easy for bubbles to appear inside the Zener chip. When the driving motor slowly slows down, the Zener chip is flipped over by the flipping mechanism, so that the opening of the Zener chip turns from horizontal to upward, and the packaging glue is quickly solidified by the gel piece, and finally enters the next process through the discharge plate.

[0021] The present invention has at least the following beneficial effects:

[0022] When the present invention is in use, the packaging glue can be filled into the inside of the voltage regulator chip through the glue spraying mechanism. The packaging glue increases fluidity through the preheating plate to facilitate entering the inside of the voltage regulator chip, thereby avoiding the appearance of bubbles inside the voltage regulator chip. After the filling is completed, the voltage regulator chip is slowly flipped over by the flipping mechanism so that the opening of the voltage regulator chip faces upward, thereby facilitating the next processing step. The invention is very convenient to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the overall structure of the voltage regulator chip packaging device of the present invention;

[0024] Figure 2 This is a schematic diagram of the structure of the driving motor of the present invention;

[0025] Figure 3 This is a schematic diagram of the overall structure of the packaging tray of the present invention;

[0026] Figure 4 This is a schematic diagram of the internal structure of the glue dispensing tray of the present invention;

[0027] Figure 5 for Figure 4 Schematic diagram of the enlarged structure of the middle A area;

[0028] Figure 6 It is a schematic diagram of the structure of the rotating ring of the present invention;

[0029] Figure 7 This is a schematic diagram of the cross-sectional structure of the driving ring of the present invention;

[0030] Figure 8 for Figure 7 Schematic diagram of the enlarged structure of the middle B area;

[0031] Fig. 9This is a schematic diagram of the overall structure of Embodiment 2;

[0032] Fig.10 It is a schematic diagram of a partial cross-sectional structure of the gel box of the present invention.

[0033] In the figure: 1. packaging machine body; 11. packaging plate; 12. feed plate; 13. discharge plate; 2. glue spraying mechanism; 21. driving motor; 22. motor output shaft; 23. glue dispensing plate; 24. packaging glue nozzle; 25. glue spraying hole; 3. flipping mechanism; 31. flipping groove; 32. flipping rod; 33. flipping plate; 34. inclined plate; 4. glue dispensing part; 41. preheating plate; 42. glue discharge hole; 43. rotating ring; 5. driving part; 51. driving cylinder; 52. spring; 53. baffle; 54. counterweight; 55. connecting rod; 56. driving ring; 57. fixing rod; 58. driving rod; 6. gel part; 61. gel box; 62. heating plate. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] Embodiment 1

[0036] See also Figure 1-8 The present invention provides a technical solution: a voltage regulator chip packaging device and packaging process, including a packaging machine body 1, a packaging plate 11 is fixedly connected inside the packaging machine body 1, a feed plate 12 and a discharge plate 13 are fixedly connected at both ends of the packaging plate 11, and a voltage regulator chip is carried on the top of the packaging plate 11;

[0037] The glue spraying mechanism 2 is located above the packaging plate 11, and the glue spraying mechanism 2 can spray the packaging glue and package the voltage regulator chip;

[0038] The flipping mechanism 3 is located at the periphery of the packaging plate 11, and the flipping mechanism 3 can drive the voltage regulator chip to flip;

[0039] When the present invention is in use, the packaging glue can be filled into the inside of the Zener chip through the glue spraying mechanism 2. The packaging glue increases the fluidity through the preheating plate 41 to facilitate entering the inside of the Zener chip, thereby avoiding the formation of bubbles inside the Zener chip. After the filling is completed, the Zener chip is slowly flipped over by the flipping mechanism 3 so that the opening of the Zener chip faces upward, which is convenient for the next processing step. The use is very convenient.

[0040] The glue spraying mechanism 2 includes a driving motor 21 fixedly connected to the bottom of the packaging machine body 1, one end of the motor output shaft 22 of the driving motor 21 is fixedly connected to a glue dispensing plate 23, the glue dispensing plate 23 is located in the center of the packaging plate 11, and a packaging glue spraying head 24 is arranged above the glue dispensing plate 23. The packaging glue spraying head 24 is fixedly connected to the upper inner wall of the packaging machine body 1, the bottom of the packaging glue spraying head 24 is located above the glue dispensing plate 23, and a plurality of glue spraying holes 25 are arranged at the bottom of the packaging glue spraying head 24. A sealing glue spraying hole 25 is arranged above the glue dispensing plate 23. The glue distributing part 4 is used to distribute the packaging glue sprayed by the glue nozzle 24, and the glue distributing part 4 includes a plurality of preheating plates 41 fixedly connected to the upper end of the glue distributing disc 23, each preheating plate 41 is arranged in a ring-shaped and equidistant manner, and a plurality of glue outlet holes 42 are provided on the side of the glue distributing disc 23, each glue outlet hole 42 corresponds to the gap position between every two preheating plates 41, and a rotating ring 43 is fixedly connected to the outer wall of the glue distributing disc 23, and the rotating ring 43 is located above the packaging disc 11 and is rotatably connected to the packaging disc 11, and a ceramic material is provided between each preheating plate 41;

[0041] When it is necessary to package the Zener chip, the Zener chip enters the packaging disk 11 from the feed plate 12, and the driving motor 21 slowly rotates through the motor output shaft 22, so that the Zener chip can be rolled into the top of the glue dispensing disk 23 one after another. After the sealing opening of the Zener chip abuts against the glue outlet hole 42, the packaging glue nozzle 24 sprays out the packaging glue, and at the same time, the driving motor 21 accelerates the driving glue dispensing disk 23 to rotate, and the preheating plate 41 located above the glue dispensing disk 23 is heated. Since the packaging glue flows through the position between every two preheating plates 41, the ceramic material is made of ceramic material, and the ceramic material has good high temperature resistance, corrosion resistance and non-stick properties, the packaging glue is not easy to adhere to the glue dispensing disk 23. At the same time, the preheating plate 41 heats the packaging glue, the temperature of the preheating plate 41 increases, and the fluidity of the packaging glue is enhanced. When the temperature is between 40°C and 80°C, the fluidity of the packaging glue will be significantly increased, which is convenient for the packaging glue to flow into the interior of the Zener chip. At the same time, the high-fluidity packaging glue is not easy to have bubbles, thereby avoiding unstable or unreliable electrical connections after the Zener chip is packaged.

[0042] The flip mechanism 3 includes a plurality of flip grooves 31 formed at the upper end of a rotating ring 43, each flip groove 31 corresponding to the position of a glue outlet hole 42, a flip rod 32 is fixedly connected to the inner wall of the flip groove 31, a flip plate 33 is rotatably connected to the outer periphery of the flip rod 32, the flip plate 33 is L-shaped, an inclined plate 34 is fixedly connected to the end of the flip plate 33 away from the glue outlet hole 42, a driving member 5 capable of driving the flip plate 33 to rotate is provided on one side of the flip plate 33, the driving member 5 includes a driving cylinder 51 fixedly connected to the upper end of the rotating plate, a spring 52 is fixedly connected to the inner wall of the driving cylinder 51, a baffle 53 is fixedly connected to the side of the spring 52 close to the glue dispensing disk 23, and the baffle 53 is away from the spring 52. The end is fixedly connected with a counterweight block 54, the end of the baffle plate 53 close to the glue dispensing plate 23 is fixedly connected with a connecting rod 55, the connecting rod 55 is located on one side of the counterweight block 54, the driving cylinder 51 is located at the end of the flip groove 31 away from the feed plate 12, the driving cylinder 51 is located at the counterclockwise end of the flip groove 31, the driving cylinder 51 is used to abut against the voltage regulator chip, the end of the connecting rod 55 away from the baffle plate 53 is movably connected with a driving ring 56, the center of the driving ring 56 is rotatably connected with a fixed rod 57, the fixed rod 57 is located above the flip rod 32 and fixedly connected to the outer wall of the rotating ring 43, the outer wall of the driving ring 56 is fixedly connected with a driving rod 58, and the driving rod 58 is located above the flip plate 33;

[0043] When the voltage regulator chip enters the packaging disk 11, the voltage regulator chip first enters above the rotating ring 43 on the outer periphery of the glue dispensing disk 23. When the voltage regulator chip abuts the driving cylinder 51, it stays above the flip plate 33. Since the driving motor 21 drives the glue dispensing disk 23 to rotate through the motor output shaft 22, the voltage regulator chip passes through the feed plate 12 in turn and enters above the rotating ring 43. When the voltage regulator chip moves to above the rotating ring 43, since the flip plate 33 is fixedly connected with an inclined plate 34 at one end away from the glue outlet hole 42, the voltage regulator chip tilts when it moves to above the inclined plate 34. When the voltage regulator chip tilts, the sealing outlet fits the glue outlet hole 42, and the back inclined plate 34 abuts against the outer wall of the voltage regulator chip, so that the sealing outlet of the voltage regulator chip is close to the glue outlet hole 42, which is convenient for filling the packaging glue for the voltage regulator chip.

[0044] When the voltage regulator chip is filled with packaging glue, the counterweight block 54 located inside the driving cylinder 51 moves toward the side of the spring 52 due to the centrifugal force generated when the glue dispensing plate 23 rotates. At this time, the counterweight block 54 pushes the baffle plate 53 and compresses the spring 52. The connecting rod 55 located on one side of the baffle plate 53 drives the driving ring 56 to rotate around the fixing rod 57. The fixing rod 57 located on the outer wall of the driving ring 56 rotates toward one end of the glue dispensing hole. After the voltage regulator chip is filled with packaging glue, the driving motor 21 gradually slows down, and the glue dispensing plate 23 slowly decelerates. At this time, the counterweight block 54 As the centrifugal force of block 54 decreases, the counterweight block 54 gradually slides by being reset by the spring 52. At this time, the baffle plate 53 gradually resets, and the baffle plate 53 drives the driving ring 56 to rotate in the opposite direction through the connecting rod 55. At this time, when the driving rod 58 rotates in the opposite direction, it can move the flip plate 33 to rotate around the flip rod 32. At this time, the packaging glue inside the Zener chip is also gradually reduced by the large centrifugal force, and the Zener chip seal is gradually rotated from the horizontal direction to the vertical direction. The packaging glue inside the Zener chip will not be thrown out, which is convenient for the packaging glue to solidify and the Zener chip to seal.

[0045] Embodiment 2

[0046] See also Figure 9-10 A gel member 6 capable of quickly solidifying the packaging glue inside the voltage regulator chip is provided above the packaging disk 11. The gel member 6 includes a gel box 61 fixedly connected to the upper end of the packaging disk 11. A plurality of heating plates 62 are fixedly connected to the inner wall of the gel box 61. The heating plates 62 are located above the voltage regulator chip;

[0047] When the packaging glue completely enters the Zener chip and the driving motor 21 gradually slows down, the heating plate 62 located above the Zener chip is heated. Since ordinary epoxy resin packaging glue usually begins to solidify rapidly when heated to a certain temperature, when the temperature of the heating plate 62 reaches about 100°C to 150°C, its solidification speed will be significantly accelerated. When the Zener chip rotates to a vertical direction, the packaging glue inside the Zener chip solidifies, which is convenient for removal from the discharge plate to enter the next processing step.

[0048] Embodiment 3

[0049] A voltage regulator chip packaging process, used in conjunction with a voltage regulator chip packaging device according to any one of claims 1 to 9:

[0050] The packaging glue of the voltage regulator chip is ordinary epoxy resin packaging glue. Ordinary epoxy resin packaging glue usually has a certain fluidity at room temperature, but as the temperature of the preheating plate 41 increases, its fluidity will be further enhanced. When the temperature is between 40°C and 80°C, its fluidity will increase significantly, which is helpful to fill the gap between the chip and the substrate during the packaging process.

[0051] Ordinary epoxy resin encapsulation glue usually starts to solidify rapidly when heated to a certain temperature, and its solidification speed will be significantly accelerated when the temperature of the heating plate 62 reaches about 100° C. to 150° C.;

[0052] The temperature range of ordinary voltage regulator tubes is usually between 0℃ and 150℃. Within this temperature range, the voltage regulator tube can maintain stable electrical properties, such as stable output voltage and current.

[0053] The Zener chip enters the packaging disk 11 from the feed plate 12, the packaging port of the Zener chip is tightly attached to and aligned with the glue outlet hole 42, the driving motor 21 drives the glue dispensing disk 23 to rotate, and the ordinary epoxy resin packaging glue sprayed by the packaging glue nozzle 24 flows between every two preheating plates 41, the ceramic bottom plate is not easy to adhere to the packaging glue, and after the high-fluidity packaging glue enters the interior of the Zener chip, it is not easy for bubbles to appear inside the Zener chip. When the driving motor 21 slowly decelerates, the Zener chip is flipped by the flipping mechanism 3, so that the opening of the Zener chip is turned from horizontal to upward, and the packaging glue is quickly solidified by the gel member 6, and finally enters the next process through the discharge plate 13.

[0054] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0055] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A voltage regulator chip packaging device, comprising: A packaging machine body (1), wherein a packaging disc (11) is fixedly connected inside the packaging machine body (1), a feed plate (12) and a discharge plate (13) are fixedly connected at both ends of the packaging disc (11), and a voltage regulator chip is carried above the packaging disc (11); It is characterized by: also including: A glue spraying mechanism (2), the glue spraying mechanism (2) being located above the packaging plate (11), and the glue spraying mechanism (2) being capable of spraying packaging glue and packaging the voltage regulator chip; A flipping mechanism (3), the flipping mechanism (3) is located on the periphery of the packaging disk (11), and the flipping mechanism (3) can drive the voltage regulator chip to flip.

2. The voltage regulator chip packaging device according to claim 1, characterized in that: The glue spraying mechanism (2) comprises a driving motor (21) fixedly connected to the bottom of the packaging machine body (1); one end of the motor output shaft (22) of the driving motor (21) is fixedly connected to a glue dispensing disk (23); the glue dispensing disk (23) is located in the center of the packaging disk (11); a packaging glue spray head (24) is arranged above the glue dispensing disk (23); the packaging glue spray head (24) is fixedly connected to the upper inner wall of the packaging machine body (1); the bottom of the packaging glue spray head (24) is located above the glue dispensing disk (23); a plurality of glue spraying holes (25) are arranged at the bottom of the packaging glue spray head (24); and a glue dispensing member (4) capable of diverting the packaging glue sprayed by the packaging glue spray head (24) is arranged above the glue dispensing disk (23).

3. The voltage regulator chip packaging device according to claim 2, characterized in that: The glue dispensing member (4) comprises a plurality of preheating plates (41) fixedly connected to the upper end of the glue dispensing disk (23), each of the preheating plates (41) being arranged equidistantly in a ring shape, a plurality of glue outlet holes (42) being provided on the side of the glue dispensing disk (23), each of the glue outlet holes (42) corresponding to the gap position between every two preheating plates (41), and a rotating ring (43) being fixedly connected to the outer wall of the glue dispensing disk (23), the rotating ring (43) being located above the encapsulation disk (11) and being rotatably connected to the encapsulation disk (11).

4. The voltage regulator chip packaging device according to claim 3, characterized in that: Each of the preheating plates (41) is made of ceramic material.

5. The voltage regulator chip packaging device according to claim 3, characterized in that: The flip mechanism (3) comprises a plurality of flip grooves (31) formed at the upper end of a rotating ring (43), each of the flip grooves (31) corresponding to the position of a glue outlet hole (42), a flip rod (32) fixedly connected to the inner wall of the flip groove (31), a flip plate (33) rotatably connected to the outer periphery of the flip rod (32), the flip plate (33) being L-shaped, an inclined plate (34) fixedly connected to one end of the flip plate (33) away from the glue outlet hole (42), and a driving member (5) capable of driving the flip plate (33) to rotate is provided on one side of the flip plate (33).

6. The voltage regulator chip packaging device according to claim 5, characterized in that: The driving member (5) comprises a driving cylinder (51) fixedly connected to the upper end of the rotating plate, a spring (52) fixedly connected to the inner wall of the driving cylinder (51), a baffle (53) fixedly connected to the side of the spring (52) close to the glue dispensing disk (23), a counterweight (54) fixedly connected to the end of the baffle (53) away from the spring (52), a connecting rod (55) fixedly connected to the end of the baffle (53) close to the glue dispensing disk (23), and the connecting rod (55) is located on one side of the counterweight (54).

7. The voltage regulator chip packaging device according to claim 6, characterized in that: The driving cylinder (51) is located at one end of the turning groove (31) away from the feed plate (12), and the driving cylinder (51) is located at one end of the turning groove (31) in the counterclockwise direction. The driving cylinder (51) is used to abut against the voltage regulator chip.

8. The voltage regulator chip packaging device according to claim 6, characterized in that: The end of the connecting rod (55) away from the baffle (53) is movably connected to a driving ring (56); the center of the driving ring (56) is rotatably connected to a fixing rod (57); the fixing rod (57) is located above the flip rod (32) and is fixedly connected to the outer wall of the rotating ring (43); the outer wall of the driving ring (56) is fixedly connected to a driving rod (58); and the driving rod (58) is located above the flip plate (33).

9. The voltage regulator chip packaging device according to claim 1, characterized in that: A gel piece (6) capable of quickly solidifying the packaging glue inside the voltage regulator chip is provided above the packaging disk (11), the gel piece (6) comprising a gel box (61) fixedly connected to the upper end of the packaging disk (11), a plurality of heating plates (62) fixedly connected to the inner wall of the gel box (61), and the heating plates (62) are located above the voltage regulator chip.

10. A voltage regulator chip packaging process, used in conjunction with a voltage regulator chip packaging device according to any one of claims 1 to 9, characterized in that: The packaging glue of the voltage regulator chip is a common epoxy resin packaging glue. The common epoxy resin packaging glue usually has a certain fluidity at room temperature, but as the temperature of the preheating plate (41) increases, its fluidity will be further enhanced. When the temperature is between 40°C and 80°C, its fluidity will increase significantly, which is helpful to fill the gap between the chip and the substrate during the packaging process; Ordinary epoxy resin encapsulation glue usually starts to solidify rapidly when heated to a certain temperature, and its solidification speed will be significantly accelerated when the temperature of the heating plate (62) reaches about 100°C to 150°C; The temperature range of ordinary voltage regulator tubes is usually between 0℃ and 150℃. Within this temperature range, the voltage regulator tube can maintain stable electrical properties, such as stable output voltage and current. The voltage regulator chip enters the packaging plate (11) from the feed plate (12), the packaging port of the voltage regulator chip is closely attached to and aligned with the glue outlet hole (42), the driving motor (21) drives the glue dispensing plate (23) to rotate, and the ordinary epoxy resin packaging glue sprayed by the packaging glue nozzle (24) flows between each two preheating plates (41), so that the ceramic bottom plate is not easy to adhere to the packaging glue, and after the high-fluidity packaging glue enters the interior of the voltage regulator chip, it is not easy for bubbles to appear inside the voltage regulator chip. When the driving motor (21) is slowly decelerated, the voltage regulator chip is flipped by the flipping mechanism (3), so that the opening of the voltage regulator chip is turned from horizontal to upward, and the packaging glue is quickly solidified by the gel member (6), and finally enters the next process through the discharge plate (13).

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